JPH0832106A - Optical semiconductor device and substrate mounting device - Google Patents

Optical semiconductor device and substrate mounting device

Info

Publication number
JPH0832106A
JPH0832106A JP18523694A JP18523694A JPH0832106A JP H0832106 A JPH0832106 A JP H0832106A JP 18523694 A JP18523694 A JP 18523694A JP 18523694 A JP18523694 A JP 18523694A JP H0832106 A JPH0832106 A JP H0832106A
Authority
JP
Japan
Prior art keywords
light emitting
light
light receiving
optical semiconductor
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18523694A
Other languages
Japanese (ja)
Inventor
Masayuki Sugizaki
雅之 杉崎
Original Assignee
Toshiba Corp
Toshiba Electron Eng Corp
東芝電子エンジニアリング株式会社
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Electron Eng Corp, 東芝電子エンジニアリング株式会社, 株式会社東芝 filed Critical Toshiba Corp
Priority to JP18523694A priority Critical patent/JPH0832106A/en
Publication of JPH0832106A publication Critical patent/JPH0832106A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00, e.g. forming hybrid circuits
    • H01L25/167Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 and H01L51/00, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Abstract

PURPOSE:To accurately mount an optical semiconductor device which communicates with a circuit formed on a wiring board on the wiring board by aligning the optical axis of a light emitting section coincident with that of a light receiving section and directing the light emitting surface of the light emitting section and the light receiving surface of the light receiving section in the opposite directions. CONSTITUTION:The front ends of external leads 251 and 252 which are horizontally lead out from the package of an optical semiconductor device 20 and bent in easily connectable states are soldered to wiring 12. Since the center of the package is coincident with an optical axis positioned to the center of a through hole 11, a lens 241 for light emitting element formed at the center of the package is inserted into through light 11. On the opposite side of the lens 241 at the center of the package, a lens 242 for light receiving element is formed. Therefore, the optical semiconductor device 20 fitted to a wiring board 10 in such a way can make optical communication with a circuit formed on the upper or lower surface of a wiring board 10.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光ファイバーを用いな
いで短い距離の光空間伝送を行うための発光素子と受光
素子とを内蔵した光半導体装置とこれを実装した基板実
装装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical semiconductor device including a light emitting element and a light receiving element for performing optical space transmission over a short distance without using an optical fiber, and a substrate mounting apparatus mounting the same. .

【0002】[0002]

【従来の技術】光通信技術の信頼性が高まるに連れてこ
の技術に用いる光半導体装置の開発及びその応用が進ん
でいる。特に光半導体装置をプリント基板など配線基板
に搭載し、これをやはり光半導体装置を搭載した配線基
板と対向させ、2つの半導体装置間を光信号で連絡する
ことによって各配線基板に形成された回路間を電気的に
接続している。従来配線基板の回路間の通信を従来の電
気信号から光信号に変えることにより高速化する集積回
路に対して配線抵抗を低抵抗で対応することができる。
2. Description of the Related Art As the reliability of optical communication technology increases, the development and application of optical semiconductor devices used in this technology are progressing. In particular, a circuit formed on each wiring board by mounting the optical semiconductor device on a wiring board such as a printed circuit board, facing it with the wiring board also mounting the optical semiconductor device, and connecting two semiconductor devices with an optical signal. There is an electrical connection between them. By changing the communication between the circuits of the conventional wiring board from the conventional electric signal to the optical signal, it is possible to cope with the wiring resistance with a low resistance for the integrated circuit which is speeded up.

【0003】図18乃至図21を参照して従来の光半導
体装置を配線基板に実装した基板実装装置を説明する。
図18に示すように配線基板50は、例えば、プリント
配線基板からなり、光空間送信器或いは光空間受信器な
どの光半導体装置60が実装されている。光半導体装置
60は、そのパッケージ側面から水平に導出されパッケ
ージ内部の光半導体素子に電気的に接続された外部リー
ド65を備えている。そして、この外部リード65は、
配線基板50上に形成された配線パターン(図示せず)
に電気的に接続された半田付けなどで接続される。外部
リード65は水平に導出されてから一旦下方に折り曲げ
られ、再び先端部で水平に曲げられている。そして、そ
の先端部が配線パターンに接続している。したがってパ
ッケージは、外部リード65に支えられて宙に浮いてい
る。すなわちパッケージ底面は配線基板表面から離れて
いる。図19(a)は、配線基板に実装された光半導体
装置60の平面図、図19(b)は、その矢印D方向か
らの側面図、図19(c)は、図19(a)のC−C′
線に沿う部分の断面図である。
A conventional board mounting apparatus in which a conventional optical semiconductor device is mounted on a wiring board will be described with reference to FIGS.
As shown in FIG. 18, the wiring board 50 is formed of, for example, a printed wiring board, and an optical semiconductor device 60 such as an optical space transmitter or an optical space receiver is mounted thereon. The optical semiconductor device 60 includes an external lead 65 that is horizontally led out from the side surface of the package and electrically connected to an optical semiconductor element inside the package. The external lead 65 is
Wiring pattern (not shown) formed on the wiring board 50
It is electrically connected to, for example, by soldering. The external lead 65 is drawn out horizontally, then once bent downward, and again bent horizontally at the tip. And the tip part is connected to the wiring pattern. Therefore, the package is supported by the external leads 65 and floats in the air. That is, the package bottom surface is separated from the wiring board surface. 19A is a plan view of the optical semiconductor device 60 mounted on a wiring board, FIG. 19B is a side view from the arrow D direction, and FIG. 19C is a side view of FIG. 19A. C-C '
It is sectional drawing of the part which follows a line.

【0004】図19(a)及び図19(b)に示すよう
にパッケージ64はエポキシ樹脂などの透光性樹脂から
なる樹脂封止体から構成されている。パッケージ64の
向い合う2辺から1対の外部リード65が導出されてい
る。また、パッケージ64の上部にはパッケージ本体と
同じ材料から形成されるドーム型レンズ部641が形成
され、そのレンズの中心の垂直方向にパッケージ64内
部の光半導体素子の光軸が形成されている。さらに、図
19(c)において素子搭載部61の上に受光素子或い
は発光素子などの光半導体素子62が水平に載置されて
おり、その光軸は、光半導体素子62に垂直に形成され
ている。発光素子には、発光ダイオード(LED;Ligh
t Emitting Diode)や半導体レーザ(LD;Laser Diod
e)などが用いられ、受光素子には、フォトダイオード
(PD;Photo Diode)が通常用いられている。外部リー
ド65と連続的に繋がっている内部リード66は、素子
搭載部61と離隔して光半導体素子62に対向してお
り、その先端は、Au線などのボンディングワイヤ63
によって光半導体素子62の表面に形成された電極パッ
ド(図示せず)に電気的に接続されている。そして、素
子搭載部61、光半導体素子62、ボンディングワイヤ
63及び内部リード66は、透明樹脂のパッケージ64
にモールド成形されている。
As shown in FIGS. 19A and 19B, the package 64 is composed of a resin encapsulant made of a translucent resin such as an epoxy resin. A pair of external leads 65 are led out from two opposite sides of the package 64. A dome-shaped lens portion 641 made of the same material as the package body is formed on the upper portion of the package 64, and the optical axis of the optical semiconductor element inside the package 64 is formed in the direction perpendicular to the center of the lens. Further, in FIG. 19C, an optical semiconductor element 62 such as a light receiving element or a light emitting element is horizontally mounted on the element mounting portion 61, and its optical axis is formed perpendicular to the optical semiconductor element 62. There is. The light emitting element is a light emitting diode (LED).
t Emitting Diode) and laser diode (LD)
e) and the like are used, and a photo diode (PD) is usually used as a light receiving element. The inner lead 66, which is continuously connected to the outer lead 65, is opposed to the optical semiconductor element 62 while being separated from the element mounting portion 61, and its tip has a bonding wire 63 such as an Au wire.
Is electrically connected to an electrode pad (not shown) formed on the surface of the optical semiconductor element 62. The element mounting portion 61, the optical semiconductor element 62, the bonding wire 63, and the internal lead 66 are formed of a transparent resin package 64.
It is molded.

