BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under / under" Quot; on "and" under "as used herein are intended to refer to all that is" directly "or" indirectly " . In addition, the criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.
In the drawings, dimensions are exaggerated, omitted, or schematically illustrated for convenience and clarity of illustration. Also, the size of each component does not entirely reflect the actual size. The same reference numerals denote the same elements throughout the description of the drawings. Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.
2 is a partially enlarged view of the light emitting module of FIG. 1, FIG. 3 is a partially enlarged view of the light incident portion of FIG. 2, and FIG. 4 is a cross- 1 is a side sectional view showing a light emitting element of the light emitting module of Fig.
The light emitting module 10 shown in FIG. 1 includes a light emitting device 100 and an optical member 2 that irradiates the light to the emitting surface 25 by changing the traveling direction of light of the light emitting device 100. The light emitting module 10 may be defined as a lens unit or a light emitting unit, but is not limited thereto.
The light emitting device 100 is a light source and selectively emits light in a wavelength band from ultraviolet to visible light. The light emitting device 100 includes a UV LED chip, a green LED chip, a blue LED chip, and a red LED chip. The light emitting region of the light emitting device 100 may be coated with a phosphor, but the present invention is not limited thereto.
The light emitting device 100 may be implemented as a package in which the light emitting chip is packaged, for example, as shown in FIG. As another example, the light emitting device 100 may be provided in a form in which a chip is mounted on a module substrate, but the present invention is not limited thereto.
4, includes a body 111, a gap portion 115, first and second lead frames 121 and 131, a light emitting chip 141, and a molding member 151.
The body 111 may be formed of a reflector having a reflectivity higher than that of the light emitted by the light emitting chip 141, for example, 70% or more. When the reflectance of the body 111 is 70% or more, the body 111 may be defined as a non-transparent material. The body 111 may be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA). The body 111 may be formed of a thermosetting resin including a silicon-based, epoxy-based, or plastic material, or a material having high heat resistance and high light resistance. The above-mentioned silicon includes a white-based resin having a metal oxide therein. In the body 111, an acid anhydride, an antioxidant, a release agent, a light reflector, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide may be selectively added. . The body 111 may be formed of at least one member selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin comprising triglycidylisocyanurate, hydrogenated bisphenol A diglycidyl ether and the like and an acid comprising hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride and the like DBU (11,8-Diazabicyclo (15,4,0) undecene-7) as an accelerator for epoxy resin and ethylene glycol, titanium oxide pigment and glass fiber as a cocatalyst were added to the epoxy resin, A solid epoxy resin composition that has been cured and B-staged can be used. However, the present invention is not limited thereto.
In addition, a light shielding material or a diffusing agent may be mixed in the body 111 to reduce light transmitted through the body 111. In order to provide the body 111 with a predetermined function, at least one member selected from the group consisting of a diffusing agent, a pigment, a fluorescent substance, a reflective substance, a light shielding substance, a light stabilizer and a lubricant is suitably mixed with the thermosetting resin .
As another example, the body 111 may be formed of a translucent material or a translucent material having a conversion material for converting the wavelength of incident light.
A cathode mark may be formed on the upper side of the body 111. The cathode mark separates the first lead frame 121 or the second lead frame 131 of the light emitting device 100 to prevent confusion about the polarity direction of the first and second lead frames 121 and 131 can do.
A cavity 112 is formed in the body 111, and the cavity 112 has a concave shape with an open top. The cavity 112 may be formed in a circular shape, an elliptical shape, or a polygonal shape when viewed from the device top side, but the present invention is not limited thereto. A plurality of lead frames 121 and 131 are disposed at the bottom of the cavity 112, and the plurality of lead frames 121 and 131 are electrically spaced from each other.
The peripheral surface of the cavity 112 may be curved or angled, and may be inclined with respect to the bottom of the cavity 112.
