JP2012049486A - Led package and manufacturing method therefor, and led module device configured of the same led package and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable restrictive injection of an expensive LED chip sealing resin, while adopting a metal-formed lead frame structure as an LED chip package substrate.SOLUTION: A lead frame includes: a main body for mounting the LED chip thereon; and a pair of wall portions positioned on both sides of the main body and extending to the identical side of the light emitting direction of the LED chip in the direction orthogonal to the main body. The pair of wall portions is mutually separated by an opening that separates the lead frame, so as to function as a pair of connection electrodes. By the fixation of the LED chip to the front surface of the lead frame main body, each connection electrode of the LED chip is connected to each separated lead frame. By using a transparent resin, resin sealing is made into a space between the wall portions on both sides of the lead frame. An insulating layer is adhered to the back face of the lead frame by an adhesive agent.

Description

  The present invention relates to an LED package that uses a lead frame to form a package substrate for an LED chip and a manufacturing method thereof, and an LED module device that uses the LED package and a manufacturing method thereof.

  An LED (Light Emitting Diode) is widely used as an element that has both low power consumption, reduced carbon dioxide, high durability, and energy saving. Such an LED is used for a large display, a backlight of an electronic device such as a mobile phone, a digital video camera, or a PDA, a road lighting, a general lighting, etc. by mounting a chip-mounted package on a mounting substrate. . Since the LED itself is a light emitting element and emits heat, the LED package basically includes a heat dissipation device for cooling.

  In the current LED module, a ceramic substrate, a silicon substrate, or a metal substrate is used as the LED package substrate. However, in a method using a conventional ceramic substrate (see Patent Document 1) or silicon substrate (see Patent Document 2), a ceramic substrate is used. There is a problem that heat conduction of silicon and silicon is worse than that of metal such as copper, so that heat cannot be radiated well, it is expensive, and processing is difficult.

  Also, although a metal substrate is used as the LED package substrate, there is a large thermal resistance between the metal substrate and the wiring substrate because it is thickly covered with resin, and the heat dissipation is greatly improved compared to ceramics etc. Absent. FIG. 15 is a diagram illustrating a conventionally known light emitting device (see Patent Document 3). As shown in the figure, a copper foil pattern constituting a lead electrode is formed on the surface of a stainless steel substrate via an insulating film. A through hole is formed in the stainless steel substrate, and a copper support is fitted into the through hole. The LED chip is placed in a recess formed at the tip of the copper support. Each electrode of the LED chip and a copper foil pattern provided on the surface of the substrate are wire-bonded. Thereafter, a lens is formed by potting and curing a translucent resin such as a silicon resin. The silicon resin functioning as a lens is provided so as to cover the protrusions of the support, the light emitting elements, and even the wires bonded to the electrodes.

  Although resin sealing is applied to the bonding connection portion of the LED chip electrode, the configuration shown in the drawing has a problem that the resin cannot be efficiently injected only into a necessary portion. A translucent resin such as silicon resin for resin sealing is expensive, and therefore a structure for injecting resin more specifically is required.

  FIG. 16 is a schematic cross-sectional view of a conventionally known light emitting diode (see Patent Document 4). Lead electrodes connected by tie bars are formed by punching and pressing a metal flat plate made of stainless steel. One of the lead electrodes facing each other is provided with a recess in which the LED chip is disposed. After the LED chip is mounted in the recess, each electrode of the LED chip and a pair of lead electrodes are wire bonded. After wire bonding, the LED chip is placed in a mold for injection molding, and an epoxy resin is injected to mold the resin. The formed light emitting diode has a structure in which a pair of lead electrodes are extended to face each other.

  However, since the metal base on which the LED chip is mounted is covered with resin thickly, this resin portion not only has a large thermal resistance, but a translucent resin such as silicon resin for resin sealing is expensive. As described above with reference to FIG. 15, a configuration for injecting resin more specifically is required. In addition, this type of LED package requires efficient interconnection means and heat dissipation means for cooling, especially when a plurality of LED packages are used in connection with each other. It has not been.

