KR101941512B1 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
KR101941512B1
KR101941512B1 KR1020110100811A KR20110100811A KR101941512B1 KR 101941512 B1 KR101941512 B1 KR 101941512B1 KR 1020110100811 A KR1020110100811 A KR 1020110100811A KR 20110100811 A KR20110100811 A KR 20110100811A KR 101941512 B1 KR101941512 B1 KR 101941512B1
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KR
South Korea
Prior art keywords
lead frame
light emitting
emitting device
cavity
device package
Prior art date
Application number
KR1020110100811A
Other languages
Korean (ko)
Other versions
KR20130036617A (en
Inventor
여정완
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020110100811A priority Critical patent/KR101941512B1/en
Publication of KR20130036617A publication Critical patent/KR20130036617A/en
Application granted granted Critical
Publication of KR101941512B1 publication Critical patent/KR101941512B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15158—Shape the die mounting substrate being other than a cuboid
    • H01L2924/15159—Side view

Abstract

The light emitting device package according to the embodiment may include a first lead frame and a second lead frame spaced apart from each other, and may be mounted on one of the first lead frame and the second lead frame exposed in the cavity, Wherein the body has a central portion having a bottom and a curved surface on a bottom surface of the outer surface, and a joint portion formed on both ends of the central portion, the bottom surface of the outer surface being planar, The reliability of mounting can be improved when the light emitting device package is mounted on the substrate.

Description

A light emitting device package

An embodiment relates to a light emitting device package.

As a typical example of a light emitting device, a light emitting diode (LED) is a device for converting an electric signal into an infrared ray, a visible ray, or a light using the characteristics of a compound semiconductor, and is used for various devices such as household appliances, remote controllers, Automation equipment, and the like, and the use area of LEDs is gradually widening.

In general, miniaturized LEDs are made of a surface mounting device for mounting directly on a PCB (Printed Circuit Board) substrate, and an LED lamp used as a display device is also being developed as a surface mounting device type . Such a surface mount device can replace a conventional simple lighting lamp, which is used for a lighting indicator for various colors, a character indicator, an image indicator, and the like.

As the use area of the LED is widened as described above, it is required to increase the brightness and size of the LED. Particularly, in the case of a long LED, there is a problem that the body is bent at the time of curing after injection molding.

The embodiment provides a light emitting device package with improved reliability and convenience in mounting on a substrate.

The light emitting device package according to the embodiment may include a first lead frame and a second lead frame spaced apart from each other, and may be mounted on one of the first lead frame and the second lead frame exposed in the cavity, Wherein the body has a central portion having a bottom and a curved surface on a bottom surface of the outer surface, and a joint portion formed on both ends of the central portion, the bottom surface of the outer surface being planar, As shown in FIG.

When the light emitting device package is mounted on the substrate, the bottom surface of the junction portion contacting the substrate has the same shape as the substrate when the light emitting device package is mounted on the substrate by flattening the bottom surface of the junction portion when curvature or curved surface is formed in the curing process after the injection molding of the light emitting device package The light emitting device package can be easily mounted on the substrate.

Further, the bottom surface of the body of the light emitting device package having a curved surface at the time of mounting on the substrate can be brought into close contact with the substrate, and reliability and convenience of mounting the light emitting device package can be improved.

1 is a perspective view of a light emitting device package according to an embodiment.
2 is a vertical sectional view of a light emitting device package according to the embodiment of FIG.
3 is a vertical sectional view of a light emitting device package according to another embodiment.
4 is a perspective view of a light emitting device package according to another embodiment.
5 is a vertical sectional view of a light emitting device package according to another embodiment.
6 is a perspective view of a light emitting device package according to another embodiment.
7 is a side view of the light emitting device package of Fig.
8 is a view illustrating a state in which the light emitting device package according to the embodiment is mounted.
9 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment.
10 is a cross-sectional view showing a CC 'section of the illumination device of FIG.
11 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment.
12 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" May be used to readily describe a device or a relationship of components to other devices or components. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element. Thus, the exemplary term "below" can include both downward and upward directions. The elements can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

FIG. 1 is a perspective view of a light emitting device package according to an embodiment, and FIG. 2 is a vertical sectional view of a light emitting device package according to the embodiment of FIG.