【0005】パッケージ64のドーム型レンズ部641
は、光半導体素子62の中央部の上部に形成されてお
り、素子62で発生した光はここから発光される。光軸
は、水平に配置された素子搭載部61及び光半導体素子
62とは直角に垂直方向に形成される。素子搭載部6
1、外部リード65及び内部リード66は、一体化され
たリードフレームから形成されるのが通常である。図2
0(a)及び図20(b)は、従来の光半導体装置を実
装した配線基板の2組または3組以上で行う光空間伝送
を説明する基板実装装置の断面図である。図20(a)
において、第1の配線基板51には、光空間送信器60
3と光空間受信器600とが実装されている。また第2
の配線基板52には、光空間送信器601と光空間受信
器602とが実装されている。そして2つの配線基板は
それぞれ送受信器を対向させて1対の送受信器で構成さ
れる光軸を2つ形成する。各配線基板には所定の機能を
備えた集積回路が形成されている。例えば、第1の配線
基板51を操作機能を有する親機とすると第2の配線基
板52は、操作される子機の組み合わせがあり、また、
第1の配線基板51を第1の電卓とし、第2の配線基板
を第2の電卓とする場合などがある。また、発光素子の
指向性を高くするには指向性の高いレンズを選択すれば
良い。
Dome type lens portion 641 of the package 64
Is formed in the upper part of the central portion of the optical semiconductor element 62, and the light generated in the element 62 is emitted from here. The optical axis is formed in the vertical direction at a right angle to the element mounting portion 61 and the optical semiconductor element 62 which are arranged horizontally. Element mounting part 6
1, the outer leads 65 and the inner leads 66 are usually formed from an integrated lead frame. Figure 2
FIGS. 0 (a) and 20 (b) are cross-sectional views of a board mounting device for explaining optical space transmission performed by two sets or three sets or more of wiring boards on which a conventional optical semiconductor device is mounted. Figure 20 (a)
In the first wiring board 51, the optical space transmitter 60
3 and the optical space receiver 600 are mounted. Also the second
An optical space transmitter 601 and an optical space receiver 602 are mounted on the wiring board 52 of FIG. The two wiring boards face each other to form two optical axes composed of a pair of transceivers. An integrated circuit having a predetermined function is formed on each wiring board. For example, when the first wiring board 51 is a master unit having an operation function, the second wiring board 52 has a combination of operated slave units, and
There is a case where the first wiring board 51 is used as a first calculator and the second wiring board is used as a second calculator. Further, in order to increase the directivity of the light emitting element, a lens having high directivity may be selected.

【0006】図20(b)では、前記第1及び第2の配
線基板51、52の間に第3の配線基板53を挿入し配
置している。第3の配線基板53には、基板両面に背中
合わせに取付けられた送受信器604〜607が2組形
成されている。これは1つの回路装置をこの3つの配線
基板で構成する場合において配線基板間を接続する例で
ある。
In FIG. 20B, a third wiring board 53 is inserted and arranged between the first and second wiring boards 51 and 52. On the third wiring board 53, two sets of transmitters / receivers 604 to 607 mounted back to back on both sides of the board are formed. This is an example in which wiring boards are connected to each other when one circuit device is configured by these three wiring boards.

【0007】[0007]

【発明が解決しようとする課題】従来は1対の配線基板
間の信号のやり取りが多かったが、回路装置が複雑化す
るにしたがって前述のような1つの回路基板が信号の授
受をすべき配線基板を3つもしくはそれ以上含む場合が
多くなっている。上記のように従来の基板実装装置は、
複数の配線基板に形成された送信器と受信器とを組合わ
せて光軸上に配置する構造になっているので、2組の光
軸上に精度良く光半導体装置を配置することは難しく、
精度が低い場合は伝送不良などの不都合が有った。また
3枚以上の配線基板間で通信する場合には、配線基板
は、両面配線を行う両面実装が必要になり、コストが高
くなる欠点が有る。さらに、3枚の配線基板のうち両端
の配線基板間を光信号で接続する場合には、中間の配線
基板の光軸周辺部分を開口し、その開口を通して両端の
配線基板間の光学的な接続を行っていた。
In the past, signals were often exchanged between a pair of wiring boards. However, as the circuit device becomes complicated, one circuit board as described above should exchange signals. In many cases, three or more substrates are included. As described above, the conventional board mounting device is
Since the transmitter and the receiver formed on a plurality of wiring boards are combined and arranged on the optical axis, it is difficult to accurately arrange the optical semiconductor devices on the two sets of optical axes.
If the accuracy was low, there were problems such as poor transmission. Further, in the case of communicating between three or more wiring boards, the wiring board requires double-sided mounting to perform double-sided wiring, which has a drawback of increasing cost. Further, when connecting the wiring boards at both ends of the three wiring boards by an optical signal, an opening is formed in the peripheral portion of the optical axis of the intermediate wiring board, and an optical connection is made between the wiring boards at both ends through the opening. Was going on.

【0008】本発明は、このような事情によりなされた
ものであり、1つの光軸に沿って光信号を受信し、か
つ、発信する配線基板間通信用半導体装置及び3枚以上
の配線基板間で通信する場合であっても、この配線基板
間を通信する光半導体装置を配線基板上で精度良く実装
することができ、また、3枚以上の配線基板間で通信す
る場合でも配線基板は片面配線の片面実装で済ませるこ
とができ、低コストで形成される基板実装装置を提供す
ることを目的としている。
The present invention has been made under such circumstances, and a semiconductor device for communication between wiring boards which receives and transmits an optical signal along one optical axis and between three or more wiring boards is provided. The optical semiconductor device that communicates between the wiring boards can be mounted on the wiring boards with high accuracy even when communicating with each other, and the wiring board has one side even when communicating with three or more wiring boards. It is an object of the present invention to provide a board mounting device which can be mounted on one side of wiring and can be formed at low cost.

【0009】[0009]

【課題を解決するための手段】本発明の光半導体装置
は、外部へ光を発する発光部を有する発光素子と、外部
からの光を受ける受光部を有する受光素子と、外部回路
の電気信号を前記発光素子に伝える第1のリードと、前
記受光部からの光信号を外部回路に電気信号として伝え
る第2のリードと、前記発光素子、前記受光素子、前記
第1のリードの一端を含む一部及び前記第2のリードの
一端を含む一部とを被覆し、少なくとも発光部及び受光
部を被覆する領域は透明である樹脂モールドパッケージ
とを備え、前記発光部の光軸と前記受光部の光軸とは一
致しており、かつ前記発光部の発光面と受光部の受光面
とは互いに反対方向を向いていることを特徴としてい
る。前記発光部の前記発光面及び前記受光部の前記受光
面もしくは前記受光面及び前記発光面のいずれか一方の
上に光軸がその中心にくるようにレンズが取り付けられ
このレンズは前記樹脂モールドパッケージと一体に形成
されているようにしても良い。前記発光素子と受光素子
とはそれぞれ2つづつ有しており、前記樹脂モールドパ
ッケージ内には、第1の発光素子と第1の受光素子とか
ら構成された第1の光軸と、第2の発光素子と第2の受
光素子とから構成された第2の光軸とを備えているよう
にしても良い。前記第1の発光素子の発光方向は前記第
2の発光素子の発光方向とは逆方向であるようにしても
良い。
SUMMARY OF THE INVENTION An optical semiconductor device of the present invention includes a light emitting element having a light emitting portion for emitting light to the outside, a light receiving element having a light receiving portion for receiving light from the outside, and an electric signal of an external circuit. A first lead for transmitting to the light emitting element, a second lead for transmitting an optical signal from the light receiving section to an external circuit as an electric signal, a light emitting element, the light receiving element, and one end of the first lead And a part including the one end of the second lead are covered, and at least a region covering the light emitting part and the light receiving part is provided with a transparent resin mold package, and the optical axis of the light emitting part and the light receiving part are provided. It is characterized in that they coincide with the optical axis, and that the light emitting surface of the light emitting portion and the light receiving surface of the light receiving portion face in opposite directions. A lens is mounted on one of the light emitting surface of the light emitting portion and the light receiving surface of the light receiving portion or the light receiving surface and the light emitting surface such that the optical axis is in the center thereof. It may be formed integrally with. Each of the light emitting element and the light receiving element has two, and the resin mold package has a first optical axis composed of the first light emitting element and the first light receiving element, and a second optical axis. It is also possible to have a second optical axis composed of the light emitting element and the second light receiving element. The light emitting direction of the first light emitting element may be opposite to the light emitting direction of the second light emitting element.

