KR102029795B1 - Light emitting device and lighting systme having thereof - Google Patents

Abstract

The embodiment relates to a light emitting device.
The light emitting device according to the embodiment, the body having a cavity; First and second lead frames spaced apart from each other in the cavity; A gap portion disposed between the first and second lead frames; A light emitting chip disposed on at least one of the first lead frame and the second lead frame; A molding member disposed in the cavity; And a protective layer disposed along an interface between the sidewall of the cavity and the molding member and bonded to the molding member and the body.

Description

LIGHT EMITTING DEVICE AND LIGHTING SYSTME HAVING THEREOF}

Embodiments relate to a light emitting device and a lighting system having the same.

Light emitting diodes (LEDs) are a type of semiconductor device that converts electrical energy into light. Light emitting diodes have the advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent and incandescent lamps. Accordingly, many researches are being conducted to replace existing light sources with light emitting diodes, and the use of light emitting diodes is increasing as a light source for lighting devices such as various lamps, liquid crystal displays, electronic displays, and street lamps that are used indoors and outdoors.

The embodiment provides a light emitting device having a protective layer covering an interface between a body and a molding member.

The embodiment provides a light emitting device having a protective layer covering the entire surface of the body and the molding member.

The embodiment provides a light emitting device having a protective layer having an open area of a width narrower than the width of the upper surface of the molding member.

The light emitting device according to the embodiment, the body having a cavity; First and second lead frames spaced apart from each other in the cavity; A gap portion disposed between the first and second lead frames; A light emitting chip disposed on at least one of the first lead frame and the second lead frame; A molding member disposed in the cavity; And a protective layer disposed along an interface between the sidewall of the cavity and the molding member and bonded to the molding member and the body.

Embodiments can prevent moisture from penetrating into the interface between the molding member and the body.

The embodiment can provide a light emitting device resistant to moisture.

The embodiment can improve the electrical reliability of the light emitting device.

The embodiment can improve the reliability of the light emitting device and the lighting system having the same.

1 is a side cross-sectional view of a light emitting device according to the first embodiment.
FIG. 2 is a diagram illustrating another example of the protective layer of the light emitting device of FIG. 1.
3 is a side cross-sectional view of a light emitting device according to a second embodiment.
4 is a plan view of the light emitting device of FIG. 3.
5 is a side cross-sectional view of a light emitting device according to a third embodiment.
6 is a side cross-sectional view of a light emitting device according to a fourth embodiment.
7 is a side cross-sectional view of a light emitting device according to a fifth embodiment.
8 is a side cross-sectional view of a light emitting device according to a sixth embodiment.
9 is a side cross-sectional view of a light emitting device according to a seventh embodiment.
10 is a side cross-sectional view of a light emitting device according to an eighth embodiment.
11 is a perspective view illustrating an example of a display device according to an exemplary embodiment.
12 is a perspective view illustrating another example of a display device according to an exemplary embodiment.
13 is a view showing a lighting apparatus according to an embodiment.

In the description of the embodiments, each layer, region, pattern, or structure is “on” or “under” the substrate, each layer, layer, pad, or pattern. In the case of being described as being formed "in", "on" and "under" are both formed "directly" or "indirectly" through another layer. Include. In addition, the criteria for the top / bottom or bottom / bottom of each layer or each structure will be described with reference to the drawings. In the drawings, the thickness or size of each layer or each structure is exaggerated, omitted, or schematically illustrated for convenience and clarity of description. In addition, the size of each component does not necessarily reflect the actual size.

Hereinafter, a light emitting device according to a first embodiment will be described with reference to the accompanying drawings.

1 is a side cross-sectional view of a light emitting device according to an embodiment.

Referring to FIG. 1, the light emitting device 1 includes a body 11 having a cavity 12, a protective layer 31, a light emitting chip 15, and a molding member 17, a first and a second lead frame ( 21,23).