1 and 2, a light emitting device package 100 according to an embodiment includes a body 110 having a cavity C formed therein, a lead frame 120 provided on the body 110, a lead frame 120 mounted on the lead frame 120, The light source unit 130 may include a light source unit.

The body 110 serves as a housing and may include at least a first lead frame 121 and a second lead frame 122. However, the present invention is not limited to this, and it is possible to have at least two lead frames capable of applying power.

The body 110 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), liquid crystal polymer (PSG), polyamide 9T (Al 2 O 3 ), beryllium oxide (BeO), a printed circuit board (PCB), or the like, and may be formed by injection molding, etching process But the present invention is not limited thereto.

A cavity C having an open top may be formed in the body 110 so that the light source 130 may be positioned inside the cavity C. [ In addition, the inside of the body 110 may be inclined so that the angle of reflection of the light emitted from the light source unit 130 may be different depending on the angle of the inclined surface.

As the directivity angle of the light decreases, the concentration of the light emitted to the outside from the light source unit 130 increases. On the other hand, as the directivity angle of the light increases, the light source unit 130 emits the light toward the outside The concentration of light decreases.

The shape of the cavity C formed on the body 110 may be circular, square, polygonal, elliptical, or the like, and may have a curved shape, but the present invention is not limited thereto.

At this time, a reflection coating film (not shown) may be formed on the side surface and the bottom surface of the cavity C forming the inner wall of the cavity C. Here, the surface of the body 110 on which the reflective coating film (not shown) is formed may be smooth or have a predetermined roughness, and may be formed of silver (Ag), aluminum (Al), or the like.

The lead frame 120 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, platinum, tin, (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru), and iron (Fe). Further, the lead frame 120 may be formed to have a single layer or a multi-layer structure, but the present invention is not limited thereto.

In addition, the lead frame 120 may be composed of a first lead frame 121 and a second lead frame 122 to apply different power sources. Here, the light source unit 130 may be disposed on the first lead frame 121, and the second lead frame 122 may be spaced apart from the first lead frame 121 by a predetermined distance. The light source unit may be connected to the second lead frame 122 through wire 140 bonding. However, the present invention is not limited thereto, and the light source unit 130 may have any structure that is electrically connected to the first lead frame 121 and the second lead frame 122.

The first lead frame 121 and the second lead frame 122 protrude sideways through the body 110 and can bend along the body 110 to be in contact with the bottom surface of the body 110. However, the present invention is not limited thereto and may have various configurations. This will be described later.

The light source unit 130 is mounted on the first lead frame 121 and emits light of a predetermined wavelength by an external power source. For example, a light emitting element. However, the present invention is not limited to this, and any device that generates light may be used.

The light emitting device is a kind of semiconductor device and can be implemented based on a group III or group compound such as GaN (gallium nitride), AlN (aluminum nitride), InN (indium nitride), GaAs (gallium arsenide) For example, the light emitting device may be a light emitting diode.

The light emitting diode may be, for example, a colored light emitting diode that emits light such as red, green, blue, or white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet light. In the embodiment, a single light emitting diode is illustrated as being provided at the central portion, but the present invention is not limited thereto, and it is also possible to include a plurality of light emitting diodes.

In addition, the light source unit 130 may be a horizontal type in which all the electric terminals are formed on the upper surface, or a vertical type formed in the upper and lower surfaces.

The light source unit 130 is electrically connected to the first lead frame 121 and the second lead frame 122 through the wire 140 to receive external power. In this case, the horizontal type light emitting device uses a wire bonding method using two wires, and the vertical type light emitting device uses a wire bonding method using one wire.

The resin material 150 may be filled in the cavity to seal the light source unit 130 and the wire 140. At this time, the resin material 150 may be formed of a light-transmissive resin material such as silicon or epoxy, and the material may be filled in the cavity and then formed by ultraviolet ray or thermal curing.

The surface of the resin material 150 may be formed in a concave lens shape, a convex lens shape, a flat shape, or the like, and the orientation angle of the light emitted from the light source unit 130 may be changed according to the shape of the resin material 150 .

