JP2008124297A - Light-emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device having good light emitting characteristics and also high reliability. <P>SOLUTION: A surface mounting LED (light emitting device) includes a substrate 1 on which an LED element 20 is mounted, a reflecting frame 30 fixed to the upper surface of the substrate 1 to surround the LED element 20 and having an internal side face 32 serving as a reflective surface for reflecting light from the LED element 20, and a translucent member 40 filled inside the frame 30 for sealing the LED element 20 and bonding wires 22 and 23. In addition, angles θ1 and θ2 formed between the side face 32 and the substrate 1 are structured to be acute along an entire circumference of the side face 32 in an opening 31 of the reflecting frame. That is, the opening 31 of the frame 30 is structured to taperedly narrow upwardly (in the direction of the arrow A). In addition, the frame 30 is made of a metallic material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device including a reflective frame that reflects light from a light emitting element.

2. Description of the Related Art Conventionally, a light emitting device including a reflection frame that reflects light from a light emitting element is known (see, for example, Patent Document 1). In Patent Document 1, an LED (Light Emitting Diode) chip electrically connected to an electrode part on a substrate via a bonding wire, and a reflection frame having an opening having an inner surface as a reflection surface A surface-mounted light-emitting device in which a body is fixed on a substrate is described. The opening of the reflecting frame of the light emitting device is formed to be tapered upward (in the direction opposite to the substrate), and the LED chip and the bonding wire are sealed in the opening of the reflecting frame. A light-transmitting resin (translucent member) is filled. In addition, the light-transmitting resin contains a phosphor and 20 wt% to 80 wt% of a diffusing agent, which suppresses variation in color tone when the light emitting device emits light.
JP 2005-93712 A

  However, in the light emitting device described in Patent Document 1, since the opening of the reflective frame is formed so as to taper upward, thermal expansion between the reflective frame and the light-transmitting resin is performed. Due to the difference in rate, there is a disadvantage that peeling easily occurs at the interface between the light-transmitting resin and the reflective frame. In addition, when the light-transmitting resin expands due to heat generated by the light emission of the LED chip, the force that moves the light-transmitting resin upward (in the direction opposite to the substrate) is increased by the tapered inner surface that spreads upward. Therefore, there is an inconvenience that the light transmissive resin moves upward, so that peeling easily occurs at the interface between the light transmissive resin and the reflective frame.

  As described above, in the light-emitting device described in Patent Document 1, an air layer is formed between the light-transmitting resin and the reflective frame by peeling at the interface between the light-transmitting resin and the reflective frame. Therefore, this air layer has a disadvantage that the refractive index of the light emitted from the LED chip changes at the interface between the light transmitting resin and the reflecting surface of the reflecting frame. For this reason, it becomes difficult for light from the LED chip to be incident on the reflecting surface of the reflecting frame body with a desired refractive index, which causes a disadvantage that the luminance of the light emitting device is reduced due to irregular reflection of light. . Thereby, there exists a problem that the light emission characteristic of a light-emitting device falls.

  Moreover, since the LED chip and the bonding wire sealed with the light-transmitting resin are lifted upward as the light-transmitting resin moves upward, the LED chip is peeled off from the substrate, and the bonding wire and the substrate There is an inconvenience that the electrical connection with the electrode portion is interrupted. As a result, there arises a problem that the light emitting device is not turned on (operated), so that the reliability of the light emitting device is lowered.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a light-emitting device having good light-emitting characteristics and high reliability.

  In order to achieve the above object, a light-emitting device according to one aspect of the present invention includes a base on which a light-emitting element is mounted, a base that surrounds the light-emitting element, and an inner peripheral surface that is fixed to the base. A reflecting frame that is a reflecting surface that reflects light from the light emitting element; and a translucent member that is filled inside the reflecting frame and seals the light emitting element, and includes at least an inner peripheral surface of the reflecting frame. The angle formed by the part and the surface of the base is configured to be an acute angle.

  In the light emitting device according to this aspect, as described above, by forming an acute angle between at least a part of the inner peripheral surface of the reflection frame and the surface of the base, heat generated by light emission of the light emitting element, etc. Even when the temperature of the translucent member is increased by the above, it is possible to suppress the expansion of the translucent member at the acute angle portion of the inner peripheral surface of the reflective frame, and at the same time, the inner periphery of the reflective frame Since the translucent member can be pressed against the surface, even if there is a large difference in thermal expansion coefficient between the reflective frame and the translucent member, peeling occurs at the interface between the reflective frame and the translucent member. Can be suppressed. In addition, when the angle formed by at least a part of the inner peripheral surface of the reflection frame and the surface of the base is configured to be an acute angle, when the temperature of the translucent member rises due to heat generated by light emission of the light emitting element, etc. Even if a force for moving the translucent member upward (opposite to the base) is generated, the translucent member moves upward at a portion formed at an acute angle of the inner peripheral surface of the reflection frame. And at the same time, the translucent member can be pressed against the inner peripheral surface of the reflective frame, so that the peeling can also occur at the interface between the reflective frame and the translucent member. Can be suppressed. For this reason, an air layer is formed between the reflective surface (inner peripheral surface) of the reflective frame and the translucent member by suppressing the occurrence of peeling at the interface between the reflective frame and the translucent member. Therefore, the light from the light emitting element can be incident on the reflection surface of the reflection frame with a desired refractive index. As a result, it is possible to suppress a decrease in luminance of the light-emitting device due to irregular reflection of light, and thus a light-emitting device having favorable light-emitting characteristics can be obtained.