The body 11 may be formed of a material having a reflectance higher than the transmittance, for example, a 70% or more reflectance with respect to a wavelength emitted by the light emitting chip 15. The body 11 may be defined as a non-transparent material when the reflectance is 70% or more. The body 11 may be formed of a resin-based insulating material, for example, a resin material such as polyphthalamide (PPA). The body 11 may be formed of a silicone-based, epoxy-based, or a thermosetting resin including a plastic material, or a high heat resistant and high light resistant material. The silicone includes a white series resin. In addition, the body 11 may be selectively added among an acid anhydride, an antioxidant, a release material, a light reflector, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide. It contains. The body 11 may be molded by at least one selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin composed of triglycidyl isocyanurate, hydrogenated bisphenol A diglycidyl ether, or the like, an acid composed of hexahydro phthalic anhydride, 3-methylhexahydro phthalic anhydride 4-methylhexahydrophthalic anhydride, or the like. The anhydride was added to the epoxy resin by adding DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator, ethylene glycol, titanium oxide pigment and glass fiber as a promoter, and partially by heating. The solid epoxy resin composition hardened by reaction and B staged can be used, It does not limit to this.

In addition, it is possible to reduce the light transmitted by mixing the light-shielding material or the diffusion agent in the body (11). In addition, the body 11 is appropriately mixed with at least one selected from the group consisting of a diffusing agent, a pigment, a fluorescent material, a reflective material, a light-shielding material, a light stabilizer, a lubricant in a thermosetting resin in order to have a predetermined function. You may also do it.

The body 11 may be a metal oxide added to a resin material such as epoxy or silicon, the metal oxide includes at least one of TiO ₂ , SiO ₂ , Al ₂ O ₃ , 3wt in the body 11 It may be added in a ratio of more than%. Accordingly, the body 11 can effectively reflect the incident light. Here, when the content of the metal oxide added in the body 11 is 3wt% or less, the reflection efficiency may decrease, and when the reflection efficiency decreases, the light directivity angle distribution may vary.

As another example, the body 11 may be formed of a transparent resin material or a resin material having a phosphor for converting a wavelength of incident light.

A cathode mark may be formed on the upper side of the body 11. The cathode mark distinguishes the first lead frame 21 or the second lead frame 23 of the light emitting device 1, and confusion about the direction of the polarity of the first and second lead frames 21 and 23. Can be prevented.

A cavity 12 is formed in the body 11, and the cavity 12 may be formed in a concave shape or a cup shape recessed from the upper surface 14. The cavity 12 may be formed in a circular shape, an elliptic shape, and a polygonal shape when viewed from the top of the device, but is not limited thereto. The circumferential sidewall 2 of the cavity 12 may be formed into a curved or / and angled surface, and may be inclined or perpendicular to the bottom of the cavity 12.

First and second lead frames 21 and 23 are disposed at the bottom of the cavity 12, and a gap 13 is disposed between the first and second lead frames 21 and 23. The first lead frame 21 extends below the first outer surface 3 of the body 11 from the gap 13. The second lead frame 23 extends from the gap portion 13 below the second outer surface 4 of the body 11. The first and second outer surfaces 3 and 4 may be opposite to each other.

Since the first lead frame 21 and the second lead frame 23 are disposed at the bottom of the cavity 12, the first and second lead frames 21 and 23 are formed at the bottom of the cavity 12. It may be formed into a structure disposed below the extension line. Although the first and second lead frames 21 and 23 have been described as examples formed in a flat frame shape, the first and second lead frames 21 and 23 may be formed as a frame having a concave cup shape or a frame having a bent structure, but are not limited thereto. .

The first and second lead frames 21 and 23 may be formed of a metal plate having a predetermined thickness, and another metal layer may be plated on the surface of the metal plate, but is not limited thereto. The first and second lead frames 21 and 23 are made of metal, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum (Ta). ), Platinum (Pt), tin (Sn), silver (Ag), and may include at least one of phosphorus (P). In addition, the first and second lead frames 21 and 23 may be formed to have a multilayer structure, but the present invention is not limited thereto. The thicknesses of the first and second lead frames 21 and 23 may be 0.25 mm to 1.5 mm, for example, 0.3 mm to 0.8 mm.