In addition, other lens-shaped resin materials may be formed or adhered on the resin material 150, but the present invention is not limited thereto.

The resin material 150 may include a phosphor. Here, the phosphor may be selected according to the wavelength of the light emitted from the light source unit 130, so that the light emitting device package 100 may realize white light.

That is, the phosphor may be excited by the light having the first light emitted from the light source unit 130 to generate the second light. For example, when the light source unit 130 is a blue light emitting diode and the phosphor is a yellow phosphor , The yellow phosphor may be excited by blue light to emit yellow light, and the blue light generated from the blue light emitting diode and the yellow light generated by excitation by the blue light may be mixed, so that the light emitting device package 100 emits white light can do.

Similarly, when the light source unit 130 is a green light emitting diode, a magenta phosphor or a blue phosphor and a red phosphor are mixed, and when the light source unit 130 is a red light emitting diode, a cyan phosphor or a mixture of blue and green phosphors For example.

Such a fluorescent material may be a known fluorescent material such as a YAG, TAG, sulfide, silicate, aluminate, nitride, carbide, nitridosilicate, borate, fluoride or phosphate.

1 and 2, the body 110 includes a wall portion 111 forming a side surface of the cavity C, a central portion 112 formed at a lower portion of the wall portion 111, and a joining portion 113 can do.

Here, the central portion 112 may have a curved surface on the bottom surface 112D of the outer surface.

The bottom surface 112D of the central portion can form an arcuately concave curved surface. However, the present invention is not limited to this, and the bottom surface 112D of the central portion may be formed to have a curved surface and to be convex.

1 and 2, the bottom surface 112D of the center portion has a curved surface. However, the upper surface of the body 110 and the lower surface of the cavity C may have curved surfaces, which will be described later.

The bonding portion 113 is formed at both ends of the central portion 112 and bonded to the substrate or the like when the light emitting device package 100 is mounted on a substrate or the like and the bottom surface 113D of the outer surface is flat.

The bottom surface 113D of the joint part is connected to the bottom surface 112D of the center part and may be formed below the bottom surface 112D of the center part. That is, the bottom surface 112D of the central portion may be formed to be concave toward the inside of the light emitting device package 100, spaced apart from the extension of the bottom surface 113D of the junction portion.

Further, the bottom surfaces 113D of both joint portions may be formed parallel to each other, and may be formed on the same surface. However, the present invention is not limited to this and may have a step.

A method of forming the bottom surface 113D of the joint portion may be formed by an injection molding method in consideration of, for example, warpage that may occur during curing before injection of the body 110, Or may be formed by an etching process or a cutting method in which warpage is generated in the process. However, the present invention is not limited thereto.

Therefore, when the light emitting device package 100 is mounted on the substrate by forming the bottom surface 113D of the junction part flat when the light emitting device package 100 is bent or curved in the curing process after injection molding, The light emitting device package 100 can be easily mounted on the substrate if the bottom surface 113D of the bonding portion in contact with the light emitting device package 100 is formed in a plane having the same shape as the substrate. In addition, the bottom surface of the light emitting device package 100 having a curved surface can be brought into close contact with the substrate, and the reliability and convenience of mounting the light emitting device package 100 can be improved.

In addition, when the length of the light emitting device package 100 increases, deformation occurring during the curing or cooling process after the molding is largely generated. In this case, the reliability and convenience of the light emitting device package 100 And the reliability can be improved even in the use process.

On the other hand, the shape of the bottom surface 113D of the junction portion viewed from the top may have a rectangular shape when the light emitting device package 100 is a hexahedron. However, the present invention is not limited thereto and may have various shapes. If the shape of the bottom surface 113D of the joint portion is rectangular, it is advantageous in the area of close contact with the substrate, and the reliability of the mounting can be improved.

The thickness w2 of the bonding portion 113 and the thickness w1 of the central portion 112 may be different from each other. However, the present invention is not limited thereto.

The width L of the bottom surface 113D of the joint may be 0.5 mm to 3 mm. When the width L of the bottom surface 113D of the bonding portion is smaller than 0.5 mm, there is a problem in bonding strength when the light emitting device package 100 is mounted on the substrate. When the width L is larger than 3 mm, The strength of the body 110 may be lowered.