  Further, in one aspect, by suppressing the translucent member from moving upward, it is possible to prevent the light emitting element sealed by the translucent member from being lifted upward, and to emit light. Even when the electrode portion of the element and the electrode portion of the base are electrically connected via a bonding wire, and the bonding wire is sealed with a light-transmitting resin, the light-transmitting member remains upward. By suppressing the movement, the bonding wire sealed by the translucent member can be prevented from being lifted upward. Accordingly, it is possible to suppress the light emitting element from being peeled off from the base, and it is possible to suppress disconnection of the electrical connection between the bonding wire and the electrode portion of the base. It is possible to suppress the occurrence of inconvenience such as no longer lighting (operation). As a result, a highly reliable light-emitting device can be obtained. The opening area on the lower surface side of the reflecting frame body is set to the opening area on the upper surface side of the reflecting frame body by configuring the angle formed by at least a part of the inner peripheral surface of the reflecting frame body and the surface of the base to an acute angle. Therefore, when the reflecting frame is fixed on the base, a wide area on the base on which the light emitting element is mounted can be secured. Thus, a plurality of light emitting elements can be mounted on the base without increasing the size of the light emitting device.

  In the light emitting device according to the above aspect, the angle formed by the inner peripheral surface of the reflection frame and the surface of the base is preferably configured to be an acute angle over the entire circumference of the inner peripheral surface. With this configuration, even when the temperature of the translucent member rises due to heat generated by light emission of the light emitting element, the translucent member is prevented from expanding over almost the entire inner peripheral surface of the reflective frame. At the same time, since the translucent member can be pressed almost on the entire inner peripheral surface of the reflective frame, the difference in thermal expansion coefficient between the reflective frame and the translucent member is large. Even in this case, it is possible to suppress the peeling at the interface between the reflective frame and the translucent member over almost the entire inner peripheral surface of the reflective frame. Further, even when the temperature of the translucent member rises due to heat generated due to light emission of the light emitting element, the translucent member is formed on almost the entire inner peripheral surface formed with an acute angle with the surface of the base. It is possible to suppress the upward movement, and at the same time, the translucent member can be pressed almost on the entire inner peripheral surface of the reflective frame, so that the inner peripheral surface of the reflective frame can be substantially It is possible to suppress peeling at the interface between the reflective frame and the translucent member over the entire surface. For this reason, almost all the inner peripheral surface of the reflective frame is prevented from being peeled off at the interface between the reflective frame and the translucent member. Since it is possible to suppress the formation of an air layer between the reflective surface (inner peripheral surface) of the frame body and the translucent member, the light emitting element is formed on almost the entire inner peripheral surface of the reflective frame body. Can be incident on the reflection surface (inner peripheral surface) of the reflection frame body with a desired refractive index. As a result, it is possible to easily suppress the luminance of the light emitting device from being lowered due to irregular reflection of light, and thus a light emitting device having good light emitting characteristics can be easily obtained.

  Further, by suppressing the translucent member from moving upward, it is possible to easily prevent the light emitting element sealed by the translucent member from being lifted upward, and to form an electrode of the light emitting element. And the electrode part of the base are electrically connected via a bonding wire, and the translucent member moves upward even when the bonding wire is sealed with a translucent resin. By suppressing the above, it is possible to easily suppress the bonding wire sealed by the translucent member from being lifted upward. Thereby, it is possible to easily suppress the light emitting element from being peeled off from the base, and it is possible to easily suppress the disconnection of the electrical connection between the bonding wire and the electrode portion of the base. Therefore, it is possible to easily suppress inconveniences such as the light emitting device from being turned on (operating). As a result, a highly reliable light-emitting device can be easily obtained. The angle formed by the inner peripheral surface of the reflective frame and the surface of the base is configured to be an acute angle over the entire circumference of the inner peripheral surface, thereby reducing the opening area on the lower surface side of the reflective frame. Since it can be easily made larger than the opening area on the upper surface side, when the reflection frame is fixed on the base, a wide area on the base on which the light emitting element is mounted can be easily secured. Thereby, a plurality of light emitting elements can be easily mounted on the base without enlarging the light emitting device.

