JP5804550B2 - Light emitting device - Google Patents

Description

  The present invention relates to a light-emitting device used for various lighting devices and the like, and more particularly to a light-emitting device serving as a linear light source in which a plurality of light-emitting elements are arranged in a straight line.

  Conventionally, this type of light emitting device has been shown in FIG. 27 and FIG. In this light emitting device, a large number of LED elements 2 are mounted in a straight line at the center of an elongated rectangular parallelepiped base 1. In addition, the substrate 3 provided with a through-hole 3a in the center is bonded onto the base 1, and the LED element 2 is surrounded by the substrate 3 such as the short side direction of the base 1. (For example, refer to Patent Document 1, FIG. 1 and FIG. 3).

  In addition, a light-emitting device in which a light-emitting element is disposed in a concave portion provided in the substrate and extending in the longitudinal direction has also been proposed (see, for example, Patent Document 2).

  In the above prior art, in any light emitting device, the light emitting element is housed in a recess such as a through slot. For this reason, the irradiation of the light which goes to the circumference | surroundings of a light emitting element, especially the transversal direction of a linear light source was prevented by the wall of the recessed part. Thus, when irradiation of the light in the short direction of the line light source is hindered, light is not irradiated from the side surface (particularly, the side surface extending in the longitudinal direction) of the line light source toward the side and back surface of the substrate. Therefore, when a light-emitting device using this line-shaped light source is installed on a ceiling or wall, the light reflected by the ceiling or wall in the side or back direction of the light-emitting device is insufficient and the periphery of the light-emitting device or the lateral direction becomes dark. There was a problem. For this reason, it has been desired to broaden the directivity and brighten a wider range.

JP 2006-295085 A JP 2008-243864 A

  The problem to be solved by the present invention is to solve the above-mentioned problems of the prior art and to provide a light emitting device that is a linear light source having a wide directivity.

The light emitting device of the present invention includes a metal substrate having a substantially rectangular parallelepiped shape, a substrate having a wiring portion disposed in the center and in the longitudinal direction on the surface thereof, and a wiring formed on the wiring portion and including two independent wires. It consists of a pattern and two independent patterns that communicate with the wiring pattern, and the center is partitioned in the longitudinal direction by the conductive pattern provided on the terminal portion of the substrate protruding from the longitudinal end portion of the metal substrate and the wiring portion. And a plurality of light emitting elements connected to the wiring pattern and arranged in a straight line in the longitudinal direction across the wiring portion on the element mounting surface of the metal substrate where both ends in the upper and short directions are open And a sealing resin for sealing the light emitting element. In this light emitting device, the light emitting element is mounted on the element mounting surface in which the center is partitioned in the longitudinal direction by the wiring portion and the upper and shorter directions are released. For this reason, the light emitting element emits light not only above but also to the side.

Terminal portion of the put that board to the light-emitting device, respectively provided at both ends in the longitudinal direction of the wiring part, independent patterns of the wiring patterns are provided one by one. The terminal portion of the board is provided at one end portion in the longitudinal direction of the wiring portion, and two independent patterns of the wiring pattern are provided. Thus, since the terminal part of the board | substrate is provided in the edge part of a longitudinal direction, irradiation of the light to a side is not prevented.

  Further, the terminal portion of the substrate has a protruding portion protruding in the short direction, and the metal substrate is made of a metal film provided between the protruding portions facing the longitudinal direction of the wiring portion. In this way, the metal film formed in the same manner as the wiring pattern is used instead of the metal substrate by supplementing the strength of both ends of the thin metal film using the overhanging portion.

  In the light emitting device of the present invention, the wiring portion of the substrate is arranged in the center and in the longitudinal direction of the metal substrate, and the element mounting surface of the metal substrate is partitioned by the wiring portion and the upper and short direction end portions are open, The light emitting elements are arranged so as to sandwich the wiring portion. As a result, light emitted from the light emitting element is irradiated not only above the metal substrate but also to the end portion in the short direction, that is, the side, and the directivity can be widened to illuminate the periphery of the light emitting device.

  In addition, since the terminal portion of the substrate is provided at the end of the wiring portion in the longitudinal direction, a plurality of light emitting devices can be connected or connected to a power source or the like without blocking light emitted from the light emitting element from the side. it can.

  In addition, a protruding portion that extends in the short direction (side) is provided in the terminal portion of the substrate, and a metal film thinner than the metal substrate can be used by using this protruding portion. Thereby, the light emitting device can be formed thinner.

