JP2007234846A - Ceramic package for light-emitting element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ceramic package for light-emitting elements that can be manufactured relatively easily while the light of the light-emitting elements cannot be blocked off regardless of the falling-off prevention structure of a transparent resin. <P>SOLUTION: The ceramic package 10 for light-emitting elements has a ceramic substrate 11 and a heat sink 18. The ceramic substrate 11 has a hole 17 that is open at the side of a main substrate surface 12 and that of a rear substrate surface 13. The heat sink 18 has a mount 23 capable of mounting an LED element 22 on an entire surface 19 of a metal body. The heat sink 18 is mounted to the ceramic substrate 11 so that the hole 17 is blocked from the side of the rear substrate surface 13 by the main surface 19 of the metal body. A transparent resin 25 for covering the mount 23 and the LED element 22 is filled into a cavity 21. A recess 39 for fixing resin is provided around the mount 23. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a ceramic package used for mounting a light emitting element such as a light emitting diode.

  Conventionally, a light emitting diode (hereinafter also referred to as an LED element) is well known as a kind of light emitting element. In recent years, as a result of putting high-luminance blue light-emitting diodes into practical use, high-luminance white light can be obtained by combining red, green, and blue LED elements. Therefore, development for using these three-color LED elements as a light bulb or a headlight of an automobile is underway. Since the LED element has an advantage of low power consumption, if the LED element is used for the headlight, the load on the battery can be reduced. In addition, since the LED element also has an advantage of a long life, application to indoor lighting such as a fluorescent lamp and a light bulb is also being studied. When the LED element is used in the above-described application, in order to maximize the advantages of the LED element, it is an important factor that the performance of the package itself for mounting the LED element is good. In that respect, ceramic packages are considered to be suitable for mounting LED elements because they are superior in durability, heat resistance, corrosion resistance, and heat dissipation compared to organic packages, for example.

  FIG. 12 shows a conventional example of a ceramic package 100 for an LED element. The ceramic package for LED element 100 has a cavity 102 that can accommodate the LED element 101. Specifically, the LED element ceramic package 100 includes a ceramic substrate 107 composed of a plurality of ceramic layers 103 to 106, and a hole 108 that opens on the upper surface side and the lower surface side is formed in the center of the ceramic substrate 107. Has been. A heat sink 109 is provided so as to close the hole 108 from the lower surface side of the ceramic substrate 107. A cavity 102 opened to the upper surface side of the substrate is formed by the upper surface of the heat sink 109 and the side surface of the hole 108, and the LED element 101 is mounted on the upper surface of the heat sink 109 in the cavity 102.

  The cavity 102 of the LED element ceramic package 100 is filled with a transparent resin 110 for covering the LED element 101. With this configuration, the LED element 101 is sealed and protected by the transparent resin 110. Furthermore, since the transparent resin 110 is capable of transmitting light, the luminous flux from the LED element 101 can be emitted outside the cavity 102 without being blocked. In addition, the LED element 101 generates heat when it emits light, but by providing the heat sink 109, heat is efficiently dissipated. Thereby, the problem that the light emission luminance and the light emission wavelength change due to the temperature rise of the LED element 101 itself is avoided.

  By the way, the transparent resin 110 used for sealing the LED element 101 does not have sufficient adhesiveness with the ceramic package 100, and further has a coefficient of thermal expansion different from that of the ceramic package 100. Therefore, there arises a problem that the transparent resin 110 expands due to the heat generated by the LED element 101 and falls off from the ceramic package 100. As a countermeasure, in this ceramic package 100, a flange 111 is provided on the opening side of the cavity 102, and the transparent resin 110 is fixed by the flange 111 so as not to drop off. The flange 111 is formed by reducing the inner peripheral dimension of the hole 108 in the uppermost ceramic layer 103 constituting the ceramic substrate 107 and projecting the ceramic layer 103 beyond the lower ceramic layer 104. Has been.

As in the conventional example as shown in FIG. 12, a ceramic package provided with an engagement structure (that is, a drop-off prevention structure) for fixing a transparent resin on the opening side of a cavity is disclosed in, for example, Patent Document 1.
Japanese Patent Laid-Open No. 11-74561 (see FIGS. 1 and 3)

  However, in the ceramic package 100, the flange 111 protrudes toward the center of the package on the opening side of the cavity 102. Therefore, there is a problem that the collar 111 blocks the light emitted from the LED element 101 and deteriorates the light emission efficiency. Moreover, even if it is going to process the ceramic substrate 107 and provide the collar part 111, since a ceramic is not good in workability, manufacture becomes very difficult. Therefore, the problem that the manufacturing cost of the package 100 increases also arises.

