JP2004304643A - Remote control sensor unit and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a remote control sensor with an LED for the confirmation of light reception which can reduce sizes and weights of various kinds of electronic devices by mounting the sensor, and to provide its manufacturing method. <P>SOLUTION: A quarter cylindrical recess 1a is formed at each corner of a PCB board 1 of the remote control sensor unit 10, and a half cylindrical recess 1b is formed at the two longer sides, respectively. Each of them is connected to a terminal electrode below via a through hole. A remote control IC 2 which distinguishes optically received signals and a photodiode 3 for light reception are mounted on a land pattern of the board 1, and sealed with first sealing resin 5 which is black resin containing a visible light intercepting agent. Luminescent colors of the LED chip 4 for confirmation of optical reception are orange to royal purple separated from an infrared radiation area. The LED chip 4 is mounted on the land pattern of the board 1 and sealed with second, transparent sealing resin 6. The first sealing resin 5 is covered with a shield cover 7 having a window for optical reception 7a, and is engaged with a recess 1c of the board 1 by hooks 7b on both sides of the cover. Thereby the cost down and miniaturization of the remote control sensor unit is achieved. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a light-receiving confirmation remote control sensor used for various AV devices and the like, and a method of manufacturing the same.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, devices such as various AV devices, communication devices, and air conditioners have been operated using a wireless signal transmission device using infrared rays or the like, that is, a so-called remote controller. Various devices on the light receiving side are provided with a remote control sensor for receiving a signal of a remote control.
[0003]
An example of such a conventional remote control sensor will be described with reference to the drawings. FIG. 6 is a plan view of a conventional remote control sensor. In FIG. 6, reference numeral 90 denotes a remote control sensor unit. Reference numeral 91 denotes an FPC (flexible circuit board), which includes a land pattern 91a for mounting each component and a connector connection portion 91b, and these are connected by wiring. Reference numeral 92 denotes a remote control sensor in which a sensor IC (not shown) for determining a light receiving signal and a light receiving photodiode are integrally molded. Usually, the remote control sensor 92 is covered with a shield cover (not shown). Reference numeral 93 denotes a light-emitting diode (LED) chip that emits yellow-green light for confirming light reception. As described above, the remote control sensor 92 and the LED chip 93 are mounted on the FPC 91 to form a unit.
[0004]
When the photodiode of the remote control sensor 91 receives light, the circuit of the sensor IC determines the read signal, and when it is confirmed that the received signal is meaningful, outputs a signal according to the command of the remote control, A current is applied to the LED chip 93 to emit light for confirming that the light is received.
[0005]
[Problems to be solved by the invention]
However, the conventional remote control sensor requires a large amount of space for mounting because it uses a glass epoxy board or an FPC, which imposes design restrictions to promote lighter, thinner, and smaller components, and involves a lot of parts and work costs. Was hanging.
[0006]
The above invention has been made in order to solve such a conventional problem, and an object thereof is to provide a remote control sensor with a light-receiving confirmation LED capable of reducing the size and weight of various electronic devices equipped with the same, and a remote control sensor having the same. It is to provide a manufacturing method.
[0007]
[Means for Solving the Problems]
Means of the present invention for solving the above-mentioned problem is a remote control sensor unit in which a remote control IC, a photodiode and a light-receiving confirmation LED chip are mounted on the same substrate, wherein the remote control IC and the photodiode use a first sealing resin. The LED chip for light reception confirmation is sealed using a second sealing resin.
[0008]
Further, the first sealing resin is a black resin containing a visible light cutting agent, and the second sealing resin is a transparent resin.
[0009]
Further, the light emitting confirmation LED chip emits light of an orange to blue-violet color.
[0010]
Another means of the present invention for solving the above problem is that in a method of manufacturing a remote control sensor unit in which a remote control IC, a photodiode, and a light-receiving confirmation LED chip are mounted on the same substrate, a large number of the remote control sensor units can be obtained. A step of forming an aggregate substrate, a step of mounting the remote control IC, the photodiode and the light-receiving confirmation LED chip on the aggregate substrate, and sealing the remote control IC and the photodiode with a first sealing resin. A step of sealing the LED chip for light reception confirmation with a second sealing resin, and a step of dividing a single remote control sensor unit from the collective substrate.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a remote control sensor according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a remote control sensor according to the first embodiment of the present invention. FIG. 2 is a sectional view showing an AA section of FIG.
[0012]
First, the configuration of a remote control sensor according to the first embodiment of the present invention will be described with reference to FIG. 1 and 2, reference numeral 10 denotes a light-receiving confirmation remote control sensor unit. Reference numeral 1 denotes a printed circuit board (PCB) of the remote control sensor unit 10. A wiring pattern and a land pattern (not shown) are formed on the upper surface of the substrate 1. A quarter cylindrical concave portion 1a is formed at each corner, and a 1/2 cylindrical concave portion 1b is formed at each of two long sides. These are formed as through holes connected to the wiring pattern, and are electrically connected to terminal electrodes (not shown) on the lower surface. Reference numeral 2 denotes a remote control IC mounted on the land pattern of the substrate 1 for determining a received signal. Reference numeral 3 denotes a light receiving photodiode.
[0013]