The plurality of lead frames 121 and 131 may be formed of a metal plate having a predetermined thickness, and another metal layer may be plated on the surface of the metal plate. However, the present invention is not limited thereto. The plurality of lead frames 121 and 131 may be formed of a metal material such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), tantalum (Ta) ), Tin (Sn), silver (Ag), and phosphorus (P). In addition, the first and second lead frames 121 and 131 may have a multi-layer structure, but the present invention is not limited thereto. The thickness of the first and second lead frames 121 and 131 may be 0.3 mm to 1.5 mm, for example, 0.3 mm to 0.8 mm.
The gap part 115 is disposed between the first lead frame 121 and the second lead frame 131 and physically separates the first lead frame 121 and the second lead frame 131 . The gap 114 may be formed of the same material as the body 111 or may be formed of another material.
A light emitting chip 141 is disposed on at least one of the first lead frame 121 and the second lead frame 131 disposed at the bottom of the cavity 112. The light emitting chip 141 may be a red, The LED chip may emit light in a visible light band or an ultraviolet band that emits blue, white, or other light. However, the present invention is not limited thereto. The light emitting chip 141 may include at least one of Group III and Group V semiconductor compounds and Group II and VI semiconductor compounds.
One or more light emitting chips 141 are mounted on the second lead frame 131 and are electrically connected to the second lead frame 121 and connected to the first lead frame 121 Member 143 as shown in FIG. The connecting member 143 includes a wire.
The light emitting chip 141 may be implemented as a horizontal chip in which two electrodes in a chip are arranged in parallel or a vertical chip in which two electrodes in a chip are disposed on opposite sides, but the invention is not limited thereto. The horizontal chip may be connected to at least two wires, and the vertical chip may be connected to at least one wire. Alternatively, the light emitting chip 141 may be mounted in a flip manner, but the invention is not limited thereto.
The lower surfaces of the first and second lead frames 121 and 131 are disposed on the same plane as the lower surface of the body 111 to effectively dissipate the heat generated from the light emitting chip 141 when mounted on the module substrate .
The cavity 112 is formed with a molding member 151 and the molding member 151 may include a transparent resin material such as epoxy or silicone. In addition, a fluorescent substance or a diffusing agent may be optionally added to the molding member 151, but the present invention is not limited thereto. The fluorescent material may include, for example, a YAG-based, a silicate-based, or a TAG-based fluorescent material.
For example, when the light emitting device 100 has the light emitting chip 141 that emits the first color and the phosphor that emits the second color, the color distribution of the light emitted to the upper surface of the molding member 151 is the center region The target light with the first color is emitted from the light L1 in the region close to the peripheral region and the target light with the second color is emitted from the light L2 in the region close to the peripheral region. For example, the first color comprises blue, the second color comprises yellow, and the target light comprises white. For example, the light L1 in the center region is the vertical direction of the light emitting chip 141 and the region adjacent thereto, and bluish-white light is emitted. The light L2 in the peripheral region is emitted from the light- (Yellowish-white) light is emitted rather than blue.
11, the color temperature distribution of the light emitted from the light emitting device 100 shows a color temperature distribution of a predetermined section F1 from an angle of +70 to +74 degrees from an angle of 0 degrees, F2). Such a color temperature difference is represented by a color deviation, and a color deviation is generated from an area of more than +/- 70 degrees from the optical axis Z as a starting point. The range of the color deviation may vary depending on the distribution of the directivity of the light emitting device 100, but is not limited thereto. The embodiment can reduce the color deviation generated according to the directivity angle distribution of the light emitting device 100 on the light emission path.
1 and 2, the color deviation of the center region and the peripheral region of the light emitting device 100 can be improved by the optical member 2 according to the embodiment. That is, the optical member 2 may be defined as an optical lens, a front-reflecting lens, or a side-light-emitting lens, but is not limited thereto.
The light emitting device 100 is disposed below the horizontal extension line of the bottom surface 21 of the optical member 2 or on the bottom surface 21 of the optical member 2, Or may be disposed within the optical member 2. The optical member 2 may be disposed in the optical member 2, for example. The light emitting device 100 is disposed at a predetermined distance Z1 from the bottom surface 21 of the optical member 2 in order to explain the embodiment. Here, the center of the light emitting device 100 may be placed on the optical axis Z, which is the center of the optical member 2. The distance Z1 may be zero or have a value of 0.02 mm or less.
