TW201140897A - Led module device and method for manufacturing same - Google Patents

Led module device and method for manufacturing same Download PDF

Info

Publication number
TW201140897A
TW201140897A TW100100645A TW100100645A TW201140897A TW 201140897 A TW201140897 A TW 201140897A TW 100100645 A TW100100645 A TW 100100645A TW 100100645 A TW100100645 A TW 100100645A TW 201140897 A TW201140897 A TW 201140897A
Authority
TW
Taiwan
Prior art keywords
led
lead frame
body portion
main body
module device
Prior art date
Application number
TW100100645A
Other languages
Chinese (zh)
Inventor
Masamichi Ishihara
Tsutomu Toyoshima
Yasuyuki Takehara
Kazuki Narasaki
Tatsuo Tonedachi
Teruo Takeuchi
Original Assignee
Kyushu Inst Technology
Toshiba Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyushu Inst Technology, Toshiba Kk filed Critical Kyushu Inst Technology
Publication of TW201140897A publication Critical patent/TW201140897A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A lead frame main body on which an LED chip is mounted is separated from a mounting board for electrical connections, thereby optimizing the respective costs and performances and obtaining a totally inexpensive and high-efficient heat release. An LED package includes: the lead frame main body, on the top surface of which the LED chip is mounted; and divided lead frames to which the respective pair of electric terminals of the LED chip are connected. On the mounting board, an opening portion for attaching the LED package is opened and wiring is formed. The LED package is mounted on the mounting board by connecting the top sides of the pair of electrode portions of the lead frame to the wiring on the mounting board, and a heat sink or a chassis is attached to the rear surface of the lead frame main body.

