JP2008124195A - Light-emitting device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light-emitting device capable of improving its working efficiency at mounting restraining a mounting failure. <P>SOLUTION: This surface-mounting LED (light emitting device) is equipped with a substrate 1 mounted with an LED element 20, and a reflecting frame 30 which is fixed above the upper surface of the substrate 1 to reflect light emitted from the LED element 20, surrounding the LED element 20. The reflecting frame 30 is provided with one corner composed of an upper surface 30a and side faces 30b and the other corner composed of two side faces 30b, and cutouts 32 and 34 are provided to the former corners and latter corners respectively. The reflecting frame 30 is formed of metal material whose main component is aluminum. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a light emitting device and a method for manufacturing the same, and more particularly to a light emitting device including a reflective frame that reflects light from a light emitting element and a method for manufacturing the same.

  Conventionally, a light-emitting device including a reflection frame that reflects light from a light-emitting element is known (see, for example, Patent Document 1). In Patent Document 1, an LED (Light Emitting Diode) chip is fixed on a base (base) made of ceramics by ultrasonic welding and has an opening having an inner peripheral surface as a reflection surface. A surface mount type LED lamp (light emitting device) in which a lamp house (reflective frame) is fixed on a base so as to surround the LED chip is described. In this surface mount type LED lamp, since the base is made of ceramics, even when the LED chip is fixed on the base by ultrasonic welding, mechanical stress applied to the LED chip is reduced. In addition, an electrode layer is formed on each of the front surface (upper surface) and the back surface (lower surface) of the base, and the electrode layer on the front surface and the electrode layer on the back surface are connected via a connection portion formed in the through hole. Electrically connected.

  The LED lamp (light emitting device) described in Patent Document 1 fixes a plurality of LED chips on a base by ultrasonic welding, and then fixes a plate-like member having a plurality of openings on the base. Formed by dividing individually. In addition, when individually dividing, generally, after fixing the base to the dicing apparatus, the division is performed by moving the rotating disk-shaped dicing saw along the planned cutting line. Done.

  However, the conventional LED lamp described in Patent Document 1 has a disadvantage that burrs are generated in the electrode layer on the back surface of the base when the base is cut. Such burr in the electrode layer causes various problems in the mounting process of the LED lamp, and thus measures for suppressing the occurrence of burr in the electrode layer are required.

Therefore, conventionally, after fixing the base to the dicing device with the base on the upper side (plate-like member on the lower side), the rotating disc-shaped dicing saw is moved along the planned cutting line, so that the base and the plate A method for dividing a member is known. In this conventionally known method, the base and the plate-like member are disposed in the opposite directions and fixed to the dicing apparatus, and from the base side, the electrode layer on the back surface of the base is cut by using a dicing saw. Prevents the occurrence of burrs.
JP 2003-37298 A

  However, in the above-described conventionally known method, since the plate-like member is disposed on the lower side, there is a disadvantage that burrs are generated in the plate-like member when the plate-like member is cut. The burr generated in such a plate-like member remains as a burr protruding beyond the outer surface of the reflecting frame on the reflecting frame of the LED lamp when the LED lamp is formed. Due to the presence of burrs protruding beyond the above, there are problems in that mounting failure occurs when LED lamps are mounted and work efficiency decreases.

  Specifically, for example, when an LED lamp is mounted on a circuit board or the like, the suction collet is generally used. However, when the LED lamp is lifted by the suction collet, the suction surface of the suction collet is caused by a burr. There is an inconvenience that the adhesion to the outer surface (upper surface) of the reflecting frame is hindered. In this case, the suction of the LED lamp by the suction collet becomes incomplete, so that the LED lamp falls from the suction collet or the suction position of the LED lamp by the suction collet is shifted. As a result, when the LED lamp falls, it may be necessary to stop a mounting apparatus for mounting the LED lamp on a circuit board or the like, so that the working efficiency at the time of mounting is lowered. On the other hand, when the adsorption position of the LED lamp by the adsorption collet is deviated, the LED lamp is mounted at a position deviated from the region to be mounted, resulting in a defective mounting of the LED lamp.

  The present invention has been made to solve the above-described problems, and one object of the present invention is to provide a light emitting device capable of improving work efficiency during mounting while suppressing mounting defects. Is to provide.

  Another object of the present invention is to provide a method for manufacturing a light emitting device capable of improving the working efficiency during mounting while suppressing mounting defects.

  In order to achieve the above object, a light-emitting device according to a first aspect of the present invention includes a base on which a light-emitting element is mounted and an inner peripheral surface that is fixed on the surface of the base so as to surround the light-emitting element. Includes a reflection frame that is a reflection surface that reflects light from the light-emitting element, and the reflection frame is provided with a notch at a corner formed by two outer surfaces.

  As described above, the light-emitting device according to the first aspect provides a reflection frame body by cutting a reflection frame body by providing a cutout portion at a corner portion constituted by two outer surfaces of the reflection frame body. Even if burrs occur, the cutouts can prevent the burrs from protruding beyond the outer surface of the reflective frame. Work efficiency can be improved.

  In the light emitting device according to the first aspect described above, preferably, the notch includes a first notch provided at a corner formed by an upper surface and a side surface of the reflection frame. With this configuration, even if burrs are generated in the reflecting frame by cutting the reflecting frame from the base side, the burrs protrude upward beyond the upper surface of the reflecting frame by the first notch. Therefore, when mounting the light emitting device, it is possible to easily improve mounting efficiency while suppressing mounting defects. For example, when a light-emitting device is mounted on a circuit board or the like using an adsorption collet, by suppressing the burr from protruding upward beyond the upper surface of the reflection frame body, the adsorption surface of the adsorption collet and the reflection frame body Since the upper surface can be brought into close contact with each other, it is possible to prevent the adsorption position of the light emitting device from shifting or the light emitting device from dropping from the adsorption collet. For this reason, it is possible to mount the light emitting device in the region to be mounted by suppressing the adsorption position of the light emitting device from shifting. That is, a reduction in mounting accuracy can be suppressed. Further, by suppressing the light emitting device from dropping from the suction collet, the mounting operation can be continued without stopping the mounting device for mounting the light emitting device on a circuit board or the like. Thereby, at the time of mounting the light emitting device, it is possible to easily improve the working efficiency at the time of mounting while suppressing mounting defects. In addition, by suppressing the burr projecting upward beyond the upper surface of the reflective frame, for example, when a backlight device is configured using the light emitting device, the upper surface of the light guide plate and the reflective frame of the light emitting device. It is possible to suppress the occurrence of a mounting defect in which a gap is generated by burr. For this reason, since the light guide plate can be brought into close contact with the upper surface of the reflection frame of the light emitting device, a gap is formed between the light guide plate and the upper surface of the reflection frame of the light emitting device. It is also possible to suppress the occurrence of inconvenience that the light emitting surface becomes dark or the luminance distribution is uneven.