【0010】本発明の基板実装装置は、貫通孔を有し、
間隔を置いて配置積層された複数の配線基板と、前記配
線基板に実装され、光軸が前記貫通孔の内部を通過する
ように配置された光半導体装置とを備え、前記光半導体
装置は、外部へ光を発する発光部を有する発光素子と、
外部からの光を受ける受光部を有する受光素子と、外部
回路の電気信号を前記発光素子に伝える第1のリード
と、前記受光部からの光信号を外部回路に電気信号とし
て伝える第2のリードと、前記発光素子、前記受光素
子、前記第1のリードの一端を含む一部及び前記第2の
リードの一端を含む一部とを被覆し、少なくとも発光部
及び受光部を被覆する領域は透明である樹脂モールドパ
ッケージとを備えており、前記発光部の光軸と前記受光
部の光軸とは一致しており、かつ前記発光部の発光面と
受光部の受光面とは互いに反対方向を向いていることを
特徴としている。前記光半導体装置は、前記発光部の前
記発光面及び前記受光部の前記受光面もしくは前記受光
面及び前記発光面のいずれか一方の上に光軸がその中心
にくるようにレンズが取り付けられ、このレンズは、前
記樹脂モールドパッケージと一体成形されるようにして
も良い。
The board mounting apparatus of the present invention has a through hole,
A plurality of wiring boards arranged and stacked at intervals, and an optical semiconductor device mounted on the wiring board and arranged so that an optical axis passes through the inside of the through hole, the optical semiconductor device includes: A light emitting element having a light emitting portion that emits light to the outside,
A light receiving element having a light receiving section for receiving light from the outside, a first lead for transmitting an electric signal of an external circuit to the light emitting element, and a second lead for transmitting an optical signal from the light receiving section to the external circuit as an electric signal. And the light emitting element, the light receiving element, a part including one end of the first lead and a part including one end of the second lead, and at least a region covering the light emitting part and the light receiving part is transparent. A resin mold package that is, the optical axis of the light emitting unit and the optical axis of the light receiving unit are aligned, and the light emitting surface of the light emitting unit and the light receiving surface of the light receiving unit are in opposite directions. It is characterized by facing. In the optical semiconductor device, a lens is attached such that the optical axis is located at the center of the light emitting surface of the light emitting portion and the light receiving surface of the light receiving portion or the light receiving surface and the light emitting surface. The lens may be integrally molded with the resin mold package.

【0011】[0011]

【作用】配線基板に光軸の通る貫通孔を設け、光半導体
装置内に光軸を一致させるように受光素子と発光素子と
を配置し、かつ、発光素子の発光面と受光素子の受光面
とを互いに反対方向に向くように配置することによっ
て、3枚以上の配線基板間を通信する場合に、その中間
の配線基板を両面実装することなく容易に通信すること
ができる。また、光半導体装置は、上下1対の発光素子
/受光素子を1対並列させて樹脂モールドしているの
で、光軸間の精度が向上すると共に部品数が減少する。
The wiring substrate is provided with a through hole through which the optical axis passes, the light receiving element and the light emitting element are arranged in the optical semiconductor device so that the optical axes coincide with each other, and the light emitting surface of the light emitting element and the light receiving surface of the light receiving element. By arranging and so as to face in mutually opposite directions, when communicating between three or more wiring boards, it is possible to easily communicate without mounting the intermediate wiring board on both sides. Further, in the optical semiconductor device, since a pair of upper and lower light emitting elements / light receiving elements are arranged in parallel and resin-molded, the accuracy between the optical axes is improved and the number of parts is reduced.

【0012】[0012]

【実施例】以下、図面を参照して本発明の実施例を説明
する。まず、図1乃至図6を参照して第1の実施例を説
明する。図1は、本発明の光半導体装置を実装した基板
実装装置の断面図、図2(a)は、光半導体装置の上か
ら見た平面図、図2(b)は、図2(a)のA方向から
みた光半導体装置の側面図、図3(a)は、図2(a)
のB−B′線に沿う部分の断面図、図3(b)は、図2
(a)のC−C′線に沿う部分の断面図、図4は、光半
導体装置のパッケージ内部の発光素子部分の平面図、図
5は、光半導体装置のパッケージ内部の受光素子部分の
平面図及び図6は、光半導体装置を複数の配線基板に実
装した基板実装装置の断面図である。
Embodiments of the present invention will be described below with reference to the drawings. First, a first embodiment will be described with reference to FIGS. 1 is a cross-sectional view of a substrate mounting device on which the optical semiconductor device of the present invention is mounted, FIG. 2A is a plan view seen from above the optical semiconductor device, and FIG. 2B is FIG. 2A. 2A is a side view of the optical semiconductor device viewed from the direction A in FIG.
2 is a cross-sectional view of a portion taken along the line BB ′ of FIG.
FIG. 4A is a plan view of a light emitting element portion inside a package of an optical semiconductor device, and FIG. 5 is a plan view of a light receiving element portion inside a package of an optical semiconductor device. 6 and 6 are cross-sectional views of a board mounting device in which an optical semiconductor device is mounted on a plurality of wiring boards.

【0013】図1において配線基板10は、貫通孔11
を備えており、その周辺の電子部品(図示せず)が取り
付けられる基板表面(図の裏側)には配線12が形成さ
れている。光半導体装置20は、その光軸が貫通孔11
内部を通過する状態で実装される。すなわち、光半導体
装置20のパッケージ24から水平に導出し、接続し易
いように折り曲げられた外部リード25の先端が配線1
2に半田づけされている。パッケージ24の中心が貫通
孔11の中心に配置された光軸に沿っているので、この
パッケージ24の中心に形成された発光素子用レンズ2
41は貫通孔11の中に挿入される。同じパッケージ2
4の中心の発光素子用レンズ241の反対側には受光素
子用レンズ242が形成されている。この様に配線基板
10に取り付けた光半導体装置20は、この配線基板1
0の上または下に配置した配線基板(図示せず)に形成
された回路と前記配線基板10に形成された回路との通
信(信号の授受)を光学的に行われる。下の配線基板の
光半導体装置(図示せず)からの光信号は、光軸に沿っ
てこの配線基板10の光半導体装置20の受光素子用レ
ンズ242を介して光半導体装置20内の受光素子に伝
えられ、この受光素子から配線基板10に形成された回
路に電気信号として伝えられる。一方、配線基板10に
形成された回路からの信号は光信号として光半導体装置
20の発光素子から発光され、この光信号は、光軸に沿
って上の配線基板の光半導体装置(図示せず)によって
受光され、この配線基板に形成された回路に伝えられ
る。
In FIG. 1, the wiring board 10 has a through hole 11
The wiring 12 is formed on the front surface (back side of the drawing) of the substrate to which electronic components (not shown) around it are attached. The optical axis of the optical semiconductor device 20 is the through hole 11
It is implemented while passing through the inside. That is, the tips of the external leads 25, which are drawn out horizontally from the package 24 of the optical semiconductor device 20 and bent for easy connection, are the wirings 1.
Soldered to 2. Since the center of the package 24 is along the optical axis arranged at the center of the through hole 11, the light emitting element lens 2 formed at the center of the package 24
41 is inserted into the through hole 11. Same package 2
A light receiving element lens 242 is formed on the opposite side of the light emitting element lens 241 at the center of 4. The optical semiconductor device 20 thus mounted on the wiring board 10 is
Communication (signal transmission / reception) between a circuit formed on a wiring board (not shown) arranged above or below 0 and a circuit formed on the wiring board 10 is optically performed. An optical signal from an optical semiconductor device (not shown) on the lower wiring substrate passes through the light receiving element lens 242 of the optical semiconductor device 20 on the wiring substrate 10 along the optical axis, and the light receiving element in the optical semiconductor device 20. Is transmitted to the circuit formed on the wiring board 10 from this light receiving element as an electric signal. On the other hand, a signal from the circuit formed on the wiring board 10 is emitted as an optical signal from the light emitting element of the optical semiconductor device 20, and the optical signal is sent along the optical axis to the optical semiconductor device (not shown) on the wiring board above. ) And is transmitted to the circuit formed on this wiring board.

【0014】図3(a)及び図3(b)に示す様に、光
半導体装置20は、パッケージ24内に光半導体素子を
有し、光半導体素子は、LED(Light Emitted Diode)
やLD(Laser Diode )などの発光素子211とPD
(Photo Diode)などの受光素子212とからなり、その
光軸は、水平に配置された素子搭載部221、222に
水平に載置されたこれら光半導体素子211、212と
は垂直に交差している。発光素子211が取付けられて
いる素子搭載部221には、これに一体的にパッケージ
24内に配置された内部リード261が接続されてお
り、内部リード261は、パッケージ24外に導出され
る外部リード251と一体的に接続される。素子搭載部
221、外部リード251及び内部リード261は、第
1のリードフレームを成形して形成される。同様に、受
光素子212が取付けられている素子搭載部222に
は、これに一体的にパッケージ24内に配置された内部
リード262が接続されており、内部リード262は、
パッケージ24外に導出される外部リード252と一体
的に接続される。素子搭載部222、外部リード252
及び内部リード262は、第2のリードフレームを成形
して形成される。
As shown in FIGS. 3A and 3B, the optical semiconductor device 20 has an optical semiconductor element in a package 24, and the optical semiconductor element is an LED (Light Emitted Diode).
And a light emitting element 211 such as an LD (Laser Diode) and a PD
(Photo Diode) or the like, and its optical axis intersects vertically with these optical semiconductor elements 211 and 212 mounted horizontally on the element mounting portions 221 and 222 arranged horizontally. There is. An internal lead 261 arranged inside the package 24 is integrally connected to the element mounting portion 221 to which the light emitting element 211 is attached. The internal lead 261 is an external lead led out of the package 24. 251, and is integrally connected. The element mounting portion 221, the outer leads 251, and the inner leads 261 are formed by molding the first lead frame. Similarly, the element mounting portion 222 to which the light receiving element 212 is attached is connected to an internal lead 262 integrally arranged in the package 24, and the internal lead 262 is
It is connected integrally with an external lead 252 led out of the package 24. Element mounting portion 222, external lead 252
The inner leads 262 are formed by molding the second lead frame.