The direction of the optical axis (reference optical axis) Z refers to the traveling direction of light at the center of the three-dimensional outgoing light flux of the light emitted from the light emitting element 100. In FIG. 1, the upward direction from the light emitting device 100 for convenience can be defined as an optical axis (reference optical axis) Z or a normal line. Further, the light emitting element 100 has a rotationally symmetrical shape with the optical axis Z as the center. Further, the light emitting element 100 is not necessarily rotationally symmetrical, and may be a polyhedron-like shape. The optical member (2) changes the direction of light emitted from the light emitting element (100). That is, the optical member 2 is irradiated with the direction of the incident light changed.
The optical member (2) is a member that emits light around the optical axis (Z). The optical member 2 is a member for changing the direction of light emitted from the light emitting device 100 and is not particularly limited, but preferably a transparent material having a refractive index of 1.4 or more and 1.7 or less can be used. More preferably, it may be formed of a transparent resin material of transparent resin such as polymethyl methacrylate (PMMA) having a refractive index of 1.49, a polycarbonate (PC) having a refractive index of 1.59, an epoxy resin (EP) It is.
The optical member 2 includes a bottom surface 21, a light incident portion 22, an outgoing surface 25 as an outer surface, and a concave portion 26. The bottom surface 21 intersects with the optical axis Z in a vertical direction. The bottom surface 21 may be formed in a substantially horizontal planar shape, and light may be incident on a partial area. The bottom surface 21 may have a roughness or concave-convex pattern, but the present invention is not limited thereto.
The light incident portion 22 is a region recessed upward in the direction of the optical axis Z from the bottom surface 21 in the center region of the bottom surface 21 and corresponds to the light emitting device 100. The light incident portion 22 has a width D2 that is wider than the width D4 of the light emitting device 100 and a width D2 that is 1.5 times or more the width D4 of the light emitting device 100 . The width D2 of the light-incident portion 22 may be in the range of 2.3 to 2.5 mm and the depth may be at least three times the thickness T2 of the light emitting device 100, for example, 3.7 to 3.9 mm . ≪ / RTI > Here, the thickness T2 of the light emitting device 100 may be less than or equal to 1 mm.
The light incident portion 22 is formed to be wider than the width D4 of the light emitting device 100 so that the light emitted to the light emitting region of the light emitting device 100 can be effectively incident. When viewed from the bottom, the light-incident portion 22 may have a circular or polygonal shape, but the present invention is not limited thereto.
The light incident portion 22 includes a first incident region 23 and a second incident region 24 along the incidence region and the first incidence region 23 is formed at the highest point of the light incidence portion 22, The surface of the region includes a shape having a curved surface, such as a hemispherical shape. The first incident region 23 corresponds to the light emitting device 100. The second incidence region 24 is an area or section between the bottom surface 21 and the first incidence region 23 and is a region closer to the bottom surface 21 than the highest point of the light- Lt; / RTI >
The second incident region 24 has a transmittance lower than the transmittance of the first incident region 23 and the second incident region 24 has a transmittance lower than that of the first incident region 23, And may have a light transmittance lower than 1%. The light transmittance of the first incident region 23 may be greater than 98% and the light transmittance of the second incident region 24 may be in a range of 92% to 97%. Due to the difference in light transmittance, the optical member 2 can compensate for the color deviation generated from the light emitting device 100.
The second incident region 24 may have a surface roughness of the first incident region 23 higher than a surface roughness of the second incident region 24. That is, the second incident region 24 may have a rougher surface than the surface of the first incident region 23. Due to the difference in surface roughness, the optical member 2 can compensate for the color deviation generated from the light emitting device 100.