The angle? 1 between the bottom surface 113D of the joining portion and the tangent of the bottom surface 112D of the center portion contacting the bottom surface 113D of the joining portion may be in the range of 130 to 179 degrees. However, the present invention is not limited thereto.

The distance d between the bottom surface 112D of the center portion and the extension line of the bottom surface 113D of the joining portion may have a range of 0.05 mm to 0.2 mm. The distance d between the bottom surface 112D of the center portion and the extension line of the bottom surface 113D of the joining portion is the largest distance between the bottom surface 112D of the center portion and the extension line of the bottom surface 113D of the joining portion As a reference.

At this time, the first lead frame 121 and the second lead frame 122 protrude from the side surface of the body 110 and can bend to contact the bottom surface 113D of the joint portion. The direction in which the lead frame 120 protrudes may be a width direction or a length direction of the light emitting device package 100. However, the present invention is not limited thereto. When the first lead frame 121 and the second lead frame 122 are brought into contact with the bottom surface 113D of the junction portion, they are stably connected to the substrate and power can be supplied to the light source portion 130 stably.

The top surface of the first lead frame 121 or the second lead frame 122 exposed in the cavity C is flattened so that the bottom surface 114 of the cavity C is flat. . The bottom surface 114 of the cavity C may be curved and only the upper surface of the first lead frame 121 and the light emitting device package 100 may be formed flat, The bottom surface 114 may be formed to be bent and the first lead frame 121 and the second lead frame 122 may be formed to bend along the bottom surface 113D of the junction portion. This will be described later. However, the present invention is not limited thereto.

3 is a vertical sectional view of a light emitting device package according to another embodiment.

3, the light emitting device package 200 includes a body 210 having a cavity C formed therein, a lead frame 220 provided on the body 210, a light source unit 220 mounted on the lead frame 220, 230).

At this time, the bottom surface 214 of the cavity C may have a curved surface. The curvature of the bottom surface 214 of the cavity C and the curvature of the bottom surface 212D of the center portion may be the same. However, the present invention is not limited to this and may have different curvatures.

The bottom surface of the first lead frame 221 and the second lead frame 222 exposed in the cavity C may have a curved surface along the bottom surface 214 of the cavity C. [ The top surfaces of the first lead frame 221 and the second lead frame 222 exposed in the cavity C may have a curved surface along the bottom surface 214 of the cavity C. [ That is, the first lead frame 221 and the second lead frame 222 exposed in the cavity C may be formed to be curved along the bottom surface 214 of the cavity C while being constant in thickness, The bottom surfaces of the first lead frame 221 and the second lead frame 222 are formed to bend along the bottom surface of the bottom surface 214 of the cavity C, and the first lead frame 221 and the second lead frame 222 are bent, The upper surface of the second electrode 222 may be formed flat. But is not limited thereto.

4 is a perspective view of a light emitting device package according to another embodiment.

Referring to FIG. 4, the light emitting device package 300 according to the embodiment differs from the embodiment of FIG. 1 in the configuration of the lead frame 320.

The first lead frame 321 and the second lead frame 322 may protrude from the lateral side of the body 310 and may be curved toward the center bottom surface 312D.

At this time, one end of the first lead frame 321 and the other end of the second lead frame 322 may be bent to contact the bottom surface 312D of the center portion. The first lead frame 321 and the second lead frame 322 may be bent in the direction of the bottom surface 312D of the center portion and not in contact with the bottom surface 312D of the center portion . 4, the lead frame 320 is shown as not contacting the bottom surface 312D of the central portion. However, the present invention is not limited thereto. That is, the first lead frame 321 and the second lead frame 322 protrude in the lateral direction of the body 310 and are spaced apart from each other by a space between an extension of the bottom surface 313D of the junction and a bottom surface 312D of the central portion. .

When the lead frame 320 is formed as described above, the contact area of the light emitting device package 300 having a curved surface is increased during mounting on the substrate, and the reliability of the mounting can be improved.

5 is a vertical sectional view of a light emitting device package according to another embodiment.

