JP2009071012A - Light emitting device, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light emitting device which has excellent light emission characteristics, and can prevent a deterioration in manufacturing efficiency and trouble caused by cut burrs. <P>SOLUTION: The light emitting device includes a substrate which has a nonpolar electrode layer 6 formed on a top surface, an LED element 20 mounted on a predetermined region of the nonpolar electrode layer 6, a plurality of cathode electrode layers 3 and anode electrode layers 4 formed on the top surface of the substrate 1 to supply electric power to the LED element 20, and a reflection frame 30 made of a metallic material and having an internal surface 31a made into a reflecting surface for reflecting light from the LED element 20, wherein the reflection frame 30 is provided with a cut portion 36 on one end side of an external side surface so that at least a portion of a corner portion formed of two external side surfaces is removed, and also mounted on the top surface of the substrate 1 in thermal contact with the nonpolar electrode layer 6, which is electrically insulated and separated from one of the cathode electrodes 3 and anode electrodes 4. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device including a reflective frame that reflects light from a light emitting element, and a method for manufacturing the same.

  2. Description of the Related Art Conventionally, a light emitting device including a reflection frame that reflects light from a light emitting element is known (see, for example, Patent Document 1).

  In Patent Document 1, two lead frames that are electrically insulated from each other are formed on the upper and lower sides of a glass epoxy substrate, and an LED element (light emitting element) is mounted on one of the two lead frames. In addition, a light emitting device is described in which a reflective frame is provided on each lead frame so as to surround the LED element. The reflection frame is made of plastic (resin), and its inner peripheral surface is configured to function as a reflection surface that reflects light from the LED element. Also, one lead frame of the two lead frames is electrically connected to one electrode terminal of the LED element via a bonding wire, and the other lead frame of the two lead frames is connected via a bonding wire. The other electrode terminal of the LED element is electrically connected. In other words, the light emitting device described in Patent Document 1 is configured such that power is supplied to the LED element via two lead frames.

  In the conventional light emitting device configured as described above, since the reflection frame body is made of plastic (resin), even if the reflection frame body is provided on the two lead frames, the two lead frames are electrically connected. While short-circuiting is suppressed, there is a disadvantage that heat generated by light emission of the LED element is difficult to dissipate to the outside.

Therefore, conventionally, a light emitting device is known in which a reflection frame is made of a metal material in order to easily dissipate heat generated by light emission of the LED element to the outside. FIG. 33 is a cross-sectional view showing an example of a conventional light emitting device including a reflective frame body made of a metal material. Referring to FIG. 33, the light emitting device 900 includes a substrate 901 made of glass epoxy, an electrode layer 902 formed on the substrate 901, and an LED element (light emission) mounted on a predetermined region of the electrode layer 902. Element) 903 and a reflection frame 904 provided on the electrode layer 902 so as to surround the LED element 903. In addition, the inner peripheral surface 904a of the reflective frame 904 is configured to function as a reflective surface that reflects light from the LED element 903. The reflective frame 904 is formed on the electrode layer 902 of the substrate 901 by an adhesive 905 made of a resin material (insulating material) such as an epoxy resin or an acrylic resin in order to suppress an electrical short circuit of the electrode layer 902. It is glued. In addition, a translucent member 906 that covers the LED element 903 is filled in a region inside the reflective frame 904.
JP 2006-186297 A

  However, in the configuration of the conventional light emitting device 900 shown in FIG. 33, a resin adhesive layer (adhesive 905) having low thermal conductivity is interposed between the substrate 901 and the reflective frame 904. There is a disadvantage that it is difficult to efficiently transfer heat from the LED element 903 to the reflection frame 904. For this reason, it is difficult to efficiently dissipate the heat generated by the light emission of the LED element 903 from the reflection frame body 904, and thus it is difficult to sufficiently suppress the deterioration of the light emission characteristics due to the temperature rise of the LED element 903. There is a problem of becoming.

  Further, in the above-described conventional light emitting device 900, since the reflection frame 904 is made of a metal material, the dicing speed in the cutting process by the dicing saw is higher than that in the case where the reflection frame is made of a resin material. There is an inconvenience that (cutting speed) decreases. Thereby, there exists a problem that manufacturing efficiency falls. Further, since the reflection frame body 904 is made of a metal material, there is a disadvantage that cutting burrs are likely to occur at the edge of the cut portion of the reflection frame body 904 in the cutting process using a dicing saw. Therefore, when a cut burr occurs in the reflective frame 904, the cut burr causes a mounting failure of the light emitting device 900, or the cut burr comes into contact with the electrode layer 902 formed on the lower surface of the substrate 901. There is a problem that various disadvantages occur.

  The present invention has been made in order to solve the above-described problems, and an object of the present invention is to have good light emission characteristics and to suppress a decrease in manufacturing efficiency, and to cut. An object of the present invention is to provide a light emitting device capable of suppressing the occurrence of inconvenience due to burrs.

  To achieve the above object, a light emitting device according to a first aspect of the present invention includes a substrate having a conductor layer formed on the upper surface, a light emitting element mounted on a predetermined region of the conductor layer, and an upper surface of the substrate. A plurality of electrode layers for supplying power to the light emitting element, and a reflective frame body made of a metal material, the inner peripheral surface of which is a reflective surface that reflects the light from the light emitting element, and is reflective The frame body is provided with a first cutout at least on one end side of the outer surface, so that at least a part of the corner portion constituted by the two outer surfaces is removed and on the upper surface of the substrate. The plurality of electrode layers include a cathode electrode and an anode electrode, and the conductor layer is electrically insulated from at least one of the cathode electrode and the anode electrode. It is separated.

  In the light emitting device according to the first aspect, as described above, the reflective frame is made of a metal material, and the reflective frame is thermally connected to the conductor layer on which the light emitting element is mounted, thereby emitting light. The heat generated due to the light emission of the element can be efficiently transmitted to the reflecting frame through the conductor layer, and the transmitted heat can be efficiently radiated from the reflecting frame. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, so that the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired.

  In the above configuration, since the conductor layer is electrically insulated and separated from at least one of the cathode electrode and the anode electrode, the reflective frame is thermally connected to the conductor layer without considering an electrical short circuit. can do.

  Further, in the light emitting device according to the first aspect, as described above, at least the first cutout portion is provided on one end side of the outer surface of the reflection frame body, thereby reducing the cutting area of the reflection frame body. Therefore, even if the reflective frame is made of a metal material, a decrease in dicing speed (cutting speed) in the cutting process can be suppressed. Thereby, the fall of manufacturing efficiency can be suppressed.

  Furthermore, in the light emitting device according to the first aspect, as described above, by removing at least a part of the corner formed by the two outer surfaces of the reflective frame, in the step of cutting the reflective frame, Even if a cut burr occurs at the edge of the cut portion of the reflection frame, it is possible to suppress the cut burr from protruding beyond the outer surface (outer surface) of the reflection frame. Thereby, generation | occurrence | production of the inconvenience resulting from a cutting | disconnection burr | flash can be suppressed. For example, a light emitting device housed in an embossed pocket of an embossed carrier tape by suppressing the cutting burr from projecting to the side beyond the side of the reflective frame can be When taking out from inside, it can suppress that the cutting | disconnection burr | flash of a reflective frame is caught by the side wall etc. of the pocket of an embossed carrier tape. For this reason, the cutting frame burr of the reflecting frame is caught on the side wall of the pocket, which causes the disadvantage that the adsorption position of the light emitting device due to the adsorption collet is shifted or an adsorption error due to the adsorption collet occurs. Can be suppressed. Thereby, since the adsorption position of the light-emitting device by the suction collet can be suppressed, the light-emitting device can be mounted in a region to be mounted when the light-emitting device is mounted on a mounting substrate or the like by the suction collet. . That is, since a reduction in mounting accuracy can be suppressed, occurrence of mounting defects can be suppressed. Further, by suppressing the suction mistake due to the suction collet, the mounting operation can be continued without stopping the mounting device for mounting the light emitting device on the mounting substrate or the like. As a result, it is possible to improve work efficiency (manufacturing efficiency) during mounting while suppressing mounting defects during mounting of the light emitting device.

  In addition, by suppressing the burrs from protruding laterally beyond the outer surface of the reflection frame (exceeding the outer tolerance), for example, when the light-emitting device is mounted on a mounting substrate, the reflection of the light-emitting device Since it is possible to suppress the occurrence of mounting defects in which the cutting burrs of the frame come into contact with other electronic components, etc., the mounting area can be used effectively, and the reflective frame is made of a metal material. Even in this case, it is possible to suppress the occurrence of inconveniences such as electrical short-circuiting or scratching of other electronic components due to the contact between the other electronic components and the cutting burr. .