JP 2005-158957 A JP 2000-106458 A JP 2002-335019 Japanese Patent No. 3255284

  The present invention solves such problems, and as a LED chip package substrate, adopts a metal lead frame structure capable of realizing highly efficient exhaust heat, devises the shape of the package substrate, and on the back surface By providing a thin insulating layer, an object of the present invention is to make it possible to inject a sealing resin for an expensive LED chip more limitedly and without leaking.

  Further, the present invention comprises a package substrate itself made of a lead frame as a part of an electrode, and separates an electrical connection portion from a heat sink or a housing on which the package substrate is mounted, without using a wiring substrate, In particular, it is an object to simplify electrical connection between package substrates that are used by connecting a plurality of packages. Furthermore, the chip mounting side of the lead frame is covered with resin, and the back side is covered with a thin insulating layer with an adhesive layer, so that the entire lead frame is covered with resin to improve the adhesion between the lead frame and the resin. It aims to improve the degree.

  In addition, the present invention achieves low cost and highly efficient exhaust heat by optimizing the cost performance of heat dissipation and electrical connection by separating the electrical connection part from the heat sink or the housing. It is an object.

  The LED package of the present invention is configured by using a lead frame as a substrate and mounting an LED chip on the substrate. The lead frame has a flat plate-like main body portion on which the LED chip is mounted, and a pair of wall portions that are located on both sides of the main body portion, bent from the main body portion, and extend to the same side as the light emitting direction of the LED chip. The plate member is formed by processing, and the pair of wall portions are separated from each other by an opening that divides the main body portion, and functions as a pair of connection electrodes. The LED package includes a lead frame, an LED chip fixed to the front surface of the main body of the lead frame and connected to each of the divided lead frames, and an insulating layer attached to the back side of the lead frame having an opening. And a transparent resin that is resin-sealed in a space regulated by the wall portions on both sides of the lead frame.

  The LED module device of the present invention is configured by fixing or contacting the insulating layer side of the LED package on a heat sink or a housing.

  The LED package manufacturing method of the present invention electrically separates the pair of electrodes from a cavity that is a recess for mounting the LED chip, wall portions that also function as a pair of left and right electrodes on both sides of the cavity. A plurality of lead frames in which openings are formed are formed by pressing or etching a metal plate member in a connected state. An insulating layer is attached to the back surface of the lead frame using an adhesive, and the LED chip is fixed to the front surface of the main body of the lead frame. After fixing the LED chip, each of the lead frames divided by the opening and the connection electrodes of the LED chip are connected. The resin is sealed with a transparent resin in the space regulated by the wall portions on both sides of the lead frame, and then separated into individual packages or a package in a state where a predetermined number of packages are connected. After the resin sealing, the insulating layer can be peeled off. The lead frame cavity can be silver-plated as a reflective material.

  The LED module device manufacturing method of the present invention is configured by fixing or contacting the insulating layer side of the LED package or the bottom surface side of the peeled LED package on a heat sink or a housing. A resin film reinforced with a metal layer or an adhesive layer is used as the insulating layer, and the insulating layer side is attached to the back surface of the lead frame, while the metal layer side is fixed on the heat sink.

  According to the present invention, while devising the shape of the lead frame and providing a thin insulating layer (tape) on the back surface, an expensive LED chip sealing resin is injected only in a necessary place, The leakage of the resin can be prevented. Further, since the package substrate itself is configured as a part of the electrode, low cost can be realized. In addition, the lead frame is covered with resin on the chip mounting side, and the back side is covered with an insulating layer with an adhesive layer, so that the entire lead frame is wrapped in a resin system, and improvement in adhesion between the lead frame and the resin can be expected. Reliability is improved.

  According to the present invention, the lead frame main body portion on which the LED chip is mounted is separated from the wiring for electrical connection, so that heat dissipation and electrical connection can be optimized for cost performance, and the overall cost-effective and highly efficient discharge can be achieved. Heat can be realized. Although a heat sink can be provided on the back surface of the lead frame main body portion, if the housing is brought into direct contact with the back surface of the main body portion, the housing can be used as a heat sink, so that an inexpensive configuration can be achieved.

