KR101655505B1 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
KR101655505B1
KR101655505B1 KR1020130067826A KR20130067826A KR101655505B1 KR 101655505 B1 KR101655505 B1 KR 101655505B1 KR 1020130067826 A KR1020130067826 A KR 1020130067826A KR 20130067826 A KR20130067826 A KR 20130067826A KR 101655505 B1 KR101655505 B1 KR 101655505B1
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KR
South Korea
Prior art keywords
lead frame
disposed
light emitting
cavity
emitting device
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KR1020130067826A
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Korean (ko)
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KR20140145410A (en
Inventor
오성주
Original Assignee
엘지이노텍 주식회사
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Priority to KR1020130067826A priority Critical patent/KR101655505B1/en
Publication of KR20140145410A publication Critical patent/KR20140145410A/en
Application granted granted Critical
Publication of KR101655505B1 publication Critical patent/KR101655505B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
    • H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/32257—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic the layer connector connecting to a bonding area disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

A light emitting device according to an embodiment includes a body including a cavity; A first lead frame extending from the bottom of the cavity toward the first side of the body; A second lead frame extending from the bottom of the cavity toward the second side of the body; A light emitting chip disposed on at least one of the first and second lead frames in the cavity; A gap portion disposed between the first and second lead frames; A protective chip disposed on the second lead frame and disposed between an upper surface of the body and the second lead frame; At least one coupling hole formed along the periphery of the protection chip of the second lead frame; And a coupling portion in which a part of the body extends in the coupling hole.

Description

[0001] LIGHT EMITTING DEVICE [0002]

The present invention relates to a light emitting device.

BACKGROUND ART A light emitting device, for example, a light emitting device (Light Emitting Device) is a type of semiconductor device that converts electrical energy into light, and has been widely recognized as a next generation light source in place of existing fluorescent lamps and incandescent lamps.

Since the light emitting diode generates light by using a semiconductor element, the light emitting diode consumes very low power as compared with an incandescent lamp that generates light by heating tungsten, or a fluorescent lamp that generates ultraviolet light by impinging ultraviolet rays generated through high-pressure discharge on a phosphor .

In addition, since the light emitting diode generates light using the potential gap of the semiconductor device, the light emitting diode has a longer life span, a faster response characteristic, and an environment-friendly characteristic than conventional light sources. And light emitting diodes are increasingly used as light sources for various lamps used for indoor and outdoor use, lighting devices such as liquid crystal display devices, electric sign boards, and street lamps.

Embodiments provide a light emitting device having a protective chip embedded between a body and at least one of a plurality of lead frames.

Embodiments provide a light emitting device in which one or a plurality of coupling holes of a lead frame are formed around a protective chip, and a part of the body is coupled to the coupling hole.

The embodiment provides a light emitting device having a recess portion connected to a coupling hole disposed around the protective chip at a lower portion of the lead frame.

A light emitting device according to an embodiment includes a body including a cavity; A first lead frame extending from the bottom of the cavity toward the first side of the body; A second lead frame extending from the bottom of the cavity toward the second side of the body; A light emitting chip disposed on at least one of the first and second lead frames in the cavity; A gap portion disposed between the first and second lead frames; A protective chip disposed on the second lead frame and disposed between an upper surface of the body and the second lead frame; At least one coupling hole formed along the periphery of the protection chip of the second lead frame; And a coupling portion in which a part of the body extends in the coupling hole.

Embodiments can mitigate the external impact transmitted to the periphery of the protection chip by disposing at least one coupling portion around the protection chip embedded in the body in the light emitting device.

The embodiment can prevent the protection chip disposed in the body of the light emitting element from being lifted.

The embodiment can improve the electrical reliability of the protection chip in the body of the light emitting device.

The embodiment can improve the light extraction efficiency by removing the protection chip in the cavity of the light emitting element.

The embodiment can improve the electrical reliability of the light emitting device.

The embodiment can improve the reliability of the light emitting device and the lighting device having the same.

1 is a plan view of a light emitting device according to a first embodiment.
Fig. 2 is a cross-sectional view of the light-emitting device of Fig. 1 on the AA side.
3 is a cross-sectional view of the light-emitting device of Fig. 1 on the BB side.
4 is a partially enlarged view of the light emitting device of Fig.
FIG. 5 is a view showing a protection chip and a coupling hole disposed on the second lead frame in the light emitting device of FIG. 1;
FIG. 6 is a bottom view of the first and second lead frames in the light emitting device of FIG. 1; FIG.
7 is a view showing another example of the light emitting device of FIG.
8 to 14 are views showing another example of the coupling hole of the second lead frame according to the embodiment.
15 to 17 are views showing another example of the recessed portion of the second lead frame according to the embodiment.
18 is a side cross-sectional view showing a protection and coupling hole in the light emitting device according to the second embodiment.
19 is a plan view showing a light emitting device according to the third embodiment.
20 is a plan view showing a light emitting device according to a fourth embodiment.
21 is a cross-sectional side view of the light emitting device of Fig. 20 on the CC side.
22 is a perspective view of a display device having a light emitting element according to the embodiment.
23 is a side cross-sectional view showing another example of a display device having a light emitting element according to the embodiment.
24 is an exploded perspective view of a lighting apparatus having a light emitting element according to the embodiment.

In the description of the embodiments, it is described that each substrate, frame, sheet, layer or pattern is formed "on" or "under" each substrate, frame, sheet, In this case, "on" and "under " all include being formed either directly or indirectly through another element. In addition, the upper or lower reference of each component is described with reference to the drawings. The size of each component in the drawings may be exaggerated for the sake of explanation and does not mean the size actually applied.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. In the drawings, dimensions are exaggerated, omitted, or schematically illustrated for convenience and clarity of illustration. Also, the size of each component does not entirely reflect the actual size. The same reference numerals denote the same elements throughout the description of the drawings.

Hereinafter, a light emitting device according to an embodiment will be described with reference to the accompanying drawings.

FIG. 1 is a plan view of a light emitting device according to a first embodiment, FIG. 2 is a cross-sectional view of the light emitting device of FIG. 1 taken along line AA, FIG. 3 is a cross- FIG. 5 is a view showing a protection chip and a coupling hole disposed on the second lead frame in the light emitting device of FIG. 1, and FIG. 6 is a sectional view of the light emitting device of FIG. And a bottom view of the frame.

