KR101880469B1 - Light emitting device package and light unit having the same - Google Patents

Abstract

A light emitting device package according to an embodiment includes: a body having a cavity; A plurality of lead frames including first and second lead frames disposed at the bottom of the cavity; A first lead portion protruding from the first lead frame to a first side surface of the body; A second lead portion protruding from the second lead frame to a second side surface of the body; A first protective member formed on at least one surface of the first lead portion and formed of a material different from that of the first lead frame; A second protection member formed on at least one surface of the second lead portion, the second protection member being made of a material different from that of the second lead frame; A light emitting chip disposed on at least one of the plurality of lead frames; And a molding member molded on the light emitting chip and formed in the cavity.

Description

TECHNICAL FIELD [0001] The present invention relates to a light emitting device package, and a light unit having the light emitting device package.

The present invention relates to a light emitting device package and a light unit having the same.

BACKGROUND ART A light emitting device, for example, a light emitting device (Light Emitting Device) is a type of semiconductor device that converts electrical energy into light, and has been widely recognized as a next generation light source in place of existing fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor device, the light emitting diode consumes very low power compared to a fluorescent lamp that generates light by heating tungsten to generate light by incandescent lamps or by colliding ultraviolet rays generated through high-voltage discharges with phosphors .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, it has a longer lifetime, faster response characteristics, and an environment-friendly characteristic as compared with the conventional light source.

Accordingly, much research has been conducted to replace an existing light source with a light emitting diode, and a light emitting diode is increasingly used as a light source for various lamps used for indoor and outdoor use, lighting devices such as a liquid crystal display, an electric signboard, and a streetlight.

Embodiments provide a light emitting device package including a protective member to cover at least one surface of a lead frame protruding from a side surface of a body.

Embodiments provide a light emitting device package having a protection member protruding from a body so as to protect an upper surface of a lead frame protruding from a side surface of a body.

A light unit having a light emitting device package according to an embodiment is provided.

An embodiment includes a body including a first protective member and a second protective member and having a cavity; A plurality of lead frames including a first lead frame and a second lead frame spaced apart from each other on the bottom of the cavity; A first lead portion disposed below the first side surface of the body from the first lead frame and projecting further than the first side surface of the body; A second lead portion disposed below the second side surface of the body from the second lead frame and projecting more than the second side surface of the body; And a light emitting chip disposed on at least one of the plurality of lead frames, wherein the first protective member and the second protective member are disposed on the first lead portion and the second lead portion, respectively, The first protection member may cover the entire upper surface of the first lid part, and the second protection member may cover the entire top surface of the second lid part.

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The embodiment can protect the lead frame protruding from the body side of the light emitting device package.

In the embodiment, at least one surface of the lead frame protruding to the side surface of the body is covered with the protection member, thereby preventing oxidation of the surface of the lead frame and preventing moisture penetration.

The embodiment can improve the reliability of the light emitting device package.

The embodiment can improve the reliability of the light unit having the light emitting device package.

1 is a perspective view of a light emitting device package according to a first embodiment.
2 is a side sectional view of the light emitting device package of Fig.
3 is a perspective view of a light emitting device package according to a second embodiment.
4 is a side sectional view of the light emitting device package of Fig.
5 is a perspective view illustrating a display device having the light emitting device package of FIG.
6 is a view showing another example of a display device having the light emitting device package of FIG.
7 is a view showing a lighting device having the light emitting device package of FIG.

In the description of the embodiments, each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, Quot; on "and" under "include both being formed" directly "or" indirectly " . In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the drawings, dimensions are exaggerated, omitted, or schematically illustrated for convenience and clarity of illustration. Also, the size of each component does not entirely reflect the actual size. The same reference numerals denote the same elements throughout the description of the drawings.

Hereinafter, a light emitting device package according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view of a light emitting device package according to a first embodiment, and FIG. 2 is a side sectional view of the light emitting device package of FIG.

