JP2013069837A - Light emitting module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting module which includes mounting surfaces, having a pair of electrode surfaces, in multiple directions and allows emitters to be mounted on the respective mounting surfaces thereby lighting a three dimensional space with uniform brightness and achieving excellent heat radiation performance.SOLUTION: A light emitting module includes: multiple emitters 13a, 13b, 13c; and a substrate 12 having multiple mounting surfaces 17a, 17b, 17c where the multiple emitters are respectively mounted and formed by a polyhedron where adjacent mounting surfaces make a predetermined angle. The mounting surface has a pair of electrode surfaces 15a, 15b at both sides with an insulation layer 14 sandwiched by the pair of electrode surfaces 15a, 15b. A pair of terminal electrode of the emitter electrically connects with the pair of electrode surfaces, and the multiple mounting surfaces are formed on all surfaces of the polyhedron which exclude the pair of facing electrode surfaces.

Description

  The present invention relates to a light emitting module configured by mounting a light emitter on an outer peripheral surface of a substrate made of a polyhedron.

  2. Description of the Related Art Conventionally, a light emitting module configured to obtain a wide range of light emission with high luminance by mounting a plurality of light emitters on a substrate is known. Such a light emitting module includes a flat substrate on which a plurality of pairs of electrode patterns are formed and a plurality of light emitting diodes (LEDs) having a PN junction structure. Since the planar mounting space of the substrate is limited, in order to mount a large number of LEDs, it is necessary to arrange them at high density with a small interval.

  According to the light emitting module having the above configuration, although a planar light emitting effect can be obtained, it is not suitable as a light source for illuminating a three-dimensional space like a light bulb. For this reason, in order to obtain three-dimensional light emission, an illuminating device configured by mounting LEDs on each surface of a polyhedral base body on which an electrode pattern is formed is disclosed (Patent Document 1).

  In addition, since the electrode pattern on which the LED is mounted is composed of two electrode surfaces including an anode and a cathode, a substrate having a structure in which a pair of metal materials are sandwiched between insulating members such as an adhesive may be used. . For example, in the light emitting diode disclosed in Patent Document 2, a pair of columnar electrode bodies are bonded together with an insulating material interposed therebetween, and an LED is mounted on the bonded upper surface, and each electrode body and bonding wire are electrically connected. It is formed in connection with. In this light emitting diode, in order to reduce the size of the plane on which the LED is mounted, the upper surface of the pair of electrode bodies bonded together is configured as a light emitting surface.

JP 2008-004415 A JP 2002-289924 A

  In the light emitting device disclosed in Patent Document 1, it is necessary to form a base body having a plurality of mounting surfaces facing a predetermined light emitting direction, and to form an electrode pattern on the surface of the base body by etching or the like. There is. For this reason, an electrode pattern can be formed so as to be suitable for the LED mounting form, but there is a problem in that the number of manufacturing steps and costs increase because a step of forming a base body and a step of forming an electrode pattern are required. It was.

  On the other hand, in the light emitting diode disclosed in Patent Document 2, since the upper surface where the pair of electrode bodies are bonded together is a light emitting surface, it cannot be said that the light emitting range is narrow and the reflection effect is not sufficient. In order to widen the light emitting surface, the electrode body itself must be formed in a large size, and there is a problem that manufacturing and product costs increase. Moreover, since the surface which mounts LED is one place, it is not the structure which arrange | positions several LED in three dimensions.

  Accordingly, an object of the present invention is to provide a mounting surface having a pair of electrode surfaces in multiple directions, and to mount a light emitter on each mounting surface, so that a three-dimensional space can be illuminated with uniform brightness and heat dissipation. It is to provide a light emitting module excellent in performance.

  In order to solve the above problems, a light emitting module of the present invention has a plurality of light emitters and a plurality of mounting surfaces for mounting the plurality of light emitters, and adjacent mounting surfaces have a predetermined angle. And the mounting surface has a pair of electrode surfaces on both sides of the insulating layer, and the pair of terminal electrodes of the light emitter are electrically connected to the pair of electrode surfaces. And

  According to the light emitting module according to the present invention, the light emitting body is mounted on each mounting surface of the substrate made of a polyhedron in which the adjacent mounting surfaces have a predetermined angle, so that it is possible to simultaneously illuminate multiple directions. . Further, since each of the mounting surfaces is formed by a pair of electrode surfaces with an insulating layer interposed therebetween, electrical connection can be easily achieved by placing a pair of terminal electrodes of the light emitter on the pair of electrode surfaces. be able to. Furthermore, since the number of mounting surfaces and the angle between adjacent mounting surfaces can be defined by changing the shape of the substrate, it is possible to configure a light emitting module by selecting a substrate having a shape suitable for the purpose of use. it can.

