KR20120072740A - Light-emitting element array - Google Patents

Abstract

PURPOSE: A light emitting device array is provided to improve reliability and process efficiency by forming a plurality of connector terminals which are symmetrical based on the center of an open region to prevent a tilt in a connector mounting process. CONSTITUTION: A power source control module(210) includes a power supply(212), a control unit(214), and a connector linking unit(216). The control unit controls the operation of the power supply according to a command inputted from the outside. The connector linking unit supplies power from the power supply to a connector(130). A connector terminal(124a) is electrically connected to the connector linking unit through the connector. A light emitting device package(110) is mounted on a printed circuit board(120).

Description

Light-emitting element array

The embodiment relates to a light emitting device array, and more particularly, to a light emitting device array having a structure that is easy to prevent the tilt of the connector mounted on the printed circuit board.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is important to increase the luminance of the LED as the brightness required for a lamp used in daily life and a lamp for a structural signal is increased.

An object of the embodiment is to provide a light emitting device array having a structure that is easy to prevent the tilt of the connector mounted on the printed circuit board.

The light emitting device array according to the embodiment includes a light emitting device package, a connector connected to an external power source, a copper foil pattern on which the light emitting device package and the connector are mounted, and an insulating member stacked on the copper foil pattern. And a printed circuit board on which the connector is mounted in an open area that is not stacked, and the copper foil pattern includes a plurality of connector terminals partially exposed in the open area, and the plurality of connector terminals are formed in the open area. The exposed areas based on the center may be symmetrical with each other.

The light emitting device array according to the embodiment prevents the tilt when the connector is mounted by forming a plurality of connector terminals whose areas are symmetrical with respect to the center of the open area where the insulating members are not stacked so that the connector is mounted on the printed circuit board. Since there is an advantage that can increase the reliability and process efficiency.

1 is an exploded perspective view briefly showing a light emitting device module including a light emitting device array according to the embodiment.
FIG. 2 is a perspective view briefly illustrating a stacking order of the light emitting device array illustrated in FIG. 1.
3 is an enlarged view of the connector terminal illustrated in FIG. 2.
4 is an enlarged view illustrating the open area and the connector terminal of FIG. 3.
5 is a cross-sectional view illustrating the light emitting device package illustrated in FIG. 1.
6 is a perspective view illustrating a lighting device including the light emitting device array according to the embodiment.
FIG. 7 is a cross-sectional view taken along line AA ′ of the lighting apparatus shown in FIG. 6.
8 is an exploded perspective view of a liquid crystal display including the light emitting device array according to the first embodiment.
9 is an exploded perspective view of a liquid crystal display including the light emitting device array according to the second embodiment.

Prior to the description of the embodiments, the substrate, each layer region, pad, or pattern of each layer (film), region, pattern, or structure referred to herein is "on", "below ( "on" and "under" include all that is formed "directly" or "indirectly" through other layers. In addition, the criteria for the top or bottom of each layer will be described with reference to the drawings.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. Thus, the size of each component does not fully reflect its actual size.

In addition, angles and directions mentioned in the process of describing the structure of the light emitting device array in the present specification are based on those described in the drawings. In the description of the structure of the light emitting device array in the specification, if the reference point and the positional relationship with respect to the angle is not clearly mentioned, reference is made to related drawings.

1 is an exploded perspective view briefly showing a light emitting device module including a light emitting device array according to the embodiment.

Referring to FIG. 1, the light emitting device module 200 may include a power control module 210, a light emitting device array 100, and a connector 130.

Herein, the power control module 210 may include a power supply 212 for generating power to be supplied to the light emitting device package 110 mounted on the light emitting device array 100, and a control unit for controlling the operation of the power supply 212. 214 and a connector connector 216 to which one side of the connector 130 is connected may be included.

In this case, the power supply 212 operates under the control of the control unit 214 and generates the power consumed by the light emitting device array 100.

The controller 214 may control the operation of the power supply 212 according to a command input from the outside.

In this case, the externally input command may be a command output from a remote control for directing an operation of a device including the light emitting device module 200 and an input device (not shown) directly connected to the light emitting device module 200. There is no limitation to this.

In addition, the connector connecting portion 216 is connected to one side of the connector 130, it can supply the power output from the power supply 212 to the connector 130.

The light emitting device array 100 includes a light emitting device package 110, a printed circuit board 120 on which the light emitting device package 110 is mounted, and a connector terminal to which the other side of the connector 130 is connected on the printed circuit board 120 ( 124a).

In this case, the connector terminal 124a may be electrically connected to the connector connecting portion 216 through the connector 130, and the detailed description of the connector terminal 124a will be described later.