Description

201140897 六、發明說明： 【發明所屬之技術領域】 本發明是有關於把於引線框架上搭載了 led晶片之 LED封裝，著裝到安裝基板上的LED模組裝置及其之製造 ' 方法。 【先前技術】 LED (Light Emitting Diode:發光二極體），是普遍 用來當作所謂的降低消耗電力、削減二氧化碳、高耐用性 之兼具環保與省能的元件。這樣的LED，乃是著裝到安裝 基板上後做成LED封裝，用於攜帶式電話或數位攝影攝像 器材、PDA等的電子機器的背光、大型顯示裝置、道路顯 示器等之顯示用等方面。LED其本身爲發光元件，因爲會 放出熱，所以LED封裝基本上是包含有用於冷卻的散熱裝 置。 在現行的LED模組方面，使用陶瓷基板或金屬芯（銅 或鋁）基板來作爲一次安裝基板，而且，將該一次安裝基 板，把發光面朝上後安裝到二次安裝基板，使熱傳導到二 次安裝基板以進行散熱。圖1 5爲表示出具備了由先前技術 所做出的散熱裝置之LED模組的圖（參閱非專利文獻1 ) 。圖示的LED模組是具有由銅板47與印刷配線板46而成、 且安裝到專用的單元基板之LED封裝45。LED封裝45，是 裝著LED晶片44、光學零件42、以及螢光體薄片43於於陶 瓷基板41上。LED晶片44是於陶瓷基板41直接以金凸塊來 201140897 做倒裝晶片接合；光學零件42與螢光體薄片43是用矽氧樹 脂來固定。 在使用以往的陶瓷基板41的方法中，有著陶瓷基板41 的熱傳導比銅等的金屬來要來得差所以沒有辦法有效散熱 、高價格、與二次安裝基板（印刷配線板46 )的CTE (熱 膨脹係數）的差爲較大的緣故導致發生接合不良、加工困 難等之問題。又，在金屬芯基板方面，比起陶瓷基板散熱 性是要來得好，但由玻璃聚酯所作成的二次安裝基板的熱 傳導率不好的緣故，所以採用了就多層基板提升熱傳導率 等的方法，但是因爲散熱不充分，所以現況只能使用在較 小的輸出方面。 還有，圖16爲表示出具備了由別的先前技術所做出的 散熱裝置之LED模組的圖（參閱專利文獻1 )。專利文獻1 揭示有在印刷配線板5 3開孔後，把LED封裝5 1安裝於此之 結構。具備了散熱器55之LED封裝51，乃是介隔著熱結合 劑安裝到散熱板5 6。該專利文獻1，係爲了 LED封裝5 1之 安裝，利用到了從LED封裝體側面延伸到外部之金屬引線 52。但是，該金屬引線52，必須要與通常用於LED封裝體 的陶瓷做一體成形，其構成變得複雜》 [先前技術文獻] [非專利文獻] [非專利文獻1 ]山本勝他「照明用高輸出白色 LED光源」，松下電工技法，Vo 1.53, No.1 s -6- 201140897 http://panasonic-denko.co.jp/corp/tech/report/531j/pdfs/ 531_01 .pdf [專利文獻] [專利文獻1] US 6,428，189 B1專利公報 【發明內容】 [發明欲解決之課題] 在以往的LED模組方面，將與LED晶片的發光面相反 的側安裝到LED封裝基板，介隔著該封裝基板就要來進行 散熱，但是該封裝基板或所著裝的安裝基板（印刷配線板 )的熱阻抗變大的緣故，晶片的熱難以傳遞。 本發明，其目的在於，解決相關的問題點，將搭載了 LED晶片之引線框架本體部，從用以電性連接的安裝基板 (印刷配線板）分離開來，以圖求各個成本效能（cost performance )的最佳化，綜合來說實現便宜且高效率的 排熱。 [爲解決課題之手段] 本發明之LED模組裝置及其之製造方法，係具備有： 用以搭載LED晶片7並利用來自該LED晶片7的發光，同時 把來自該LED晶片7所放出的熱予以散熱之結構。LED模組 裝置’係具備有：平板狀的本體部16，其利用加工金屬板 狀構件所形成之、引線框架4，其具有一對電極部1 5，該 —對電極部1 5是位置於與該本體部1 6相對之至少2邊端並 201140897 延伸在從本體部16折彎立起向上的方向上而且利用設於本 體部16的開口 14來相互電性分離之、LED封裝2，其在該 引線框架4的本體部16之表面搭載LED晶片7且利用把LED 晶片7之一對電性端子分別電性連接到一對電極部1 5來構 成之、以及安裝基板9，其開設有用來著裝LED封裝2之開 口部1 〇且形成有配線3。利用將作爲外部電極1 3功能之引 線框架4的一對電極部1 5的頂部側，連接到安裝基板9的配 線3之方式，把LED封裝2著裝於安裝基板9的開口部10’ 而且，在引線框架本體部16的背面安裝散熱器5或是框體 〇 LED封裝2，是利用透明樹脂1 8來進行樹脂密封。引 線框架4的本體部16是被做2分割，於本體部16的其中一方 ，搭載LED晶片7，且與一對電極部15內的其中一方被形 成爲一體。或者是，引線框架4的本體部16是被做3分割， 於中央的本體部1 6搭載LED晶片7，左右兩側的本體部1 6 係被一體形成一對電極部15中的每一個。一對電極部15之 至少其中一方的背面，利用半蝕刻來薄化成特定厚度，與 安裝到本體部1 6的散熱器5或是框體之間做絕緣。於已開 設在安裝基板9的開口部1 0，可以配置透鏡1成與LED晶片 7的發光面相對向。 [發明效果] 根據本發明，可以將搭載了 LED晶片7之引線框架本 體部1 6 ’從用以電性連接的安裝基板（印刷配線板）9分 201140897 離開來，以圖求各個成本效能（cost performance )的最 佳化’綜合來說實現便宜且高效率的排熱。也可以在引線 框架本體部16的背面具備有散熱器5，或是在本體部16的 背面直接接觸框體的話’也可以將框體當作是散熱器5的 緣故，可以便宜地構成。 本發明是爲了促進散熱性，可以比以往還要來得高輸 出（可以比較明亮）。或者是用與以往一樣的輸出，來可 以圖求長壽化。甚至於因爲使用一般的金屬材料，可以便 宜地製造。 【實施方式】 以下，根據例示說明本發明。圖1爲將本發明具體化 之LED模組裝置之剖面圖。例示的LED模組裝置，是於安 裝基板（印刷配線板）9底面之配線3，連接已組裝之LED 封裝2的引線框架4的外部電極1 3 (參閱圖6 )，同時安裝 透鏡1及散熱器5 (或是框體）來進行構成。圖示例子的 LED封裝2 (第1例），乃是在電性分割成左右2個的引線 框架4的本體部16的其中一方之上，搭載LED晶片7，將其 之一對電性端子分別連接到各個已分割成2個的引線框架4 上，更利用樹脂密封來構成之。各個已分割成2個的引線 框架4的上端側形成一對外部電極1 3。裝到安裝基板9上的 LED封裝2之安裝，係以於設在安裝基板9的開口部10封裝 LED封裝2後，將引線框架4之一對外部電極13，利用焊接 等來連接到安裝基板9底面的配線3的方式來進行。通過該 201140897 開口部10’讓發光自led晶片7的光通過。LED晶片7，是 被配置成其發光面與透鏡1相對向。還有，透鏡1，乃是希 望爲了聚光而裝著；透鏡1不一定是必要的。 接著’參閱圖2〜圖5，說明有關引線框架4的製造。 圖2爲表示引線框架4加工前的板狀構件；（A)爲表示引 線框架4之剖面圖；（B)爲表示其之頂面圖。LED封裝1 個份的尺寸，例如爲3.2x2.8x〇.5mm左右，以下，說明將 3x9個引線框架4，同時做成在圖2所示之板狀構件上者。 作爲引線框架4的材質，係爲以往以來通常所用的材質’ 例如，使用銅、銅合金或是鐵合金。 圖3爲表示形成孔穴1 1及分切線1 2後之板狀構件；（ A)爲表示於（B)所示之僅顯示1個區塊之以X-X'線剖面 之剖面圖；（B)爲表示頂面圖。引線框架4，係如眾所皆 知那樣，利用沖壓加工或是蝕刻加工來製造，以下，說明 蝕刻加工場合的例子。將圖示的孔穴1 1 (凹處）以及分切 線1 2的成形，利用蝕刻來進行之。孔穴Π，乃是爲了搭載 LED晶片7之凹處。分切線1 2，乃是爲了在後續的工程中 個片化切開成一個—個的封裝，所預先形成之半切割。 圖4爲表示形成開口 1 4後之板狀構件；（a )爲表示 於（B )所示之僅顯示1個區塊之以X - X ·線剖面之剖面圖； (B)爲表示頂面圖。開口 14的形成，是爲了電性分離左 右一對的外部電極1 3 ’例如’利用蝕刻來進行之。或者是 該開口 14也是可以進行在形成圖3之孔穴11前。於該場合 ，開口 1 4乃是先形成從引線框架4的背面到中途的孔，之BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an LED package in which an LED package is mounted on a lead frame and mounted on a mounting substrate, and a method of manufacturing the same. [Prior Art] LED (Light Emitting Diode) is commonly used as an environmentally friendly and energy-saving component for reducing power consumption, reducing carbon dioxide, and high durability. Such an LED is mounted on a mounting substrate to form an LED package, and is used for display of backlights, large display devices, road displays, and the like of electronic devices such as portable telephones, digital photographic equipment, and PDAs. The LED itself is a light-emitting element, and since it emits heat, the LED package basically contains a heat sink for cooling. In the current LED module, a ceramic substrate or a metal core (copper or aluminum) substrate is used as a primary mounting substrate, and the primary mounting substrate is mounted with the light emitting surface facing up and then mounted to the secondary mounting substrate to conduct heat to the substrate. The substrate is mounted twice for heat dissipation. Fig. 15 is a view showing an LED module provided with a heat sink according to the prior art (see Non-Patent Document 1). The illustrated LED module is an LED package 45 having a copper plate 47 and a printed wiring board 46 and mounted to a dedicated unit substrate. The LED package 45 is provided with an LED chip 44, an optical component 42, and a phosphor sheet 43 on the ceramic substrate 41. The LED wafer 44 is flip-chip bonded directly to the ceramic substrate 41 with gold bumps 201140897; the optical component 42 and the phosphor sheet 43 are fixed with a neodymium resin. In the method of using the conventional ceramic substrate 41, the thermal conductivity of the ceramic substrate 41 is inferior to that of a metal such as copper, so that there is no way to effectively dissipate heat, and the CTE (thermal expansion) of the secondary mounting substrate (printing wiring board 46) is not effective. The difference in coefficient) is large, causing problems such as poor bonding, difficulty in processing, and the like. Further, in the case of the metal core substrate, the heat dissipation property of the ceramic substrate is better than that of the ceramic substrate. However, since the thermal conductivity of the secondary mounting substrate made of the glass polyester is not good, the heat conductivity of the multilayer substrate is improved. Method, but because the heat is not enough, the current situation can only be used in smaller output. Fig. 16 is a view showing an LED module including a heat sink manufactured by another prior art (see Patent Document 1). Patent Document 1 discloses a structure in which an LED package 51 is mounted after the printed wiring board 53 is opened. The LED package 51 having the heat sink 55 is mounted to the heat dissipation plate 56 via a thermal bonding agent. This Patent Document 1 uses a metal lead 52 extending from the side surface of the LED package to the outside for mounting of the LED package 51. However, the metal lead 52 must be integrally formed with a ceramic which is generally used for an LED package, and its constitution becomes complicated. [Prior Art Document] [Non-Patent Document] [Non-Patent Document 1] Yamamoto wins him "Lighting" High output white LED light source", Matsushita Electric Technology, Vo 1.53, No.1 s -6- 201140897 http://panasonic-denko.co.jp/corp/tech/report/531j/pdfs/ 531_01 .pdf [Patent Literature [Patent Document 1] US Pat. No. 6,428,189, the disclosure of the entire disclosure of the present invention is related to the subject of the invention. In the conventional LED module, the side opposite to the light-emitting surface of the LED chip is mounted on the LED package substrate, and is separated. The package substrate is required to dissipate heat, but the thermal resistance of the package substrate or the mounted mounting substrate (printed wiring board) is increased, and the heat of the wafer is hard to be transmitted. An object of the present invention is to solve the related problems and to separate a lead frame body portion on which an LED chip is mounted from a mounting substrate (printed wiring board) for electrical connection, and to obtain various cost performances (cost) The optimization of performance), in combination, achieves an inexpensive and efficient heat rejection. [Means for Solving the Problem] The LED module device of the present invention and the method of manufacturing the same are provided for mounting the LED chip 7 and using the light emitted from the LED chip 7 while discharging the LED chip 7. Heat is used to dissipate heat. The LED module device is provided with a flat body portion 16 which is formed by processing a metal plate member, and has a lead frame 4 having a pair of electrode portions 15 which are positioned at At least two sides opposite to the body portion 16 and 201140897 extend in an upward direction from the body portion 16 and are electrically separated from each other by an opening 14 provided in the body portion 16, the LED package 2 The LED chip 7 is mounted on the surface of the main body portion 16 of the lead frame 4, and is electrically connected to the pair of electrode portions 15 by electrically connecting one of the LED chips 7 to the pair of electrode portions 15 and the mounting substrate 9. The opening 1 of the LED package 2 is mounted and the wiring 3 is formed. Further, the LED package 2 is mounted on the opening 10' of the mounting substrate 9 by connecting the top side of the pair of electrode portions 15 as the lead frame 4 functioning as the external electrode 13 to the wiring 3 of the mounting substrate 9. The heat sink 5 or the frame 〇 LED package 2 is attached to the back surface of the lead frame main body portion 16, and is resin-sealed by the transparent resin 18. The main body portion 16 of the lead frame 4 is divided into two, and the LED chip 7 is mounted on one of the main body portions 16, and one of the pair of electrode portions 15 is integrally formed. Alternatively, the main body portion 16 of the lead frame 4 is divided into three, and the LED chip 7 is mounted on the central portion 16 of the center, and the main body portion 16 on the left and right sides is integrally formed with each of the pair of electrode portions 15. The back surface of at least one of the pair of electrode portions 15 is thinned to a specific thickness by half etching, and is insulated from the heat sink 5 or the frame attached to the main body portion 16. The lens 1 can be disposed so as to face the light-emitting surface of the LED chip 7 in the opening 10 of the mounting substrate 9. [Effect of the Invention] According to the present invention, the lead frame main body portion 16' on which the LED chip 7 is mounted can be separated from the mounting substrate (printed wiring board) 9 for electrical connection 9 201140897, and various cost performances can be obtained. The optimization of cost performance 'integrated to achieve cheap and efficient heat rejection. It is also possible to provide the heat sink 5 on the back surface of the lead frame main body portion 16 or to directly contact the frame body on the back surface of the main body portion 16. The frame body can be regarded as the heat sink 5, and it can be configured inexpensively. The present invention is intended to promote heat dissipation and can be outputted higher than before (it can be relatively bright). Or use the same output as before to achieve longevity. Even because of the use of ordinary metal materials, it can be easily manufactured. [Embodiment] Hereinafter, the present invention will be described by way of examples. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view showing an LED module device embodying the present invention. The illustrated LED module device is a wiring 3 on the bottom surface of a mounting substrate (printed wiring board) 9, and is connected to the external electrode 13 of the lead frame 4 of the assembled LED package 2 (see FIG. 6), and is mounted with the lens 1 and heat dissipation. The device 5 (or the frame) is configured. In the LED package 2 (first example) of the illustrated example, the LED chip 7 is mounted on one of the main body portions 16 of the lead frame 4 that is electrically divided into two left and right, and one of the electrical terminals is placed. They are respectively connected to the lead frames 4 which have been divided into two, and are further formed by resin sealing. A pair of external electrodes 13 are formed on the upper end side of each of the lead frames 4 which have been divided into two. The LED package 2 mounted on the mounting substrate 9 is mounted by mounting the LED package 2 on the opening 10 of the mounting substrate 9, and then connecting one of the lead frames 4 to the external electrode 13 to the mounting substrate by soldering or the like. 9 way of wiring 3 on the bottom surface. Light emitted from the LED wafer 7 is passed through the opening portion 10' of the 201140897. The LED chip 7 is arranged such that its light emitting surface faces the lens 1. Further, the lens 1 is intended to be housed for concentrating; the lens 1 is not necessarily required. Next, the manufacture of the lead frame 4 will be described with reference to Figs. 2 to 5 . Fig. 2 is a view showing a plate member before processing of the lead frame 4; (A) is a cross-sectional view showing the lead frame 4; and (B) is a top view showing the same. The size of one portion of the LED package is, for example, about 3.2 x 2.8 x 〇 .5 mm. Hereinafter, 3 x 9 lead frames 4 will be formed on the plate member shown in Fig. 2 at the same time. The material of the lead frame 4 is a material which has been conventionally used. For example, copper, a copper alloy or an iron alloy is used. 3 is a view showing a plate-like member formed by forming a hole 11 and a slit line 12; (A) is a cross-sectional view taken along line XX' of the block showing only one block shown in (B); B) is the top view. The lead frame 4 is manufactured by press working or etching as is well known. Hereinafter, an example of etching processing will be described. The formation of the hole 1 1 (recess) and the slit line 12 shown in the figure is performed by etching. The hole is for carrying the recess of the LED chip 7. The slitting line 12 is for the purpose of cutting into a one-piece package in a subsequent project, and the pre-formed half-cut. 4 is a view showing a plate-like member after the opening 14 is formed; (a) is a cross-sectional view showing an X-X· line section showing only one block shown in (B); (B) is a top view; Surface map. The opening 14 is formed by electrically etching the pair of external electrodes 1 3 '', for example, by etching. Alternatively, the opening 14 can also be made before the formation of the aperture 11 of Figure 3. In this case, the opening 14 is formed by first forming a hole from the back surface of the lead frame 4 to the middle.