Reference numeral 4 denotes a light-receiving confirmation LED chip, whose emission color is an orange-blue-violet emission color far from the infrared region. Reference numeral 5 denotes a first sealing resin which is a black resin containing a visible light cutting agent and seals the remote control IC 2 and the photodiode 3. Reference numeral 6 denotes a second sealing resin which is a transparent resin sealing the LED chip 4. Reference numeral 7 denotes a shield cover that covers the first sealing resin 5, has a window 7a for receiving infrared light at a position corresponding to the photodiode 3 on the upper surface, and hooks 7b on both side surfaces. Have. The shield cover 7 is engaged with the concave portion 1c of the substrate 1 by bending the hooks 7b on both sides.
[0014]
Next, a method for manufacturing the remote control sensor unit 10 will be described with reference to FIG. 3 and 4 are perspective views showing a method of manufacturing the remote control sensor unit 10 in the order of steps. First, in FIG. 3A, reference numeral 11 denotes a collective board from which a large number of remote control sensor units 10 can be formed. On the collective board 11, a dividing line 11d for dividing into individual boards 1 is drawn for convenience of explanation. I have. A through hole 11a is formed at the intersection of a dividing line 11d corresponding to a corner of the substrate 1, a through hole 11b corresponding to the concave portion 1b of the substrate 1 and a through hole corresponding to the concave portion 1c on the dividing line corresponding to the long side of the substrate 1. A hole 11c is formed. Thus, the collective substrate 11 is formed.
[0015]
In the next step, as shown in FIG. 3B, the remote control IC 2, the photodiode 3, and the light-receiving confirmation LED chip 4 are mounted at predetermined positions on the collective substrate 11 by wire bonding or flip chip method. In the next step, as shown in FIG. 3C, the remote control IC 2 and the photodiode 3 are sealed with the first sealing resin 5 using a mold. In the next step, as shown in FIG. 3D, the light-receiving confirmation LED chip 4 is sealed with a second sealing resin 6 using a mold. Next, the collective substrate 11 is divided into single remote control sensor units 10 by dicing along the dividing lines. Finally, the shield cover 7 is put on the first sealing resin 5, the hook 7 b is bent and locked in the concave portion 1 c of the substrate 1, and the remote control sensor unit 10 is completed.
[0016]
Next, effects of the remote control sensor unit according to the first embodiment of the present invention will be described. Since the remote control IC 2 and the photodiode 3 were sealed with the first sealing resin 5, the remote control IC 2 was not affected by the visible light, and the remote control sensor did not malfunction and the reliability was improved. Also, since the emission color of the LED chip 4 is orange to blue-violet emission color that is far from the infrared region, even if the LED chip 4 is brought close to the photodiode 3, the light emission of the LED chip 4 may affect the remote control sensor. No malfunction. Therefore, the substrate area can be significantly reduced, and the remote control sensor unit can be reduced in weight and thickness. Since the configuration is suitable for mass production, the cost of the remote control sensor unit can be reduced.
[0017]
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a perspective view of a remote control sensor unit according to the second embodiment of the present invention. In FIG. 5, a remote control sensor unit 20 differs from the remote control sensor unit 10 of the first embodiment only in the shape of the sealing resin of the LED chip 4 for confirming light reception. Therefore, the same components as those of the first embodiment are denoted by the same reference numerals and names, and detailed description is omitted. The method of manufacturing the remote control sensor unit 20 is almost the same as that of the remote control sensor unit 10.
[0018]
【The invention's effect】
As described above, according to the present invention, in a remote control sensor unit in which a remote control IC, a photodiode, and a light reception confirmation LED chip are mounted on the same substrate, the remote control IC and the photodiode use the first sealing resin. Since the LED chip for light reception confirmation is sealed with the second sealing resin, a process suitable for mass production using the collective substrate can be adopted, and the cost of the remote control sensor unit can be reduced. Further, the substrate area was significantly reduced, so that the cost of the substrate was reduced. Further, it has become possible to reduce the size and size of small electronic devices using the remote control sensor unit.
[Brief description of the drawings]
FIG. 1 is a perspective view of a remote control sensor unit according to a first embodiment of the present invention.
FIG. 2 is a sectional view showing an AA section of FIG. 1;
FIG. 3 is a perspective view of a main part showing a method for manufacturing the remote control sensor unit according to the first embodiment of the present invention.
FIG. 4 is a perspective view illustrating a method for manufacturing the remote control sensor unit according to the first embodiment of the present invention.
FIG. 5 is a perspective view of a remote control sensor unit according to a second embodiment of the present invention.
FIG. 6 is a plan view of a conventional remote control sensor unit.
[Explanation of symbols]
1 board 2 remote control IC
Reference Signs List 3 photodiode 4 LED chip 5 first sealing resin 6 second sealing resin 7 shield cover 10, 20 remote control sensor unit

Claims (4)

In a remote control sensor unit having a remote control IC, a photodiode, and a light reception confirmation LED chip mounted on the same substrate, the remote control IC and the photodiode are sealed using a first sealing resin, and the light reception confirmation LED chip is A remote control sensor unit characterized by being sealed using a second sealing resin. The remote control sensor unit according to claim 1, wherein the first sealing resin is a black resin containing a visible light cutting agent, and the second sealing resin is a transparent resin. The remote control sensor unit according to claim 1, wherein a light emission color of the light-receiving confirmation LED chip is an emission color of orange to blue-violet. In a method of manufacturing a remote control sensor unit in which a remote control IC, a photodiode, and a light-receiving confirmation LED chip are mounted on the same substrate, a step of forming an aggregate substrate from which a plurality of remote control sensor units can be formed; Mounting the photodiode and the light-receiving confirmation LED chip, sealing the remote control IC and the photodiode with a first sealing resin, and sealing the light-receiving confirmation LED chip with a second sealing resin. A method of manufacturing a remote control sensor, comprising: a step of sealing with a resin; and a step of dividing a single remote control sensor unit from the collective substrate.

Images