  In the light emitting device according to the above aspect, preferably, a stepped portion that is recessed from the inner peripheral surface is provided on the inner peripheral surface of the reflective frame. If comprised in this way, since the translucent member with which the level | step-difference part is filled can be engaged with the translucent member with which the level | step-difference part was filled, the heat_generation | fever accompanying light emission of a light emitting element. Even when a force to move the translucent member upward (opposite direction from the base) is generated when the temperature of the translucent member rises due to the engagement between the translucent member and the stepped portion, It is possible to more easily suppress the translucent member from moving upward. For this reason, it is possible to more easily suppress the inconvenience that peeling occurs at the interface between the reflective frame and the translucent member due to the translucent member moving upward. It is possible to more easily suppress the formation of an air layer between the reflective surface (inner peripheral surface) of the frame and the translucent member, and the translucent member moves upward. Thus, it is possible to more easily suppress the occurrence of inconvenience such as the light emitting device not being turned on (operating). As a result, it is possible to obtain a light-emitting device having good light emission characteristics and high reliability more easily.

  In the light-emitting device according to the above aspect, the reflecting frame is preferably made of a metal material. With this configuration, since the metal material has better thermal conductivity than the resin material, the heat generated in the light-emitting element is generated from the reflection frame compared to the case where the reflection frame is configured from the resin material. Heat can be radiated efficiently. In addition, when such a configuration is applied to the light emitting device according to the above aspect, even if a metal material that has a large difference in thermal expansion coefficient from the light transmissive member is used, the light emitting device has good light emission characteristics and is reliable. Can be obtained.

  In the light emitting device according to the above aspect, it is preferable that a plurality of light emitting elements are mounted on the base. When such a configuration is applied to the light-emitting device according to the above aspect, when light of different colors is emitted from a plurality of light-emitting elements, the light-emitting element is reflected by the reflecting surface configured at an acute angle with the surface of the base. Since a part of the light can be reflected to the light emitting element side, the light color mixing (color mixing) can be improved. As a result, since the light emitting device can emit light with a desired color, good light emission characteristics can also be obtained.

  As described above, according to the present invention, it is possible to obtain a light emitting device having excellent light emission characteristics and high reliability.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the present embodiment, a case will be described in which the present invention is applied to a surface-mounted LED (Light Emitting Diode) which is an example of a light-emitting device.

  FIG. 1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. FIG. 2 is a plan view of the surface-mounted LED according to the embodiment of the present invention shown in FIG. is there. 3 is a plan view of the surface-mounted LED according to the embodiment of the present invention shown in FIG. 1 as viewed from below, and FIG. 4 is a cross-sectional view taken along the line 100-100 in FIGS. It is. 5 and 6 are views for explaining a reflection frame body of the surface-mounted LED according to the embodiment of the present invention shown in FIG. First, the structure of a surface-mounted LED according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, a surface-mount LED according to an embodiment includes a substrate 1 made of glass epoxy or the like, a light-emitting diode element (LED element) 20 and a reflection frame 30 fixed on the upper surface of the substrate 1, And a translucent member 40 filled inside the reflection frame 30. In addition, the board | substrate 1 is an example of the "base" of this invention, and the LED element 20 is an example of the "light emitting element" of this invention.

  Moreover, the board | substrate 1 is comprised from the double-sided board | substrate with which the electrode layer was formed on the upper surface and lower surface of the insulation base material 2, as shown in FIG. Further, as shown in FIG. 3, the substrate 1 has a length of about 3.5 mm in the direction of the arrow X as viewed in a plan view, and also has a length of about 3. It is formed in a square shape having a length of 5 mm and has a thickness of about 0.2 mm.

  In addition, the electrode layer formed on the upper surface of the insulating base 2 has a plurality of (three) polar electrode layers 3 having a positive polarity and a negative polarity, as shown in FIGS. A plurality of (three) polar electrode layers 4 and a nonpolar (neutral) electrode layer 6 having no polarity electrically separated through the polar electrode layers 3 and 4 and the insulating groove 5 Has been. In addition, the polar electrode layers 3 and 4 are formed on the upper surface of the insulating base 2 and in regions located inside the openings 31 of the reflection frame 30 to be described later. The nonpolar electrode layer 6 is formed on a region other than the region where the polar electrode layers 3 and 4 are formed, on the upper surface of the insulating base 2. Specifically, as shown in FIGS. 1, 2, and 4, the nonpolar electrode layer 6 includes polar electrode layers 3 and 4, insulating grooves 5 around the polar electrode layers 3 and 4, and The substrate 1 is formed in a region other than a region where a later-described stepped portion 1a formed on the outer peripheral portion of the upper surface of the substrate 1 is formed.

