JP4910220B1 - LED module device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve a heat radiation characteristic of an LED module device. <P>SOLUTION: A wiring board is constituted by a glass epoxy substrate on which wiring is formed. An LED package substrate has a laminated structure that two insulation layers comprising a resin layer and an adhesive layer are sandwiched between a metallic plate and a metal foil. An LED chip is mounted to the LED package substrate, and a pair of electrodes of the LED chip are respectively connected to the metal foils separated by a slit, and filled with a transparent resin, so as to constitute an LED package. The LED package is fastened to or brought into contact with a heat radiator, an upper part of a wall of the LED package is adhered to the glass epoxy substrate, and the pair of the external connection electrodes are connected to the wiring of the glass epoxy substrate on an adhesion part. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to an LED module device in which an LED package substrate for an LED chip is formed by processing a metal plate and a manufacturing method thereof.

  An LED (Light Emitting Diode) is widely used as an element that has both low power consumption, reduced carbon dioxide, high durability, and energy saving. A package on which such an LED chip is mounted is mounted on a wiring board and used for a large display, a backlight of an electronic device such as a mobile phone, a digital video camera, or a PDA, road lighting, general lighting, and the like. Since the LED itself is a light emitting element and emits heat, the LED package basically includes a heat dissipation device for cooling.

  In the current LED module device, a ceramic substrate or a silicon substrate or a metal substrate is used as the LED package substrate, but in a method using a conventional ceramic substrate (see Patent Document 1) or silicon substrate (see Patent Document 2), There are problems that heat conduction of ceramics and silicon is worse than metals such as copper, so that heat cannot be radiated well, it is expensive, and processing is difficult.

  FIG. 12 is a diagram illustrating a conventionally known light emitting device (see Patent Document 3). As shown in the figure, a copper foil pattern constituting a lead electrode is formed on the surface of a stainless steel substrate via an insulating film. A through hole is formed in the stainless steel substrate, and a copper support is fitted into the through hole. The LED chip is placed in a recess formed at the tip of the copper support. Each electrode of the LED chip and a copper foil pattern provided on the surface of the substrate are wire-bonded. Thereafter, a lens is formed by potting and curing a translucent resin such as a silicon resin. The silicon resin functioning as a lens is provided so as to cover the protrusions of the support, the light emitting elements, and even the wires bonded to the electrodes.

  Although resin sealing is applied to the bonding connection portion of the LED chip electrode, the configuration shown in the drawing has a problem that the resin cannot be efficiently injected only into a necessary portion. A translucent resin such as silicon resin for resin sealing is expensive, and therefore a structure for injecting resin more specifically is required.

  FIG. 13 is a side cross-sectional view showing the light emitting device disclosed in Patent Document 4. As shown in FIG. The substrate uses an electrically insulating material such as a liquid crystal polymer, and forms an insulating substrate by injection molding. Then, a three-dimensional three-dimensional insulating base material is formed, for example, by providing a recess in the LED chip mounting location. After the metal film is formed on the surface of the insulating substrate, the metal film other than the portion where the circuit portion is formed is removed. The LED chip is mounted in the recess of the substrate, and the circuit portion and the LED chip are electrically joined with a conductive adhesive. Thereafter, the upper electrode of the LED chip and the circuit part are joined with a gold wire. Next, the recess is filled with a transparent resin to seal the LED chip. Finally, a diffusion plate made of a transparent resin or the like is attached to the surface of the substrate to complete the LED lighting module.

  In this way, since a plurality of LED chips are mounted in the recess and three-dimensionally arranged on the substrate, any light distribution characteristic can be easily obtained according to the shape of the substrate, and the module can be thinned. Become. However, the light emitting device disclosed in Patent Document 4 has a problem in that the process is complicated and the cost is high because a substrate serving as a package base is three-dimensionally formed and wiring is formed later. There is.

  14A and 14B are diagrams showing an LED lighting apparatus disclosed in Patent Document 5, in which FIG. 14A shows a top view and FIG. 14B shows a partial cross-sectional view. As shown in the figure, the insulating metal substrate has a recess for installing the LED chip provided by squeezing. The insulating metal substrate includes a metal substrate layer, an electrical insulating layer made of an insulating material layer, an electrode pattern made of a conductive metal, and a lead pattern. Adjacent LED chips are electrically connected by a bonding wire via an electrode pattern.

  However, since Patent Document 5 discloses only an LED lighting device having a large number of LED chips or resistors connected thereto, a relief method when one LED chip becomes defective is difficult, and there is a problem in practical use. . In addition, in order to extract light efficiently, addition of a reflective material is indispensable. However, Patent Document 5 discloses only application of a white material and vapor deposition of metal as a retrofit. However, these are complicated and costly factors.