【0015】発光素子211及び受光素子212の光軸
は、一致し、かつ、反対方向に向うように配置されてい
る。ボンディングワイヤ23は、第1のリードフレーム
の素子搭載部221上の発光素子211の電極パッド
(図示せず)とこの素子搭載部221と連続的に繋がっ
ていない内部リード223とを電気的に接続し、素子搭
載部221と内部リード224とを電気的に接続してい
る。同じくボンディングワイヤ23は、第2のリードフ
レームの素子搭載部222上の受光素子212の電極パ
ッド(図示せず)とこの素子搭載部222と連続的に繋
がっていない内部リード225とを電気的に接続し、素
子搭載部222と内部リード226とを電気的に接続し
ている。パッケージ24は、例えば、エポキシ樹脂など
の透光性樹脂のモールド成形体から構成されており、発
光素子211及び受光素子212などの光半導体素子、
第1及び第2のリードフレームの素子搭載部221、2
22及び内部リード261、262を被覆している。
The optical axes of the light emitting element 211 and the light receiving element 212 are arranged so that they coincide with each other and face in opposite directions. The bonding wire 23 electrically connects the electrode pad (not shown) of the light emitting element 211 on the element mounting portion 221 of the first lead frame and the internal lead 223 which is not continuously connected to the element mounting portion 221. Then, the element mounting portion 221 and the internal lead 224 are electrically connected. Similarly, the bonding wire 23 electrically connects the electrode pad (not shown) of the light receiving element 212 on the element mounting portion 222 of the second lead frame and the internal lead 225 which is not continuously connected to the element mounting portion 222. Then, the element mounting portion 222 and the internal lead 226 are electrically connected. The package 24 is made of, for example, a molded body of a translucent resin such as an epoxy resin, and has an optical semiconductor element such as a light emitting element 211 and a light receiving element 212.
Element mounting portions 221 and 2 of the first and second lead frames
22 and the inner leads 261 and 262 are covered.

【0016】透光性樹脂のパッケージ24は、本体に一
体的にモールド成形されたドーム型レンズ241、24
2を有し、これらは、光軸方向に沿って互いに逆方向に
パッケージ24本体から突出している。ドーム型レンズ
は、発光素子の発光出力或いは受光素子の光エネルギー
を光軸中心に集中させるために形成される。ドーム型レ
ンズ部241は、少なくとも先端部が前記配線基板10
の貫通孔11に挿入されている。受光素子用レンズにし
ても発光素子用レンズにしても必ずこれら素子の上に形
成される。しかし、その大きさは任意であり、素子を必
ず覆っていれば良い。また、少し大きくして、それぞれ
の素子に付属している集積回路を被覆するようにしても
良い。この実施例では、集積回路は被覆されていない。
この光半導体装置20は、前述の様にパッケージ24か
ら外部リード251、252を導出している。外部リー
ド251、252は、パッケージ24の側部から水平に
導出されてからドーム型レンズ部241の突出方向に折
り曲げられ、その先端部分は再び水平に折り曲げられて
いる。そして、外部リード251、252は、配線基板
10の配線12に半田付けされる。光半導体装置20の
光軸は、ドーム型レンズ部の突出方向に平行に形成さ
れ、配線基板10表面とは、垂直の方向に形成される。
The translucent resin package 24 is a dome-shaped lens 241, 24 integrally molded with the main body.
2 and these protrude from the package 24 main body in mutually opposite directions along the optical axis direction. The dome-shaped lens is formed to concentrate the light emission output of the light emitting element or the light energy of the light receiving element on the optical axis center. At least the tip of the dome-shaped lens portion 241 is the wiring board 10 at least.
Is inserted into the through hole 11. Both the light-receiving element lens and the light-emitting element lens are always formed on these elements. However, its size is arbitrary, and it is sufficient that it covers the element. Also, it may be made a little larger so as to cover the integrated circuit attached to each element. In this example, the integrated circuit is uncoated.
In the optical semiconductor device 20, the external leads 251 and 252 are led out from the package 24 as described above. The external leads 251 and 252 are drawn out horizontally from the side portion of the package 24 and then bent in the protruding direction of the dome-shaped lens portion 241, and the tip portions thereof are bent again horizontally. Then, the external leads 251 and 252 are soldered to the wiring 12 of the wiring board 10. The optical axis of the optical semiconductor device 20 is formed parallel to the protruding direction of the dome-shaped lens portion, and is formed in the direction perpendicular to the surface of the wiring board 10.

【0017】この光半導体装置20は、通常の半導体装
置の製造方法と同様に、光半導体素子211、212の
ダイボンディング、ワイヤボンディング、パッケージン
グ、リードメッキ、リードカッティング、リードフォー
ミング工程等を経て製造される。図4及び図5は、パッ
ケージ24の内部構造を示している。図3(a)及び図
3(b)に示すように光半導体装置は発光素子と受光素
子とを備え、これらは光軸を揃えて上下に配置されてい
る。したがって、図4を用いて発光素子211が配置さ
れているパッケージ内部の平面を示し、図5を用いて受
光素子212が配置されている前図より下に有るパッケ
ージ内部の平面を示している。まず、光半導体装置20
のパッケージ24は、例えば、LEDからなる発光素子
211とその発光を制御する集積回路(IC)271を
備えている。集積回路271は、基板搭載部281に固
定され、入力端子とGND端子とを備えている。集積回
路271には、外部回路から信号が入力信号として入力
端子から入力される。発光素子211は5Vで動作され
る。発光素子211は、基板搭載部221に固定され、
5V端子を備えている。
This optical semiconductor device 20 is manufactured through the steps of die bonding, wire bonding, packaging, lead plating, lead cutting, lead forming, etc. of the optical semiconductor elements 211 and 212, as in the usual semiconductor device manufacturing method. To be done. 4 and 5 show the internal structure of the package 24. As shown in FIGS. 3A and 3B, the optical semiconductor device includes a light emitting element and a light receiving element, which are arranged vertically with their optical axes aligned. Therefore, FIG. 4 is used to show the plane inside the package in which the light emitting element 211 is arranged, and FIG. 5 is used to show the plane inside the package below the previous figure where the light receiving element 212 is arranged. First, the optical semiconductor device 20
The package 24 includes, for example, a light emitting element 211 including an LED and an integrated circuit (IC) 271 that controls the light emission. The integrated circuit 271 is fixed to the board mounting portion 281 and includes an input terminal and a GND terminal. A signal from an external circuit is input to the integrated circuit 271 from the input terminal as an input signal. The light emitting element 211 is operated at 5V. The light emitting element 211 is fixed to the board mounting portion 221,
It has a 5V terminal.

【0018】各端子は、外部リード251と内部リード
261とを備え、これらリードは、前記基板搭載部22
1、281とともに第1のリードフレーム(図示せず)
から形成される。一方、PDからなる受光素子212
は、その受光を制御する集積回路(IC)272を備え
ている。集積回路272は、基板搭載部282に固定さ
れ、出力端子とGND端子とを備えている。受光素子が
受けた外部からの光信号は、電気信号に変えられてから
集積回路272で制御されて出力端子から外部回路へ伝
えられる。受光素子212は5Vで動作される。受光素
子212は、基板搭載部222に固定され、5V端子を
備えている。各端子は、外部リード252と内部リード
262とを備え、これらリードは、前記基板搭載部22
2、282とともに第2のリードフレーム(図示せず)
から形成される。
Each terminal is provided with an external lead 251 and an internal lead 261, which are connected to the board mounting portion 22.
First lead frame (not shown) together with 1, 281
Formed from. On the other hand, the light receiving element 212 including a PD
Has an integrated circuit (IC) 272 for controlling the light reception. The integrated circuit 272 is fixed to the board mounting portion 282 and has an output terminal and a GND terminal. An external optical signal received by the light receiving element is converted into an electric signal, controlled by the integrated circuit 272, and transmitted from an output terminal to an external circuit. The light receiving element 212 is operated at 5V. The light receiving element 212 is fixed to the board mounting portion 222 and has a 5V terminal. Each terminal includes an external lead 252 and an internal lead 262, and these leads are connected to the board mounting portion 22.
Second lead frame (not shown) with 2, 282
Formed from.