  In the light emitting device according to the first aspect, preferably, the reflection frame body has a substantially square shape when seen in a plan view, and the first cutout portions are formed on the four outer surfaces of the reflection frame body. Each is provided on one end side and the other end side. And each of the four corner | angular parts comprised by the two outer surfaces of a reflective frame is removed by the 1st notch part. If comprised in this way, even if a cutting | disconnection burr | flash generate | occur | produces in the edge of the cutting | disconnection part of a reflective frame body in the cutting process of a reflective frame body, a cutting | disconnection burr | flash will be a reflection frame body in all four corners of a reflective frame body. It can suppress projecting to the side beyond the outer side surface (outer shape surface). For this reason, generation | occurrence | production of the inconvenience resulting from a cutting | disconnection burr | flash can be suppressed easily. Moreover, if comprised in this way, since the cutting | disconnection area | region of a reflective frame body can be made smaller, the fall of the dicing speed (cutting speed) in a cutting process can be suppressed easily.

  In the light emitting device according to the first aspect, preferably, the first notch is covered with a resin member. If comprised in this way, in the cutting process of a reflective frame, it can be made hard to produce a cutting | disconnection burr | flash at the edge of the cut part of a reflective frame.

  A light-emitting device according to a second aspect of the present invention includes a substrate having a conductor layer formed on the upper surface, a light-emitting element mounted on a predetermined region of the conductor layer, and formed on the upper surface of the substrate. A plurality of electrode layers, and a reflective frame including a frame body portion that is made of a metal material and has an inner peripheral surface that is a reflective surface that reflects light from the light emitting element. And at least the frame portion is mounted in a state of being thermally connected to the conductor layer on the upper surface of the substrate so that the frame portion is placed on the inner region of the upper surface of the substrate in plan view. The electrode layer includes a cathode electrode and an anode electrode, and the conductor layer is electrically insulated and separated from at least one of the cathode electrode and the anode electrode.

  In the light emitting device according to the second aspect, as described above, the reflective frame is made of a metal material, and the reflective frame is thermally connected to the conductor layer on which the light emitting element is mounted, thereby emitting light. The heat generated due to the light emission of the element can be efficiently transmitted to the reflecting frame through the conductor layer, and the transmitted heat can be efficiently radiated from the reflecting frame. For this reason, even if the light emitting element generates heat due to light emission, the temperature rise of the light emitting element can be effectively suppressed, so that the element temperature of the light emitting element can be kept low. Thereby, since the fall of the light emission characteristic resulting from the raise of element temperature can be suppressed, a favorable light emission characteristic can be acquired.

  In the above configuration, since the conductor layer is electrically insulated and separated from at least one of the cathode electrode and the anode electrode, the reflective frame is thermally connected to the conductor layer without considering an electrical short circuit. can do.

  Further, in the light emitting device according to the second aspect, as described above, the reflection frame body is placed on the inner region of the upper surface of the substrate so that at least the frame body portion is seen in a plan view. By mounting on the upper surface, it is possible to reduce the cutting area of the reflecting frame in the step of cutting the reflecting frame. For this reason, even if it comprises a reflective frame body from a metal material, the fall of the dicing speed (cutting speed) in a cutting process can be suppressed. Thereby, the fall of manufacturing efficiency can be suppressed.

  Furthermore, in the light emitting device according to the second aspect, as described above, the reflection frame body is placed on the inner region of the upper surface of the substrate so that at least the frame body portion is seen in a plan view. By mounting on the top surface, even if a cutting burr occurs at the edge of the cut part of the reflective frame in the cutting process, the cut burr protrudes to the side beyond the side surface (outer surface) of the reflective frame. Can be suppressed. Thereby, even if a cut burr occurs at the edge of the cut portion of the reflective frame, it is possible to suppress the occurrence of inconvenience due to the cut burr as in the light emitting device according to the first aspect described above.

  In the light emitting device according to the second aspect, preferably, the substrate has a quadrangular shape when seen in a plan view, and the reflection frame has a frame portion having a substantially circular shape when seen in a plan view. And a cutting portion formed so as to extend outward from a part of the outer surface of the frame body portion. If comprised in this way, a reflective frame body can be easily mounted | worn on the area | region inside a board | substrate area | region on the upper surface of a board | substrate. Furthermore, the occurrence of inconvenience due to cutting burrs can be easily suppressed by using the cutting portion as a cutting region.

  In this case, preferably, the thickness of the cut portion is smaller than the thickness of the reflective frame. If comprised in this way, since the fall of the dicing speed (cutting speed) in a cutting process can be suppressed easily, the fall of manufacturing efficiency can be suppressed easily.

  In this case, preferably, at least the outer surface of the frame body portion is covered with a resin member. If comprised in this way, in the cutting process of a reflective frame, it can be made hard to produce a cutting | disconnection burr | flash at the edge of the cut part of a reflective frame.

  In the light emitting device according to the first and second aspects, preferably, the reflecting frame is further provided with a second notch at at least a part of a corner formed by the bottom surface and the outer surface of the reflecting frame. ing. If comprised in this way, even when the electrode terminal etc. are formed in the back surface side of a board | substrate, the insulation distance of the electrode terminal and a reflective frame body can be ensured widely. For this reason, in the cutting process of the reflective frame, even if a cut burr extending in the substrate direction occurs at the edge of the cut part of the reflective frame, the contact between the electrode terminal of the substrate and the cut burr is suppressed, The occurrence of inconvenience that a short circuit occurs can be suppressed.

  In this case, the second cutout is preferably covered with a resin member. If comprised in this way, in the cutting process of a reflective frame, it can be made hard to produce the cutting | disconnection burr | flash extended in a board | substrate direction in the edge of the cut part of a reflective frame.

  In the light emitting device according to the first and second aspects, preferably, the reflection frame is bonded to the conductor layer with a conductive adhesive. If comprised in this way, while being able to transmit the heat which generate | occur | produced with the light emission of a light emitting element more efficiently to a reflective frame body through a conductor layer, the transmitted heat can be more efficiently carried out. Heat can be dissipated from the reflective frame. Moreover, if comprised in this way, the adhesion | attachment process of a reflective frame body can be simplified unlike the case where the reflective frame body is adhere | attached on a conductor layer with the resin adhesive comprised from an epoxy resin, an acrylic resin, etc. FIG. That is, when the reflective frame is bonded to the substrate with a resin adhesive composed of an epoxy resin or an acrylic resin, the reflective frame must be pressed against the substrate at a high pressure. There is an inconvenience that a large-scale high-pressure press is required in the bonding process. In addition, bubbles easily enter the resin adhesive, and when bubbles are present inside the resin adhesive, a region that is not bonded by the resin adhesive is formed in the bonding region between the reflective frame and the substrate. For this reason, when the reflective frame is bonded to the substrate with the resin adhesive, there is also a disadvantage that a defoaming (evacuation) process using a vacuum apparatus is required simultaneously with the high-pressure pressing step. On the other hand, when the reflective frame is bonded to the conductor layer using a conductive adhesive, the above-described disadvantages can be suppressed, so that the reflective frame bonding process can be simplified. . As a result, the manufacturing efficiency can be improved also by this.

  In the configuration in which the reflective frame is bonded with a conductive adhesive, preferably, a step is formed at the bottom of the reflective frame, and the conductive adhesive is disposed inside the reflective frame. The side wall part which suppresses flowing out into the area | region of this is provided. If comprised in this way, it will suppress that the inconvenience which the light from a light emitting element irradiates to a conductive adhesive due to the conductive adhesive flowing out into the area | region inside a reflective frame body arises. Can do. For this reason, since discoloration and deterioration of the conductive adhesive due to light irradiation can be suppressed, there arises a disadvantage that light emission characteristics and reliability are deteriorated due to discoloration and deterioration of the conductive adhesive. Can be suppressed. Thereby, even if the reflective frame is bonded to the conductor layer with a conductive adhesive, a light emitting device having good light emission characteristics can be obtained.

  In the configuration in which the reflection frame is bonded by a conductive adhesive, the conductive adhesive is preferably made of a silver paste. If comprised in this way, since the heat from a light emitting element can be more efficiently transmitted to a reflective frame, the heat from a light emitting element can be thermally radiated from a reflective frame more efficiently.

  In the light emitting device according to the first and second aspects, the reflective frame may be mounted on the upper surface of the substrate so as to be in direct contact with the conductor layer.

  In the light emitting device according to the first and second aspects, preferably, the metal material constituting the reflection frame is aluminum. If comprised in this way, since the heat | fever from the light emitting element heat-transferred via the conductor layer can be thermally radiated more efficiently from a reflective frame body, the heat dissipation characteristic of a light-emitting device can be improved easily. it can.