1 to 6, the light emitting device 100 includes a body 111 having a cavity 112, a cavity 111 extending from the bottom of the cavity 112 in the direction of the first side 11 of the body 111, A first lead frame 121, a second lead frame 123 extending from the bottom of the cavity 112 in the direction of the second side 12 of the body 111, first and second lead frames 121 and 123 A protection chip 161 disposed between at least one of the first and second lead frames 121 and 123 and the upper surface of the body 111, the protection chip 161, And a wire 165 connecting one of the first and second lead frames 121 and 123 to each other.

The body 111 may include at least one of a light transmitting material, a reflective material, and an insulating material. The body 111 may be formed of a material having a reflectivity higher than that of the light emitted from the light emitting chip 151, for example, a material having a reflectance of 70% or more. When the reflectance of the body 111 is 70% or more, the body 111 may be defined as a non-transparent material. The body 111 of insulating material, for example, polyphthalamide resin series (PPA: Polyphthalamide), a resin material, a silicon (Si), metallic material, PSG (photo sensitive glass), such as epoxy or silicon material, sapphire (Al 2 O 3 , and a printed circuit board (PCB).

The body 111 may be formed of a thermosetting resin including silicon, an epoxy resin, or a plastic material, or a material having high heat resistance and high light resistance. The above-mentioned silicon includes a white-based resin. Also, the body 111 may be selectively added with an acid anhydride, an antioxidant, a release agent, a light reflector, an inorganic filler, a curing catalyst, a light stabilizer, a lubricant, and titanium dioxide. . The body 111 may be formed of at least one member selected from the group consisting of an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylic resin, and a urethane resin. For example, an epoxy resin comprising triglycidylisocyanurate, hydrogenated bisphenol A diglycidyl ether and the like and an acid comprising hexahydrophthalic anhydride, 3-methylhexahydrophthalic anhydride, 4-methylhexahydrophthalic anhydride and the like DBU (1,8-Diazabicyclo (5,4,0) undecene-7) as a curing accelerator in an epoxy resin, ethylene glycol, titanium oxide pigment and glass fiber as a cocatalyst were added, A solid epoxy resin composition that has been cured and B-staged can be used. However, the present invention is not limited thereto.

In addition, a light shielding material or a diffusing agent may be mixed in the body 111 to reduce light transmitted through the body 111. In order to provide the body 111 with a predetermined function, at least one member selected from the group consisting of a diffusing agent, a pigment, a fluorescent substance, a reflective substance, a light-shielding substance, a light stabilizer and a lubricant is suitably mixed with the thermosetting resin .

The body 111 may include a metal oxide such as epoxy or silicon, and the metal oxide may include at least one of TiO 2 , SiO 2 and Al 2 O 3 . % ≪ / RTI >

The body 111 may be formed of a conductor having conductivity. If the body 111 is made of an electrically conductive material, an insulating layer (not shown) may be formed on the surface of the body 111, and a metal layer serving as a lead frame may be formed on the insulating layer. For convenience of description, the embodiment will be described in which the body 111 is formed of a resin material of an insulating material. The body 111 may be made of a reflective material or a transparent material, but the present invention is not limited thereto.

The body 111 may have a curved surface or an angled surface, for example, the top view may have a circular or polygonal shape. For convenience of description, the embodiment will be described with a structure in which the shape of the top view of the body 111 is polygonal.

The body 111 includes a plurality of side surfaces 11-14, an upper surface 15 and a lower surface. One or two or more side surfaces of the plurality of side surfaces 11-14 may be arranged perpendicular or inclined to the lower surface of the body 110 or the lower surfaces of the first and second lead frames 121 and 123. The first side surface 11 and the second side surface 12 of the side surface 11-14 of the body 111 correspond to each other and the width thereof may be the width of the first and second lead frames 121 and 123, . ≪ / RTI > The third side surface 13 and the fourth side surface 14 correspond to each other, and the length thereof may be the length of the light emitting device. The length of the third side surface 13 or the fourth side surface 14 may be equal to or greater than 1.5 times the width of the first side surface 11 or the second side surface 12.

The cavity 112 of the body 111 has a lower depth than the top surface 15 in the center region and is a region where light is emitted. The cavity 112 may include a recessed cup structure or a recessed structure from the upper surface 15 of the body 111, but the present invention is not limited thereto. The inner side surface 21 of the cavity 112 may be inclined or perpendicular to the bottom of the cavity 112 or the upper surfaces of the first and second lead frames 121 and 123. The corner portion between the inner side surfaces 21 may be an angular surface or a curved surface, but is not limited thereto.

A plurality of lead frames, for example, two or more lead frames, may be disposed on the bottom of the cavity 112. Two lead frames 121 and 123 may be disposed on the bottom of the cavity 112. For example, the first and second lead frames 121 and 123 may be spaced apart from each other. The first and second lead frames 121 and 123 may be formed of a metal material such as titanium, copper, nickel, gold, chromium, tantalum, And may include at least one of platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), iron (Fe), tin (Sn), zinc (Zn) And may be formed in multiple layers. The thickness T2 of the first and second lead frames 121 and 123 may be in a range of 0.4 mm or more, for example, 0.4 mm to 1.5 mm, for example, in a range of 0.5 mm to 1 mm.

The first lead frame 121 extends from the gap 115 at the bottom of the cavity 112 in the direction of the first side 11 of the body 111 and the outer end of the first lead frame 121 extends from the first side 11, As shown in FIG. The second lead frame 123 extends from the gap portion 115 at the bottom of the cavity 112 in the direction of the second side 12 of the body 111 and the outer end of the second lead frame 123 extends toward the second side 12, As shown in FIG. The first lead frame 121 and the second lead frame 123 may be mounted on a PCB or other conductive pattern, but the present invention is not limited thereto.

The gap part 115 is disposed between the first lead frame 121 and the second lead frame 123 and may be formed of an insulating material. The material of the gap portion 115 may be the same as or different from that of the body 111. The gap portion 116 can prevent the penetration of moisture into the interface between the first lead frame 121 and the second lead frame 123. To this end, the upper portion of the gap portion 115 can be brought into contact with the upper surfaces of the first and second lead frames 121 and 123, thereby increasing the contact area with the lead frames, have.

The lower surface of the first lead frame 121 and the lower surface of the second lead frame 123 and the lower surface of the body 111 may be disposed on the same plane. The present invention is not limited thereto. That is, since the first and second lead frames 121 and 123 are disposed at positions lower than the bottom of the cavity 112, the light emitting device of the embodiment has a cup or a thickness of a light emitting device having a lead frame bent in a cavity structure It can be provided with a thin thickness as compared with the case of FIG. Further, since the first and second lead frames 121 and 123 are provided with a flat bottom surface, the heat radiation efficiency can be improved. The top surface area of the first and second lead frames 121 and 123 may be wider than the bottom surface area. As another example, the first and second lead frames 121 and 131 may include a concave cup structure having a light emitting chip, but the present invention is not limited thereto.