  Also, as shown in FIG. 3, the electrode layer formed on the lower surface of the insulating base 2 is mainly composed of electrode layers 7 and 8 used for wiring and an electrode layer 9 used mainly for heat dissipation. It is configured. Further, a plurality of electrode layers 7 and 8 used for wiring are formed so as to respectively correspond to the plurality of polar electrode layers 3 and 4 described above, and as shown in FIG. The polar electrode layers 3 and 4 are electrically connected to each other through a connection portion 2b formed in the hole 2a. In addition, the electrode layer 9 used for heat dissipation is thermally connected to the nonpolar electrode layer 6 via connection portions 2 d formed in the plurality of through holes 2 c of the insulating base 2. The polar electrode layers 3 and 4, the nonpolar electrode layer 6, and the electrode layers 7 to 9 are made of a conductive material having excellent thermal conductivity such as copper.

  Further, a stepped portion 1 a where an adhesive layer 10 for fixing the reflective frame 30 on the substrate 1 is formed on the outer peripheral portion on the upper surface of the substrate 1. The step portion 1 a has a function of making the upper surface of the adhesive layer 10 and the upper surface of the nonpolar electrode layer 6 substantially the same surface. Thereby, when the reflecting frame 30 is fixed on the substrate 1 through the adhesive layer 10, the lower surface of the reflecting frame 30 can be brought into direct contact with the upper surface of the nonpolar electrode layer 6.

  In addition, as shown in FIGS. 1 and 2, three LED elements 20 are electrically conductive in a region located on the upper surface of the nonpolar electrode layer 6 and inside the opening 31 of the reflection frame 30. The adhesive is fixed with an adhesive 21 (see FIG. 4) or the like. The LED element 20 is arranged and fixed on the upper surface of the nonpolar electrode layer 6 between the positive polar electrode layer 3 and the negative polar electrode layer 4 at a predetermined interval. The LED elements 20 each have a function of emitting red, green, and blue light. When these LED elements 20 emit light at the same time, the colors are mixed and emitted. .

  Further, the upper surface of the positive polar electrode layer 3 and the electrode portion of the LED element 20 are electrically connected via the bonding wires 22 respectively, and the upper surface of the negative polar electrode layer 3 The electrode portions of the LED elements 20 are electrically connected via bonding wires 23, respectively. Therefore, when a voltage is applied to the electrode layer 7 and the electrode layer 8 shown in FIG. 4, a current flows through the LED elements 20 through the bonding wires 22 and 23, and each LED element 20 has a unique wavelength. Emits light. The bonding wires 22 and 23 are made of fine metal wires made of Au, Ag, Al, or the like.

  In addition, as shown in FIGS. 1 to 4, the heat generated by the light emission of the LED element 20 is radiated by the nonpolar electrode layer 6 formed on the upper surface of the insulating base 2, and the nonpolar electrode layer 6. The heat is also radiated by the reflective frame 30 in contact with the. Further, the heat generated in the LED element 20 is also generated in the heat dissipation electrode layer 9 that is thermally connected to the nonpolar electrode layer 6 through the connection portion 2d formed in the through hole 2c of the insulating base 2. Heat is dissipated. Further, when the electrode layer 9 is connected to the heat sink portion of the circuit board, the heat dissipation effect is further promoted. As described above, the surface-mounted LED according to the embodiment is configured to be able to efficiently dissipate the heat generated in the LED element 20, thereby suppressing a decrease in light emission efficiency due to a temperature rise of the LED element 20. In addition, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED are obtained.

  Further, as shown in FIGS. 1 and 2, the reflection frame 30 is made of a metal material mainly composed of aluminum having excellent heat dissipation and is formed in a planar shape having almost the same size as the substrate 1. Has been. Specifically, the reflective frame 30 has a square shape having a length of about 3.5 mm in the arrow X direction and a length of about 3.5 mm in the arrow Y direction when seen in a plan view. Is formed. The reflective frame 30 has a thickness of about 0.6 mm.

  In addition, an opening 31 is formed in the central portion of the reflection frame 30, and the inner side surface 32 of the opening 31 is configured to function as a reflection surface that reflects light emitted from the LED element 20. ing. The surface of the inner side surface 32 of the opening 31 is subjected to a silver plating process, an alumite process, or the like. Further, the reflection frame 30 is fixed on the substrate 1 via the adhesive layer 10 (see FIG. 4) so as to surround the LED element 20 by the inner surface 32 of the opening 31.

  Here, in this embodiment, as shown in FIGS. 1 and 4, the inner side surface 32 of the opening portion 31 includes a first inner side surface 32 a formed on the upper side (arrow A direction) of the opening portion 31, and an opening. The second inner surface 32b is formed below the portion 31 and is recessed from the first inner surface 32a. Further, the first inner side surface 32 a and the second inner side surface 32 b are connected via a step surface 33. That is, the second inner side surface 32 b is configured by forming a stepped portion retreated from the first inner side surface over the entire circumference of the inner side surface 32.