  In the light emitting device according to the first and second aspects, the light emitting element may be composed of a light emitting diode element.

  A method for manufacturing a light emitting device according to a third aspect of the present invention includes a step of forming a substrate assembly in which a plurality of substrates are connected, a step of forming a plurality of individually separated reflection frames, and a plurality of reflections. A step of disposing each of the frames on the upper surface of the substrate assembly; and a step of cutting the substrate assembly so as to include one reflection frame and one substrate.

  In the method of manufacturing the light emitting device according to the third aspect, as described above, each of the plurality of individually separated reflection frame bodies is disposed on the upper surface of the substrate assembly, and one reflection frame body and By cutting the substrate assembly so as to include one substrate, only the substrate can be used as the cutting region in the cutting step of separating the light emitting device into individual pieces, so that the cutting region can be reduced. Thereby, since the fall of the dicing speed (cutting speed) in a cutting process can be suppressed, the fall of manufacturing efficiency can be suppressed.

  Further, in the method for manufacturing a light emitting device according to the third aspect, as described above, each of the plurality of individually separated reflection frame bodies is disposed on the upper surface of the substrate assembly, whereby the light emitting device is separated. Since it is possible to eliminate the step of cutting the reflecting frame made of a metal material in the cutting step to be separated, it is possible to suppress the occurrence of cutting burrs at the edge of the cutting portion of the reflecting frame in the cutting step be able to. As a result, it is possible to prevent various inconveniences from occurring due to the cutting burr generated at the edge of the cut portion of the reflective frame.

  In the method for manufacturing a light emitting device according to the third aspect, preferably, the step of forming the reflection frame body includes a step of forming a reflection frame body assembly in which a plurality of reflection frame bodies are connected, and a reflection frame body assembly. Are separated into individual reflecting frames by pressing. If comprised in this way, since the several reflective frame body isolate | separated separately can be formed, without producing a cutting | disconnection burr | flash, the light-emitting device provided with the reflective frame body without a cutting | disconnection burr | flash is easily manufactured. be able to.

  As described above, according to the present invention, there is provided a light emitting device that has good light emission characteristics, can suppress a decrease in manufacturing efficiency, and can suppress the occurrence of inconvenience due to a cutting burr. Can be easily obtained.

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments embodying the present invention will be described in detail with reference to the drawings. In the embodiment of the present invention, a case where the present invention is applied to a surface-mounted LED that is an example of a light-emitting device will be described.
(First embodiment)
A light emitting device according to a first embodiment of the present invention will be described. FIG. 1 is an overall perspective view of a surface-mounted LED 100 according to the first embodiment of the present invention. FIG. 2 is a plan view of the surface-mounted LED 100 according to the first embodiment of the present invention shown in FIG. 1 as viewed from above, and FIG. 3 is a surface-mounted type according to the first embodiment of the present invention. It is the top view which looked at LED100 from the downward direction. 4-7 is a figure for demonstrating the structure of surface mount type LED100 concerning the 1st Embodiment of this invention. First, the structure of the surface-mounted LED 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 and 2, the surface-mounted LED 100 according to the first embodiment of the present invention includes a substrate 1 and a light emitting diode element (hereinafter referred to as an LED element) 20 mounted on the substrate 1. And a reflective frame 30 fixed on the substrate 1 and a translucent member 40 filled inside the reflective frame 30 so as to surround the LED element 20. The LED element 20 is an example of the “light emitting element” in the present invention.

  The substrate 1 is composed of a double-sided substrate in which a plurality of electrode layers are formed on an upper surface and a lower surface of an insulating base material 2 made of glass epoxy or liquid crystal polymer (LCP), respectively. . As shown in FIG. 2, the substrate 1 has a length of about 3.5 mm in the X direction and a length of about 3.5 mm in the Y direction orthogonal to the X direction as viewed in a plan view. It has a substantially square shape. In the first embodiment, the thickness of the substrate 1 is about 0.2 mm.

  As shown in FIG. 2, the plurality of electrode layers formed on the upper surface of the insulating base 2 are a plurality of (three) cathode electrode layers 3 having a positive polarity and a plurality (3) having a negative polarity. ) Anode electrode layer 4 and nonpolar electrode layer 6 having no polarity and electrically separated from cathode electrode layer 3 and anode electrode layer 4 by insulating groove 5. As shown in FIGS. 1 and 2, the cathode electrode layer 3 and the anode electrode layer 4 are respectively formed on the upper surface of the insulating base 2 so as to be located in the region inside the opening 31 a of the reflection frame 30. ing. The nonpolar electrode layer 6 is formed in a region on the upper surface of the insulating base 2 other than the region where the cathode electrode layer 3 and the anode electrode layer 4 are formed. The cathode electrode layer 3 and the anode electrode layer 4 are examples of the “electrode layer” in the present invention, and the nonpolar electrode layer 6 is an example of the “conductor layer” in the present invention.

  On the other hand, the electrode layer formed on the lower surface of the insulating base 2 is mainly composed of an electrode layer used for wiring and an electrode layer mainly used for heat dissipation. Specifically, as shown in FIG. 3, the electrode layer 7 and the electrode layer 8 are electrode layers used for wiring, and the electrode layer 9 is an electrode layer 9 used for heat dissipation. A plurality of electrode layers 7 and electrode layers 8 used for wiring are formed so as to correspond to the plurality of cathode electrode layers 3 and anode electrode layers 4, respectively. As shown in FIG. Are respectively electrically connected to the cathode electrode layer 3 and the anode electrode layer 4 through the through hole 2a. In addition, as shown in FIG. 3, the electrode layer 7 and the electrode layer 8 used for wiring are electrodes formed on one end side (X1 direction side) and the other end side (X2 direction side) of the substrate 1, respectively. The terminal 7a and the electrode terminal 8a are integrally connected.

  The electrode layer 9 used for heat dissipation is in direct contact with the nonpolar electrode layer 6 through the plurality of through holes 2 b of the insulating base 2. That is, the electrode layer 9 is thermally connected to the nonpolar electrode layer 6 through the plurality of through holes 2 b of the insulating base 2. The cathode electrode layer 3 and the anode electrode layer 4, the nonpolar electrode layer 6, the electrode layers 7 to 9, the electrode terminal 7a and the electrode terminal 8a are made of a conductive material having excellent thermal conductivity such as copper. .

  As shown in FIGS. 1 and 2, the three LED elements 20 are on the upper surface of the nonpolar electrode layer 6 and on the region located inside the opening 31 a of the reflection frame 30. It is fixed with an adhesive 21 (see FIG. 4) or the like. The LED elements 20 are arranged at a predetermined interval between the cathode electrode layer 3 and the anode electrode layer 4. The three LED elements 20 have a function of emitting red, green, and blue light, respectively.

  As shown in FIGS. 1, 2, and 4, the upper surface of the cathode electrode layer 3 and the electrode portion of the LED element 20 are electrically connected via bonding wires 22, respectively. The upper surface of 4 and the electrode portion of the LED element 20 are electrically connected via bonding wires 23, respectively. Thereby, by applying a voltage between the electrode terminal 7a of the electrode layer 7 and the electrode terminal 8a of the electrode layer 8, a current flows to the LED element 20 via the bonding wires 22 and 23, and each LED element 20 emits light at a specific wavelength. And when these LED elements 20 light-emit simultaneously, since the color is mixed and emitted, the emitted light from the surface mount type LED100 turns into white light. The bonding wires 22 and 23 are made of fine metal wires such as gold (Au), silver (Ag), and aluminum (Al). In this case, only the LED element 20 that emits blue light is mounted, and the phosphor is dispersed in the translucent member 40 so that the light emitted from the surface-mounted LED 100 becomes white light. May be.

  Here, in 1st Embodiment, the reflective frame 30 is comprised from the metal material which has aluminum which was excellent in the thermal radiation characteristic as a main component. As shown in FIG. 2, the reflection frame 30 is formed in a planar shape having a size substantially equal to that of the substrate 1 when viewed in plan. Specifically, as shown in FIG. 2, the reflection frame 30 has a maximum length of about 3.5 mm in the X direction when viewed in a plan view, and about 3.5 mm in the Y direction. It is formed to have a maximum length. In the first embodiment, the thickness of the reflection frame 30 is about 0.6 mm.

  Further, as shown in FIG. 4, an opening 31 a is formed in the central portion of the reflection frame 30 so as to penetrate from the upper surface to the lower surface and spread upward in a tapered shape. The inner side surface 31b of the opening 31a is configured to function as a reflecting surface that reflects the light emitted from the LED element 20. That is, as shown in FIG. 2, the opening 31 a is formed so that the inner side surface 31 b is circular when viewed in plan, in order to uniformly collect the light emitted from the LED element 20. . Thus, the inner side surface 31b of the opening 31a is configured to efficiently reflect light emitted from the LED element 20 upward. The inner side surface 31b is an example of the “reflecting surface” in the present invention.