  In this case, preferably, the reflection frame body has a quadrangular shape when seen in a plan view, and the first cutout portions are respectively provided at four corners constituted by the upper surface and the side surface of the reflection frame body. Is provided. If comprised in this way, since it can suppress that a burr | flash protrudes upwards over the upper surface of a reflective frame in each of the four side surfaces of a reflective frame, it suppresses mounting defect more easily. However, the work efficiency at the time of mounting can be improved.

  In the light emitting device according to the first aspect described above, preferably, the notch includes a second notch provided at a corner constituted by two side surfaces of the reflection frame. With this configuration, even if burrs are generated in the reflecting frame by cutting the reflecting frame, the second cutout portion causes the burrs to protrude beyond the side of the reflecting frame. Therefore, it is possible to improve the working efficiency at the time of mounting while suppressing the mounting failure more easily when mounting the light emitting device. For example, when a light emitting device housed in an embossed pocket of an embossed carrier tape is taken out from the pocket of the embossed carrier tape using a suction collet, burrs are formed on the side beyond the side of the reflective frame. By suppressing the protrusion, it is possible to suppress the burr of the reflective frame from being caught on the side wall of the pocket of the embossed carrier tape, which is caused by the burr of the reflective frame being caught on the side wall of the pocket. Thus, it is possible to suppress the occurrence of inconvenience that the adsorption position of the light emitting device due to the adsorption collet is shifted or an adsorption error due to the adsorption collet occurs. For this reason, it is possible to further easily prevent the adsorption position of the light emitting device from shifting, so that the light emitting device can be more easily mounted in the region to be mounted. That is, it is possible to more easily suppress a decrease in mounting accuracy of the light emitting device. Further, since a suction mistake due to the suction collet can be more easily suppressed, the mounting operation can be continued more easily without stopping the mounting device for mounting the light emitting device on a circuit board or the like. As a result, at the time of mounting the light emitting device, it is possible to improve the working efficiency at the time of mounting more easily while suppressing the mounting failure. In addition, when the light emitting device is mounted on a circuit board or the like, for example, when the light emitting device is mounted on a circuit board or the like, it is possible to prevent the burr from projecting laterally beyond the side surface of the reflective frame body (exceeding the outer tolerance). Since it is possible to suppress the occurrence of mounting defects that the burr of the body comes into contact with other electronic components, etc., it is possible to effectively utilize the mounting area, and even when the reflective frame is made of metal, It is also possible to suppress the occurrence of inconveniences such as electrical short-circuiting or scratching of other electronic components due to the contact between other electronic components and burrs.

  In the light emitting device according to the first aspect, preferably, the reflection frame is made of a metal material. If such a configuration is applied to the light emitting device according to the first aspect, it is possible to improve the heat dissipation of the light emitting device and to generate burrs as compared with the case where a reflective frame made of resin is used. Even when the reflective frame is made of a metal material that is easy to perform, it is possible to improve working efficiency during mounting while suppressing mounting defects.

  According to a second aspect of the present invention, there is provided a method for manufacturing a light emitting device, wherein a plurality of openings having an inner peripheral surface as a reflection surface are formed in a plate-like member, and at least the upper surface of the plate-like member is cut into a lattice shape. Along the at least part of the line, the step of forming a groove having a width wider than the cutting allowance of the planned cutting line, and at least one of the intersections of the planned cutting line extend in the thickness direction of the plate-shaped member, A step including any of the steps of forming a hole having a larger outer shape than the cutting allowance of the planned cutting line, a step of fixing the plate-like member on the upper surface of the base, the upper surface of the base, and a plate A step of mounting each of the light emitting elements in a region located inside the opening of the member, and a step of cutting the base and the plate member along the planned cutting line.

  In the method of manufacturing the light emitting device according to the second aspect, as described above, the width of the upper surface of the plate-like member is wider than the cutting allowance of the planned cutting line along at least part of the grid-shaped cutting planned line. Even if burrs occur on the cut surface of the plate-like member by cutting the base and the plate-like member along the planned cutting line from the base side by forming the groove portion, It is possible to suppress the burrs from protruding upward beyond the upper surface. For this reason, when a plate-like member is cut and a reflective frame (light emitting device) is formed (manufactured), the generated burr is prevented from protruding upward beyond the upper surface of the reflective frame of the light emitting device. Therefore, it is possible to manufacture a light emitting device capable of improving the working efficiency during mounting while suppressing mounting defects. On the other hand, at least one of the intersecting portions of the planned cutting line extends in the thickness direction of the plate-like member and forms a hole having a larger outer shape than the cutting allowance of the planned cutting line, thereby forming a base along the planned cutting line. By cutting the table and the plate-like member, even if burrs are generated on the cut surface of the plate-like member, it is possible to suppress the burrs from protruding sideways beyond the side surface of the plate-like member by the hole. it can. For this reason, when the plate-shaped member is cut to form (manufacture) the reflective frame (light emitting device), the generated burr protrudes laterally beyond the side surface of the reflective frame of the light emitting device. Since it can suppress, the light-emitting device which can improve the working efficiency at the time of mounting can be manufactured, suppressing a mounting defect.