  In the present embodiment, the first inner side surface 32a of the opening 31 has an angle θ1 (see FIG. 1) between the first inner side surface 32a and the surface of the substrate 1, as shown in FIGS. 5) is configured to have an acute angle over the entire circumference of the first inner side surface 32a. Specifically, the first inner side surface 32a of the opening 31 of the reflection frame 30 tapers upward (in the direction of arrow A) above the opening 31 as shown in FIGS. It is formed so as to narrow in a shape. Further, as shown in FIG. 2, the first inner side surface 32a of the opening 31 is formed in a circular shape when seen in a plan view. The inner side surface 32 and the first inner side surface 32a are examples of the “inner peripheral surface” and the “reflecting surface” in the present invention.

  In the present embodiment, as shown in FIGS. 1, 2, and 6, the second inner side surface 32b has an angle θ2 (see FIG. 6) formed with the surface of the substrate 1 such that the second inner side surface 32b It is comprised so that it may become an acute angle over the perimeter of. Specifically, as shown in FIGS. 1 and 4, the second inner side surface 32 b narrows in a tapered shape above the opening 31 (in the direction of arrow A), as with the first inner side surface 32 a described above. Is formed. Further, as shown in FIG. 2, the second inner side surface 32b is formed in a circular shape when seen in a plan view. The angle θ2 formed between the second inner side surface 32b and the surface of the substrate 1 is configured to be substantially the same as the angle θ1 formed between the first inner side surface 32a and the surface of the substrate 1. The second inner side surface 32b and the stepped surface 33 are examples of the “stepped portion”, “inner peripheral surface”, and “reflecting surface” of the present invention, respectively.

  Further, the angle θ1 formed by the first inner side surface 32a and the surface of the substrate 1 and the angle θ2 formed by the second inner side surface 32b and the surface of the substrate 1 are separated and transmitted at the interface with the translucent member 40. Considering the adhesion with the light-sensitive member 40, etc., it is preferable to make it small, but if it is made too small, the effect of extracting light from the LED element 20 is reduced. For this reason, it is preferable that each of the angles θ1 and θ2 is configured to have an acute angle of 80 ° or more, and the surface-mounted LED according to the embodiment is configured to have an acute angle of 85 ° or more.

  Moreover, the translucent member 40 is comprised from resin materials, such as an epoxy resin and a silicone resin, as shown in FIG.1, FIG.2, and FIG.4, In the opening part 31 of the reflective frame 30, It is provided so as to close the opening 31. Further, the translucent member 40 has a function of preventing the LED element 20 and the bonding wires 22 and 23 from coming into contact with air, moisture, and the like by sealing the LED element 20 and the bonding wires 22 and 23. ing. Further, the translucent member 40 is provided so as to be in contact with the second inner side surface 32b and the step surface 33, and is configured so that the translucent member 40 and the step surface 33 of the opening 31 are engaged. ing.

  In the present embodiment, as described above, the angle θ1 formed by the first inner side surface 32a of the reflection frame 30 and the surface of the substrate 1 is configured to be an acute angle over the entire circumference of the first inner side surface 32a. Even when the temperature of the translucent member 40 rises due to heat generated by the light emission of the element 20, the translucent member 40 is prevented from expanding over almost the entire first inner side surface 32 a of the reflective frame 30. At the same time, the translucent member 40 can be pressed against almost the entire first inner surface 32a of the reflective frame 30, so that the thermal expansion between the reflective frame 30 and the translucent member 40 can be achieved. Even when the rate difference is large, it is possible to suppress the peeling at the interface between the reflective frame 30 and the translucent member 40 on almost the entire first inner side surface 32a of the reflective frame 30. Even when the temperature of the translucent member 40 rises due to heat generated by the light emission of the LED element 20, the translucent member 40 is upward (arrow A) over almost the entire first inner side surface 32 a of the reflective frame 30. ), And at the same time, the translucent member 40 can be pressed against almost the entire first inner side surface 32a of the reflective frame 30, so that the reflective frame 30 It is possible to suppress the occurrence of peeling at the interface between the reflective frame 30 and the translucent member 40 over substantially the entire first inner surface 32a. For this reason, by suppressing the occurrence of peeling at the interface between the reflective frame body 30 and the translucent member 40 over almost the entire first inner side surface 32a of the reflective frame body 30, Since it is possible to suppress the formation of an air layer between the reflective surface (first inner side surface 32a) of the reflective frame 30 and the translucent member 40 over almost the entire side surface 32a, the reflective frame body The light from the LED element 20 can be incident on the reflecting surface (first inner side surface 32a) of the reflecting frame 30 with a desired refractive index over almost the entire surface of the first inner side surface 32a. As a result, it is possible to easily suppress the brightness of the surface-mounted LED from being lowered due to irregular reflection of light and the like, and thus a surface-mounted LED having good light emission characteristics can be easily obtained.