  In order to remedy defects, mounting on individual lighting fixtures using individual packages is a simple solution. However, Patent Document 5 discloses an individual package that is divided into individual pieces for each LED chip, and an individual package that is divided into a wiring board and There is no disclosure about mounting on a radiator. Therefore, no consideration has been given to heat dissipation. Since a general insulating metal plate is used, the electrical insulating layer located on the lower surface of the LED chip is usually as thick as 80 μm and has poor thermal conductivity, so that there is a problem that good heat dissipation characteristics cannot be obtained.

  FIG. 15 is a cross-sectional view showing a lighting fixture disclosed in Patent Document 6. As shown in FIG. The illustrated metal core printed circuit board includes a metal core and a printed circuit obtained by processing a copper foil over the insulating layer on the metal core. As the insulating layer, a heat-resistant thermoplastic resin having a thickness of about 100 μm made of any one of polyether ether ketone, polyether imide, and polyether sulfone is used. A light emitting diode is mounted and fixed on the bottom surface of the recess of the metal core printed circuit board, and each terminal is connected to the printed circuit. The hollow of the metal core printed circuit board is filled with a transparent acrylic resin. As described above, it is known to use a heat-resistant thermoplastic resin as the insulating layer, however, it cannot be said that the resin is usually excellent in heat dissipation. There is a need for an insulating layer with good thermal conductivity that can dissipate heat generated by a light emitting diode while achieving electrical insulation.

JP 2005-158957 A JP 2000-106458 A JP 2002-335019 JP 11-163412 A JP-A-1-309201 Japanese Patent Laid-Open No. 11-68269

  The present invention solves such problems and is an LED module device in which an LED package in which an LED chip is attached to an LED package substrate formed by processing a metal plate is attached to a wiring substrate and a radiator is attached. The purpose is to improve the heat dissipation characteristics.

  The present invention uses a metal plate having good processability and thermal conductivity as an LED package substrate, and uses an insulating layer that ensures insulation from the connection wiring of the LED chip mounted thereon, while insulating the same. The aim is to improve the thermal conductivity through the layers.

  In addition, the present invention is such that the electrical connection portion of the LED package connected to the wiring board is positioned on the upper surface of the LED chip, while the heat dissipator for mounting the LED package board is positioned below to separate the two. In addition to simplifying the electrical connection between the LED package substrate and the wiring substrate, the cost performance of each of the heat dissipation and electrical connection is optimized, and overall, low-cost and high-efficiency exhaust heat is realized. It is aimed.

  In the LED module device of the present invention, an LED package substrate for an LED chip is formed by processing a metal plate, and an LED package using the substrate is mounted on a wiring substrate. The LED package substrate is provided with a metal foil functioning as a connection wiring on a flat plate-shaped bottom portion for mounting an LED chip and a metal plate bent so as to form a wall portion rising from both sides of the bottom end, And it is set as the laminated structure which pinched | interposed the two insulating layers which consist of a resin layer and an adhesive material layer between this metal plate and metal foil. A slit is opened in the metal foil on the upper surface of the flat plate-like bottom so that the metal foil at the upper end of the wall portion functions as a pair of external connection electrodes, and the ends of the pair of external connection electrodes are located inside the metal plate ends. To place. An LED package is mounted by mounting an LED chip on the upper surface of the flat bottom of the LED package substrate, connecting a pair of electrodes of the LED chip to each of the metal foils separated by slits, and filling a transparent resin. Configure. The LED package is mounted on the wiring board, and the pair of external connection electrodes are connected to the wiring on the wiring board, and the flat bottom bottom surface of the LED package board is fixed or brought into contact with the radiator.

  In the manufacturing method of the LED module device of the present invention, first, a resin layer side of a laminated film made of a metal foil with a resin layer is pasted on a metal plate using an adhesive, and between the metal plate and the metal foil. In addition, a laminated structure in which two insulating layers composed of a resin layer and an adhesive layer are sandwiched is formed. Before or after attaching the laminated film on the metal plate, the metal foil is processed to open a slit. Next, the laminated structure including the metal plate is bent to form a flat bottom portion on which the LED chip is to be mounted, and the LED is positioned on both sides of the bottom portion and bent from the bottom end to rise. A wall portion extending on the same side as the light emitting direction of the chip is provided, and the upper portion of the wall portion is bent outward to form a pair of external connection electrodes to constitute an LED package substrate. Then, an LED chip is mounted on the LED package substrate, one of the LED chip electrodes is connected to one of the bottom metal foils of the LED package substrate divided by the slit, and the LED chip is connected to the other of the divided bottom metal foils The other electrode is connected and resin-sealed using a transparent resin to form an LED package. Finally, the LED package is mounted on the wiring board, the pair of external connection electrodes are connected to the wiring on the wiring board, and the flat bottom bottom surface of the LED package board is fixed or brought into contact with the radiator.

