KR101678739B1 - Slim type Remocon receiver module and manufacturing method thereof - Google Patents

Slim type Remocon receiver module and manufacturing method thereof Download PDF

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Publication number
KR101678739B1
KR101678739B1 KR1020140139252A KR20140139252A KR101678739B1 KR 101678739 B1 KR101678739 B1 KR 101678739B1 KR 1020140139252 A KR1020140139252 A KR 1020140139252A KR 20140139252 A KR20140139252 A KR 20140139252A KR 101678739 B1 KR101678739 B1 KR 101678739B1
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KR
South Korea
Prior art keywords
light
receiving chip
remote control
control signal
lead frame
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KR1020140139252A
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Korean (ko)
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KR20160044697A (en
Inventor
이기영
김상중
임봉현
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주식회사원광전자
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Priority to KR1020140139252A priority Critical patent/KR101678739B1/en
Publication of KR20160044697A publication Critical patent/KR20160044697A/en
Application granted granted Critical
Publication of KR101678739B1 publication Critical patent/KR101678739B1/en

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Light Receiving Elements (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)

Abstract

The present invention relates to a remote control signal receiving module and a manufacturing method thereof, and more particularly, to a slim remote control signal receiving module without a lens and a manufacturing method thereof.
A slim type remote control signal receiving module according to the present invention comprises: a plastic injection molding having a groove in which a lead frame is exposed on a floor; A light receiving chip and a control IC mounted on the lead frame; A lower element filled in the groove and including a resin layer covering the light-receiving chip, and a translucent portion in an area corresponding to the light-receiving chip.

Description

Technical Field [0001] The present invention relates to a remote control receiver module and a manufacturing method thereof,

The present invention relates to a remote control signal receiving module and a manufacturing method thereof, and more particularly, to a slim remote control signal receiving module without a lens and a manufacturing method thereof.

The remote control receiving module is known as a lead frame type in which major components are mounted on a lead frame as shown in FIG. 8 and a PCB type in which major intestines are mounted on a PCB as shown in FIG. The manufacturing process will be described taking the lead frame type as an example. First, the light receiving chip and the control IC are mounted on the lead frame, then connected to each other by wire bonding, and also connected to the lead frame. Next, in order to shield the disturbance light, a metal shield case surrounds the portion except the upper part of the light receiving chip, and is surrounded by transfer molding using EMC. At this time, a hemispherical lens is formed on the light receiving chip to widen the receiving angle of the remote control signal.

In recent years, there has been a demand for a slimmer remote control receiver module in accordance with the tendency of the TV and the bezel to become thinner.

Further, in the conventional remote control receiver module, there is a problem that the wire bonding is short-circuited due to the thermal expansion of the transfer mold, and there is a demand for measures to solve such a problem.

A further object of the present invention is to provide a new slim-type remote control receiver module that can solve the problem of wire bonding short-circuit due to thermal expansion of a transfer mold while being slim according to the trend of thinning of a TV and a bezel.

  A further object of the present invention is to provide a novel method of manufacturing a slim type remote control receiver module that can solve the problem of shorting wire bonding due to thermal expansion of a transfer mold while being slim according to the tendency of thinning of a TV and a bezel.

In order to solve the above problems,

Grooved plastic moldings with exposed leadframes on the bottom;

A light receiving chip and a control IC mounted on the lead frame; And

A lower element filled in the groove and including a resin layer covering the light receiving chip, and

And an upper cover having a planar light-projecting portion in a region corresponding to the light-

The remote control signal receiving module includes:

In the present invention, the 'flat transparent portion' is a transparent portion including a perforated, translucent flat, or planar type lens, which does not use a hemispherical protruding lens, and is preferably a perforated transparent portion in consideration of simplification of the process and cost .

In the present invention, the plastic molded article may be manufactured by an insert injection method in which a lead frame is fixed in a mold and a resin is injected.

In the present invention, the groove may be a flat bottom surface on which the lead frame is exposed, and a groove having a dam along the periphery of the lead frame, and may preferably be a rectangular groove formed with a dam along the rim. It is preferable that the height of the dam is higher than the height of the wire bonding so as to cover the light receiving chip, the control IC, and the wire bonding.

In the present invention, the groove may be formed with a blocking wall that separates a region where the light-receiving chip is mounted and a region where the control IC is mounted. The cut-off wall is formed with a predetermined cut-out portion through which wire bonding for connecting the light-receiving chip and the control IC can pass.

In the present invention, a resin that is filled in the groove and covers the light-receiving chip is preferably a heat-resistant resin, preferably a silicone resin, so that wire bonding is not short-circuited by high temperature expansion. In the case where the groove is divided into the blocking walls, it is preferable that the light-receiving chip and the control IC are respectively filled.