S -10- 201140897 後以從表面形成孔穴π的方式使其貫通並完成開口 1 4。 圖5爲表示形成背面半蝕刻6後之板狀構件；（A )爲 表示於（B )所示之僅顯示1個區塊之以X - X'線剖面之剖面 圖；（B)爲表示頂面圖。形成背面半餓刻6’乃是爲了與 安裝到背面的散熱器5 (參閱圖1 )之間確保絕緣層’是利 用蝕刻來進行之。該半鈾刻1 9 ’乃是將利用開口 1 4所分成 兩側之引線框架4部分之內的其中一方的背面予以切除特 定厚度者。藉由以上的工程，形成3χ9個已連結之引線框 架4 〇 接著，一邊參閱圖6〜圖9—邊說明圖1所示之第1例之 LED封裝2的製造工程。圖6爲表示用於一個LED封裝2之1 個引線框架4之剖面圖（A )及頂面圖（B )。在此，僅揭 示1個引線框架4，但是在實際的製造中，會像如圖5所例 示之連結複數個的狀態。分離成一個一個的模組裝置之個 片化，乃是在後續的工程中進行。如圖示那樣，引線框架 4，具備了：平板狀的本體部16，用以成爲搭載LED晶片7 ，以及一對電極部1 5，其是於該本體部1 6的兩側，亦即位 置於相對向之至少2邊端，折彎自本體部1 6後延伸到與 LED晶片7的發光方向同側直立向上的方向上。這一對電 極部1 5的前端面，乃是功能爲成爲連接到安裝基板9的配 線3之外部電極1 3。又，作爲外部電極1 3的功能，不一定 限制在電極部1 5的前端面，電極部1 5的頂部側也是可以的 。針對遠離自引線框架本體部1 6而配置的安裝基板9的配 線3 ’例如，也可以由電極部1 5的前端側外面來進行銲接 -11 - 201140897 連接。在圖示的例子中’乃是例不出從平板部直立向上於 電極部15所正交的方向上’但是也不一定要正交，以外部 電極13位置在平板狀的本體部16的上方的方式’例如，也 可以是斜上方上呈直線地’或者是灣曲向上者。至少一對 外部電極13，利用開口 14，相互分離之。在圖示的例子中 ，利用將平板狀的本體部16藉由開口 14來做2分割的方式 ，使一對外部電極13相互分離之。如後述那樣（參閱圖8 )，在已做了 2分割之本體部16的其中一方上，著裝LED 晶片7後，進行其中一方的打線連接，另一方面，於本體 部16的其中另一方，進行其中另一方的打線連接。 圖7爲表示搭載了 LED晶片7的狀態之剖面圖。於引線 框架4的本體部16的其中一方的表面，LED晶片7是使用接 著劑來固定之。該LED晶片7，於頂面具有LED發光面，而 且，於其之周邊，形成接合引線17的連接電極。尙且，於 圖中，僅圖示出僅1個的LED晶片7，但是，是可以搭載複 數個晶片的（參閱圖9 ( C ))。 圖8爲表示在把LED晶片7連接到了引線框架4的狀態 之剖面圖。將LED晶片7固著到引線框架4的本體部1 6之其 中一方之上後，將2分割的引線框架4之每一個以及LED晶 片7的連接電極間，利用接合引線1 7來進行打線連接》After S -10- 201140897, the hole is formed by forming a hole π from the surface to complete the opening 14 . Fig. 5 is a view showing a plate-like member after the back surface half etching 6 is formed; (A) is a cross-sectional view taken along line XX' of the block showing only one block shown in (B); Top view. The formation of the back half-hungry 6' is to ensure that the insulating layer ' is secured by etching between the heat sink 5 mounted on the back side (see Fig. 1). The semi-uranium engraving 1 9 ' is a portion in which the back surface of one of the lead frames 4 which are divided into two sides by the opening 14 is cut to a specific thickness. By the above process, 3 to 9 connected lead frames 4 are formed. Next, the manufacturing process of the LED package 2 of the first example shown in Fig. 1 will be described with reference to Figs. 6 to 9 . Fig. 6 is a cross-sectional view (A) and a top view (B) showing one lead frame 4 for one LED package 2. Here, only one lead frame 4 is disclosed, but in actual manufacturing, a plurality of states are connected as illustrated in Fig. 5 . Separation into individual module devices is carried out in subsequent projects. As shown in the figure, the lead frame 4 includes a flat body portion 16 for mounting the LED chip 7 and a pair of electrode portions 15 on both sides of the main body portion 16, that is, the position At least at the two opposite ends, the bending extends from the body portion 16 to a direction that is upright in the same direction as the light-emitting direction of the LED chip 7. The front end surface of the pair of electrode portions 15 is an external electrode 13 that functions to be a wiring 3 connected to the mounting substrate 9. Further, the function of the external electrode 13 is not necessarily limited to the front end surface of the electrode portion 15 but the top side of the electrode portion 15 is also possible. For example, the wiring 3' of the mounting substrate 9 disposed away from the lead frame body portion 16 may be joined by the outer surface of the front end side of the electrode portion 15 to be welded -11 - 201140897. In the illustrated example, 'the case is not straight from the flat plate portion up to the direction orthogonal to the electrode portion 15', but it is not necessarily orthogonal, and the outer electrode 13 is positioned above the flat body portion 16. The way 'for example, it can also be straight on the upper side of the slope' or the Bayer upwards. At least one pair of external electrodes 13 are separated from each other by the opening 14. In the illustrated example, the pair of external electrodes 13 are separated from each other by dividing the flat body portion 16 into two by the opening 14. As will be described later (see FIG. 8), one of the main body portions 16 that have been divided into two is mounted with the LED chip 7, and one of the wires is connected, and the other of the main body portion 16 is placed on the other side. Perform the wire bonding of the other party. FIG. 7 is a cross-sectional view showing a state in which the LED wafer 7 is mounted. On one of the surfaces of the main body portion 16 of the lead frame 4, the LED wafer 7 is fixed by using an adhesive. The LED chip 7 has an LED light-emitting surface on the top surface, and a connection electrode for bonding the lead wires 17 is formed on the periphery thereof. Further, in the figure, only one LED chip 7 is illustrated, but a plurality of wafers can be mounted (see Fig. 9(C)). Fig. 8 is a cross-sectional view showing a state in which the LED wafer 7 is connected to the lead frame 4. After the LED chip 7 is fixed to one of the main body portions 16 of the lead frame 4, each of the two divided lead frames 4 and the connection electrodes of the LED chips 7 are connected by a bonding wire 17 for wire bonding. 》