  On the metal foil, a metal surface treatment that functions as a reflector is applied. The adhesive layer is filled with a heat conductive filler. The connection between the pair of electrodes of the LED chip is a wire bond connection or a flip chip connection. The metal foil can be divided into three parts by two slits. A plurality of LED chips are mounted on the central metal foil divided into three parts, and the wiring between the LED chips and the wiring between the LED chip and the metal foil are performed. And are connected using bonding wires. The heat radiating body is a heat radiating plate or a housing, or the flat bottom surface of the LED package substrate is fixed to the wiring board so that the wiring board functions as a heat radiating body.

  A function of confining the sealing resin from the left and right front and back can be achieved by providing a front and rear direction wall that is connected to the right and left walls rising from both sides of the bottom end. A plurality of LED package substrates are simultaneously formed on a single metal plate, and after mounting an LED chip on the LED package substrate and resin-sealing, each LED package or an arbitrary plurality of LED packages connected to each other is packaged. Divide into pieces.

  According to the present invention, a metal plate having good processability and thermal conductivity is used for the LED package substrate, and an insulating layer for ensuring insulation with the LED chip connection wiring mounted thereon is used. Thermal conductivity through the insulating layer can be improved.

  The LED package substrate of the present invention has a metal-two-layer insulating layer (polyimide + adhesive layer) -metal four-layer structure, so that the insulating resin layer (polyimide) can be made very thin and the adhesive material has a low thermal resistance. By mixing this filler, the thermal conductivity can be improved by an order of magnitude over the insulating layer, and the total thermal resistance can be reduced.

  In addition, according to the present invention, the electrical connection between the LED package substrate and the wiring board can be easily performed by separating the electrical connection portion between the LED package board and the wiring board from the heat radiating body on which the LED package board is mounted. At the same time, by optimizing the cost performance of heat dissipation and electrical connection, it is possible to achieve low-cost and high-efficiency exhaust heat overall.

  In addition, according to the present invention, since heat dissipation is promoted, the output can be higher than before (it can be brightened). Alternatively, it is possible to extend the life with the same output as the conventional one. Further, by devising the shape of the LED package substrate, it is possible to inject an expensive LED chip sealing resin in a limited manner only to the necessary portions.

  In addition, according to the present invention, it is possible to realize by simple and low-cost metal plating without using a complicated process for forming the reflecting surface.

It is side surface sectional drawing which shows the 1st example of the LED module apparatus which actualizes this invention. It is a figure explaining the bending process of the metal plate by the press work using a metal mold | die. It is a figure which shows a 1st LED package board | substrate, (A) is a figure shown in the state which connected several LED package board | substrates, (B) is a figure which takes out and shows only the one LED package board | substrate. (C) is a cross-sectional view cut along line AA ′ shown in (B), and (D) is a cross-sectional view cut along line BB ′ shown in (B). FIG. 4 is a diagram showing a second LED package substrate different from FIG. 3, (A) is a diagram showing a state in which a plurality of LED package substrates are connected, and (B) is only one LED package substrate. (C) is a cross-sectional view taken along line AA ′ shown in (B), and (D) is a cross-section taken along line BB ′ shown in (B). FIG. It is a figure which shows the 1st example of LED package assembly. It is a figure which shows the 2nd example of LED package assembly. It is a figure which shows the 3rd example of LED package assembly, (A) shows the upper side figure of the completed LED package, (B) has shown side surface sectional drawing. It is a figure explaining the assembly of the 1st example (refer FIG. 1) of the LED module apparatus which actualizes this invention. It is a figure explaining the assembly of the 2nd example of the LED module apparatus which actualizes this invention. It is a figure explaining the 3rd example of the LED module device which embodies this invention, (A) shows the sectional view, and (B) is the upper surface shown in the state where three LED packages were attached to the wiring board. FIG. It is a figure explaining the 4th example of the LED module device which actualizes this invention, (A) shows the top view of a connection structure LED package, (B) attached this connection structure LED package to the wiring board. Sectional drawing cut | disconnected by the AA 'line of the state is shown. It is a figure which illustrates a conventionally well-known light-emitting device (refer patent document 3). FIG. 11 is a side cross-sectional view showing a light emitting device disclosed in Patent Document 4. It is a figure which shows the LED lighting fixture disclosed by patent document 5, (A) shows the top view, (B) has shown the fragmentary sectional view. It is sectional drawing which shows the lighting fixture of the patent document 6.