  In the first embodiment, as shown in FIGS. 4 and 5, a stepped portion 33 is formed at the bottom of the reflection frame 30. The step portion 33 includes a step portion bottom surface portion 33a and a step portion side wall portion 33b, and is formed at a predetermined distance from the lower opening end 31c of the opening portion 31a as shown in FIG. Yes. That is, a substantially square-shaped reflection frame bottom surface portion 32 is formed in a region outside the lower opening end 31c of the opening 31a so as to surround the lower opening end 31c. A stepped portion 33 composed of a stepped portion side wall portion 33b and a stepped portion bottom surface portion 33a is formed in a region outside the surface.

  Further, as shown in FIGS. 4 and 5, a cutout portion 35 having an arcuate cross section is formed in a region formed by the step portion bottom surface portion 33 a of the step portion 33 and the outer surface 34 of the reflection frame 30. Has been. Further, as shown in FIGS. 6 and 7, notches 36 are formed on both end sides of the outer surface 34. Due to the notches 36, each of the four corners of the reflection frame 30 is in a state in which a part of the corner constituted by the two adjacent outer surfaces 34 is removed. The stepped portion 33, the cutout portion 35, and the cutout portion 36 can be formed integrally with the reflection frame 30 by pressing or the like. The notch 36 is an example of the “first notch” in the present invention, and the notch 35 is an example of the “second notch” in the present invention.

  In general, the light emitting device 100 is formed by forming a light emitting device assembly in which a plurality of light emitting devices 100 are connected as shown in FIG. 1, and then cutting the light emitting device assembly by a cutting process (dicing process) using a dicing saw ( It is obtained by dividing into pieces. When cutting the reflective frame with a dicing saw in this cutting step (dicing step), the reflective frame is cut from a metal material, compared to the case where the reflective frame is made from a resin material. There is a problem that the speed (dicing speed) is lowered and the production efficiency is lowered. Further, there is a problem that a cutting burr occurs along the edge of the cut portion of the reflection frame body, and various inconveniences occur due to the generated cutting burr.

  In the first embodiment of the present invention, since the cutout portion 35 is formed at the bottom of the reflective frame 30, the cutting area can be reduced in the cutting process using a dicing saw. Thereby, the fall of a cutting speed can be suppressed in a cutting process. In addition, since the insulation distance between the electrode terminals 7a and 8a formed on the lower surface of the substrate 1 and the reflecting frame can be secured widely, in the cutting step, the edge of the cut portion of the reflecting frame is placed in the direction of the substrate 1 Even if a cutting burr is generated so as to extend in the direction of contact, the contact between the electrode terminals 7a and 8a and the cutting burr can be suppressed. Thereby, it can suppress that an electrical short circuit arises.

  Furthermore, since the notches 36 are formed in the areas that are the four corners of the reflection frame 30, the cutting area can be further reduced. Thereby, the fall of a cutting speed can be suppressed in a cutting process. In addition, since the notches 36 are formed in the four corners of the reflective frame 30, even if a cut burr occurs at the edge of the cut part of the reflective frame in the reflective frame cutting process. The cutting burr can be prevented from projecting laterally beyond the outer surface (outer surface) of the reflecting frame. Thereby, it is possible to suppress the occurrence of inconvenience due to the cutting burr. For example, when the cutting burr is caught on the side wall of the embossed pocket of the embossed carrier tape, the adsorption position of the light emitting device is shifted by the suction collet, and mounting failure occurs when the light emitting device is mounted. Can be suppressed. Thereby, the work efficiency (manufacturing efficiency) at the time of mounting can be improved. In addition, when the light emitting device is mounted on a mounting board, etc., it is possible to prevent the cutting burr from coming into contact with other electronic components, etc., thereby electrically shorting or scratching other electronic components. can do.

  Furthermore, in the first embodiment, as shown in FIGS. 1, 2, and 4, the insulating member 11 (11 b) is filled in the notches 36 formed at the four corners of the reflection frame 30. Yes. In this way, by filling the notch 36 with the insulating member 11 (11b), it is possible to make it difficult for the cutting burr to occur in the cutting process. Thereby, it is possible to suppress the occurrence of inconvenience due to the cutting burr.

  As shown in FIGS. 4 and 5, the reflection frame 30 is bonded to the nonpolar electrode layer 6 with an adhesive 10. In the first embodiment, a conductive adhesive composed of a thermosetting silver paste (Ag content (after curing): 94%, thermal conductivity 85 W / m · K) is used as the adhesive 10. Yes. Specifically, after applying the adhesive 10 on a predetermined region of the nonpolar electrode layer 6, that is, a region corresponding to the stepped portion bottom surface portion 33 a of the stepped portion 33 by screen printing, the reflective frame 30 is mounted on the substrate. 1 on the nonpolar electrode layer 6. Then, the adhesive is cured by heat treatment at a predetermined temperature, and the reflective frame 30 is bonded to the nonpolar electrode layer 6. Thereby, the reflective frame 30 is fixed on the board | substrate 1 so that the LED element 20 may be surrounded by the inner surface 31b of the opening part 31a. In addition, when said conductive adhesive is used as the adhesive agent 10, the optimal conditions of hardening are 30 minutes at 200 degreeC from 60 minutes at 175 degreeC. Thus, when the conductive adhesive comprised from a silver paste is used as the adhesive 10, since the process at low temperature of 175 degreeC-200 degreeC is possible, the adhesion process of the reflective frame 30 is simplified. It becomes possible to do.

  In the first embodiment, as shown in FIGS. 4 and 5, since the step portion 33 is formed at the bottom of the reflective frame 30, the adhesive 10 flows out to the area inside the reflective frame 30. Can be suppressed. That is, since the adhesive 10 flows out to the inner region of the reflective frame 30, it can be prevented that the adhesive 10 is irradiated with the light from the LED element 20, so that the light is irradiated. It is possible to suppress deterioration and deterioration of the adhesive due to the occurrence of the above. Thereby, it can suppress that the light emission characteristic falls by the discoloration by deterioration or alteration of the adhesive agent 10, and reliability falls.

  In the first embodiment, as shown in FIGS. 4 and 5, the insulating member 11 (11 a) is filled in the notch 35 formed at the bottom of the reflection frame 30 so as to cover the adhesive 10. ing. Thereby, since it can suppress that the adhesive agent 10 contact | connects the air | atmosphere and the water | moisture content in air, degradation, a quality change, and discoloration of an adhesive agent can be suppressed. Further, by filling the notch 35 with the insulating member 11 (11a), it is difficult to generate a cutting burr extending in the substrate direction at the edge of the cut portion of the reflecting frame in the cutting process of the reflecting frame. Can do. In the first embodiment, the insulating member 11a and the insulating member 11b are made of the same material.

  Further, as shown in FIG. 4, a translucent member 40 is filled inside the reflection frame 30. The translucent member 40 is made of a resin material such as epoxy resin or silicon resin, and is provided in the opening 31 a of the reflection frame 30 so as to seal the LED element 20 and the bonding wires 22 and 23. It has been. Thus, the translucent member 40 seals the LED element 20 and the bonding wires 22 and 23, thereby suppressing the LED element 20 and the bonding wires 22 and 23 from coming into contact with air or moisture in the air. be able to.

  In the first embodiment, the heat generated by the light emission of the LED element 20 is radiated by the nonpolar electrode layer 6 formed on the upper surface of the insulating base 2 and insulated as shown in FIG. Heat is dissipated also in the electrode layer 9 for heat dissipation thermally connected to the nonpolar electrode layer 6 through the through hole 2b of the base material 2. Moreover, since the reflective frame 30 is made of a metal whose main component is aluminum, the heat transferred to the reflective frame 30 via the nonpolar electrode layer 6 is also efficiently radiated from the reflective frame 30. can do. Furthermore, when the electrode layer 9 is in thermal contact with a heat sink portion (not shown) of a substrate (not shown), the heat dissipation effect is further promoted. As described above, the surface-mounted LED 100 according to the first embodiment can effectively dissipate the heat generated in the LED element 20, so that the light emission efficiency (light emission characteristics) due to the temperature rise of the LED element 20 can be achieved. ) Is suppressed, high luminance proportional to the amount of current is obtained, and the effects of improving the functionality and life of the surface-mounted LED 100 are obtained.

  In the first embodiment, since the nonpolar electrode layer 6, the cathode electrode layer 3, and the anode electrode layer 4 are electrically separated from each other, the reflection frame 30 is formed without considering an electrical short circuit. It can be fixed on the substrate 1.

