KR102131348B1 - Light emitting device package - Google Patents

Abstract

The embodiment includes a first lead frame in which the light emitting element is disposed and a second lead frame spaced apart from the first lead frame, and the first inclined surface, the second inclined surface, and the first and second inclined surfaces. It has a triangular cross section made of a third inclined surface that emits light from a light emitting device, and includes a body in which a cavity is formed on the first and second lead frames, and a resin material that is filled in the cavity and forms the third inclined surface. In addition, the first lead frame provides a light emitting device package exposed on the first and second inclined surfaces.

Description

Light emitting device package

The embodiment relates to a light emitting device package.

Light Emitting Diode (LED) is a device that converts electrical signals into the form of light by using the properties of compound semiconductors, and is used in household appliances, remote controls, electronic displays, indicators, and various automation devices. Trend.

In general, miniaturized LEDs are made of a surface mount device type for mounting directly on a printed circuit board (PCB) board, and accordingly, LED lamps used as display devices are also being developed as a surface mount device type. . Such a surface mount element can replace the existing simple lighting lamp, which is used as a lighting indicator, text display, and image display that emit various colors.

As the use area of the LED becomes wider, luminance and reliability required for a light used for life, a light for rescue signals, and the like increase, and it is important to increase the light emission luminance and reliability of the LED.

An object of the embodiment is to provide a light emitting device package having a high directivity angle and easily dissipating heat generated by the light emitting device.

The light emitting device package according to the embodiment includes a light emitting device, a first lead frame in which the light emitting devices are disposed, and a second lead frame spaced apart from the first lead frame, the first inclined surface, the second inclined surface, and the first , Has a triangular cross-section consisting of a third inclined surface that emits light from the light emitting element between the two inclined surfaces, is filled in the body and the cavity formed on the first and second lead frames, the third inclined surface It includes a resin material to be formed, and the first lead frame may be exposed to the first and second inclined surfaces.

The light emitting device package according to the embodiment, the first lead frame in which the light emitting device is disposed in a body having a triangular cross section is exposed to at least two surfaces of the triangular cross section, thereby easily dissipating heat generated from the light emitting device to the outside. , By increasing the heat dissipation effect, there is an advantage that can increase the durability of the light emitting device.

1 is a perspective view showing a light emitting device package according to a first embodiment.
FIG. 2 is a cross-sectional perspective view of a portion of the light emitting device package shown in FIG. 1 cut in the first and third directions (x, y).
3 is a perspective view showing first and second lead frames shown in FIG. 2.
4 is a perspective view showing a light emitting device package according to a second embodiment.
5 is a cross-sectional perspective view of the light emitting device package shown in FIG. 4 cut in the first and third directions (x, y).
6 is a perspective view and a cross-sectional view showing first and second lead frames shown in FIG. 5.
7 is an exploded perspective view showing a display device according to an exemplary embodiment.
8 is a cross-sectional view illustrating a display device according to another exemplary embodiment.
9 is an exploded perspective view showing a lighting device according to an embodiment.

Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only the embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention pertains. It is provided to completely inform the person having the scope of the invention, and the present invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.

The spatially relative terms “below”, “beneath”, “lower”, “above”, “upper”, etc., are as shown in the figure. It can be used to easily describe the correlation of a device or components with other devices or components. The spatially relative terms should be understood as terms including different directions of the device in use or operation in addition to the directions shown in the drawings. For example, if the device shown in the figure is turned over, a device described as "below" or "beneath" the other device may be placed "above" the other device. Thus, the exemplary term “below” can include both the directions below and above. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to the orientation.

The terminology used herein is for describing the embodiments and is not intended to limit the present invention. In the present specification, the singular form also includes the plural form unless otherwise specified in the phrase. As used herein, "comprises" and/or "comprising" refers to the components, steps, operations and/or elements mentioned above, the presence of one or more other components, steps, operations and/or elements. Or do not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used as meanings commonly understood by those skilled in the art to which the present invention pertains. In addition, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively, unless specifically defined.

In the drawings, the thickness or size of each layer is exaggerated, omitted, or schematically illustrated for convenience and clarity. In addition, the size and area of each component does not entirely reflect the actual size or area.

In addition, the angles and directions mentioned in the process of describing the structure of the light emitting device package in the embodiment are based on those described in the drawings. In the description of the structure constituting the light emitting element in the specification, if the reference point and the positional relationship with respect to the angle is not explicitly mentioned, the related drawings will be referred to.