  Since heat dissipation is promoted in the present invention, the output can be higher than before (it can be brightened). Or, it is possible to extend the life with the same output as the conventional one. Furthermore, since a general metal material is used, it can be manufactured at low cost.

(A) is side sectional drawing which shows the 1st example of the LED module of this invention which comprised the package board | substrate using the lead frame manufactured by the etching process, (B) is the LED package shown to (A) It is side surface sectional drawing which takes out only and shows in detail, (C) is a top view. (A) is side surface sectional drawing which shows the 2nd example of the LED module of this invention which comprised the package board | substrate using the lead frame manufactured by press work, (B) is the LED package shown to (A) It is side surface sectional drawing which takes out only and shows in detail, (C) is a top view. (A) is a top view of a lead frame by etching shown in a state of being connected in a plurality of arrays, and (B) is cut along the line XX ′ showing only the left one block shown in (A). It is sectional drawing. (A) is a side view of a lead frame, and (B) is a top view thereof. (A) is a top view of a lead frame by press working shown in a state of being connected in an array, and (B) is a cross-sectional view showing only one left block cut by a line S in (A). is there. (A) is a side view of a lead frame, and (B) is a top view thereof. (A) is a figure which shows the 1st example of LED package assembly, (B) shows the top view in the case of 1 chip / package, (C) shows the top view in the case of multiple chips / package Yes. It is a figure which shows the 2nd example of LED package assembly. (A) is side surface sectional drawing which shows the 3rd example of the LED module of this invention, and the LED package which peeled the insulating film at the last process as it demonstrated with reference to FIG. 8 (lead frame by etching process) (B) is a side sectional view showing a fourth example of the LED module of the present invention, to the heat sink of the LED package (lead frame by press working) from which the insulating film has been peeled off. Each installation is shown. (A) is side sectional drawing which shows the 5th example of the LED module of this invention, and shows attachment to the heat sink of LED package (lead frame by etching process) with a laminated insulating tape, (B) FIG. 10 is a side sectional view showing a sixth example of the LED module of the present invention, showing attachment of an LED package with a laminated insulating tape (lead frame by pressing) to a heat sink, and (C) is a laminated insulating tape. Details are shown respectively. (A) is side sectional drawing which shows the 7th example of the LED module of this invention, and is an LED package (lead frame by press processing) with a back surface reinforcement adhesive agent (copper foil which adhered the adhesive bond layer). The attachment to a heat sink is shown, (B) has each shown the detail of the back surface reinforcement adhesive agent. (A) is a figure which shows the example of a connection of a connection structure LED package, is a top view of the LED module arrange | positioned on a heat sink, (B) is an equivalent circuit diagram which shows the electrical connection. (A) is a figure which illustrates the external connection of an LED package, and shows the case where it connects on an electrode part upper surface, (B) has each shown the case where it connects on an electrode part side surface. (A) is a figure which shows the module apparatus for LED illumination which actualized this invention in the incandescent bulb-shaped illuminating device, (B) is the module apparatus for LED illumination embodied in the straight tube fluorescent lamp-shaped illuminating device. FIG. It is a figure which illustrates a conventionally well-known light-emitting device. It is typical sectional drawing which illustrates a conventionally well-known light emitting diode.

  Hereinafter, the present invention will be described based on examples. FIG. 1A is a side cross-sectional view showing a first example of an LED module of the present invention in which a package substrate is configured using a lead frame manufactured by etching, and FIG. 1B is a side view of FIG. It is side surface sectional drawing which takes out only an LED package and shows it in detail, (C) is a top view. FIG. 2A is a side cross-sectional view showing a second example of the LED module of the present invention in which a package substrate is formed using a lead frame manufactured by press working, and FIG. It is side surface sectional drawing which takes out only the LED package shown to and shows in detail, (C) is a top view. As is well known, the lead frame is manufactured by etching or pressing. As the lead frame material, a conventionally used material such as copper, a copper alloy, or an iron alloy can be used.