The gap portion 13 physically separates the first lead frame 21 and the second lead frame 23. The gap portion 13 may be formed of the same material as the body 11. The lower surface of the body 11, the lower surface of the gap 13, and the lower surface of the first and second lead frames 21 and 23 may be disposed on the same plane, but are not limited thereto.

The light emitting chip 15 is disposed on at least one of the first lead frame 21 and the second lead frame 23 disposed on the bottom of the cavity 12, and the light emitting chip 15 is red, green, It may be implemented as a diode emitting a visible light band or an ultraviolet (Ultra Violet) band that emits light such as blue and white, but is not limited thereto.

As illustrated, the light emitting chip 15 is mounted on the second lead frame 23, electrically connected to the second lead frame 23, and the first lead frame 21 and the connection member 16. Leads to. The connecting member 16 comprises a wire.

The light emitting chip 15 may be implemented as a horizontal chip in which two electrodes in a chip are disposed in parallel, or a vertical chip in which two electrodes in a chip are disposed on opposite sides of the chip, but is not limited thereto. The horizontal chip may be connected to at least two wires, and the vertical chip may be connected to at least one wire. Alternatively, the light emitting chip 15 may be mounted in a flip method, but is not limited thereto.

A molding member 17 is formed in the cavity 12, and the molding member 17 may include a transparent resin material such as epoxy or silicon. In addition, a phosphor or / and a diffusing agent may be selectively added to the molding member 17, but is not limited thereto. The phosphor may include, for example, a YAG-based, silicate-based, or TAG-based fluorescent material. An optical lens may be formed on the molding member 17, and the optical lens may include a lens having a concave lens shape, a convex lens shape, a certain part concave, and another part convex.

A protective layer 31 is disposed on an upper surface 14 of the molding member 17 and an upper surface 14 of the body 11, and the protective layer 31 may be defined as a transparent adhesive layer, and the molding member 17 may be formed. It is bonded to the upper surface and the upper surface 14 of the body (11).

The width D1 of the protective layer 31 is the same width as the gap between the first and second outer surfaces 3 and 4 of the body 11, or the width D2 of the upper surface of the molding member 17. Rather, it may be formed to have a wider width, and the protective layer 31 covers the entire upper surface of the light emitting device 1.

The protective layer 31 is a material having a lower viscosity than a silicon material, and may be formed of a compound of an epoxy resin or a silicone resin and a curing agent in a main material such as a silicon oxide film. The protective layer 31 may be formed of an inorganic material.

The protective layer 31 may have a thickness of 20 μm ± 5 μm, and its refractive index may be 1.5 or less, for example, 1.42 ± 0.05. The thickness of the protective layer 31 may be provided in the form of a film having a uniform thickness, but is not limited thereto.

As another example, the protective layer 31 includes at least one of an acrylate group or a methacrylate group, or an acrylate group and a methacrylate group, which are bonded by an ethylenically unsaturated group bonded by a urethane group, particularly a urethane group. do.

In addition, the protective layer 31 may be a hydroxylated material based on an amino group, such as 2,4-bis [N-butyl-N- (1-cyclohexyloxy-2,2,6,6-tetramethyl). Piperidin-4-yl) amino] -6- (2-hydroxyethylamino) -1,3,5-triazine (Tinuvin 152 light stabilizer commercially available from Ciba Specialty Chemicals), bis (1,2 , 2,6,6-pentamethyl-4-piperidinyl) -2-butyl-2- (4-hydroxy-3,5-di-tert-butylbenzyl) propanediate (commercially available from Ciba Specialty Chemicals Tinuvin 144 light stabilizer, available as Purifying agent).

The protective layer 31 is a light-transmitting material, and has a property equal to or lower than the refractive index of the molding member 17, and thus hardly affects the light L1 emitted from the molding member 17. In addition, the protective layer 31 is a translucent material, and may serve to diffuse and emit emitted light.

The protective layer 31 is adhered to the upper surface 14 of the body 11 and the upper surface of the molding member 17, so that the boundary surface of the side wall 2 of the cavity 12 and the molding member 17. It will prevent the penetration of moisture through the (18).