In the present invention, a visible light blocking layer may further be formed on the heat-resistant resin covering the light-receiving chip to prevent visible light, which is extraneous light, from being incident. The visible light blocking layer may be a conventional black epoxy resin.

In the present invention, the light receiving chip may be a conventional light receiving chip used in a conventional lead frame type or COB type remote control receiving module. Means an element that converts light energy into electric energy, such as a photodiode, a phototransistor, and a photothyristor. The light receiving element is preferably a photodiode in terms of maximum sensitivity, response speed, response characteristics, and the like.

The control IC may be a signal processing chip, and the signal processing chip may include circuitry such as a preamplifier, an amplifier, a decision and a clock recovery circuit, as will be understood by a person skilled in the art.

In the present invention, the light-receiving chip uses a large-area light-receiving chip having a larger area than that of the light-receiving chip in order to solve the reduction of the light-receiving angle due to the removal of the lens. The large-area light-receiving chip has an area of 10% or more, preferably 20% or more, more preferably 30% or more, still more preferably 40% or more, most preferably, Is a light receiving chip whose area is increased by 50% or more.

In the present invention, the upper cover may have a light-transmitting portion corresponding to the upper portion of the light-receiving chip, and preferably the light-transmitting portion may be a light-receiving chip-type perforated portion.

In the present invention, the upper cover may be in the form of a lower open rectangular parallelepiped having an upper surface on which a light transmitting portion is formed. In order to prevent the resin layer covering the light receiving chip from being detached, Or the like.

In the practice of the present invention, the upper cover may be manufactured by bending the rim of the metal piece formed with the light transmitting portion downward, and soldered to the lead frame of the lower element for grounding.
According to one aspect of the present invention, there is provided a plastic injection molding apparatus, comprising: a plastic injection mold having a bottom, a lead frame exposed on the bottom, a rim formed at a predetermined height in a rim,
A light receiving chip mounted on the lead frame, a control IC, and wire bonding for connecting the light receiving chip and the control IC; And
And a multilayer resin layer made of a lower heat-insulating layer covering the light-receiving chip on the surface of the lower silicon resin layer, the lower silicon resin layer being filled in the groove and covering the light-receiving chip, the control IC and the wire bonding, A lower element,
And a top cover having a flat light transmitting portion in a region corresponding to the light receiving chip.

The remote control receiving module according to the present invention is a slim type without a condenser lens to secure a thin film receiving distance of a TV and form a lens in a receiving window. The package has a high temperature (245 ° C) of a reflow process, However, the present invention does not use a transfer molding process, which is a conventional package forming process, in order to secure a distance by increasing the size of a photodiode of a light receiving portion without using a lens and to improve reliability even in a high temperature environment , The injection package is processed, the chip is put on the injection package, the wire is connected, and the epoxy resin which can protect the chip and the wire by the first application with the silicone material having a small property change at high temperature, Lt; / RTI > By eliminating the conventional transfer mold process, the process is simplified and the stability of the market quality is ensured even at high temperatures. Since there is no lens, the thickness of the PKG is slim and the design range is wide in the customer assembly environment.

1 is a perspective view of a plastic injection molding constituting a lower element.
2 is a perspective view showing a state in which a light receiving element and a control IC are mounted on a plastic injection mold.
3 is a perspective view showing a state in which a heat-resistant resin is filled and covered with a light-receiving element and a control IC mounted on a plastic injection molded article.
4 is a perspective view showing a state in which a heat-resistant resin is filled and covered with a light-receiving element and a control IC in a plastic injection molded product, and a wide groove is filled with an EMC for shielding visible light.
5 is a perspective view showing an upper cover coupled to a lower element;
FIG. 6 is a perspective view illustrating a lower element and a cover of a light receiving element according to the present invention. FIG.
7 is a cross-sectional view of a lower element and a cover of a light receiving element according to the present invention.
Figs. 8 and 9 show a conventional light receiving element.

Hereinafter, the present invention will be described in detail with reference to examples.

As shown in FIG. 1, a lead frame 110 is covered on the bottom surface of the plastic injection mold 100, and a dam 120 is formed at a predetermined height on the rim, thereby forming a groove 130 having a flat bottom. The groove 130 is divided into a wide groove 131 on which the light receiving element is mounted by the blocking wall 140 formed with the cutout 141 in the middle and a narrow groove 132 on which the control IC is mounted.

Lead frame protruding pieces 121 connected to the lead frame 110 of the groove bottom protrude from the outside of the dam 120. On both sides of the dam 120, 122 are formed.

