KR101997244B1 - Light source module and lighting system having the same - Google Patents

Abstract

A light source module according to an embodiment includes a body having a cavity, a lead frame in the cavity, a light emitting element including a light emitting chip on the lead frame, And an optical element having a first recess portion disposed on the light emitting element and disposed on the upper portion of the cavity, a phosphor layer disposed on the first recess portion, and a light exit surface for emitting light incident on the phosphor layer Wherein the first recess portion and the phosphor layer include a width wider than an upper width of the cavity.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a light source module,

Embodiments relate to a light source module and an illumination system having the same.

Generally, a circuit board refers to a substrate which is formed by forming a circuit pattern of a conductive material such as copper on an electrically insulating substrate and immediately before mounting a heating element related to an electronic component. A plurality of light emitting diodes (LEDs) are arranged on the circuit board.

A light emitting diode (LED) is a type of semiconductor device that converts electric energy into light. It is being used as a next generation light source in place of conventional fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode. The light emitting diode has been increasingly used as a light source for various lamps used in indoor and outdoor, lighting devices such as a liquid crystal display, have.

The embodiment provides a light source module in which an optical lens having a light emitting element and a phosphor layer is combined.

The embodiment provides the light source module in which the phosphor layer of the optical lens is disposed on the light exit of the light emitting element.

The embodiment provides a light source module in which an optical lens having a phosphor layer can be coupled to a light emitting element or a circuit board.

A light source module according to an embodiment of the present invention includes: a body having an upper opened cavity; A plurality of lead frames disposed in the cavity and spaced apart from each other; A light emitting chip disposed on at least one of the plurality of lead frames; And an optical lens disposed on the plurality of lead frames and the body and including a recessed portion formed at a predetermined depth on an incident surface on which light is incident; A phosphor layer disposed in the recessed portion; And a barrier portion covering the side surface of the phosphor layer, wherein the barrier portion includes a reflective layer, the barrier portion is disposed in a recessed region formed along the outer periphery of the incident surface of the optical lens, And the upper surface of the phosphor layer is in contact with the optical lens.

A light source module according to an embodiment includes: a support substrate including a storage region; A radiator plate disposed in the storage area; A plurality of light emitting chips disposed on the heat dissipation substrate; An optical lens disposed on the support substrate and having a recess portion in a region corresponding to the heat dissipation substrate; And a phosphor layer disposed in the recess portion, wherein the supporting substrate includes a metal layer, an insulating layer on the metal layer, a wiring layer on the insulating layer, and a protective layer on the wiring layer, Wherein the supporting substrate is provided with an engaging hole recessed in the direction of the insulating layer from the protective layer and surrounding the side surface of the receiving area and exposed to the insulating layer, And can be combined with the coupling protrusion of the optical lens protruding in the direction of the supporting substrate.

The embodiment can improve the yield of the light emitting element by applying the phosphor layer to the optical lens.

The embodiment has an effect of adjusting the light directing angle by combining the color conversion by the optical lens having the phosphor layer.

The embodiment does not form a phosphor layer on the light emitting chip of the light emitting device, thereby preventing damages of the light emitting chip and preventing the wire connected to the light emitting chip from being opened.

The embodiment can improve the straightness of the directivity angle by providing the light exit surface of the optical lens having the phosphor layer at the bottom in a hemispherical shape.

The embodiment has an effect that the optical lens having the phosphor layer can be replaced.

Embodiments can improve the reliability of a light source module and an illumination system having the same.

1 is a side sectional view showing a light source module according to a first embodiment.
Fig. 2 is a view showing a method of manufacturing the phosphor layer of the optical lens of Fig. 1;
3 (A) and 3 (B) are bottom views of the optical lens of Fig. 1;
Fig. 4 is a view showing another example of the optical lens of Fig. 1. Fig.
Fig. 5 is a view showing another example of the optical lens of Fig. 1. Fig.
6 is a side sectional view showing a light source module according to a second embodiment.
7 is a view showing a manufacturing method of the optical lens of Fig.
8 is a side sectional view showing a light source module according to the third embodiment.
9 is a side cross-sectional view of the optical lens of Fig.
10 is a side sectional view showing a light source module according to a fourth embodiment.
11 is a side sectional view showing the optical lens of Fig.
12 is a view showing another example of the optical lens of Fig.
13 is a side sectional view showing a light source module according to a fifth embodiment.
14 is a view showing another example of the optical lens of Fig.
15 and 16 are views showing another example of the optical lens of the light source module according to the embodiment.
17 is a side sectional view showing a light source module according to a sixth embodiment.
18 is a side sectional view showing a light source module according to a seventh embodiment.
19 is a perspective view showing a display device having a light source module according to an embodiment.
20 is a view showing another example of a display device having a light source module according to the embodiment.
21 is a diagram showing an example of a lighting apparatus having a light source module according to an embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when an element is referred to as "comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

In the description of the embodiments, it is to be understood that each layer (film), region, pattern or structure is formed "on" or "under" a substrate, each layer Quot; on "and "under" include both those that are "directly" or "indirectly" formed through another layer. In addition, the criteria for above or below each layer will be described with reference to the drawings.