The protection chip 161 may be electrically connected to the light emitting chip 151 to protect the light emitting chip 151. The protection chip 161 is bonded to the second lead frame 123 with an adhesive member 163 and electrically connected to the second lead frame 123. The adhesive member 163 may be a conductive adhesive. The protection chip 161 is connected to the first lead frame 121 by a wire 165. The protection chip 161 and the wire 165 are embedded in the body 111 in contact with the body 111, for example. As another example, the protection chip 161 may be electrically connected to the other lead frames 121 and 131 through a plurality of wires, but the present invention is not limited thereto.

1 and 3, the protection chip 161 is disposed between the upper surface 15 of the body 111 and the second lead frame 123 and the inner surface 21 of the cavity 112, And a side (13) of the body (111). The protection chip 161 is spaced apart from the cavity 112 so that loss of light emitted from the light emitting chip 151 disposed in the cavity 112 can be suppressed and the degree of freedom in designing the light emitting chip 151 .

The gap T3 between the second lead frame 123 and the upper surface 15 of the body 111 may be spaced by 200 mu m or more and the gap T3 may be a height at which the wire 165 is not exposed Lt; / RTI > The protection chip 161 may be implemented with a thyristor, a zener diode, or a TVS (Transient Voltage Suppression), and the zener diode protects the light emitting chip 151 from ESD (Electro Static Discharge).

The gap between the inner side surface 21 of the cavity 112 and the third side surface 13 of the body 111 is larger than the gap between the inner side surface 21 of the cavity 112 and the fourth side surface 14 of the body 111. [ As shown in FIG. This can provide a space for mounting the protection chip 161. [

2 to 4, the first lead frame 121 includes a first recess portion 30 and a first hole 17, and the first recess portion 30 has a first recess portion 30, Is recessed at a predetermined depth (X2) in the direction of the first side (11) of the body (111). A portion of the body 111 may be disposed in the first recess portion 30 and a portion of the body 111 may be connected to the gap portion 115. The height T1 of the first recess portion 30 may be equal to or less than half the thickness T2 of the first lead frame 121. The height of the first recess portion 30 The stiffness of the first lead frame 121 may be lowered.

The first holes (17) may be formed in the first lead frame (121), and a part of the body (111) is inserted. The first hole 17 may have a circular or polygonal shape and the coupling force between the body 111 and the first lead frame 121 may be increased depending on the shape and length of the first hole 17. [ have.

The second lead frame 123 includes a second recess portion 31, a second hole 18 and a coupling hole 41. The second recess portion 31 includes the gap portion 115 To the second side surface 12 of the body 111 at a predetermined depth X1. The height T1 of the second recess 31 may be equal to or less than half the thickness T2 of the second lead frame 123. The height of the second recess 31 The stiffness of the second lead frame 123 may be deteriorated. The second recess portion 31 may be coupled to the support portion 25 of the body 111 and the support portion 25 of the body 111 may be connected to the gap portion 115.

The depth X1 of the second recess portion 31 may be deeper than the depth X2 of the first recess portion 30 and the depth X2 of the second recess portion 31 may be larger than the depth T2 of the second lead frame 123. [ It can be formed deeply. The depth X1 of the second recessed portion 31 is formed deeper than the distance from the gap portion 115 to the protective chip 161. For example, As shown in Fig.

The second holes 18 may be formed in the first lead frame 121 or a plurality of the second holes 18, and a part of the body 111 may be inserted. The second hole 18 may have a circular or polygonal shape and the coupling strength between the body 111 and the second lead frame 131 may be increased depending on the shape and length of the second hole 18. [ have.

The coupling holes 41 are disposed around the protection chip 161 in the area of the second lead frame 123 and may be disposed in one or more than one. The coupling hole 41 may be, for example, a shape penetrating in a direction perpendicular to the second lead frame 123. The engaging portion 26 of the body 111 is engaged with the engaging hole 41 and the engaging portion 26 is connected to the supporting portion 25 of the body 111. The width D1 of the coupling hole 41 may be 0.15 mm or more or 60% or more of the thickness T2 of the second lead frame 123. The width D1 of the coupling hole 41 may be 300% or less of the thickness T2 of the second lead frame 123, for example, 200% or less. If the width D1 of the coupling hole 41 is too narrow, it may be difficult to form the coupling portion 26. If the width D1 is too wide, the coupling force between the coupling portion 26 and the second lead frame 123 Can be. The width D1 may be defined as a diameter when the coupling hole 41 is circular.

The distance D2 between the coupling hole 41 and the protective chip 161 may be smaller than the width D1 of the coupling hole 41 and may be a distance D2 of 0.20 mm or less, mm. < / RTI > Further, the distance D2 may be smaller than the length of either one of the sides of the protection chip 161. The position of the coupling hole 41 may be located at a position where it contacts the adhesive member 163 disposed around the lower surface of the protective chip 161 or may be spaced from the outer surface of the protective chip 161 by 0.20 mm or less (D2). The engaging portion 26 disposed in the engaging hole 41 may be weakened as a buffer when it is spaced from the periphery of the protective chip 161 by the distance D2, Can be weakened.

3 and 4, the support portion 25 is connected to the gap portion 115 and the coupling portion 26, and supports the coupling portion 26. As shown in FIGS. Accordingly, when the body 111 is thermally deformed by thermal contraction or expansion, the engaging portion 26 is vertically supported by the engagement with the supporting portion 25. [ When the body 111 is thermally deformed, the protection chip is protected by the coupling part 26, the gap part 115 and the support part 25, The impact transmitted to the protection chip 161 can be reduced. As a result, the protective chip 161 is prevented from lifting from the second lead frame 123, so that the electrical reliability of the protective chip 161 can be prevented from being deteriorated.