  Hereinafter, the present invention will be described based on examples. FIG. 1 is a side sectional view showing a first example of an LED module device embodying the present invention. The exemplary LED module device includes an LED package, a wiring board having an opening for mounting the LED package, and a heat sink fixed to the back surface of the LED package. The LED package is attached to the opening of the wiring board by filling a gap between the LED package side surface and the wiring board with an adhesive (heat-resistant adhesive), and on the adhesive, a pair of connection electrodes ( The external connection electrodes for connecting to the wiring board are connected to the wiring on the upper surface of the wiring board by soldering or the like. The LED chip light emitting surface is directed to the upper surface side in the figure, and emits light toward the upper surface without being blocked by the wiring board. The back surface of the LED package on which the wiring board is mounted is fixed on the heat sink by solder connection. Alternatively, instead of this solder connection, it is possible to bond using a highly heat conductive adhesive.

  The LED package is assembled on the LED package substrate. As will be described later with reference to FIG. 2, the LED package substrate has a laminated film made of a metal foil with a resin on a metal plate bent into a predetermined shape so as to have a recess for mounting an LED chip. Affixing using an adhesive material is performed by applying silver plating functioning as a reflective material on the metal foil. In the metal foil (and silver plating) functioning as connection wiring, a slit for insulating and separating a pair of connection electrodes (both ends of the metal foil) is opened. After the LED chip is mounted on the LED package substrate configured as described above and electrically connected and wired, a transparent resin is filled to configure the LED package.

  Thus, the LED package substrate of the present invention comprises an insulating layer sandwiched between a metal plate and a metal foil by two layers of a resin layer (polyimide film) and an adhesive layer (see FIG. 2). Since the polyimide film is responsible for electrical insulation and the adhesive material is responsible for adhesion, each can be optimized, resulting in improved heat conduction characteristics. Moreover, since the rigidity after singulation can be held by a metal plate thicker than the metal foil, the reliability is remarkably improved. There is no need to ensure rigidity with transparent resin, and there are many choices of resin materials, resulting in cost reduction.

  FIG. 2 is a diagram for explaining bending of a metal plate by press working using a mold. FIG. 2A is a side view showing a metal plate to be processed (a plate metal member having high thermal conductivity such as copper or aluminum). Next, as shown in (b), a laminated film made of a metal foil with a resin (for example, a copper foil with a polyimide film attached thereto: for example, MCF-5000IR manufactured by Hitachi Chemical Co., Ltd., this material, as shown in FIG. The polyimide film has a thickness of only 5 μm, which is a very advantageous material in terms of heat resistance, and is attached using an adhesive. By making the thickness of the resin layer thinner than that of the adhesive layer, it is advantageous in terms of both cost and heat dissipation. This adhesive is preferably filled with a heat conductive filler. As a result, a two-layer insulating layer composed of a resin layer (polyimide film) and an adhesive layer is sandwiched between the metal plate and the metal foil. The polyimide film and the adhesive layer can not only provide insulation between the pair of connection electrodes of the LED chip, but also can utilize a copper foil as the connection wiring of the LED chip. Moreover, not only copper foil but metal foil (metal layer) with high heat conductivity like aluminum can be used.

  As described above, by using a two-layer structure of the resin layer and the adhesive layer as the insulating layer, the heat dissipation of the insulating layer can be greatly improved. For example, when only one layer of polyimide film is used as an insulating layer between an 18μ copper foil and a copper plate (metal plate) of around 125μm, polyimide can be used to take into account both tolerances and also serve as an adhesive force between them. For example, a film thickness of about 20 to 30 μm is required. On the other hand, when the insulating layer is divided into a polyimide film and an adhesive layer, the polyimide film thickness can be made as thin as possible. This can be realized by thinly applying polyimide on the copper foil. As a result, a polyimide film thickness of 5 μm is realized. An adhesive is further used to attach a laminate of this copper foil and a thin polyimide film. Since it is assumed that it is applied to a relatively thick plate (metal plate) of about 125 μm, the thickness of the adhesive layer is set to about 25 μm for the same reason as described above. Simply speaking, the ratio of thickness is 25 μm in the case of one insulating layer, and 25 μm + 5 μm in the case of two layers of a polyimide film and an adhesive layer, which is disadvantageous for two insulating layers. However, in the case of two insulating layers, the 5 μm polyimide film has insulation resistance, so the adhesive layer can easily increase heat conduction. For example, it can be easily realized by increasing the filling rate of a thermally conductive filler (ceramic or metal such as aluminum nitride). In general, as the thermal conductive filler is filled, the electrical insulation resistance decreases, but the electrical insulation resistance does not have to be considered by the lamination with the polyimide film. As a result, in the case of two insulating layers, for example, the total thermal conductivity can be improved by about three times compared to a single-layer adhesive having substantially the same thickness.