  By forming the substrate by a polyhedron of pentahedron or more and forming the areas of all the mounting surfaces substantially the same, it is possible to uniformly illuminate a wide range without unevenness.

  Also, by configuring the substrate with a block-shaped metal body having an insulating layer in the middle of the mounting surface, the heat dissipation effect is enhanced, and the heat generated from the light emitter mounted on each mounting surface is efficiently released to the outside. Can be made.

It is a perspective view of the light emitting module of 1st Embodiment. It is a perspective view of the board | substrate which comprises the said light emitting module. It is a side view which shows the mounting form of the said light emitting module. It is sectional drawing which comprised the said light emitting module with the light emitting element of PN structure. It is sectional drawing which comprised the said light emitting module with the light emitting device. It is sectional drawing of the light emitting module of 2nd Embodiment. It is sectional drawing of the light emitting module of 3rd Embodiment. It is sectional drawing of the light emitting module of 4th Embodiment. It is sectional drawing of the light emitting module of 5th Embodiment. It is a perspective view of the lamp | ramp which mounts the light emitting module of this invention.

  Hereinafter, embodiments of a light emitting module according to the present invention will be described in detail with reference to the accompanying drawings. 1 to 5 show the structure of the light emitting module 11 according to the first embodiment of the present invention. The light emitting module 11 includes a polyhedral substrate 12 and a plurality of light emitters 13a, 13b, and 13c mounted on the outer peripheral surface of the substrate 12.

  As shown in FIG. 2, the substrate 12 is formed in a hexahedron shape by a pair of block-shaped metal members 15 and 16 formed with an insulating layer 14 interposed therebetween. The insulating layer 14 is a layer made of an adhesive having an insulating property, and the pair of metal members 15 and 16 are electrically separated by this layer. The pair of metal members 15 and 16 are made of a copper material having excellent conductivity and are formed in a horizontally long rectangular column shape having a square cross section. As described above, since the substantially entire substrate 12 is constituted by the block-shaped metal members 15 and 16 having a wide exposed portion to the outside, as described later, when the light emitter 13 is mounted, the thermal conductivity is high. It becomes a good radiator (heat sink).

  The substrate 12 having the above-described structure has planar mounting surfaces 17a to 17d made of metal members 15 and 16 facing each other with the insulating layer 14 in between, and the mounting surfaces are adjacent to each other at right angles. Yes. Each of the mounting surfaces 17a to 17d is composed of a pair of electrode surfaces 15a and 16a facing each other with the insulating layer 14 traversing the center portion therebetween. Further, as shown in FIG. 3, both side surfaces 18a and 18b of the substrate 12 orthogonal to the mounting surfaces 17a to 17d are disposed when the one mounting surface 17d is placed on an external substrate 19 such as a mother board. It becomes an electrode surface on which a part of the solder 20 is applied.

  The substrate 12 is formed by bonding a pair of metal members 15 and 16 with an insulating layer 14 made of an adhesive, but can also be formed via a thin insulating plate made of a resin material. As another method for forming the substrate 12, a polyhedral base body is formed of resin, and an insulating region in which the resin surface is exposed in a strip shape is provided at the center of each outer peripheral surface serving as the mounting surface. Alternatively, the entire surface can be formed by plating with a highly conductive metal.

  The substrate 12 can be an abutment surface for mounting any one of the mounting surfaces 17 a to 17 d on the external substrate 19. In the example shown in FIG. 3, the mounting surface 17d is used as the contact surface, and the light emitters 13a, 13b, and 13c are mounted on the other three mounting surfaces 17a, 17b, and 17c. Each of the light emitters 13a, 13b, and 13c is provided with a pair of electrode portions 26a and 26b on the lower surface side, and the pair of electrode portions and the pair of electrode surfaces 15a and 16a of the substrate 12 are electrically connected. The Then, when the one mounting surface 17d is placed on the electrode patterns 19a and 19b of the external substrate 19, a part of the solder 20 is applied to the pair of side surfaces 18a and 18b, so that the electrical connection with the external substrate 19 is achieved. Connection is made. The substrate 12 mounted on the external substrate 19 has one of the pair of metal members 15 and 16 on the anode side and the other on the cathode side, and the light emitters 13a, 13b and 13c mounted on the mounting surfaces 17a, 17b and 17c. Are connected in parallel.