  The present invention has been made in view of the above-described problems, and its purpose is to manufacture a relatively easy manufacturing process that does not block light from the light-emitting element even though it has a transparent resin drop-off preventing structure. An object of the present invention is to provide a ceramic package for a light emitting device.

  Means (Means 1) for solving the above problems include a ceramic substrate having a substrate main surface and a substrate back surface, and having holes opened on the substrate main surface side and the substrate back surface side, and a metal body main A heat-dissipating metal attached to the ceramic substrate so as to have a mounting portion capable of mounting a light emitting element on the surface and the metal body main surface, and so as to close the hole portion from the substrate back surface side by the metal body main surface A ceramic package for a light-emitting element capable of being filled with a transparent resin that covers the mounting part and the light-emitting element in the cavity. There is a ceramic package for a light emitting element characterized in that an uneven portion for fixing a resin is provided around the mounting portion on the main surface of the metal body.

  Therefore, according to the invention described in the means 1, since the concave portion for fixing the resin is provided around the mounting portion on the metal main surface of the metal body for heat dissipation, it is in close contact with the transparent resin filled in the cavity. And the transparent resin can be reliably fixed. In addition, since the concave and convex portions for fixing the resin are located on the back side (side closer to the back surface of the substrate) than the light emitting element, the light emitted from the light emitting element is not blocked as in the conventional package, and the light emission efficiency is improved. Deterioration can be avoided. Furthermore, since the concavo-convex portion is provided on the heat-dissipating metal body, the concavo-convex portion having an optimum shape for fixing the resin can be easily formed with excellent workability as compared with the case where it is provided on the ceramic substrate. As described above, the ceramic package for a light-emitting element of the present invention has a structure for preventing the transparent resin from falling off, but does not block the light of the light-emitting element, and can be manufactured relatively easily.

  The ceramic substrate constituting the ceramic package is mainly composed of a ceramic insulating material such as alumina, aluminum nitride, silicon nitride, boron nitride, beryllia, mullite. The ceramic substrate preferably has a conductor layer for supplying electric power to the light emitting element, and it is particularly preferable to use a ceramic multilayer substrate having two or more such conductor layers. Examples of such a conductor layer include an inner layer conductor pattern made of a metallized layer provided inside the package, and a pad made of a metallized layer provided on the substrate main surface and the substrate back surface.

  The ceramic substrate has one or more cavities that open on the main surface of the substrate. The shape of the cavity is not particularly limited, and a rectangular shape or a circular shape can be adopted.

  The heat-dissipating metal body is formed using a metal material that has high thermal conductivity and efficiently releases heat. As this forming material, for example, an alloy such as copper-tungsten or cobalt, or a metal such as copper or aluminum is used.

  Although a LED element is mentioned as a suitable example of the light emitting element which should be mounted in the mounting part of the said metal body for heat dissipation, Other things, for example, a semiconductor laser element (LD element), VCSEL, etc. may be used. There may be one light emitting element or a plurality of light emitting elements mounted in one cavity. For example, you may comprise so that white light may be obtained by mounting red, green, and blue LED elements in one cavity.

  The uneven portion for fixing the resin may be a recess that does not penetrate the metal body for heat dissipation. This prevents the transparent resin from leaking out of the package through the recess when the cavity is filled with the transparent resin. Moreover, it is preferable that the said recessed part is a groove part surrounding the said mounting part. Examples of the groove include a circular annular groove and a meandering groove. The groove is more preferably a recess having a cross-sectional shape that becomes wider toward the back side of the substrate. When the concave portion is provided in this way, the transparent resin can be more reliably fixed. Furthermore, it is preferable that the opening of the recess is partially covered with the ceramic substrate. If it does in this way, the suitable engagement structure for fixing transparent resin is realizable. Of course, the uneven portion for fixing the resin is not limited to the groove, and may be a through hole or a non-through hole that penetrates the metal body for heat dissipation. The uneven portion for fixing the resin can be easily formed by known metal processing (for example, coining processing or punching processing).