FIG. 2 is another example of the protective layer of FIG. 1. The same parts as in FIG. 1 will be referred to the description of FIG. 1.

Referring to FIG. 2, the protective layer 32 may have an inner portion 34 and an outer portion 33 having different thicknesses. For example, the thickness T1 of the outer side portion 33 of the protective layer 32 may be formed to be thicker than the thickness T2 of the inner side portion 32. For example, the thickness T1 of the outer side portion 33 may be the inner side portion 32. It may be formed more than 1.5 times thicker than the thickness (T2).

The outer portion 33 of the protective layer 32 is an area corresponding to the upper surface 14 of the body 11, and the inner portion 34 is an area corresponding to the upper surface of the molding member 17. By forming the outer side portion 33 of the protective layer 32 thicker than the inner side portion 34, it is possible to prevent the outer side portion 33 of the protective layer 32 from being broken, and the upper surface 14 of the body 11. Moisture permeation that penetrates through) can be suppressed, and the amount of light emitted through the outer portion 33 can be increased. In addition, the outer side portion 33 of the protective layer 32 may have a hemispherical shape or a polygonal side cross section, but is not limited thereto.

Since the outer portion 33 of the protective layer 32 is disposed to protrude relative to the inner portion 34, the outer portion 33 may be in contact with an optical member such as a light guide plate, and thus an impact applied to the light emitting element by thermal expansion of the light guide plate. Can alleviate The inner part 34 of the protective layer 32 is non-contacted with an optical member such as the light guide plate, thereby preventing the luminance from changing.

3 is a side cross-sectional view of the light emitting device according to the second embodiment, and FIG. 4 is a plan view of the light emitting device of FIG. 3. In describing the second embodiment, the same parts as the first embodiment will be referred to the first embodiment.

3 and 4, in the light emitting device, a protective layer 41 is adhered around an upper surface of the molding member 17, and the protective layer 41 has an open area 41A, and the open area ( 41A) corresponds to the top surface of the molding member 17.

The protective layer 41 is formed in a loop shape or a frame shape along the side wall 2 of the cavity 12, as shown in FIG. 4, and the upper surface and the body 11 of the molding member 17. Is bonded to the boundary portion of the upper surface 14 of

The protective layer 41 extends from the upper circumference of the molding member 17 to the extension lines of the first and second outer side surfaces 3 and 4 of the body 11, the side cross-sectional shape of which is a hemispherical shape. Can be formed. Since the upper surface 41-1 of the protective layer 41 is formed in a spherical shape, it is possible to improve the light extraction efficiency and to improve the distribution of the directivity angles of the light.

The protective layer 41 is a protective layer of the first embodiment, and may be formed of a translucent material, and may be formed with a height B4 in a range of 20 μm-50 μm, and a width B3 of the bottom surface thereof may be 0.2 mm˜. It may be formed in the range 0.5mm.

The inner width B1 of the region overlapping the upper surface of the molding member 17 and the outer width B2 of the region overlapping the upper surface 14 of the body 11 are the same, or the outer width B2 is the inner side. For example, the width B1 may be wider than that of the width B1.

5 is a side cross-sectional view of a light emitting device according to a third embodiment. In describing the third embodiment, the same parts as the first embodiment will be referred to the first embodiment.

Referring to FIG. 5, in the light emitting device, a protective layer 43 is adhered to a boundary area between an upper surface 14 of the body 11 and an upper surface of the molding member 17. The protective layer 43 has an open area 44 therein, and the upper surface 43-1 has a spherical shape. The upper surface 43-1 of the protective layer 43 includes a curved surface having a recess 43-2 having a concave shape at a central portion thereof, and receives light incident by the curved surface having the recess 43-2. It can reflect or induce lateral emission. As another example, a reflective material may be formed in the concave recess 43-2 disposed on the upper surface of the protective layer 43. The bottom position of the recess 43-2 may be located in an area corresponding to the upper surface 14 of the body 11.

The protective layer 43 is adhered to the circumference of the upper surface of the molding member 17, thereby improving the adhesion between the molding member 17 and the body 11, and also the molding member 17 and the The penetration of moisture into the boundary surface 18 of the side wall 2 of the cavity 12 can be suppressed.