  The light emitting body 13 is sealed with a light emitting element 21 having a PN junction structure as shown in FIG. 4 or the light emitting element 21 as shown in FIG. 5 on a chip substrate 23 with a translucent resin body 25. A light emitting device (LED) 22 can be used. As the light emitting element 21, for example, a gallium nitride compound semiconductor, an aluminum gallium arsenide, or a gallium arsenide phosphorus semiconductor is used. These semiconductors consist of a substrate made of sapphire glass and a diffusion layer (P layer and N layer) obtained by diffusing and growing a P-type semiconductor and an N-type semiconductor on the substrate. Each of the P-type semiconductor and the N-type semiconductor includes a P-type electrode and an N-type electrode, and the exposed portions of the P-type electrode and the N-type electrode serve as a pair of element electrodes 21a and 21b.

  When the light emitting element 21 is directly mounted on the mounting surfaces 17a, 17b, and 17c, as shown in FIG. 4, the element electrodes 21a and 21b are positioned so as to correspond to the pair of electrode surfaces 15a and 16a. Placed. Then, the bump-shaped solder 20 is placed between the pair of electrode surfaces 15a and 16a and the element electrodes 21a and 21b, and the entire light emitting module 11 is subjected to a reflow process to achieve electrical connection. Further, the color of the luminescent color can be adjusted by covering the upper surface of the light emitting element 21 with a fluorescent plate or sheet.

  On the other hand, as shown in FIG. 5, the light emitter has a chip substrate 23 having a pair of chip electrodes 24a and 24b at both ends, a light emitting element 21 mounted on the chip substrate 23, and the light emitting element 21. In the case of being configured as a surface mount type LED 22 composed of a resin body 25 to be stopped, a pair of chip electrodes 24a, 24b are placed on the pair of electrode surfaces 15a, 16a in correspondence with each other, and then solder 20 or It is electrically connected via a conductive adhesive or the like. In the present embodiment, the light emitting element 21 and the pair of chip electrodes 24a and 24b are connected by wires. However, the LED may be a surface-mounted LED via solder bumps, and each mounting surface of the substrate 12 Any light emitter that can be electrically connected to the pair of electrode surfaces 15a and 16a formed on 17a, 17b, and 17c may be used. Further, the hue of the luminescent color can be adjusted by including a fluorescent agent in the resin body 25.

  Since the mounting space differs between the light emitting element 21 and the LED 22, the size of the substrate 12 and the pair of electrode surfaces 15a, 16a provided on the mounting surfaces 17a, 17b, 17c in accordance with each aspect. The size of is specified. Although one light emitter 13 is disposed on each of the mounting surfaces 17a, 17b, and 17c, a plurality of light emitters 13 including a plurality of light emitting elements 21 and LEDs 22 can be disposed in parallel on the same mounting surface. .

  According to the light emitting module 11 of the present embodiment, as shown in FIG. 1, the light emitting modules 13a, 13b, and 13c mounted on the mounting surfaces 17a, 17b, and 17c facing the three directions of the substrate 12, respectively, A spatial region extending about 180 degrees centering on the left-right direction can be set as the irradiation range. Further, by applying nickel plating or silver plating with high light reflectivity to the pair of side surfaces 18a and 18b on which the light emitter is not mounted, the brightness of the space region facing both side surfaces 18a and 18b can be ensured.

  In the first embodiment, the case where the predetermined angle of the mounting surface adjacent to the substrate is 90 degrees has been described, but in the light emitting module of the present invention, the polyhedral shape of the substrate can take various shapes other than the hexahedron, Accordingly, it can be configured based on a substrate having a predetermined angle other than 90 degrees. These cases will be described below. 6 to 9 show various modifications of the light emitting module of the present invention, and show cross-sectional shapes along each mounting surface. Hereinafter, in each embodiment, the plurality of light emitters 13 and the external substrate 19 are assumed to be common, and the mounting surface of each substrate will be referred to as A, B, C.

  FIG. 6 is an example of the light emitting module of the second embodiment configured by a substrate having a quadrangular cross section. According to this embodiment, since four mounting surfaces A to D can be obtained, any one mounting surface is used as a contact surface to the external substrate 19, and the light emitter 13 is mounted on the remaining three mounting surfaces. can do. FIG. 6A shows the basic configuration of the regular quadrangular columnar substrate 12a shown in the first embodiment, and the angle α formed by the mounting surfaces A to D is 90 degrees. FIG. 6B is formed based on a trapezoidal substrate 12b having a wide mounting surface D. FIG. According to this board 12b, since the light emitters 13 mounted on the left and right mounting surfaces B and C are inclined so as to face the front, the irradiation centering on the light emitters 13 arranged on the mounting surface A is performed. A light emitting effect that overlaps the range can be obtained. At this time, the angle α formed by the mounting surfaces (AB) and (AC) is approximately 120 degrees, and the angle β formed by the mounting surfaces (DB) and (DC) is approximately 60 degrees. can do. In FIG. 6C, since the mounting surface D has an inverted trapezoidal shape narrower than the upper mounting surface A, partial light emission in the forward direction facing the mounting surface A and partial light emission from the left and right directions toward the external substrate 19 side. A lighting effect having the following can be obtained. At this time, the angle α formed by the mounting surfaces (AB) and (AC) is about 80 degrees, and the angle β formed by the mounting surfaces (DB) and (DC) is about 100 degrees. can do.