圖9爲表示已進行樹脂密封的狀態之圖；（A)爲表 示側面剖面圖；（B )爲表示1個晶片/封裝之場合之頂面 圖：（C)爲表示複數個晶片/封裝之場合之頂面圖。搭載 LED晶片後進行電性連接之後，在此狀態下，搭載了 LEDFig. 9 is a view showing a state in which resin sealing has been performed; (A) is a side sectional view; (B) is a top view showing a case of one wafer/package: (C) is a view showing a plurality of wafers/packages. Top view of the occasion. After the LED chip is mounted and electrically connected, the LED is mounted in this state.

S -12- 201140897 晶片7的引線框架4的頂面，使用透明液狀樹脂（例如材質 爲環氧系之類）來進行樹脂密封（轉注模（transfer mold )或是裝塡（potting))至與功能爲外部電極13之引線框 架4的前端面同平面爲止。之後，藉由個片化成各個的封 裝之方式，完成第1例之LED封裝2。 分割成各個封裝的LED封裝2，係如前述圖1所示般， 安裝到安裝基板9後，構成LED模組裝置。作爲該安裝基 板9，預先製作出穿出透鏡1安裝部的孔之印刷配線板（ printed circuit board)。於該安裝基板9，安裝1個（參閱 圖1)或是複數個（參閱後述之圖11) LED封裝2，以構成 LED模組裝置。使用接著劑將透鏡1著裝於印刷配線板的 穿孔位置。LED晶片7的發光面，乃朝向透鏡1方向。 LED封裝2的著裝，乃是將引線框架外部電極丨3 (參 閱圖6)，利用銲接等的連接方式，裝著於設在安裝基板 (印刷配線板）9上的配線3 (該電極連接墊部）。又，在 該階段’於已設在印刷配線板上的配線3，不僅是LED封 裝2，搭載並連接控制iC21、被動零件20等之電路元件（ 參閱後述之圖1 1 )。 於已著裝到安裝基板9之LED封裝2的引線框架4背面 ，安裝板狀的散熱器5。藉此，完成L E D模組裝置。利用 已形成在引線框架4背面的半蝕刻1 9 (以及已注入於此的 密封樹脂）’確保其中一方之分割的引線框架4與散熱器5 之間的絕緣。作爲散熱器5，例如，接著銅板、鋁板、或 者是鋁與碳的混合材等等之散熱板。或者是，也可以不用 -13- 201140897 安裝散熱器5，直接安裝到框體。藉此’產生自LED晶片7 的熱，介隔著引線框架4’更進一步’介隔著散熱器5來散 熱。於散熱器5與印刷配線板之間’也形成空間的緣故’ 不僅是從散熱器5之圖中的底面，也可以從頂面來散熱。 但是，取代散熱器5，也是可以將著裝LED模組裝置的框 體，作爲散熱板來利用之。 圖10爲表示第2例之LED封裝2之圖；（A)爲表示側 面剖面圖；（B )爲表示1個晶片/封裝之場合之頂面圖； (C)爲表示複數個晶片/封裝之場合之頂面圖。該第2例 之LED封裝2，乃是僅於1個引線框架4的本體部16爲利用2 個開口 14來做3分割這一點，是與圖9所示之第1例的LED 封裝2相異的。於已做了 3分割之引線框架4的中央的本體 部1 6，搭載LED晶片7，而且，從位置於所相對向之至少2 邊端之左右兩側的平板狀的本體部1 6端開始折彎並直立向 上的電極部1 5的前端面，是功能爲外部電極1 3。又，於左 右兩側的平板狀的本體部1 6以及電極部1 5的背面，形成用 以確保各個絕緣層之半蝕刻19。產生自LED晶片7的熱， 介隔著引線框架1 6，更進一步，介隔著散熱器5來散熱。 另一方面，左右兩側的電極部1 5係可以相互地，且與散熱 器5完全地絕緣。 圖Π爲表示搭載了複數個（例示爲2個）第2例的LED封 裝2之場合的LED模組裝置之剖面圖；（B)爲由底面來看 LED模組裝置之槪略的底面圖；（C)爲由頂面來看未安 裝散熱器5狀態的LED模組裝置之槪略的頂面圖。如圖示S -12- 201140897 The top surface of the lead frame 4 of the wafer 7 is sealed with a transparent liquid resin (for example, an epoxy resin) for resin sealing (transfer mold or potting) to It is flush with the front end surface of the lead frame 4 which functions as the external electrode 13. Thereafter, the LED package 2 of the first example is completed by singulation into individual packages. The LED package 2 divided into individual packages is mounted on the mounting substrate 9 as shown in FIG. 1 described above, and constitutes an LED module device. As the mounting substrate 9, a printed circuit board through which a hole of the mounting portion of the lens 1 is inserted is prepared in advance. On the mounting substrate 9, one (see Fig. 1) or a plurality (see Fig. 11 to be described later) of the LED package 2 is mounted to constitute an LED module device. The lens 1 is mounted on the punched position of the printed wiring board using an adhesive. The light emitting surface of the LED wafer 7 is oriented in the direction of the lens 1. The LED package 2 is mounted on the lead frame external electrode 丨3 (see FIG. 6), and is attached to the wiring 3 provided on the mounting substrate (printed wiring board) 9 by soldering or the like (the electrode connection pad) unit). In addition, at this stage, not only the LED package 2 but also the circuit components such as the control unit iC21 and the passive component 20 are mounted and connected to the wiring 3 provided on the printed wiring board (see Fig. 1 1 described later). A plate-shaped heat sink 5 is attached to the back surface of the lead frame 4 of the LED package 2 that has been mounted on the mounting substrate 9. Thereby, the L E D module device is completed. The insulation between the lead frame 4 of one of the divided leads and the heat sink 5 is ensured by the half etching 1 9 (and the sealing resin injected therein) which has been formed on the back surface of the lead frame 4. As the heat sink 5, for example, a heat sink which is followed by a copper plate, an aluminum plate, or a mixture of aluminum and carbon or the like. Alternatively, you can install the heat sink 5 without the -13- 201140897 and install it directly into the frame. Thereby, the heat generated from the LED chip 7 is further absorbed by the heat sink 5 via the lead frame 4'. The space between the heat sink 5 and the printed wiring board 'also forms a space' is not only the bottom surface of the heat sink 5 but also the heat dissipation from the top surface. However, instead of the heat sink 5, it is also possible to use the frame in which the LED module device is mounted as a heat sink. Fig. 10 is a view showing the LED package 2 of the second example; (A) is a side sectional view; (B) is a top view showing one wafer/package; (C) is a plurality of wafers/packages. The top view of the occasion. In the LED package 2 of the second example, only the main body portion 16 of one lead frame 4 is divided into three by two openings 14, and is the same as the LED package 2 of the first example shown in FIG. Different. The LED chip 7 is mounted on the main body portion 1.6 of the center of the lead frame 4 which has been divided into three, and is formed from the flat body portion 16 end which is positioned on the right and left sides of at least two opposite ends of the opposite direction. The front end surface of the electrode portion 15 which is bent and erected upward functions as the external electrode 13. Further, on the left and right sides of the flat main body portion 16 and the back surface of the electrode portion 15 are formed a half etching 19 for securing the respective insulating layers. The heat generated from the LED chip 7 is interposed between the lead frame 16 and the heat sink 5 to dissipate heat. On the other hand, the electrode portions 15 on the left and right sides are mutually insulated and completely insulated from the heat sink 5. FIG. 2 is a cross-sectional view showing an LED module device in a case where a plurality of (for example, two) second LED packages 2 are mounted; (B) is a schematic bottom view of the LED module device viewed from the bottom surface. (C) is a schematic top view of the LED module device in which the heat sink 5 is not mounted from the top. As shown