1 and 2, a light emitting device package 100 includes a body 10 having a concave portion 60, a first lead frame 21 having a first cavity 25, a second cavity 35, A second lead frame 31 having a first lead frame 31 and a second lead frame 31 covering the surfaces of the first and second lead frames 21 and 31, 18, light emitting chips 71, 72, wires 73 to 76, and a molding member 81. The protective members 17,

The body 10 may be formed of a resin material such as polyphthalamide (PPA), a silicon material, a metal material, a photo sensitive glass (PSG), a sapphire (Al ₂ O ₃ ), a silicone, an epoxy molding compound , And a printed circuit board (PCB). For example, the body 10 may be made of a resin material such as polyphthalamide (PPA). The body 10 includes a predetermined color, for example, a white resinous material.

As another example, the body 10 may be formed of a conductor having conductivity. When the body 10 is formed of a material having electric conductivity, an insulating film (not shown) is further formed on the surface of the body 10 so that the conductive body 10 covers the first cavity 25, the second cavity 35 And electrically shorted with the connection frame 46, as shown in Fig.

The shape of the body 10 may have various shapes such as a triangular shape, a square shape, a polygonal shape, and a shape having a circular shape and a curved shape when viewed from above. The body 10 includes a plurality of side surfaces 11 to 14 and at least one of the plurality of side surfaces 11 to 14 may be disposed perpendicular or inclined with respect to a lower surface of the body 10. [ The first side surface 11 and the second side surface 12 are opposite to each other and the third side surface 13 and the second side surface 12 are opposite to each other. The fourth side surfaces 14 are opposite to each other. The length of each of the first side surface 11 and the second side surface 12 may be different from the length of the third side surface 13 and the fourth side surface 14, The width of the side surface 12 (for example, the short side length) may be shorter than the length of the third side surface 13 and the fourth side surface 14. [ The width of the first side surface 11 or the second side surface 12 may be a distance between the third side surface 13 and the fourth side surface 14, And the center of the second cavity 25,35.

The first lead frame 21 and the second lead frame 31 are disposed on the lower surface of the body 10 and can be mounted on the substrate in a direct lower type. But it is not limited thereto. The thicknesses of the first lead frame 21 and the second lead frame 31 may be 0.2 mm ± 0.1 mm.

The body 10 is open at the top and has a recess 60 made up of a side and a bottom 16. The recess 60 may be formed in the shape of a concave cup structure, a cavity structure, or a recess structure from the top surface 15 of the body 10, but the present invention is not limited thereto. The circumferential surface of the concave portion 60 may be perpendicular or inclined to the bottom 16. The shape of the concave portion 60 viewed from above may be a circular shape, an elliptical shape, a polygonal shape (e.g., a square shape), and a polygonal shape with a curved corner.

The top surface 15 of the body 10 may be formed point-symmetrically or line-symmetrically with respect to the center of the light emitting device package by removing the cathode mark or the polarity mark. Here, the symmetrical shape may be formed symmetrically with respect to a line along which the corner portion of the light emitting device package, which faces the diagonal direction, faces the center or the center of the light emitting device package.

The first lead frame 21 is disposed in the first area of the recess 60 and is partially disposed on the bottom 16 of the recess 60 and is formed at the center thereof at the bottom of the recess 60, A concave first cavity 25 is arranged to have a lower depth than the first cavity 16. The first cavity 25 includes a concave shape such as a cup shape or a recess shape from the bottom 16 of the concave portion 60 to the bottom direction of the body 10.

The side surface and the bottom of the first cavity 25 are formed by the first lead frame 21 and the peripheral side surface of the first cavity 25 is inclined or vertically inclined from the bottom of the first cavity 25. [ It can be bent. The opposite sides of the side surface of the first cavity 25 may be inclined at the same angle or may be inclined at different angles.

The second lead frame 31 is disposed in a second area spaced apart from the first area of the concave part 60 and partially disposed on the bottom 16 of the concave part 60, A concave second cavity 35 is formed to have a lower depth than the bottom 16 of the concave portion 60. The second cavity 35 may have a concave shape such as a cup shape or a recess shape from the upper surface of the second lead frame 31 in the lower direction of the body 10. The bottom and side surfaces of the second cavity 35 are formed by the second lead frame 31 and the side surfaces of the second cavity 35 are inclined from the bottom of the second cavity 35, . The opposite sides of the side surface of the second cavity 35 may be inclined at the same angle or may be inclined at different angles.