Hereinafter, the light source module according to the first embodiment will be described with reference to FIGS. 1 to 3. FIG. FIG. 1 is a side sectional view showing a light source module according to a first embodiment, FIG. 2 is a view showing a method of manufacturing a phosphor layer of the optical lens of FIG. 1, and FIG. 3 is a bottom view of the optical lens of FIG.

1 to 3, the light source module 10 includes a light emitting element 5 having a light emitting chip 14; And an optical lens 15 disposed on the light emitting element 5 and having a phosphor layer 19.

The light emitting device 5 includes a body 12 having a cavity 13 with an open upper part, a plurality of lead frames 11 and 11A disposed in the cavity 13 of the body 12, And at least one light emitting chip (14) disposed on at least one of the lead frames (11, 11A).

The body 12 may be made of an insulating material, a light transmitting material, or a conductive material. The body 12 may be made of a resin material such as polyphthalamide (PPA), silicon (Si), metal material, PSG (PCB) such as Al ₂ O ₃ , silicon, an epoxy molding compound (EMC), a polymer series, a plastic series, and the like. For example, the body 12 may be made of a resin material such as polyphthalamide (PPA), silicone, or an epoxy material. The shape of the body 12 may include polygonal, circular, or curved shapes as viewed from above, but is not limited thereto.

The cavity 13 of the body 12 is opened at the top and a plurality of lead frames 11 and 11A, for example, two or three or more, may be disposed therein. The plurality of lead frames 11 and 11A may be spaced from each other at the bottom of the cavity 13. [ The width of the cavity 13 may be wide and the top may be narrow, but the present invention is not limited thereto.

The lead frames 11 and 11A are made of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, ), Tin (Sn), silver (Ag), and phosphorous (P), and may be formed of a single metal layer or a multilayer metal layer. The thickness of the lead frames 11 and 11A may be in a range of 0.3 mm to 1.5 mm, for example, in a range of 0.3 mm to 0.8 mm, but is not limited thereto.

An insulating material may be disposed between the plurality of lead frames 11 and 11A. The insulating material may be the same material as the body 12 or other insulating material, but is not limited thereto.

The light emitting chip 14 can selectively emit light in the range of visible light band to ultraviolet light band. For example, a red LED chip, a blue LED chip, a green LED chip, a yellow green LED chip, a UV LED chip, and white LED chips. The light emitting chip 14 includes a compound semiconductor of Group III-V or / and Group II-VII elements. Although the light emitting chip 14 is disposed in a chip structure having a horizontal electrode structure, the light emitting chip 14 may be arranged in a chip structure having a vertical electrode structure in which two electrodes are arranged up and down. The light emitting chip 14 is electrically connected to a plurality of lead frames 11 and 11A by an electrical connecting member such as a wire 4.

One or two or more light emitting chips 14 may be disposed in the cavity 13, and two or more light emitting chips may be connected in series or in parallel. However, the present invention is not limited thereto.

The cavity 13 may be sealed by the phosphor layer 19 and may be filled with air or nitrogen (N ₂ ). As another example, the cavity 13 may be formed with a molding member of a transparent material. The molding member includes a light-transmitting resin layer such as silicon or epoxy, and may be formed as a single layer or a multi-layer. The upper surface of the molding member may include at least one of a flat shape, a concave shape, and a convex shape. For example, the surface of the molding member may be formed of a concave curved surface or a convex curved surface, 5).

The optical lens 15 includes a recessed portion 16 and a light emitting surface 17 on an incident surface 16A on which light is incident and a phosphor layer 19 on the recessed portion 16.

The optical lens 15 is formed in a convex shape about an optical axis perpendicular to the light emitting chip 14. The optical lens 15 is a light extracting member, and changes the emitting direction of light emitted from the light emitting chip 14.

The optical lens 21 may use a transparent material having a refractive index of 1.4 or more and 1.7 or less. The optical lens 21 is made of transparent resin material of transparent resin such as polymethyl methacrylate (PMMA) having a refractive index of 1.49, polycarbonate (PC) having a refractive index of 1.59 or epoxy resin (EP) Can be formed.