  In the method for manufacturing a light emitting device according to the second aspect, preferably, the step of forming the hole includes a step of forming the hole in a through hole reaching the lower surface from the upper surface of the plate-like member. If configured in this way, the hole is formed over the entire length of the plate-shaped member, so even if burrs occur at any position in the thickness direction of the plate-shaped member, Further, it is possible to suppress the burrs from protruding sideways beyond the side surface of the plate-like member. For this reason, when the plate-shaped member is cut to form (manufacture) the reflective frame (light emitting device), the generated burr protrudes laterally beyond the side surface of the reflective frame of the light emitting device. Since it can suppress easily, the light-emitting device which can improve the working efficiency at the time of mounting can be manufactured easily, suppressing a mounting defect.

  In the method for manufacturing a light emitting device according to the second aspect, preferably, the plate member is made of a metal material. When such a configuration is applied to the method for manufacturing a light emitting device according to the second aspect, the heat dissipation of the light emitting device can be improved as compared with the case where a plate-shaped member made of resin is used, Even when the plate-like member is made of a metal material that is likely to generate burrs, it is possible to manufacture a light-emitting device that can improve the working efficiency during mounting while suppressing mounting defects.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the present embodiment, a case will be described in which the present invention is applied to a surface-mounted LED (Light Emitting Diode) which is an example of a light-emitting device.

  FIG. 1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. FIG. 2 is a plan view of the surface-mounted LED according to the embodiment of the present invention shown in FIG. is there. 3 is a plan view of the surface-mounted LED according to the embodiment of the present invention shown in FIG. 1 as viewed from below, and FIG. 4 is a cross-sectional view taken along the line 100-100 in FIGS. It is. 5 and 6 are views for explaining the surface-mounted LED according to the embodiment of the present invention shown in FIG. First, the structure of a surface-mounted LED according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, a surface-mount LED according to an embodiment includes a substrate 1 made of glass epoxy or the like, a light-emitting diode element (LED element) 20 and a reflection frame 30 fixed on the upper surface of the substrate 1, And a translucent member 40 filled inside the reflection frame 30. In addition, the board | substrate 1 is an example of the "base" of this invention, and the LED element 20 is an example of the "light emitting element" of this invention.

  Moreover, the board | substrate 1 is comprised from the double-sided board | substrate with which the electrode layer was formed on the upper surface and lower surface of the insulation base material 2, as shown in FIG. Further, as shown in FIG. 3, the substrate 1 has a length of about 3.5 mm in the direction of the arrow X as viewed in a plan view, and is about 3 in the direction of the arrow Y perpendicular to the direction of the arrow X. It is formed in a square shape having a length of 5 mm. The substrate 1 has a thickness of about 0.2 mm.

  Moreover, as shown in FIG. 2, the electrode layer formed on the upper surface of the insulating substrate 2 includes a plurality of (three) polar electrode layers 3 having a positive polarity, and a plurality ( 3) polar electrode layers 4, and polar electrode layers 3 and 4 and nonpolar (neutral) electrode layers 6 that are electrically separated through insulating grooves 5 and have no polarity. . Further, as shown in FIGS. 1 and 2, the polar electrode layers 3 and 4 are on the upper surface of the insulating base material 2 and in regions located inside the openings 31 of the reflection frame 30 described later, respectively. Is formed. The nonpolar electrode layer 6 is formed on a region other than the region where the polar electrode layers 3 and 4 are formed, on the upper surface of the insulating base 2. Specifically, as shown in FIGS. 1, 2, and 4, the nonpolar electrode layer 6 includes polar electrode layers 3 and 4, insulating grooves 5 around the polar electrode layers 3 and 4, and The substrate 1 is formed in a region other than a region where a later-described stepped portion 1a formed on the outer peripheral portion of the upper surface of the substrate 1 is formed.

  Also, as shown in FIG. 3, the electrode layer formed on the lower surface of the insulating base 2 is mainly composed of electrode layers 7 and 8 used for wiring and an electrode layer 9 used mainly for heat dissipation. It is configured. Further, a plurality of electrode layers 7 and 8 used for wiring are formed so as to respectively correspond to the plurality of polar electrode layers 3 and 4 described above, and as shown in FIG. The polar electrode layers 3 and 4 are electrically connected to each other through a connection portion 2b formed in the hole 2a. In addition, the electrode layer 9 used for heat dissipation is thermally connected to the nonpolar electrode layer 6 via connection portions 2 d formed in the plurality of through holes 2 c of the insulating base 2. The polar electrode layers 3 and 4, the nonpolar electrode layer 6, and the electrode layers 7 to 9 are made of a conductive material having excellent thermal conductivity such as copper.

  Further, a stepped portion 1 a where an adhesive layer 10 for fixing the reflective frame 30 on the substrate 1 is formed on the outer peripheral portion on the upper surface of the substrate 1. The step portion 1 a has a function of making the upper surface of the adhesive layer 10 and the upper surface of the nonpolar electrode layer 6 substantially the same surface. Thereby, when the reflecting frame 30 is fixed on the substrate 1 through the adhesive layer 10, the lower surface of the reflecting frame 30 can be brought into direct contact with the upper surface of the nonpolar electrode layer 6.

  In addition, as shown in FIGS. 1 and 2, three LED elements 20 are electrically conductive in a region located on the upper surface of the nonpolar electrode layer 6 and inside the opening 31 of the reflection frame 30. The adhesive is fixed with an adhesive 21 (see FIG. 4) or the like. The LED element 20 is arranged and fixed on the upper surface of the nonpolar electrode layer 6 between the positive polar electrode layer 3 and the negative polar electrode layer 4 at a predetermined interval. The LED elements 20 each have a function of emitting red, green, and blue light. When these LED elements 20 emit light at the same time, the colors are mixed and emitted. .

  Further, the upper surface of the positive polar electrode layer 3 and the electrode portion of the LED element 20 are electrically connected via the bonding wires 22 respectively, and the upper surface of the negative polar electrode layer 3 The electrode portions of the LED elements 20 are electrically connected via bonding wires 23, respectively. Therefore, when a voltage is applied to the electrode layer 7 and the electrode layer 8 shown in FIG. 4, a current flows through the LED elements 20 through the bonding wires 22 and 23, and each LED element 20 has a unique wavelength. Emits light. The bonding wires 22 and 23 are made of fine metal wires such as Au, Ag, and Al.