6 is a side cross-sectional view of a light emitting device according to a fourth embodiment. In the description of the fourth embodiment, the same parts as the first embodiment will be referred to the first embodiment.

Referring to FIG. 6, the light emitting device has an open region 46 therein, and a protective layer 45 is adhered to a circumference of an upper surface of the molding member 17, and the protective layer 45 is an upper surface of the body 11. Extends to 14.

The protective layer 45 may be formed to gradually become thicker from the inner side to the outer side. The inner portion of the protective layer 45 may have a thickness of 10 μm or more, and when the thickness is too thin, a problem may occur in which the protective layer 45 is peeled off and a problem of preventing moisture penetration is prevented. Can be generated.

The lower surface of the protective layer 45 may be formed as a flat surface, and the upper surface 45-1 may be formed as a curved surface or an inclined surface. The protective layer 45 covers the boundary surface 18 between the upper surface 14 of the body 11 and the upper surface of the molding member 17, so that the molding member 17 and the cavity 12 are separated from each other. Moisture that penetrates between the side walls 2 can be blocked.

Here, the lower surface of the protective layer 45 may be formed along the contour of the upper surface 14 of the body 11 and the upper surface of the molding member 17, but is not limited to a flat surface.

7 is a side cross-sectional view of a light emitting device according to a fifth embodiment. In the description of the fifth embodiment, the same parts as the first embodiment will be referred to the first embodiment.

Referring to FIG. 7, in the light emitting device, a recessed region 14-1 lower than the top surface 14 of the body 11 is disposed outside the body 11, and the protective layer 47 has an open region inside the body 11. 48 and adheres to the upper surface 14 of the molding member 17 and the upper surface 14 of the body 11. The outer portion 47-1 of the protective layer 47 is disposed in the recessed area 14-1 disposed outside the body 11. The depth C2 of the recess region 14-1 may be formed in a range of 0.05 mm to 0.1 mm, and the width C1 is narrower than the width C3 of the upper surface 14 of the body 11. For example, the width may be in the range of 50% to 80% of the width C3 of the upper surface 14 of the body 11. If the depth C2 of the recess region 14-1 is too deep, the rigidity of the body 11 is weakened, and if the depth C 2 is too thin, the moisture penetration preventing function is not performed. In addition, when the width C1 of the recess region 14-1 is too narrow, the adhesive force of the outer portion 47-1 of the protective layer 47 may be weakened.

By attaching the outer portion 47-1 of the protective layer 47 to the outer recessed region 14-1 of the body 11, the adhesive force of the body 11 is increased, thereby increasing the adhesion of the body 11. It can block moisture entering through the surface.

An upper surface of the protective layer 47 may be formed as a flat surface, a curved surface or an inclined surface, but is not limited thereto.

8 is a side cross-sectional view of a light emitting device according to a sixth embodiment. In describing the sixth embodiment, the same parts as the first embodiment will be referred to the first embodiment.

Referring to FIG. 8, the light emitting device includes a cavity 12 having a first side wall 12-1 and a second side wall 12-2, wherein the second side wall 12-2 is the first side wall. It is formed to step outward from the top of (12-2). The first side wall 12-1 and the second side wall 12-2 may be formed to be inclined at a predetermined angle with respect to a normal direction perpendicular to the upper surface of the light emitting chip 15. The first side wall 12-1 is disposed around the light emitting chip 15, and the second side wall 12-2 is connected to an upper portion of the first side wall 12-1. The upper width of the second side wall 12-2 may be wider than the upper width of the first side wall 12-1 to increase the distribution of the directivity angles of the light.

A molding member 17 is formed in the cavity 12, and the upper surface width D3 of the molding member 17 is wider than the structure without the second side wall 12-1 of the cavity 12. Can be. A protective layer 49 having an open area 50 is formed around the upper surface of the molding member 17, and the protective layer 49 has a hemispherical contour with a side cross section and an upper surface 49-1. It can be formed into a curved surface.