  The ceramic substrate is a multilayer substrate composed of a plurality of ceramic layers, and the multilayer substrate is composed of at least one layer of the plurality of ceramic layers, and has a protruding portion protruding from a side surface of the hole portion. The metal body main surface of the heat radiating metal body may be brazed to the projecting portion via a brazing material.

  Examples of the brazing material include silver brazing material and copper brazing material. The silver brazing material refers to an alloy in which silver (Ag) is a main component and a metal such as copper (Cu) or zinc (Zn) is added thereto. The copper brazing material refers to an alloy containing copper (Cu) as a main component and a metal such as silver (Ag) or zinc (Zn) added thereto. Incidentally, examples of the brazing material other than the silver brazing material and the copper brazing material include a gold brazing material, a nickel brazing material, and an aluminum brazing material.

  The heat dissipating metal body is preferably attached to an intermediate ceramic layer located in the inner layer of the multilayer substrate. The reason is that the metal body for heat dissipation can be attached without protruding from the multilayer substrate, which is advantageous for reducing the height of the package. Furthermore, it is preferable that the intermediate ceramic layer is extended toward the center of the package, and the lower surface side of the extended portion of the intermediate ceramic layer is formed in a tapered shape. If it does in this way, the transparent resin will surely enter into the concavo-convex part when the transparent resin is filled into the cavity. In addition, since the contact area between the transparent resin and the ceramic substrate can be sufficiently secured, the transparent resin can be more reliably fixed.

  As another means (means 2) for solving the above problems, the ceramic package according to means 1, a light emitting element mounted on the substrate main surface side of the ceramic substrate, and a transparent resin covering the light emitting element There is a light emitting device characterized by comprising: Therefore, according to the light emitting device described in the means 2, the light emitting element can be reliably sealed using the transparent resin, and the emitted light flux of the light emitting element can be reliably emitted to the outside without being shielded.

  Hereinafter, a ceramic package 10 for a light emitting device according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic sectional view showing a ceramic package 10 with a light emitting element (that is, a light emitting device 1). FIG. 2 is a schematic cross-sectional view showing the ceramic package 10 before mounting the light emitting element. FIG. 3 is a plan view showing the ceramic package 10 before the light emitting element is mounted.

  As shown in FIGS. 1 to 3, the ceramic substrate 11 constituting the ceramic package 10 is a rectangular flat plate member having an upper surface (substrate main surface) 12 and a lower surface (substrate back surface) 13. The ceramic substrate 11 is a three-layer substrate (multilayer substrate) composed of an upper ceramic layer 14, an intermediate ceramic layer 15, and a lower ceramic layer 16, and has a circular shape that opens on the upper surface 12 side and the lower surface 13 side. It has a hole 17. The number of ceramic layers is arbitrary, and may be two layers or four or more layers. In the present embodiment, each of the ceramic layers 14 to 16 is made of an alumina sintered body.

  A heat sink 18 is attached to the ceramic substrate 11 so as to close the hole 17 from the substrate rear surface 13 side, and a cavity 21 is formed by the upper surface (metal body main surface) 19 of the heat sink 18 and the side surface 20 of the hole 17. Is formed.

  A mounting portion 23 on which the LED element 22 can be mounted is formed at the central portion of the upper surface of the heat sink 18 (the central portion of the bottom surface of the cavity 21). For example, a thermosetting adhesive is used for the mounting portion 23. LED element 22 is joined. The heat sink 18 is a heat-dissipating metal body formed in a plate shape using a metal material (for example, copper) having a high thermal conductivity, and efficiently dissipates heat generated by the LED elements 22.

  The cavity 21 of the present embodiment has a circular shape in plan view. The cavity 21 is filled with a transparent resin 25 made of a thermosetting resin such as epoxy, and as a result, the mounting portion 23 and the LED element 22 are entirely covered with the transparent resin 25.

  A side surface (side surface of the hole portion 17 of the upper ceramic layer 14) 20 on the opening side of the cavity 21 is a tapered surface having an inclination angle of about 45 ° with respect to the bottom surface (the upper surface of the heat sink 18). A light reflection layer 28 having a layer structure in which nickel plating, silver plating, or the like is formed on a tungsten metallized layer is formed on the side surface 20 of the cavity 21. The light reflection layer 28 allows the luminous flux of the LED element 22 to be emitted. The ceramic substrate 11 is reflected in the thickness direction (upward in FIG. 1).