  The lead frame illustrated in FIG. 1B is formed by etching, whereas the lead frame illustrated in FIG. 2B is different in that it is formed by pressing. In both FIG. 1 (A) and FIG. 2 (A), the lead frame is exemplified as being bonded on the heat sink using a high heat conductive adhesive (for example, Toray: high heat conductive adhesive sheet TSA). However, a laminated insulating tape as shown in FIG. 10C, which will be described later, or a back surface reinforcing adhesive as shown in FIG. 11B can also be used. Insulation between the pair of connection electrodes is performed by a sealing resin and an insulating film.

  As the heat sink (heat sink), for example, a heat sink such as a copper plate, an aluminum plate, or a mixed material of aluminum and carbon is bonded. Alternatively, it can be directly fixed or brought into contact with the housing without attaching a heat sink. Thereby, the heat generated from the LED chip is radiated through the lead frame and further through the heat sink. However, it replaces with a heat sink and the housing | casing which mounts an LED package can be utilized as a heat sink.

  Each of the lead frames shown in FIGS. 1B and 2B has a flat plate-like main body portion on which the LED chip is mounted, and is positioned on both sides of the main body portion and orthogonal to the flat plate portion. A pair of wall portions extending in the same direction as the light emitting direction of the LED chip are provided. The tip surfaces of the pair of wall portions function as connection electrodes. At least a pair of connection electrodes are separated from each other by an opening.

  An insulating film (insulating tape) is attached to the back surface of the lead frame using an adhesive. An LED chip is fixed to the front surface of the main body of the lead frame using an adhesive. This LED chip has an LED light emitting surface on the upper surface, and a bonding wire connection electrode is formed around the LED light emitting surface. After the LED chip is fixed on the main body of the lead frame, wire bonding is performed between each of the two-part lead frames and the connection electrodes of the LED chip with bonding wires. Next, resin sealing is performed using a transparent resin. The lateral direction of the sealing resin is regulated by the wall portions (connection electrodes) on both sides of the lead frame. The height of the sealing resin is the same plane as the leading end surface of the lead frame wall that functions as a connection electrode. The wall portion functions to confine the sealing resin. By providing the insulating film on the back surface (bottom surface) side of the lead frame, the resin does not leak through the opening. Further, by providing the insulating film, it is possible to insulate the LED module connection electrode when assembled on the heat sink (or housing).

  Since the lead frame is physically separated by the opening, when there is no insulating film, both side portions are held only by the rigidity of the resin. That is, the package is constituted by the adhesion between the frame and the resin and the rigidity of the resin. On the other hand, if the back surface is fixed with an insulating film (insulating tape) with an adhesive layer, the tape fixes the frame up and down via the resin and adhesive layer on the chip side, so the stress on the left and right due to the difference in thermal expansion coefficient is Since the stress is reduced and the stress is distributed upward, the left and right stress applied to the bonding wire is reduced, and the reliability can be improved. However, the tape may not be provided as long as the adhesive and the heat sink have sufficient adhesion and have a fixing force equal to or greater than that of the insulating tape (see FIG. 8).

  Next, formation of a lead frame by etching used for the LED package of FIG. 1 will be described with reference to FIGS. FIG. 3A shows a top view of the lead frame shown in a state of being connected in a plurality of arrays, and FIG. 3B is a cross section taken along the line XX ′ showing only one left block shown in FIG. The figure is shown. In the illustrated example, 3 × 9 lead frames are illustrated as being simultaneously formed on a plate-like member. In the illustrated example, the connecting portion between the LED packages is formed by half-cutting a lead frame. It can also be used in a state where a plurality (for example, three) are connected, or can be used separately by cutting the connecting portion.

  Next, the lead frame shown in FIG. 3 will be further described with reference to FIG. 4 showing only one of the lead frames in detail. 4A is a side view of the lead frame, and FIG. 4B is a top view thereof. Here, only one lead frame is shown, but in actual manufacturing, the LED package is assembled in a state where a plurality of lead frames are connected as illustrated in FIG. Each lead frame is formed with a cavity that is a recess for mounting the LED chip. On both sides of the cavity, a wall portion that also functions as a pair of left and right electrodes and an opening for electrically separating the pair of electrodes are formed. This opening is formed by etching. The wall portion not only functions as an electrode but also functions to confine the sealing resin.