S -14- 201140897 般，於搭載了 LED晶片7之引線框架4的背面，接著散熱器 5 »藉此，完成LED模組裝置。藉此，產生自LED晶片7的 熱，介隔著引線框架4，更進一步，介隔著散熱器5來散熱 。於散熱器5與印刷配線板之間，也形成空間的緣故’不 僅是從散熱器5之圖中的頂面，也可以從底面來散熱。 作爲安裝基板9，預先製作出穿出透鏡1安裝部的孔之 印刷配線板（P r i n t e d c i r c u i t b 〇 a r d )。於該安裝基板9， 如圖示般地，安裝複數個LED封裝2，以構成LED模組裝置 。印刷配線板具有單面1層的配線3，穿孔係在預成型料（ 樹脂含浸基材）的狀態下以金屬模等的沖壓、或者是鑽孔 來形成之。該安裝基板9，是在絕緣體製基板上，以銅箔 等的導電體來構成電路圖案之印刷配線。印刷配線，乃是 爲了零件之間做連接，將導線圖案藉由印刷形成在絕緣基 板的表面或者是表面及其內部。 於該印刷配線板，著裝LED封裝2。LED封裝2的著裝 ，乃是將一對外部電極1 3，利用銲接等的連接方式，裝著 於設在安裝基板（印刷配線板）9上的配線3 (該電極連接 墊部）。又，在該階段，於已設在印刷配線板上的配線3 ’不僅是LED封裝2，搭載並連接控制IC21、被動零件20 等之電路元件。更進一步，使用接著劑將透鏡1著裝於印 刷配線板的穿孔位置。LED晶片7的發光面，乃朝向透鏡1 方向。或者是在預先著裝了透鏡1於封裝的狀態下安裝到 印刷配線板也是可以的。 圖12爲表示第3例之LED封裝2之圖；（A)爲表示側 -15- 201140897 面剖面圖；（B )爲表示1個晶片/封裝之場合之頂面圖； (C)爲表示複數個晶片/封裝之場合之頂面圖。該第3例 之LED封裝2，係僅只有將利用1個開口 14做2分割的引線 框架4部分的背面之其中任—個，予以形成用以確保絕緣 層之半蝕刻19這一點，是與圖9所示第1例之LED封裝2相 異的。在配置於引線框架4背面的散熱器5側可以確保絕緣 的情況下，如圖1 2所例示的，於LD封裝2側具備用以確保 絕緣層之半蝕刻1 9是沒有必要的。例如，僅於利用開口 1 4 做了分割的引線框架4部分的LED晶片7搭載側著裝散熱器 5之際，不一定得要用以確保絕緣層之半蝕刻1 9。 圖13爲表示第4例之LED封裝2之圖，各自表示有：（ A)爲表示頂面圖：（B)爲表示以X-X1線所切斷之剖面 圖；（C )爲表示以Y-Y’線所切斷之剖面圖。如圖示般地 ，把與一對外部電極13正交的方向之一對的固定器22，設 在搭載有LED晶片7的兩側。藉此，可以增強對樹脂的咬 合，提高可靠性。又，可以圖求對封裝底面側的樹脂洩漏 。例如，於樹脂密封時，以金屬模的上模透過固定器22將 引線框架4壓到金屬模底面使其緊密接著，防止對封裝底 面側的樹脂洩漏。 接著，一邊參閱圖14，一邊說明有關本發明的散熱作 用。圖14(A)爲表示根據本發明所構成的LED模組之圖 (與上述的圖11相同）；（B)爲表示以往構造之圖。在 圖14(B)所示之以往構造中，產生自LED晶片31的熱， 通過LED安裝基板3 2，並通過印刷配線板3 3後，於散熱器In the same manner as in S-14-201140897, the back surface of the lead frame 4 on which the LED chip 7 is mounted is followed by the heat sink 5 » to complete the LED module device. Thereby, heat generated from the LED wafer 7 is interposed between the lead frame 4, and further, the heat sink 5 is interposed to dissipate heat. The space between the heat sink 5 and the printed wiring board is also formed by the fact that not only the top surface of the heat sink 5 but also the bottom surface, heat can be dissipated from the bottom surface. As the mounting substrate 9, a printed wiring board (P r i n t e d c i r c u i t b 〇 a r d ) that penetrates the hole of the mounting portion of the lens 1 is prepared in advance. On the mounting substrate 9, as shown, a plurality of LED packages 2 are mounted to constitute an LED module device. The printed wiring board has the wiring 3 of one layer on one side, and the perforation is formed by punching or drilling with a metal mold or the like in a state of a prepreg (resin impregnated base material). The mounting substrate 9 is a printed wiring in which a circuit pattern is formed of a conductor such as copper foil on an insulating substrate. The printed wiring is formed by connecting between the parts, and the wiring pattern is formed on the surface or the surface of the insulating substrate by printing. The LED package 2 is mounted on the printed wiring board. The LED package 2 is mounted on the pair of external electrodes 13 by means of soldering or the like, and is attached to the wiring 3 (the electrode connection pad portion) provided on the mounting substrate (printing wiring board) 9. Further, at this stage, the wiring 3' provided on the printed wiring board is not only the LED package 2 but also a circuit component such as the control IC 21 and the passive component 20. Further, the lens 1 is mounted on the punching position of the printed wiring board using an adhesive. The light emitting surface of the LED wafer 7 is oriented in the direction of the lens 1. Alternatively, it is also possible to mount the lens 1 to the printed wiring board in a state in which the lens 1 is preliminarily mounted. Fig. 12 is a view showing the LED package 2 of the third example; (A) is a sectional view showing a side -15 - 201140897; (B) is a top view showing a case of one wafer / package; (C) is a view Top view of a plurality of wafers/packages. In the LED package 2 of the third example, only one of the back surfaces of the lead frame 4 portion which is divided into two by one opening 14 is formed to ensure the half etching 19 of the insulating layer. The LED package 2 of the first example shown in Fig. 9 is different. In the case where the side of the heat sink 5 disposed on the back surface of the lead frame 4 can be insulated, as illustrated in Fig. 12, it is not necessary to provide half etching of the insulating layer on the LD package 2 side. For example, when the LED chip 7 on the lead frame 4 portion which is divided by the opening 14 is mounted on the side of the mounting surface of the heat sink 5, it is not necessary to ensure half etching of the insulating layer. Fig. 13 is a view showing the LED package 2 of the fourth example, each of which shows: (A) is a top view: (B) is a cross-sectional view taken along the line X-X1; (C) is a view showing A section cut by the Y-Y' line. As shown in the figure, the holder 22 which is one of the directions orthogonal to the pair of external electrodes 13 is provided on both sides on which the LED chips 7 are mounted. Thereby, the biting of the resin can be enhanced and the reliability can be improved. Further, it can be seen that the resin on the bottom surface side of the package leaks. For example, when the resin is sealed, the upper mold of the metal mold is passed through the holder 22 to press the lead frame 4 to the bottom surface of the mold to be closely adhered, thereby preventing resin leakage to the bottom side of the package. Next, the heat dissipation effect of the present invention will be described with reference to Fig. 14 . Fig. 14 (A) is a view showing an LED module constructed in accordance with the present invention (the same as Fig. 11 described above); (B) is a view showing a conventional structure. In the conventional structure shown in Fig. 14(B), heat generated from the LED chip 31 is generated, the substrate 3 2 is mounted by the LED, and the printed wiring board 3 3 is printed on the heat sink.