3, the upper surface 415 of the body 410 has a curved surface, and has the same curvature as the bottom surface 442D of the central portion, as compared with the embodiment of FIG. Lt; / RTI > That is, at least one of the bottom surface 442D of the center portion, the bottom surface 414 of the cavity C, the top surface 415 of the body 410, or the lead frame 420 exposed into the cavity C, Lt; / RTI > And the curvatures of these curved surfaces may or may not be the same. 5, the bottom surface 412D of the center portion, the bottom surface 414 of the cavity C, the top surface 415 of the body 410, and the lead frame 420 exposed into the cavity C have curved surfaces, Are shown to have the same curvature. However, the present invention is not limited thereto.

If the thickness h of the body 410 is too small on the bottom surface 413D of the joint portion, the strength of the body 410 can not be maintained and the thickness of the body 410 the thickness h of the body 410 on the bottom surface 413D of the joint portion may be 0.6 mm to 0.79 mm since the luminous efficiency of the light emitting device may be lowered. However, the present invention is not limited thereto. On the other hand, the length a of the upper surface 415 of the body may be 7 mm to 8.5 mm. However, the present invention is not limited thereto.

The angle? 2 formed by the side surface of the body 410 and the bottom surface 413D of the joint portion may be 100 to 179 degrees. However, the present invention is not limited thereto.

FIG. 6 is a perspective view of a light emitting device package according to another embodiment, and FIG. 7 is a side view of the light emitting device package of FIG.

Referring to FIGS. 6 and 7, the light emitting device package 500 of the embodiment differs from the embodiment of FIG. 5 in the configuration of the first lead frame 521 and the second lead frame 522. FIG.

The first lead frame 521 and the second lead frame 522 may protrude from the side of the body 510 in the width direction and may be bent in the direction of the bottom surface 512D of the center portion.

At this time, one end of the first lead frame 521 and the second lead frame 522 may be bent and contact with the bottom surface 512D of the center portion. The first lead frame 521 and the second lead frame 522 may be bent in the direction of the bottom surface 512D of the center portion and not in contact with the bottom surface 512D of the center portion . In Fig. 6, the lead frame 520 is shown as not contacting the bottom surface 512D of the central portion. However, the present invention is not limited thereto. That is, the first lead frame 521 and the second lead frame 522 protrude in the lateral direction of the body 510, and the space between the extension of the bottom surface 513D of the junction and the bottom surface 512D of the center portion .

When the lead frame 520 is formed as described above, the contact area of the light emitting device package 500 having a curved surface is increased during mounting on the substrate, and the reliability of the mounting can be improved.

8 is a view illustrating a state in which the light emitting device package according to the embodiment is mounted.

Referring to FIG. 8, a plurality of light emitting device packages 400 and a plurality of light emitting device packages 400 may be disposed.

The substrate 10 may be a printed circuit board, a flexible printed circuit board or a metal substrate. In the case of a printed circuit board, a printed circuit board (PCB), a printed circuit board Board or a PCB (Print Circuit Board) having a plurality of layers can be used. In the embodiment, it is described that it is a single-sided PCB (Print circuit Board), but the present invention is not limited thereto.

The substrate 10 may include a base layer 11, a copper foil layer 12, and an insulating layer 13.

The base layer 11 may be an FR4 material, and the glass fiber and the epoxy resin may form a plurality of layers, but are not limited thereto.

The plurality of light emitting device packages 400 are mounted on the copper foil layer 12 disposed on the base layer 11 to supply power. The insulating layer 13 may be laminated on the base layer 11 and a part of the copper foil layer 12.

The copper foil layer 12 may include an electrode pattern 14 on which the light emitting device package 400 is mounted, and the electrode pattern 14 may be formed in various ways.

The substrate 10 may have a flat shape and the light emitting device packages 100, 200, 300, 400, and 500 described with reference to FIGS. 1 to 6 may be easily disposed on the substrate 10 having a flat shape. have. 1 to 6, when the bottom surface 113D of the junction portion contacting the substrate 10 is formed in the same plane as the substrate, the light emitting device package 100 can be easily mounted on the substrate have.

