JP4625614B2 - Remote control sensor unit and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a remote control sensor for light reception confirmation used for various AV devices and the like and a manufacturing method thereof.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a radio signal transmission device using infrared rays or the like, that is, a so-called remote controller is used to operate various AV devices, communication devices, air conditioning devices, and the like. Various devices on the light receiving side are provided with a remote control sensor for receiving a remote control signal.
[0003]
An example of such a conventional remote control sensor will be described with reference to the drawings. FIG. 6 is a plan view of a conventional remote control sensor. In FIG. 6, reference numeral 90 denotes a remote control sensor unit. Reference numeral 91 denotes an FPC (flexible circuit board), which includes a land pattern 91a for mounting each component and a connector connecting portion 91b, which are connected by wiring. Reference numeral 92 denotes a remote control sensor in which a sensor IC (not shown) for discriminating a received light signal and a light receiving photodiode are integrally molded. Normally, the remote control sensor 92 is covered with a shield cover (not shown). A light emitting diode (LED) chip 93 emits yellowish green light for confirmation of light reception. Thus, the remote control sensor 92 and the LED chip 93 are mounted on the FPC 91 to form a unit.
[0004]
When the photodiode of the remote control sensor 91 receives light, the sensor IC circuit discriminates the read signal, confirms that the received signal is meaningful, and outputs a signal according to the command of the remote control, A current is applied to the LED chip 93 to emit light for confirming that the light has been received.
[0005]
[Problems to be solved by the invention]
However, since the conventional remote control sensor uses a glass epoxy board or FPC and requires a lot of space for mounting, it becomes a design restriction to make lighter, thinner and more compact, and it also costs a lot of parts and work. It was over.
[0006]
The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a remote control sensor with an LED for light reception confirmation capable of reducing the thickness and thickness of various electronic devices on which the same is mounted, and the same. It is to provide a manufacturing method.
[0007]
[Means for Solving the Problems]
In a remote control sensor unit in which a remote control IC, a photodiode and a light reception confirmation LED chip are mounted on the same substrate, the remote control IC and the photodiode are sealed with a first sealing resin which is a black resin containing a visible light cut agent. The LED chip for light reception confirmation is sealed away from the first sealing resin using a second sealing resin that is a transparent resin, and infrared light is received at a position corresponding to the photodiode. A portion other than the window of the first sealing resin is covered with a shield cover having a window for the purpose.
[0008]
Further, the shield cover is characterized in that hook portions formed on both surfaces are covered by engaging with concave portions formed on both side surfaces of the substrate .
[0009]
Further, the light emission color of the LED chip for light reception confirmation is a light emission color of orange to blue-violet.
[0010]
In a method of manufacturing a remote control sensor unit in which a remote control IC, a photodiode, and a light reception confirmation LED chip are mounted on the same substrate, a step of forming a collective substrate that can take a large number of the remote control sensor units, and the remote control IC on the collective substrate Mounting the photodiode and the LED chip for light reception confirmation, sealing the remote controller IC and the photodiode with a first sealing resin, and sealing the light reception confirmation LED chip to the first seal. Sealing with a second sealing resin apart from the stop resin, dividing a single remote control sensor unit from the collective substrate, and receiving infrared light at a position corresponding to the photodiode It is characterized by a step of a shield cover having a window covering a portion other than the window of the first sealing resin .
The shield cover may be covered by engaging hook portions formed on both sides with recesses formed on both side surfaces of the substrate.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a remote control sensor according to an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a perspective view of a remote control sensor according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view showing the AA cross section of FIG.
[0012]
First, the configuration of the remote control sensor according to the first embodiment of the present invention will be described with reference to FIG. 1 and 2, reference numeral 10 denotes a remote control sensor unit for light reception confirmation. Reference numeral 1 denotes a substrate which is a printed wiring board (PCB) of the remote control sensor unit 10. A wiring pattern and a land pattern (not shown) are formed on the upper surface of the substrate 1. A quarter cylindrical concave portion 1 a is formed at each corner, and a half cylindrical concave portion 1 b is formed at two sides on the long side. These are formed as through holes connected to the wiring pattern, and are electrically connected to terminal electrodes (not shown) on the lower surface. Reference numeral 2 denotes a remote control IC for discriminating a received signal mounted on the land pattern of the substrate 1. 3 is a photodiode for light reception.
[0013]
4 is an LED chip for confirming light reception, and its emission color is an orange to blue-violet emission color far from the infrared region. Reference numeral 5 denotes a first sealing resin that is a black resin containing a visible light cutting agent that seals the remote control IC 2 and the photodiode 3. Reference numeral 6 denotes a second sealing resin that is a transparent resin sealing the LED chip 4. A shield cover 7 is placed on the first sealing resin 5 and has a window 7a for receiving infrared light at a position corresponding to the photodiode 3 on the upper surface, and hooks 7b are provided on both side surfaces. Have. The shield cover 7 is locked to the recess 1c of the substrate 1 by bending the hooks 7b on both sides.
[0014]
Next, a method for manufacturing the remote control sensor unit 10 will be described with reference to FIG. 3 and 4 are perspective views showing a method of manufacturing the remote control sensor unit 10 in the order of steps. First, in FIG. 3A, reference numeral 11 denotes a collective substrate that can take a large number of remote control sensor units 10, and the collective substrate 11 has a dividing line 11d for dividing into individual substrates 1 drawn for convenience of explanation. Yes. A through hole 11a is formed at a position where a dividing line 11d corresponding to a corner of the substrate 1 intersects, a through hole 11b corresponding to the recessed portion 1b of the substrate 1 is formed on a dividing line corresponding to the long side of the substrate 1, and a through hole corresponding to the recessed portion 1c. A hole 11c is formed. In this way, the collective substrate 11 is formed.
[0015]
In the next step, as shown in FIG. 3B, the remote controller IC 2, the photodiode 3, and the light reception confirmation LED chip 4 are mounted on each of the predetermined locations on the collective substrate 11 by wire bonding or flip chip method. In the next step, as shown in FIG. 3C, the remote controller IC 2 and the photodiode 3 are sealed with a first sealing resin 5 using a mold. In the next step, as shown in FIG. 3D, the LED chip 4 for light reception confirmation is sealed with a second sealing resin 6 using a mold. Next, the collective substrate 11 is divided into a single remote control sensor unit 10 by dicing along a dividing line. Finally, the shield cover 7 is put on the first sealing resin 5, the hook 7b is bent and locked to the recess 1c of the substrate 1, and the remote control sensor unit 10 is completed.
[0016]
Next, the effect of the remote control sensor unit according to the first embodiment of the present invention will be described. Since the remote control IC 2 and the photodiode 3 were sealed with the first sealing resin 5, the remote control sensor was not affected by visible light and the reliability of the remote control sensor did not occur. Further, since the emission color of the LED chip 4 is an orange to bluish purple emission color far from the infrared region, even if the LED chip 4 is brought close to the photodiode 3, the remote control sensor may be affected by the emission of the LED chip 4. There is no malfunction. Therefore, the board area can be greatly reduced, and the remote control sensor unit can be reduced in size and thickness. Because it is suitable for mass production, the cost of the remote control sensor unit can be reduced.
[0017]
Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 5 is a perspective view of a remote control sensor unit according to the second embodiment of the present invention. In FIG. 5, 20 is a remote control sensor unit, and the only difference from the remote control sensor unit 10 of the first embodiment is the shape of the sealing resin of the LED chip 4 for light reception confirmation. Accordingly, the same constituent elements as those in the first embodiment are denoted by the same reference numerals and names, and detailed description thereof is omitted. The manufacturing method of the remote control sensor unit 20 is almost the same as that of the remote control sensor unit 10.
[0018]
【The invention's effect】
As described above, according to the present invention, in the remote control sensor unit in which the remote control IC, the photodiode, and the light reception confirmation LED chip are mounted on the same substrate, the remote control IC and the photodiode use the first sealing resin. Since the LED chip for light reception confirmation was sealed using the second sealing resin, a process suitable for mass production using the collective substrate could be adopted, and the cost of the remote control sensor unit could be reduced. In addition, since the substrate area can be greatly reduced, the cost of the substrate can be reduced.
Furthermore, it has become possible to reduce the size and size of small electronic devices that use this remote control sensor unit.
[Brief description of the drawings]
FIG. 1 is a perspective view of a remote control sensor unit according to a first embodiment of the present invention.
2 is a cross-sectional view showing the AA cross section of FIG. 1. FIG.
FIG. 3 is a perspective view of relevant parts showing a method of manufacturing a remote control sensor unit according to the first embodiment of the present invention.
FIG. 4 is a perspective view showing a method for manufacturing the remote control sensor unit according to the first embodiment of the present invention.
FIG. 5 is a perspective view of a remote control sensor unit according to a second embodiment of the present invention.
FIG. 6 is a plan view of a conventional remote control sensor unit.
[Explanation of symbols]
1 Substrate 2 Remote control IC
3 Photodiode 4 LED chip 5 First sealing resin 6 Second sealing resin 7 Shield cover 10, 20 Remote control sensor unit