  The diameter of the hole 17 in the intermediate ceramic layer 15 is smaller than the diameter of the hole 17 in the upper ceramic layer 14 and the lower ceramic layer 16. In the intermediate ceramic layer 15, the peripheral portion of the hole portion 17 is an overhang portion 30 that protrudes from the side surface 20 of the hole portion 17 toward the center of the package.

  A conductor layer 31 made of a tungsten metallized layer is formed at the interface between the ceramic layers 14 to 16. A pair of bonding pads 32 constituting a part of the conductor layer 31 are provided on the upper surface of the overhang portion 30 of the intermediate ceramic layer 15. These bonding pads 32 have a layer structure in which nickel plating, silver plating, or the like is performed on a tungsten metallized layer. Each bonding pad 32 is electrically connected to a terminal on the LED element 22 side via wire bonding 33.

  A plurality of electrode solder pads 34 are provided on the outer peripheral portion of the lower surface 13 of the ceramic substrate 11 (lower ceramic layer 16). These electrode solder pads 34 have the same layer structure as the bonding pad 32 (layer structure in which nickel plating, silver plating or the like is applied on the tungsten metallized layer). Each electrode solder pad 34 is connected to the inner conductor layer 31 through a conductor portion of a castellation 35 provided on the side surface of the ceramic substrate 11.

  A brazing material layer 37 is provided on the conductor layer 31 on the lower surface of the overhanging portion 30 in the intermediate ceramic layer 15 via a plating layer (not shown), and the heat sink 18 is brazed via the brazing material layer 37. Yes.

  On the upper surface of the heat sink 18, a resin fixing recess 39 is provided around the mounting portion 23. The recess 39 is a recess that does not penetrate the heat sink 18, and the depth thereof is half or less of the thickness of the heat sink 18. The recess 39 in the present embodiment is a circular groove (annular groove) formed in a plan view so as to surround the mounting portion 23, and the opening 40 of the recess 39 is partly formed by the overhanging portion 30 of the ceramic substrate 11. Covered. That is, in the recess 39, the inner peripheral diameter is smaller than the minimum diameter of the hole 17 (diameter of the intermediate ceramic layer 15) of the ceramic substrate 11, and the outer peripheral diameter is smaller than the minimum diameter of the hole 17. Is also formed to be large. In the joined state of the intermediate ceramic layer 15 and the heat sink 18, the space formed by the concave portion 39 has a cross-sectional shape that enters the lower side of the overhang portion 30 (a cross-sectional shape that becomes wider toward the back side of the substrate). .

  The mounting portion 23 and the recess 39 in the heat sink 18 are formed by a known metal processing method (coining processing or punching processing). Thus, by forming the recessed part 39 in the heat sink 18, it fixes reliably so that the transparent resin 25 with which the cavity 21 was filled does not drop. Note that the mounting portion 23 and the recess 39 may be formed by performing etching or the like.

  Next, a method for manufacturing the ceramic package 10 having the above structure will be described.

  First, a slurry is prepared by mixing alumina powder, an organic binder, a solvent, a plasticizer and the like. Then, the slurry is formed into a sheet shape by a conventionally known method (for example, a doctor blade method or a calender roll method) to produce a plurality of ceramic green sheets 41, 42, 43 (see FIG. 4).

  Next, punching is performed using a conventionally known punching die to form circular through holes 45, 46, 47 in the ceramic green sheets 41, 42, 43, respectively (see FIG. 5). The through hole 45 of the ceramic green sheet 41 that is the uppermost layer is formed to have a tapered shape. Further, a castellation hole 48 is formed in each ceramic green sheet 41, 42, 43 by a conventionally known punching process.

  Next, a tungsten paste 49, which is a material for forming a metallized layer, is applied to the inner peripheral surface of the through hole 45 of the ceramic green sheet 41 as the uppermost layer using a conventionally known paste printing apparatus (see FIG. 6). . Moreover, the tungsten paste 49 is apply | coated to the predetermined location of the ceramic green sheets 42 and 43 using the same apparatus (refer FIG. 6).