The printed circuit board 124 may use a single-sided printed circuit board (PCB), a double-sided printed circuit board (PCB) or a printed circuit board (PCB) formed of a plurality of layers. It will be described as, but not limited to.

The plurality of light emitting device packages 110 are described as being divided into first to fourth groups P1 to P4, and each of the light emitting device packages 110 is described as being mounted in each group P1 to P4. The number of the light emitting device packages 110 is not limited.

That is, six light emitting device packages 110 may be connected in series to each of the first to fourth groups P1 to P4, and the first to fourth groups P1 to P4 may be connected to each other in parallel.

In the embodiment, six light emitting device packages 110 are described as being connected in series to form a group, but the connection form of the light emitting device package 110 is not limited.

As such, in the light emitting device packages 100 included in the first to fourth groups P1 to P4, at least two or more light emitting device packages 110 having different colors may be alternately mounted, and a single color may be used. It may be mounted as a light emitting device package 110 having a.

For example, when the white light is emitted from the light emitting device array 100, the plurality of light emitting device packages 110 may be implemented by using a light emitting device package emitting red light and a light emitting device package emitting blue light. . Therefore, the light emitting device packages emitting red light and blue light may be alternately mounted, and may be formed of red light, blue light, and green light.

The power control module 210 shown in FIG. 1 illustrates a power supply device, that is, a supply device for supplying external power, and may be a device for describing the light emitting device array 100 according to the embodiment, but is not limited thereto.

FIG. 2 is a perspective view briefly illustrating a stacking order of the light emitting device array illustrated in FIG. 1.

Referring to FIG. 2, the light emitting device array 100 may include a base board 122, a copper foil pattern 124, a printed circuit board 120 including an insulating member 126, and a light emitting device package 110. have.

2 (a) is a base substrate 122, a first layer (not shown) comprising a FR-4 substrate or glass fibers, and a first layer disposed on the first layer, including a resin (resin) It may include two layers (not shown).

2B, the copper foil pattern 124 is patterned (arranged) on the base substrate 122.

That is, the copper foil pattern 124 may include a connector terminal 124a, a connection pattern 124b, a ground pattern 124c, and an electrode pad pattern 124d that are connected to the outside and supplied with power.

Here, the connector terminal 124a is provided with a power supply unit (not shown) disposed outside and a terminal in electrical contact with the connector (not shown).

In addition, the connection pattern 124b is connected to the connector terminal 124a and supplies power supplied to the connector terminal 124a to the electrode pad pattern 124d.

The ground pattern 124c is connected to the connector terminal 124a and absorbs the magnetic field input from the outside and the magnetic field generated on the connection pattern 124b.

The electrode pad pattern 124d allows the lead frame (not shown) of the light emitting device package 110 to be bonded.

In the embodiment, the copper foil pattern 124 is divided into the connector terminal 124a, the connection pattern 124b, the ground pattern 124c, and the electrode pad pattern 124d for convenience of description, and the present invention is not limited thereto.

In FIG. 2C, after the copper foil pattern 124 is patterned on the base substrate 122 in FIG. 2B, the insulating member 126 is coated.

In this case, as shown in FIG. 2C, a portion of the electrode pad pattern 124d is exposed on the upper surface of the base substrate 122 to which the insulating member 126 is applied, and the exposed electrode pad pattern 124d is disposed on the upper surface of the base substrate 122. The light emitting device package 110 is mounted.

Here, the insulating member 126 may be a PSR ink and an insulating film, but is not limited thereto.

FIG. 2 (d) emits light on the electrode pad pattern 124 d exposed in FIG. 2 (c) on the printed circuit board 120 including the base substrate 122, the copper foil pattern 124, and the insulating member 126. A lead frame (not shown) of the device package 110 is bonded.

The light emitting device array 100 shown in FIG. 2 is a simplified illustration of the light emitting device array 100 shown in FIG. 1, and the number of light emitting device packages 110 is not limited.

3 is an enlarged view showing the connector terminal shown in FIG. 2, and FIG. 4 is an enlarged view showing the open area and the connector terminal shown in FIG.

3 and 4 will be described briefly for the description of the configuration duplicated in FIG. 2, the same reference numerals are used.

3 and 4, the copper foil pattern 124 may include a connector terminal 124a, a connection pattern 124b, and a ground pattern 124c.

In this case, the copper foil pattern 124 may be stacked on the printed circuit board 120, and the insulating member 126 may be stacked on the copper foil pattern 124.

Detailed description of the copper foil pattern 124 and the insulating member 126 will be described briefly, or will be omitted.