The coupling part 26 extends in the form of a column perpendicular to the periphery of the protection chip 161 to reduce an impact transmitted to the protection chip 161 when the body 111 is injected, And can act as a buffer when an impact due to thermal deformation of the body 111 is transmitted after injection of the body 111. Also, since the coupling portion 26 is connected by the lower supporting portion 25, the flow of the coupling portion 26 can be reduced by the supporting portion 25. Since the coupling portion 26 is connected to the support portion 25 of the body 111 in the horizontal direction and the vertical direction, the external impact of the buffering portion 161 around the protection chip 161, for example, You can give. The engaging portion 26 disclosed in the above embodiment can reduce the flow of the wire 165 bonded to the protection chip 161 so that the wire 165 can be protected. The protection chip 161 is disposed on the upper surface of the second lead frame 123 of the first and second lead frames 121 and 123. However, the protection chip 161 may be formed on one of the first and second lead frames 121 and 123 As shown in FIG. When the protection chip 161 is disposed under the second lead frame 123, a part of the body 111 may be thicker than a bottom of the protection chip 161 and the wire.

A light emitting chip 151 may be disposed in the cavity 112 and the light emitting chip 151 may be disposed on a lead frame or a lead frame different from the lead frame in which the protective chip 161 is disposed , But is not limited thereto. As another example, a plurality of light emitting chips may be disposed in the cavity 112, but the present invention is not limited thereto.

The light emitting chip 151 is bonded to the first lead frame 121 with an adhesive member 153 and is connected to the second lead frame 123 through a wire 155. The adhesive member 153 includes a conductive adhesive such as solder. The light emitting chip 151 may be electrically connected to the first lead frame 121 with an electrode disposed thereunder, but the present invention is not limited thereto. When the light emitting chip 151 is connected to the first and second lead frames 121 and 123 by wires, the light emitting chip 151 may be bonded with a nonconductive adhesive, but the present invention is not limited thereto.

The light emitting chip 151 can selectively emit light in a range of visible light band to ultraviolet light band. For example, a red LED chip, a blue LED chip, a green LED chip, a yellow green LED chip, an ultraviolet LED Chips, white LEDs, and UV LED chips. The light emitting chip 151 includes a light emitting device including at least one of compound semiconductor of group II-VI and group III-V elements.

A molding member 141 is disposed in the cavity 112 of the body 111. The molding member 141 includes a light transmitting resin material such as silicon or epoxy. The molding member 141 may be formed as a single layer or multiple layers. The molding member 141 may include a phosphor for changing the wavelength of light to be emitted on the light emitting chip 151, and may include another diffusing agent or scattering agent.

The phosphor excites a part of the light emitted from the light emitting chip 151 and emits the light to other wavelengths. The phosphor may include at least one of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. For example, the phosphor may be a nitride-based phosphor, an oxynitride-based phosphor, or the like, which is mainly activated by a lanthanoid- Alkaline earth metal borate halogen phosphors, alkaline earth metal aluminate phosphors, alkaline earth silicate, alkaline earth metal silicate phosphors, alkaline earth metal silicate phosphors, alkaline earth metal silicate phosphors, alkaline earth metal silicate phosphors, A rare earth aluminate, a rare earth silicate or a lanthanoid-based element such as Eu, which is mainly activated by a lanthanoid element such as Ce, etc., which is mainly activated by a rare earth aluminate, a rare earth aluminate, Organic and organic complexes, and the like. As a specific example, the above-mentioned phosphors can be used, but are not limited thereto.

The upper surface of the molding member 141 may be formed in a flat shape, a concave shape, a convex shape, or the like, but is not limited thereto. An optical lens (not shown) may be formed on the molding member 141. The optical lens may include a concave or convex lens structure. The light emitting device 100 may include a light distribution (light distribution).

5, a plurality of coupling holes 41 are disposed in the second lead frame 1124, and a distance D4 between the plurality of coupling holes 41 is set to be equal to a distance D4 between any one of the sides of the protection chip 161 May be formed to be shorter than the length D5 of the sides. This is because the coupling holes 41 are disposed at positions where they horizontally overlap with the side surfaces of the protection chip 161 so that the coupling portions 26 coupled to the coupling holes 41 are formed on the periphery of the protection chip 161 It can serve as a buffer.

The plurality of coupling holes 41 may be formed at positions corresponding to at least two corners of the corners of the protection chip 161, or may be arranged to correspond to at least one side. The plurality of coupling holes 41 may be positioned on the opposite side of the gap portion 115 with respect to the protective chip 161. Since the protection chip 161 is disposed between the gap portion 115 and the coupling hole 41, the protection chip 161 can be protected by the supporting portion 25 and the coupling portion 26 coupled as shown in FIG.

The distance D8 between the protection chip 161 and the coupling hole 41 is smaller than the width D5 of either side of the sides of the protection chip 161. For example, As shown in FIG.

The first outer side surface S1 of the second lead frame 123 is spaced apart from the protection chip 161 by a predetermined distance B2. If the interval B2 is too large, the width of the body 111 may increase. If the interval B2 is too small, it is difficult to form the coupling hole 41. Therefore, the interval B2 may be wider than the diameter of the coupling hole 41. [ The second outer side surface S2 of the second lead frame 123 may be spaced apart from the protection chip 161 by a predetermined distance B1. If the interval B2 is too large, there is a problem that the length of the wire 165 becomes long. And the second outer side surface S2 is a surface contacting with the gap portion 115. [

6, the lengths of the first and second recessed portions 30 and 31 of the first and second lead frames 121 and 123 are set such that the width Y1 of the first and second lead frames 121 and 123, As shown in FIG. By increasing the length Y1 of the first and second recess portions 30 and 31, the area of adhesion between the gap portion 115 and the first and second lead frames 121 and 123 can be enhanced. Accordingly, moisture penetration through the interface with the gap portion 115 can be prevented, and rigidity of the gap portion 115 can be secured.

7 is another example of the second recessed portion of the light emitting device of Fig. In describing Fig. 7, the same portions as those in the first embodiment will be described with reference to the description of the above-described disclosed configuration.

Referring to FIG. 7, the width D7 of the lower portion 31A may be wider than the width D1 of the upper portion 31a. The coupling portion 26A of the body 111 coupled to the coupling hole 41 may be narrower than the lower portion.

Since the coupling hole 41 is spaced apart from the gap portion 115, the coupling portion 26A may be disposed on the opposite side of the gap portion 115 with respect to the protection chip 161. [ The protection chip 161 can be protected from external impact by the coupling portion 26A and the gap portion 115. [ The number of the coupling holes 41 may be one or a plurality or the length of the coupling holes 41 may be shorter or longer than the length of at least one side of the sides of the protection chip 161.

8 to 14 are views showing a modified example of the coupling hole according to the embodiment.