  As described above, the lead frame has a flat plate-like main body portion on which the LED chip is to be mounted, and a light emitting direction of the LED chip in a direction rising from the flat plate portion located on both sides of the main body portion. A pair of walls extending on the same side is provided. The tip surfaces of the pair of wall portions function as connection electrodes. Moreover, it is also possible to use the upper outer surface of this pair of wall part as a connection electrode (refer FIG. 13). In the illustrated example, the wall portion is illustrated as rising from the flat plate portion in a direction orthogonal to the flat plate portion. It may be raised linearly or curved upward. At least a pair of connection electrodes are separated from each other by an opening. In the illustrated example, the pair of connection electrodes are separated from each other by dividing the flat plate-like main body portion into two by openings. As will be described later (see FIG. 7), an LED chip is mounted on one of the two divided main body parts to make one wire bond connection, while the other wire bond connection is made to the other of the main body part.

  Next, formation of a lead frame by press working using a mold used in the LED package of FIG. 2 will be described with reference to FIGS. FIG. 5A is a top view of the lead frame shown in a state of being connected in a plurality of arrays, and FIG. 5B is a cross-sectional view showing only the left block cut along the line S in FIG. . First, a plate-like member to be processed is slit-pierced (slits P and Q in the figure). The pair of electrodes are separated from each other by the slit Q (opening shown in FIG. 5B). The slit P is for making it easy to bend the electrode part of the package at the end of the lead frame in the vertical direction. Next, the plate member is bent at the same time as the cavity is formed. The cavity is a recess for mounting the LED chip.

  In this way, the lead frame can be formed by pressing using a mold. In the illustrated example, 3 × 9 lead frames are illustrated as being simultaneously formed on a plate-like member. The LED package is illustrated as being configured by connecting three LED packages at the connecting portion, but the LED package is not limited to three, and any number of LED packages can be connected. The size per LED package is, for example, about 3.2 × 2.8 × 0.5 mm. Moreover, the center part of a connection part becomes a dicing line. The dicing line is a cutting area for dividing into individual packages in a later process, and when this cutting area is left uncut, it is a connection for connecting a plurality of LED packages. It functions as a part. The connecting portion is electrically connected in series at the same time, and at the same time imparts flexibility to the connected configuration LED package, for example, an arbitrary shape such as a convex shape or a concave shape as described later with reference to FIG. It can be mounted on a heat sink or housing having an outer surface shape.

  Next, the lead frame shown in FIG. 5 will be further described with reference to FIG. 6A is a side view of the lead frame, and FIG. 6B is a top view thereof. Here, only one lead frame is shown, but in actual manufacture, the LED package is assembled in a state where a plurality of lead frames are connected as illustrated in FIG. Each lead frame has an opening in the main body for electrically separating a pair of left and right wall portions (electrode portions). This opening is formed by slit perforation as described above.

  In this way, the lead frame is a flat plate-like main body portion on which the LED chip is to be mounted, and bends from the flat plate portion on both sides of the main body portion, obliquely upward, in a direction substantially orthogonal, A pair of wall portions extending on the same side as the light emitting direction of the LED chip are provided. As will be described later, the pair of wall portions not only function as a regulating surface of the sealing resin but also function as an electrode portion, and the tip surfaces thereof become connection electrodes.

  FIG. 7A is a diagram showing a first example of LED package assembly, where FIG. 7B is a top view in the case of one chip / package, and FIG. 7C is a top view in the case of multiple chips / package. Show. Here, a lead frame by etching (see FIGS. 3 and 4) will be described as an example, but a similar assembly can be performed for a lead frame by press working (see FIGS. 5 and 6). First, in the tape attaching process, an insulating film (insulating tape) is attached to the back surface of the lead frame using an adhesive. An adhesive tape may be used. Alternatively, a laminated insulating tape as shown in FIG. 10C described later, or a back surface reinforcing adhesive as shown in FIG. 11B may be used. Thus, by providing an insulating film on the back surface (bottom surface) side of the lead frame, the resin does not leak through the opening during resin sealing, so that waste of resin at the time of manufacture can be eliminated, and the adhesive However, the resin and the insulating film are integrated, and the resin wraps the lead frame from both the front and back surfaces. As a result, the adhesion between the resin and the lead frame can be improved.