【0019】図6は、この実施例の基板実装装置の断面
図であり、この基板実装装置を用いて行う光空間伝送を
説明している。この基板実装装置は、多数の配線基板か
ら構成されているが、この図では積層された中間の3枚
の配線基板について示し、その上下に更に他の配線基板
が積層されている。光空間伝送を説明するために3枚の
配線基板101、102、103を用いる。各配線基板
には、それぞれ2個づつの光半導体装置201と20
2、203と204、205と206が実装されてい
る。配線基板に実装されるこの基板の回路を構成する電
子部品は光半導体装置が取り付けられる配線基板表面に
取り付けられる。この実装に際して各光半導体装置のド
ーム型レンズ241又はドーム型レンズ242は、配線
基板101〜103の貫通孔11内に突出するように配
置され、各光半導体装置の光軸は、貫通孔11内を平行
に貫抜くように形成されている。配線基板101〜10
3は、等間隔に平行に配置されており、各配線基板10
1〜103に形成された2個の貫通孔11は、互いに重
なり合うようになっている。そして貫通孔11には各光
半導体装置の光軸が形成されているので、3つの配線基
板101〜103には、各光半導体装置の光軸を含む2
本の光軸1及び光軸2が形成されことになる。光軸上の
光信号が伝送される向きは、光軸1が下から上に向けら
れ、光軸2が上から下に向けられており、双方向伝送が
できるようになっている。
FIG. 6 is a cross-sectional view of the board mounting apparatus of this embodiment, which illustrates optical space transmission performed using this board mounting apparatus. This board mounting device is composed of a large number of wiring boards, but in this figure, three wiring boards in the middle are shown, and another wiring board is further stacked above and below the wiring board. Three wiring boards 101, 102, and 103 are used to describe the optical space transmission. Two optical semiconductor devices 201 and 20 are provided on each wiring board.
2, 203 and 204, 205 and 206 are installed. The electronic components constituting the circuit of the wiring board mounted on the wiring board are mounted on the surface of the wiring board on which the optical semiconductor device is mounted. At the time of this mounting, the dome-shaped lens 241 or the dome-shaped lens 242 of each optical semiconductor device is arranged so as to project into the through hole 11 of the wiring boards 101 to 103, and the optical axis of each optical semiconductor device is inside the through hole 11. Are formed so as to penetrate through in parallel. Wiring boards 101-10
3 are arranged in parallel at equal intervals, and each wiring board 10
The two through holes 11 formed in Nos. 1 to 103 overlap each other. Since the optical axis of each optical semiconductor device is formed in the through hole 11, the three wiring boards 101 to 103 include the optical axis of each optical semiconductor device.
The optical axis 1 and the optical axis 2 of the book are formed. The optical signals on the optical axis are transmitted in such a manner that the optical axis 1 is directed from the bottom to the top and the optical axis 2 is directed from the top to the bottom so that bidirectional transmission is possible.

【0020】図7は、配線基板101の平面図であり、
配線基板間の信号を通信する光半導体装置の配置を説明
するものである。図に示すように1対の光半導体装置は
近接して他の電子部品が実装されていない領域に取り付
けられている。図では、配線基板の角部に形成されてい
るが、他の電子部品が実装されていない領域であれば配
線基板の辺中央でも良く、配線基板中心部も良い。本発
明の基板実装装置によれば、1対の発光素子と受光素子
とを光軸を一致させた状態で備えた光半導体装置をレン
ズが配線基板の貫通孔内に配置されるように実装されて
いるので、積層された配線基板の内、積層内の配線基板
は電子部品を両面実装する必要はなく片面配線の片面実
装で済むので、低コストが実現できる。また、2組の光
軸に精度良く光半導体装置を配置出来る。
FIG. 7 is a plan view of the wiring board 101.
The arrangement of an optical semiconductor device that communicates signals between wiring boards is described. As shown in the figure, the pair of optical semiconductor devices are mounted close to each other in a region where no other electronic component is mounted. In the figure, it is formed at the corner of the wiring board, but it may be at the center of the side of the wiring board or at the center of the wiring board as long as it is a region where no other electronic component is mounted. According to the board mounting apparatus of the present invention, an optical semiconductor device having a pair of a light emitting element and a light receiving element with their optical axes aligned with each other is mounted so that the lens is arranged in the through hole of the wiring board. Therefore, among the laminated wiring boards, it is not necessary to mount electronic components on both surfaces of the wiring boards in the lamination, and only one-sided wiring can be mounted on one side, so that low cost can be realized. Further, the optical semiconductor device can be accurately arranged on the two sets of optical axes.

【0021】図8乃至図10にこの実施例の光半導体装
置の外装とパッケージ内部の1断面を示す。図8は、光
半導体装置のパッケージ上部の平面図、図9(a)は、
図8のB方向から見た側面図、図9(b)は、図8のC
方向から見た側面図、図10(a)は、図8のパッケー
ジ下部の平面図、図10(b)は、図8のA−A′線に
沿う部分の断面図である。この図は図6に用い配線基板
に取付けた、例えば、光半導体装置202を示してい
る。樹脂封止体パッケージ24は基板搭載部221によ
って支持された発光素子211を被覆するレンズ241
及び基板搭載部222によって支持された受光素子21
2を被覆するレンズ242を備えている。パッケージ2
4からは発光素子側の外部リード251及び受光素子側
の外部リード252がそれぞれ導出している。
8 to 10 show a cross section of the exterior and package of the optical semiconductor device of this embodiment. FIG. 8 is a plan view of the upper part of the package of the optical semiconductor device, and FIG.
8 is a side view seen from the direction B of FIG. 8, and FIG. 9B is a side view of FIG.
10A is a side view seen from the direction, FIG. 10A is a plan view of the lower portion of the package of FIG. 8, and FIG. 10B is a cross-sectional view of a portion taken along the line AA ′ of FIG. This figure shows, for example, an optical semiconductor device 202 attached to the wiring substrate used in FIG. The resin encapsulation package 24 includes a lens 241 that covers the light emitting element 211 supported by the substrate mounting portion 221.
And the light receiving element 21 supported by the board mounting portion 222
2 is provided with a lens 242. Package 2
An external lead 251 on the light emitting element side and an external lead 252 on the light receiving element side are led out from FIG.

【0022】次に、図11を参照して第2の実施例を説
明する。図は、光半導体装置の断面図である。本発明の
基板実装装置は、光軸を一致させた1対の発光素子と受
光素子(以下、発光/受光素子という)から構成された
1対の光半導体装置を積層する各配線基板に取り付け、
その光軸を一致させることに特徴がある。光半導体装置
を配線基板に取り付けるには、配線基板の貫通孔に光軸
が来るように配置する。この実施例では、光半導体装置
に1対の発光/受光素子を用いたことに特徴がある。こ
のような構造の光半導体装置を配線基板に取り付けるの
で、1対の光軸間の距離を予め正確に決めることができ
る。図は、配線基板への取り付け面を上にしている。光
軸1には、第1の発光/受光素子が配置され、この素子
は、基板搭載部223に支持された第1の発光素子21
3とその下に配置され、基板搭載部224に支持された
第1の受光素子214から構成されている。第1の発光
素子213は、基板搭載部283に支持された集積回路
273に電気的に接続され、第1の受光素子214は、
基板搭載部284に支持された集積回路274に電気的
に接続されている。
Next, a second embodiment will be described with reference to FIG. The figure is a cross-sectional view of an optical semiconductor device. The board mounting apparatus of the present invention is mounted on each wiring board on which a pair of optical semiconductor devices, each of which is composed of a pair of light emitting elements and light receiving elements (hereinafter, referred to as light emitting / light receiving elements) whose optical axes are aligned, is laminated,
It is characterized by matching the optical axes. In order to attach the optical semiconductor device to the wiring board, the optical axis is placed in the through hole of the wiring board. This embodiment is characterized by using a pair of light emitting / receiving elements in the optical semiconductor device. Since the optical semiconductor device having such a structure is attached to the wiring board, the distance between the pair of optical axes can be accurately determined in advance. In the figure, the mounting surface on the wiring board is facing up. A first light emitting / receiving element is arranged on the optical axis 1, and this element is the first light emitting element 21 supported by the board mounting portion 223.
3 and a first light receiving element 214 that is arranged below the light receiving element 3 and is supported by the substrate mounting portion 224. The first light emitting element 213 is electrically connected to the integrated circuit 273 supported by the substrate mounting portion 283, and the first light receiving element 214 is
It is electrically connected to the integrated circuit 274 supported by the substrate mounting portion 284.