1 is a perspective view showing a light emitting device package according to a first embodiment.

Referring to FIG. 1, the light emitting device package 100 may include a light emitting device 12 and a body 20 on which the light emitting device 12 is disposed.

The body 20 may include a first partition wall 22 extending in the first direction (x) and a second partition wall 24 extending in the second direction (z) intersecting the first direction (x), , The first and second partition walls 22 and 24 may be integrally formed with each other or may be formed to be combined with each other. The first and second partition walls 22 and 24 may be formed by injection molding, an etching process, and the like, but are not limited thereto.

The first and second partition walls 22 and 24 are made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), AlOx, and liquid crystal polymer (PSG, photo sensitive) glass), polyamide 9T (PA9T), new geotactic polystyrene (SPS), metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), ceramic, and at least one of printed circuit boards (PCB) It can be formed as one.

In addition, the top and bottom shapes of the first and second partition walls 22 and 24 may have various shapes such as a triangle, a square, a polygon, and a circular shape according to the use and design of the light emitting device 12, but are not limited thereto.

In addition, the first and second partition walls 22 and 24 may form a cavity s in which the light emitting elements 12 are disposed, and the cross-sectional shape of the cavity s may be formed in a cup shape, a concave container shape, or the like. The first and second partition walls 22 and 24 constituting the cavity s may be inclined downward.

In addition, the planar shape of the cavity s may have various shapes such as a triangle, a square, a polygon, and a circular shape, but is not limited thereto.

Here, when the body 20 is cut in the third direction (y), it may have a triangular cross-section, generated in the first inclined surface (not shown), the second inclined surface (not shown) and the light emitting device 12 It may include a third inclined surface (not shown) for emitting the light.

The cross-sectional shape of the body 20 according to the embodiment will be described later.

The body 20 may include first and second lead frames 32 and 34 forming the lower surface of the cavity s, and the first and second lead frames 32 and 34 may be made of metal, for example , Titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P ), one or more of aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) Or alloys.

In addition, the first and second lead frames 32 and 34 may be formed to have a single-layer or multi-layer structure, but is not limited thereto.

Here, the first and second lead frames 32 and 34 may have the same shape as the cross-sectional shape of the body 20 and may be exposed on at least one of the first and second inclined surfaces.

The first and second lead frames 32 and 34 according to the implementation will be described later.

In addition, the body 20 may include an insulating member 26 that electrically insulates the first and second lead frames 32 and 34, but is not limited thereto.

Here, the cross-sectional shape of the insulating member 26 may have a shape such as a triangle, a square, a circle, an oval, and a polygon, but is not limited thereto.

The inner surfaces of the first and second partition walls 22 and 24 may be formed to be inclined with a predetermined inclination angle based on any one of the upper surfaces of the first and second lead frames 32 and 34, and emit light according to the inclination angle. The reflection angle of the light emitted from the device 12 may be changed, and accordingly, the directing angle of the light emitted to the outside may be adjusted. Here, while the concentration of light emitted from the light emitting element 12 increases so that the directivity of light decreases, the concentration of light emitted from the light emitting element 12 to the outside may decrease as the light directing angle increases.

The inner surfaces of the first and second partition walls 22 and 24 may have a plurality of inclination angles, thereby forming a plurality of cavities (not shown), but are not limited thereto.

The first and second lead frames 32 and 34 are electrically connected to the light emitting element 12, and are respectively connected to the positive (+) and negative (-) poles of an external power source (not shown), respectively. ) To supply power.

In an embodiment, the light emitting device 12 is disposed on the first lead frame 32, and the second lead frame 34 is described as being spaced apart from the first lead frame 32, but is not limited thereto.

Further, in the embodiment, the light emitting device 12 may be a light emitting device of a horizontal type, a vertical type, and a flip type, and the light emitting device 12 is wire-bonded with the first and second lead frames 32 and 34 to be electrically connected. It may be connected, but is not limited thereto, and the electrodes may be connected to the first and second lead frames 32 and 34 to supply power to the light emitting device 12.

In the cavity s formed in the body 20, a resin material 40 capable of covering the light emitting element 12 may be filled.

The resin material 40 may include a translucent material, for example, silicone, epoxy, and other resin materials, and may be cured according to ultraviolet or thermal curing methods.

The resin material 40 may include a phosphor (not shown), and the phosphor may be selected according to the wavelength of light emitted from the light emitting element 12 to implement white light.

