JP2003004987A - Optical transmission and reception module installation structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve the problem that an optical fiber and a lens have inferior positional precision because of stress applied to resin when a light emitting or receiving module is inserted and the molding tolerance of the resin. SOLUTION: Semicircular recessed cut parts 18 are formed on both the right and left flanks of a light emitting module base board 15 where a light emitting element 6 and an IC 7 are mounted, and semicircular projection parts 17 are formed on both the right and left internal walls of the storage part of a plastic module 12. In the state the emission module 14 is inserted into the storage part 13 of the plastic module 12, the cut parts 18 formed on the base substrate 15 and the projection parts 17 formed on the plastic module 12 are joined to achieve positioning. The light reception module side is also of similar constitution. When the light emission or reception module is inserted into the plastic module 12, the projection parts 17 expand to fix the modules. Since no stress is applied to the resin, the positioning precision and light transmission efficiency are improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical transmission and reception module installation structure in which an optical fiber plug is inserted into an optical minijack module to enable communication.

[0002]

2. Description of the Related Art In recent years, a bidirectional optical element module structure has an optical fiber plug connector housing an optical fiber and a light emitting diode (LED) or laser (LD) as a light emitting element, which is detachably attached to the tip of the optical fiber plug connector. ,
A drive IC for controlling the element is mounted on the circuit board, and a photodiode (P
Di) is integrated with the IC, and an OEIC having a function of converting an optical signal into an electric signal is mounted on a substrate,
Each of these elements is sealed with a translucent resin, and a light emitting module having electrode terminals on the circuit board for electrical connection to the outside and an optical minijack module in which a light receiving module is housed independently in a case are provided. Therefore, two optical fibers are respectively connected to the light emitting module and the light receiving module in the optical minijack module, whereby optical signals are transmitted and received to enable optical communication.

FIGS. 4 to 6 show a conventional structure for installing an optical minijack module on the light emitting side. FIG. 4 is a bottom view of the optical minijack module, and FIG. 5 is an explanatory view from the direction A in FIG. FIG. 6 is an explanatory view from the direction B in FIG.

In FIGS. 4 to 6, reference numeral 1 is an optical mini-jack module, and the optical mini-jack module 1 has a light emitting module 4 built in a housing portion 3 of a plastic module 2. The light emitting module 4 includes a light emitting diode (LED) 6 or a laser (L) as a light emitting element on the surface of a plurality of (for example, three) lead frames 5.
D) and a drive IC 7 for controlling the LED 6 are mounted, and electrical continuity with the lead frame 5 is achieved by a wire. It is sealed with a translucent sealing resin 8 to protect the LEDs 6, IC 7 and wires.

A conical recess is formed on the front surface of the LED 6 on the surface of the translucent sealing resin 8, and a hemispherical lens portion 9 is formed on the bottom of the recess. Has been done.

When the light emitting module 4 is mounted on a mounting board (not shown), the tip portion of the lead frame 5 projects downward from the lower surface of the mounting board and is fixed by soldering with solder, and is electrically connected to an external connection electrode. Connected to each other.

A cylindrical insertion portion (not shown) of an optical fiber plug is detachably engaged with an end portion of the plastic module 2 of the optical minijack module 1 on an extension line connecting the center of the LED 6 and the lens portion 9. Insertion hole 10
Are formed.

The alignment of the light emitting module 4 and the plastic module 2 will be described. The alignment surface on the plastic module 2 side is shown in FIGS.
The resin surface 3a of the inner wall of the storage portion 3 shown by the dotted line in (a)
The alignment surface on the light emitting module 4 side is shown in FIG.
It is the side surface 8a of the sealing resin 8 shown in (b) and FIG. 6 (b).

With the above structure, when the light emitting module 4 is inserted into the housing portion 3 of the plastic module 2 in the direction of the arrow D, the side surface 8a of the sealing resin 8 of the light emitting module 4 is the inner wall of the housing portion 3 of the plastic module 2. And is positioned by contacting the resin surface 3a.

The optical minijack module installation structure (not shown) on the light receiving side is the same as that of the light emitting module side described above, and instead of the light emitting module 4, a light receiving module is built in the plastic module. ing. A plurality of light receiving modules (for example,
OEIC that integrates PDi and IC with the function of converting optical signals into electrical signals on the surface of the lead frame
Is mounted, and electrical continuity with the lead frame is achieved by wires. In order to protect the OEIC and the wires, the OEIC and the wires are sealed with a light-transmitting sealing resin. A conical concave portion is formed on the front surface of the OEIC on the surface of the light-transmitting sealing resin, and a hemispherical lens portion is formed on the bottom surface of the concave portion.

The position of the light receiving module and the plastic module is aligned with the resin surface of the inner wall of the housing of the plastic module of the light receiving module and the side surface of the sealing resin of the light receiving module, as in the case of the structure of the light emitting module. .