  The heat generated by the light emission of the LED element 20 is radiated by the nonpolar electrode layer 6 formed on the upper surface of the insulating base 2 as shown in FIGS. The heat is also radiated by the reflective frame 30 in contact with the. Further, the heat generated in the LED element 20 is also generated in the heat dissipation electrode layer 9 that is thermally connected to the nonpolar electrode layer 6 through the connection portion 2d formed in the through hole 2c of the insulating base 2. Heat is dissipated. Further, when the electrode layer 9 is connected to the heat sink portion of the circuit board, the heat dissipation effect is further promoted. As described above, the surface-mounted LED according to the embodiment is configured to be able to efficiently dissipate the heat generated in the LED element 20, thereby suppressing a decrease in light emission efficiency due to a temperature rise of the LED element 20. In addition, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED are obtained.

  Further, as shown in FIGS. 1 and 2, the reflection frame 30 is made of a metal material mainly composed of aluminum having excellent heat dissipation and is formed in a planar shape having almost the same size as the substrate 1. Has been. Specifically, the reflective frame 30 has a square shape having a length of about 3.5 mm in the arrow X direction and a length of about 3.5 mm in the arrow Y direction when seen in a plan view. Is formed. The reflective frame 30 has a thickness of about 0.6 mm.

  In addition, an opening 31 is formed in the central portion of the reflection frame 30, and the inner side surface 31 a of the opening 31 is configured to function as a reflection surface that reflects light emitted from the LED element 20. ing. Further, the surface of the inner side surface 31a of the opening 31 is subjected to a silver plating process, an alumite process, or the like. Further, the reflection frame 30 is fixed on the substrate 1 via the adhesive layer 10 (see FIG. 4) so as to surround the LED element 20 by the inner surface 31 a of the opening 31. As shown in FIGS. 1, 2 and 4, the opening 31 has an inner surface 31a formed in a circular shape so as to uniformly collect the light emitted from the LED element 20. , And is formed so as to expand in a tapered shape toward the upper part of the opening 31. As described above, the inner side surface 31a of the opening 31 is configured to be able to efficiently reflect the light emitted from the LED element 20 upward. The inner side surface 31a is an example of the “inner peripheral surface” and “reflective surface” in the present invention.

  Here, in the present embodiment, cutout portions extending in the arrow X direction and the arrow Y direction are respectively formed in four corner portions constituted by the upper surface 30a and the side surface 30b, which are the two outer surfaces of the reflection frame 30. 32 is provided. As a result, as shown in FIG. 5, the upper edge 30c of the side surface 30b is formed at a position (downward) away from the position of the upper surface 30a by a distance H1, and thus the reflecting frame 30 is formed by cutting. Even when a burr 33 protruding upward is generated at the upper edge 30c of the side surface 30b of the reflection frame 30, the burr 33 protrudes above the upper surface 30a of the reflection frame 30. Is suppressed. The burr 33 has a length A1 of 0.15 mm or less, and the distance H1 between the position of the upper edge 30c of the side surface 30b and the upper surface 30a is larger than the length A1 of the burr 33. The notch 32 is configured to be long. The notch 32 has an arc-shaped cross section and is provided over the entire length of each corner. The notch 32 is an example of the “first notch” in the present invention.

  In the present embodiment, as shown in FIGS. 1 and 2, the four corners constituted by the two side surfaces 30 b of the reflection frame 30 respectively extend in the thickness direction of the substrate 1 (arrow Z direction). A notch 34 is provided. As a result, as shown in FIG. 6, the side edge 30d of the side surface 30b adjacent to the side surface 30b is formed at a position separated from the position of the side surface 30b by a distance L1, so that the reflecting frame 30 is formed by cutting. At this time, even if a burr 35 protruding to the side is generated at the side edge 30d of the side surface 30b of the reflection frame 30, the burr 35 protrudes to the side beyond the side 30b of the reflection frame 30. To be suppressed. The burr 35 has a length A2 of 0.15 mm or less, and the distance L1 between the position of the side edge 30d of the side surface 30b and the adjacent side surface 30b is the length of the burr 35. The cutout 34 is configured to be longer than A2. Moreover, the notch part 34 has the circular-arc shaped cross section similarly to the above-mentioned notch part 32, and is each provided over the full length of the corner | angular part. The notch 34 is an example of the “second notch” in the present invention.

  Further, as shown in FIGS. 1, 2, and 4, the translucent member 40 is made of epoxy resin, silicon resin, or the like, and the opening 31 is provided in the opening 31 of the reflective frame 30. It is provided so as to block. Further, the translucent member 40 has a function of preventing the LED element 20 and the bonding wires 22 and 23 from coming into contact with air, moisture, and the like by sealing the LED element 20 and the bonding wires 22 and 23. ing.

  In the present embodiment, as described above, by providing the notch 32 at the corner portion constituted by the upper surface 30a and the side surface 30b of the reflective frame 30, the reflective frame 30 is cut from the substrate 1 side. Even if the burr 33 is generated at the edge 30c of the side surface 30b of the reflection frame 30, the cutout 32 can prevent the burr 33 from protruding upward beyond the upper surface 30a of the reflection frame 30. Therefore, when mounting the surface-mounted LED, it is possible to easily improve the working efficiency during mounting while suppressing mounting defects. For example, when a surface-mounted LED is mounted on a circuit board or the like using a suction collet, by suppressing the burr protruding upward beyond the upper surface 30a of the reflection frame 30, the suction surface of the suction collet Since the upper surface 30a of the reflective frame 30 can be brought into close contact with each other, it is possible to prevent the adsorption position of the surface-mounted LED from shifting or the surface-mounted LED from dropping from the adsorption collet. For this reason, the surface-mounted LED can be mounted in the region to be mounted by suppressing the displacement of the suction position of the surface-mounted LED. That is, a reduction in mounting accuracy can be suppressed. Also, by suppressing the surface-mounted LED from dropping from the suction collet, the mounting operation can be continued without stopping the mounting device for mounting the surface-mounted LED on a circuit board or the like. it can. As a result, when mounting the surface-mounted LED, it is possible to easily improve the working efficiency during mounting while suppressing mounting defects.