Claims (5)

In a remote control sensor unit in which a remote control IC, a photodiode, and a light reception confirmation LED chip are mounted on the same substrate, the remote control IC and the photodiode are sealed with a first sealing resin that is a black resin containing a visible light cut agent. The LED chip for light reception confirmation is sealed away from the first sealing resin using a second sealing resin that is a transparent resin, and infrared light is received at a position corresponding to the photodiode. A remote control sensor unit characterized in that a portion other than the window of the first sealing resin is covered with a shield cover having a window for the purpose.   2. The remote control sensor unit according to claim 1, wherein the shield cover is covered by hook portions formed on both sides thereof being engaged with recesses formed on both side surfaces of the substrate.   3. The remote control sensor unit according to claim 1, wherein a light emission color of the LED chip for light reception confirmation is a light emission color of orange to blue-violet. In a method of manufacturing a remote control sensor unit in which a remote control IC, a photodiode, and a light reception confirmation LED chip are mounted on the same substrate, a step of forming a collective substrate that can take a large number of the remote control sensor units, and the remote control IC on the collective substrate Mounting the photodiode and the LED chip for light reception confirmation, sealing the remote controller IC and the photodiode with a first sealing resin, and sealing the light reception confirmation LED chip to the first seal. Sealing with a second sealing resin apart from the stop resin, dividing a single remote control sensor unit from the collective substrate, and receiving infrared light at a position corresponding to the photodiode It is characterized by a step of a shield cover having a window covering a portion other than the window of the first sealing resin Manufacturing method of the remote control sensor.   5. The method of manufacturing a remote control sensor unit according to claim 4, wherein the shield cover is covered by engaging hook portions formed on both sides with recesses formed on both side surfaces of the substrate.

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