S -16- 201140897 34進行排熱。如此，以往構造，係因爲LED安裝基板32與 印刷配線板33—起或者是複合成爲一體的緣故而排熱受到 限制，或者是爲了複合而做成高成本的基板。 相對於此，如圖1 4 ( A )所示，根據本發明所構成的 LED模組裝置，乃是選擇了將搭載了 LED晶片7的引線框架 本體部1 6，從用以電性連接的基板（印刷配線板）予以離 開，所以排熱方面爲成本效能最好的手段。例如，作爲散 熱器5’可以使用便宜的鋁或者是銅單板，將框體當作散 熱器5來使用也是可以的。又，將引線框架本體部16從印 刷配線板予以離開的方式，散熱器5的表面積跟以往構造 相比增加了近2倍，增大了排熱（散熱）效果。 以上’在本揭示只是把眾多的實施型態單舉幾個作爲 例示詳細說明之，在不實質脫離本發明的新穎性教示及有 利的效果下，其實施的型態是可以有眾多的變形例。 【圖式簡單說明】 [圖1]爲將本發明具體化之led模組裝置之剖面圖。 [圖2]圖2爲表示引線框架加工前的板狀構件；（A) 爲表示引線框架之剖面圖；（B )爲表示其之頂面圖。 [圖3 ]爲表示形成孔穴及分切線後之板狀構件；（a ) 爲表示於（B )所示之僅顯示i個區塊之以χ _ χ，線剖面之剖 面圖；（Β)爲表示頂面圖。 [圖4 ]爲表示形成開口後之板狀構件；（a )爲表示於 (B )所示之僅顯示1個區塊之以χ_χ，線剖面之剖面圖；（ -17- 201140897 B)爲表不頂面圖。 [圖5 ]爲表示形成背面半蝕刻後之板狀構件；（a )爲 表示於（B)所示之僅顯示1個區塊之以χ-χ·線剖面之剖面 圖；（B)爲表示頂面圖。 [圖6]爲表示用於—個LED封裝之1個引線框架之剖面 圖（A)及頂面圖（b)。 [圖7]爲表示搭載了 LED晶片的狀態之剖面圖。 [0 8]爲表示在把LED晶片連接到了引線框架的狀態之 剖面圖。 [圖9]爲表示已進行樹脂密封的狀態之圖；（A)爲表 示側面剖面圖；（B )爲表示1個晶片/封裝之場合之頂面 圖；（C)爲表示複數個晶片/封裝之場合之頂面圖。 [圖10]爲表示第2例之LED封裝之圖；（A)爲表示側 面剖面圖；（B)爲表示1個晶片/封裝之場合之頂面圖； (C)爲表示複數個晶片/封裝之場合之頂面圖。 [圖11]爲表示搭載了複數個（例示爲2個）第2例的LED 封裝之場合的LED模組裝置之剖面圖；（B)爲表示（A) 所示之由X方向所見之槪略的底面圖；（C)爲在未安裝 散熱器的狀態下，由γ方向所見之槪略的頂面圖。 [圖12]爲表示第3例之LED封裝之圖；（A)爲表示側 面剖面圖；（B )爲表示1個晶片/封裝之場合之頂面圖； (C)爲表示複數個晶片/封裝之場合之頂面圖。 [圖13]爲表示第4例之LED封裝之圖，各自表示有：（ A )爲表示頂面圖：（B )爲表示以X-X'線所切斷之剖面S -16- 201140897 34 for heat removal. As described above, in the conventional structure, the LED mounting substrate 32 is integrated with the printed wiring board 33 or integrated, and the heat is limited, or a high-cost substrate is formed for the purpose of recombination. On the other hand, as shown in FIG. 14 (A), the LED module device according to the present invention is selected from the lead frame main body portion 16 on which the LED chip 7 is mounted, for electrical connection. The substrate (printed wiring board) is left away, so heat removal is the best means of cost effectiveness. For example, it is also possible to use inexpensive aluminum or a copper veneer as the heat radiator 5', and it is also possible to use the casing as the heat radiator 5. Further, the lead frame main body portion 16 is separated from the printed wiring board, and the surface area of the heat sink 5 is nearly doubled as compared with the conventional structure, and the heat exhausting (heat dissipation) effect is increased. The above descriptions are merely illustrative of the numerous embodiments, and the embodiments of the invention may be embodied in a number of variations without departing from the novel teachings and advantageous effects of the invention. . BRIEF DESCRIPTION OF THE DRAWINGS [Fig. 1] is a cross-sectional view of a LED module device embodying the present invention. Fig. 2 is a view showing a plate member before processing of a lead frame; (A) is a cross-sectional view showing the lead frame; and (B) is a top view showing the same. [Fig. 3] is a plate-like member after forming a hole and a slit line; (a) is a sectional view showing a line profile of only y _ 显示 shown in (B); (Β) To represent the top view. [Fig. 4] is a plate-like member after forming an opening; (a) is a cross-sectional view showing a line section showing only one block shown in (B); (-17-201140897 B) The table is not top. [Fig. 5] is a plate-like member after forming a back surface half-etched; (a) is a cross-sectional view showing a χ-χ· line cross section showing only one block shown in (B); Indicates the top view. Fig. 6 is a cross-sectional view (A) and a top view (b) showing one lead frame used for one LED package. Fig. 7 is a cross-sectional view showing a state in which an LED chip is mounted. [08] is a cross-sectional view showing a state in which the LED wafer is connected to the lead frame. Fig. 9 is a view showing a state in which resin sealing has been performed; (A) is a side sectional view; (B) is a top view showing one wafer/package; and (C) is a plurality of wafers/ Top view of the package. Fig. 10 is a view showing the LED package of the second example; (A) is a side sectional view; (B) is a top view showing one wafer/package; (C) is a plurality of wafers/ Top view of the package. FIG. 11 is a cross-sectional view showing an LED module device in a case where a plurality of (illustrated as two) second example LED packages are mounted, and (B) is a view showing (X) in the X direction. A slightly bottom view; (C) is a top view of the outline seen from the γ direction in a state where the heat sink is not mounted. Fig. 12 is a view showing a LED package of a third example; (A) is a side sectional view; (B) is a top view showing a wafer/package; (C) is a plurality of wafers/ Top view of the package. Fig. 13 is a view showing a LED package of a fourth example, each of which shows that (A) is a top view: (B) is a cross section cut by an X-X' line;