Referring to FIG. 8, a portion of the body, that is, the coupling portion, is coupled to the coupling hole 42 and may be disposed corresponding to the sides of the protection chip 161, respectively. A plurality of coupling holes 42 correspond to the sides of the protection chip 161 so that the coupling part coupled to the coupling hole 42 can be connected to the supporting part 25 as shown in FIG. ), And functions as a buffer for an external shock. As another example, the coupling hole 42 does not correspond to the four sides of the protection chip 161, but may correspond to one or two sides.

Each of the coupling holes 42 may have a circular or polygonal top view shape. The width D10 may be 0.15 mm or more or 60% or more of the thickness of the second lead frame 123. The distance D9 between the coupling hole 42 and the protection chip 161 may be in a range of 0.04 mm to 0.01 mm, but the present invention is not limited thereto. Two adjacent ones of the plurality of coupling holes 42 may have an angle of 90 degrees with respect to the protection chip 161, an angle of 90 degrees or less, or an angle of 180 degrees or less. As another example, the plurality of coupling holes 42 may be arranged at the same angle around the protection chip 161, or may be arranged at different angles.

Referring to FIG. 9, a portion of the body, that is, the coupling portion is coupled to the coupling hole 43, and may be disposed corresponding to each corner of the corners of the protection chip 161. A plurality of the coupling holes 43 correspond to the corners of the protection chip 161 so that the coupling portion coupled to the coupling hole 43 is connected to the protrusion But it is not limited thereto. The coupling portion may serve as a buffer against an external impact at a corner of the protection chip 161.

Each of the coupling holes 43 extends to a portion of two sides adjacent to the corner of the protection chip 161, thereby protecting the periphery of the protection chip 161. Each of the coupling holes 43 may be formed such that the top view shape is curved with respect to the corner of the protection chip 161. The width D12 may be 0.15 mm or more or the thickness of the second lead frame 123 may be 60 % ≪ / RTI > The distance D11 between the coupling hole 43 and the protection chip 161 may be in a range of 0.04 mm to 0.01 mm. However, the present invention is not limited thereto.

9, the coupling holes 44 may be arranged at two corners of the protection chip 161, not at the four corners of the protection chip 161, Direction, or may be corners adjacent to each other.

Referring to FIG. 11, a portion of the body, that is, the coupling portion is coupled to the coupling hole 45, and may be disposed corresponding to each corner of the corners of the protection chip 161. A plurality of the coupling holes 45 correspond to each other on opposite sides of the side surfaces of the protection chip 161. The length D51 of each coupling hole 45 may be longer than the length D5 of either side of the protection chip 161. [ The coupling holes 45 may cover both sides of the protection chip 161 and the coupling portions coupled to the coupling holes 45 may be formed on the lower surface of the second lead frame 123 4, respectively. Accordingly, the coupling part is longer than the length D5 of one side of the sides of the protection chip 161 and disposed on the opposite sides of the protection chip 161, so that it can serve as a buffer against an external impact. At least one of the plurality of coupling holes 45 may have a curved or straight top view shape, but the present invention is not limited thereto.

Referring to FIG. 12, one or a plurality of coupling holes 46 may have an elliptical shape and may be disposed corresponding to the corners of the protective chip 161. When the plurality of coupling holes 46 are provided, the protection chip 161 may be disposed at two corners or four corners of the corners of the protection chip 161. The coupling part of the body is coupled to the coupling hole 46, and the coupling part is connected to the support part 25 of FIG. 4 to protect the periphery of the protection chip 161. The gap D14 between the coupling hole 46 and the protection chip 161 may be smaller than the length D5 of either side of the protection chip 161. For example, But the present invention is not limited thereto.

Each of the engaging holes 46 may be formed in an elliptical shape having a long radius and a long radius, and the engaging holes 46 facing each other may be disposed to face each other in the radial direction of the long axis. This allows the coupling portion to further cover the periphery of the protection chip 161 by the long radius direction of the coupling hole 46, so that the protection range can be widened.

Referring to FIG. 13, one or a plurality of coupling holes 47 may have an elliptical shape and may be disposed in parallel with the side surfaces of the protection chip 161. When the plurality of coupling holes 47 are provided, the plurality of coupling holes 47 may be arranged parallel to the opposite sides of the protection chip 161. A coupling part of the body is coupled to the coupling hole 47, and the coupling part is connected to the support part 25 of FIG. 4 to protect the periphery of the protection chip 161. The distance D15 between the protection chip 161 and the coupling hole 47 may be less than the length of either side of the protection chip 161. The coupling hole 47 and the protection chip 161 may be formed at intervals of, for example, 0.04 mm to 0.01 mm, but the invention is not limited thereto.

Each of the coupling holes 47 may be formed in an elliptical shape having a long radius and a long radius in a top view shape, and may be disposed parallel to opposite sides of the protection chip 161. This allows the coupling portion to further cover the periphery of the protection chip 161 by the coupling hole 47, so that the protection range can be widened.

14A, the coupling hole 48 has a length longer than a length D5 of either one of the sides of the protection chip 161, and is formed on two sides or three sides of the protection chip 161 Can be extended correspondingly. The coupling hole 48 may be a through hole or a via hole passing through the second lead frame 123 or an upper portion of the second lead frame 123 may be a recessed groove.

14B can be formed in a recessed shape having a predetermined depth and a recessed hole 48A as shown in FIG. 14A, and the depth of the recessed portion is set to a thickness of the second lead frame 123 / RTI >< / RTI > The coupling portion is coupled to the coupling hole 48A, thereby protecting the periphery of the protection chip 161. Although the embodiment has been described as a through hole for the coupling hole of the above-described embodiment, it may be formed in a groove shape.

15 to 17 are bottom views of the second lead frame according to the embodiment. For convenience of explanation, the second recess portion of the second lead frame will be described as a recess portion.

Referring to FIG. 15, the recess portion 35 disposed at the lower portion of the second lead frame 123 may be formed as a pipe around the opposite side region of the protection chip 161. For example, the recess portion 35 may include a shape in which the bottom view shape is a circular or polygonal shape having a continuous loop shape or a discontinuous loop shape, or a shape in which a corner portion is curved.

One or a plurality of coupling holes 42 are formed in the recess portion 35. The coupling holes 42 may be arranged as shown in FIG. 8, for example, and may be connected to each other through the recessed portion 35. That is, the coupling portion of the body coupled to the coupling hole 42 may be connected to the support portion of the body coupled to the recess portion. This structure will be described with reference to FIG.