In an embodiment, the connector terminal 124a is formed in the open region 122 in which the insulating member 126 is not stacked, and the first and second connector terminals 131 and symmetrical with respect to the center of the open region 122 are symmetric to each other. 132, third and fourth connector terminals 133 and 134 and fifth and sixth connector terminals 135 and 136.

In the embodiment, the connector terminal 124a has been described as having six connector terminals, but the number is not limited thereto.

Here, the first and second connector terminals 131 and 132 may have the same area s1 and the length d1, and may be symmetrical with each other.

In this case, the third and fourth connector terminals 133 and 134 may have the same area s2 and the length d2, and the fifth and six connector terminals 135 and 136 have the same area s3 and the length d2. Or may have different lengths d2, but the present invention is not limited thereto.

In addition, the connector terminal 124a may include an extension terminal 140 disposed in a non-open area (not shown) in which the insulating member 126 except for the open area 122 is stacked.

The extension terminal 140 includes third and fourth extension terminals of the first and second extension terminals 141 and 142 and the third and fourth connector terminals 133 and 134 of the first and second connector terminals 131 and 132, respectively. The fifth and sixth extension terminals 145 and 146 of the first and second connectors 143 and 144 and the fifth and sixth connector terminals 135 and 136 may be included.

Here, the areas (not shown) of the first and second extension terminals 141 and 142 may be the same or different from each other, and the connection pattern 124b connected to each of the first and second extension terminals 141 and 142 may be extended. It can be determined by the direction, but is not limited thereto.

In addition, the areas (not shown) of the third and fourth extension terminals 143 and 144 and the fifth and sixth extension terminals 145 and 146 may be the same or different from each other.

Here, each pair of the first and second extension terminals 141 and 142, the third and fourth extension terminals 143 and 144, and the fifth and sixth extension terminals 145 and 146 may be referred to the center of the open area 122. It may be formed asymmetrically with each other, without being limited thereto, it may be determined by the extending direction of the connection pattern (124b).

As such, the first and second connector terminals 131 and 132, the third and fourth connector terminals 133 and 134, and the fifth and sixth connector terminals 135 and 136 formed in the open region 122 may have the open region 122. By forming symmetrical with respect to the center of the ()) it can be prevented that the tilt occurs in at least one of the up, down, left and right directions when mounting the connector 130.

5 is a cross-sectional view illustrating the light emitting device package illustrated in FIG. 1.

Referring to FIG. 5, the light emitting device package 110 may include a light emitting device 102 and a body 104 having a cavity s on which the light emitting device 102 is mounted.

The body 104 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, photosensitive glass (PSG), polyamide 9T (PA9T), neogeotactic polystyrene (SPS), a metal material, sapphire (Al2O3), beryllium oxide (BeO), ceramic, and may be formed of at least one of a printed circuit board (PCB).

The body 104 may be formed by an injection molding, an etching process, or the like, but is not limited thereto.

The top shape of the body 104 may have various shapes such as triangle, square, polygon, and round shape according to the use and design of the light emitting device 102.

The cross-sectional shape of the cavity s may be formed in a cup shape, a concave container shape, or the like, and the inner surface of the body 104 constituting the cavity s may be inclined downward.

In addition, the front shape of the cavity s may be a shape such as a circle, a rectangle, a polygon, an oval, and the like, but is not limited thereto.

In this case, first and second lead frames 112 and 113 are disposed on the lower surface of the body 104, and the first and second lead frames 112 and 113 are made of a metal material, for example, titanium (Ti) and copper. (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), It may include one or more materials or alloys of indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe). .

In addition, the first and second lead frames 112 and 113 may be formed to have a single layer or a multilayer structure, but the embodiment is not limited thereto.

The inner surface of the body 104 is formed to be inclined with a predetermined inclination angle with respect to any one of the first and second lead frames 112 and 113, and the reflection angle of the light emitted from the light emitting device 102 varies according to the inclination angle. In this way, it is possible to adjust the directivity angle of the light emitted to the outside. Concentration of the light emitted from the light emitting device 102 to the outside increases as the directivity of the light decreases, while concentration of the light emitted from the light emitting device 102 to the outside decreases as the directivity of the light increases.

The first and second lead frames 112 and 113 are electrically connected to the light emitting device 102, and are connected to the positive and negative poles of an external power source (not shown), respectively, and the light emitting device 102 is provided. ) Can be powered.

Here, an insulating film 108 may be formed between the first and second lead frames 112 and 113 to prevent electrical short between the first and second lead frames 112 and 113.