The second incident region 24 includes a plurality of protrusions 4 protruding in the direction of the optical axis Z, and the first incident region 23 may be formed as a surface without protrusions. The plurality of protrusions 4 can compensate for the color deviation generated from the light emitting device 100. The projections 4 can be defined as a diffusion pattern, and diffuse the incident light.
The second incident region 24 may be a region corresponding to an optical axis Z that is the center of the optical member 2 and the light emitting device 100 and corresponding to a first angle? The first incidence region 23 may be an area corresponding to an angle less than the first angle? 1 with respect to the optical axis Z. [ Here, the first angle? 1 includes a range of 70 to 74 degrees. 11, the chromatic aberration in which the color temperature difference of the light emitted from the light emitting device 100 is generated is smaller than the color deviation in the light incident portion 22 of the optical member 2 by the first incident region 23 and the second incident region 24).
The second incident region 24 is disposed in a region spaced apart from the bottom surface 21 by a predetermined distance D1 and may be formed in an area less than 1/2 of the depth D1 of the light- have.
The second incident region 24 may be formed by a corrosion process, a metal mold in a manufacturing process, or an electrical discharge, but the invention is not limited thereto.
The outgoing surface 25 of the optical member 2 is formed into a curved surface whose cross-sectional shape has a predetermined curvature so as to diffuse the light incident into the optical member 2, It will come out.
The concave portion 26 may include one or more than two total reflection surfaces, and the sectional shape of the total reflection surface may be an inclined surface or a curved surface, but is not limited thereto.
The cross-sectional shape of the concave portion 26 may be formed in a concave shape such as a cup or a container shape in the direction of the light emitting device 100 with the optical axis Z as a center. The center of the concave portion 26 has the same center as the optical axis Z and the depth D5 thereof is formed to have a depth gradually deeper toward the optical axis Z. [ The depth D5 of the concave portion 26 may be less than the depth D1 of the light incident portion 22 and may be less than 1/2 of the depth D1 of the light entering portion 22 .
The width D6 of the concave portion 26 may be greater than the width D2 of the light-incident portion 22 as a distance between a boundary point with the light exit surface 25 or an inflection point, I do not.
A reflective member (not shown) may be formed on the concave portion 26. The reflection member may be mixed with at least one of a metal oxide and a metal nitride in the resin material, and the embodiment will be described as an example in which a metal oxide is added. The resin material includes a material such as silicone or epoxy. The resin material may be selected from the group consisting of polyacrylate resin, epoxy resin, phenolic resin, polyamide resin, polyimides rein, unsaturated polyesters resin, polyphenylene ether resin (PPE), polyphenylene oxide resin (PPO), polyphenylenesulfides resin, cyanate ester resin, benzocyclobutene ), Polyamido-amine Dendrimers (PAMAM), and Polypropylene-imine, Dendrimers (PPI), and PAMAM-OS (organosilicon) with PAMAM internal and organic-silicone outer surfaces alone or combinations thereof have. The metal oxide may be formed in the reflective member in a range of 5 wt% or more, for example, 30 to 80 wt%. The metal oxide may have at least one of TiO 2 , SiO 2 and Al 2 O 3 as a material having a refractive index higher than that of the optical member 2. Accordingly, the refractive index of the reflective member is higher than the refractive index of the optical member 2, and may have a refractive index of 1.7 or more, for example. The reflecting member may be formed of a ceramic material such as SiO 2 , Si x O y , Si 3 N 4 , Si x N y , SiO x N y , Al 2 O 3 , BN, Si 3 N 4 , SiC ), A ceramic such as BeO, CeO, AlN, or the like.
The reflecting member disposed in the concave portion 26 may be defined as a high refraction layer higher than the refractive index of the optical member 2 or a reflecting layer. The phase reflection member may be a layer having a light reflection efficiency of 70% or more, for example, 85% or more, and is not limited thereto. The reflection member may have a difference in refractive index from the optical member 2 by 0.1 or more, for example, 0.3 or more.