The operation of the optical transmission and reception module will be described. The cylindrical insertion portion of the optical fiber plug not shown is inserted in the insertion hole 10 of the optical mini-jack module 1 incorporating the light emitting module 4 and the light receiving module in the direction of arrow C to establish a communicable state.

On the light emitting module 4 side, an electric signal is input from the lead frame 5 and converted into an optical signal by the IC 6 and LED 7 in the light emitting module 4. LED7
The light emitted from is collected by the lens unit 9, is incident on the optical fiber of the optical fiber plug, and is transmitted.

Next, the light transmitted from the optical fiber plug on the light receiving module side is condensed by the lens portion of the optical minijack module. The condensed light enters the OEIC in the light receiving module, is converted into an electric signal, and is output to the lead frame.

[0015]

However, in the above-mentioned optical transmission and reception module installation structure, when the light emitting or receiving module is inserted into the plastic module, the alignment is performed on the resin surface. Since the resin is stressed when the light emitting or light receiving module is inserted and there is a tolerance when molding the resin, the positional accuracy between the optical fiber of the optical fiber plug and the lens of the light emitting or light receiving module deteriorates. When the optical fiber plug is engaged with the optical minijack module, there is a problem that the light transmission efficiency is deteriorated.

The present invention has been made in view of the above conventional problems, and an object thereof is to improve alignment accuracy without stress on resin when inserting a light emitting or light receiving module into a plastic module. An optical transmission and reception module arrangement structure with improved light transmission efficiency is provided.

[0017]

In order to achieve the above object, in the optical transmitting and receiving module arrangement structure of the present invention, an optical element composed of a light emitting element and an IC are mounted on a base substrate, and the upper surface thereof is transparent. Optical mini-jack module in which an optical element module having an electrode terminal for electrical connection with the outside covered with a conductive resin is housed in a housing of a plastic module, and an optical mini-jack module in which an optical fiber plug is engaged. In the transmitter module installation structure,
A concave cutout is formed on the side surface of the base substrate on which the optical element is mounted, a convex projection is formed on the inner wall of the plastic module storage portion, and the optical element module is inserted into the storage portion of the plastic module. In this state, the notch formed on the side surface of the base substrate and the protrusion formed on the inner wall of the plastic module housing are joined and positioned.

Further, an optical element module having a light receiving element and an IC mounted on a base substrate, the upper surface of which is covered with a translucent resin and an electrode terminal for electrical connection with the outside is provided as a plastic module. In the optical mini-jack module housed in the housing part and the optical receiver module installation structure in which the optical mini-jack module is engaged with the optical fiber plug, the PDi and the IC as the light receiving element are integrated to convert an optical signal into an electric signal. A concave cutout is formed on the side surface of the base substrate on which the OEIC is mounted, a convex projection is formed on the inner wall of the plastic module housing, and the optical element module is inserted into the housing of the plastic module. In this state, the notch formed on the side surface of the base substrate and the inner wall of the plastic module housing are formed. It is characterized in that the raised portion is positioned by bonding.

The notch is formed in a semicircular shape on the left and right side surfaces of the light emitting module base substrate, and the protrusion is formed by:
It is characterized in that the left and right inner walls of the plastic module are formed in a semicircular shape.

The notch is formed in a semicircular shape on the left and right side surfaces of the light-receiving module base substrate, and the protrusion is
It is characterized in that the left and right inner walls of the plastic module are formed in a semicircular shape.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An optical transmission and reception module arrangement structure in the present invention will be described below with reference to the drawings. 1 to 3 relate to an optical transmission module arrangement structure according to an embodiment of the present invention, FIG. 1 is a bottom view of an optical minijack module on a light emitting side, and FIG. 2 is an explanatory view from a direction A of FIG. FIG. 3 is an explanatory view from the direction B in FIG. In the drawings, the same members as those in the conventional technique are designated by the same reference numerals.

In FIG. 1, in the optical mini-jack module 11, a storage section 1 for a plastic module 12 is provided.
A light emitting module 14 is built into the device 3. In the light emitting module 14, a through hole electrode 16 is formed on a light emitting module base substrate 15, and a light emitting diode (LED) 6 or a laser (LD) as a light emitting element is formed on the surface of the through hole electrode 16.
A drive IC 7 for controlling D6 is mounted and wire-bonded. Conduction of the through-hole electrode 16 is performed by a wire, and at the same time, the through-hole electrode 16 is connected.
Is electrically connected to the external connection electrode formed on the upper surface of the mounting board (not shown) by soldering. The L
It is sealed with a translucent sealing resin 8 to protect the ED 6 or LD, the IC 7 and the wires.