It is a top view which shows the light-emitting device based on one Example of this invention. It is AA sectional drawing of the light-emitting device shown in FIG. It is BB sectional drawing of the light-emitting device shown in FIG. It is a top view which shows the state which mounted the light-emitting device shown in FIG. 1 side by side. It is a back view which shows the large sized metal substrate used as the original form of the metal substrate shown in FIG. It is a back view which shows the large sized board | substrate used as the original form of the board | substrate shown in FIG. FIG. 7 is a back view showing a collective substrate formed by bonding a large metal substrate and a large substrate shown in FIG. 5 and FIG. 6. FIG. 8 is a plan view of the collective substrate shown in FIG. 7. It is a principal part cross-sectional view of the aggregate substrate shown in FIG. It is a principal part longitudinal cross-sectional view of the aggregate substrate shown in FIG. It is a top view which shows the state which mounted the light emitting element on the aggregate substrate shown in FIG. It is a top view which shows the state which sealed the light emitting element shown in FIG. 11 with sealing resin. It is a top view which shows the state which divided | segmented the aggregate substrate shown in FIG. It is a top view which shows the example changed so that the terminal part of the light-emitting device of this invention might be provided only in one side. It is CC sectional drawing of the light-emitting device shown in FIG. It is DD sectional drawing of the light-emitting device shown in FIG. It is a top view which shows the state which mounted the light-emitting device shown in FIG. 14 side by side. It is a top view which shows the aggregate substrate formed by bonding together the large metal substrate used as the original form of the metal substrate shown in FIG. 14, and a large substrate. It is a principal part cross-sectional view of the aggregate substrate shown in FIG. It is a principal part longitudinal cross-sectional view of the aggregate substrate shown in FIG. It is a top view which shows the state which mounted the light emitting element on the aggregate substrate shown in FIG. It is a top view which shows the state which sealed the light emitting element shown in FIG. 21 with sealing resin. It is a top view which shows the state which divided | segmented the aggregate substrate shown in FIG. It is a top view which shows the example which changed the metal substrate into the metal film in the light-emitting device shown in FIG. It is EE sectional drawing of the light-emitting device shown in FIG. It is FF sectional drawing of the light-emitting device shown in FIG. It is a top view which shows the conventional light-emitting device. It is principal part sectional drawing of the light-emitting device shown in FIG.

  FIG. 1 is a plan view of a light emitting device according to an embodiment of the present invention, FIGS. 2 and 3 are AA and BB sectional views, and FIG. 4 is a plan view showing a state where a plurality of light emitting devices are mounted side by side. . The light emitting device 10 shown in FIGS. 1 to 4 includes a metal substrate 11 and a substrate 12. The metal substrate 11 is made of a metal or an alloy having high thermal conductivity and excellent heat dissipation, and forms a substantially rectangular parallelepiped such as a plate shape. The substrate 12 is made of alumina, resin, or the like, and has a wiring portion 13 and terminal portions 14 and 15. The wiring portion 13 is set to a length that is approximately the same as or slightly shorter than the length of the metal substrate 11 in the longitudinal direction, and is set to a width that is approximately one third of the length of the metal substrate 11 in the width direction. Yes. The terminal portions 14 and 15 are provided at both ends in the longitudinal direction of the wiring portion 13, and projecting portions 14 a projecting in the lateral direction by substantially the same length as the length of the metal substrate 11 in the lateral direction. 14b, 15a, 15b. The substrate 12 is affixed on the metal substrate 11 so that the wiring portion 13 is arranged in the center and longitudinal direction of the surface of the metal substrate 11. At this time, the terminal portions 14 and 15 of the substrate 12 are in a state of protruding outward from the end portions in the longitudinal direction of the metal substrate 11.

  Reference numerals 16 and 17 denote wiring patterns provided in the longitudinal direction on the wiring portion 13 of the substrate 12, and are composed of independent parallel straight lines. Reference numerals 18 and 19 denote conductive patterns provided on the terminal portions 14 and 15 of the substrate 12, respectively. The conductive patterns 18 and 19 in the present embodiment communicate with the wiring patterns 16 and 17, respectively, and are formed not only on the front surface side of the terminal portions 14 and 15 but also on the back surface side through the through holes 18a and 19a. ing.

  Reference numerals 20 and 21 denote a plurality of light emitting elements such as LEDs arranged and mounted on the element mounting surfaces 11a and 11b of the metal substrate 11, respectively. The element mounting surfaces 11a and 11b of the metal substrate 11 are partitioned in the longitudinal direction by the wiring portion 13 of the substrate 12 on the surface of the metal substrate 11, and the end portions in the upper and shorter directions are respectively released. The light emitting elements 20 and 21 are bonded to the element mounting surfaces 11a and 11b with the wiring portion 13 interposed therebetween and arranged in a line in the longitudinal direction. The light emitting elements 20 and 21 are wire-bonded to the wiring patterns 16 and 17 of the wiring part 13, respectively. In FIG. 1, the same number of light emitting elements 20 and 21 are provided at symmetrical positions with respect to the wiring portion 13, but the positions and numbers thereof can be arbitrarily changed and set.