The first cavity 25 and the second cavity 35 may have the same shape as viewed from above, but the present invention is not limited thereto. The bottom shapes of the first cavity 25 and the second cavity 35 may be circular or elliptical shapes having a rectangular shape, a regular square shape, or a curved shape.

Each of the center portions of the first lead frame 21 and the second lead frame 31 is exposed to the lower portion of the body 10 and may be disposed on the same plane as the lower face of the body 10, have.

The first lead frame 21 includes a first lead portion 23 and the first lead portion 23 is disposed below the first side 11 of the body 10 and the body 10 ) Of the first side 11 of the frame. The second lead frame 31 includes a second lead portion 33 and the second lead portion 33 is disposed below the second side 12 of the body 10, (12) of the first side (11). Holes or grooves may be formed in the first lead portion 23 and the second lead portion 33 and the protective members 17 and 18 may be coupled to the holes or grooves to enhance the bonding force .

The thickness T3 of the first lead portion 23 and the second lead portion 33 may be the same as the thickness of the first lead frame 21 and the second lead frame 31, It is not limited thereto.

A connection frame 46 is disposed on the bottom 16 of the recess 60 and the connection frame 46 is disposed between the first lead frame 21 and the second lead frame 31, It is used as a connection terminal.

The connection frame 46 is formed in a region between the first lead frame 21 and the second lead frame 31 in a region adjacent to the third side face 13 of the body 10. [ The connection frame 46 serves to support a region between the first lead frame 21 and the second lead frame 31. The gap portion 19 between the first lead frame 21 and the second lead frame 31 electrically separates the first lead frame 21 and the second lead frame 31 from each other. The first lead frame 21, the second lead frame 31, and the connection frame 46 are physically separated from each other.

The first lead frame 21, the second lead frame 31 and the connection frame 46 may be formed of a metal material such as titanium (Ti), copper (Cu), nickel (Ni), gold (Au) And may include at least one of chromium (Cr), tantalum (Ta), platinum (Pt), tin (Sn), silver (Ag), and phosphorous (P) and may be formed of a single metal layer or a multilayer metal layer. The thicknesses of the first and second lead frames 21 and 31 may be the same, but the present invention is not limited thereto.

The embodiment is formed with protective members 17 and 18 for protecting the exposed surfaces of the lead frames 21 and 31 projecting from the body 10. [

A first protective member 17 is formed on the surface of the first lead portion 23 of the first lead frame 21 and a second protective member 17 is formed on the surface of the second lead portion 33 of the second lead frame 31 2 protective member 18 is formed.

The first protection member 17 may be formed on at least one surface of the upper surface, the side surface, and the lower surface of the first lead portion 23, for example. The second protective member 18 may be formed on at least one surface of the upper surface, the side surface, and the lower surface of the second lead portion 33, for example, the upper surface.

The lower surface of the first protective member 17 may be equal to the upper surface area of the first lead portion 23 or may cover the entire upper surface of the first lead portion 23. The bottom surface of the second protection member 18 may be equal to the top surface area of the second lead portion 33 or may cover the entire upper surface of the second lead portion 33.

The length D2 of the first protection member 17 and the second protection member 18 is a distance distant from each of the side surfaces 11 and 12 of the body 10, The length of the second lead portion 33 may be equal to or wider than the length of the second lead portion 33. The length D2 may be in the range of 50 mu m or more, for example, 100-200 mu m.

The width D1 of the first protective member 17 and the second protective member 18 may be the same width or wider than the widths of the first and second lead portions 23 and 33, The present invention is not limited thereto. The width of the first and second lead portions 23 and 33 may be the same as or narrower than that of the first and second lead frames 21 and 31, but is not limited thereto.