The optical lens 15 may have a hemispherical shape and the light exit surface 17 may have the same shape as the outer shape of the optical lens 15.

The recess portion 16 may have a predetermined depth and may have a width larger than an upper width of the cavity 13. Accordingly, the phosphor layer 19 may be formed to have a larger width than the upper width of the cavity 13, and the wavelength of the light emitted through the cavity 13 may be changed.

The phosphor layer 19 may include a phosphor for converting the wavelength of light emitted onto the light emitting chip 14 in a transparent resin material such as silicon or epoxy. The phosphor may include YAG, TAG, Silicate, Nitride , And an oxy-nitride-based material. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but the present invention is not limited thereto.

The lower surface 19A of the phosphor layer 19 extends from the incident surface 16A of the optical lens 15 and the lower surface 19A is curved convexly toward the light emitting chip 14, 14, or may be formed as a flat surface.

An adhesive agent such as silicon or epoxy is formed between the circumference of the phosphor layer 19 and the upper surface of the body 12. The phosphor layer 19 is formed on the lower surface of the body 12, And the present invention is not limited thereto.

The incident surface 16A of the optical lens 15 may be formed as a circular ring as shown in FIG. 3, but the present invention is not limited thereto.

The optical lens 15 may have a plurality of coupling protrusions 18 formed around its lower portion as shown in FIGS. 1 and 3A and 3B, and the plurality of coupling protrusions 18 are spaced apart from each other The light emitting device 5 may be coupled to an end of the lead frame 11 or 11A that is vertically protruded outside the side surface of the body 12 of the light emitting device 5 and exposed to the outside of the body 12, (Not shown) disposed underneath. The coupling protrusions 18 may be removed from the optical lens 15, but the invention is not limited thereto. The plurality of coupling protrusions 18 may be made of the same material as that of the optical lens 15 or may be made of different materials, but the present invention is not limited thereto.

The plurality of coupling protrusions 18 may be spaced apart from each other by 90 degrees with respect to the center of the optical lens 15. The angle may be changed according to the number of the coupling protrusions 18. [ In FIG. 3A, the four engaging projections are equally spaced from each other by 90 degrees, and the three engaging projections are spaced equidistantly from each other by 120 degrees.

The recess 16 may be circular when viewed from the bottom of the optical lens 15 and the diameter D2 may be narrower than the diameter D1 of the optical lens 15. [

Since the optical lens 15 includes the phosphor layer 19, when the molding member is added to the light emitting chip 14, the wire can be prevented from being opened due to thermal expansion of the molding member. Further, by providing the phosphor layer 19 in the optical lens 15, damage to the light emitting chip 14 can be prevented. Thus, the yield of the light emitting device can be improved. By disposing the optical lens 15 on the light emitting element, the wavelength conversion and the angle of directivity can be adjusted. And the optical lens 15 having the phosphor layer 19 can be replaced.

Referring to FIG. 2, a method of manufacturing a phosphor layer of an optical lens is as follows.

The optical lens 15 is rotated 180 degrees as shown in Fig. 2 and then the recessed portion 16 is exposed to the top and the liquid resin material in which the phosphor is added to the recessed portion 16 through the dispenser 20 As shown in FIG. Thereafter, since the phosphor layer 19 is formed by curing, the optical lens 15 having the phosphor layer 19 can be formed. 3 (A) and 3 (B), the recess portion 16 is formed in a dam structure for preventing the phosphor layer 19 from overflowing, and the periphery of the phosphor layer 19 is covered with a cover . The minimum thickness of the phosphor layer 19 may be the same as or smaller than the depth of the recessed portion 16.

4 is a modification of the optical lens of Fig.

4, the optical lens 25 has a barrier portion 26A having an open region on the incident surface 26, and a phosphor layer 29 is disposed in an open region of the barrier portion 26A. The open region of the barrier portion 26A is a recessed region formed along the outer periphery of the incident surface 26 of the optical lens 25 to prevent the fluorescent layer 29 from overflowing. The thickness of the barrier portion 26A may be greater than the thickness of the phosphor layer 29, but is not limited thereto.

It is possible to cover the periphery of the phosphor layer 29 and to block light leaking outward. The barrier section (26A) may function as a reflective layer, the reflective layer may be formed of a resin material such as silicon or epoxy, for bonding with the phosphor layer 29, for example metal oxides therein, TiO ₂ And additives such as SiO ₂ . The reflective layer may be a white material such as a PSR (photo solder resist), but is not limited thereto. As another example, the barrier portion 26A may be formed of a metal material or may be formed of an adhesive tape, but is not limited thereto.