  FIG. 7 shows an example of the light emitting module of the third embodiment configured by the substrates 32a, 32b, and 32c having a triangular cross section. According to this embodiment, since the three mounting surfaces A to C can be obtained, any one mounting surface is used as a contact surface to the external substrate 19, and the light emitter 13 is mounted on the remaining two mounting surfaces. can do. Here, the mounting surfaces A and B are used for mounting the light emitter 13, and the mounting surface C is used for contact with the external substrate 19. Since the substrate 32a shown in FIG. 7A has a regular triangular cross section, the light emitters 13 mounted on the two mounting surfaces A and B each irradiate a range of about 120 degrees. Can do. The angle α formed by the mounting surfaces A to C at this time is 60 degrees. Since the board 32b shown in FIG. 7B has an isosceles triangle shape with a wide mounting surface C, the inclination angles of the mounting surfaces A and B are shallower than those in FIG. Become. At this time, the angle α formed by the mounting surfaces (AB) can be about 90 degrees, and the angle β formed by the mounting surfaces (CA) and (CB) can be about 45 degrees, respectively. In addition, the board 32c shown in FIG. 7C has an isosceles triangle shape with a narrow mounting surface C. Therefore, the inclination angles of the mounting surfaces A and B are deeper than those in FIG. It is suitable for applications that irradiate directions. At this time, the angle α formed by the mounting surfaces (AB) can be about 30 degrees, and the angle β formed by the mounting surfaces (CA) and (CB) can be about 75 degrees, respectively.

  FIG. 8 shows an example of the light emitting module of the fourth embodiment configured by the substrates 42a, 42b and 42c having a pentagonal cross section. According to this embodiment, since the mounting surfaces A to E having a pentagonal configuration can be obtained, any one mounting surface is used as a contact surface to the external substrate 19, and the light emitters 13 are provided on the remaining four mounting surfaces. Can be implemented. FIG. 8A is formed by left and right mounting surfaces C and D rising from the mounting surface E at a substantially right angle and a pair of mounting surfaces A and B extending in a mountain shape from the upper end sides of the mounting surfaces C and D. The light emission toward the left and right side surfaces parallel to the external substrate 19 and the light emission effect centered on the upper side can be obtained. At this time, the angle α formed by the mounting surface (AB) is about 120 degrees, the angle β formed by the mounting surfaces (BC) and (AD) is about 120 degrees, and the mounting surface (EC). , (ED) can be each about 90 degrees. In FIG. 8B, the left and right mounting surfaces C and D are inclined slightly upward by widening the mounting surface E. Thereby, the light emission range from the pair of mounting surfaces A and B located above can be illuminated more brightly. At this time, the angle α formed by the mounting surface (AB) is about 120 degrees, the angle β formed by the mounting surfaces (BC) and (AD) is about 130 degrees, and the mounting surface (EC). , (ED) can be about 80 degrees. Since FIG. 8C has a shape close to a regular pentagon, any mounting surface A to E can be used as a contact surface, and substantially all directions except for the contact surface can be irradiated uniformly. . For this reason, the brightness in a range close to the external substrate 19 can be secured. At this time, the angle α formed by the mounting surfaces A to E is 108 degrees.