  Moreover, in this embodiment, the LED element 20 and the bonding wires 22 and 23 sealed by the translucent member 40 are lifted upward by suppressing the translucent member 40 from moving upward. Therefore, it is possible to easily prevent the LED element 20 from being peeled from the substrate 1, and the bonding wires 22 and 23 and the polar electrode layers 3 and 4 of the substrate 1 It is possible to easily suppress disconnection of the electrical connection. Thereby, since it is possible to easily suppress the occurrence of inconvenience such as the surface mounted LED not being lit (operated), a highly reliable surface mounted LED can be easily obtained.

  In the present embodiment, the second inner side surface 32b that is recessed from the first inner side surface 32a is formed on the lower side of the opening 31 of the reflection frame 30, thereby transmitting light due to heat generated by light emission of the LED element 20. Even when the temperature of the light transmissive member 40 is increased, the light transmissive member 40 can be easily prevented from moving upward by the engagement of the light transmissive member 40 and the stepped surface 33. It is possible to more easily suppress the inconvenience that peeling occurs at the interface between the reflective frame 30 and the translucent member 40 due to the upward movement of the conductive member 40. For this reason, it is easier to form an air layer between the reflective surface (the first inner side surface 32a, the second inner side surface 32b, and the stepped surface 33) of the reflective frame 30 and the translucent member 40. In addition, it is possible to more easily suppress the occurrence of inconveniences such as the surface mounted LED not lighting (operating) due to the translucent member 40 moving upward. . As a result, it is possible to easily obtain a surface-mount type LED having good light emission characteristics and high reliability.

  In the present embodiment, the angle θ2 formed by the second inner side surface 32b and the surface of the substrate 1 is configured to be an acute angle over the entire circumference of the second inner side surface 32b. The same effect as that obtained when the angle θ1 formed between the first inner surface 32a and the surface of the substrate 1 is formed as an acute angle over the entire circumference of the first inner surface 32a can be obtained.

  In the present embodiment, the angle θ1 formed by the first inner side surface 32a of the reflection frame 30 and the surface of the substrate 1 is configured to be an acute angle over the entire circumference of the first inner side surface 32a. The angle θ2 formed by the second inner side surface 32b and the surface of the substrate 1 is configured to be an acute angle over the entire circumference of the second inner side surface 32b, so that the lower side of the opening 31 (the lower surface side of the reflection frame 30). Since the opening area can be easily increased as compared with the opening area on the upper side of the opening 31 (the upper surface side of the reflecting frame 30), when the reflecting frame 30 is fixed on the substrate 1, the LED element The area on the substrate 1 on which 20 is mounted can be easily secured. Thereby, the several LED element 20 can be easily mounted on the board | substrate 1 without enlarging surface mount type LED.

  In the present embodiment, since the reflective frame 30 is made of a metal material mainly composed of aluminum, the metal material mainly composed of aluminum has better thermal conductivity than a resin material or the like. Compared with the case where the reflective frame 30 is made of a resin material, the heat generated in the LED element 20 can be efficiently radiated from the reflective frame 30.

  Moreover, in this embodiment, the inner side surface 32 comprised at the acute angle with the surface of the board | substrate 1 by mounting on the board | substrate 1 the three LED elements 20 which light-emit red, green, and blue light, respectively. Since the (reflecting surface) allows part of the light from the LED element 20 to be reflected toward the LED element 20, the light color mixing (color mixing) can be improved. As a result, since the surface-mounted LED can emit light with a desired color, it is possible to obtain good light emission characteristics.

  7 to 12 are views for explaining a manufacturing process of the surface-mounted LED according to the embodiment shown in FIG. Next, with reference to FIG. 1, FIG. 2, FIG. 4 and FIG. 7 to FIG.

  First, as shown in FIG. 7, a plurality of openings 31 are formed in a plate-like member 50 having aluminum as a main component and having a thickness of about 0.6 mm by pressing. At this time, the opening 31 is formed so that the inner side surface 32 is formed in a circular shape and is tapered toward the upper side of the opening 31.

  Next, as shown in FIG. 8, the plate-like member 50 is fixed on the substrate 1 via the adhesive layer 10 (see FIG. 4). Specifically, as shown in FIGS. 1 and 2, the plate-like member 50 is formed so that the polar electrode layers 3 and 4 formed on the substrate 1 are surrounded by the opening 31 of the plate-like member 50. Fix on the substrate 1. Then, as shown in FIG. 9, the three LED elements 20 are fixed on the upper surface of the substrate 1 and in the region inside the opening 31 formed in the plate-like member 50. Specifically, as shown in FIG. 2, three LED elements 20 are arranged and fixed in a predetermined region on the nonpolar electrode layer 6 via a conductive adhesive 21 (see FIG. 4). To do. Subsequently, as shown in FIGS. 2 and 10, the electrode portions of the LED element 20 and the polar electrode layers 3 and 4 on the substrate 1 are electrically connected by bonding wires 22 and 23, respectively.