  In addition, the presence of the resin layer facilitates etching of the upper surface copper foil. There is no concern that the adhesive layer is eroded by the etchant during etching. However, if the heat conduction is improved only by the adhesive layer, the insulation resistance is easily sacrificed, and it is difficult to achieve both the heat conduction and the insulation resistance by a single adhesive layer.

  Next, as shown in FIG. 2C, the attached metal foil is processed to form slit openings and copper foil removal portions. For example, photolithography technology is used for this processing. A resist is applied on the metal layer (copper foil), the pattern is exposed and developed, and etching is further performed to remove the resist, thereby completing the slit opening and the copper foil removing portion. Here, the case where a slit is opened in the metal foil of the laminated film with the laminated film attached on the metal plate is illustrated, but the slit is opened in the metal foil by etching in the state of the laminated film alone. The processed laminated film can also be attached on the metal plate using an adhesive. Alternatively, the slit opening can be made by punching in the state of the laminated film alone. However, in this case, the slit is opened not only to the metal foil but also to the polyimide layer.

  Next, as shown in (d), the metal plate to which the metal foil with resin is attached is bent. This bending process is performed by pressing using a mold so as to form a recess for mounting the LED chip and a connection electrode with the upper part bent outward. As will be described later, when the connection electrode is soldered to the wiring substrate, the copper foil is removed by partially removing the connection electrode tip in order to prevent the solder from electrically shorting the connection electrode and the metal plate. Provide a part. That is, the connection electrode end is disposed inside the metal plate end. In order to prevent a solder short between the electrode end and the metal plate end, the copper foil removing portion can be provided by a slit opening step shown in FIG.

  Next, as shown in (e), metal (for example, silver) plating (metal surface treatment) that functions as a reflective material for light emission from the LED chip is applied to the entire upper surface of the metal foil. By using a metal foil as a plating electrode for the plating process, it is possible to plate only on the upper surface of the metal foil except for the slit. Alternatively, a glossy surface (reflecting material) is formed by applying an ink jet to a portion requiring metal surface treatment using silver ink and baking.

  FIG. 3 is a view showing a first LED package substrate, (A) is a view showing a state in which a plurality of LED package substrates are connected, and (B) is a view showing only one LED package substrate. It is a figure taken out and shown, (C) is a sectional view cut by AA 'line shown in (B), (D) is a sectional view cut by BB' line shown in (B) It is. In the illustrated example, 5 × 14 LED package substrates are illustrated as being simultaneously formed on a single metal plate. In a later step, after mounting the LED chip on the LED package substrate and resin-sealing, individualization is performed by dividing into individual packages or arbitrary plural connected packages. The singulation is performed along the dividing line shown in FIG. 3 (A), but by creating a connecting part for connecting a plurality of LED packages, they are electrically connected in series, The connected LED package can be provided with flexibility, and can be mounted on a heat sink or housing having an arbitrary outer surface shape such as a convex shape or a concave shape (see FIG. 11 described later).

  In the illustrated LED package substrate, a recess for mounting the LED chip is formed. Left and right wall portions are provided on both sides of the recess, and front and rear wall portions connected to and orthogonal to the left and right wall portions are provided to perform a function of confining the sealing resin from the left and right front and rear. The metal foils on the upper surfaces of the left and right wall parts (and silver plating thereon) function as a pair of connection electrodes. In addition, slits for electrically separating the pair of connection electrodes are formed in the metal foil (and silver plating thereon). An LED chip is mounted on one of the metal foils divided by the slit as described later.

  In this way, the LED package substrate has a flat bottom portion on which the LED chip is to be mounted, a light emitting direction of the LED chip in a direction where the bottom portion is located at the left and right front and back, and is bent from the bottom end. It has left and right and front and rear wall portions extending on the same side. The metal foils on the pair of left and right wall tip surfaces function as connection electrodes. The directions in which the left and right front and rear walls rise from the bottom end do not necessarily have to be orthogonal to each other. For example, the connection electrode can be raised linearly or curved upward at an angle so that the connection electrode can be positioned above the flat bottom. May be. In the example shown in the drawing, the pair of connection electrodes are separated from each other by dividing the metal foil of the flat bottom portion and the front and rear wall portions into two by slits. As will be described later (see FIG. 5), an LED chip is mounted on one of the two divided bottom metal foils to make one wire bond connection, while the other one of the two divided bottom metal foils has the other wire bond connection. do.