  Reference numeral 22 denotes a sealing resin made of epoxy resin, silicon resin, or the like, and seals the light emitting elements 20 and 21. In this embodiment, the sealing resin 22 is formed so as to cover the element mounting surfaces 11a and 11b and the wiring portion 13 of the substrate 12 in order to seal all the light emitting elements 20 and 21 and the wires.

  In the light emitting device 10 having the above-described configuration, the element mounting surfaces 11a and 11b are partitioned at the center by the wiring portion 13 of the substrate 12, but the upper and short ends thereof are released. . For this reason, the light emitted from the light emitting elements 20 and 21 mounted on the element mounting surfaces 11a and 11b is irradiated from the upper and lateral ends (sides). Therefore, the light emitting device 10 can irradiate not only the upper part but also the surroundings, and the directivity can be expanded.

  Further, since the light emitting element 10 is provided with terminal portions 14 and 15 at both ends in the longitudinal direction, as shown in FIG. Can be implemented. When mounted side by side in this way, a linear light source whose length can be arbitrarily set can be formed. In this case, light is widely irradiated from the end of the short direction end which is the long side, and the periphery can be widely illuminated.

  Further, since the terminal portions 14 and 15 protrude from the metal substrate 11 and the conductive patterns 18 and 19 are formed on the front and back surfaces thereof, both the front and back surfaces of the terminal portions 14 and 15 can be mounted on a mother board or the like. Is possible. Note that the light emitting device 10 can be mounted not only in the arrangement shown in FIG. 4 but also in series, in parallel, or individually by simply changing the mounting direction and connection.

  Next, a state at the time of manufacturing the light emitting device 10 will be described with reference to FIGS. First, a large metal substrate 31 (FIG. 5) capable of obtaining a plurality of metal substrates 11 and a large substrate 32 (FIG. 6) capable of obtaining a plurality of substrates 12 are prepared and shown in FIGS. So that they are layered together. The large metal substrate 31 is provided with long holes 31a at portions corresponding to the plurality of terminal portions 32a arranged in the vertical direction in the figure provided on the large substrate 32. The large substrate 32 is provided with a plurality of terminal portions 32a connected vertically in the drawing, and a plurality of wiring portions 32b formed like a cross between the terminal portions 32a in the horizontal direction in the drawing. A conductive pattern 32c including a through hole and a wiring pattern 32d are formed in the plurality of terminal portions 32a and the wiring portion 32b in the large substrate 32, respectively.

  As shown in FIGS. 7 to 10, a part of the surface of the large metal substrate 31 is exposed between the wiring portions 32 b of the large substrate 32 in the collective substrate 30 in which the large metal substrate 31 and the large substrate 32 are bonded together. As shown in FIG. 11, a plurality of light emitting elements 33 are mounted thereon. The light emitting element 33 is wire bonded to the wiring pattern 32d.

  After that, as shown in FIG. 12, the surface of the collective substrate 30 excluding the upper surface of the terminal portion 32a of the large substrate 32 is covered with a sealing resin 34 to seal the light emitting element 33. After sealing in this manner, as shown in FIG. 13, the terminal portions 32a of the large substrate 32 are cut vertically by dicing, and the rows of the light emitting elements 33 between the wiring portions 32b are cut horizontally by dicing. Thus, it is divided into individual light emitting devices. Thereby, many light-emitting devices can be manufactured at once.

  When cutting the collective substrate 30 in this embodiment, when cutting in the horizontal direction in FIG. 13, the large metal substrate 31 and the large substrate 32 are cut, and when cutting in the vertical direction, only the large substrate is cut. Become. For this reason, compared with the case where the four sides of the metal substrate have to be cut, the life of the blade used for dicing is extended, and the replacement time of the blade can be extended to reduce the manufacturing cost.

  14 is a plan view showing a partially modified example in which the terminal portion in the above-described light emitting device 10 is changed to be provided only on one side of the wiring portion 13, and FIGS. 15 and 16 are a CC sectional view and a DD sectional view, respectively. FIG. 17 is a plan view showing a state where the light emitting devices are mounted side by side. In the light emitting device 40 shown in FIGS. 14 to 17, the terminal portion 44 is provided only on one side of the wiring portion 13 of the substrate 12 in the longitudinal direction (the right end in the drawing). The terminal portion 44 protrudes outward from the metal substrate 11 and has independent conductive patterns 48 and 49 communicating with the wiring patterns 16 and 17 on the wiring portion 13, respectively. The conductive patterns 48 and 49 are formed so as to go around the back surface of the terminal portion 44 through through holes, respectively. The metal substrate 11, the wiring part 13 of the substrate 12, the light emitting elements 20, 21 and the sealing resin 22 have the same configuration as that of the light emitting device 10 shown in FIG.