  Next, the ceramic green sheets 41, 42, and 43 are laminated, and a predetermined load is applied in the thickness direction using a conventionally known laminating apparatus, whereby these are pressed and integrated to form a laminated body. Then, the baking process which heats this laminated body to the predetermined | prescribed temperature (for example, temperature of about 1500 degreeC-1700 degreeC) which an alumina can sinter is performed. After this firing, as shown in FIG. 7, the ceramic green sheets 41, 42, 43 are sintered, and the ceramic substrate 11 composed of the plurality of ceramic layers 14, 15, 16 is obtained. Further, the light reflecting layer 28 of the cavity 21, the conductor layer 31, the bonding pad 32, the electrode solder pad 34, and the tungsten metallization layer of the castellation 35 are formed by sintering the tungsten paste 49.

  Next, electrolytic nickel plating is performed to form a nickel layer on the tungsten metallized layer, and electrolytic silver plating is further performed to form a silver plating layer on the nickel layer. As a result, the light reflecting layer 28, the conductor layer 31, the bonding pad 32, the electrode solder pad 34, and the castellation 35 are completed.

  Furthermore, a brazing material layer 37 is formed by disposing a silver brazing material on the lower surface of the overhanging portion 30 in the hole portion 17 of the ceramic substrate 11 and heating it to a predetermined temperature (for example, a temperature of 750 ° C.) in a furnace. Thereafter, the outer peripheral portion of the upper surface of the heat sink 18 is joined to the brazing material layer 37 in the projecting portion 30 and brazed. As a result, the light emitting element ceramic package 10 shown in FIG. 2 is completed.

  About the ceramic package 10 for light emitting elements obtained as mentioned above, an element mounting process is further performed after this, and mounting of LED element 22 and wire bonding are implemented. Next, a filling process is performed to fill the cavity 21 with the transparent resin 25. At this time, the transparent resin 25 also enters the recess 39, but since the recess 39 does not penetrate the heat sink 18, there is no fear that the transparent resin 25 leaks out of the package. Next, the transparent resin 25 thus filled is thermally cured, thereby completing the ceramic package 1 with a light emitting element having a structure for preventing the transparent resin 25 from falling off. The obtained ceramic package 1 is mounted on the organic wiring board 2 using the solder 3 (see FIG. 1).

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the ceramic package 10 for light emitting device of the present embodiment, since the resin fixing recess 39 is provided around the mounting portion 23 on the upper surface of the heat sink 18, the transparent resin 25 filled in the cavity 21 and Thus, the transparent resin 25 can be reliably fixed. Further, since the resin fixing recess 39 is located behind the LED element 22 in the cavity 21, it does not block the light emitted from the LED element 101 unlike the conventional ceramic package 100, and the light emission efficiency. Can be avoided. Furthermore, since the recess 39 is provided in the heat sink 18 made of a metal material, it is excellent in workability compared with the case where the flange 111 is provided on the ceramic substrate 107 as in the prior art, and is optimal for fixing the transparent resin 25. A shaped recess 39 can be provided. Thus, although the ceramic package 10 for light emitting elements of this embodiment has the structure which prevents the transparent resin 25 from falling off, the light from the LED elements 22 is not blocked by the structure, and is manufactured relatively easily. be able to.

  (2) In the case of the present embodiment, since the resin fixing recess 39 is an annular groove surrounding the mounting portion 23, the transparent resin 25 provided in the cavity 21 can be fixed uniformly in the circumferential direction. it can. Moreover, since the recessed part 39 forms the space of the cross-sectional shape which becomes wide as it goes to the board | substrate back surface side, what is called an anchor effect is acquired and the transparent resin 25 can be fixed reliably.

  (3) Since the heat sink 18 is provided in the ceramic package 10 for the light emitting element of the present embodiment, the heat generated by the LED element 22 can be efficiently dissipated, and light is emitted by the temperature rise of the LED element 22 itself. Problems such as changes in luminance and emission wavelength can be avoided.

In addition, you may change embodiment of this invention as follows.
In the ceramic package 10 for light emitting element of the above embodiment, the light reflecting layer 28 mainly composed of the tungsten metallized layer or the like is formed on the inner surface of the cavity 21. However, this may be omitted. That is, the white ceramic may be exposed on the inner surface of the cavity 21 and the surface thereof may be used as a light reflecting surface.