  FIG. 4 is a diagram showing a second LED package substrate different from FIG. 3, (A) is a diagram showing a state in which a plurality of LED package substrates are connected, and (B) is a diagram of one of them. It is a figure which takes out and shows only an LED package board | substrate, (C) is sectional drawing cut | disconnected by the AA 'line shown to (B), (D) is a BB' line shown to (B). It is sectional drawing cut | disconnected by. In the illustrated example, as in FIG. 3, 5 × 14 LED package substrates are illustrated as being simultaneously formed on one metal plate. The second LED package substrate shown in FIG. 4 is different from FIG. 3 in which walls are provided not only on the left and right but also on the front and back, in that walls are provided only on the left and right sides of the recess. In a later step, after mounting the LED chip on the LED package substrate, when the resin is sealed in the mold, the resin flowing in the left-right direction in the figure is regulated by the left and right walls, while flowing in the front-rear direction. The resin is regulated by edge processing of the package substrate, for example, by providing a wall only at the edge. The description of other configurations is the same as in FIG.

  FIG. 5 is a diagram showing a first example of LED package assembly. The LED package substrate shown in (a) is the same as the first LED package substrate shown in FIG. 3 or the second LED package substrate shown in FIG. The LED chip is fixed on the silver-plated metal foil on the flat bottom surface of the LED package substrate with an adhesive as shown in FIG. This LED chip has an LED light emitting surface on the upper surface. Although only one LED chip is illustrated, a plurality of chips can be mounted (see FIG. 7).

  Next, as shown in (c), wire bond connection is performed between the LED chip and the metal foil functioning as connection wiring. After fixing the LED chip on the bottom metal foil of the LED package substrate, each of the two-divided metal foil and a pair of connection electrodes of the LED chip are wire-bonded with a bonding wire. As described above, since silver plating is formed as a reflective material on the metal foil, this silver plating can also function for improving wire bonding.

  Next, in the resin sealing shown in (d), resin sealing (transfer molding or potting) is performed using a transparent resin (the material is, for example, epoxy or silicone). The transparent resin may be mixed with a phosphor. In general, in the case of a white LED, a yellow phosphor is disposed on an LED chip using a blue light emitting LED chip, and this phosphor receives blue and glows white. Usually, this phosphor is often mixed in a transparent resin. Resin sealing is performed by placing the connected package in a mold. Alternatively, resin sealing may be performed by a dispenser or screen printing. The height of the sealing resin is injected up to the same plane as the front end surface of the wall functioning as a connection electrode. Thereafter, the LED package is completed by dividing into individual packages or a plurality of connected packages.

  FIG. 6 is a diagram showing a second example of LED package assembly. The third LED package substrate shown in (a) is different from the above-described first or second LED package substrate in that a silver-plated metal foil is formed with a wiring pattern for flip chip mounting. Yes. An LED chip is flip-chip mounted on the flip chip mounting wiring pattern. Next, as shown in (c), the same resin sealing as described with reference to FIG. 5 is performed.

  7A and 7B are diagrams showing a third example of LED package assembly, in which FIG. 7A shows a top view of a completed LED package, and FIG. 7B shows a side sectional view. In the illustrated LED package substrate, a silver-plated metal foil is divided into three by two slits on the left and right sides. A plurality of (6 × 6 exemplified) LED chips are mounted on the central metal foil divided into three, and the wiring between the LED chips and the wiring between the LED chip and the metal foil are bonded using bonding wires. It is connected. When a plurality of chips are mounted in one package as in this case, it is premised that the chips are sufficiently inspected to be non-defective products.

  FIG. 8 is a view for explaining the assembly of the first example (see FIG. 1) of the LED module device embodying the present invention. First, as shown in (a), an LED package (see FIGS. 5, 6, and 7) and a wiring board (for example, a single-layer glass epoxy board) having an opening corresponding to the LED package are prepared. An LED package is disposed in the opening of the wiring board, and a gap between the side surface of the LED package and the wiring board is filled with an adhesive (heat-resistant and insulating adhesive). Next, as shown in (b), on this adhesive, a pair of connection electrodes of the LED package is soldered to the wiring on the upper surface of the wiring board or connected by copper, silver, or the like by inkjet. The LED chip light emitting surface is directed to the upper surface side in the figure, and emits light toward the upper surface without being blocked by the LED package substrate.

  Next, as shown in (c), the LED package with the wiring board mounted thereon is soldered on a heat sink (for example, a copper or aluminum plate). Alternatively, instead of this solder connection, it is possible to bond using a highly heat conductive adhesive. Further, instead of the heat radiating plate, it can be directly fixed to the housing.