S -18- 201140897 圖；（c )爲表示以γ- γ1線所切斷之剖面圖。 [圖14] (Α)爲表示根據本發明所構成的LED模組之 圖（與上述的圖11相同）；（B)爲表示以往構造之圖。 [圖15]爲表示出具備了由先前技術所做出的散熱裝置 之LED模組之圖。 ‘ [圖1 6]爲表示出具備了由別的先前技術所做出的散熱 裝置之LED模組之圖。 【主要元件符號說明】 1 :透鏡（lens) 2 : LED封裝 3 :配線 4 :引線框架（lead frame ) 5 :散熱器（heat sink) 6 :背面半蝕刻 7 : LED晶片 9 :安裝基板（印刷配線板） 1 〇 :開口部 Η :孔穴（cavity) 1 2 :分切線（d i c i n g 1 i n e ) 1 3 :外部電極 1 4 ··開口 1 5 :電極部 1 6 :本體部 -19- 201140897 17 :接合引線（bonding wire) 1 8 :透明樹脂 19:半触刻（half etching) 2 0 :被動零件 2 1 : IC (控制 IC ) 22:固定器（anchor) 31 : LED晶片 32 : LED安裝基板 3 3 :印刷配線板 34:散熱器（heatsink) 4 1 :陶瓷基板 4 2 :光學零件 43 :螢光體薄片 44 ： LED晶片 45 ： LED封裝 46 :印刷配線板 4 7 :銅板 51: LED封裝 52 :金屬引線 5 3 :印刷配線板 5 4 :熱結合劑 55:散熱器（heatsink) 5 6 :散熱板S -18- 201140897 Fig. (c) is a cross-sectional view showing the γ-γ1 line cut. Fig. 14 is a view showing an LED module constructed in accordance with the present invention (the same as Fig. 11 described above); (B) is a view showing a conventional structure. Fig. 15 is a view showing an LED module provided with a heat sink device made by the prior art. ‘ [Fig. 16] is a diagram showing an LED module having a heat sink made by another prior art. [Main component symbol description] 1 : lens (lens) 2 : LED package 3 : wiring 4 : lead frame 5 : heat sink 6 : back half etching 7 : LED chip 9 : mounting substrate (printing Wiring board) 1 〇: opening Η : cavity 1 2 : dicing 1 ine 1 3 : external electrode 1 4 · · opening 1 5 : electrode part 1 6 : body part -19- 201140897 17 : Bonding wire 1 8 : Transparent resin 19: half etching 2 0 : Passive part 2 1 : IC (control IC) 22: anchor 31 : LED chip 32 : LED mounting substrate 3 3: printed wiring board 34: heatsink 4 1 : ceramic substrate 4 2 : optical component 43 : phosphor sheet 44 : LED wafer 45 : LED package 46 : printed wiring board 4 7 : copper plate 51 : LED package 52 : metal lead 5 3 : printed wiring board 5 4 : thermal bonding agent 55: heatsink 5 6 : heat sink

S -20-S -20-

Claims (1)

201140897 七、申請專利範圍： 1 . 一種L E D模組裝置，係具備了 利用來自該LED晶片的發光’同時將來 出的熱予以散熱之結構；其特徵爲： 具備有： 引線框架，乃是具有平板狀的本體 該平板狀的本體部是利用加工金屬板狀 一對電極部是位置於該本體部所相對2 體部開始折彎延伸到立起向上的方向上 部的開口來相互電性分離， LED封裝，乃是在該引線框架的： LED晶片，而且，構成爲將前述LED晶 個別電性連接到前述一對電極部，以及 安裝基板，乃是開有用以裝著前述 ，且形成有配線； 利用將作爲外部電極來發揮功能之 述一對電極部的頂部側，連接到前述安 地，來把前述LED封裝裝著於前述安裝 且，安裝散熱器或者是框體於前述引線 ，來做成LED模組裝置。 2 ·如申請專利範圍第1項所記載之 中： 前述LED封裝，是利用透明樹脂來f 3 .如申請專利範圍第1項所記載之 以搭載LED晶片後 自該LED晶片所放 部與一對電極部， 構件所形成之，該 :至少2邊端並從本 ，且利用設在本體 體部的表面搭載 片之一對電性端子 LED封裝之開口部 前述引線框架之前 裝基板的配線那樣 基板的開口部，而 框架本體部的背面 LED模組裝置，其 玫樹脂密封。 LED模組裝置，其 -21 - 201140897 中： 前述引線框架的前述本體部是被做2分割，於本體部 的其中一方，搭載LED晶片，且前述—對電極部內的其中 一方被形成爲一體。 4·如申請專利範圍第1項所記載之LED模組裝置，其 中： 則述引線框架的前述本體部是被做3分割，於中央的 本體部’搭載LED晶片’且左右兩側的本體部，係被—體 形成前述一對電極部中的每一個。 5 ·如申請專利範圍第1項所記載之LED模組裝置，其 中： 前述一對電極部之至少其中—方的背面，係利用半蝕 刻來切除成特定厚度’與安裝到此的前述散熱器或是框體 之間做絕緣。 6. 如申請專利範圍第1項所記載之L E D模組裝置，其 中： 於已開設在前述安裝基板的前述開口部，以與前述 L E D晶片的發光面相對向那樣地來配置透鏡。 7. -種LED模組裝置之製造方法，係該LED模組裝置 具備了用以搭載LED晶片後利用來自該LED晶片的發光， 同時將來自該LED晶片所放出的熱予以散熱之結構；其特 徵爲： 將具有平板狀的本體部與一對電極部之引線框架，利 用對金屬狀構件進行沖壓加工或蝕刻加工的方式來形成： S -22- 201140897 該一對電極部是位置於該本體部所相對之至少2邊端並從 本體部開始折彎延伸到立起向上的方向上，且利用設在本 體部的開口來相互電性分離； 在該引線框架的本體部的表面搭載LED晶片，而且， 構成爲將前述LED晶片之一對電性端子個別電性連接到前 述一對電極部，將該一對電極部的頂部側作爲外部電極， 以構成LED封裝： 安裝散熱器或者是框體於前述引線框架本體部的背面 ，來做成LED模組裝置。 8. 如申請專利範圍第7項所記載之LED模組裝置之製 造方法，其中： 具備有開有用以著裝前述LED封裝之開口部，且形成 配線之安裝基板；利用將前述一對電極部的頂部側連接到 前述安裝基板的配線的方式，將前述LED封裝裝著到前述 安裝基板的開口部。 9. 如申請專利範圍第7項所記載之LED模組裝置之製 造方法，其中： 前述LED封裝，是利用透明樹脂來做樹脂密封。 1〇·如申請專利範圍第7項所記載之LED模組裝置之 製造方法，其中： 前述引線框架的前述本體部是做2分割，於本體部的 其中一方，搭載LED晶片，且前述一對電極部內的其中一 方形成爲一體。 1 1 .如申請專利範圍第7項所記載之LED模組裝置之製 -23- 201140897 造方法，其中： 前述引線框架的前述本體部是做3分割，於中央的本 體部，搭載LED晶片’且左右兩側的本體部，係—體形成 前述一對電極部中的每一個。 12·如申請專利範圍第7項所記載之L E D模組裝置之 製造方法，其中： 將前述一對電極部之至少其中一方的背面，利用半蝕 刻來切除成特定厚度，與安裝到此的前述散熱器或是框體 之間做絕緣。 1 3 .如申請專利範圍第8項所記載之LED模組裝置之 製造方法，其中： 於已開設在前述安裝基板的前述開口部，以與前述 LED晶片的發光面相對向之方式來配置透鏡。 S -24-201140897 VII. Patent application scope: 1. An LED module device having a structure for radiating heat from the LED chip while radiating heat from the LED chip; the feature is: having: a lead frame, having a flat plate The main body of the flat shape is electrically separated from each other by a pair of electrode portions in which the metal plate-like shape is formed so as to be located at an upper portion of the main body portion where the two body portions are bent and extended upward in the upward direction. The package is an LED chip of the lead frame, and is configured to electrically connect the LED crystals to the pair of electrode portions, and to mount the substrate, and to install the substrate and to form the wiring; The top side of the pair of electrode portions that functions as an external electrode is connected to the ground, and the LED package is attached to the LED package, and a heat sink or a frame is attached to the lead wire. LED module device. 2. In the case of the first aspect of the patent application, the LED package is made of a transparent resin, and the LED chip is mounted on the LED chip as described in the first paragraph of the patent application. In the electrode portion, the member is formed by at least two side ends, and the wiring is mounted on the substrate before the lead frame is opened by one of the surface mounting sheets provided on the main body portion and the opening of the electrical terminal LED package. The opening of the substrate, and the LED module device of the back of the frame body portion is sealed with a resin. In the LED module device, in the above-mentioned lead frame, the main body portion is divided into two, and one of the main body portions is mounted with an LED chip, and one of the counter electrode portions is integrally formed. 4. The LED module device according to the first aspect of the invention, wherein: the main body portion of the lead frame is divided into three, and the main body portion of the center is mounted with an LED chip and the main body portions on the left and right sides Each of the pair of electrode portions is formed by the body. The LED module device according to the first aspect of the invention, wherein: at least one of the back surfaces of the pair of electrode portions is cut by a half etching into a specific thickness ′ and the aforementioned heat sink mounted thereto Or insulation between the frames. 6. The L E D module device according to claim 1, wherein the lens is disposed so as to face the light-emitting surface of the L E D wafer in the opening portion of the mounting substrate. 7. A method of manufacturing an LED module device, comprising: a structure for mounting an LED chip, using light emitted from the LED chip, and dissipating heat emitted from the LED chip; The lead frame having a flat body portion and a pair of electrode portions is formed by press working or etching a metal member: S -22- 201140897 The pair of electrode portions are positioned on the body At least two opposite ends of the portion are bent from the main body portion to the upright direction, and are electrically separated from each other by an opening provided in the main body portion; the LED chip is mounted on the surface of the main body portion of the lead frame Further, one of the LED chips is electrically connected to the pair of electrode portions individually, and the top side of the pair of electrode portions is used as an external electrode to constitute an LED package: a heat sink or a frame is mounted. The LED module device is formed on the back surface of the lead frame body portion. 8. The method of manufacturing an LED module device according to claim 7, wherein: a mounting substrate having an opening for mounting the LED package and forming a wiring; and a pair of electrode portions The LED package is attached to the opening of the mounting substrate such that the top side is connected to the wiring of the mounting substrate. 9. The method of manufacturing an LED module device according to claim 7, wherein: the LED package is made of a transparent resin for resin sealing. The method of manufacturing the LED module device according to the seventh aspect of the invention, wherein the main body portion of the lead frame is divided into two, and an LED chip is mounted on one of the main body portions, and the pair of the two One of the electrode portions is formed integrally. The method of manufacturing the LED module device according to the seventh aspect of the invention, wherein the body portion of the lead frame is divided into three, and the LED chip is mounted on the central body portion. And a body portion on the left and right sides, the body forming each of the pair of electrode portions. The method of manufacturing an LED module device according to claim 7, wherein: a back surface of at least one of the pair of electrode portions is cut into a specific thickness by half etching, and the foregoing is mounted thereon Insulate between the heat sink or the frame. The method of manufacturing an LED module device according to claim 8, wherein the opening is formed in the opening of the mounting substrate so as to face the light emitting surface of the LED chip. . S -24-
TW100100645A 2010-01-07 2011-01-07 Led module device and method for manufacturing same TW201140897A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010001951 2010-01-07
JP2010205151A JP2011159951A (en) 2010-01-07 2010-09-14 Led module device and method of manufacturing the same