That is, the phosphor is a blue light emitting phosphor, a blue light emitting phosphor, a green light emitting phosphor, a yellow green light emitting phosphor, a yellow light emitting phosphor, a yellow red light emitting phosphor, an orange light emitting phosphor, and a red light emitting phosphor according to the wavelength of light emitted from the light emitting device 12 Either can be applied.

The phosphor may be excited by light having the first light emitted from the light emitting device 12 to generate the second light. For example, when the light emitting device 12 is a blue light emitting diode and the phosphor (not shown) is a yellow phosphor, the yellow phosphor may be excited by blue light to emit yellow light, and the blue light generated by the blue light emitting diode and As the yellow light generated by excitation by the blue light is mixed, the light emitting device package 100 may provide white light.

When the light emitting element 12 is a green light emitting diode, when a magenta phosphor or a blue and red phosphor (not shown) is mixed, when the light emitting element 12 is a red light emitting diode, a Cyan phosphor or a blue and green phosphor is mixed. For example.

The phosphor may be YAG-based, TAG-based, sulfide-based, silicate-based, aluminate-based, nitride-based, carbide-based, nitridosilicate-based, borate-based, fluoride-based, or phosphate-based.

In an embodiment, the first light emitting device 12 may be a colored light emitting diode that emits light such as red, green, blue, and white, or a UV (Ultra Violet) light emitting diode that emits ultraviolet rays, but is not limited thereto.

FIG. 2 is a perspective sectional view of a part of the light emitting device package shown in FIG. 1 cut in the first and third directions (x, y) and FIG. 3 is a perspective view showing the first and second lead frames shown in FIG. 2.

2 and 3, when the light emitting device package 100 is cut in a third direction (y), first and second lead frames 32 and 34 having a triangular cross-sectional shape and first and second lead frames A cavity s in which the resin material 40 is filled is formed on the 32 and 34, and may include a body 20 having a triangular cross-sectional shape.

The body 20 may include a first inclined surface s1, a second inclined surface s2, and a third inclined surface s3 in which light generated from the light emitting element 12 is excited and emitted by the resin 40. have.

That is, the third inclined surface s3 is disposed between the first and second inclined surfaces s1 and s2, and the third inclined surface s3 may be inclined by the first and second inclined surfaces s1 and s2.

The body 20 forms a first inclination angle θ1 between the first and second inclined surfaces s1 and s2, and a second inclination angle θ2 between the first inclined surface s1 and the third inclined surface s3, A third inclination angle θ3 may be achieved between the second inclined surface s2 and the third inclined surface θ3.

In an embodiment, the body 20 may have a triangular cross section by the first and second inclined surfaces s1 and s2 and the third inclined surface s3, and the trapezoidal shape in which the third inclined surface s3 is formed to be inclined It may have a cross section, but is not limited thereto.

Here, the first inclination angle θ1 may be 90° to 120°.

When the first inclination angle θ1 is less than 90° or greater than 120°, the bonding stability may be lowered when the body 20 is mounted on a printed circuit board (not shown).

At this time, the second inclination angle θ2 may be 45°, the same as the third inclination angle θ3 when the first inclination angle θ1 is 90°, and the third inclination angle (when the first inclination angle θ1) is 100° The same as θ3), or may be formed at 45° to 50°, and also, when the first inclination angle θ1 is 120°, the second and third inclination angles θ3 and θ4 may be varied according to the directivity angle. And there is no limitation.

The first and second lead frames 32 and 34 shown in FIG. 3 are shown to have the same triangular cross-sectional shape, but are not limited thereto.

In an embodiment, each of the first and second lead frames 32 and 34 has first, second, and third surfaces s11, s12, and s13, and the first, second, and third included in the first lead frame 32 Although the inclination angle between the surfaces s11, s12, and s13 is the same as the inclination angle between the first, second, and third surfaces s11, s12, and s13 included in the second lead frame 34, it is described and described, but is not limited to this. Do not put.

The first lead frame 32 includes a first surface s11 exposed to the first inclined surface s1, a second surface s12 exposed to the second inclined surface s2, and first and second surfaces s11 and s12. It may be disposed between and include a third surface s13 on which the light emitting element 12 is disposed.

Here, the first surface s11 is formed to have a smaller size than the first inclined surface s1, and may achieve the second inclined surface s12 and the fourth inclined angle θ4.