16, the recess portion 36 disposed at the lower portion of the second lead frame 123 may be formed in a polygonal shape or a circular shape. The area of the recess portion 36 may be 2 Or more. A plurality of engagement holes 44 are formed in the recess portion 36 as shown in FIG. 10, and the plurality of engagement holes 44 can be connected to each other in the recess portion 36. A coupling portion of a body is formed in the coupling hole 44, and a supporting portion of the body can be coupled to the recess portion 36. Accordingly, the support portion of the body supports the coupling portion, and the coupling portion protects the periphery of the protection chip 161. [

The recess portions 35 and 36 shown in Figs. 15 and 16 are formed at a position apart from the gap portion 115 between the first and second lead frames 121 and 123 at the lower portion of the second lead frame .

17, the recessed portion 37 of the second lead frame 123 may be formed in a hemispherical shape from a corner of the corner of the second lead frame 123, have. The recess portion 37 may be formed with a coupling hole 41 as shown in FIG. 5, but the present invention is not limited thereto. A coupling part of a body is formed in the coupling hole 41, and a supporting part of the body can be coupled to the recess part 37. Accordingly, the support portion of the body supports the coupling portion, and the coupling portion protects the periphery of the protection chip 161. [

18 is a side cross-sectional view illustrating a protection structure of a protection chip of a light emitting device according to the second embodiment. In describing the second embodiment, the same parts as those of the first embodiment will be described with reference to the first embodiment.

Referring to FIG. 18, a recess 125 having a predetermined depth is formed in the second lead frame 123, and at least a part or the whole of the protection chip 161 is inserted into the recess 125 . A coupling hole 41 is formed around the protection chip 161 and a coupling portion 26A which is a part of the body 111 is coupled to the coupling hole 41. [ Accordingly, the coupling portion 26A can protect the protection chip 161 and relieve the external impact transmitted to the wire 165. [ The depth of the recess 125 may be less than 1/2 of the thickness of the second lead frame 123.

19 is a view showing a light emitting device in the third embodiment. In describing the third embodiment, the same parts as those of the first embodiment will be described with reference to the first embodiment.

19, a light emitting chip 151 and a protection chip 161 are disposed on a first lead frame 121. The light emitting chip 151 is disposed in a cavity 112 of a body 111 And the protection chip 161 is embedded in the body 111. A coupling hole 41B is formed in the first lead frame 121 at a region of the periphery of the protective chip 161 opposite to the gap portion 115 and a coupling hole 41B is formed in the coupling hole 41B, Can be additionally combined. The coupling portion of the body 111 may extend to a recess portion disposed under the first lead frame 121. Thus, the periphery of the protection chip 161 can be protected, and the protection chip 161 can be prevented from being lifted from an external impact.

20 is a plan view of a light emitting device according to a fourth embodiment, and FIG. 21 is a C-C side sectional view of the light emitting device of FIG. In describing the fourth embodiment, the same parts as those of the first embodiment will be described with reference to the first embodiment.

20 and 21, the light emitting device includes a body 111 having a cavity 112A, a first lead 111c extending from the bottom of the cavity 112A in the direction of the first side 11 of the body 111, A second lead frame 123 extending from the bottom of the cavity 112 in the direction of the second side 12 of the body 111 and a second lead frame 123 extending from the bottom of the cavity 112 to the first and second lead frames 121, A protection chip 161 disposed between one of the first and second lead frames 121 and 123 and an upper surface of the body 111, a protection chip 161, And a wire 165 for connecting the other one of the lead frames 121 and 123 to each other.

The cavity 112A of the body 111 includes four or more, for example, first to sixth inner sides 61, 62, 63, 64, 65, 66, and the first and second inner sides 61 62 correspond to each other, and the third and fourth inner sides 63, 64 correspond to each other. The fifth inner side surface 65 is connected between the third inner side surface 63 and the second inner side surface 62 and the sixth inner side surface 66 is connected to the fourth inner side surface 64 and the first inner side surface 62 62. The fifth and sixth inner sides (65, 66) are inclined at a first angle (? 1) less than 90 degrees from the extension line of the third and fourth inner sides (63, 64). Here, the first angle? 1 is less than 90 degrees, and may be in the range of 40 degrees to 89 degrees. The fifth inner side surface 65 can be formed at an obtuse angle with the second and third inner side surfaces 62 and 63 respectively and the sixth inner side surface 66 can be formed at the second and fourth inner side surfaces 62 and 63, The internal angles with the inner sides 62 and 64 can be formed at an obtuse angle, respectively.

The width X4 of the second inner side surface 62 of the cavity 112A may be smaller than the width X3 of the first inner side surface 61. For example, the width X4 may be smaller than the width X3 50% or more and less than 100%.

The protection chip 161 may be disposed in the body 111 between the fifth inner side 65 of the cavity 112 and the third side 13 of the body 111 and the second lead frame 123 And is connected to the first lead frame 121 through a wire 165. [

The protection chip 161 is disposed in the body 111 from the outside of the fifth inner side surface 25 of the cavity 112 to improve the degree of freedom in installing the light emitting chip 151A disposed in the cavity 112 And the size of the light emitting chip 151A can be maximized with respect to the area of the cavity 112. [

The fifth inner side surface 65 and the sixth inner side surface 66 may be planar or curved, but are not limited thereto.

As another example, the protection chip 161 may be disposed outside the sixth inner side surface 66 of the cavity 112, but is not limited thereto. In addition, a plurality of light emitting chips 115A may be disposed in the cavity 112A. Further, the protection chip 161 may be disposed on a lower surface of any one of the first and second lead frames 121 and 123, but is not limited thereto.

21, a first recess 122 is formed at a predetermined depth in the first lead frame 121, and a second recess portion 122 is formed in the second lead frame 123, 124 and a coupling hole 41C are formed. The first and second recess portions 122 and 124 are formed with a support portion 117 connected to the material of the gap portion 115 and the support portion 117 is formed on the engagement portion 26C formed in the engagement hole 41C . The height of the first and second recess portions 122 and 124 may be less than 1/2 of the thickness of the first and second lead frames 121 and 123, but the present invention is not limited thereto.

One or more of the coupling portions 26C are arranged along the periphery of the protection chip 161 to mitigate an external impact transmitted to the protection chip 161 or an impact transmitted to the wire 165 have. Therefore, the electrical reliability of the protection chip 161 can be improved, and the reliability of the light emitting device can also be improved. Further, by embedding the protection chip 161 in the body 111, the degree of freedom in designing the light emitting device can be improved.