  In the present embodiment, the burr 33 is prevented from projecting upward beyond the upper surface 30a of the reflection frame 30, so that, for example, when a backlight device is configured using surface-mounted LEDs, Generation | occurrence | production of the mounting defect that a clearance gap arises by a burr | flash between an optical plate and the upper surface 30a of the reflective frame 30 of surface mount type LED can be suppressed. For this reason, since the light guide plate can be brought into close contact with the upper surface 30a of the reflective frame 30 of the surface-mounted LED, a gap is generated between the light guide plate and the upper surface 30a of the reflective frame 30 of the surface-mounted LED. As a result, it is possible to prevent the disadvantage that the light emitting surface of the backlight device becomes dark or the luminance distribution is uneven.

  In the present embodiment, the notch 32 is provided at each of the four corners constituted by the upper surface 30a and the side surface 30b of the reflection frame 30, so that each of the four side surfaces 30b of the reflection frame 30 is provided. Since the burr 33 can be prevented from protruding upward beyond the upper surface 30a of the reflecting frame 30, the working efficiency during mounting can be improved more easily while suppressing mounting defects.

  Moreover, in this embodiment, the edge of the side surface 30b of the reflective frame 30 is cut | disconnected by providing the notch 34 in the corner | angular part comprised by the two side surfaces 30b of the reflective frame 30, and cutting the reflective frame 30. FIG. Even if the burr 35 is generated in the portion 30d, the cutout portion 34 can suppress the burr 35 from projecting to the side beyond the side surface 30b of the reflection frame 30. In this case, it is possible to more easily improve the working efficiency during mounting while suppressing mounting defects. For example, when a surface-mounted LED housed in an embossed pocket of an embossed carrier tape is taken out from the pocket of the embossed carrier tape using an adsorption collet, the side beyond the side surface 30b of the reflective frame 30 is removed. By suppressing the burrs 35 from protruding in the direction, it is possible to suppress the burrs 35 of the reflective frame 30 from being caught on the side walls of the pockets of the embossed carrier tape. It is possible to suppress the occurrence of inconvenience that the suction position of the surface-mounted LED due to the suction collet is shifted or the suction mistake due to the suction collet occurs due to being caught on the side wall or the like. For this reason, since it can suppress further more easily that the adsorption position of surface mount type LED shifts, surface mount type LED can be mounted still more easily in the field which should be mounted. That is, it is possible to more easily suppress a decrease in mounting accuracy of the surface-mounted LED. In addition, it is possible to more easily suppress suction mistakes caused by the suction collet, so that the mounting operation can be continued more easily without stopping the mounting device for mounting the surface-mounted LED on a circuit board or the like. it can. As a result, at the time of mounting the surface-mounted LED, it is possible to improve the working efficiency at the time of mounting more easily while suppressing the mounting failure.

  Further, in the present embodiment, by suppressing the burr 35 from projecting to the side beyond the side surface 30b of the reflection frame 30 (exceeding the outer tolerance), for example, the surface-mounted LED is applied to a circuit board or the like. Since it is possible to suppress the occurrence of a mounting failure in which the burrs of the reflective frame 30 of the surface-mounted LED come into contact with other electronic components when mounted, the mounting area can be used effectively. At the same time, even when the reflection frame 30 is made of metal, it may be electrically short-circuited or scratched on other electronic components due to the contact between other electronic components and burrs. Inconvenience can also be suppressed.

  Further, in the present embodiment, the reflective frame 30 is made of a metal material mainly composed of aluminum, so that the heat dissipation of the surface-mounted LED is made as compared with the case where the reflective frame made of resin is used. In addition, even when the reflection frame 30 is made of a metal material that is likely to generate burrs, the working efficiency during mounting can be improved while suppressing mounting defects.

  7 to 19 are views for explaining a manufacturing process of the surface-mounted LED according to the embodiment shown in FIG. Next, with reference to FIG. 1, FIG. 2, and FIGS. 4-19, the manufacturing process of the surface mount type LED by one Embodiment is demonstrated.

  First, as shown in FIGS. 7 and 8, a plurality of openings 31 are formed by press working on a plate-like member 50 having aluminum as a main component and a thickness of about 0.6 mm. At this time, the opening 31 is formed so that the inner side surface 31a is formed in a circular shape, and is widened in a tapered shape toward the upper side of the opening 31 as shown in FIG. Further, as shown in FIGS. 7 and 8, the openings 31 are formed in a matrix so as to be arranged in the arrow X direction and the arrow Y direction.

  Here, in this embodiment, as shown in FIGS. 7 to 9, at the timing of forming the opening 31 in the plate-like member 50 by press work, the upper surface of the plate-like member 50 is formed into a lattice shape by press work. The groove portion 51 is formed. Thereby, even when forming the groove part 51 in the upper surface of the plate-shaped member 50, the increase in a manufacturing process is suppressed. Further, as shown in FIG. 8, the groove 51 surrounds the opening 31 and is formed in a lattice shape along a lattice-shaped cut line 52 extending in the arrow X direction and the arrow Y direction, respectively.

  In the present embodiment, as shown in FIG. 10, the groove 51 has a width W (about 0.6 mm) larger than a cutting allowance W1 (about 0.25 mm) when the dicing saw 60 is used for cutting. At the same time, it is formed to a depth R1 of about 0.3 mm. Specifically, the groove 51 is formed in a semicircular shape having a radius R1 (about 0.3 mm) in cross section. As a result, when the plate-like member 50 is cut along the cutting line 52, the distance H1 between the upper edge 30c of the side surface 30b and the upper surface 30a is set to the width of the burr 33 as shown in FIG. It becomes possible to keep it larger than the length. In addition, when forming the groove part 51 by press work, forming the groove part 51 having a semicircular cross section makes it easier than forming a groove part having a concave or V-shaped cross section. It is possible to form a groove having an intended cross-sectional shape.

  Moreover, in this embodiment, as shown in FIG.7, FIG.8 and FIG.11, at the timing which forms the opening part 31 in the plate-shaped member 50 by press work, it presses on the plate-shaped member 50 by press work. A plurality of through-hole portions 53 are formed. Thereby, even when forming the through-hole part 53 in the plate-shaped member 50, the increase in a manufacturing process is suppressed. The through hole 53 is formed at the intersection of the planned cutting line 52 in the arrow X direction and the planned cutting line 52 in the arrow Y direction so as to reach the lower surface from the upper surface of the plate-like member 50. The through hole 53 is an example of the “hole” in the present invention.