One or a plurality of light emitting chips 24 may be disposed under the fluorescent layer 29 of the optical lens 25 and the light emitting chip 24 may be disposed in the cavity 13 of the body 12, Or may be disposed on a circuit board, but is not limited thereto.

Light incident through the phosphor layer 29 of the optical lens 25 is emitted through the light exit surface 27. The light exit surface 27 may include a hemispherical shape, but is not limited thereto.

5 is another example of the optical lens of Fig.

5, the optical lens 35 includes a recess portion 36 having a concave curved surface with a predetermined depth from the incident surface 36A, and a phosphor layer 39 is formed on the recess portion 36 .

The depth of the recessed portion 36 gradually increases toward the central portion and the maximum depth T2 thereof may be 1/2 or less of the height T1 of the optical lens 35, for example, 1/5 or less. The lower surface of the phosphor layer 39 may be formed on the same plane as the incident surface 36A of the optical lens 35, or may be formed as a convex or concave surface.

The recessed portion 36 of the optical lens 35 is formed into a concave curved surface to improve the transmittance of light passing through the phosphor layer 39. [

6 is a side sectional view showing a light source module according to a second embodiment.

Referring to FIG. 6, the light source module 40 includes an optical lens 45 having a light emitting element 6 and a hemispherical phosphor layer 49.

The light emitting device 6 includes a light emitting chip 44 disposed on a lead frame 41 disposed in a cavity 43 of the body 42. Here, a molding member 43A covering the light emitting chip 44 may be formed. The molding member 43A may be formed of a transparent resin layer to which no impurities such as a fluorescent material and a diffusing agent are added, or may be formed of a resin layer to which a diffusing agent is added. As another example, the molding member may not be formed, but the molding member is not limited thereto.

The recessed portion 46 of the optical lens 45 is formed in a hemispherical shape having a predetermined depth T4 from the incident surface 46A, Of the thickness (T3) of the lens (45). The recessed portion 46 of the optical lens 45 and the light exit surface 47 are formed in a hemispherical shape so that the optical lens 45 can improve the straightness of the directivity angle of the emitted light.

The phosphor layer 49 may be formed in a hemispherical shape and may be in contact with the molding member 43A of the light emitting device 6, but the present invention is not limited thereto.

The upper surface of the molding member 43A or the upper width of the cavity 43 may be equal to or narrower than the width (or diameter) D4 of the phosphor layer 49. The width (or diameter) D4 of the phosphor layer 49 may be narrower than the diameter D3 of the optical lens 45. [

The optical lens 45 includes a plurality of engaging projections 48. The engaging projections 48 protrude downward from the incident surface 46A of the optical lens 5, 41, or may be coupled to a circuit board. The coupling protrusions 48 may not be formed.

Fig. 7 is a view showing an example of the surface of the phosphor layer of the optical lens of Fig. 6;

7, the surface of the phosphor layer 49 may be formed as a flat surface L1 with respect to the incident surface 46A, a concave curved surface L2, or a convex curved surface L3 . This surface shape can be selectively changed.

8 and 9 are side sectional views showing a light source module and an optical lens thereof according to a third embodiment.

8, the light source module 50 includes a circuit board 51, a light emitting chip 54 disposed on the circuit board 51, and a light emitting chip 54 disposed on the light emitting chip 54, And an optical lens 55 having a phosphor layer 59 on its surface.

The circuit board 51 may include at least one of a metal core PCB (MCPCB), a flexible PCB (FPCB), a resin PCB, and a ceramic PCB. The circuit board 51 includes a circuit pattern, which is electrically connected to the light emitting chip 54. Accordingly, the circuit pattern can supply power to the light emitting chip 54.

One or a plurality of light emitting chips 54 may be disposed on the circuit board 51. The plurality of light emitting chips 54 may be selectively connected to the circuit board 51 in series, And the present invention is not limited thereto.

The optical lens 55 covers the light emitting chip 54. The optical lens 55 includes a first recess portion 56 and a phosphor layer 59 is formed on the first recess portion 56. The phosphor layer 59 is spaced from the front surface and the top surface of the light emitting chip 54. The first recess portion 56 and the phosphor layer 59 may be formed in a hemispherical shape and the light exit surface 57 of the optical lens 55 may be formed in a hemispherical shape.