  Next, as shown in FIG. 11, an opening 31 formed in the plate-like member 50 is filled with a light transmissive resin such as an epoxy resin or a silicon resin and cured. Thereby, the translucent member 40 is provided in each of the plurality of openings 31 so as to seal the LED element 20 and the bonding wires 22 and 23.

  Next, as shown in FIG. 12, a dicing adhesive sheet 61 is attached to the lower surface of the substrate 1, and the substrate 1 is fixed to a dicing apparatus. And using the dicing saw 60, the board | substrate 1 and the plate-shaped member 50 are cut | disconnected along the cutting projected line 51, and it divides | segments into each surface mount type LED. In this manner, the surface-mounted LED according to the embodiment shown in FIG. 1 is manufactured.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, an example in which the present invention is applied to a surface-mounted LED has been described. However, the present invention is not limited thereto, and any light emitting device including a reflective frame can emit light other than the surface-mounted LED. You may make it apply this invention to an apparatus.

  In the above embodiment, the example in which the opening of the reflection frame is configured so that the angle between the inner surface and the surface of the substrate is an acute angle over the entire circumference of the inner surface is shown. However, the present invention is not limited to this, and it is only necessary that the angle formed by the inner surface and the surface of the substrate is an acute angle in a part of the inner surface.

  Moreover, in the said embodiment, although the example which comprised the inner surface of the opening part from two inner surfaces, the 1st inner surface and the 2nd inner surface, this invention is not limited to this, The inner surface of an opening part was shown. May be configured from one inner surface or three or more inner surfaces.

  Moreover, in the said embodiment, although the example which comprised the 2nd inner surface was shown by forming the level | step-difference part retreated from the 1st inner surface over the perimeter of an inner surface, this invention is not limited to this, You may comprise so that the level | step-difference part retreated from 1 inner surface may be formed in a predetermined position. That is, you may make it form one or more level | step-difference parts which retreat rather than a 1st inner surface and have a predetermined | prescribed width | variety in the predetermined position of an inner surface.

  In the above embodiment, an example is shown in which the angle formed between the second inner surface and the surface of the substrate is substantially the same as the angle formed between the first inner surface and the surface of the substrate. The invention is not limited to this, and the angle formed between the second inner surface and the surface of the substrate may be different from the angle formed between the first inner surface and the surface of the substrate.

  In the above embodiment, the angle formed between the first inner side surface and the surface of the substrate and the angle formed between the second inner side surface and the surface of the substrate are each set to an acute angle of 85 ° or more. The present invention is not limited to this, and the angle formed between the first inner surface and the surface of the substrate, and the angle formed between the second inner surface and the surface of the substrate may each be an acute angle other than an acute angle of 85 ° or more. Good. Further, if one of the angle formed between the first inner surface and the surface of the substrate and the angle formed between the second inner surface and the surface of the substrate is an acute angle, the angle formed between the first inner surface and the surface of the substrate. The other of the angles formed by the second inner surface and the surface of the substrate may be a right angle or an obtuse angle.

  Moreover, in the said embodiment, although the example which formed the opening part in the plate-shaped member by press work was shown, this invention is not restricted to this, An opening part is formed in a plate-shaped member by processing methods other than press work. You may make it do. As a processing method other than press processing, for example, drilling or etching can be considered.

  Moreover, in the said embodiment, although the example which fixed the LED element and the reflective frame on the board | substrate which is an example of a base was shown, this invention is not restricted to this, LED element and a reflection on bases other than a board | substrate. The frame body may be fixed. For example, the LED element and the reflection frame body may be fixed to a molded frame or the like.

  Moreover, in the said embodiment, although the example which comprised the reflective frame and the plate-shaped member from the metal material which has aluminum as a main component was shown, this invention is not restricted to this, A reflective frame and a plate-shaped member are shown. You may comprise from pure Al, magnesium, and another metal material. Moreover, you may comprise a reflective frame and a plate-shaped member from materials other than a metal material. Examples of materials other than metal materials include resins and ceramics. Moreover, you may coat | cover a metal material on the surface of the reflective frame body comprised from resin, ceramics, etc. Furthermore, you may comprise a reflective frame and a plate-shaped member from the material etc. which disperse | distributed the metal to resin. Note that when the reflective frame is made of a resin material, the difference in thermal expansion coefficient from the translucent member is reduced, so that the occurrence of peeling at the interface between the translucent member and the reflective frame is easily suppressed. It becomes possible to do.