The protective layer 49 is adhered to the upper surface 14 of the molding member 17 and the upper surface 14 of the body 11 to form a second side wall 12-2 of the molding member 17 and the cavity 12. Can block moisture that penetrates the boundary between The lower surface of the protective layer 49 is disposed to overlap the second side wall 12-2 of the cavity 12 in a vertical direction.

In addition, as the width of the exit side of the cavity 12 is increased to increase the light extraction efficiency, the width of the upper surface 14 of the body 11 may be narrowed. By disposing the protective layer 49 on the upper surface 14 of the body 11, it is possible to suppress the penetration of moisture between the molding member 17 and the second side wall 12-2 of the cavity 12. .

9 is a side cross-sectional view of a light emitting device according to a seventh embodiment. In describing the seventh embodiment, the same parts as the first embodiment will be referred to the first embodiment.

Referring to FIG. 9, the light emitting device includes a stepped recess region 12-3 above the side wall 2 of the cavity 12 of the body 11, and the molding member 17 is formed in the cavity 12. ) Is disposed, and the molding member 17 may be formed at the sidewall height H1 of the cavity 12. The protective layer 51 is bonded to the recessed region 12-3.

The protective layer 51 has an open area 52, and may be coplanar with the upper surface 14 of the body 11 or protrude lower or higher than the upper surface 14 of the body 11. The protective layer 51 is in contact with the recessed region 12-3 of the cavity 12 and the upper surface of the molding member 17, so that the side wall 2 and the molding member 17 of the cavity 12 are in contact with each other. Moisture can be prevented from penetrating the interface between them.

In addition, a translucent resin layer 17A is disposed on the molding member 17, and phosphors may be added to the translucent resin layer 17A, but embodiments are not limited thereto.

The light transmissive resin layer 17A may be disposed in the open area 52 of the protective layer 51 and may contact the inner surface of the protective layer 51. Accordingly, the protective layer 51 extends over the upper surface of the molding member 17 and contacts the outer surface of the translucent resin layer 17A, thereby preventing moisture from penetrating. In addition, since the protective layer 51 is a light-transmitting material, it has little influence on the path of light propagation.

The width F2 of the recessed area 12-3 disposed above the cavity 12 includes a range of 0.04-0.1 mm, and is 40 relative to the width F1 of the upper surface 14 of the body 11. It may be formed in the range of% -80%, it may be formed narrower than the width of the protective layer 51. Accordingly, the protective layer 51 protrudes from the recessed region 12-3 in the direction of the cavity 12. Also, the depth F3 of the recessed region 12-3 may be deeper than the width F 2, for example, in the range of 0.05-0.1 mm. The width F2 and the depth F3 of the recess region 12-3 may vary depending on the adhesion of the protective layer 51.

The light emitting device has a wider upper width D4 of the cavity 12, whereby light extraction efficiency can be improved.

10 is a side cross-sectional view of a light emitting device according to an eighth embodiment. In describing the eighth embodiment, the same parts as the first embodiment will be referred to the first embodiment.

Referring to FIG. 10, in the light emitting device, a recessed region 12-3 is disposed on the sidewall 2 of the cavity 12, and a protective layer 53 is disposed in the recessed region 12-3. do. The protective layer 53 has an open region 54, and is bonded in the recess region 12-3.

The molding member 17 is formed in the cavity 12 and is disposed in the open area 54 of the protective layer 53. Accordingly, the molding member 17 may be in contact with the inner surface of the protective layer 53. The protective layer 53 covers the boundary surface between the side wall 2 of the cavity 12 of the body 11 and the molding member 17, thereby along the upper surface 14 of the body 11. Moisture that penetrates along the side wall 2 of the cavity 12 may be blocked.

The width F4 of the protective layer 53 may be smaller than the width F2 of the recess region 12-3. By arranging the protective layer 53 in the recess region 12-3, the molding member 17, the protective layer 53, and the recess region 12-3 of the recess region 12-3 are disposed. The area of contact with the surfaces is increased, which can prevent moisture penetration.

The light emitting device according to the embodiment may be applied to a lighting system. The lighting system includes a structure in which a plurality of light emitting elements are arranged, and includes a display device shown in FIGS. 11 and 12 and a lighting device shown in FIG. 13, and may include a lighting lamp, a traffic light, a vehicle headlamp, an electric signboard, and the like. have.