The phosphor layer 59 includes a second recess portion 59A, and the second recess portion 59A is formed in a hemispherical shape, and air or nitrogen may be formed. The region 53 between the light emitting chip 54 and the phosphor layer 59 is located at a position where the second recess portion 59A is located, that is, the light emitting chip 54 is disposed in the second recess portion 59A do. The second recess portion 59A may separate the light emitting chip 54 from the phosphor layer 59 and diffuse the light emitted from the light emitting chip 54.

The optical lens 55 includes a plurality of coupling protrusions 58 and the plurality of coupling protrusions 58 may be coupled to the coupling hole 52 of the circuit board 51.

A reflective layer may be formed on the upper surface 51A of the circuit board 51, and the reflective layer may be formed of a material such as a photo solder resist. The reflective layer may reflect the incident light reflected from the optical lens 55. The surface of the reflective layer is formed as a rough surface, and the incident light can be scattered.

9, the optical lens 55 may have a circular shape in which the first and second recess portions 56 and 59A have different diameters D6 and D7 and the first and second recess portions 56 and 59A may have a circular shape, The diameter D6 of the optical lens 55 may be wider than the diameter D7 of the second recess 59A and may be narrower than the diameter D5 of the optical lens 55. [ The optical lens 55 may be formed in a circular shape on the incidence side, but is not limited thereto.

10 and 11 are side sectional views showing a light source module and an optical lens thereof according to a fourth embodiment.

10, the light source module 60 includes a circuit board 61, a light emitting chip 64 disposed on the circuit board 61, and a circuit board 61 disposed on the light emitting chip 64, (Not shown).

The circuit board 61 has an engaging hole 62 and the engaging projection 68 of the optical lens 65 is engaged with the engaging hole 62.

The optical lens 65 has the phosphor layer 69 disposed on the first recess 66 and the second recess 69A on the phosphor layer 69 on the light emitting chip 64. [

A reflective member 67A is formed in a region of the interface between the first recessed portion 66 and the phosphor layer 69 adjacent to the circuit board 61. [ The reflective member 67A is formed along the lower circumference of the first recess portion 66, and may be formed in a loop shape. The reflective member 67A may be made of a metal or a non-metallic material, which is different from the phosphor layer 69 or the optical lens 65. [ For example, the reflective layer of the metal may be Al or Ag, and the reflective layer of the non-metallic material may contain at least one of metal oxides such as SiO ₂ , TiO ₂ and Al ₂ O ₃ in a material such as silicon or epoxy in an amount of 5 wt% .

The reflective member 67A may be curved along the curvature of the first recess portion 66 and may be disposed in the region of the first recess portion 66, The engaging projections 68 of the engaging protrusions 68 are provided.

The phosphor layer 69 may be in contact with or attached to the upper surface of the circuit board 61, but the present invention is not limited thereto.

11, the height T6 of the reflective member 67A may be lower than or equal to the depth T3 of the second recess 66, and the height T6 of the reflective layer 67A 69 to reflect the light leaking laterally. The height T6 of the reflecting member 67A may be less than or equal to 1/3 of the depth T3 of the first recess 66 and may be formed within a range that does not affect the directivity angle distribution of light. .

12 is a view showing another example in the optical lens of Fig.

Referring to Fig. 12, the optical lens 65A includes a phosphor layer 69 and a reflecting member 67B. The reflective member 67B is disposed on the lower periphery of the light exit surface 67 of the optical lens 65. [ The reflective member 67B may be formed along the light exit surface 67 and may be disposed outside the coupling protrusion 68. [ The height T6 of the reflective member 67B may be lower than the depth T5 of the second recess 66 of the phosphor layer 69 and is not limited thereto. The reflective member 67B may reflect the light in the lateral direction emitted through the optical lens 65. [ The material of the reflective member 67B may include a metal or a non-metallic material, but is not limited thereto.

13 is a side sectional view of the light source module according to the fifth embodiment and an optical lens.

13, the light source module 70 includes a circuit board 71 on which a light emitting chip 74 is disposed and a phosphor layer 79 covering the light emitting chip 74 on the circuit board 71 And an optical lens 75.

The optical lens 75 may have a phosphor layer 79 formed in the recess 76 and the phosphor layer 79 may be formed to a predetermined depth of the recess 76. The phosphor layer 79 may be spaced apart from the upper surface of the circuit board 71 and a layer such as air or nitrogen may be formed in the region 73 between the phosphor layer 79 and the circuit board 71 . As another example, a layer such as silicon or epoxy may be formed in the region between the phosphor layer 79 and the circuit board 71 as a transparent molding member, not air, without adding other additives.