【0023】光軸2には、第2の発光/受光素子が配置
され、この素子は、第2の発光素子215とその上に配
置された第2の受光素子216から構成されている。こ
の素子は基板搭載部225に支持された第2の発光素子
215とその上に配置され、基板搭載部226に支持さ
れた第2の受光素子216から構成されている。第2の
発光素子215は、基板搭載部285に支持された集積
回路275に電気的に接続され、第2の受光素子216
は、基板搭載部286に支持された集積回路276に電
気的に接続されている。第2の発光/受光素子が第1の
発光/受光素子に対して発光素子と受光素子の位置が上
下逆になっているので、両発光/受光素子の発光方向及
び受光方向はそれぞれ逆になっている。本発明では、第
2の実施例のような1対の発光/受光素子を用いる光半
導体装置において、第1及び第2の発光/受光素子の発
光方向若しくは受光方向を互いに逆にする必要はない。
この発光方向若しくは受光方向を同じにすることができ
る。このような光半導体装置は、配線基板の回路間を複
数の通信手段で結ぶ基板実装装置に適用することができ
る。
A second light emitting / receiving element is arranged on the optical axis 2, and this element is composed of a second light emitting element 215 and a second light receiving element 216 arranged thereon. This element is composed of a second light emitting element 215 supported by the substrate mounting portion 225 and a second light receiving element 216 arranged thereon and supported by the substrate mounting portion 226. The second light emitting element 215 is electrically connected to the integrated circuit 275 supported by the substrate mounting portion 285, and the second light receiving element 216.
Are electrically connected to the integrated circuit 276 supported by the substrate mounting portion 286. Since the positions of the light emitting element and the light receiving element of the second light emitting / light receiving element are upside down with respect to the first light emitting / light receiving element, the light emitting direction and the light receiving direction of both light emitting / light receiving elements are opposite. ing. In the present invention, in the optical semiconductor device using the pair of light emitting / receiving elements as in the second embodiment, it is not necessary to reverse the light emitting direction or the light receiving direction of the first and second light emitting / receiving elements. .
The light emitting direction or the light receiving direction can be the same. Such an optical semiconductor device can be applied to a board mounting device that connects circuits of a wiring board by a plurality of communication means.

【0024】次に、図12乃至図14を用いて、この実
施例の光半導体装置の外装とパッケージ内部の1断面を
示す。図12は、光半導体装置のパッケージ上部の平面
図、図13(a)は図12のB方向から見た側面図、図
13(b)は、図12のC方向から見た側面図、図14
(a)は、図12のパッケージ下部の平面図、図14
(b)は、図12のA−A′線に沿う部分の断面図であ
る。これらの図は、図11の光半導体装置の外装を示し
ている。樹脂封止体パッケージ24は、基板搭載部22
3によって支持された発光素子213を被覆するレンズ
243、基板搭載部224によって支持された受光素子
214を被覆するレンズ244、基板搭載部225によ
って支持された発光素子215を被覆するレンズ24
5、基板搭載部226によって支持された受光素子21
6を被覆するレンズ246を備えている。パッケージ2
4からは発光素子側の外部リード253、255及び受
光素子側の外部リード254、256がそれぞれ導出し
ている。
Next, with reference to FIGS. 12 to 14, one cross section of the package and the package of the optical semiconductor device of this embodiment is shown. 12 is a plan view of the upper part of the package of the optical semiconductor device, FIG. 13 (a) is a side view seen from the direction B in FIG. 12, and FIG. 13 (b) is a side view seen from the direction C in FIG. 14
FIG. 14A is a plan view of the lower portion of the package of FIG.
12B is a sectional view of a portion taken along the line AA ′ in FIG. These figures show the exterior of the optical semiconductor device of FIG. The resin encapsulation package 24 includes the board mounting portion 22.
The lens 243 which covers the light emitting element 213 supported by the lens 3, the lens 244 which covers the light receiving element 214 which is supported by the substrate mounting portion 224, and the lens 24 which covers the light emitting element 215 which is supported by the substrate mounting portion 225.
5, the light receiving element 21 supported by the board mounting portion 226
6 is provided with a lens 246. Package 2
External leads 253 and 255 on the light emitting element side and external leads 254 and 256 on the light receiving element side are led out from FIG. 4, respectively.

【0025】次に、図15を参照して第3の実施例を説
明する。図は、基板実装装置の断面図である。この実施
例の基板実装装置は、3枚の積層された配線基板から構
成されている。上下の配線基板104、105には、従
来の光半導体装置が搭載されている。上の配線基板10
4は、信号をその上に送ったり、上から受ける必要はな
く、下の配線基板105はその下に信号を送ったり、下
から受ける必要はない。したがって、従来の光半導体装
置を貫通孔のない従来の配線基板に取り付けたものを上
下の配線基板とする事ができる。上の配線基板104に
は、その下面に受光素子600と発光素子603が取り
付けられている。また、下の配線基板105には、その
上面に発光素子601と受光素子602が取り付けられ
ている。上下の配線基板104、105の間に本発明に
係る配線基板106が配置され、この配線基板には、1
対の発光/受光素子を備えた本発明に係る光半導体装置
が取り付けられている。
Next, a third embodiment will be described with reference to FIG. The figure is a cross-sectional view of the substrate mounting apparatus. The board mounting apparatus of this embodiment is composed of three laminated wiring boards. Conventional optical semiconductor devices are mounted on the upper and lower wiring boards 104 and 105. Upper wiring board 10
No. 4 does not need to send a signal to it or receive it from above, and the wiring board 105 below does not need to send a signal below it or receive it from below. Therefore, the conventional optical semiconductor device mounted on the conventional wiring substrate having no through hole can be used as the upper and lower wiring substrates. The light receiving element 600 and the light emitting element 603 are attached to the lower surface of the upper wiring board 104. A light emitting element 601 and a light receiving element 602 are attached to the upper surface of the lower wiring board 105. The wiring board 106 according to the present invention is arranged between the upper and lower wiring boards 104 and 105.
An optical semiconductor device according to the present invention having a pair of light emitting / receiving elements is attached.

【0026】配線基板106には、1対の貫通孔11が
形成されており、貫通孔11には、下から光半導体装置
207、208のレンズが挿入されている。左側は、発
光用レンズ、右側には受光用レンズが挿入されている。
図示はしないが、配線基板104、106にはその回路
を構成する電子部品が基板下面に形成され、配線基板1
05にはその回路を構成する電子部品が基板上面に形成
されている。この実施例では、光軸間距離を正確に一定
にすることができる。この実施例に用いる光半導体装置
には第2の実施例に用いた1対の発光/受光素子を有す
るレンズが上面及び下面に2つづつ形成したものを用い
ても良い。
A pair of through holes 11 are formed in the wiring board 106, and the lenses of the optical semiconductor devices 207 and 208 are inserted into the through holes 11 from below. A light emitting lens is inserted on the left side, and a light receiving lens is inserted on the right side.
Although not shown in the drawing, the wiring boards 104 and 106 are provided with electronic components constituting the circuits on the bottom surface of the wiring board 1 and the wiring board 1
In 05, electronic components that form the circuit are formed on the upper surface of the substrate. In this embodiment, the distance between the optical axes can be made exactly constant. The optical semiconductor device used in this embodiment may be one having two lenses each having a pair of light emitting / receiving elements used in the second embodiment formed on the upper surface and the lower surface.

【0027】次に、図16を参照して第4の実施例を説
明する。この実施例は、受光素子の受光面にレンズを形
成しないことに特徴がある。図は、光半導体装置の断面
図である。この実施例では、他の実施例と同様に光半導
体装置が光軸を一致させた1対の発光/受光素子から構
成されている。この発光素子217及び受光素子218
をその光軸を一致させる様に上下に配置し、これら素子
は、リードフレームから形成した素子搭載部227、2
28で支持され、入力信号及び出力信号を入出力するリ
ード257、258を備えている。光半導体装置を配線
基板に取り付けるには、配線基板の貫通孔に光軸が来る
ように配置する。この1対の発光/受光素子、素子搭載
部及びリードの一部は樹脂モールドパッケージ24に被
覆されている。樹脂モールドパッケージ24の一部がレ
ンズ247になっていて発光素子217の発光面上部に
配置されている。受光面にはレンズが施されていない。
受光は発光ほど指向性を必要としないので、高精度を要
求されない受光面にはレンズを施さない場合も可能であ
る。このような構造の光半導体装置を配線基板に取り付
けるので、基板実装装置はレンズを少なくしたので、小
形化を可能にする。
Next, a fourth embodiment will be described with reference to FIG. This embodiment is characterized in that no lens is formed on the light receiving surface of the light receiving element. The figure is a cross-sectional view of an optical semiconductor device. In this embodiment, like the other embodiments, the optical semiconductor device is composed of a pair of light emitting / receiving elements whose optical axes are aligned. The light emitting element 217 and the light receiving element 218
Are arranged above and below so that their optical axes coincide with each other, and these elements are formed by a lead frame.
It is equipped with leads 257 and 258 which are supported by 28 and which input and output input signals and output signals. In order to attach the optical semiconductor device to the wiring board, the optical axis is placed in the through hole of the wiring board. The resin mold package 24 covers the pair of light emitting / receiving elements, the element mounting portion, and part of the leads. A part of the resin mold package 24 serves as a lens 247 and is arranged above the light emitting surface of the light emitting element 217. No lens is applied to the light-receiving surface.
Since light reception does not require directivity as much as light emission, it is possible to provide a lens on the light receiving surface that does not require high accuracy. Since the optical semiconductor device having such a structure is attached to the wiring substrate, the substrate mounting device has a reduced number of lenses, which enables downsizing.