11 is an exploded perspective view of a display device having a light emitting device according to the embodiment.

Referring to FIG. 11, the display device 1000 according to the exemplary embodiment includes a light guide plate 1041, a light source module 1031 providing light to the light guide plate 1041, and a reflective member 1022 under the light guide plate 1041. ), An optical sheet 1051 on the light guide plate 1041, a display panel 1061, a light guide plate 1041, a light source module 1031, and a reflective member 1022 on the optical sheet 1051. The bottom cover 1011 may be included, but is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 may be defined as a light unit 1050.

The light guide plate 1041 diffuses light to serve as a surface light source. The light guide plate 1041 is made of a transparent material, for example, an acrylic resin series such as polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphtha late PEN. ) One of the resins.

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately serves as a light source of the display device.

The light source module 1031 may include at least one, and may provide light directly or indirectly at one side of the light guide plate 1041. The light source module 1031 may include a substrate 1033 and a light emitting device 1035 according to the embodiment disclosed above, and the light emitting device 1035 may be arranged on the substrate 1033 at predetermined intervals. .

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB but also a metal core PCB (MCPCB, Metal Core PCB), a flexible PCB (FPCB, Flexible PCB) and the like, but is not limited thereto. When the light emitting device 1035 is mounted on the side surface of the bottom cover 1011 or the heat dissipation plate, the substrate 1033 may be removed. Here, a part of the heat dissipation plate may contact the upper surface of the bottom cover 1011.

The light emitting devices 1035 may be mounted on the substrate 1033 such that an emission surface from which light is emitted is spaced apart from the light guide plate 1041 by a predetermined distance, but is not limited thereto. The light emitting device 1035 may directly or indirectly provide light to a light incident part, which is one side of the light guide plate 1041, but is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 may improve the luminance of the light unit 1050 by reflecting light incident to the lower surface of the light guide plate 1041 and pointing upward. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may accommodate the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with an accommodating part 1012 having a box shape having an upper surface opened thereto, but is not limited thereto. The bottom cover 1011 may be combined with the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or non-metal material having good thermal conductivity, but is not limited thereto.

The display panel 1061 is, for example, an LCD panel, and includes a first and second substrates of transparent materials facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizer may be attached to at least one surface of the display panel 1061, but the polarizer is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. The display device 1000 may be applied to various portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light transmissive sheet. The optical sheet 1051 may include at least one of a sheet such as, for example, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses the incident light, the horizontal and / or vertical prism sheet focuses the incident light into the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness. In addition, a protective sheet may be disposed on the display panel 1061, but is not limited thereto.

Here, the light guide plate 1041 and the optical sheet 1051 may be included as an optical member on the optical path of the light source module 1031, but are not limited thereto.

12 is a diagram illustrating a display device having a light emitting device according to an exemplary embodiment.

Referring to FIG. 12, the display device 1100 includes a bottom cover 1152, a substrate 1120 on which the light emitting device 1124 disclosed above is arranged, an optical member 1154, and a display panel 1155.

The substrate 1120 and the light emitting device 1124 may be defined as a light source module 1160. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include an accommodating part 1153, but is not limited thereto. The light source module 1160 includes a substrate 1120 and a plurality of light emitting devices 1124 arranged on the substrate 1120.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, horizontal and vertical prism sheets, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a poly methyl methacrylate (PMMA) material, and the light guide plate may be removed. The diffusion sheet diffuses the incident light, the horizontal and vertical prism sheets focus the incident light onto the display area, and the brightness enhancement sheet reuses the lost light to improve the brightness.

The optical member 1154 is disposed on the light source module 1160 and performs surface light, or diffuses, condenses, or the like the light emitted from the light source module 1160.

13 is an exploded perspective view of a lighting apparatus having a light emitting device according to the embodiment.