  8-16 is sectional drawing for demonstrating the manufacturing method of the surface mount type LED100 concerning the 1st Embodiment of this invention. Next, a method for manufacturing the surface-mounted LED 100 according to the first embodiment of the present invention will be described with reference to FIGS.

  First, as shown in FIG. 8, an etching or drilling method or press working is performed on a reflector frame plate 300 having a thickness of 0.5 mm to 3.0 mm, preferably 0.5 mm to 2.0 mm made of aluminum. By the method or the like, an opening 31a that penetrates from the upper surface to the lower surface and becomes tapered upward is formed. At this time, as shown in FIG. 16, a plurality of openings 31a are formed in a matrix in the X direction and the Y direction of the reflection frame body plate 300.

  Next, as shown in FIG. 9, at the bottom of the reflector frame plate 300, a stepped portion 33 composed of a stepped portion side wall portion 33b and a stepped portion bottom surface portion 33a, and a cutout portion 35 having an arcuate cross section are formed. Form. At this time, it is preferable that the depth of the notch 35 is a depth that does not penetrate the reflection frame plate 300. Next, as shown in FIG. 16, the X-direction cutting lines α1, α2, α3,... And the Y-direction cutting lines β1, β2, β3,. A plurality of cutout portions having a width equal to or greater than a cutting width in a dicing process, which will be described later, and having a predetermined depth from the upper surface of the reflection frame body plate 300 in the four corner portions of the reflection frame body 36 is formed. As a result, as shown in FIG. 9, a notch 36 is formed in the corner area of each reflection frame, and the reflection frame plate 300 is removed from the upper surface by the notch 35 and the notch 36. A through hole penetrating to the lower surface is formed. In addition, the step part 33, the notch part 35, and the notch part 36 can be formed by methods, such as press work.

  Subsequently, as shown in FIG. 10, after forming a substrate assembly 400 in which a plurality of substrates 1 (see FIG. 1) are connected, a reflection frame plate 300 (on the upper surface of the substrate assembly 400). The adhesive 10 is applied to the positions corresponding to the stepped portion bottom surface portions 33a (see FIG. 9) formed in FIG. 9 by screen printing. And as shown in FIG. 11, after mounting the board 300 for reflective frame bodies on the upper surface of the board | substrate aggregate | assembly 400, it heat-processes by predetermined temperature (about 175 degreeC-about 200 degreeC), and adhesive agent (Refer FIG. 10) is hardened | cured and the board 300 for reflection frame bodies and the board | substrate aggregate 400 are fixed. Thereafter, as shown in FIG. 12, each of the notch 35 and the notch 36 is filled with an insulating member 11 such as a resist material.

  Next, as shown in FIG. 13, the LED element 20 is fixed by the adhesive 21 on the upper surface of the substrate assembly 400 inside the opening 31 a, and the LED element 20 is bonded using bonding wires 22 and 23. Wiring is performed so that the electrode portion of the electrode and the cathode electrode layer 3 and the anode electrode layer 4 (see FIG. 1) formed on the substrate inside the opening 31a are electrically connected. Subsequently, as shown in FIG. 14, a transparent member 40 such as silicon resin or epoxy resin is filled in the opening 31a so as to seal the LED element 20 and the bonding wires 22 and 23, and then cured. .

  Finally, as shown in FIGS. 15 and 16, using a dicing saw 50, cutting lines α1, α2, α3,... In the X direction and cutting lines β1, β2, β3,. Then, the reflector frame plate 300 and the substrate assembly 400 are cut to form individual surface-mounted LEDs. In this way, the surface-mounted LED 100 according to the first embodiment of the present invention shown in FIG. 1 is manufactured.

  As described above, in the first embodiment, the cut region can be reduced by forming the cutout portion 35 and the cutout portion 36 in the reflection frame 30, thereby suppressing a reduction in cutting speed in the cutting step. be able to. Moreover, since the notch 35 and the notch 36 are filled with the insulating member 11, the occurrence of cutting burrs in the cutting process can be suppressed. Thereby, while being able to suppress the fall of manufacturing efficiency, it can suppress that the problem resulting from a cutting | disconnection burr | flash arises.

In the first embodiment, the step portion side wall 33b formed at the bottom of the reflection frame 30 is configured so that the adhesive does not flow out to the inner region of the reflection frame 30. The light emitted from the LED element 20 can be prevented from being applied to the adhesive. As a result, the light emitted from the LED element 20 is restrained from being discolored due to deterioration or alteration, so that the adhesive that has flowed into the region inside the reflective frame 30 is discolored. It is possible to suppress the disadvantage that the light from the LED element 20 is absorbed by the adhesive 10.
(Second Embodiment)
FIG. 17 is a plan view of the surface-mounted LED 110 according to the second embodiment of the present invention as viewed from above. 18 is a cross-sectional view taken along line 500-500 in FIG. 17, and FIG. 19 is a cross-sectional view taken along line 550-550 in FIG. FIG. 20 is a perspective view of the reflective frame body of the surface-mounted LED 110 according to the second embodiment of the present invention as seen from below. Next, the structure of the surface-mounted LED 110 according to the second embodiment of the present invention will be described with reference to FIGS. The plan view of the surface-mounted LED 110 according to the second embodiment of the present invention viewed from below is the same as the surface-mounted LED 100 according to the first embodiment of the present invention, and is the plane shown in FIG. It is the same as the figure. In the second embodiment of the present invention, the same reference numerals are given to the same components as those of the first embodiment of the present invention, and the description thereof is omitted.

  In the second embodiment, as shown in FIG. 17, the reflection frame body 70 includes a frame body portion 71 having a substantially circular shape in a plan view and a frame body from a part of the outer surface of the frame body portion 71. It is comprised from the cutting process part 76 extended to the outer side of the part 71. FIG. The frame part 71 is formed such that the outer diameter of the frame part 71 is shorter than the lengths of the substrate 1 in the X direction and the Y direction. Further, as shown in FIGS. 18 and 19, an opening 71a is formed in the central portion of the frame body portion 71 so as to penetrate from the upper surface to the lower surface and spread upward in a tapered shape. The inner surface 71b of the opening 71a is configured to function as a reflecting surface that reflects the light emitted from the LED element 20, and the opening 71a emits light from the LED element 20, as shown in FIG. In order to uniformly collect the emitted light, the inner side surface 71b is formed in a circular shape when seen in a plan view. As described above, the inner side surface 71b of the opening 71a is configured to efficiently reflect the light emitted from the LED element 20 upward. The inner side surface 71a is an example of the “reflecting surface” in the present invention.

  As shown in FIGS. 18 to 20, the reflection frame body 70 is formed with a stepped portion 73 formed of a stepped portion bottom surface portion 73 a and a stepped portion side wall portion 73 b at a part of the bottom of the frame body portion 71. Yes. As shown in FIG. 20, the stepped portion 73 is formed at a predetermined distance from the lower opening end 71c of the opening 71a. That is, a substantially circular reflection frame bottom surface portion 72 is formed in a region outside the lower opening end 71c of the opening so as to surround the lower opening end 71c. A stepped portion 73 composed of a stepped portion side wall 73b and a stepped portion bottom surface portion 73a is formed in the outer region. Further, as shown in FIGS. 17 and 18, a cut processing portion 76 extending to the outside of the frame body portion 71 is formed on a part of the outer surface 74 of the reflection frame body 70. As shown in FIG. 20, the cutting processing portion 76 is provided at a position facing the lower opening end 71c. As shown in FIG. It is formed to be smaller than the thickness of the body part 71. In the second embodiment, since the cutting portion 76 can be used as a cutting region in the step of cutting the reflecting frame, the cutting region can be greatly reduced. Thereby, the fall of a cutting speed can be suppressed in a cutting process. Further, since the thickness of the cutting portion 76 is formed to be smaller than the thickness of the frame body portion 71, it is assumed that a cutting burr has occurred at the edge of the cutting portion 76 in the cutting process of the reflective frame body. In addition, the cutting burr can be prevented from projecting laterally beyond the outer surface of the reflection frame 70. Thereby, it is possible to suppress the occurrence of inconvenience due to the cutting burr.

  Further, as shown in FIG. 19, a cutout portion 75 having an arcuate cross section is formed in a part of a region formed by the step portion bottom surface portion 73 a and the outer surface 74 of the reflection frame body 70. As shown in FIG. 20, the notch 75 is formed in a region other than the region where the cutting portion 76 is formed. In addition, the frame part 71, the level | step-difference part 73, the notch part 75, and the cutting process part 76 are integrally formed with the reflective frame 70 by the press work method.