The light emitting device 102 is mounted on the first lead frame 112, and the light emitting device 102 is die-bonded with the first lead frame 112 and is formed by the second lead frame 113 and the wire (not shown). The wire may be bonded to receive power from the first and second lead frames 112 and 113.

Here, the light emitting device 102 may be wire bonded or die bonded to each of the first and second lead frames 112 and 113, but is not limited thereto.

The first and second lead frames 112 and 113 may be formed symmetrically with each other, but the present invention is not limited thereto.

In addition, the body 104 may distinguish the polarity of the first and second lead frames 112 and 113, and a cathode mark (not shown) may be formed to prevent confusion when electrically connected.

The light emitting device 102 may be a light emitting diode. The light emitting diode may be, for example, a colored light emitting diode emitting red, green, blue, or white light, or an ultraviolet (UV) emitting diode emitting ultraviolet light, but is not limited thereto. There may be a plurality of light emitting devices 102 mounted on the frame 112, and at least one light emitting device 102 may be mounted on the first and second lead frames 112 and 113, respectively. The number and mounting positions of 102 are not limited.

In addition, the body 104 may include a resin material 106 filled in the cavity (s). That is, the resin material 106 may be formed in a double molding structure or a triple molding structure, but is not limited thereto.

In addition, the resin material 106 may be formed in a film shape, may include at least one of a phosphor and a light diffusing material, and a light-transmissive material that does not include the phosphor and the light diffusing material may be used, but is not limited thereto. Do not.

FIG. 6 is a perspective view illustrating a lighting device including an array of light emitting devices according to an embodiment, and FIG. 7 is a cross-sectional view of a lighting device shown in FIG.

Hereinafter, in order to describe the shape of the lighting apparatus 300 according to the embodiment in more detail, the longitudinal direction (Z) of the lighting apparatus 300, the horizontal direction (Y) perpendicular to the longitudinal direction (Z), and the length The height direction X perpendicular to the direction Z and the horizontal direction Y will be described.

That is, FIG. 7 is a cross-sectional view of the lighting apparatus 300 of FIG. 6 cut in the plane of the longitudinal direction Z and the height direction X, and viewed in the horizontal direction Y. FIG.

6 and 7, the lighting device 300 may include a body 310, a cover 330 fastened to the body 310, and a closing cap 350 positioned at both ends of the body 310. have.

The lower surface of the body 310 is fastened to the light emitting device module 340, the body 310 is conductive so that the heat generated in the light emitting device package 344 can be discharged to the outside through the upper surface of the body 310 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device module 340 may include a light emitting device array (not shown) including a light emitting device package 344 and a printed circuit board 342.

The light emitting device package 344 may be mounted on the PCB 342 in a multi-colored, multi-row array to form an array. The light emitting device package 344 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. The PCB 342 may be a metal core PCB (MCPCB) or a PCB made of FR4.

Meanwhile, the light emitting device package 344 may include a plurality of holes and a film made of a conductive material.

Since a film formed of a conductive material such as a metal causes a lot of interference of light, the intensity of the light wave may be strengthened by the interaction of the light wave, thereby effectively extracting and diffusing the light. The interference and diffraction of the light can effectively extract the light. Therefore, the efficiency of the lighting device 300 can be improved. At this time, the size of the plurality of holes formed in the film is preferably smaller than the wavelength of the light generated from the light source.

The cover 330 may be formed in a circular shape to surround the lower surface of the body 310, but is not limited thereto.

The cover 330 protects the light emitting device module 340 from the outside and the like. In addition, the cover 330 may include diffusing particles to prevent glare of the light generated from the light emitting device package 344, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 330 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 330.

On the other hand, since the light generated from the light emitting device package 344 is emitted to the outside through the cover 330, the cover 330 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated by the light emitting device package 344. The cover 330 is preferably formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like. .

Closing cap 350 is located at both ends of the body 310 may be used for sealing the power supply (not shown). In addition, the closing cap 350 is formed with a power pin 352, the lighting device 300 according to the embodiment can be used immediately without a separate device to the terminal from which the existing fluorescent lamps are removed.

8 is an exploded perspective view of a liquid crystal display including the light emitting device array according to the first embodiment.

8 is an edge-light method, the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410.

The liquid crystal display panel 410 may display an image using light provided from the backlight unit 470. The liquid crystal display panel 410 may include a color filter substrate 412 and a thin film transistor substrate 414 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 412 may implement a color of an image displayed through the liquid crystal display panel 410.

The thin film transistor substrate 414 is electrically connected to the printed circuit board 418 on which a plurality of circuit components are mounted through the driving film 417. The thin film transistor substrate 414 may apply a driving voltage provided from the printed circuit board 418 to the liquid crystal in response to a driving signal provided from the printed circuit board 418.