  Thus, by providing the terminal portion 44 only on one side in the longitudinal direction of the wiring portion 13 of the substrate 12, the light emitting device 40 can be reduced in size.

  Further, the same conductive patterns 48 (or conductive patterns 49) are arranged so that the same conductive patterns 48 (or conductive patterns 49) come into contact with each other by abutting the terminal portions 44 of the adjacent light emitting devices 40 or by shifting the terminal portions 44 as shown in FIG. It is possible to form a surface light source with a wide directivity by mounting in a similar manner.

  The light emitting device 40 can be manufactured in the same manner as the light emitting device 10 described above. That is, the large metal substrate 51 similar to the large metal substrate 31 shown in FIG. 5 and the large substrate 52 in which the wiring pattern and the conductive pattern in the large substrate 32 shown in FIG. A collective substrate 50 is formed. Next, the light emitting element 53 is mounted on the collective substrate 50 as shown in FIG. 21, and the light emitting element 53 is sealed with a sealing resin 54 as shown in FIG. Thereafter, as shown in FIG. 23, the collective substrate 50 is divided vertically and horizontally and separated into individual light emitting devices 40. As described above, the light emitting devices 10 and 40 can be manufactured in the same process only by changing the wiring pattern and the conductive pattern.

  24 to 26 are a plan view, an EE cross-sectional view, and an FF cross-sectional view showing an example in which the metal substrate 11 of the light emitting device 10 shown in FIG. The metal film 61 is formed or configured in the same manner as the wiring patterns 16 and 17, and the metal substrate 11 is thin and can be miniaturized, but has low strength. In this modified example, the shape of the metal film 61 is supported by supporting the four corners of the metal film 61 by the overhanging portions 14a, 14b, 15a, and 15b that project in the short direction of the terminal portions 14 and 15 of the substrate 12. Thus, the light emitting elements 20 and 21 are structured to have sufficient strength to enable mounting.

DESCRIPTION OF SYMBOLS 1 Base 2 LED element 3 Board | substrate 3a Through long hole 10 Light-emitting device 11 Metal substrate 11a, 11b Element mounting surface 12 Board | substrate 13 Wiring part 14,15 Terminal part 14a, 14b, 15a, 15b Overhang | projection part 16,17 Wiring pattern 18 , 19 Conductive pattern 18a, 19a Through hole 20, 21 Light emitting element 22 Sealing resin 30 Collective substrate 31 Large metal substrate 31a Long hole 32 Large substrate 32a Terminal portion 32b Wiring portion 32c Conductive pattern 32d Wiring pattern 33 Light emitting device 34 Sealing resin DESCRIPTION OF SYMBOLS 40 Light-emitting device 44 Terminal part 48,49 Conductive pattern 51 Large metal substrate 52 Large substrate 53 Light emitting element 54 Sealing resin 61 Metal film

Claims (4)

A metal substrate having a substantially rectangular parallelepiped;
A substrate having a wiring portion arranged in the center and in the longitudinal direction on the surface of the metal substrate;
A wiring pattern formed on the wiring portion of the substrate and including two independent wirings;
A conductive pattern provided on a terminal portion of the substrate that protrudes from an end portion in the longitudinal direction of the metal substrate;
On the element mounting surface of the metal substrate in which the center is partitioned in the longitudinal direction by the wiring part and both the upper and short ends are released, the wiring part is linearly arranged in the longitudinal direction. A plurality of light emitting elements arranged and connected to the wiring pattern,
A sealing resin for sealing the light emitting element;
A light emitting device comprising: 2. The light emitting device according to claim 1 , wherein terminal portions of the substrate are provided at both ends in the longitudinal direction of the wiring portion, and independent patterns of the wiring pattern are provided one by one . The light emitting device according to claim 1, wherein the terminal portion of the substrate is provided at one end portion in the longitudinal direction of the wiring portion, and two independent patterns of the wiring pattern are provided . The terminal portion of the substrate has a projecting portion projecting in a short direction of the wiring portion, and the metal substrate is made of a metal film provided between the projecting portions facing the longitudinal direction of the wiring portion. Item 4. The light emitting device according to Item 1 .

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