  Moreover, in this embodiment, as shown in FIG. 12, the through-hole part 53 is formed in the external shape larger than the cutting allowance W1 (about 0.25 mm) at the time of cut | disconnecting using the dicing saw 60. FIG. Specifically, the outer shape of the through hole 53 is formed so that the flat cross section is a circle having a diameter D1 (about 0.6 mm). That is, the through hole 53 is formed in a cylindrical shape having a diameter D1 of about 0.6 mm. Thereby, when the plate-like member 50 is cut along the planned cutting line 52, as shown in FIG. 6, the distance L1 between the side edge 30d of the side face 30b and the side face 30b adjacent thereto is It is possible to keep the burr 35 longer than the length of the burr 35.

  Next, as shown in FIGS. 13 and 14, the plate-like member 50 is fixed on the substrate 1 via the adhesive layer 10 (see FIG. 4). Specifically, the plate member 50 is fixed on the substrate 1 so that the polar electrode layers 3 and 4 formed on the substrate 1 are surrounded by the openings 31 of the plate member 50. Then, as shown in FIG. 15, the three LED elements 20 are fixed to the regions on the upper surface of the substrate 1 and inside the plurality of openings 31 formed in the plate-like member 50. Specifically, as shown in FIG. 2, three LED elements 20 are arranged and fixed in a predetermined region on the nonpolar electrode layer 6 via a conductive adhesive 21 (see FIG. 4). To do. Subsequently, as shown in FIGS. 2 and 16, the electrode portions of the LED element 20 and the polar electrode layers 3 and 4 on the substrate 1 are electrically connected by bonding wires 22 and 23, respectively.

  Next, as shown in FIG. 17, each of the plurality of openings 31 formed in the plate-like member 50 is filled with a light transmissive resin such as an epoxy resin or a silicon resin and cured. Thereby, the translucent member 40 is provided in each of the plurality of openings 31 so as to seal the LED element 20 and the bonding wires 22 and 23.

  Next, as shown in FIG. 18, a dicing sticking sheet 61 is stuck on the upper surface of the plate-like member 50 and fixed to the dicing apparatus with the plate-like member 50 facing down. Then, as shown in FIG. 18 and FIG. 19, using the rotating disc-shaped dicing saw 60, the substrate 1 is moved from the substrate 1 side along the planned cutting line 52 in the arrow X direction and the arrow Y direction. Then, the plate-like member 50 is cut and divided into individual surface-mounted LEDs. In this manner, the surface-mounted LED according to the embodiment shown in FIG. 1 is manufactured. The notches 32 and 34 are formed by cutting the groove 51 and the through-hole 53 of the plate-like member 50, respectively.

  In the manufacturing process of the surface-mounted LED according to the present embodiment, as described above, the width is larger than the cutting allowance W1 of the planned cutting line 52 along the lattice-shaped planned cutting line 52 on the upper surface of the plate-like member 50. Even if burrs are generated on the cut surface of the plate-like member 50 by cutting the substrate 1 and the plate-like member 50 along the planned cutting line 52 from the substrate 1 side by forming the wide groove portion 51, the groove portion 51. Thus, it is possible to prevent the burrs from protruding upward beyond the upper surface of the plate-like member 50. For this reason, when the plate-like member 50 is cut to form (manufacture) the reflective frame 30 (surface-mounted LED), the generated burr 33 forms the upper surface 30a of the reflective frame 30 of the surface-mounted LED. Since it can suppress protruding beyond the upper limit, it is possible to manufacture a surface-mounted LED that can improve working efficiency during mounting while suppressing mounting defects.

  In the present embodiment, at the intersection of the planned cutting line 52 in the arrow X direction and the planned cutting line 52 in the arrow Y direction, the plate member 50 reaches the lower surface from the upper surface, and the cutting allowance of the planned cutting line 52 In addition, by forming the through-hole portion 53 having a large outer shape, the substrate 1 and the plate-like member 50 were cut along the planned cutting line 52 from the substrate 1 side, so that burrs were generated on the cut surface of the plate-like member 50. Even so, it is possible to prevent the burrs from protruding laterally beyond the side surface of the plate-like member 50 by the through-hole portion 53. For this reason, when the plate-like member 50 is cut to form (manufacture) the reflective frame 30 (surface mounted LED), the generated burr 35 causes the side surface 30b of the reflective frame 30 of the surface mounted LED to be formed. Since it can suppress protruding beyond the side, it is possible to manufacture a surface-mounted LED that can improve the working efficiency during mounting while suppressing mounting defects.

  Further, in the present embodiment, the plate-like member 50 is made of a metal material mainly composed of aluminum, so that the heat dissipation of the surface-mounted LED is made as compared with the case where the plate-like member 50 made of resin is used. A surface-mounted LED that can improve the working efficiency at the time of mounting while suppressing mounting defects even when the plate-like member 50 is made of a metal material that is likely to generate burrs. Can be manufactured.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the above-described embodiment, the example in which the present invention is applied to the surface-mounted LED has been described. However, the present invention is not limited thereto, and the present invention may be applied to light emitting devices other than the surface-mounted LED. .

  Moreover, in the said embodiment, although the example which provided the notch part in each of the four corner | angular parts comprised by the upper surface and side surface of a reflective frame body was shown, this invention is not limited to this, You may make it provide a notch in either of the four corner | angular parts comprised by an upper surface and a side surface.

  Moreover, in the said embodiment, although the example which provided the notch part in each of the four corner | angular parts comprised by two side surfaces of a reflective frame body was shown, this invention is not limited to this, 2 of a reflective frame body is shown. You may make it provide a notch in either of the four corner | angular parts comprised by one side surface.

  Moreover, in the said embodiment, the example which provided the notch part in both the corner | angular part comprised by the upper surface and side surface of a reflective frame, and the corner | angular part comprised by two side surfaces of a reflective frame body was shown. However, the present invention is not limited to this, and a cutout portion may be provided in either one of the corner portion constituted by the upper surface and the side surface and the corner portion constituted by the two side surfaces.