  FIG. 9 is a diagram illustrating the assembly of the second example of the LED module device embodying the present invention. This second example uses a wiring board as a heat radiator. For this reason, the exemplary wiring board does not have an opening for mounting the LED package, and is different from the first example shown in FIG. 8 in that the LED package is mounted on the upper surface of the wiring board. ing. In the assembly of the second example of the LED module device, first, as shown in (a), a wiring board having a good thermal conductivity (for example, 1 more filled with a thermal conductive filler such as the above-mentioned aluminum nitride) The LED package is fixed to a predetermined position on the layer glass epoxy substrate) using an adhesive (heat-resistant and insulating adhesive). Alternatively, if an isolated wiring pattern is provided on the wiring board, it can be fixed by soldering. Next, as shown in (b), the space between the LED package side surface and the wiring board is filled with an insulating adhesive. Next, as shown in (c), on this insulating adhesive, a pair of connection electrodes of the LED package are soldered to the wiring on the upper surface of the wiring board or connected by copper, silver, or the like by inkjet. Heat generated from the LED chip is radiated from the LED package substrate through the wiring substrate.

  FIG. 10 is a diagram for explaining a third example of the LED module device embodying the present invention, where (A) shows a sectional view thereof, and (B) shows three LED packages mounted on a wiring board. It is a top view shown in a state. An LED package described above (see FIGS. 5, 6, and 7) and a wiring board having an opening corresponding to the LED package are prepared. The wiring board can be, for example, a single-layer glass epoxy board having a wiring layer on the back surface, but it is desirable that the wiring board be as thin as possible for light radiation, and a tape board such as polyimide may be used. When the wiring board is opened, the thickness of the board becomes a wall, and light hitting it becomes a loss. Therefore, the thinner the wall, the more advantageous. In order to reduce this loss, the wiring board shown in FIG. 10B has a large opening area and a small connecting portion with the LED package. A white resist is applied to the front surface of the wiring board to obtain a reflection effect. The LED package is disposed in the opening of the wiring board, and the connection electrode on the upper surface of the LED package is soldered to the wiring on the back surface of the wiring board. The LED chip light emitting surface is directed to the upper surface side in the figure, and emits light toward the upper surface without being blocked by the LED package substrate.

  The LED package on which the wiring board is mounted is soldered on a heat radiating plate (for example, copper or aluminum plate). Alternatively, instead of this solder connection, it is possible to bond using a highly heat conductive adhesive. Further, instead of the heat radiating plate, it can be directly fixed to the housing.

  11A and 11B are views for explaining a fourth example of the LED module device embodying the present invention. FIG. 11A is a top view of a connected configuration LED package, and FIG. 11B is a wiring diagram of the connected configuration LED package. A sectional view taken along line AA ′ in a state of being mounted on a substrate is shown. The connected configuration LED package is obtained by connecting a plurality of LED packages (illustrated as four) at a connecting portion. In the connecting portion, partial cut portions are formed on both sides of the connecting portion in order to escape distortion during drawing. By connecting at the connecting portion, it is electrically connected in series, and at the same time, it gives flexibility to the connected LED package, and the heat sink or housing having an arbitrary outer surface shape such as a convex shape or a concave shape. It can be mounted on such a radiator. There is no connecting portion on the most end side of the connected LED package, and connection electrodes are formed here. And this connection structure LED package is mounted in a wiring board. As described above with reference to FIG. 8, the mounting on the wiring board is performed by filling the space between the LED package side surface and the wiring board with an insulating adhesive, and then connecting the insulating adhesive on the insulating adhesive. A pair of connection electrodes of the configuration LED package are soldered to the wiring on the upper surface of the wiring board or connected by copper, silver, or the like by inkjet.

Although several embodiments have been described in detail in the present disclosure by way of example only, many modifications may be made to the embodiments without substantially departing from the novel teachings and advantages of the present invention. Examples are possible.

Claims (17)