  Next, in the chip mounting step, the LED chip is fixed to the front surface of the main body portion of the lead frame using an adhesive. This LED chip has an LED light emitting surface on the upper surface, and a bonding wire connection electrode is formed around the LED light emitting surface. Moreover, by silver plating as a reflecting material inside the cavity, this silver plating can also function to improve wire bonding properties. Note that only one LED chip can be used (FIG. 7B) or a plurality of chips can be mounted (FIG. 7C).

  In the chip mounting process, after the LED chip is fixed on the main body of the lead frame, each of the two-part lead frame and the connection electrode of the LED chip are wire-bonded with a bonding wire. Next, in the resin sealing step, resin sealing (transfer molding or potting) is performed using a transparent resin (a material is, for example, an epoxy type). The transparent resin may be mixed with a phosphor. In general, in the case of a white LED, a yellow phosphor is disposed on an LED chip using a blue light emitting LED chip, and this phosphor receives blue and glows white. Usually, this phosphor is often mixed in a transparent resin. Resin sealing is performed by placing the connected package in a mold. Therefore, another LED package in a connected state is located in the vertical direction of the LED package shown in FIG. 7B or 7C, and the outermost resin is regulated by the mold. Alternatively, resin sealing may be performed by a dispenser or screen printing. In this case, the outermost ends of the lead frame are provided with a work for resin fixing, such as dam formation. The lateral space for resin sealing is regulated by the wall portions (connection electrodes) on both sides of the lead frame. The height of the sealing resin is injected up to the same plane as the front end surface of the lead frame wall that functions as a connection electrode. After that, for example, the connected LED package is completed by separating into three packages that are connected three by three.

  FIG. 8 is a diagram showing a second example of LED package assembly. The processes up to the tape attaching process, the chip mounting process, and the resin sealing process are as described with reference to FIG. In the second example, in the tape peeling step, the insulating film (insulating tape) is peeled after the resin sealing step. This insulating film can prevent the resin from leaking through the opening at the time of resin injection, but there is no problem even if it is peeled after the resin is cured. The insulating film has a function of electrically insulating the pair of connection electrodes from each other when the lead frame is fixed on a conductor such as a heat sink. If there is, see FIG. 9), there is no problem even if it peels.

  FIG. 9A is a side sectional view showing a third example of the LED module of the present invention. As described with reference to FIG. 8, the LED package (lead by etching process) from which the insulating film has been peeled off in the final process is shown. (B) is a side cross-sectional view showing a fourth example of the LED module of the present invention, and heat dissipation of the LED package (lead frame by press working) from which the insulating film has been peeled is shown. The attachment to the board is shown respectively. In any case, the lead frame is illustrated as being bonded onto the heat sink using a highly heat conductive adhesive, and the insulating layer is insulated by the adhesive layer. However, as in FIGS. 1A and 2A, a housing in which the LED module is mounted can be used as a heat sink instead of the heat sink.

  FIG. 10 (A) is a side sectional view showing a fifth example of the LED module of the present invention, showing attachment of an LED package with laminated insulating tape (lead frame by etching process) to a heat sink, (B ) Is a side sectional view showing a sixth example of the LED module of the present invention, showing attachment of an LED package with a laminated insulating tape (lead frame by pressing) to a heat sink, and (C) is a laminated layer. Details of the insulating tape are shown respectively. The laminated insulating tape is attached in place of the insulating film in the drawing in the tape attaching step illustrated in FIG. As shown in FIG. 10C, the details of the laminated insulating tape are as follows. Copper foil with resin (copper foil with polyimide film attached: for example, MCF-5000IR manufactured by Hitachi Chemical Co., Ltd.) This material has a polyimide thickness of only 5μm The polyimide film side of the material (which is very advantageous in terms of thermal resistance) is attached to the bottom surface of the lead frame using an adhesive. The polyimide film and adhesive layer not only provide insulation between the pair of connection electrodes of the lead frame, but also can be fixed to the heat sink by soldering with the copper foil on the back surface. It becomes possible. Instead of soldering, it can also be affixed using a high thermal conductive adhesive (for example, Toray: high thermal conductive adhesive sheet TSA), and is not limited to copper foil, but also a high thermal conductive metal foil such as aluminum. (Metal layer) can be used.