【0028】次に、図17を参照して第5の実施例を説
明する。この実施例は、発光素子の発光面及び受光素子
の受光面にレンズを形成しないことに特徴がある。図
は、光半導体装置の断面図である。この実施例では、他
の実施例と同様に光半導体装置が光軸を一致させた1対
の発光/受光素子から構成されている。この発光素子2
19及び受光素子220をその光軸を一致させる様に上
下に配置し、これら素子はリードフレームから形成した
素子搭載部229、230で支持され、入力信号及び出
力信号を入出力するリード259、260を備えてい
る。光半導体装置を配線基板に取り付けるには、配線基
板の貫通孔に光軸が来るように配置する。この1対の発
光/受光素子、素子搭載部及びリードの一部は樹脂モー
ルドパッケージ24に被覆されている。樹脂モールドパ
ッケージ24には光半導体装置に高度の指向性を求めな
い場合は、この様にレンズを配置する必要はない。この
ような構造の光半導体装置を配線基板に取り付けるの
で、基板実装装置はレンズがなく薄型化、小形化を可能
にする。
Next, a fifth embodiment will be described with reference to FIG. This embodiment is characterized in that lenses are not formed on the light emitting surface of the light emitting element and the light receiving surface of the light receiving element. The figure is a cross-sectional view of an optical semiconductor device. In this embodiment, like the other embodiments, the optical semiconductor device is composed of a pair of light emitting / receiving elements whose optical axes are aligned. This light emitting element 2
19 and the light receiving element 220 are vertically arranged so that their optical axes coincide with each other, and these elements are supported by element mounting portions 229 and 230 formed from a lead frame, and leads 259 and 260 for inputting and outputting an input signal and an output signal. Is equipped with. In order to attach the optical semiconductor device to the wiring board, the optical axis is placed in the through hole of the wiring board. The resin mold package 24 covers the pair of light emitting / receiving elements, the element mounting portion, and part of the leads. If the resin mold package 24 does not require a high degree of directivity in the optical semiconductor device, it is not necessary to dispose the lens in this way. Since the optical semiconductor device having such a structure is attached to the wiring board, the board mounting apparatus has no lens and can be made thin and small.

【0029】[0029]

【発明の効果】以上、本発明によれば、光半導体装置を
複数の配線基板上に光軸が一致するように精度良く実装
することができ、また、3枚以上の配線基板間で通信す
る場合でも配線基板は、片面配線による片面実装で済ま
せることができるので、低コストの基板実装装置を得る
ことができる。
As described above, according to the present invention, an optical semiconductor device can be mounted on a plurality of wiring boards with high accuracy so that the optical axes thereof coincide with each other, and communication is performed between three or more wiring boards. Even in this case, the wiring board can be mounted on one side by single-sided wiring, so that a low-cost board mounting device can be obtained.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の第1の実施例の配線基板に取付けた光
装置の断面図。
FIG. 1 is a cross-sectional view of an optical device mounted on a wiring board according to a first embodiment of the present invention.

【図2】図1の光半導体装置の平面図及びA方向から見
た光半導体装置の側面図。
FIG. 2 is a plan view of the optical semiconductor device of FIG. 1 and a side view of the optical semiconductor device as seen from the direction A.

【図3】図2のB−B′線に沿う部分の断面図及びC−
C′線に沿う部分の断面図。
3 is a cross-sectional view of a portion along line BB ′ in FIG. 2 and C-
Sectional drawing of the part which follows the C'line.

【図4】図3のパッケージ内部の発光素子部分の平面
図。
FIG. 4 is a plan view of a light emitting element portion inside the package of FIG.

【図5】図3のパッケージ内部の受光素子部分の平面
図。
5 is a plan view of a light receiving element portion inside the package of FIG.

【図6】光半導体装置を取付けた配線基板の断面図。FIG. 6 is a sectional view of a wiring board to which an optical semiconductor device is attached.

【図7】光半導体装置を取付けた配線基板の平面図。FIG. 7 is a plan view of a wiring board to which an optical semiconductor device is attached.

【図8】第1の実施例の光半導体装置の上部を示す平面
図。
FIG. 8 is a plan view showing the upper portion of the optical semiconductor device of the first embodiment.

【図9】図8のB方向及びC方向から見た光半導体装置
の側面図。
9 is a side view of the optical semiconductor device viewed from the B direction and the C direction in FIG.

【図10】図8の光半導体装置の底部を示す平面図及び
断面図。
10 is a plan view and a cross-sectional view showing the bottom of the optical semiconductor device of FIG.

【図11】第2の実施例の光半導体装置の断面図。FIG. 11 is a sectional view of an optical semiconductor device according to a second embodiment.

【図12】第2の実施例の光半導体装置の上部を示す平
面図。
FIG. 12 is a plan view showing an upper portion of an optical semiconductor device according to a second embodiment.

【図13】図12のB方向及びC方向から見た光半導体
装置の側面図。
13 is a side view of the optical semiconductor device as seen from the B direction and the C direction in FIG.

【図14】図12の光半導体装置の底部を示す平面図及
び図12のA−A′線に沿う部分の断面図。
14 is a plan view showing the bottom of the optical semiconductor device of FIG. 12 and a cross-sectional view of a portion taken along the line AA ′ of FIG.

【図15】第3の実施例の基板実装装置の断面図。FIG. 15 is a sectional view of a board mounting apparatus according to a third embodiment.

【図16】第4の実施例の光半導体装置の断面図。FIG. 16 is a sectional view of an optical semiconductor device according to a fourth embodiment.

【図17】第5の実施例の光半導体装置の断面図。FIG. 17 is a sectional view of an optical semiconductor device according to a fifth embodiment.

【図18】従来の配線基板に取付けた光半導体装置の断
面図。
FIG. 18 is a cross-sectional view of an optical semiconductor device mounted on a conventional wiring board.

【図19】図18の光半導体装置の平面図、D方向から
見た側面図及びC−C′線に沿う部分の断面図。
19 is a plan view of the optical semiconductor device of FIG. 18, a side view seen from the direction D, and a cross-sectional view of a portion along the line CC ′.

【図20】従来の基板実装装置の断面図。FIG. 20 is a cross-sectional view of a conventional board mounting device.

【図21】従来の基板実装装置の断面図。FIG. 21 is a sectional view of a conventional board mounting device.

【符号の説明】[Explanation of symbols]

10、101、102、103、104、105、10
6 配線基板 11 貫通孔 12 配線 20、201、202、203、204、205、20
6、207、208光半導体装置 23 ボンディングワイヤ 24 樹脂封止体 25、251、252、253、254、255、25
6、257、258、259、260 外部リード 211、213、215、217、219 発光素
子 212、214、216、218、220 受光素
子 221、222、223、224、225、226、2
81、282、283、284、285、286
基板搭載部 241、242、243、244、245、246、2
47 レンズ 261、262、263、264、265、266、2
67、268、269、270 内部リード 271、272、273、274、275、276
集積回路 600、602 受信装置 601、603 発信装置
10, 101, 102, 103, 104, 105, 10
6 Wiring Board 11 Through Hole 12 Wiring 20, 201, 202, 203, 204, 205, 20
6, 207, 208 Optical semiconductor device 23 Bonding wire 24 Resin sealing body 25, 251, 252, 253, 254, 255, 25
6, 257, 258, 259, 260 External leads 211, 213, 215, 217, 219 Light emitting element 212, 214, 216, 218, 220 Light receiving element 221, 222, 223, 224, 225, 226, 2
81, 282, 283, 284, 285, 286
Substrate mounting part 241, 242, 243, 244, 245, 246, 2
47 lenses 261, 262, 263, 264, 265, 266, 2
67, 268, 269, 270 Internal lead 271, 272, 273, 274, 275, 276
Integrated circuit 600, 602 Receiver 601, 603 Transmitter