  In the second embodiment, as shown in FIGS. 17 to 19, the reflection frame body 70 is applied to the cutting portion 76, the step bottom surface portion 73 a of the step portion 73, and a part of the notch portion 75. It is bonded to the nonpolar electrode layer 6 on the substrate 1 through an adhesive 60. Since the step part 73 is formed in the bottom part of the reflective frame 70, it can suppress that the adhesive agent 60 flows out to the area | region inside the reflective frame 70 by the step part side wall part 73b. That is, when the adhesive 60 flows out to the inner region of the reflective frame 70, the adhesive 60 is irradiated with light from the LED element 20, and the light is irradiated, whereby the adhesive 60 is deteriorated, It is possible to suppress the alteration. Thereby, it can suppress that the light emission characteristic falls by the discoloration by deterioration and quality change of the adhesive agent 60, and reliability falls. In the second embodiment, a conductive adhesive composed of a thermosetting silver paste can be used as the adhesive 60 as in the first embodiment of the present invention. Moreover, you may use resin adhesives other than the conductive adhesive comprised from materials other than silver paste, and a conductive adhesive.

  In addition, the other structure of 2nd Embodiment mentioned above is the same as that of the said 1st Embodiment.

  21 to 23 are cross-sectional views for explaining a method for manufacturing the light emitting device 110 according to the second embodiment. Next, a method for manufacturing the light emitting device 110 according to the second embodiment will be described with reference to FIGS. Note that, in the method for manufacturing a light emitting device according to the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the drawings and description of the same manufacturing steps are omitted.

  First, the reflective frame body plate 700 made of aluminum having a thickness of 0.5 mm to 3.0 mm, preferably 0.5 mm to 2.0 mm, is etched from the upper surface to the lower surface by etching, drilling, pressing, or the like. An opening 71a that is tapered upward is formed. A plurality of openings 71a are formed in a matrix on the reflector frame plate 700, as in the manufacturing method of the first embodiment.

  Next, as shown in FIG. 21, after forming the frame body portion 71 including the opening 71a and the cutting portion 76 so as to extend outward from the outer surface of the frame body portion 71 by a press working method or the like. A stepped portion 73 composed of a stepped portion side wall portion 73b and a stepped portion bottom surface portion 73a is formed on the bottom of the reflection frame body plate 700 by a press working method or the like. At the same time, a cross-sectional shape is formed in a region where the bottom cut portion 76 of the bottom portion of the reflection frame body plate 700 is not formed and formed by the stepped portion bottom surface portion 73a and the outer surface 74 of the reflection frame body 70. An arcuate cutout 75 (see FIGS. 19 and 20) is formed.

  Next, the substrate assembly 400 is formed by the same method as in the first embodiment shown in FIG. 10, and then cut on the upper surface of the substrate assembly 400 and formed on the reflection frame body plate 700. The adhesive 60 is applied to the positions corresponding to each of the processed portions 76 and the stepped portion bottom surface portion 73a by a screen printing method. Then, as shown in FIG. 22, the reflective frame body plate 700 is placed on the substrate assembly 400 with the lower surface of the cutting portion 76 as the adhesive surface, and then a predetermined temperature (about 175 ° C. to about 200 ° C.). By heat-treating, the adhesive is cured and the reflection frame body plate 700 and the substrate assembly 400 are fixed.

  Next, the LED element 20 is fixed by the adhesive 21 on the upper surface of the substrate assembly 400 inside the opening 71a, and the electrode part of the LED element 20 and the opening are bonded using the bonding wires 22 and 23. Wiring is performed so that the cathode electrode layer 3 and the anode electrode layer 4 formed on the substrate inside the portion 71a are electrically connected. Subsequently, each of the openings 71a is filled with a translucent member 40 such as silicon resin or epoxy resin so as to seal the LED element 20 and the bonding wires 22 and 23, and then cured.

  Next, as shown in FIG. 22, using the dicing saw 50, the reflective frame body plate 700 and the substrate assembly 400 are cut so that the cutting portion 76 becomes a part of the cutting region, and individual light emission is performed. Separate into equipment. In this way, the surface-mounted LED 110 according to the second embodiment of the present invention shown in FIG. 17 is manufactured.

  As described above, in the second embodiment, in the cutting step, the cutting area of the reflective frame can be limited to the cutting portion 76, and the thickness of the cutting portion 76 is greater than the thickness of the frame portion 71. Therefore, the cutting area can be greatly reduced. Thereby, in a cutting process, since it can suppress that a cutting speed falls, it can suppress that manufacturing efficiency falls. Further, since the thickness of the cutting portion 76 is formed to be smaller than the thickness of the frame body portion 71, generation of cutting burrs in the cutting process can be suppressed, and there is a problem due to the cutting burrs. It is possible to suppress the occurrence.

(Third embodiment)
FIG. 24 is a plan view of a surface-mounted LED 120 according to the third embodiment of the present invention as viewed from above. 25 is a cross-sectional view taken along line 600-600 in FIG. 24, and FIG. 26 is a cross-sectional view taken along line 650-650 in FIG. Next, the structure of the light emitting device 120 according to the third embodiment of the present invention will be described with reference to FIGS. The plan view of the surface-mounted LED 120 according to the third embodiment of the present invention viewed from below is the same as the surface-mounted LED 100 according to the first embodiment of the present invention, and is the plane shown in FIG. It is the same as the figure. In the third embodiment of the present invention, the same components as those in the first and second embodiments of the present invention are denoted by the same reference numerals and the description thereof is omitted.

  In the third embodiment of the present invention, as shown in FIGS. 25 and 26, the substrate 1 and the reflective frame 70 of the surface-mounted LED 120 are the substrates of the surface-mounted LED 110 according to the second embodiment of the present invention. 1 and the reflective frame 70 have the same configuration. In the third embodiment, as shown in FIGS. 24 to 26, the insulating member 61 such as a resist material is filled in the region outside the frame body portion 71 on the upper surface of the substrate 1 and the cut processing portion 76. Has been. That is, as shown in FIG. 24 and FIG. 25, a region constituted by the cutting portion 76 and the outer surface 74 of the frame body portion 71, a region constituted by the substrate 1 and the cutout portion 75, and the substrate 1 A region constituted by the outer surface 74 is filled with an insulating member 61. Thereby, while being able to suppress that the board | substrate 1 contacts the water | moisture content in air or air, the external shape of the surface mount type LED120 can be prepared. Moreover, since it can suppress that the adhesive agent 60 contact | connects the water | moisture content in air or air, degradation and quality change of an adhesive agent can be suppressed.

  The remaining configuration of the third embodiment described above is the same as that of the first and second embodiments.

  FIG. 27 is a cross-sectional view for explaining the method for manufacturing the light emitting device according to the third embodiment. Next, with reference to FIGS. 24-27, the manufacturing method of the surface mount type LED element 120 concerning the 3rd Embodiment of this invention is demonstrated. In the third embodiment, the same components as those in the first and second embodiments are denoted by the same reference numerals, and the same manufacturing steps as those in the first and second embodiments are used. The figure and description are omitted.

  In the method for manufacturing the surface-mounted LED 120 according to the third embodiment of the present invention, the steps up to the step shown in FIG. 22 are the same as the method for manufacturing the surface-mounted LED 110 according to the second embodiment. In the third embodiment, the reflector frame plate 700 is bonded and fixed onto the upper surface of the substrate assembly 400 by the adhesive 60 with the cut portion 76 and the stepped portion bottom surface portion 73a of the stepped portion 73 as the bonding surfaces. After that, as shown in FIG. 27, an insulating member 61 such as a resist material is filled in a region between the adjacent reflection frames 70. That is, the region formed by the substrate 1 and the outer surface 74 and the region formed by the substrate 1 and the outer surface 74 at the same time as the insulating member 61 is filled in the region formed by the cut portion 76 and the outer surface 74. Insulating member 61 is filled.

  Next, the LED element 20 is fixed by the adhesive 21 on the upper surface of the substrate assembly 400 inside the opening 71, and the electrode portion of the LED element 20 and the opening are bonded using the bonding wires 22 and 23. Wiring is performed so that the cathode electrode layer 3 and the anode electrode layer 4 formed on the substrate inside the portion 71a are electrically connected. Then, each of the openings 71 is filled with a translucent member 40 such as silicon resin or epoxy resin so as to seal the LED element 20 and the bonding wires 22 and 23, and then cured.

  Subsequently, by using the dicing saw 50, the reflection frame body plate 700 and the substrate assembly 400 are cut using the area where the cutting portion 76 is formed as a cutting area, and separated into individual light emitting devices. In this way, the surface-mounted LED 120 according to the third embodiment shown in FIG. 24 is manufactured.