The optical member 2 may have a sidewall portion 27 around the exit surface 25 and the bottom surface 21 and the sidewall portion 27 may be curved A stepped structure can be formed. The side wall part 27 functions as a supporting part, and the height of the side wall part 27 may be lower than the depth D1 of the light- That is, the height of the sidewall portion 27 may be lower than the depth D1 of the light-incident portion 22 for the light extraction efficiency to the exit surface 25. [ The distance D7 between the light-entering portion 22 and the concave portion 26 may be narrower than the depth D1 of the light-entering portion 22. The depth D1 of the light-incident portion 22 may be equal to or greater than a half of the thickness T1 of the optical member 2, The light ratio can be lowered.
2, an optical axis Z perpendicular to the light emitting chip 141 of the light emitting device 100 and a boundary between the first and second incident regions 23 and 24 from the light emitting chip 141 are defined as The first angle [theta] 1 between the connected line segments P1 may be a value smaller than 70 to 74 degrees. That is, the size of the second incident region 24 may vary depending on the position of the light emitting chip 141.
Referring to FIG. 3, the protrusions 4 protruding from the second incident region 24 of the light-incident portion 22 may be regularly or irregularly arranged. The interval B1 between the projections 4 may be in the range of 0.1 占 퐉 or more, for example, in the range of 0.1 占 퐉 to 500 占 퐉, but is not limited thereto. A line segment X1 passing through the center of the protrusion 4 protruding from the second incident region 24 may be formed in a range of an acute angle? 11 with respect to the optical axis Z. The height B2 of the protrusion 4 projecting to the second incident region 24 may be in the range of 0.1 탆 or more, for example, 0.1 탆 to 100 탆, but is not limited thereto.
The size of the protrusion 4 may vary depending on the size of the optical member 2 and the light emitting device 100, but is not limited thereto.
5 is a side sectional view showing a light emitting module according to the second embodiment. In describing the second embodiment, the same parts as those of the first embodiment will be described with reference to the first embodiment.
5, the light emitting module 11 includes a light emitting device 100, a module substrate 105 on which the light emitting device 100 is mounted, a light emitting device 100 disposed on the module substrate 105, And an optical member (2).
The module substrate 105 includes at least one of a printed circuit board (PCB), a ceramic substrate, a flexible PCB (FPCB), and a metal PCB (e.g., metal core PCB) The present invention is not limited thereto.
The light emitting device 100 is disposed on the module substrate 105, and the light emitting device 100 may be packaged as shown in FIG. 4. However, the present invention is not limited thereto. Also, the light emitting device 100 and the optical member 2 correspond one to one, and one or a plurality of the light emitting device 100 and the optical member 2 may be arranged on the module substrate 105, but the present invention is not limited thereto.
The optical member 2 includes a bottom surface 21, a light incident portion 22, an exit surface 25, a concave portion 26, and a coupling protrusion 28. The concave and convex pattern 21A includes a concave and convex pattern 21A disposed on the bottom surface 21 in the downward direction, that is, in the direction of the top surface of the module substrate 105, Reflect to be re-incident. In addition, the bottom surface 21 having the concavo-convex pattern 21A reflects light traveling in the optical member 2 to the bottom surface 21. The light-incident portion 22, the exit surface 25 and the concave portion 26 will be referred to the structure of FIG. The convex portion 21A may have a width larger than the width of the protrusion 4 and may have a circular or polygonal shape.
The area of the bottom surface 21 where the concavo-convex pattern 21A is formed may correspond to the light exit surface 25 and may be a region adjacent to the side wall portion 27, May not be formed.
The optical member 2 is provided with a coupling protrusion 28 and a plurality of the coupling protrusions 28 are arranged on the bottom surface 21 so as to be spaced apart from each other. For example, three or more engaging projections 28 may be spaced apart from each other by a predetermined angle, but the invention is not limited thereto.