In an LED module device in which an LED package substrate for an LED chip is configured by bending a metal plate made of a plate material having a predetermined plate thickness , and the LED package using the substrate is mounted on a wiring substrate.
The LED package substrate is bent so as to integrally form a flat bottom portion for mounting an LED chip, a wall portion rising from both sides of the bottom end, and a connection electrode portion where the upper portion of the wall portion is bent outward. Two insulating layers comprising a resin layer and an adhesive layer between the metal plate and the metal foil provided with a metal foil that has been subjected to a metal surface treatment that functions as a reflector on the processed metal plate With a laminated structure
A slit is opened in the metal foil on the upper surface of the flat plate-like bottom so that the metal foil at the upper end of the connection electrode part where the upper part of the wall part is bent outwards functions as a pair of external connection electrodes, and the pair of external connections The end of the electrode is placed inside the end of the metal plate,
An LED chip is mounted on the upper surface of the flat bottom of the LED package substrate, a pair of electrodes of the LED chip are connected to each of the metal foils separated by the slit, and a transparent resin is attached to the wall portion. Configure the LED package by filling the sandwiched recess,
Together to fix or contacting the flat bottom rear surface of the front Symbol LED package to the heat radiating body, and mounting the LED package on the opening of the circuit board which is spaced between the heat radiating body, the metal plate end An LED module device comprising the pair of external connection electrodes arranged on the inner side and connected to wiring of a wiring board . The LED module device according to claim 1, wherein the adhesive layer is filled with a heat conductive filler. The LED module device according to claim 1, wherein the LED package is mounted on the wiring board by solder-connecting the pair of external connection electrodes to the wiring on the back surface of the wiring board. The LED module device according to claim 1, wherein the LED package is mounted on the wiring board by connecting the pair of external connection electrodes to the wiring on the front surface of the wiring board. The LED module device according to claim 1, wherein the resin layer is thinner than the adhesive layer. The LED module device according to claim 1, wherein the pair of electrodes of the LED chip are connected by wire bond connection or flip chip connection. There are two slits, the metal foil is divided into three by two slits, a plurality of LED chips are mounted on the central metal foil divided into three, and the wiring between the LED chips and the LED chip The LED module device according to claim 1, wherein the wiring with the metal foil is connected using a bonding wire. 2. The LED module device according to claim 1, wherein the radiator is a radiator plate or a housing, or the flat bottom bottom surface of the LED package substrate is fixed to the wiring substrate to cause the wiring substrate to function as a radiator. 2. The LED module device according to claim 1, wherein the LED module device has a function of confining the sealing resin from the left and right front and rear sides by providing a front and rear direction wall portion that is connected to and orthogonal to the left and right wall portions rising from both sides of the bottom end. 2. The LED module device according to claim 1, wherein the LED package is a connected LED package configured by connecting a plurality of LED packages and electrically connecting them in series. In a manufacturing method of an LED module device in which an LED package substrate for an LED chip is configured by bending a metal plate made of a plate material having a predetermined thickness , and the LED package using the substrate is mounted on a wiring substrate ,
On the metal plate, the resin layer side of the laminated film made of a metal foil with a resin layer is attached using an adhesive, and the resin layer and the adhesive layer are between the metal plate and the metal foil. Forming a laminated structure sandwiching two insulating layers,
Before or after pasting the laminated film on the metal plate, processing the metal foil, opening a slit,
The laminated structure including the metal plate is bent to form a flat bottom on which the LED chip is to be mounted, and the LED is positioned on both sides of the bottom to bend and rise from the bottom end. A wall portion extending on the same side as the light emitting direction of the chip is provided, and the upper portion of the wall portion is bent outward to form a pair of external connection electrodes to constitute an LED package substrate,
An LED chip is mounted on the LED package substrate, one of the LED chip electrodes is connected to one of the bottom metal foils of the LED package substrate divided by the slit, and the other of the divided bottom metal foils Connects the other of the LED chip electrodes,
Resin-sealing with a transparent resin to form an LED package,
Together to fix or contacting the flat bottom rear surface of the front Symbol LED package to the heat radiating body, and mounting the LED package on the opening of the circuit board which is spaced between the heat radiating member, said pair of external A method of manufacturing an LED module device, comprising connecting a connection electrode to a wiring of a wiring board . The method for manufacturing an LED module device according to claim 11, wherein the adhesive layer is filled with a heat conductive filler. The method of manufacturing an LED module device according to claim 11, wherein the slit opening is formed by etching the metal foil on the resin layer. A plurality of the LED package substrates are simultaneously formed on a single metal plate, an LED chip is mounted on the LED package substrate and resin-sealed, and then individual LED packages or arbitrary connected LEDs are connected. The manufacturing method of the LED module apparatus of Claim 11 which divides and separates into a package. The manufacturing method of the LED module apparatus of Claim 11 which performs the metal surface treatment which functions as a reflecting material on the said metal foil. The LED module device according to claim 11, wherein the heat dissipating member is a heat dissipating plate or a housing, or the flat bottom bottom surface of the LED package substrate is fixed to the wiring substrate to function as the heat dissipating member. Production method. The manufacturing method of the LED module apparatus of Claim 11 which provides the front-back direction wall part which is connected to the left-right direction wall part which stands | starts up from the both sides of the said bottom part edge, respectively, and encloses sealing resin from right-left front-back.