  In the third embodiment, since the insulating member 61 is filled above the cutting portion 76 that is a cutting region, it is possible to make it difficult to generate cutting burrs in the cutting process. Thereby, it can suppress that the problem resulting from a cutting | disconnection burr | flash arises. Moreover, since the insulating member 61 is formed on the upper surface of the substrate 1, the substrate 1 can be prevented from coming into contact with air or moisture in the air, and the outer shape of the surface-mounted LED 120 can be adjusted. .

(Fourth embodiment)
FIG. 28 is a plan view of a surface-mounted LED 130 according to the fourth embodiment of the present invention as viewed from above. 29 is a cross-sectional view taken along the line 800-800 in FIG. Next, with reference to FIG. 28 and FIG. 29, the light-emitting device 120 concerning the 4th Embodiment of this invention is demonstrated. In addition, the top view which looked at the surface mount type LED130 concerning the 4th Embodiment of this invention from the bottom is the same as that of the surface mount type LED100 concerning the 1st Embodiment of this invention, The plane shown in FIG. It is the same as the figure. In the fourth embodiment of the present invention, the same components as those in the first to third embodiments of the present invention are denoted by the same reference numerals and the description thereof is omitted.

  In the surface-mounted LED 130 according to the fourth embodiment of the present invention, the reflection frame 90 is configured by a frame body portion 91 having a substantially square shape when viewed in plan, as shown in FIG. The frame body portion 91 is placed (fixed) on an inner region on the upper surface of the substrate 1. Specifically, the frame body portion 91 is formed such that the lengths in the X direction and the Y direction are shorter than the lengths in the X direction and the Y direction of the substrate 1. Is mounted (fixed) on a region (on the upper surface of the substrate 1) at a predetermined distance from the substrate. In addition, an opening 91a is formed in the central portion of the frame body portion 91 so as to penetrate from the upper surface to the lower surface and spread upward in a tapered shape. The inner side surface 91b of the opening 91a is configured to function as a reflecting surface that reflects the light emitted from the LED element 20, and as shown in FIG. 28, the inner side surface 91b is viewed in a plan view. It is formed to be circular. The inner side surface 91b is an example of the “reflection surface” in the present invention.

  As shown in FIG. 29, a stepped portion 93 composed of a stepped portion bottom surface portion 93a and a stepped portion side wall portion 93b is formed at the bottom of the frame body portion 91. Further, a cutout portion 95 having an arcuate cross section is formed in a region formed by the stepped portion bottom surface portion 93a and the outer surface 94 of the frame body portion 91. The stepped portion 73 and the cutout portion 95 are integrally formed with the reflection frame 90 by pressing or the like. The notch 95 is an example of the “second notch” in the present invention.

  In the fourth embodiment, as shown in FIG. 29, the reflection frame 90 is bonded to the substrate 1 by an adhesive 80 applied to a region corresponding to the stepped portion bottom surface portion 93a. At this time, since the stepped portion 93 is formed, it is possible to suppress the adhesive 80 from flowing out to a region inside the reflective frame 90. As a result, it is possible to suppress the disadvantage that the adhesive 80 is irradiated with light from the LED element 20 due to the adhesive 80 flowing out into the region inside the reflective frame 90. Deterioration and alteration of the adhesive 80 due to light irradiation can be suppressed. Therefore, it is possible to prevent the light emission characteristics from being lowered and the reliability from being lowered due to the deterioration of the adhesive 80 or the color change caused by the alteration. In the fourth embodiment, the adhesive 80 can be a conductive adhesive composed of a thermosetting silver paste, as in the first to third embodiments. Moreover, you may use resin adhesives other than the conductive adhesive comprised from materials other than a silver pace, and a conductive adhesive. In the fourth embodiment, as shown in FIG. 29, the notch 95 is not filled with an insulating member, but as in the first to third embodiments, the insulating member is filled. Also good.

  In the fourth embodiment, as shown in FIG. 29, an epoxy resin, a silicon resin, or the like is provided so as to cover the LED element 20 and the bonding wires 22 and 23 in the region inside the opening 91a of the frame body 91. A translucent member 45 made of this resin material is formed. Thus, by forming the translucent member 45 so as to cover only the region where the LED element 20 and the bonding wires 22 and 23 are formed, the entire region inside the opening of the reflective frame is transparent. The directivity can be controlled more than in the case of filling the sex member.

  In addition, the other structure of the 4th Embodiment mentioned above is the same as that of the said 1st-3rd embodiment.

  30 to 32 are cross-sectional views for explaining a method for manufacturing the surface-mounted LED 130 according to the fourth embodiment of the present invention. Next, with reference to FIGS. 30 to 32, a method for manufacturing the surface-mounted LED 130 according to the fourth embodiment of the present invention will be described. In addition, in 4th Embodiment, while attaching the same code | symbol about the component similar to 1st-3rd embodiment, about the manufacturing process similar to the manufacturing process concerning 1st-3rd embodiment, The figure and description are omitted.

  First, as shown in FIG. 30, a plurality of reflective frame bodies 90 made of aluminum and individually separated are formed. As a manufacturing method of the reflecting frame 90, as in the manufacturing methods according to the first to third embodiments, a reflecting frame body plate made of aluminum is etched, drilled, pressed, or the like. An opening 91a that penetrates from the upper surface to the lower surface and tapers upward is formed, and a stepped portion side wall portion 93b and a stepped portion bottom surface portion 93a are formed on the bottom of the reflector frame plate by a press working method or the like. A plurality of individually separated reflection frame bodies by cutting a reflection frame body plate using a dicing saw after forming a stepped portion 93 composed of the above and a cutout portion 95 having an arc-shaped cross section. Can be formed. Moreover, it may replace with the method of cut | disconnecting the board for reflection frame bodies using a dicing saw, and may form the several reflection frame body isolate | separated separately by the press work method.

  Next, after forming the substrate assembly 400 in which a plurality of substrates are connected, the adhesive 21 is applied to a region on the upper surface of the substrate assembly 400 and inside the opening 91a of the reflection frame 90. The LED element 20 is fixed, and the electrode part of the LED element 20 is electrically connected to the cathode electrode layer and the anode electrode layer formed on the substrate inside the opening 91a by using the bonding wires 22 and 23. , Do the wiring. Then, as shown in FIG. 31, a translucent member 45 such as silicon resin or epoxy resin is filled and cured so as to cover the LED element 20 and the bonding wires 22 and 23.

  Next, the adhesive 80 is applied on the upper surface of the substrate assembly 400 at a position corresponding to the stepped portion 93 of the reflection frame 90 by a screen printing method. Then, as shown in FIG. 32, after each reflection frame 90 is placed on the substrate assembly 400, the adhesive is cured by heat treatment at a predetermined temperature (about 175 ° C. to about 200 ° C.). The reflection frame 90 and the substrate assembly 400 are fixed. In addition, the reflective frame 90 is arrange | positioned so that the distance between the adjacent reflective frames 90 may become wider than the cutting width in a cutting process.

  Next, using the dicing saw 50, the substrate assembly 400 is cut using the region between the adjacent reflection frame bodies 90 as a cutting region, and separated into individual light emitting devices. In this way, the surface-mounted LED 130 according to the fourth embodiment shown in FIG. 28 is manufactured.

  In the fourth embodiment, since only the substrate assembly 400 needs to be cut in the cutting step, the cutting area can be reduced. Thereby, the fall of a cutting speed can be suppressed in a cutting process. In addition, since it is not necessary to cut the reflective frame made of a metal material in the cutting step, it is possible to suppress the occurrence of cutting burrs caused by cutting the reflective frame made of the metal material. The occurrence of inconvenience due to burrs can be suppressed.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and all modifications within the meaning and scope equivalent to the scope of claims for patent are included.

  For example, in the first to fourth embodiments, the example in which the present invention is applied to the surface-mounted LED is shown. However, the present invention is not limited to this, and the present invention is applied to light emitting devices other than the surface-mounted LED. May be.

  Moreover, in the said 1st-4th embodiment, although the structure which provided the LED element which is an example of a light emitting element in the light-emitting device was shown as an example, this invention is not restricted to this, Light-emitting elements other than an LED element are shown. You may provide in a light-emitting device.

  Moreover, in the said 1st-4th embodiment, although the reflective frame body using the metal material comprised from aluminum was shown as an example as a thermal radiation material, this invention is not limited to this, Copper (Cu), A material composed of copper alloy, aluminum nitride (AlN), ceramic, or the like may be used.

  Moreover, in the said 1st-4th embodiment, although the structure which uses the conductive adhesive comprised from a silver paste as an adhesive was shown as an example, this invention is not limited to this, An epoxy resin adhesive Alternatively, an acrylic resin adhesive or the like may be used. Furthermore, you may use the electroconductive adhesive comprised from electroconductive materials other than a silver paste.