The thickness T4 of the first and second protective members 17 and 18 may be about 40 to 60% of the thickness T2 of the body 10 shown in FIG. For example, the thickness T4 of the first and second protective members 17 and 18 may be 0.2 mm or more, and the thickness T2 of the body 10 may be 0.3 mm or more, for example, 0.4 to 0.8 mm Range. ≪ / RTI > The thickness T1 of the package may be in the range of 0.6 mm or more, for example, in the range of 0.6 to 1.0 mm. The thickness T4 of the first and second protective members 17 and 18 may be 10% to 50% of the thickness T1 of the package. The thickness T1 of the package may be expressed by a total thickness of the thickness T3 of the lead frames 21 and 31 and the thickness T1 of the body 10. [

The first and second protective members 17 and 18 may be made of the same material as the body 10. The first and second protective members 17 and 18 may be formed during the injection molding of the body 10 to protect the upper surfaces of the first and second lead portions 13 and 33 . That is, the first and second protective members 17 and 18 can protect the coating layer or the oxidation preventing layer coated on the surfaces of the first and second lead portions 13 and 33 from damage, It is also possible to prevent moisture from penetrating.

Further, the first lead portion 13 and the second lead portion 33 can be further projected from the side surfaces 11 and 12 of the body 10, thereby facilitating the trim process.

In the embodiment, the protective members 17 and 18 may be made of the same material as the material of the body 10, for example, PPA or other materials such as silicone or epoxy.

The protective members 17 and 18 are protruded outwardly from the first and second side surfaces 11 and 12 of the body 10 to a thickness thinner than the thickness of the body 10, (Not shown).

The upper surfaces of the first lead portion 23 and the second lead portion 33 may be formed as irregular surfaces or rough surfaces or may be formed as bent surfaces to enhance adhesion with the protective members 17 and 18 You can give. The lower surfaces of the protective members 17 and 18 may be disposed on the same horizontal plane as the upper surfaces of the first and second lead portions 23 and 33, or at least partly on different planes.

The first light emitting chip 71 is disposed in the first cavity 25 of the first lead frame 21 and the second light emitting chip 17 is disposed in the second cavity 35 of the second lead frame 31 72 may be disposed.

The first and second light emitting chips 71 and 72 can selectively emit light in a range of visible light band to ultraviolet light band. For example, a red LED chip, a blue LED chip, a green LED chip, a yellow green LED Chip. The first and second light emitting chips 71 and 72 include compound semiconductor light emitting devices of group III-V elements. Although the light emitting chips 71 and 72 are arranged in a horizontal chip structure, the light emitting chips 71 and 72 may be arranged in a vertical chip structure in which two electrodes are arranged up and down. The frame can be connected with a wire.

The first light emitting chip 71 is connected to the first lead frame 21 disposed on the bottom 16 of the concave portion 60 by the first wire 73 and connected to the first lead frame 21 by the second wire 74, And is connected to the frame 46. The second light emitting chip 72 is connected to the connection frame 46 by a third wire 75 and is connected to a second lead 76 disposed on the bottom 16 of the recess 60 by a fourth wire 76. [ And is connected to the frame 31. The connection frame 46 electrically connects the first light emitting chip 71 and the second light emitting chip 72.

The protection element may be disposed on a part of the first lead frame 21 or the second lead frame 31. The protection device may be implemented with a thyristor, a zener diode, or a TVS (Transient Voltage Suppression), and the zener diode protects the light emitting chip from ESD. The protection element is connected to the connection circuit of the first light emitting chip 71 and the second light emitting chip 72 in parallel, thereby protecting the light emitting chips 71 and 72.

The molding member 81 may be formed in the concave portion 60, the first cavity 25, and the second cavity 35. The molding member 81 includes a light-transmitting resin layer such as silicon or epoxy, and may be formed as a single layer or a multilayer.

The molding member 81 may include a phosphor for converting the wavelength of light emitted onto the light emitting chips 71 and 72. The phosphor may be disposed between the first cavity 25 and the second cavity 35 The molding member 81 may be formed on at least one of the surfaces of the molding member 81, but the present invention is not limited thereto. The phosphor excites a part of the light emitted from the light emitting chips 71 and 72 to emit light of a different wavelength. The phosphor may be selectively formed from YAG, TAG, Silicate, Nitride, and Oxy-nitride based materials. The phosphor may include at least one of a red phosphor, a yellow phosphor, and a green phosphor, but the present invention is not limited thereto. The surface of the molding member 81 may be formed in a flat shape, a concave shape, a convex shape, or the like. For example, the surface of the molding member 81 may be formed as a concave curved surface, It can be an exit plane.