  In the above embodiment, an example in which the inner side surface of the opening is subjected to silver plating treatment, anodizing treatment, or the like has been shown, but the present invention is not limited thereto, and the inner side surface of the opening portion is subjected to silver plating treatment or Further, a configuration in which processing such as alumite processing is not performed may be employed.

  Moreover, in the said embodiment, although the polar electrode layer, the nonpolar electrode layer, and the electrode layer showed the example comprised from copper, in this invention, not only this but a polar electrode layer, a nonpolar electrode layer The electrode layer may be made of Fe or Al other than copper. Further, Ni, Au, Ag, Pd, and Sn plating or plating in which a plurality of these are laminated may be performed on the surfaces of the polar electrode layer, the nonpolar electrode layer, and the electrode layer.

  Moreover, in the said embodiment, although the example which mounted three LED elements of red, green, and blue was shown, this invention is not restricted to this, One, two, or four or more LED is shown. You may make it mount an element.

  Moreover, in the said embodiment, although the example using the reflective frame body and plate-shaped member which have a thickness of about 0.6 mm was shown, this invention is not restricted to this, The reflective frame which has thickness other than about 0.6 mm A body and a plate-like member may be used.

  Moreover, in the said embodiment, although the example which formed surface mount type LED in the square shape whose one side is about 3.5 mm seeing planarly was shown, this invention is not limited to this, Surface mount type LED is shown. You may form in the square shape of a magnitude | size other than about 3.5 mm on one side. Moreover, you may form surface mount type LED in shapes other than square shape seeing planarly. For example, it may be formed in a rectangular shape or the like, or may be formed in a shape other than a quadrangular shape.

  Moreover, in the said embodiment, although the example which attached the LED element after attaching the reflective frame body on the board | substrate was shown, this invention is not restricted to this, The attachment to the board | substrate of a light emitting diode element is a reflective frame body. It may be before attaching.

  In the above embodiment, an example in which the light emitting diode element is provided in the light emitting device as an example of the light emitting element is described. However, the present invention is not limited thereto, and a light emitting element other than the light emitting diode element is provided in the light emitting device. Also good.

  Moreover, in the said embodiment, although the example which formed the inner surface of the opening part of the reflective frame body in circular shape seeing planarly was shown, this invention is not restricted to this, The opening part of a reflective frame body is shown. The inner surface may be formed in a shape other than a circle when viewed in a plan view. For example, the inner surface of the opening of the reflection frame body may be formed in a quadrangular shape when viewed in plan. In this case, it is only necessary that one or more of the four inner surfaces has an acute angle with the surface of the substrate. When two inner surfaces of the four inner surfaces are configured such that the angle formed with the surface of the substrate is an acute angle, it is preferable that the two opposing surfaces are configured with an acute angle.

1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. It is the top view which looked at the surface mount type LED by one Embodiment of this invention shown in FIG. 1 from the upper side. It is the top view which looked at the surface mount type LED by one Embodiment of this invention shown in FIG. 1 from the lower side. FIG. 4 is a cross-sectional view taken along line 100-100 in FIGS. 2 and 3. It is sectional drawing which expanded and showed a part of reflective frame body of surface mount type LED by one Embodiment of this invention shown in FIG. It is the top view which expanded and showed a part of reflective frame body of surface mount type LED by one Embodiment of this invention shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG.

Explanation of symbols

1 Substrate (base)
2 Insulating base material 3, 4 Polarized electrode layer 5 Insulating groove 6 Nonpolar electrode layer 10 Adhesive layer 20 LED element (light emitting element)
21 Conductive adhesive 22, 23 Bonding wire 30 Reflective frame body 31 Opening part 32 Inner side surface (inner peripheral surface, reflective surface)
32a 1st inner surface (inner peripheral surface, reflective surface)
32b Second inner surface (stepped portion, inner peripheral surface, reflecting surface)
33 Stepped surface (stepped portion, inner peripheral surface, reflecting surface)
40 translucent member 50 plate member

Claims (5)

A base on which a light emitting element is mounted;
A reflective frame that is fixed on the surface of the base so as to surround the light emitting element, and whose inner peripheral surface is a reflective surface that reflects light from the light emitting element;
A translucent member filled inside the reflective frame and sealing the light emitting element;
An angle formed by at least a part of the inner peripheral surface of the reflection frame and the surface of the base is configured to be an acute angle.   2. The light emitting device according to claim 1, wherein an angle formed by an inner peripheral surface of the reflection frame and a surface of the base is configured to be an acute angle over the entire circumference of the inner peripheral surface.   The light-emitting device according to claim 1, wherein a stepped portion that is recessed from the inner peripheral surface is provided on the inner peripheral surface of the reflection frame.   The light-emitting device according to claim 1, wherein the reflection frame is made of a metal material.   The light emitting device according to claim 1, wherein a plurality of the light emitting elements are mounted on the base.

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