<Lighting system>

The light emitting device or the light emitting device according to the embodiment can be applied to the illumination system. The lighting system includes a structure in which a plurality of light emitting elements are arrayed, and includes a display device shown in Figs. 22 and 23, a lighting device shown in Fig. 24, and may include an illumination lamp, a traffic light, a vehicle headlight, have.

22 is an exploded perspective view of a display device having a light emitting device according to an embodiment.

22, a display device 1000 according to an embodiment includes a light guide plate 1041, a light source module 1031 for providing light to the light guide plate 1041, and a reflection member 1022 An optical sheet 1051 on the light guide plate 1041 and a display panel 1061 on the optical sheet 1051 and the light guide plate 1041, the light source module 1031, and the reflection member 1022 But is not limited to, a bottom cover 1011.

The bottom cover 1011, the reflective sheet 1022, the light guide plate 1041, and the optical sheet 1051 can be defined as a light unit 1050.

The light guide plate 1041 serves to diffuse light into a surface light source. The light guide plate 1041 may be made of a transparent material such as acrylic resin such as polymethyl methacrylate (PET), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. &Lt; / RTI &gt;

The light source module 1031 provides light to at least one side of the light guide plate 1041, and ultimately acts as a light source of the display device. The light source module 1031 includes at least one light source module 1031 and may directly or indirectly provide light from one side of the light guide plate 1041. The light source module 1031 includes a substrate 1033 and a light emitting device 1035 according to the embodiment described above and the light emitting devices 1035 may be arrayed on the substrate 1033 at predetermined intervals.

The substrate 1033 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1033 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like. When the light emitting element 1035 is mounted on the side surface of the bottom cover 1011 or on the heat radiation plate, the substrate 1033 can be removed. Here, a part of the heat radiating plate may be in contact with the upper surface of the bottom cover 1011.

The plurality of light emitting devices 1035 may be mounted on the substrate 1033 such that the light emitting surface is spaced apart from the light guiding plate 1041 by a predetermined distance. However, the present invention is not limited thereto. The light emitting device 1035 may directly or indirectly provide light to the light-incident portion, which is one surface of the light guide plate 1041, but the present invention is not limited thereto.

The reflective member 1022 may be disposed under the light guide plate 1041. The reflective member 1022 reflects the light incident on the lower surface of the light guide plate 1041 so as to face upward, thereby improving the brightness of the light unit 1050. The reflective member 1022 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto. The reflective member 1022 may be an upper surface of the bottom cover 1011, but is not limited thereto.

The bottom cover 1011 may house the light guide plate 1041, the light source module 1031, the reflective member 1022, and the like. To this end, the bottom cover 1011 may be provided with a housing portion 1012 having a box-like shape with an opened upper surface, but the present invention is not limited thereto. The bottom cover 1011 may be coupled to the top cover, but is not limited thereto.

The bottom cover 1011 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding. In addition, the bottom cover 1011 may include a metal or a non-metal material having good thermal conductivity, but the present invention is not limited thereto.

The display panel 1061 is, for example, an LCD panel, including first and second transparent substrates facing each other, and a liquid crystal layer interposed between the first and second substrates. A polarizing plate may be attached to at least one surface of the display panel 1061, but the present invention is not limited thereto. The display panel 1061 displays information by light passing through the optical sheet 1051. Such a display device 1000 can be applied to various types of portable terminals, monitors of notebook computers, monitors of laptop computers, televisions, and the like.

The optical sheet 1051 is disposed between the display panel 1061 and the light guide plate 1041 and includes at least one light-transmitting sheet. The optical sheet 1051 may include at least one of a sheet such as a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The diffusion sheet diffuses incident light, and the horizontal and / or vertical prism sheet condenses incident light into a display area. The brightness enhancing sheet improves the brightness by reusing the lost light. A protective sheet may be disposed on the display panel 1061, but the present invention is not limited thereto.

Here, the optical path of the light source module 1031 may include the light guide plate 1041 and the optical sheet 1051 as an optical member, but the invention is not limited thereto.

23 is a diagram showing a display device having a light emitting element according to the embodiment.

23, the display device 1100 includes a substrate 1020, an optical member 1154, and a display panel 1155 on which the bottom cover 1152, the light emitting device 1124 described above are arrayed.

The substrate 1020 and the light emitting device 1124 may be defined as a light source module 1160. The bottom cover 1152, the at least one light source module 1160, and the optical member 1154 may be defined as a light unit 1150. The bottom cover 1152 may include a receiving portion 1153, but the present invention is not limited thereto. The light source module 1160 includes a substrate 1020 and a plurality of light emitting devices 1124 arranged on the substrate 1020.

Here, the optical member 1154 may include at least one of a lens, a light guide plate, a diffusion sheet, a horizontal and vertical prism sheet, and a brightness enhancement sheet. The light guide plate may be made of a PC material or a PMMA (poly methyl methacrylate) material, and such a light guide plate may be removed. The diffusion sheet diffuses incident light, and the horizontal and vertical prism sheets condense incident light into a display area. The brightness enhancing sheet enhances brightness by reusing the lost light.

The optical member 1154 is disposed on the light source module 1060, and performs surface light source, diffusion, and light condensation of light emitted from the light source module 1060.

24 is an exploded perspective view of a lighting device having a light emitting device according to an embodiment.

24, the lighting apparatus according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, and a socket 2800 . Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device according to an embodiment of the present invention.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200 and may be coupled to the heat discharger 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint having a diffusion material. The light from the light source module 2200 can be scattered and diffused to emit to the outside using the milky white material.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light emitting device 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 into which a plurality of illumination elements 2210 and a connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the illumination device 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects the light reflected by the inner surface of the cover 2100 toward the cover 2100 in the direction toward the light source module 2200. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 may have a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides the electrical signal to the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components may include, for example, a DC converter, a driving chip for controlling driving of the light source module 2200, an electrostatic discharge (ESD) protection device for protecting the light source module 2200, The present invention is not limited thereto.

The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension portion 2670 is inserted into the connection portion 2750 of the inner case 2700 and receives an external electrical signal. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. The extension 2670 may be electrically connected to the socket 2800 through a wire.