  Moreover, in the said embodiment, the example which formed the notch part over the full length of the corner | angular part comprised by the upper surface and side surface of a reflective frame, and the corner | angular part comprised by two side surfaces of a reflective frame body was shown. However, the present invention is not limited to this, and the cutout portion may be formed at a corner portion constituted by the upper surface and the side surface and a part of the corner portion constituted by the two side surfaces. For example, a cutout portion may be formed only in a portion where burrs are generated.

  Moreover, in the said embodiment, although the example which divides | segments into each surface mount type LED was shown by cut | disconnecting a reflective frame body from the board | substrate side, this invention is not limited to this, A board | substrate opposite side (reflective frame body) The reflective frame body may be cut from the upper surface side) to be divided into individual surface-mounted LEDs.

  Moreover, in the said embodiment, although the translucent member was provided in the opening part of a reflective frame so that an opening part may be plugged up, this invention is not limited to this, LED element and a bonding wire are sealed If possible, a translucent member may be provided only at the bottom of the opening. When configured in this manner, the contact area between the reflective frame and the air can be increased, so that the heat dissipation from the reflective frame can be improved. In addition, when configured in this manner, the scattered light emitted from the surface (upper surface) of the translucent member can be reflected by the reflecting surface of the reflecting frame, so that the light emission direction can be controlled. Can be facilitated.

  Moreover, although the example which formed the cross section of the groove part in the semicircle shape was shown in the said embodiment, this invention is not limited to this, You may form the cross section of a groove part in shapes other than a semicircle shape. Examples of shapes other than the semicircular shape include a concave shape and a V-shape. In addition, when the cross section of a groove part is formed in shapes other than semicircle shape, the cross-sectional shape of the notch part formed in the corner | angular part of the reflective frame body of surface mount type LED becomes shapes other than circular arc shape.

  Moreover, in the said embodiment, while showing the cross-sectional shape of a groove part in the semicircle shape with a radius of about 0.3 mm, the example which formed the flat cross section of the through-hole part in the circular shape about 0.6 mm in diameter was shown. The present invention is not limited to this, and if the generated burr can be prevented from projecting beyond the outer surface of the surface-mounted LED, the groove portion can be reduced to a size other than the size described above, and You may form a through-hole part.

  Moreover, in the said embodiment, while forming an opening part in a plate-shaped member by press work, while forming a groove part in the upper surface of a plate-shaped member by press work, a several through-hole part is formed in a plate-shaped member. However, the present invention is not limited to this, and the step of forming the groove on the upper surface of the plate-like member and the step of forming the plurality of through-hole portions on the plate-like member are respectively applied to the plate-like member. It may be either before or after the step of forming the opening.

  Moreover, in the said embodiment, although the example which formed the some opening part, the groove part, and the through-hole part in the plate-shaped member by press work was shown, this invention is not limited to this, Processing other than press work is shown. Depending on the method, a plurality of openings, grooves, and through holes may be formed in the plate-like member. As a processing method other than press processing, for example, drilling or etching can be considered.

  Moreover, in the said embodiment, although the groove part was formed in the upper surface of a plate-shaped member along the grid-like cutting planned line, this invention is not restricted to this, A part of grid-like cutting planned line is shown. A groove portion may be formed on the upper surface of the plate-like member.

  In the above embodiment, an example in which the planned cutting line in the arrow X direction and the planned cutting line in the arrow Y direction are orthogonal to each other is shown. However, the present invention is not limited to this, and the planned cutting in the arrow X direction is shown. The line and the planned cutting line in the arrow Y direction may be configured to intersect at a predetermined angle other than orthogonal.

  Moreover, in the said embodiment, although the example which formed the through-hole part in each of the cross | intersection part of the cutting planned line of a plate-shaped member was shown, this invention is not restricted to this, The crossing part of the cutting planned line of a plate-shaped member You may make it form a through-hole part in at least one of these. That is, it may be configured not to form a through hole in a portion where no burr is generated.

  Moreover, in the said embodiment, although the example which formed the through-hole part with a flat cross section in the cross | intersection part of a cutting planned line was shown, this invention is not limited to this, The shape of the flat cross section of a through-hole part is circular. Other than that. In addition, when the through-hole part whose plane cross section is not circular is formed, the cross-sectional shape of the notch part formed in the corner | angular part of the reflective frame body of surface mount type LED becomes shapes other than circular arc shape.

  Moreover, in the said embodiment, after forming the through-hole part in the plate-shaped member, the example which fixed the plate-shaped member on the board | substrate was shown, However, this invention is not limited to this, A plate-shaped member is fixed on a board | substrate. After that, a through hole may be formed in the plate-like member. In this case, the through hole portion may be configured to penetrate the substrate together with the plate-like member.

  Moreover, in the said embodiment, although the example which formed the through-hole part in the cross | intersection part of the cutting plan line of a plate-shaped member was shown, this invention is not limited to this, A hole that does not penetrate may be formed. In this case, the hole not penetrating may be formed on either the upper surface side or the lower surface side of the plate-like member.

  Moreover, in the said embodiment, although the example which fixed the LED element and the reflective frame on the board | substrate which is an example of a base was shown, this invention is not restricted to this, LED element and a reflection on bases other than a board | substrate. The frame body may be fixed. For example, the LED element and the reflection frame body may be fixed to a molded frame or the like.

  Moreover, in the said embodiment, although the example which comprised the reflective frame and the plate-shaped member from the metal material which has aluminum as a main component was shown, this invention is not restricted to this, A reflective frame and a plate-shaped member are shown. You may comprise from pure Al, magnesium, and another metal material. Moreover, you may comprise a reflective frame and a plate-shaped member from materials other than a metal material. Examples of materials other than metal materials include resins and ceramics. Moreover, you may coat | cover a metal material on the surface of the reflective frame body comprised from resin, ceramics, etc. Furthermore, you may comprise a reflective frame and a plate-shaped member from the material etc. which disperse | distributed the metal to resin.