  8 to 11 show another embodiment of the ceramic package 50, 60, 70, 80. The ceramic package 50 of FIG. 8 is different from the above embodiment in that the protruding portion 30 of the intermediate ceramic layer 15 is formed in a tapered shape that becomes wider toward the lower surface side. In this way, the transparent resin 25 surely enters the recess 39 around the mounting portion 23 when the transparent resin 25 is filled. In addition, since a sufficient contact area between the transparent resin 25 and the ceramic substrate 11 can be secured, the transparent resin 25 can be more reliably fixed.

  The ceramic package 60 of FIG. 9 differs from the above embodiment in that the bottom surface of the recess 39 in the heat sink 18 is a roughened surface 61 made of fine irregularities. The roughened surface 61 is formed, for example, by performing a surface roughening process that roughens the metal surface. This surface roughening treatment may be a physical treatment or a chemical treatment. By forming the roughened surface 61 in the recess 39 in this way, the contact area with the transparent resin 25 is increased, so that the transparent resin 25 can be more reliably fixed. In addition, you may make it form only the roughening surface 61 which consists of a fine unevenness | corrugation, without forming the recessed part 39. FIG.

  The ceramic package 70 of FIG. 10 is different from the above embodiment in that a through hole 71 is provided in the heat sink 18 in the thickness direction. A plurality of through holes 71 are provided at equal intervals around the mounting portion 23, and the transparent resin 25 is fixed by providing these through holes 71.

  The ceramic package 80 of FIG. 11 differs from the above embodiment in that the shape of the recess 81 provided in the heat sink 18 is meandered around the mounting portion 23. The recess 81 is formed so that almost half of the recess 81 covers the opening edge of the hole 17. In this ceramic package 80, when brazing material is used more than necessary when brazing the heat sink 18, the brazing material may enter the recess 81 on the edge of the ceramic substrate 11. The brazing material does not enter the recess 81 at a position far from 11. Accordingly, even after the heat sink 18 is brazed, a sufficient area of the recess 39 for fixing the transparent resin 25 can be secured.

  In the above embodiment, the structure in which one LED element 22 is mounted in the cavity 21 is illustrated, but the number may be two or more. As a specific example, an elliptical cavity is formed in a plan view, and red, green, and blue LED elements 22 are mounted on substantially the center of the bottom surface of the cavity. If comprised in this way, the apparatus which can obtain high-intensity white light is realizable.

  In the ceramic package 10 of the above embodiment, the heat sink 18 is bonded to the ceramic substrate 11 using a silver brazing material, but other brazing materials such as a copper brazing material may be used instead of the silver brazing material. . However, when the LED element 22 is brazed to the mounting portion 23 of the heat sink 18, the heat sink 18 is bonded to the ceramic substrate 11 using a brazing material having a higher melting point than the brazing material for bonding the LED element 22. Is preferred.

  Next, in addition to the technical ideas described in the claims, the technical ideas grasped by the embodiments described above are listed below.

  (1) A ceramic substrate having a substrate main surface and a substrate back surface, and having a hole opening on the substrate main surface side and the substrate back surface side, and a light emitting element on the metal body main surface and the metal body main surface. A heat dissipating metal body attached to the ceramic substrate so as to close the hole portion from the back surface side of the substrate with the metal body main surface, and on the metal body main surface side. In a ceramic package for a light emitting device, in which a cavity is formed and a transparent resin covering the mounting portion and the light emitting device can be filled in the cavity, a resin fixing groove is formed around the mounting portion on the metal body main surface. A ceramic package for a light-emitting element, comprising:

  (2) The ceramic package for a light emitting device according to (1), wherein the depth of the groove is not more than half of the thickness of the metal body for heat dissipation.

  (3) The ceramic package for a light emitting device according to 1 or 2, wherein the bottom surface of the groove is a roughened surface.

  (4) The ceramic package for a light-emitting element according to any one of the above 1 to 3, wherein the groove forms a space having a cross-sectional shape that becomes wider toward the back side of the substrate.

  (5) The ceramic package for a light emitting device according to any one of the above 1 to 4, wherein the groove is an annular groove surrounding the mounting portion.

  (6) In the above 5, the hole and the groove are circular when viewed from a direction perpendicular to the substrate main surface, and the diameter of the inner peripheral edge of the groove is smaller than the value of the minimum diameter of the hole, A ceramic package for a light emitting device, wherein a diameter of an outer peripheral edge of the groove is larger than a value of a minimum diameter of the hole.