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment of the present invention and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects and the like illustrated in the embodiments can be combined and modified by other persons skilled in the art to which the embodiments belong. Therefore, it should be understood that the present invention is not limited to these combinations and modifications.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of illustration, It can be seen that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

41, 41A, 41B, 41C, 42, 43, 44, 45, 46, 47, 48,
30, 31, 35, 36, 37:
25, 117: Support parts 26, 26A, 26C:
100: light emitting element 111: body
112, 112A: Cavities 121, 123: Lead frame
141: molding member 151, 151A: light emitting chip
161: protection chip 165: wire

Claims (18)

A body including a first side and a second side opposite the first side and a cavity;
A first lead frame disposed in the cavity and extending in a first lateral direction of the body in the cavity;
A second lead frame disposed in the cavity and extending in a second lateral direction of the body in the cavity;
A light emitting chip disposed on at least one of the first and second lead frames in the cavity;
A gap portion disposed between the first and second lead frames; And
And a molding member disposed in the cavity,
Wherein the gap portion comprises the same material as the body,
A part of the body is connected to the gap part,
Wherein the first lead frame includes a first recess portion that is stepped in a first side direction of the body from a first edge in contact with the gap portion,
The second lead frame includes a second recess portion that is stepped in a direction toward a second side of the body from a second edge in contact with the gap portion,
Wherein a depth of the stepped portion in the second recessed portion in the direction of the second side of the body is formed deeper than a stepped depth in the direction of the first side of the body in the first recessed portion,
Wherein an inner angle between two adjacent inner side surfaces of the inner surfaces of the cavity forms an obtuse angle,
A first hole disposed in the first lead frame and having a portion of the body inserted therein, and a second hole disposed in the second lead frame and having a portion of the body inserted therein,
Wherein the body includes a resin material to which a metal oxide is added,
Wherein the molding member comprises a phosphor. A body including a first side and a second side opposite the first side and a cavity;
A first lead frame disposed in the cavity and extending in a first lateral direction of the body in the cavity;
A second lead frame disposed in the cavity and extending in a second lateral direction of the body in the cavity;
A light emitting chip disposed on at least one of the first and second lead frames in the cavity;
A gap portion disposed between the first and second lead frames; And
And a molding member disposed in the cavity,
Wherein the gap portion comprises the same material as the body,
A part of the body is connected to the gap part,
Wherein the first lead frame includes a first recess portion that is stepped in a first side direction of the body from a first edge adjacent to the gap portion,
The second lead frame includes a second recess portion that is stepped in a direction toward a second side of the body from a second edge in contact with the gap portion,
Wherein the gap portion is disposed in the first and second recess portions,
The stepped depth from the second recessed portion in the second lateral direction of the body differs from the stepped depth from the first recessed portion in the first lateral direction of the body,
Wherein an inner angle between two adjacent inner side surfaces of the inner surfaces of the cavity forms an obtuse angle,
A first hole in which a part of the body is disposed in the first lead frame and a second hole in which a part of the body is disposed in the second lead frame,
Wherein the body and the gap portion include a resin material to which a metal oxide is added,
Wherein the molding member comprises a phosphor. The light emitting device according to claim 1 or 2, wherein the lower surface of the first lead frame, the lower surface of the gap portion, the lower surface of the body, and the lower surface of the second lead frame are disposed on the same plane. The light emitting device of claim 3, wherein the top surface area of the first and second lead frames is larger than the bottom surface area of the first and second lead frames. 3. The device of claim 1 or 2, wherein the body includes a third side and an opposite fourth side of the third side,
Wherein the first side surface and the second side surface have a length shorter than a length of the third side surface and the fourth side surface. The light emitting device according to claim 5, wherein at least two of the first to fourth sides of the body are disposed obliquely with respect to the lower surface of the body or the lower surface of the first and second lead frames. 3. The semiconductor device according to claim 1 or 2, wherein the first recess portion has a height of 1/2 or less of the thickness of the first lead frame from a lower surface of the first lead frame,
The second recess portion has a height less than 1/2 of the thickness of the second lead frame from the lower surface of the second lead frame,
And a part of the body is disposed in the first and second recess parts. The light emitting device according to claim 1 or 2, wherein the first recess portion has a height of 1/2 or less of the thickness of the first lead frame from a lower surface of the first lead frame. delete The light emitting device according to claim 1 or 2, wherein the metal oxide comprises at least one of TiO 2 , SiO 2 , and Al 2 O 3 . The light emitting device according to claim 1 or 2, wherein an outer side of the first lead frame is disposed below a first side of the body, and an outer side of the second lead frame is disposed below a second side of the body. The light emitting device according to claim 1 or 2, wherein a part of the body is disposed in the first and second recess portions. The light emitting device according to claim 1 or 2, wherein the second recess portion has a height of 1/2 or less of the thickness of the second lead frame from a lower surface of the second lead frame. The light emitting device according to claim 1 or 2, wherein the first hole is disposed adjacent to a first side of the body, and the second hole is disposed adjacent to a second side of the body. The light emitting device according to claim 1 or 2, wherein the upper surface of the molding member includes a concave shape. The light emitting device according to claim 1 or 2, wherein the first and second lead frames have a thickness ranging from 0.4 mm to 1.5 mm. The light emitting device according to claim 1 or 2, wherein the first hole and the second hole have a circular or polygonal shape. 14. The method of claim 13, wherein the length of the first hole in the first direction is longer than the length of the first hole in the second direction,
The length of the second hole in the first direction is longer than the length of the first hole in the second direction,
Wherein the first direction is a direction orthogonal to the second direction,
The second direction being a second direction of the body,
Wherein the length of the body in the second direction is longer than the length of the body in the first direction.
KR1020130067826A 2013-06-13 2013-06-13 Light emitting device KR101655505B1 (en)

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KR102374676B1 (en) * 2015-01-05 2022-03-16 서울반도체 주식회사 Light emitting diode package and manufacturing method of the same
KR102316037B1 (en) * 2015-02-11 2021-10-22 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device
US10497846B2 (en) * 2017-07-11 2019-12-03 Lg Innotek Co., Ltd. Light emitting device package
KR102433841B1 (en) * 2017-10-20 2022-08-18 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package

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JP4010299B2 (en) * 2001-06-20 2007-11-21 日亜化学工業株式会社 Semiconductor light emitting device and method for forming the same
KR100888236B1 (en) * 2008-11-18 2009-03-12 서울반도체 주식회사 Light emitting device

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TWM400099U (en) * 2010-09-27 2011-03-11 Silitek Electronic Guangzhou Lead frame, package structure and lighting device thereof

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JP4010299B2 (en) * 2001-06-20 2007-11-21 日亜化学工業株式会社 Semiconductor light emitting device and method for forming the same
KR100888236B1 (en) * 2008-11-18 2009-03-12 서울반도체 주식회사 Light emitting device

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