  In the above embodiment, an example in which the inner side surface of the opening is subjected to silver plating treatment, anodizing treatment, or the like has been shown, but the present invention is not limited thereto, and the inner side surface of the opening portion is subjected to silver plating treatment or Further, a configuration in which processing such as alumite processing is not performed may be employed.

  Moreover, in the said embodiment, although the polar electrode layer, the nonpolar electrode layer, and the electrode layer showed the example comprised from copper, in this invention, not only this but a polar electrode layer, a nonpolar electrode layer The electrode layer may be made of Fe or Al other than copper. Further, Ni, Au, Ag, Pd, and Sn plating or plating in which a plurality of these are laminated may be performed on the surfaces of the polar electrode layer, the nonpolar electrode layer, and the electrode layer.

  Moreover, in the said embodiment, although the example which mounted three LED elements of red, green, and blue was shown, this invention is not restricted to this, One, two, or four or more LED is shown. You may make it mount an element.

  Moreover, in the said embodiment, although the example using the reflective frame body and plate-shaped member which have a thickness of about 0.6 mm was shown, this invention is not restricted to this, The reflective frame which has thickness other than about 0.6 mm A body and a plate-like member may be used.

  In the above embodiment, an example in which the light emitting diode element is provided in the light emitting device as an example of the light emitting element is described. However, the present invention is not limited thereto, and a light emitting element other than the light emitting diode element is provided in the light emitting device. Also good.

  Moreover, in the said embodiment, although the example which formed surface mount type LED in the square shape whose one side is about 3.5 mm seeing planarly was shown, this invention is not limited to this, Surface mount type LED is shown. You may form in the square shape of a magnitude | size other than about 3.5 mm on one side. Moreover, you may form surface mount type LED in shapes other than square shape seeing planarly. For example, it may be formed in a rectangular shape or the like, or may be formed in a shape other than a quadrangular shape.

  Moreover, in the said embodiment, although the example which attached the LED element after attaching the reflective frame body on the board | substrate was shown, this invention is not restricted to this, The attachment to the board | substrate of a light emitting diode element is a reflective frame body. It may be before attaching.

  Moreover, in the said embodiment, while showing the example which formed the opening part so that the inner surface of the opening part of a reflective frame body might be circularly formed, and it extended in a taper shape toward the upper part of an opening part, this invention However, the present invention is not limited to this, and the opening of the reflection frame may be formed in a shape other than a circular inner surface. For example, the inner side surface of the opening of the reflection frame may be formed in a square shape.

1 is an overall perspective view of a surface-mounted LED according to an embodiment of the present invention. It is the top view which looked at the surface mount type LED by one Embodiment of this invention shown in FIG. 1 from the upper side. It is the top view which looked at the surface mount type LED by one Embodiment of this invention shown in FIG. 1 from the lower side. FIG. 4 is a cross-sectional view taken along line 100-100 in FIGS. 2 and 3. It is sectional drawing which expanded and showed the notch part of surface mount type LED by one Embodiment of this invention shown in FIG. It is the top view which expanded and showed the notch part of surface mount type LED by one Embodiment of this invention shown in FIG. It is a perspective view for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is a top view for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing along the 200-200 line | wire of FIG. It is an expanded sectional view of the groove part for demonstrating the manufacturing process of surface mount type LED by one Embodiment shown in FIG. It is sectional drawing along the 300-300 line | wire of FIG. FIG. 3 is an enlarged plan view of a through hole portion for explaining a manufacturing process of the surface mount type LED according to the embodiment shown in FIG. 1. It is a perspective view for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing along the 400-400 line of FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is sectional drawing for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG. It is a perspective view for demonstrating the manufacturing process of the surface mount type LED by one Embodiment shown in FIG.

Explanation of symbols

1 Substrate (base)
2 Insulating base material 3, 4 Polarized electrode layer 5 Insulating groove 6 Nonpolar electrode layer 7, 8, 9 Electrode layer 10 Adhesive layer 20 LED element (light emitting element)
21 Conductive adhesive 22, 23 Bonding wire 30 Reflective frame 31 Opening 31a Inner side surface (inner peripheral surface, reflective surface)
32 Notch (first notch)
33, 35 Burr 34 Notch (second notch)
40 translucent member 50 plate-like member 51 groove portion 52 planned cutting line 53 through hole portion (hole portion)
60 Dicing Saw 61 Dicing Sheet

Claims (8)

A base on which a light emitting element is mounted;
A reflection frame that is fixed on the surface of the base so as to surround the light-emitting element, and has an inner peripheral surface that is a reflection surface that reflects light from the light-emitting element;
The light-emitting device according to claim 1, wherein a cutout portion is provided in a corner portion formed by two external surfaces of the reflection frame body.   2. The light emitting device according to claim 1, wherein the notch includes a first notch provided at a corner formed by an upper surface and a side surface of the reflective frame. The reflection frame body has a quadrangular shape when seen in a plan view,
3. The light emitting device according to claim 2, wherein the first notch is provided at each of four corners formed by an upper surface and a side surface of the reflection frame. 4.   The light emitting device according to any one of claims 1 to 3, wherein the cutout portion includes a second cutout portion provided at a corner portion formed by two side surfaces of the reflection frame body. .   The light-emitting device according to claim 1, wherein the reflection frame is made of a metal material. A plurality of openings having an inner peripheral surface as a reflection surface are formed in the plate-shaped member, and at least the upper surface of the plate-shaped member is formed along the at least part of the grid-shaped cutting planned line with the cutting planned line A step of forming a groove having a width wider than a cutting margin, and at least one of the intersecting portions of the planned cutting line, extending in the thickness direction of the plate-like member, and having an outer shape than the cutting margin of the planned cutting line Including any of the steps of forming a large hole portion,
Fixing the plate-like member on the upper surface of the base;
A step of mounting the light emitting elements on the upper surface of the base and in the region located inside the opening of the plate-shaped member;
And a step of cutting the base and the plate member along the planned cutting line.   The method for manufacturing a light emitting device according to claim 6, wherein the step of forming the hole includes a step of forming the hole in a through hole reaching from the upper surface to the lower surface of the plate-like member. .   The method for manufacturing a light emitting device according to claim 6, wherein the plate-like member is made of a metal material.

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