2, the light receiving element 161 is mounted on the wide groove 131, and the control IC 162 is mounted on the narrow groove 132. [ Wire bonding 163 is performed through the cutout of the blocking wall 140 connecting the light receiving element 161 and the control IC 162. The control IC 162 is connected to the bottom lead frames 110, Bonding is performed.

3, the wide groove 131 and the narrow groove 132 are filled with silicone resin to form a heat-resistant resin layer 171 for covering the light-receiving element 161, the control IC 162 and the wire bonding 163 ).

As shown in FIG. 4, in the wide groove 131, an EMC including a visible ray blocking agent is additionally filled in the upper end of the heat-resistant resin layer 171 to form a visible light blocking layer 172. The visible light blocking layer 172 forms the lower element 200 filled with the same height as the height of the dam.

As shown in FIG. 5, the upper cover 300 is coupled to the lower element. The upper cover 300 includes an upper cover surface 310 and a side cover surface 320 having a rectangular cloth tool 311 in a region corresponding to the upper portion of the light receiving element 161. The side cover surface 320 is formed with a coupling groove 321 through which the coupling protrusion 122 is inserted and fitted and has a ground piece 322 which is grounded with at least one protrusion piece 121.

6 and 7, when the coupling groove 321 of the upper cover 300 is fitted to the coupling protrusions 122 of the lower element 200 and the coupling grooves 321 of the upper cover 300 are coupled with each other, The grounding piece 322 of the upper cover 300 is brought into contact with the protruding piece 121 of the lower element 200 while the visible ray blocking layer 172 of the element 200 is being compressed. The grounded top cover 300 shields the signals incident on the region except the cloth tool 311. The visible light incident through the cloth tool 311 is blocked by the visible light blocking layer 172 so that only the IR signal transmitted from the remote controller reaches the light receiving element 161 through the cloth tool 131. The signal arriving at the light receiving element 161 is transmitted to the control IC 162 through the wire bonding 163, and the control signal is transmitted to the TV.

Claims (10)

A plastic injection molded article having a bottom, a leadframe exposed on the bottom, a rim formed on the rim at a predetermined height,
A light receiving chip mounted on the lead frame, a control IC, and wire bonding for connecting the light receiving chip and the control IC; And
A lower heat-resistant silicone resin layer filled in the groove to cover the light-receiving chip, the control IC, and the wire bonding,
A lower element including a multilayer resin layer composed of an upper visible ray blocking layer covering the light receiving chip on a surface of the lower silicon resin layer;
And a top cover having a planar light-transmitting portion in a region corresponding to the light-receiving chip. The module according to claim 1, wherein the plastic injection molding is an insert injection molding for inserting a lead frame into a mold and injecting resin. The slim-type remote control signal receiving module according to claim 1 or 2, wherein the groove has a blocking wall that separates a region where the light-receiving chip is mounted and an area where the control IC is mounted. The slim-type remote control signal receiving module according to claim 3, wherein the blocking wall has a cut-out portion for allowing wire bonding for connecting the light-receiving chip and the control IC to pass therethrough. delete delete The module of claim 1, wherein the visible light blocking layer is an opaque epoxy resin layer. The slim type remote control signal receiving module according to claim 1, wherein the light receiving chip is a large area light receiving chip. The remote control signal receiving module of claim 1, wherein the upper cover is coupled to the lower element while compressing the resin layer of the lower element. The remote control signal receiving module of claim 1, wherein the upper cover is grounded to a lead frame of a lower irradiation.
KR1020140139252A 2014-10-15 2014-10-15 Slim type Remocon receiver module and manufacturing method thereof KR101678739B1 (en)

Priority Applications (1)

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KR1020140139252A KR101678739B1 (en) 2014-10-15 2014-10-15 Slim type Remocon receiver module and manufacturing method thereof

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Application Number Priority Date Filing Date Title
KR1020140139252A KR101678739B1 (en) 2014-10-15 2014-10-15 Slim type Remocon receiver module and manufacturing method thereof

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KR101678739B1 true KR101678739B1 (en) 2016-11-23

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KR101914542B1 (en) * 2017-10-16 2018-12-28 (주)파트론 Image sensor package

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004304643A (en) * 2003-03-31 2004-10-28 Citizen Electronics Co Ltd Remote control sensor unit and its manufacturing method

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Publication number Priority date Publication date Assignee Title
KR101082997B1 (en) * 2009-08-21 2011-11-14 광전자 주식회사 Remocon receving module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004304643A (en) * 2003-03-31 2004-10-28 Citizen Electronics Co Ltd Remote control sensor unit and its manufacturing method

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