  (7) The ceramic package for a light emitting element according to any one of the above 1 to 4, wherein the groove is a groove meandering so that a part of the groove covers an opening edge of the hole.

  (8) In any one of the above 1 to 7, the ceramic substrate is a multilayer substrate composed of a plurality of ceramic layers, and the heat dissipating metal body is attached to an intermediate ceramic layer located in an inner layer. A ceramic package for light emitting devices.

  (9) The ceramic package for a light-emitting element according to 8 above, wherein the intermediate ceramic layer is extended toward the center of the package, and the extended portion of the intermediate ceramic layer is formed in a tapered shape extending toward the lower surface side. .

  (10) The ceramic package for a light emitting element according to 8, wherein the metal body for heat dissipation is brazed to the ceramic substrate using a brazing material.

  (11) The ceramic package for a light emitting element according to 10 above, wherein the brazing material has a higher melting point than the brazing material for joining the light emitting elements.

  (12) The ceramic package according to any one of 1 to 11 above, a light emitting element mounted on the mounting portion of the heat dissipating metal body, and a transparent resin filled in the cavity so as to cover the light emitting element And a light emitting device.

1 is a schematic cross-sectional view showing a ceramic package with a light emitting device according to an embodiment of the present invention. 1 is a schematic cross-sectional view showing a ceramic package of one embodiment. The top view which shows the ceramic package of one Embodiment. Explanatory drawing which shows the manufacturing method of the ceramic package of one Embodiment. Explanatory drawing which shows the manufacturing method of the ceramic package of one Embodiment. Explanatory drawing which shows the manufacturing method of the ceramic package of one Embodiment. Explanatory drawing which shows the manufacturing method of the ceramic package of one Embodiment. The schematic sectional drawing which shows the ceramic package of another embodiment. The schematic sectional drawing which shows the ceramic package of another embodiment. The schematic sectional drawing which shows the ceramic package of another embodiment. The top view which shows the ceramic package of another embodiment. The schematic sectional drawing which shows the conventional ceramic package.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 50, 60, 70, 80 ... Ceramic package for light emitting elements 11 ... Ceramic substrate 12 ... Substrate main surface 13 ... Substrate back surface 14, 15, 16 ... Ceramic layer 17 ... Hole 18 ... Heat sink as metal body for heat dissipation 19 DESCRIPTION OF SYMBOLS ... Metal body main surface 20 ... Hole side surface 21 ... Cavity 22 ... LED element as a light emitting element 23 ... Mounting part 25 ... Transparent resin 30 ... Overhang | projection part 39,81 ... Concave part as uneven | corrugated part for resin fixing 40 ... Opening 71 in the recess 71. Through hole as an uneven portion for fixing the resin

Claims (5)

A ceramic substrate having a substrate main surface and a substrate back surface, and having a hole opening on the substrate main surface side and the substrate back surface side;
A metal body main surface and a mounting portion on which the light emitting element can be mounted on the metal body main surface, and the hole is attached to the ceramic substrate so as to be closed from the back surface side of the substrate by the metal body main surface. A ceramic package for a light emitting element, comprising a metal body for heat dissipation, wherein a cavity is formed by the main surface of the metal body and a side surface of the hole, and a transparent resin covering the mounting portion and the light emitting element can be filled in the cavity In
A ceramic package for a light-emitting element, wherein an uneven portion for fixing a resin is provided around the mounting portion on the metal body main surface.   2. The ceramic package for a light emitting element according to claim 1, wherein the uneven portion for fixing the resin is a recess that does not penetrate the metal body for heat dissipation.   The ceramic package for a light emitting device according to claim 2, wherein the concave portion is a groove portion surrounding the mounting portion.   4. The ceramic package for a light emitting element according to claim 2, wherein the opening of the recess is partially covered with the ceramic substrate.   The ceramic substrate is a multilayer substrate composed of a plurality of ceramic layers, and the multilayer substrate is composed of at least one layer of the plurality of ceramic layers, and has a protruding portion protruding from a side surface of the hole portion. 5. The ceramic for a light-emitting element according to claim 1, wherein the metal body main surface of the metal body for heat dissipation is brazed to the projecting portion via a brazing material. package.

Images