FIG. 9 is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 10 is a cross-sectional view taken along the line C-C 'of the lighting device of FIG.

9 and 10, the lighting apparatus 600 may include a body 610, a cover 630 coupled to the body 610, and a finishing cap 650 positioned at opposite ends of the body 610 have.

A light emitting device module 640 is coupled to a lower surface of the body 610. The body 610 is electrically conductive so that heat generated from the light emitting device package 644 can be emitted to the outside through the upper surface of the body 610. [ And a metal material having an excellent heat dissipation effect.

The light emitting device package 644 may be mounted on the PCB 642 in a multi-color, multi-row manner to form an array. The light emitting device package 644 may be mounted at equal intervals or may be mounted with various spacings as required. As the PCB 642, MPPCB (Metal Core PCB) or FR4 material PCB can be used.

The light emitting device package 644 may include an extended lead frame (not shown) so as to have an improved heat dissipation function, so that the reliability and efficiency of the light emitting device package 644 can be improved. The service life of the illumination device 600 including the element package 644 can be extended.

The cover 630 may be formed in a circular shape so as to surround the lower surface of the body 610, but is not limited thereto.

The cover 630 protects the internal light emitting element module 640 from foreign substances or the like. The cover 630 may include diffusion particles so as to prevent glare of light generated in the light emitting device package 644 and uniformly emit light to the outside, and may include at least one of an inner surface and an outer surface of the cover 630 A prism pattern or the like may be formed on one side. Further, the phosphor may be applied to at least one of the inner surface and the outer surface of the cover 630.

Since the light generated in the light emitting device package 644 is emitted to the outside through the cover 630, the cover 630 must have a high light transmittance and sufficient heat resistance to withstand the heat generated in the light emitting device package 644 The cover 630 may be formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like.

The finishing cap 650 is located at both ends of the body 610 and can be used to seal the power supply unit (not shown). In addition, the finishing cap 650 is provided with the power supply pin 652, so that the lighting apparatus 600 according to the embodiment can be used immediately without a separate device on the terminal from which the conventional fluorescent lamp is removed.

11 is an exploded perspective view of a liquid crystal display device including a light emitting device package according to an embodiment.

11, the liquid crystal display 700 may include a liquid crystal display panel 710 and a backlight unit 770 for providing light to the liquid crystal display panel 710 in an edge-light manner.

The liquid crystal display panel 710 can display an image using light provided from the backlight unit 770. The liquid crystal display panel 710 may include a color filter substrate 712 and a thin film transistor substrate 714 facing each other with a liquid crystal therebetween.

The color filter substrate 712 can realize the color of an image to be displayed through the liquid crystal display panel 710.

The thin film transistor substrate 714 is electrically connected to a printed circuit board 718 on which a plurality of circuit components are mounted via a driving film 717. The thin film transistor substrate 714 may apply a driving voltage provided from the printed circuit board 718 to the liquid crystal in response to a driving signal provided from the printed circuit board 718. [

The thin film transistor substrate 714 may include a thin film transistor and a pixel electrode formed as a thin film on another substrate of a transparent material such as glass or plastic.

The backlight unit 770 includes a light emitting element module 720 that outputs light, a light guide plate 730 that changes the light provided from the light emitting element module 720 into a surface light source and provides the light to the liquid crystal display panel 710, A plurality of films 752, 766, and 764 for uniformly distributing the luminance of light provided from the light guide plate 730 and improving vertical incidence and a reflective sheet (reflective plate) for reflecting light emitted to the rear of the light guide plate 730 to the light guide plate 730 747).

The light emitting device module 720 may include a PCB substrate 722 for mounting a plurality of light emitting device packages 724 and a plurality of light emitting device packages 724 to form an array. In this case, the reliability of the mounting of the bent light emitting device package 724 can be improved.

The backlight unit 770 includes a diffusion film 766 for diffusing light incident from the light guide plate 730 toward the liquid crystal display panel 710 and a prism film 752 for enhancing vertical incidence by condensing the diffused light. , And may include a protective film 764 for protecting the prism film 750.

12 is an exploded perspective view of a liquid crystal display device including a light emitting device according to an embodiment. However, the parts shown and described in Fig. 11 are not repeatedly described in detail.