Referring to FIG. 13, the lighting apparatus according to the embodiment may include a cover 2100, a light source module 2200, a heat radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. Can be. In addition, the lighting apparatus according to the embodiment may further include any one or more of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or hemisphere, may be hollow, and may be provided in an open shape. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter or excite the light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat sink 2400. The cover 2100 may have a coupling part coupled to the heat sink 2400.

An inner surface of the cover 2100 may be coated with a milky paint. The milky paint may include a diffuser to diffuse light. The surface roughness of the inner surface of the cover 2100 may be greater than the surface roughness of the outer surface of the cover 2100. This is for the light from the light source module 2200 to be sufficiently scattered and diffused to be emitted to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent and opaque so that the light source module 2200 is visible from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the heat sink 2400. Thus, heat from the light source module 2200 is conducted to the heat sink 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the heat dissipator 2400, and has a plurality of light source parts 2210 and guide grooves 2310 into which the connector 2250 is inserted. The guide groove 2310 corresponds to the board and the connector 2250 of the light source unit 2210.

The surface of the member 2300 may be coated or coated with a light reflective material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 is reflected on the inner surface of the cover 2100 to reflect the light returned to the light source module 2200 side again toward the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting apparatus according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 may block the accommodating groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may include a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside to provide the light source module 2200. The power supply unit 2600 is accommodated in the accommodating groove 2725 of the inner case 2700, and is sealed in the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide unit 2630, a base 2650, and a protrusion 2670.

The guide part 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A plurality of parts may be disposed on one surface of the base 2650. The plurality of components may include, for example, a DC converter for converting AC power provided from an external power source into DC power, a driving chip for controlling the driving of the light source module 2200, and an ESD for protecting the light source module 2200. (ElectroStatic discharge) protection element and the like, but may not be limited thereto.

The protrusion 2670 has a shape protruding to the outside from the other side of the base 2650. The protrusion 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the protrusion 2670 may be provided to be the same as or smaller than the width of the connection portion 2750 of the inner case 2700. Each end of the “+ wire” and the “− wire” may be electrically connected to the protrusion 2670, and the other end of the “+ wire” and the “− wire” may be electrically connected to the socket 2800.

The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding part is a part where the molding liquid is hardened, so that the power supply part 2600 can be fixed inside the inner case 2700.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, contents related to such combinations and modifications should be construed as being included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiment, which is merely an example, and is not intended to limit the present invention. Those skilled in the art to which the present invention pertains will be illustrated as above without departing from the essential characteristics of the present embodiment. It will be appreciated that various modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

1: light emitting element 11: body
12: cavity 17: molding member
15: light emitting chip 21, 23: lead frame
31,32,41,43,45,47,49,51,53: protective layer

Claims (12)

A body having a cavity;
A first lead frame and a second lead frame spaced apart from each other in the cavity;
A light emitting chip disposed on at least one of the first lead frame and the second lead frame;
A molding member disposed in the cavity;
A protective layer disposed along an interface between the sidewall of the cavity and the molding member and bonded to the molding member and the body; And
It includes a light-transmissive resin layer disposed on the molding member,
A stepped recess region over the cavity sidewalls of the body,
The protective layer has an open area on the inside and is bonded on the upper surface of the molding member and the upper surface of the body,
An outer portion of the protective layer is disposed in a recessed region of the body,
The light-transmissive resin layer is disposed in an open area of the protective layer,
The protective layer protrudes from the recessed area in the cavity direction,
The outer surface of the protective layer is in contact with the body,
An inner surface of the protective layer is in contact with an outer surface of the light-transmissive resin layer and surrounds both sides of the light-transmissive resin layer;
The upper surface of the protective layer and the upper surface of the body are coplanar light emitting device. delete The method of claim 1,
The protective layer protrudes lower or higher than the upper surface of the body,
The width of the recessed region is narrower than the width of the protective layer. The method of claim 3, wherein
The protective layer is in contact with the recessed area and an upper surface of the molding member,
The width of the recess area is formed in the range of 40 to 80% of the width of the upper surface of the body. delete The method of claim 4, wherein
The translucent resin layer is a phosphor is added,
And a depth of the recess area is greater than a width of the recess area. delete delete delete delete delete delete

Images