The fourth inclination angle θ4 may have the same angle as the first inclination angle θ1 described above.

In addition, the exposed area of the first surface s11 may be 0.5 to 1 times the exposed area of the second surface s12, but is not limited thereto.

That is, when the fourth inclination angle θ4 is 90° and the fifth and sixth inclination angles θ5 and θ6 are equally 45°, the exposed area of the first surface s11 is the exposed area of the second surface s12 And may be formed identically or narrowly. In addition, when the fourth inclination angle θ4 is 100°, the fifth inclination angle θ5 is 50°, and the sixth inclination angle θ6 is 30°, the exposed area of the first surface s11 is the second surface ( s12).

In addition, when the exposed area of the first surface s11 is less than 0.5 times the exposed area of the second surface s21, when the light emitting device package is mounted on a printed circuit board (not shown), the light emitting device package and the printing are performed in a soldering process. Electrical connection between the conductive pattern layer (not shown) patterned on the circuit board is not easy, or when the light emitting device package is disposed on the printed circuit board, stability may be lowered, compared to the exposed area of the second surface s21 1 When it is larger than twice, stability when placed on the printed circuit board and electrical connection with the conductive pattern layer are easy, but since the size of the light emitting device package can be increased, miniaturization according to the recent trend cannot be achieved.

The first surface s11 may form the third surface s13 and the fifth inclination angle θ5, and the fifth inclination angle θ5 may have the same angle as the second inclination angle θ2 described above.

The second surface s12 may be formed in a smaller size than the second inclined surface s2, and may form a third surface s13 and a sixth inclination angle θ6, and the sixth inclination angle θ6 may be 3 may have the same angle as the inclination angle θ3, but is not limited thereto.

In this way, the light emitting device package 100 shown in FIGS. 2 and 3 and the first and second lead frames 32 and 34 have the same triangular cross-section, thereby increasing the cross-sectional area of the third inclined surface s3. Accordingly, there is an advantage in that the directivity angle is widened, and at least two surfaces of the first and second lead frames 32 and 34 are exposed to at least two surfaces of the body 20, thereby generating light when the light emitting device 12 emits light. By dissipating heat, the durability of the light emitting device package 100 or the light emitting device 12 may be improved.

4 is a perspective view showing a light emitting device package according to a second embodiment.

Referring to FIG. 4, the light emitting device package 200 may include a light emitting device 112 and a body 120 on which the light emitting device 112 is disposed.

The light emitting device package 200 shown in FIG. 4 omits or briefly describes a configuration overlapping with the light emitting device package 100 shown in FIGS. 1 and 3.

The body 120 may include a first partition wall 122 extending in a first direction (x) and a second partition wall 124 extending in a second direction (z) crossing the first direction (x). .

Here, when cutting in the third direction (y), the body 120 may have a triangular cross-section, and is generated in the first inclined surface (not shown), the second inclined surface (not shown), and the light emitting device 112. It may include a third inclined surface (not shown) for emitting the light.

The body 120 may include first and second lead frames 132 and 134 forming the lower surface of the cavity s, and the first and second lead frames 132 and 134 are made of metal, for example , Titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), phosphorus (P ), one or more of aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge), hafnium (Hf), ruthenium (Ru) and iron (Fe) Or alloys.

In an embodiment, the first and second lead frames 132 and 134 may be formed parallel to each other in the first direction x, unlike the first and second lead frames 32 and 34 shown in FIG. 1.

In addition, the body 120 may include an insulating member 126 that electrically insulates the first and second lead frames 132 and 134, and is the same as the first and second insulating members 26 shown in FIG. 1. It may be formed between the lead frame (132, 134).

The insulating member 126 shown in FIG. 4 may be formed to extend in a different direction from the insulating member 26 shown in FIG. 1, that is, in the first direction x, which is the first and second lead frames 132 and 134. It may vary depending on the arrangement of, but is not limited to this.

In an embodiment, the light emitting element 112 is disposed on the first lead frame 132, and the second lead frame 134 is described as being spaced apart from the first lead frame 132, but is not limited thereto.

In the cavity s formed in the body 120, a resin material 140 capable of covering the light emitting device 112 may be filled.

FIG. 5 is a perspective sectional view of the light emitting device package shown in FIG. 4 cut in the first and third directions (x, y) and FIG. 6 is a perspective view showing the first and second lead frames shown in FIG. 5.