The optical lens 75 may have a full reflection surface 77A formed around the lower surface of the light exit surface 77. The total reflection surface 77A may be formed at a predetermined height from the incident surface of the optical lens 75 And may be formed into a curved surface having a predetermined curvature. The total reflection surface 77A is formed in a convex curved surface inward from the lower part of the light exit surface 77 of the optical lens 75 and can reflect light emitted from the light emitting chip 74 . This eliminates the need to form a separate reflective layer on the optical lens 75.

The optical lens 5 can be coupled to the coupling hole 72 of the circuit board 71 through the coupling projection 78. [

The gap G1 between the phosphor layer 79 and the circuit board 71 may be narrower than the depth T7 of the recess 76 or the thickness T8 of the phosphor layer T8.

14 is a view showing another example of the optical lens of Fig.

14, the optical lens 75 has a phosphor layer 79A formed in the first recessed portion 76 inside thereof and a second recessed portion 73A formed in the phosphor layer 79A do. The first and second recessed portions 76 and 73A may be formed in a hemispherical shape, but the present invention is not limited thereto. The light-emitting chip 74 shown in Fig. 13 may be disposed in the second recess portion 76. Fig.

The optical lens 75 may have a full reflection surface 77A formed around a lower portion of the phosphor layer 79A to reflect light leaked to the lower side.

15 and 16 are views showing another example of the optical lens of the light source module according to the embodiment.

Referring to Fig. 15, an optical lens 85 is disposed on one or a plurality of light emitting chips 84 in the light source module.

The optical lens 85 has a curved recess portion 86 convex upward with respect to the optical axis direction perpendicular to the light emitting chip 84 and the phosphor layer 89 is disposed in the recess portion 86.

The optical lens 85 includes a depressed portion 87A having a curved surface recessed downward with respect to the optical axis direction at an upper portion thereof and a light exit surface 87 extending at a predetermined curvature around the depressed portion 87A .

The width (or diameter) of the incident surface 89A of the phosphor layer 89 may be equal to or wider than the width (or diameter) of the depression 87A.

The optical lens 85 may not form the coupling protrusion 88, but the present invention is not limited thereto.

16, in the optical lens 85A, the phosphor layer 89 is disposed in the recess portion 86A having a predetermined depth, and the reflective material 87B is formed in the depression portion 87A at the upper portion. The reflective material 87B in the depression 87A may be doped with a metal oxide such as silicon or epoxy. The reflective material 87B can reflect the light incident on the depression 87A and the light exit surface 87C emits the light reflected by the depression 87A in the outward direction. By improving the light intensity of the side beam of the optical lens 85A, the directivity angle distribution of light can be widened.

17 is a side sectional view showing a light source module according to a sixth embodiment.

17, the light source module 100 includes a storage area 115 in the support substrate 110, a heat dissipation substrate 121 in the storage area 115, a plurality of light emitting elements 121 arranged on the heat dissipation substrate 121, A chip 124, and an optical lens 135 on the support substrate 110.

The supporting substrate 110 includes a metal layer 111, an insulating layer 112 on the metal layer 111, a wiring layer 113 on the insulating layer 112, a protective layer 114 on the wiring layer 113, . The metal layer 111 may include at least one of Al, Cu, and Fe. The metal layer 111 may be formed of Cu or Al for heat dissipation. The metal layer 111 may have a thickness in the range of 100 탆 or more, for example, 100 탆 to 1400 탆, and may have a thickness greater than the thickness of the insulating layer 112. An insulating layer 112 is formed on the metal layer 111. The insulating layer 112 includes a pre-pregregated material such as an epoxy resin, a phenol resin, and an unsaturated polyester resin. have. The insulating layer 112 may be formed to a thickness of 75 to 100 탆 and may have a thickness smaller than that of the metal layer 111 for thermal conduction. Metal oxide fillers such as TiO ₂ , SiO ₂ , and Al ₂ O ₃ , which are metal oxides, may be added to the insulating layer 112 to improve thermal conductivity. The wiring layer 113 includes a circuit pattern and includes at least one of Cu, Au, Al, and Ag. For example, Cu may be used. The wiring layer 113 may have a thickness of 25 to 70 탆 and may be formed to be thinner than the insulating layer 112, but the present invention is not limited thereto.

A passivation layer 114 is formed on the wiring layer 113 and the passivation layer 114 includes an insulating material such as a solder resist such as a photo solder resist (PSR). The protective layer 114 may be formed to a thickness of 2 to 1000 탆.

The coupling protrusion 138 of the optical lens 135 may be coupled to the coupling hole 116 of the supporting substrate 11, but the invention is not limited thereto.