The optical member 2 may be spaced apart from the module substrate 105 at a predetermined interval. The engaging projection 28 protrudes from the optical member 2 and includes a columnar shape. The coupling protrusion 28 may be coupled to the module substrate 105. For example, the coupling protrusions 28 may be coupled to the module substrate 105 using an adhesive, or holes may be formed in the module substrate 105 to couple the coupling protrusions 28 together. The coupling protrusions 28 serve to support the optical member 2 to the module substrate 105.
A reflective layer for reflecting light leaked from the optical member 2 may be further formed on the module substrate 105, and the reflective layer may include a solder resist.
6 is a side sectional view showing a light emitting module according to a third embodiment. In describing the third embodiment, the same portions as those of the first embodiment will be described with reference to the description of the first embodiment.
Referring to Fig. 6, the light emitting module 12 may be contacted to the bottom surface 21 of the optical member 2 on the module substrate 105. Fig. The light emitting device 100 mounted on the module substrate 105 can be disposed in the light incident portion 22 of the optical member 2 and the light incident portion 22 of the optical member 2 Thereby changing the direction of the light emitted from the light emitting element 100.
The light incident portion 22 may have a smaller first light incident region 23 than the first light incident region 23 within a range of the first angle? 1 with respect to the optical axis Z perpendicular to the light emitting device 100. This is because the light emitting element 100 is disposed in the light incident portion 22, so that the first incident light region 23 can be reduced by the movement distance. The line segment P1 passing through the boundary between the first incident area 23 and the second incident area 24 of the light incident part 22 is separated from the light emitting element 100 from the optical axis Z 1 &thetas; 1.
7 is a view illustrating an example in which the incident area for each region is changed according to the position of the light emitting device in the light emitting module according to the embodiment.
7, the light emitting device 100 includes a first position R1, a second position R2, a third position R3, and a third position R3 with respect to the optical axis Z, which is the center of the light-incident portion 22 of the optical member 2, (R3). The second incidence portion 22 of the light incidence portion 22 is positioned at the first position R1, the second position R2 and the third position R3 of the light emitting device 100, The height of the region 24 can be gradually increased to D3, D31, and D32. Here, even if the position of the light emitting device 100 is changed to R1, R2, and R3, the first angle? 1 may be formed at the same angle. The first position R1 of the light emitting device 100 is spaced apart from the light incident portion 22 and the second position R2 is a part of the light emitting device 100 in the light incident portion 22, The light emitting device 100 is disposed in the light-incident portion 22 at the third position R3. Therefore, the ratio of the second incident region 24 in the light-incident portion 22 to the peak of the light-incident portion 22 may be larger as the position of the light-emitting element 100 is closer to the peak of the light-incident portion 22.
8 is a side sectional view showing a light emitting module according to a fourth embodiment. In describing the fourth embodiment, the same parts as those of the first embodiment will be described with reference to the description of the first embodiment.
8, the light emitting module 13 includes a light emitting element 101 and an optical member 3. [
The light emitting element 101 is disposed below the light incoming portion 32 of the optical member 3. Here, the directivity angle distribution of the light emitting device 100 may range from 150 degrees to 170 degrees. When the directivity angle distribution of the light emitting device 100 is widened, the first incidence region 33 and the second incident region 34 may be formed at a predetermined angle? 3. Here, the angle range that the second incident region 24 of the optical member 3 can cover may be in the range of 10 to 15 degrees with respect to the bottom surface 31. [ The angle? 3 may range from 75 to 80 degrees.
The optical member 3 includes a bottom surface 31, an engaging projection 38 projecting from the bottom surface 31, an exit surface 35, a concave portion 36, and a side wall portion 37. This configuration will be described with reference to the description of the embodiments disclosed above.
9 is a side sectional view showing a light emitting module according to a fifth embodiment. In describing the fifth embodiment, the same portions as those of the first embodiment will be described with reference to the description of the first embodiment.
9, the light emitting module 15 includes a light emitting device 100 and an optical member 5 having a light incident portion 52 on the light emitting device 100. [
The light-incident portion 52 includes a first incident region 53 and a second incident region 54 having a plurality of protrusions 4 under the first incident region 53. The first incident area 53 and the second incident area 54 are formed of discontinuous or continuous surfaces. For example, the second incident area 54 may have a stepped structure from the first incident area 53, (53A). The maximum width of the second incident region 54 may be greater than the maximum width of the first incident region 53.