The light emitting device package 100 also protects the lead portions 23 and 33 exposed to the outside of the body 10 by the protective members 17 and 18 to suppress moisture penetration, It is possible to suppress the discoloration and oxidation of the ink.

FIG. 3 is a perspective view of a light emitting device package according to a second embodiment, and FIG. 4 is a side sectional view of the light emitting device package of FIG.

3 and 4, the light emitting device package includes a body 111 having a cavity 112 with an open top, a first lead frame 121 and a second lead frame 131 mounted on the body 111, A molding member 145, and a light-emitting chip 141. The light-

The body 111 may be injection molded selectively from a highly reflective resin-based (e.g., PPA), polymer, or plastic series, or may be formed as a single layer or multilayer substrate laminated structure. The body 111 may be made of a white resin or a material having a predetermined color.

The body 111 includes a cavity 112 having an open top, and the circumferential surface of the cavity 112 may be inclined or perpendicular to the bottom of the cavity.

A first lead frame 121 and a second lead frame 131 are disposed on the bottom of the cavity 112. The first lead frame 121 and the second lead frame 131 are connected to the gap 114 Respectively.

A light emitting chip 141 is disposed on at least one of the first lead frame 121 and the second lead frame 131 and the wire 142 is connected to the first lead frame 121 and the second lead frame 131 ).

A molding member 145 is formed in the cavity 112. The molding member 145 may be formed of a light transmitting resin such as silicon or epoxy and may include a phosphor.

The first lead frame 121 includes a first lead portion 122 and the first lead portion 122 is disposed below the first side 11 of the body 111 and the body 111, The first side 11 of the base plate 11 can be more protruded. The second lead frame 131 includes a second lead portion 132 and the second lead portion 132 is disposed below the second side surface 12 of the body 111, (12) of the first side (11). The materials of the first lead frame 121 and the second lead frame 131 will be described with reference to the first embodiment.

A first protective member 117 is formed on at least one surface of the first lead portion 122 and a second protective plug 118 is formed on at least one surface of the second lead portion 132.

The first protective member 117 may be formed on at least one surface, for example, an upper surface, an upper surface, a side surface, and a lower surface of the first lead portion 122. The second protective member 118 may be formed on at least one surface of the upper surface, the side surface, and the lower surface of the second lead portion 132, for example, the upper surface.

The bottom surface area of the first protective member 117 may be equal to the top surface area of the first lead part 122 or may be an area covering the entire top surface of the first lead part 122. The lower surface of the second protection member 118 may be equal to the upper surface area of the second lead portion 132 or may cover the entire upper surface of the second lead portion 132.

The length of the first protective member 117 and the length of the second protective member 118 are distances from the side surfaces 11 and 12 of the body 111, .

The width D3 of the first protective member 117 and the second protective member 118 may be equal to or wider than the widths of the first and second lead portions 122 and 132, The present invention is not limited thereto. The width of the first and second lead portions 122 and 132 may be the same as or narrower than that of the first and second lead frames 121 and 131, but is not limited thereto.

The thickness T8 of the first and second protective members 117 and 118 may be about 40 to 60% of the thickness T6 of the body 111 as shown in FIG. For example, the thickness T8 of the first and second protective members 117 and 118 may be 0.2 mm or more, and the thickness T6 of the body 111 may be 0.3 mm or more, for example, 0.4 to 0.8 mm. . The thickness T5 of the package may be in the range of 0.6 mm or more, for example, in the range of 0.6 to 1.0 mm. The thickness T8 of the first and second protective members 117 and 118 may be not less than 10% and not more than 50% of the thickness T5 of the package. The thickness T5 of the package may be expressed by the sum of the thickness T7 of the lead frames 121 and 131 and the thickness T6 of the body 10. [

The first and second protective members 117 and 118 may be made of the same material as the body 111. [ The first and second protection members 117 and 118 may be formed during the injection molding of the body 111 to protect the upper surfaces of the first and second lead portions 122 and 132 do. That is, the first and second protective members 117 and 118 can protect the coating layer or the oxidation preventing layer coated on the surfaces of the first and second lead parts 122 and 132 from damage, Can be prevented from penetrating.