The thin film transistor substrate 414 may include a thin film transistor and a pixel electrode formed of a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 470 may convert the light provided from the light emitting device module 420, the light emitting device module 420 into a surface light source, and provide the light guide plate 430 to the liquid crystal display panel 410. Reflective sheet reflecting the light emitted to the light guide plate 430 to the plurality of films 450, 466, 464 and the light guide plate 430 to uniform the luminance distribution of the light provided from the light source 430 and to improve vertical incidence ( 440).

The light emitting device module 420 may include a PCB substrate 422 such that a plurality of light emitting device packages 424 and a plurality of light emitting device packages 424 may be mounted to form an array.

In particular, the light emitting device package 424 includes a film in which a plurality of holes are formed on the light emitting surface, so that the lens may be omitted, thereby implementing a slim light emitting device package and simultaneously improving light extraction efficiency. Therefore, the thinner backlight unit 470 can be implemented.

On the other hand, the backlight unit 470 is a diffusion film 466 for diffusing light incident from the light guide plate 430 toward the liquid crystal display panel 410, and a prism film 450 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 464 for protecting the prism film 450.

9 is an exploded perspective view of a liquid crystal display including the light emitting device array according to the second embodiment.

However, the parts shown and described in FIG. 8 will not be repeatedly described in detail.

9, the liquid crystal display 500 may include a liquid crystal display panel 510 and a backlight unit 570 for providing light to the liquid crystal display panel 510.

Since the liquid crystal display panel 510 is the same as that described with reference to FIG. 8, a detailed description thereof will be omitted.

The backlight unit 570 includes a plurality of light emitting device modules 523, a reflective sheet 524, a lower chassis 530 in which the light emitting device modules 523 and the reflective sheet 524 are accommodated, and an upper portion of the light emitting device module 523. It may include a diffusion plate 540 and a plurality of optical film 560 disposed in the.

The light emitting device module 523 may include a PCB substrate 521 such that a plurality of light emitting device packages 522 and a plurality of light emitting device packages 522 are mounted to form an array.

In particular, the light emitting device package 522 is formed of a conductive material, and by providing a film including a plurality of holes on the light emitting surface, it is possible to omit the lens to implement a slim light emitting device package, at the same time light extraction efficiency Can improve. Therefore, it becomes possible to realize the backlight unit 570 which is thinner.

The reflective sheet 524 reflects the light generated from the light emitting device package 522 in the direction in which the liquid crystal display panel 510 is positioned to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 523 is incident on the diffusion plate 540, the optical film 560 is disposed on the diffusion plate 540. The optical film 560 may include a diffusion film 566, a prism film 550, and a protective film 564.

Here, the lighting device 300 and the liquid crystal display device (400, 500) may be included in the lighting system, in addition to the light emitting device package, and the purpose of the lighting may also be included in the lighting system.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (10)

A light emitting device package;
A connector connected to an external power source; And
And a printed circuit board including the copper foil pattern on which the light emitting device package and the connector are mounted, and an insulating member stacked on the copper foil pattern, wherein the connector is mounted in an open area where the insulating member is not stacked.
The copper foil pattern,
And a plurality of connector terminals partially exposed in the open area.
The plurality of connector terminals,
And a light emitting device array in which the exposed areas are symmetrical with respect to the center of the open area. The method of claim 1, wherein the plurality of connector terminals,
First and second connector terminals having an exposed first area; And
And a third and fourth connector terminal having a second area different from the first area. The length of the first connector terminal,
And a light emitting element array different from at least one of the lengths of the second and third connector terminals. The width of the first connector terminal,
And a light emitting element array different from at least one of widths of the second and third connector terminals. The method of claim 1,
Each of the plurality of connector terminals includes an extension terminal on which the insulating member is stacked.
The plurality of extension terminals,
A light emitting device array disposed asymmetrically with at least one of the top and bottom and left and right with respect to the center of the open area. The method of claim 1, wherein the light emitting device package,
A light emitting element;
A body in which a cavity is formed on a first lead frame on which the light emitting device is mounted and on a second lead frame spaced apart from the first lead frame; And
And a resin material filled in the cavity. The method of claim 6, wherein the resin is,
A light emitting device array comprising at least one of a phosphor and a light diffuser. The method of claim 6, wherein the resin is,
Light emitting device array comprising a transmissive material. The method of claim 1, wherein the insulating member,
An array of light emitting elements, either PSR ink or insulating film. 10. An illumination system comprising the array of light emitting elements of any one of claims 1-9.

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