Publications (1)

Publication Number Publication Date
TW201140897A true TW201140897A (en) 2011-11-16

Family

ID=44305440

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100100645A TW201140897A (en) 2010-01-07 2011-01-07 Led module device and method for manufacturing same

Country Status (3)

Country Link
JP (1) JP2011159951A (en)
TW (1) TW201140897A (en)
WO (1) WO2011083703A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI790406B (en) * 2018-10-31 2023-01-21 日商日亞化學工業股份有限公司 Light emitting device, light emitting module, method of manufacturing light emitting device and light emitting module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101677105B1 (en) * 2010-08-30 2016-11-17 삼성디스플레이 주식회사 Electronic component and manufacturing method for the same
CN102661492B (en) * 2012-03-27 2016-03-30 深圳市天祥太阳能技术发展有限公司 There is the LED of Whole-dismountable lamp holder
JP6355492B2 (en) 2013-10-03 2018-07-11 アルパッド株式会社 Composite resin and electronic device
US10355183B2 (en) 2015-09-18 2019-07-16 Rohm Co., Ltd. LED package
WO2017209143A1 (en) * 2016-05-31 2017-12-07 シチズン電子株式会社 Light emitting device and method for manufacturing same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0832106A (en) * 1994-07-14 1996-02-02 Toshiba Electron Eng Corp Optical semiconductor device and substrate mounting device
JP2003008079A (en) * 2001-06-27 2003-01-10 Toyoda Gosei Co Ltd Reflective optical device and its manufacturing method
JP2004311791A (en) * 2003-04-08 2004-11-04 Sharp Corp Lighting device, backlight and display
JP4180537B2 (en) * 2003-10-31 2008-11-12 シャープ株式会社 Optical element sealing structure, optical coupler, and optical element sealing method
JP2006019319A (en) * 2004-06-30 2006-01-19 C I Kasei Co Ltd Light-emitting diode assembly body and manufacturing method thereof
JP2007173791A (en) * 2005-11-22 2007-07-05 Matsushita Electric Ind Co Ltd Light-emitting module, manufacturing method thereof, and backlight device using the module
JP2007208061A (en) * 2006-02-02 2007-08-16 Sharp Corp Semiconductor light emitting element, manufacturing method thereof, and assembly thereof
JP2008034622A (en) * 2006-07-28 2008-02-14 Sharp Corp Semiconductor light-emitting element assembly

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI790406B (en) * 2018-10-31 2023-01-21 日商日亞化學工業股份有限公司 Light emitting device, light emitting module, method of manufacturing light emitting device and light emitting module

Also Published As

Publication number Publication date
JP2011159951A (en) 2011-08-18
WO2011083703A1 (en) 2011-07-14

Similar Documents

Publication Publication Date Title
JP3736366B2 (en) Surface mount type light emitting device and light emitting device using the same
KR101360732B1 (en) Led package
US7391153B2 (en) Light emitting device provided with a submount assembly for improved thermal dissipation
JP2004265986A (en) High luminance light emitting element, and method for manufacturing the same and light emitting device using the same
JP2004342870A (en) Light emitting diode to be driven with large current
US7586126B2 (en) Light emitting diode lighting module with improved heat dissipation structure
JP2004172170A (en) High luminance light emitting device and method of manufacturing the same
JP2003168829A (en) Light emitting device
JP4910220B1 (en) LED module device and manufacturing method thereof
JP2006005290A (en) Light emitting diode
JP2005158957A (en) Light emitting device
TW201140897A (en) Led module device and method for manufacturing same
JP2011228671A (en) Package for housing light emitting diode chips and manufacturing method for substrate of the same
JP2007073575A (en) Semiconductor light emitting device
TWI379445B (en)
WO2011057433A1 (en) Light emitting diode lamp bar and manufacture method thereof, light emitting diode lamp tube
JP2006012868A (en) Package for semiconductor light emitting element and semiconductor light emitting device using the same
JP2019071412A (en) Chip package
US10236429B2 (en) Mounting assembly and lighting device
US8138517B2 (en) Light-emitting diode package
US20200066943A1 (en) Light-emitting apparatus
US8079139B1 (en) Method for producing electro-thermal separation type light emitting diode support structure
JP2006073699A (en) Light emitting element accommodating package
JP2009071012A (en) Light emitting device, and manufacturing method thereof
JP2012049486A (en) Led package and manufacturing method therefor, and led module device configured of the same led package and manufacturing method therefor