Further, the first lead portion 122 and the second lead portion 132 can be further projected from the side surfaces 111 and 112 of the body 111, thereby facilitating the trimming process.

For example, the protective members 117 and 118 may be made of the same material as that of the body 111, for example, PPA, or may be made of another material such as silicone or epoxy.

The protective members 117 and 118 protrude outwardly from the first and second side surfaces 11 and 12 of the body 111 to a thickness smaller than the thickness of the body 111, As shown in FIG.

The upper surfaces of the first and second lead portions 122 and 132 may be formed as irregular surfaces or rough surfaces or may be formed as bent surfaces to enhance adhesion with the protective members 117 and 118 have. The lower surfaces of the protective members 117 and 118 may be disposed on the same horizontal plane as the upper surfaces of the first and second lead portions 122 and 132, or at least partially on different planes.

The light emitting device package according to the embodiment can be applied to the illumination system. The lighting system includes a structure in which a plurality of light emitting device packages are arrayed and includes the display device shown in Figs. 5 and 6, the lighting device shown in Fig. 7, and includes an illumination lamp, a traffic light, a vehicle headlight, .

5 is an exploded perspective view of a display device according to an embodiment.

5, a display device 1000 includes a light guide plate 1041, a light emitting module 1031 for providing light to the light guide plate 1041, a reflection member 1022 under the light guide plate 1041, An optical sheet 1051 on the light guide plate 1041, a display panel 1061 on the optical sheet 1051, and a bottom cover 1011 for storing the light guide plate 1041, the light emitting module 1031 and the reflecting member 1022 , But is not limited thereto.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 diffuses the light from the light emitting module 1031 to convert the light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >

The light emitting module 1031 is disposed on at least one side of the light guide plate 1041 to provide light to at least one side of the light guide plate 1041 and ultimately to serve as a light source of the display device.

At least one light emitting module 1031 may be disposed in the bottom cover 1011 and may directly or indirectly provide light from one side of the light guide plate 1041. The light emitting module 1031 includes a module substrate 1033 and a light emitting device package 100 according to the embodiment described above and the light emitting device package 100 is mounted on the module substrate 1033 at a predetermined interval, . The module substrate may be, but is not limited to, a printed circuit board. The module substrate 1033 may include a metal core PCB (MCPCB), a flexible PCB (FPCB), or the like, but is not limited thereto. When the light emitting device package 100 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the module substrate 1033 can be removed. A part of the heat radiation plate may be in contact with the upper surface of the bottom cover 1011. Accordingly, heat generated in the light emitting device package 100 can be emitted to the bottom cover 1011 via the heat dissipation plate.

The plurality of light emitting device packages 100 may be mounted on the module substrate 1033 such that the light emitting surface of the plurality of light emitting device packages 100 is spaced apart from the light guiding plate 1041 by a predetermined distance. The light emitting device package 100 may directly or indirectly provide light to the light-incident portion, which is one side of the light guide plate 1041, but is not limited thereto. The plurality of light emitting device packages 100 according to the embodiment may be formed by protecting the lid portions 23 and 33 using the protection members 17 and 18 on the outside of the body 10 as shown in FIG. ) Can be improved.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 and supplies the reflected light to the display panel 1061 to improve the brightness of the display panel 1061. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light emitting module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to a top cover (not shown), but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 transmits or blocks light provided from the light emitting module 1031 to display information. The display device 1000 can be applied to video display devices such as portable terminals, monitors of notebook computers, monitors of laptop computers, and televisions.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal / vertical prism sheet, a brightness enhanced sheet, and the like. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet concentrates incident light on the display panel 1061. The brightness enhancing sheet reuses the lost light to improve the brightness I will. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

The optical path of the light emitting module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the present invention is not limited thereto.