As in the conventional case, a hemispherical lens portion 9 is formed on the front surface of the LED 6 on the surface of the translucent sealing resin 8.

The alignment of the light emitting module 14 and the plastic module 12 will be described with reference to FIGS. 2 and 3. As shown by the dotted lines in FIGS. 2A and 3A, semicircular protrusions 17 are formed on the inner walls of the housing 13 of the plastic module 12 that face each other. Further, a semicircular cutout portion 18 is formed on the opposing side surfaces of the light emitting module base substrate 12 shown in FIGS. 2B and 3B.

With the above configuration, the light emitting module 14
2 is inserted into the housing 13 of the plastic module 12 in the direction of the arrow D, the two protrusions 17 formed in the housing 13 of the plastic module 12 expand and the protrusion 17
Are bonded to the two notches 18 formed on the side surface of the light emitting module base substrate 12 and positioned.

The optical minijack module installation structure (not shown) on the light receiving side is the same as that of the light emitting module side described above, and instead of the light emitting module 4, a light receiving module is built in the plastic module. ing. The light receiving module and the plastic module are aligned with each other by forming two semicircular protrusions on the inner walls of the plastic module facing each other, similarly to the configuration of the light emitting module arrangement structure described above.
On the other hand, two semi-circular cutouts are formed on the opposite side surfaces of the base substrate for the light receiving module, and when the light receiving module is inserted into the storage portion of the plastic module,
Two protrusions of the plastic module spread out and the protrusions were formed on the side surface of the base substrate for the light receiving module.
Positioned by joining the two notches.

As described above, since the concave portion on the side surface of the base substrate of the light emitting module or the light receiving module and the convex portion on the inner wall of the plastic module are joined and positioned,
No stress is applied to the resin during insertion. Further, since the positional accuracy of the optical fiber of the optical fiber plug and the lens of the light emitting module or the light receiving module is improved, the light transmission efficiency is improved.

[0028]

As described above, when inserting the light emitting or light receiving module into the plastic module, the resin is not stressed, and the alignment accuracy is improved.
The light transmission efficiency is improved.

The present invention can be applied to all optical modules.

[Brief description of drawings]

FIG. 1 is a bottom view of an optical minijack module on a light emitting module side according to an embodiment of the present invention.

FIG. 2 is an explanatory view from the direction A in FIG.

FIG. 3 is an explanatory view from a B direction in FIG.

FIG. 4 is a bottom view of a conventional optical minijack module on the light emitting module side.

5 is an explanatory view from the direction A in FIG.

6 is an explanatory view from the direction B in FIG.

[Explanation of symbols]

6 LED 7 IC 8 Sealing resin 9 lenses 10 insertion holes 11 Optical minijack module 12 plastic modules 13 Light emitting module housing 14 Light emitting module 15 Base substrate 16 Through-hole electrode 17 Protrusion 18 Notch

Claims (4)

[Claims] 1. A plastic module comprising an optical element module including a light emitting element and an IC mounted on a base substrate, an upper surface of which is covered with a transparent resin, and electrode terminals for electrical connection to the outside. In the optical minijack module housed in the housing part and the optical transmission module installation structure in which an optical fiber plug is engaged with the optical minijack module, a concave cutout part is formed on the side surface of the base substrate on which the optical element is mounted. Formed, a convex protrusion is formed on the inner wall of the plastic module storage portion, and the notch portion and the plastic module formed on the side surface of the base substrate in a state where the optical element module is inserted into the storage portion of the plastic module. Optical transmission module installation structure characterized by being joined to a protrusion formed on the inner wall of the housing to be positioned . 2. A plastic module comprising an optical element module comprising a light receiving element and an IC mounted on a base substrate, the upper surface of which is covered with a translucent resin, and electrode terminals for electrical connection to the outside. In the optical mini-jack module housed in the housing part and the optical receiver module installation structure in which the optical mini-jack module is engaged with the optical fiber plug, the PDi and the IC as the light receiving element are integrated to convert an optical signal into an electric signal. A concave cutout is formed on the side surface of the base substrate on which the OEIC is mounted, a convex projection is formed on the inner wall of the plastic module housing, and the optical element module is inserted into the housing of the plastic module. In this state, the notch formed on the side surface of the base substrate and the protrusion formed on the inner wall of the plastic module housing An optical receiver module installation structure, characterized in that and are joined and positioned. 3. The cutout portion is formed in a semicircular shape on the left and right side surfaces of the base substrate, and the protrusion portion is formed in a semicircular shape on the left and right inner walls of the plastic module housing portion. 1. The optical transmission module installation structure according to 1. 4. The cutout portion is formed in a semicircular shape on the left and right side surfaces of the base substrate, and the protrusion portion is formed in a semicircular shape on the left and right inner walls of the plastic module housing portion. 2. The optical receiver module installation structure according to 2.