Claims (6)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 外部へ光を発する発光部を有する発光素
    子と、 外部からの光を受ける受光部を有する受光素子と、 外部回路の電気信号を前記発光素子に伝える第1のリー
    ドと、 前記受光部からの光信号を外部回路に電気信号として伝
    える第2のリードと、 前記発光素子、前記受光素子、前記第1のリードの一端
    を含む一部及び前記第2のリードの一端を含む一部とを
    被覆し、少なくとも発光部及び受光部を被覆する領域は
    透明である樹脂モールドパッケージとを備え、 前記発光部の光軸と前記受光部の光軸とは一致してお
    り、かつ前記発光部の発光面と受光部の受光面とは互い
    に反対方向を向いていることを特徴とする光半導体装
    置。
    1. A light emitting element having a light emitting portion for emitting light to the outside, a light receiving element having a light receiving portion for receiving light from the outside, a first lead for transmitting an electric signal of an external circuit to the light emitting element, A second lead for transmitting an optical signal from the light receiving portion to an external circuit as an electric signal; a part including the light emitting element, the light receiving element, one end of the first lead and one end of the second lead; A resin mold package that is transparent at least in a region that covers the light emitting unit and the light receiving unit, and the optical axis of the light emitting unit and the optical axis of the light receiving unit are coincident with each other, and An optical semiconductor device, wherein the light emitting surface of the light receiving portion and the light receiving surface of the light receiving portion face in mutually opposite directions.
  2. 【請求項2】 前記発光部の前記発光面及び前記受光部
    の前記受光面もしくは前記受光面及び前記発光面のいず
    れか一方の上に光軸がその中心にくるようにレンズが取
    り付けられ、このレンズは前記樹脂モールドパッケージ
    と一体に形成されていることを特徴とする請求項1に記
    載の光半導体装置。
    2. A lens is attached on either one of the light emitting surface of the light emitting portion and the light receiving surface of the light receiving portion or on the light receiving surface or the light emitting surface such that the optical axis is in the center thereof. The optical semiconductor device according to claim 1, wherein the lens is formed integrally with the resin mold package.
  3. 【請求項3】 前記発光素子と受光素子とはそれぞれ2
    つづつ有しており、前記樹脂モールドパッケージ内に
    は、第1の発光素子と第1の受光素子とから構成された
    第1の光軸と、第2の発光素子と第2の受光素子とから
    構成された第2の光軸とを備えていることを特徴とする
    請求項1又は請求項2に記載の光半導体装置。
    3. The light emitting element and the light receiving element are each 2
    Each of them has a first optical axis composed of a first light emitting element and a first light receiving element, a second light emitting element and a second light receiving element in the resin mold package. The optical semiconductor device according to claim 1 or 2, further comprising:
  4. 【請求項4】 前記第1の発光素子の発光方向は前記第
    2の発光素子の発光方向とは逆方向であることを特徴と
    する請求項3に記載の光半導体装置。
    4. The optical semiconductor device according to claim 3, wherein the light emitting direction of the first light emitting element is opposite to the light emitting direction of the second light emitting element.
  5. 【請求項5】 貫通孔を有し、間隔を置いて配置積層さ
    れた複数の配線基板と、 前記配線基板に実装され、光軸が前記貫通孔の内部を通
    過するように配置された光半導体装置とを備え、 前記光半導体装置は、外部へ光を発する発光部を有する
    発光素子と、 外部からの光を受ける受光部を有する受光素子と、 外部回路の電気信号を前記発光素子に伝える第1のリー
    ドと、 前記受光部からの光信号を外部回路に電気信号として伝
    える第2のリードと、 前記発光素子、前記受光素子、前記第1のリードの一端
    を含む一部及び前記第2のリードの一端を含む一部とを
    被覆し、少なくとも発光部及び受光部を被覆する領域は
    透明である樹脂モールドパッケージとを備えており、 前記発光部の光軸と前記受光部の光軸とは一致してお
    り、かつ前記発光部の発光面と受光部の受光面とは互い
    に反対方向を向いていることを特徴とする基板実装装
    置。
    5. A plurality of wiring boards having through holes, arranged and stacked at intervals, and an optical semiconductor mounted on the wiring boards and arranged so that an optical axis passes through the inside of the through holes. The optical semiconductor device includes a light emitting element having a light emitting portion for emitting light to the outside, a light receiving element having a light receiving portion for receiving light from the outside, and an optical signal for transmitting an electric signal of an external circuit to the light emitting element. One lead, a second lead for transmitting an optical signal from the light receiving section to an external circuit as an electric signal, the light emitting element, the light receiving element, a part including one end of the first lead, and the second lead A part including the one end of the lead is covered, and at least a region covering the light emitting part and the light receiving part is provided with a transparent resin mold package, and the optical axis of the light emitting part and the optical axis of the light receiving part are Matches and the emission Substrate mounting apparatus characterized by the facing opposite directions with the light emitting surface and the light-receiving surface of the light receiving portion of the.
  6. 【請求項6】 前記光半導体装置は、前記発光部の前記
    発光面及び前記受光部の前記受光面もしくは前記受光面
    及び前記発光面のいずれか一方の上に光軸がその中心に
    くるようにレンズが取り付けられ、このレンズは、前記
    樹脂モールドパッケージと一体成形されていることを特
    徴とする請求項5に記載の基板実装装置。
    6. The optical semiconductor device according to claim 1, wherein an optical axis is located at the center of the light emitting surface of the light emitting portion and the light receiving surface of the light receiving portion or the light receiving surface and the light emitting surface. The board mounting device according to claim 5, wherein a lens is attached and the lens is integrally molded with the resin mold package.
JP18523694A 1994-07-14 1994-07-14 Optical semiconductor device and substrate mounting device Pending JPH0832106A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18523694A JPH0832106A (en) 1994-07-14 1994-07-14 Optical semiconductor device and substrate mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18523694A JPH0832106A (en) 1994-07-14 1994-07-14 Optical semiconductor device and substrate mounting device

Publications (1)

Publication Number Publication Date
JPH0832106A true JPH0832106A (en) 1996-02-02

Family

ID=16167273

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18523694A Pending JPH0832106A (en) 1994-07-14 1994-07-14 Optical semiconductor device and substrate mounting device

Country Status (1)

Country Link
JP (1) JPH0832106A (en)

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WO2000013273A1 (en) * 1998-08-31 2000-03-09 Rohm Co., Ltd. Semiconductor device and substrate for semiconductor device
JP2004200704A (en) * 2002-09-20 2004-07-15 Yazaki Corp Led indication device and meter using this
JP2007043165A (en) * 2005-08-02 2007-02-15 Samsung Electro-Mechanics Co Ltd Light emitting diode with improved soldering structure, method for assembling light emitting diode to substrate by soldering, and light emitting diode assembly manufactured by the assembling method
WO2011083703A1 (en) * 2010-01-07 2011-07-14 国立大学法人九州工業大学 Led module device and method for manufacturing same
WO2015093442A1 (en) * 2013-12-16 2015-06-25 京セラ株式会社 Light receiving/emitting element module and sensor device using same
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Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000013273A1 (en) * 1998-08-31 2000-03-09 Rohm Co., Ltd. Semiconductor device and substrate for semiconductor device
US6717256B1 (en) 1998-08-31 2004-04-06 Rohm Co., Ltd. Mounting structure for semiconductor device having entirely flat leads
JP2004200704A (en) * 2002-09-20 2004-07-15 Yazaki Corp Led indication device and meter using this
JP2007043165A (en) * 2005-08-02 2007-02-15 Samsung Electro-Mechanics Co Ltd Light emitting diode with improved soldering structure, method for assembling light emitting diode to substrate by soldering, and light emitting diode assembly manufactured by the assembling method
JP2010187021A (en) * 2005-08-02 2010-08-26 Samsung Electro-Mechanics Co Ltd Light emitting diode having improved soldering structure, method for assembling the same to board by soldering, and light emitting diode assembly manufactured by the same
JP4571105B2 (en) * 2005-08-02 2010-10-27 サムソン エレクトロ−メカニックス カンパニーリミテッド. LIGHT EMITTING DIODE WITH IMPROVED SOLDERING STRUCTURE, METHOD OF ASSEMBLING THE LIGHT EMITTING DIODE TO SUBSTRATE, AND LIGHT EMITTING DIODE ASSEMBLY PRODUCED BY THIS ASSEMBLY METHOD
JP4597265B2 (en) * 2005-08-02 2010-12-15 サムソン エレクトロ−メカニックス カンパニーリミテッド. LIGHT EMITTING DIODE WITH IMPROVED SOLDERING STRUCTURE, METHOD OF ASSEMBLING THE LIGHT EMITTING DIODE TO SUBSTRATE, AND LIGHT EMITTING DIODE ASSEMBLY PRODUCED BY THIS ASSEMBLY METHOD
WO2011083703A1 (en) * 2010-01-07 2011-07-14 国立大学法人九州工業大学 Led module device and method for manufacturing same
WO2015093442A1 (en) * 2013-12-16 2015-06-25 京セラ株式会社 Light receiving/emitting element module and sensor device using same
CN105830233A (en) * 2013-12-16 2016-08-03 京瓷株式会社 Light receiving/emitting element module and sensor device using same
JPWO2015093442A1 (en) * 2013-12-16 2017-03-16 京セラ株式会社 Light emitting / receiving element module and sensor device using the same
JP2017201720A (en) * 2013-12-16 2017-11-09 京セラ株式会社 Light-receiving/emitting element module and sensor device using the same
JP2017216471A (en) * 2013-12-16 2017-12-07 京セラ株式会社 Light receiving/emitting element module and sensor device using the same
US10162047B2 (en) 2013-12-16 2018-12-25 Kyocera Corporation Light receiving/emitting element module and sensor device using same
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US10165639B2 (en) 2016-12-20 2018-12-25 Melexis Technologies Nv Integrated LED device

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