  Moreover, although the said 1st-4th embodiment showed as an example the structure which forms a level | step-difference part, a notch part, and a cutting process part, after forming several reflective frame bodies in the board for reflective frame bodies, this book The invention is not limited to this, and the stepped portion, the cutout portion, and the cut processing portion may be formed simultaneously with the formation of the reflection frame. Moreover, when forming a cutting process part, after forming a reflective frame, a cutting process part may be formed, and a level | step-difference part and a notch part may be formed after that.

  Moreover, in the said 1st-4th embodiment, although the structure which provides a notch part in a reflective frame was shown as an example, this invention is not restricted to this, It is good also as a structure which does not provide a notch part in a reflective frame. . Moreover, the notch part may be filled with an insulating member or may not be filled.

  Moreover, in the said 1st-3rd embodiment, although the structure using the board for reflective frame bodies with which the several reflective frame body was connected was shown as an example, this invention is not restricted to this, It isolate | separated separately. A plurality of reflection frames may be used.

  Moreover, in the said 1st-4th embodiment, although the structure which mounted three LED elements of red, green, and blue was shown as an example, this invention is not limited to this, LED element is 1 One, two, or four or more may be mounted.

  Moreover, in the said 1st-4th embodiment, the silver plating process, the alumite process, etc. may be given to the surface of the inner surface of the opening part of the reflective frame used as a reflective surface. Thereby, since the inner surface of the opening part of a reflective frame body can be made into a uniform surface, the adhesiveness of a reflective frame body and a translucent member is improved, and the reflective efficiency of the light emitted from the LED element is improved. And reliability can be improved.

  Moreover, in the said 1st-4th embodiment, although the structure which mounted the LED element on the electrode layer (nonpolar electrode layer) which does not have electrical polarity was shown as an example, this invention is not limited to this. Alternatively, the LED element may be mounted on an electrode layer that is grounded.

  Moreover, in the said 1st-4th embodiment, although the structure in which only one step of the reflective frame was formed was shown, the present invention is not limited to this, and the second bonded to the upper surface of the reflective frame. It is good also as a structure which provides this reflective frame. In this case, the inside of the second reflection frame body may or may not be filled with a translucent member.

These are the whole perspective views of the surface mount type LED concerning the 1st Embodiment of this invention. These are the top views which looked at the surface mount type LED concerning the 1st Embodiment of this invention from the upper direction. These are the top views which looked at the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. 1 from the downward direction. FIG. 3 is a cross-sectional perspective view taken along line 200-200 in FIG. 2. These are sectional drawings which expanded and showed a part of cross section along the 200-200 line | wire of FIG. These are the perspective views which looked at the reflective frame of surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. 1 from upper direction. These are the perspective views which looked at the reflective frame of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. 1 from the downward direction. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 1st Embodiment of this invention shown in FIG. These are the top views which looked at the surface mount type LED concerning the 2nd Embodiment of this invention from the upper direction. FIG. 18 is a cross-sectional view taken along line 500-500 in FIG. FIG. 18 is a cross-sectional view taken along line 550-550 in FIG. These are the perspective views which looked at the reflective frame of surface mount type LED concerning the 2nd Embodiment of this invention shown in FIG. 17 from the downward direction. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 2nd Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 2nd Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 2nd Embodiment of this invention shown in FIG. These are the top views which looked at the surface mount type LED concerning the 3rd Embodiment of this invention from the upper direction. FIG. 25 is a cross-sectional view taken along the line 600-600 in FIG. FIG. 25 is a cross-sectional view taken along line 650-650 in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 3rd Embodiment of this invention shown in FIG. These are the top views which looked at the surface mount type LED concerning the 4th Embodiment of this invention from the upper direction. FIG. 29 is a cross-sectional view taken along the line 800-800 in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 4th Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 4th Embodiment of this invention shown in FIG. These are sectional drawings for demonstrating the manufacturing method of the surface mount type LED concerning the 4th Embodiment of this invention shown in FIG. These are sectional drawings which showed an example of the conventional light-emitting device provided with the reflective frame body comprised from the metal material.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Insulation base material 3 Cathode electrode layer (electrode layer)
4 Anode electrode layer (electrode layer)
5 Insulation groove 6 Nonpolar electrode layer (conductor layer)
10, 60, 80 Adhesive 11, 61 Insulating member 20 LED element (light emitting element)
22, 23 Bonding wire 30, 70, 90 Reflective frame 71, 91 Frame 31a, 71a, 91a Opening 31b, 71b, 92b Inner side surface (reflective surface)
31c, 71c Lower open end 32, 72, 92 Reflective frame bottom surface 33, 73, 93 Stepped portion 33a, 73a, 93a Stepped portion bottom surface 33b, 73b, 93b Stepped portion side wall 35, 75, 95 Notch ( (Second notch)
36 Notch (first notch)
40, 45 Translucent member 76 Cutting part 100, 110, 120, 130 Surface mount type LED
300, 700 Reflective frame plate 400 Substrate assembly

Claims (17)

A substrate having a conductor layer formed on the upper surface;
A light emitting element mounted on a predetermined region of the conductor layer;
A plurality of electrode layers formed on an upper surface of the substrate for supplying power to the light emitting element;
A reflection frame body made of a metal material, the inner peripheral surface of which is a reflection surface that reflects light from the light emitting element,
In the reflection frame body, at least a part of a corner portion constituted by two outer surfaces is removed by providing a first cutout at least on one end side of the outer surface, and the substrate Is mounted in a state of being thermally connected to the conductor layer on the upper surface of
The plurality of electrode layers include a cathode electrode and an anode electrode,
The light emitting device, wherein the conductor layer is electrically insulated and separated from at least one of the cathode electrode and the anode electrode.
The reflection frame has a substantially quadrangular shape when seen in a plan view, and the first cutouts are arranged on one end side and the other of the four outer surfaces of the reflection frame, respectively. It is provided on the end side,
2. The light-emitting device according to claim 1, wherein each of four corners formed by two side surfaces of the reflection frame is removed by the first cutout.   The light emitting device according to claim 1, wherein the first notch is covered with a resin member. A substrate having a conductor layer formed on the upper surface;
A light emitting element mounted on a predetermined region of the conductor layer;
A plurality of electrode layers formed on an upper surface of the substrate for supplying power to the light emitting element;
A reflection frame including a frame body portion made of a metal material and having an inner peripheral surface as a reflection surface that reflects light from the light emitting element;
The reflective frame body is thermally connected to the conductor layer on the upper surface of the substrate so that at least the frame body portion is placed on a region inside the upper surface of the substrate when viewed in plan. It is installed in the state
The plurality of electrode layers include a cathode electrode and an anode electrode,
The light emitting device, wherein the conductor layer is electrically insulated and separated from at least one of the cathode electrode and the anode electrode. The substrate has a substantially quadrangular shape in plan view,
The reflection frame body includes the frame body portion having a substantially circular shape in a plan view, and a cutting portion formed to extend outward from a part of the outer surface of the frame body portion. The light emitting device according to claim 4, wherein the light emitting device is characterized.   6. The light emitting device according to claim 4, wherein a thickness of the cut portion is smaller than a thickness of the reflective frame.   The light emitting device according to claim 4, wherein at least an outer surface of the frame body portion is covered with a resin member.   8. The reflection frame body according to claim 1, further comprising a second cutout portion at least at a part of a corner portion formed by a bottom surface and an outer surface of the reflection frame body. The light-emitting device of any one of Claims.   The light emitting device according to claim 8, wherein the second notch is covered with the resin member.   The light emitting device according to claim 1, wherein the reflective frame is bonded to the conductor layer with a conductive adhesive. A step portion is formed at the bottom of the reflection frame,
11. The light emitting device according to claim 10, wherein the stepped portion has a side wall portion that suppresses the conductive adhesive from flowing out to a region inside the reflective frame.   The light emitting device according to claim 10 or 11, wherein the conductive adhesive is made of a silver paste.   The light emitting device according to claim 1, wherein the reflective frame is mounted on the upper surface of the substrate so as to be in direct contact with the conductor layer.   The light emitting device according to claim 1, wherein the metal material constituting the reflective frame is aluminum.   The light emitting device according to claim 1, wherein the light emitting element is a light emitting diode element. Forming a substrate assembly in which a plurality of substrates are connected;
Forming a plurality of individually separated reflection frames; and
Disposing each of the plurality of reflection frames on the upper surface of the substrate assembly;
And a step of cutting the substrate assembly so as to include one of the reflection frames and one of the substrates. The step of forming the reflection frame body includes a step of forming a reflection frame body assembly in which a plurality of the reflection frame bodies are connected,
The manufacturing method of the light-emitting device according to claim 16, further comprising a step of separating the reflective frame aggregate into individual reflective frame bodies by pressing.

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