The metal layer 111 may be exposed in the storage region 115 of the support substrate 110 and the heat dissipation substrate 121 may be attached to the metal layer 111. The heat dissipation substrate 121 may be disposed in the storage area 115, and a plurality of light emitting chips 124 or light emitting devices may be mounted on the heat dissipation substrate 121. The heat dissipation substrate 121 may be formed of a metal layer, an insulating layer, a wiring layer, and a protective layer, but the present invention is not limited thereto. The plurality of light emitting chips 124 may be arranged in a series, parallel, or series-parallel mixed structure by a circuit pattern of the heat dissipation substrate 121.

The optical lens 135 has a recess 136 formed in a region corresponding to the heat dissipation substrate 121 and a phosphor layer 139 formed in the recess 136. The phosphor layer 139 corresponds to the plurality of light emitting chips 124 and is wavelength-converted with respect to the light emitted from the plurality of light emitting chips 124. The optical lens 135 includes a hemispherical light exit surface 137 and adjusts the directivity angle of the incident light to emit light.

The lower surface of the optical lens 135 and the upper surface of the supporting substrate 110 correspond to each other and can be adhered to each other with an adhesive.

18 is a side sectional view showing a light source module according to a seventh embodiment. In the description of FIG. 18, the same portions as those of FIG. 17 will be described with reference to FIG.

Referring to Fig. 18, the optical lens 135 is coupled onto the storage area 115 in the support substrate 110. Fig. The width of the lower surface of the optical lens 135 may be smaller than the width of the storage area 115 and the coupling protrusion 138 of the optical lens 135 may be disposed in the storage area 115 have.

The phosphor layer 139 is formed in the recess 136 and its lower surface 139A is spaced apart from the bottom of the optical lens 135 and may correspond to a plurality of light emitting chips 124. The embodiment can improve the straightness of the directivity angle of light by arranging the hemispherical optical lens 135 having the phosphor layer 139 on the plurality of light emitting chips.

The recess portion 136 may be formed in a shape having a predetermined depth or curved surface, which may be selectively applied to the above-described embodiment, and the description of the embodiment will be referred to. Further, a recessed portion having a hemispherical shape or an upwardly convex shape may be formed on the lower portion of the phosphor layer, but the present invention is not limited thereto.

Further, the support substrate and the heat dissipation substrate may be electrically connected, but the present invention is not limited thereto.

The light source module according to the embodiment can be applied to the illumination system. The lighting system includes a structure in which a plurality of light source modules are arrayed and includes the display device shown in Figs. 19 and 20, the lighting device shown in Fig. 21, and may include an illumination lamp, a traffic light, a vehicle headlight, have.

19 is an exploded perspective view of a display device according to an embodiment.

19, the display device 1000 includes a light guide plate 1041, a light source module 1031 disclosed in the embodiment for providing light to the light guide plate 1041, and a reflection member 1022 under the light guide plate 1041. [ An optical sheet 1051 on the light guide plate 1041 and a display panel 1061 on the optical sheet 1051 and the light guide plate 1041 and the light source module 1031 and the reflection member 1022 But is not limited to, a bottom cover 1011.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 diffuses the light from the light source module 1031 to convert the light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >

The light source module 1031 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041 and ultimately serves as a light source of the display device.

At least one light source module 1031 is disposed in the bottom cover 1011 and may directly or indirectly provide light from one side of the light guide plate 1041. [ The light source module 1031 includes a circuit board 1033 and a light emitting element 1035. The light emitting element 1035 may be arrayed on the circuit board 1033 at predetermined intervals. The circuit board may be a printed circuit board, but is not limited thereto. The circuit board 1033 may include a metal core PCB (MCPCB), a flexible PCB (FPCB), or the like, but is not limited thereto. When the light emitting element 1035 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the circuit board 1033 can be removed. A part of the heat radiation plate may be in contact with the upper surface of the bottom cover 1011. Therefore, heat generated in the light emitting element 1035 can be emitted to the bottom cover 1011 via the heat dissipation plate.

The plurality of light emitting devices 1035 may be mounted on the circuit board 1033 such that the light emitting surface of the light emitting device 1035 is spaced apart from the light guiding plate 1041 by a predetermined distance. The light emitting device 1035 may directly or indirectly provide light to the light incident portion, which is one side of the light guide plate 1041, but the present invention is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and supplies the reflected light to the display panel 1061 to improve the brightness of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 transmits or blocks light provided from the light source module 1031 to display information. The display device 1000 can be applied to video display devices such as portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet concentrates incident light on the display panel 1061. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

The optical path of the light source module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the invention is not limited thereto.