  FIG. 11A is a side sectional view showing a seventh example of the LED module of the present invention, and is an LED package with a back reinforcing adhesive (copper foil with an adhesive layer attached) (lead frame by press working). ) Is attached to the heat sink, and (B) shows details of the back surface reinforcing adhesive, respectively. The back surface reinforcing adhesive is attached in place of the insulating film in the drawing in the tape attaching process as illustrated in FIG. The adhesive layer adhered to the copper foil has both an adhesive function and an insulating function. The adhesive layer side of the copper foil with an adhesive layer as shown in FIG. 11B is attached to the bottom surface of the lead frame without using an additional adhesive. This adhesive layer (adhesive with strong adhesion to metal) not only insulates between the pair of connection electrodes of the lead frame, but also fixes it to the heat sink with the copper foil on the back surface by soldering etc. It is possible to assemble a module with high heat dissipation. In addition, as above-mentioned, not only copper foil but metal foil (metal layer) like aluminum can be used.

  The module assembly illustrated in FIG. 11 is performed as follows. First, a mounting substrate (for example, a single-layer glass epoxy substrate) having an opening corresponding to the LED package is attached to the heat sink by adhesion or the like, and the above-described back surface reinforcing adhesion is performed so as to be positioned at the opening. The LED package with the agent attached is soldered to the heat sink. Instead of this solder connection, it is also possible to bond using a highly heat conductive adhesive. Next, the gap between the LED package side surface and the mounting substrate is filled with an adhesive, and on this adhesive, a pair of external electrodes of the lead frame are soldered to the wiring on the upper surface of the mounting substrate, or copper or Connect with silver etc. The LED chip light emitting surface is directed to the upper surface side in the figure, and emits light toward the upper surface without being blocked by the mounting substrate.

  FIG. 12A is a diagram illustrating a connection example of the LED package having the connection configuration, and is a top view of the LED module disposed on the heat sink, and FIG. 12B is an equivalent circuit diagram illustrating the electrical connection. In the example shown in the figure, a plurality of (5 × 5) LED packages are arranged on a single heat sink (heat sink), and five sets of series connection are made into one set, and the five sets are connected in parallel. Shows the case. After the back surfaces of the plurality of LED packages are mounted on the heat sink via an insulating sheet to form the LED module device, the LED packages are electrically connected to each other (series connection portion and parallel connection portion in the figure). And it completes by connecting with a power supply terminal (the external connection part in a figure, refer FIG. 13). This electrical connection can be made by wire bonding, copper wiring, solder dispenser, or copper inkjet wiring. In the case of inkjet wiring, wiring is performed after the gap is slightly filled with an insulating material. About a serial connection part, it can also connect using the connection part (refer FIG. 3 (B) and FIG. 5 (B)) between lead frames. Note that FIG. 12 illustrates the case where five packages connected in series are taken as one set, and the five sets are connected in parallel, but conversely, connecting the packages connected in parallel is connected in series, and all LED packages are connected in series. Any connection form of any number of packages is possible, such as connection or parallel connection.

  FIG. 13A is a diagram illustrating the external connection of the LED package, showing a case of solder connection on the upper surface of the electrode part, and FIG. 13B showing a case of connection on the side surface of the electrode part. As shown in the figure, the external connection with the power supply terminal can be made with a copper wire soldered to the upper surface or side surface of the electrode portion with respect to the electrode portion of the LED package.