When the second incident region 54 has the stepped structure 54A, the plurality of projections 4 project in the optical axis Z direction. The second incidence region 54 reflects, scatters, and refracts the incident light, thereby reducing the color deviation from the light incident on the first incidence region 53. The angle? 5 from the optical axis Z to the second incident region 54 starting from the light emitting element 100 may be 70 to 74 degrees or less and is not limited thereto.
The concave portion 56A of the optical member 5 may be formed with a concave and convex pattern 56A and the convex and concave pattern 56A protrudes from the concave portion 56 and changes the direction of the transmitted light.
10 is a side sectional view showing a light emitting module according to a sixth embodiment. In describing the sixth embodiment, the same portions as those of the first embodiment will be described with reference to the description of the first embodiment.
10, the light emitting module 16 includes a module substrate 107, a light emitting device 161 mounted on the module substrate 107, a reflector 163 disposed around the light emitting device 161, A translucent resin layer 165 disposed in the open region 164 of the reflector 163 and an optical member 6 having a light incident portion 62 for changing the direction of light emitted from the light emitting element 161 do.
The module substrate 107 may be in contact with or spaced from the bottom surface 21 of the optical member 2, but is not limited thereto.
A light emitting element 161 is disposed on the module substrate 107 and the light emitting element 161 corresponds to the light incident portion 62 of the optical member 2 or at least a part of the light emitting element 161 is disposed in the light entering portion 62 . The position of the light emitting device 161 may be changed according to the position of the module substrate 107, but the present invention is not limited thereto.
The light emitting device 161 may be connected to a circuit pattern on the module substrate 107 by a connecting member 162 and the connecting member 162 may include a wire. The light emitting device 161 may be an LED chip, and may be, for example, at least one LED chip emitting blue, green, and red colors. The light emitting device 161 will be described as a blue LED chip.
A reflector 163 may be disposed around the light emitting device 161 and the reflector 163 may be formed in a dam structure that covers the light emitting device 161 in a ring shape along the periphery of the light emitting device 161. The reflector 163 may be made of the same material as the solder resist, a resin material to which a metal oxide is added in epoxy or silicon, or a metal such as aluminum or silver.
The reflector 163 has an open region 164 therein and a light transmitting resin layer 165 is formed in the open region 164. The inner wall of the reflector 163 corresponds to the light emitting device 161 and may be disposed at an angle with respect to the upper surface of the module substrate 107 or the bottom surface 61 of the optical member 2 .
The light transmitting resin layer 165 includes a fluorescent material therein, and the fluorescent material includes at least one of red, green, yellow, and blue fluorescent materials. The transparent resin layer 165 may be formed in a hemispherical shape, a flat shape, or a concave shape on the upper surface, but is not limited thereto.
As another example, the reflector 163 may be formed of a semi-transparent material, and the semi-transparent material may be a material having a higher reflectivity than the transmissivity. The reflector 163 may correspond to the second incident region 24 in the light entering portion 62 or may be disposed below the light entering portion 62.
The directivity angle distribution of the light emitted from the light emitting device 161 may be formed in the range of 70 to 85 degrees with respect to the optical axis within a predetermined angle? 4 range by the reflector 163.
The light emitted from the light emitting device 161 is emitted through the light transmitting resin layer 165 and the light incident portion 62 of the optical member 2 is incident on the first incident region 23 and the second incident region 24 compensates for the color deviation of the light emitted from the light emitting element 161. For example, when the light incident on the second incident region 24 is yellowish white light, the color difference with the light emitted to the first incident region 23 can be improved by controlling the critical angle of light.
The optical member 6 includes a bottom surface 61, an exit surface 65, a concave portion 66, and a side wall portion 67. This configuration will be described with reference to the description of the embodiments disclosed above.