5 and 6, the light emitting device package 200 is spaced apart in a first lead frame 132, a first lead frame 132 and a second direction (z) having a trapezoidal cross section, and has a triangular shape. A cavity s for filling the resin material 140 is formed on the second lead frame 134 having the cross section and the first and second lead frames 132 and 134, and the body 20 having a triangular cross section shape is formed. It can contain.

The body 120 may include a first inclined surface s1, a second inclined surface s2, and a third inclined surface s3 in which light generated from the light emitting element 112 is excited and emitted by the resin material 140. have.

That is, the third inclined surface s3 is disposed between the first and second inclined surfaces s1 and s2, and the third inclined surface s3 may be inclined by the first and second inclined surfaces s1 and s2.

The body 120 forms a first inclination angle θ1 between the first and second inclined surfaces s1 and s2, and a second inclination angle θ2 between the first inclined surface s1 and the light emitting surface s3. A third inclination angle θ3 may be achieved between the two inclined surfaces s2 and the third inclined surface θ3.

In an embodiment, the body 120 may have a triangular cross section by the first and second inclined surfaces s1, s2 and the third inclined surface s3, and the trapezoidal shape in which the third inclined surface s3 is formed to be inclined It may have a cross section, but is not limited thereto.

Here, the first inclination angle θ1 may be 90° to 120°.

That is, when the first inclination angle θ1 is less than 90° or greater than 120°, the bonding stability may be lowered when the body 120 is mounted on a printed circuit board (not shown).

At this time, the second inclination angle θ2 may be 45°, the same as the third inclination angle θ3 when the first inclination angle θ1 is 90°, and the third inclination angle (when the first inclination angle θ1) is 100° The same as θ3), or may be formed at 45° to 50°, and also, when the first inclination angle θ1 is 120°, the second and third inclination angles θ3 and θ4 may be varied according to the directivity angle. And there is no limitation.

The first lead frame 132 shown in FIG. 6 has a trapezoidal cross section, and the second lead frame 134 is adjacent to the first lead frame 132 and may have a triangular cross section.

That is, since the body 120 of the first and second lead frames 132 and 134 has a triangular cross-section, it may be arranged side by side in the second direction z.

In an embodiment, the first leadframe 132 has first, second, third, and fourth faces s111, s112, s113, and s114, and the second leadframe 134 has fifth, sixth, and seventh faces s121 , s122, s123).

The first lead frame 132 is exposed to the first surface s111 exposed to the first inclined surface s1, the second surface s112 exposed to the second inclined surface s2, and the third inclined surface s3 to emit light. The third surface s113 adjacent to the second surface s2 and the fourth surface s114 disposed parallel to the first and third surfaces s111 and s113 and parallel to the third surface s113 and the second surface s112 adjacent to the second surface s2 ).

Here, the first surface s111 is formed to have a smaller size than the first inclined surface s1, and can achieve the second inclined surface s12 and the fourth inclined angle θ4, and the fourth inclined angle θ4 is the aforementioned first It may have the same angle as the inclination angle θ1.

The first surface s111 may form a right angle to the fourth surface s114, which will be described later, but is not limited thereto.

Here, the second surface s112 may be formed to have a smaller size than the second inclined surface s2, and may form a third surface s113 and a sixth inclination angle θ6, and the sixth inclination angle θ6 is described above. One third inclination angle θ3 may have the same angle, but is not limited thereto.

The third surface s113 may form the fourth surface s114 and the seventh inclination angle θ7, and the seventh inclination angle θ7 may be the fourth and sixth inclination angles θ4 and θ6 at 360° and the first and fourth angles It may have an inclination angle minus the inclination angle between the surfaces s111 and s114.

Here, the second lead frame 134 may have a triangular cross-section, a fifth surface s121 exposed to the first inclined surface s1, a sixth surface s122 adjacent to the fourth surface s111, and A seventh surface s123 may be included between the fifth and sixth surfaces s121 and s122.

The fifth surface s121 is exposed to the first surface s1 of the body 120 in the same manner as the first surface s111, and may contact a printed circuit board (not shown).

At this time, the fifth surface s121 may form a right angle to the sixth surface s122. That is, the inclination angle between the fifth surface s121 and the sixth surface s122 may be the same as the inclination angle between the first surface s111 and the fourth surface s114, but is not limited thereto.

However, the sixth surface s122 is arranged to be spaced apart from the fourth surface s114 at a predetermined distance, so that they do not contact each other.