6 is a view illustrating a display device having a light emitting device package according to an embodiment.

6, the display device 1100 includes a bottom cover 1152, a module substrate 1120 on which the above-described light emitting device package 100 is arrayed, an optical member 1154, and a display panel 1155 do.

The module substrate 1120 and the light emitting device package 100 may be defined as a light emitting module 1160. The bottom cover 1152, at least one light emitting module 1160, and the optical member 1154 may be defined as a light unit (not shown).

The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto.

The optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methy methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses the incident light, and the horizontal and vertical prism sheets condense the incident light onto the display panel 1155. The brightness enhancing sheet reuses the lost light to improve the brightness .

The optical member 1154 is disposed on the light emitting module 1160 and performs surface light source, diffusion, and light condensation of the light emitted from the light emitting module 1160.

7 is a perspective view of a lighting apparatus according to an embodiment.

7, the lighting apparatus 1500 includes a case 1510, a light emitting module 1530 installed in the case 1510, a connection terminal (not shown) installed in the case 1510 and supplied with power from an external power source 1520).

The case 1510 is preferably formed of a material having a good heat dissipation property, and may be formed of, for example, a metal material or a resin material.

The light emitting module 1530 may include a module substrate 1532 and a light emitting device package 100 mounted on the module substrate 1532 according to an embodiment. A plurality of the light emitting device packages 100 may be arrayed in a matrix or at a predetermined interval.

The module substrate 1532 may have a circuit pattern printed on an insulator. For example, the module substrate 1532 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB , FR-4 substrate, and the like.

In addition, the module substrate 1532 may be formed of a material that efficiently reflects light, or may be a coating layer of a color such as white, silver, or the like whose surface is efficiently reflected.

At least one light emitting device package 100 may be mounted on the module substrate 1532. Each of the light emitting device packages 100 may include at least one LED (Light Emitting Diode) chip. The LED chip may include a light emitting diode in a visible light band such as red, green, blue or white, or a UV light emitting diode that emits ultraviolet (UV) light.

The light emitting module 1530 may be arranged to have a combination of various light emitting device packages 100 to obtain color and brightness. For example, a white light emitting diode, a red light emitting diode, and a green light emitting diode may be arranged in combination in order to secure a high color rendering index (CRI).

The connection terminal 1520 may be electrically connected to the light emitting module 1530 to supply power. The connection terminal 1520 is connected to the external power source by being inserted in a socket manner, but the present invention is not limited thereto. For example, the connection terminal 1520 may be formed in a pin shape and inserted into an external power source or may be connected to an external power source through wiring.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10, 111: Body 25, 35, 112: Cavity
21, 31, 121, 131: lead frames 27, 127, 128, 129:
17, 18, 117, 118: protective member 46: connecting frame
71, 72, 145: light emitting chip 81, 145:
100: Light emitting device package

Claims (9)

A body including a first protection member and a second protection member and having a cavity;
A plurality of lead frames including a first lead frame and a second lead frame spaced apart from each other on the bottom of the cavity;
A first lead portion disposed below the first side surface of the body from the first lead frame and projecting further than the first side surface of the body;
A second lead portion disposed below the second side surface of the body from the second lead frame and projecting more than the second side surface of the body; And
And a light emitting chip disposed on at least one of the plurality of lead frames,
The first protection member and the second protection member are disposed on the first lead portion and the second lead portion, respectively,
Wherein the first protection member covers the entire upper surface of the first lid part and the second protection member covers the entire upper surface of the second lid part. The method according to claim 1,
The width of the first protection member and the second protection member is equal to or larger than the width of the first lead portion and the second lead portion. 3. The method according to claim 1 or 2,
Wherein a bottom surface area of the first protective member and the second protective member is equal to an area of a top surface of the first lead portion and the second lead portion. The method according to claim 1,
Wherein the first lead portion and the second lead portion are formed with holes or grooves, respectively, and are coupled to the first protection member and the second protection member, respectively. 5. The method of claim 4,
Wherein the connection frame is formed in a region between the first lead frame and the second lead frame and in a region adjacent to the third side of the body.
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