<Lighting system>
The light emitting device according to the embodiment can be applied to an illumination system. The lighting system includes a structure in which a plurality of light emitting elements are arrayed and includes a display device shown in Figs. 12 and 13, a lighting device shown in Fig. 14, and may include an illumination lamp, a traffic light, a vehicle headlight, have.
12 is an exploded perspective view of a display device having a light emitting device according to an embodiment.
12, a display device 1000 according to an embodiment includes a light guide plate 1041, a light source module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041 and a display panel 1061 on the optical sheet 1051 and the light guide plate 1041 and the light source module 1031 and the reflection member 1022 But is not limited to, a bottom cover 1011.
The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.
The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >
The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device.
The light source module 1031 may include at least one light source in the bottom cover 1011, and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 1031 includes a support member 1033 and a light emitting device 1035 or a light emitting module according to the above-described embodiment (s), and the light emitting device 1035 is mounted on the support member 1033 And can be arrayed at predetermined intervals. The support member 1033 may be a substrate or a heat dissipation plate, but is not limited thereto.
The substrate may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate may include not only a general PCB but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like, but the present invention is not limited thereto. The light emitting device 1035 may be mounted on the side surface of the bottom cover 1011 or on the heat dissipation plate. Here, a part of the heat radiating plate may be in contact with the upper surface of the bottom cover 1011.
The plurality of light emitting devices 1035 may be mounted on the support member 1033 such that the light emitting surface of the plurality of light emitting devices 1035 is spaced apart from the light guiding plate 1041 by a predetermined distance. The light emitting device 1035 may directly or indirectly provide light to the light-incident portion 52, which is one surface of the light guide plate 1041, but is not limited thereto.
The reflective member 1022 may be disposed under the light guide plate 1041. The reflection member 1022 reflects the light incident on the lower surface of the light guide plate 1041 so as to face upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.
The bottom cover 1011 may house the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.
The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.
The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. Such a display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.
The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet condenses incident light into a display area. The brightness enhancing sheet improves the brightness by reusing the lost light. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.
Here, the optical path of the light source module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical sheet member, but the present invention is not limited thereto.
13 is a view showing a display device having a light emitting element according to an embodiment.
13, the display device 1100 includes a bottom cover 1152, a support member 1120 with an array of light emitting elements 1124 disclosed in the above embodiment (s), an optical sheet member 1154, Panel 1155 as shown in FIG.
The support member 1120 and the light emitting device 1124 may be defined as a light source module 1060. The bottom cover 1152, at least one light source module 1060, and the optical sheet member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto. The light source module 1060 includes a support member 1120 and a plurality of light emitting devices 1124 arranged on the support member 1120.
Here, the optical sheet member 1154 may include at least one of a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of PC material or PMMA (poly methyl methacrylate), and the light guide plate may be removed. The diffusion sheet diffuses incident light, and the horizontal and vertical prism sheets condense incident light into a display area. The brightness enhancing sheet enhances brightness by reusing the lost light.
The optical sheet member 1154 is disposed on the light source module 1060 and performs surface light source, diffusion, and light condensation on the light emitted from the light source module 1060.
14 is an exploded perspective view of a lighting device having a lighting device according to an embodiment.
14, the lighting apparatus according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, and a socket 2800 . Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting module according to an embodiment of the present invention.
For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical supporting member. The cover 2100 may be coupled to the heat discharging body 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.
The inner surface of the cover 2100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is for sufficiently diffusing and diffusing the light from the light source module 2200 and emitting it to the outside.
The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.
The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light emitting device 2210, a connection plate 2230, and a connector 2250.
The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 into which a plurality of illumination elements 2210 and a connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the illumination device 2210 and the connector 2250.
The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.
The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.
The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.
The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.
The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.
The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components include, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protective device, and the like, but the present invention is not limited thereto.
The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension portion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. One end of each of the positive wire and the negative wire is electrically connected to the extension portion 2670 and the other end of the positive wire and the negative wire are electrically connected to the socket 2800 .
The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.
The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