That is, an insulating dam 126 may be formed between the fourth surface s114 and the sixth surface 122, and the first and second lead frames 132 and 134 may be insulated by the insulating dam 126. have.

At this time, the fifth surface s121 may form a fifth inclination angle θ5 with the seventh surface s123, and the fifth inclination angle θ5 may be formed the same as the second inclination angle θ2, and is limited thereto. Do not put

7 is an exploded perspective view showing a display device according to an exemplary embodiment.

Referring to FIG. 7, the display device 1000 according to an exemplary embodiment includes a light guide plate 1041, a light source module 1031 providing light to the light guide plate 1041, a reflective member 1022 under the light guide plate 1041, and a light guide plate ( 1041) may include an optical sheet 1051, a display panel 1061 and a light guide plate 1041, an optical light source module 1031, and a bottom cover 1011 accommodating the reflective member 1022 on the optical sheet 1051. , But is not limited to this.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light and make a surface light source. The light guide plate 1041 is made of a transparent material, for example, acrylic resin series such as PMMA (polymethylmethacrylate), PET (polyethylene terephthalate), PC (poly carbonate), COC (cycloolefin copolymer) and PEN (polyethylene naphtha late) resin It may include one of.

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.

The light source module 1031 includes at least one, and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 1031 includes a substrate 1033 and a light emitting device package 1035 according to the embodiment disclosed above, and the light emitting device package 1035 may be arranged on the substrate 1033 at predetermined intervals.

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB, metal core PCB), a flexible PCB (FPCB, flexible PCB), and the like. When the light emitting device package 1035 is mounted on the side of the bottom cover 1011 or on a heat radiation plate, the substrate 1033 may be removed. Here, a part of the heat dissipation plate may contact the top surface of the bottom cover 1011.

In addition, the plurality of light emitting device packages 1035 may be mounted such that the emission surface on which the light is emitted on the substrate 1033 is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device package 1035 may directly or indirectly provide light to the light incident portion, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflection member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and faces the light upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may receive a light guide plate 1041, a light source module 1031, a reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with an accommodating portion 1012 having a box shape with an open top surface, but is not limited thereto. The bottom cover 1011 may be combined with a top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel and includes first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, and the polarizing plate is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 may be applied to various portable terminals, notebook computer monitors, laptop computer monitors, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041, and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancing sheet. The diffusion sheet diffuses the incident light, the horizontal or/and vertical prism sheet condenses the incident light into the display area, and the luminance enhancement sheet reuses the lost light to improve luminance. In addition, a protective sheet may be disposed on the display panel 1061, but is not limited thereto.

Here, as the optical member on the light path of the light source module 1031, the light guide plate 1041 and the optical sheet 1051 may be included, but is not limited thereto.

8 is a cross-sectional view illustrating a display device according to another exemplary embodiment.

Referring to FIG. 8, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the light emitting devices 1124 disclosed above are arrayed, an optical member 1154, and a display panel 1155.

The substrate 1120 and the light emitting device package 1124 may be defined as a light source module 1160. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include a storage unit 1153, which is not limited thereto. The light source module 1160 includes a substrate 1120 and a plurality of light emitting elements 1124 arranged on the substrate 1120.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancing sheet. The light guide plate may be made of PC material or PMMA (polymethyl methacrylate) material, and the light guide plate may be removed. The diffusion sheet diffuses the incident light, the horizontal and vertical prism sheets converge the incident light into the display area, and the luminance enhancement sheet reuses the lost light to improve luminance.

The optical member 1154 is disposed on the light source module 1160, and performs light diffusion, condensing, or the like, when a light emitted from the light source module 1160 is a surface light source.

9 is an exploded perspective view showing a lighting device according to an embodiment.

Referring to FIG. 9, the lighting device according to the embodiment may include a cover 2100, a light source module 2200, a heat radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. Can be. In addition, the lighting device according to the embodiment may further include any one or more of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device package according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in an empty shape and an open portion. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the radiator 2400. The cover 2100 may have a coupling portion that engages the heat radiator 2400.

A milky white coating may be coated on the inner surface of the cover 2100. The milky white paint may include a diffusion material that diffuses light. The surface roughness of the inner surface of the cover 2100 may be greater than the surface roughness of the outer surface of the cover 2100. This is because light from the light source module 2200 is sufficiently scattered and diffused to be emitted to the outside.