  FIG. 9 is an example of the light emitting module of the fifth embodiment configured by the substrates 52a, 52b, and 52c having a hexagonal cross section. According to this embodiment, since the hexagonal mounting surfaces A to F can be obtained, any one mounting surface is used as a contact surface to the external substrate 19, and the light emitters 13 are provided on the remaining five mounting surfaces. Can be implemented. FIG. 9A shows left and right mounting surfaces D and E that rise substantially perpendicularly from the mounting surface F, a pair of mounting surfaces B and C that extend obliquely from the upper end sides of the mounting surfaces D and E, and the mounting surfaces B, It is formed by a mounting surface A that extends over both ends of C and is parallel to the mounting surface F. As a result, light emission toward the left and right side surfaces parallel to the external substrate 19 and a light emission effect directed upward from the left and right mounting surfaces B and C around the mounting surface A can be obtained. At this time, the angle α formed by the mounting surfaces (AB) and (AC) is about 130 degrees, and the angle β formed by the mounting surfaces (BD) and (CE) is about 140 degrees. The angle θ formed by the mounting surfaces (FD) and (FE) can be set to about 90 degrees. In FIG. 9B, the left and right mounting surfaces D and E are inclined slightly upward by widening the mounting surface F. Thereby, the light emission from the mounting surface A and the pair of mounting surfaces B and C inclined downward from the mounting surface A can be further enhanced. At this time, the angle α formed by the mounting surfaces (AB) and (AC) is about 130 degrees, and the angle β formed by the mounting surfaces (BD) and (CE) is about 150 degrees, respectively. The angle θ formed by the mounting surfaces (FD) and (FE) can be about 80 degrees. Since FIG. 9C has a shape close to a regular hexagon, any mounting surface A to F can be a contact surface, and substantially all directions except the contact surface can be irradiated uniformly. . At this time, the angle α formed by the mounting surfaces A to F is 120 degrees. For this reason, the brightness in the range close to the external substrate 19 can be secured, and the entire circumference of the mounting surfaces A to E can be continuously illuminated more uniformly than the regular pentagonal cross section shown in FIG. Can do.

  Each of the light emitting modules shown in FIGS. 6 to 9 has a symmetrical shape with respect to one mounting surface serving as a contact surface, and the area of each mounting surface is substantially the same. Since it is uniform, the space area facing each mounting surface can be illuminated uniformly.

  Although a single light emitter is mounted on each mounting surface, a plurality of light emitters can be arranged in parallel if arrangement is possible. Furthermore, by changing the shape of the board so that a predetermined pair of mounting surfaces are wide, a plurality of light emitters are mounted side by side in this expanded space, so that a space facing a certain direction is partially It is possible to illuminate brightly.

  FIG. 10 shows an application example in which the light emitting module of the present invention is incorporated as a light source of a lamp-type lighting device 60. The light emitting module 61 used here has a substrate 62 in which left and right mounting surfaces B and C extending orthogonally from the mounting surface D are longer than the other mounting surfaces A by deforming the substrate 12 shown in FIG. It is used. As described above, since the left and right mounting surfaces B and C extend long upward, a plurality of light emitters 13 can be mounted side by side on the same mounting surface. For this reason, it is suitable for illuminating a vertically long space close to a small fluorescent tube. In addition, since the number of mounted light emitters is increased, it is bright overall, and in particular, the light emission range in the left and right side directions can be expanded. Furthermore, since the substrate 62 is formed of a pair of block-like metal members 15 and 16, sufficient heat dissipation can be ensured.

DESCRIPTION OF SYMBOLS 11 Light emitting module 12 Board | substrate 13a, 13b, 13c Light emitter 14 Insulating layer 15, 16 Metal member 15a, 16a Electrode surface 17a, 17b, 17c, 17d Mounting surface 18a, 18b Side surface 19 External substrate 19a, 19b Electrode pattern 20 Solder 21 Light emission Element 21a, 21b Element electrode 22 LED
23 Chip substrate 24a, 24b Chip electrode 25 Resin body 26a, 26b Electrode portion 60 Illuminating device 61 Light emitting module 62 Substrate

Claims (8)

A plurality of light emitters;
A plurality of mounting surfaces for mounting a plurality of light emitters, and a substrate made of a polyhedron having adjacent mounting surfaces having a predetermined angle,
The mounting surface has a pair of electrode surfaces on both sides of an insulating layer, and a pair of terminal electrodes of the light emitter are electrically connected to the pair of electrode surfaces.   The light emitting module according to claim 1, wherein the plurality of mounting surfaces are formed on all surfaces except a pair of opposing electrode surfaces of the polyhedron.   The light emitting module according to claim 1, wherein the plurality of mounting surfaces have substantially the same planar area on all mounting surfaces.   2. The light emitting module according to claim 1, wherein one of the plurality of mounting surfaces is an electrical contact surface with a mother board, and at least one light emitter is mounted on each of the remaining mounting surfaces.   The light emitting module according to claim 1, wherein the substrate is formed of a polyhedron having a pentahedron or more.   The light emitting module according to claim 1, wherein the substrate is formed of a block-shaped metal body having the insulating layer at an intermediate portion of the mounting surface.   2. The light emitting module according to claim 1, wherein the light emitter is a light emitting device having a PN structure or a light emitting device formed by sealing the light emitting device on a substrate.   The light emitting module according to claim 1, wherein a plurality of light emitters are arranged on the mounting surface.

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