20 is a view showing a display device having a light emitting element according to an embodiment.

20, the display device 1100 includes a bottom cover 1152, a circuit board 1120 in which a light emitting element 1124 is arranged under the optical lens of the above-described embodiment, an optical member 1154, (1155).

The light source module is the light source module disclosed in the embodiment, and may include an optical lens, a circuit board 1120, and a light emitting element 1124. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150.

The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto.

The optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methy methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses the incident light, and the horizontal and vertical prism sheets condense the incident light onto the display panel 1155. The brightness enhancing sheet reuses the lost light to improve the brightness .

The optical member 1154 is disposed on the light source module 1160 and performs surface light source, diffusion, and light condensation of light emitted from the light source module 1160.

21 is an exploded perspective view of a lighting device having a lighting device according to an embodiment.

21, the lighting apparatus according to the embodiment may include a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, and a socket 2800 have. Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may be a light source module having an optical lens according to an embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200 and may be coupled to the heat discharger 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint having a diffusion material. The light from the light source module 2200 can be scattered and diffused to emit to the outside using the milky white material.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light emitting device 2210, a connection plate 2230, and a connector 2250 according to an embodiment.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 into which the plurality of light emitting elements 2210 and the connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the light emitting device 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components may include, for example, a DC converter, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protection device for protecting the light source module 2200, The present invention is not limited thereto.

The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension portion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. The extension 2670 may be electrically connected to the socket 2800 through a wire.

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications not illustrated in the drawings are possible.

For example, each component specifically shown in the embodiments of the present invention can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

5, 6: light emitting device 10, 40, 50, 60, 70, 100:
11, 11A, 41, 51: lead frame 12, 42:
13, 43: Cavities 14, 24, 44, 54, 64, 74, 84, 124:
15, 25, 35, 45, 55, 65, 65A, 75, 85, 85A, 135:
16, 36, 46, 56, 66, 76, 86, 86A, 136:
19, 29, 39, 49, 59, 69,

Claims (16)

A body having an upper opened cavity;
A plurality of lead frames disposed in the cavity and spaced apart from each other;
A light emitting chip disposed on at least one of the plurality of lead frames; And
An optical lens disposed on the plurality of lead frames and the body and including a recessed portion formed at a predetermined depth on an incident surface on which light is incident;
A phosphor layer disposed in the recessed portion; And
And a barrier portion covering the side surface of the phosphor layer,
The barrier portion includes a reflective layer,
Wherein the barrier portion is disposed in a recessed region formed along an outer periphery of an incident surface of the optical lens,
Wherein the phosphor layer has a bottom surface in contact with an upper surface of the body,
And the upper surface of the phosphor layer is in contact with the optical lens. The method according to claim 1,
Wherein the barrier portion includes an open region, and the phosphor layer is disposed in an open region of the barrier portion. The method according to claim 1,
And the thickness of the barrier part is thicker than the thickness of the phosphor layer. The method according to claim 1,
Wherein the phosphor layer has a width larger than an upper width of the cavity. 5. The method of claim 4,
Wherein the optical lens includes a plurality of engaging projections spaced apart from each other around a lower portion thereof,
Wherein the plurality of coupling protrusions are vertically protruded outward from a side surface of the body. A support substrate including a storage area;
A radiator plate disposed in the storage area;
A plurality of light emitting chips disposed on the heat dissipation substrate;
An optical lens disposed on the support substrate and having a recess portion in a region corresponding to the heat dissipation substrate; And
And a phosphor layer disposed in the recessed portion,
Wherein the supporting substrate comprises a metal layer, an insulating layer on the metal layer, a wiring layer on the insulating layer, and a protective layer on the wiring layer,
Wherein the metal layer is exposed to the outside,
Wherein the supporting substrate includes an engaging hole recessed in the protective layer in the direction of the insulating layer, the insulating layer being exposed and surrounding the side surface of the receiving area,
And the engaging hole is engaged with the engaging projection of the optical lens protruding from the optical lens toward the supporting substrate. The method according to claim 6,
Wherein the coupling protrusions are surrounded by the insulating layer, the wiring layer, and the protection layer. 8. The method of claim 7,
Wherein the coupling protrusions and the plurality of light emitting chips are overlapped in a horizontal direction. 8. The method of claim 7,
And the coupling protrusion surrounds a side surface of the storage area. The method according to claim 6,
And the coupling hole penetrates the protective layer and the wiring layer. delete delete delete delete delete delete

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