The material of the cover 2100 may be glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate has excellent light resistance, heat resistance, and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the radiator 2400. Thus, heat from the light source module 2200 is conducted to the heat sink 2400. The light source module 2200 may include a light emitting element 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the radiator 2400 and has a plurality of light emitting device packages 2210 and guide grooves 2310 into which the connector 2250 is inserted. The guide groove 2310 corresponds to the board and connector 2250 of the light emitting device package 2210.

The surface of the member 2300 may be coated or coated with a light reflective material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects light that is reflected on the inner surface of the cover 2100 and returns in the direction of the light source module 2200 again in the direction of the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting device according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Accordingly, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block electrical shorts between the connection plate 2230 and the radiator 2400. The radiator 2400 radiates heat by receiving heat from the light source module 2200 and heat from the power supply unit 2600.

The holder 2500 closes the storage groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 accommodated in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may include a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal received from the outside and provides it to the light source module 2200. The power supply unit 2600 is accommodated in the storage groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide part 2630, a base 2650, and a protrusion 2670.

The guide portion 2630 has a shape protruding from the side of the base 2650 to the outside. The guide portion 2630 may be inserted into the holder 2500. A number of parts may be disposed on one surface of the base 2650. For a number of components, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip controlling driving of the light source module 2200, and ESD (ElectroStatic) for protecting the light source module 2200 discharge) protection element and the like, but is not limited thereto.

The protrusion 2670 has a shape protruding from the other side of the base 2650 to the outside. The protrusion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the protrusion 2670 may be provided equal to or smaller than the width of the connection portion 2750 of the inner case 2700. Each end of the "+ wire" and the "- wire" may be electrically connected to the protrusion 2670, and the other end of the "+ wire" and "- wire" may be electrically connected to the socket 2800.

The inner case 2700 may include a molding part together with the power supply part 2600 therein. The molding part is a part in which the molding liquid is hardened, so that the power supply unit 2600 can be fixed inside the inner case 2700.

In the light emitting device package according to the embodiment, the configuration and method of the embodiments described above may not be limitedly applied, and the embodiments may be selectively combined with all or part of each embodiment so that various modifications can be made. It may be configured.

Commonly used terms, such as predefined terms, should be interpreted as being consistent with the meaning in the context of the related art, and are not to be interpreted as ideal or excessively formal meanings unless explicitly defined in the present invention.

All terms, including technical or scientific terms, have the same meaning as generally understood by a person skilled in the art to which the present invention belongs, unless otherwise defined.

The terms "comprise", "compose" or "have" as described above mean that the component can be inherent, unless otherwise stated, and do not exclude other components. It should be interpreted that it may further include other components.

Although preferred embodiments have been illustrated and described above, the present invention is not limited to the specific embodiments described above, and the general knowledge in the technical field to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Of course, various modifications can be made by the vibrator, and these modifications should not be individually understood from the technical spirit or prospect of the present invention.

Claims (10)

Light emitting element;
A first lead frame in which the light emitting device is disposed and a second lead frame spaced apart from the first lead frame, and emitting light from the light emitting device between a first inclined surface, a second inclined surface, and the first and second inclined surfaces A body having a triangular cross section made of a third inclined surface, and having a cavity formed on the first and second lead frames; And
Included in; the resin material filling the cavity, forming the third inclined surface;
The body has a triangular cross-section by the first to third inclined surfaces,
The inclination angle between the first and second inclined surfaces is 90 degrees,
The inclination angle between the first inclined surface and the third inclined surface and the inclined angle between the second inclined surface and the third inclined surface is 45 degrees,
The first and second lead frames have the same cross-sectional shape as the cross-sectional shape of the body,
The first lead frame is exposed to the first and second inclined surfaces,
The second lead frame is exposed to the first and second inclined surfaces,
Each of the first and second lead frames,
A first surface exposed to the first inclined surface; And
It includes; a second surface exposed to the second inclined surface and having an area of 1 to 2 times the area of the first surface.
The first lead frame further includes a third surface connecting the first and second surfaces of the first lead frame and on which the light emitting elements are disposed.
The second lead frame further includes a third surface connecting the first and second surfaces of the second lead frame and parallel to the third surface of the first lead frame,
The inclination angle between the first and third surfaces of each of the first and second lead frames is 45 degrees,
A light emitting device package having a 90 degree inclination angle between the first and second surfaces of each of the first and second lead frames. delete delete delete delete delete delete delete delete delete

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