12, the liquid crystal display device 800 may include a liquid crystal display panel 810 and a backlight unit 870 for providing light to the liquid crystal display panel 810 in a direct-down manner.

The liquid crystal display panel 810 is the same as that described with reference to FIG. 11, and a detailed description thereof will be omitted.

The backlight unit 870 includes a plurality of light emitting element modules 823, a reflective sheet 824, a lower chassis 830 in which the light emitting element module 823 and the reflective sheet 824 are accommodated, And a plurality of optical films 860. The diffuser plate 840 and the plurality of optical films 860 are disposed on the light guide plate 840. [

The light emitting device module 823 may include a PCB substrate 821 to mount a plurality of light emitting device packages 822 and a plurality of light emitting device packages 822 to form an array.

The reflective sheet 824 reflects light generated from the light emitting device package 822 in a direction in which the liquid crystal display panel 810 is positioned, thereby improving light utilization efficiency.

Light generated in the light emitting element module 823 is incident on the diffusion plate 840 and an optical film 860 is disposed on the diffusion plate 840. The optical film 860 may include a diffusion film 866, a prism film 850, and a protective film 864.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

Claims (19)

A body having a first lead frame and a second lead frame spaced apart from each other and having a cavity formed therein; And
And a light source unit mounted on one of the first lead frame and the second lead frame exposed in the cavity,
The body,
A center portion having a bottom and a curved surface on the bottom of the outer surface; And
A joining portion formed at both ends of the central portion and having a flat bottom surface of the outer surface,
Wherein a bottom surface of the joining portion is formed below a bottom surface of the central portion,
Wherein the first lead frame and the second lead frame protrude from the side in the width direction of the body and bend to contact the bottom surface of the central portion. The method according to claim 1,
The curved surface of the central portion is arcuate, and the light emitting device package is concave. delete The method according to claim 1,
Wherein the bottom surface of the junction includes a quadrangular shape as viewed from above and has a width in the range of 0.5 mm to 3 mm and is formed on the same plane in parallel with each other. The method according to claim 1,
The thickness of the joint portion and the thickness of the central portion are different from each other,
Wherein a distance between a bottom surface of the central portion and an extension line of a bottom surface of the bonding portion is in a range of 0.05 mm to 0.2 mm. delete delete delete delete The method according to claim 1,
The first lead frame and the second lead frame protrude from the side surface of the body and bend to abut the bottom surface of the joint,
Wherein the first lead frame or the second lead frame has a top surface exposed in the cavity. delete delete The method according to claim 1,
Wherein the bottom surface of the cavity is formed to have a curved surface and has the same curvature as the bottom surface of the central portion,
A bottom surface of the first lead frame and the second lead frame exposed in the cavity is formed along the bottom surface of the cavity,
Wherein the upper surface of the body has a curved surface and has the same curvature as the bottom surface of the central portion. delete 14. The method of claim 13,
And a top surface of the first lead frame and the second lead frame exposed in the cavity are formed along the bottom surface of the cavity. delete 14. The method of claim 13,
Wherein a thickness of the body is 0.6 mm to 0.79 mm on the bottom surface of the junction, and a length of the body is 7 mm to 8.5 mm. delete delete
KR1020110100811A 2011-10-04 2011-10-04 Light emitting device KR101941512B1 (en)

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Publication number Priority date Publication date Assignee Title
KR102131348B1 (en) * 2014-02-17 2020-07-07 엘지이노텍 주식회사 Light emitting device package
KR102413223B1 (en) * 2017-12-19 2022-06-24 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package
KR102036338B1 (en) * 2018-04-13 2019-10-24 (주)포인트엔지니어링 Optical device package

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016292A (en) * 2008-07-07 2010-01-21 Showa Denko Kk Lighting device and method of manufacturing lighting device
JP2010062427A (en) * 2008-09-05 2010-03-18 Toshiba Corp Light emitting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010016292A (en) * 2008-07-07 2010-01-21 Showa Denko Kk Lighting device and method of manufacturing lighting device
JP2010062427A (en) * 2008-09-05 2010-03-18 Toshiba Corp Light emitting device

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