  FIG. 14A is a diagram showing an LED lighting module device in which the present invention is embodied in an incandescent bulb-shaped lighting device, and FIG. 14B is an LED lighting device in which a straight tube fluorescent lamp-shaped lighting device is embodied. It is a figure which shows a module apparatus. In FIG. 14A, the connection configuration LED package of the incandescent light bulb-shaped lighting device is illustrated as being mounted on a heat sink (or a housing) having a convex outer surface. According to the present invention, by separating the electrical connection and the heat dissipation, it can be mounted on a heat dissipation structure having an arbitrary outer surface shape (a convex portion or a concave portion).

  FIG. 14B is a diagram illustrating a straight tube fluorescent lamp-shaped illumination device. In the example shown in the figure, two LED packages connected in series (connected in groups of three) connected in series by a central connection portion are arranged on one heat sink (for example, aluminum). Yes. The LED packages connected three by three are connected to each other by connecting the lead frames themselves. A very thin insulating film is sandwiched between the lead frame and the heat sink. This connected configuration LED package is wired and connected to power supply terminals at both ends. Thus, the illuminating device of the present invention can also be mounted on a heat radiating structure (heat sink) on the outer surface of the flat surface.

Although several embodiments have been described in detail in the present disclosure by way of example only, many modifications may be made to the embodiments without substantially departing from the novel teachings and advantages of the present invention. Examples are possible.

Claims (12)

In an LED package using a lead frame as a substrate and mounting an LED chip on the substrate,
The lead frame includes a flat plate-like main body portion on which the LED chip is mounted, and a pair of wall portions that are located on both sides of the main body portion and bent from the main body portion and extend to the same side as the light emitting direction of the LED chip. Formed by processing a metal plate member, and the pair of wall portions are separated from each other by an opening that divides the main body portion, and functions as a pair of connection electrodes; and
The lead frame, the LED chip fixed to the front surface of the main body of the lead frame and connected to each of the divided lead frames, and the insulation adhered to the back surface of the lead frame having the opening An LED package comprising a layer and a transparent resin resin-sealed in a space between the wall portions on both sides of the lead frame. The LED package according to claim 1, wherein a phosphor is mixed into the resin-sealed transparent resin. The LED package according to claim 1, wherein the insulating layer is reinforced with a metal layer. The LED package according to claim 3, wherein an adhesive layer or a resin film with an adhesive layer is used as the insulating layer reinforced by the metal layer. The LED module apparatus comprised by fixing the insulating layer side of the LED package of Claim 1 on a heat sink or a housing | casing, or making it contact. In a manufacturing method of an LED package using a lead frame as a substrate and mounting an LED chip on the substrate,
A plurality of leads in which a cavity that is a recess for mounting an LED chip, wall portions that also function as a pair of left and right electrodes on both sides of the cavity, and openings for electrically separating the pair of electrodes are formed Create the frame by pressing or etching the metal plate members in a connected state,
An insulating layer is attached to the back surface of the lead frame, and the LED chip is fixed to the front surface of the main body of the lead frame,
After fixing the LED chip, each of the lead frames divided by the opening and the connection electrodes of the LED chip are connected,
After resin sealing using a transparent resin in the space between the wall portions on both sides of the lead frame, it was separated into individual packages or a package in a state where a predetermined number of the packages were connected.
An LED package manufacturing method comprising: The method of manufacturing an LED package according to claim 6, wherein the insulating layer is peeled after the resin sealing. The method of manufacturing an LED package according to claim 6, wherein the lead frame cavity is silver-plated as a reflective material. The manufacturing method of the LED module apparatus comprised by fixing or contacting the insulating layer side of the LED package of Claim 6 on a heat sink or a housing | casing. 8. A separate insulating layer is attached to the back side of the lead frame from which the insulating layer according to claim 7 has been peeled off, and the lead frame is fixed on a heat sink or a housing via the separate insulating layer. Or the manufacturing method of the LED module apparatus comprised by making it contact. The method of manufacturing an LED module device according to claim 10, wherein the another insulating layer is reinforced by a metal layer, and the metal layer side is fixed or brought into contact with a heat sink or a housing. The method for manufacturing an LED module device according to claim 11, wherein an adhesive layer or a resin film with an adhesive layer is used as another insulating layer reinforced by the metal layer.

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