TWI513068B - Led structure, metallic frame of led structure, and carrier module - Google Patents

Description

Light-emitting diode structure, metal bracket of light-emitting diode structure, and bearing block module

The present invention relates to a light-emitting structure, and more particularly to a light-emitting diode structure, a metal bracket of a light-emitting diode structure, and a carrier module for mounting a plurality of light-emitting diode chips.

The traditional LED structure with high wattage output has been replaced by Thermoplastic plastics. However, since the ratio of the contact area between the metal bracket and the plastic which has a conventional light-emitting diode structure is small, many problems arise, such as a problem of bonding between the conductive frame and the plastic, and a problem of moisture intrusion.

Therefore, the present inventors have felt that the above-mentioned deficiencies can be improved, and they have devoted themselves to research and cooperated with the application of the theory, and finally proposed a present invention which is reasonable in design and effective in improving the above-mentioned defects.

Embodiments of the present invention provide a light-emitting diode structure, a metal bracket of a light-emitting diode structure, and a carrier module, which are all transparent to a partition groove disposed in a sealing area (eg, connected to an adjacent ring side and located in a conductive frame) The separation groove in the four corners, or the annular separation groove around the periphery of the load-bearing area, increases the bond between the metal bracket and the insulator and can effectively reduce moisture intrusion.

An embodiment of the present invention provides a light emitting diode structure, including: a metal bracket having two spaced apart conductive frames and a plurality of extending from the two conductive frames An extension arm, each of the conductive holders has a front surface, a back surface, and a ring side surface connected to the front surface and the rear surface of the back surface, and a front surface of each of the conductive frames defines a sealing area and a substantially surrounded by the sealing area a carrying area; wherein each of the conductive frames is recessed from the sealing portion of the front surface thereof to form at least one dividing groove, and the at least one dividing groove communicates with the side surface of the ring and forms two openings on the side of the ring to make each conductive The partitioning slot of the rack can be spaced apart from at least one of the extending arms and the carrying area; a light emitting diode chip is mounted on the carrying area of the metal bracket and electrically connected to the two conductive racks; An insulator covering the metal bracket, and the back portion of the two conductive frames and the end faces of the extension arms are exposed outside the insulator.

The embodiment of the invention further provides a metal bracket with a light-emitting diode structure, comprising: two conductive frames disposed at intervals, each conductive frame having a front surface, a back surface, and a ring side connected to the front surface and the rear surface of the back surface And a front surface of each of the conductive frames defines a sealing area and a bearing area substantially surrounded by the sealing area; and a plurality of extending arms respectively extending from the two conductive frames; wherein each conductive frame is The front sealing area is recessed to form at least one dividing groove, and the at least one dividing groove communicates with the side of the ring and forms two openings on the side of the ring, so that the dividing groove of each conductive frame can separate the extensions At least one of the arms and the load bearing zone.

The embodiment of the present invention further provides a carrier module for mounting a plurality of LED chips thereon. The carrier module includes: a plurality of metal brackets integrally connected into a single piece structure, each metal The bracket comprises two conductive racks and a plurality of extending arms integrally extending from the two conductive racks, each of the conductive racks has a front surface, a back surface, and a ring side surface connected to the front surface and the back surface of the back surface, and each conductive layer The front surface of the frame defines a sealing area and a bearing area substantially surrounded by the sealing area; wherein each conductive frame is recessed from the sealing area of the front surface thereof to form at least one dividing groove, and the at least one dividing groove is connected to the Forming two openings on the side of the ring and on the side of the ring, so that the partitioning groove of each conductive frame can be separated from at least one of the extending arms and the carrying area; wherein the two conductive frames of each metal bracket are respectively defined as a first conductive frame and a second conductive frame are passed through one of the two adjacent metal brackets in a first direction The first conductive frame extending arm of the metal bracket is obliquely integrally connected to the second conductive frame extending arm of the other metal bracket, and the obliquely integrally connected extending arm is substantially at an acute angle with the first direction; An insulating seat covering the outer edges of the metal brackets.

In summary, the LED structure, the metal bracket of the LED structure, and the carrier module provided by the embodiments of the present invention have a separation groove formed therebetween to bond the insulator to the front surface of the conductive frame. Sex is effectively promoted. Furthermore, the moisture that permeates between the conductive frame and the insulator via the extension arm can be effectively isolated by the portion where the separation groove is joined to the insulator. Moreover, through the distribution position of the separation groove, the effect of preventing moisture from invading the carrying area of the conductive frame is achieved.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

100‧‧‧ bearing seat

1‧‧‧Metal bracket

11‧‧‧Conducting frame

111‧‧‧ positive

1111‧‧‧ Sealed area

1112‧‧‧ Carrying area

1113‧‧‧Separation slot

1113a, 1113b‧‧‧ openings

112‧‧‧Back

1121‧‧‧covered area

1122‧‧‧Weld area

113‧‧‧ ring side

114‧‧‧ Missing slots

11a‧‧‧First Conductor

111a‧‧‧protrusion

11b‧‧‧Second conductive frame

111b‧‧‧Depression

1111b‧‧‧ Groove

12‧‧‧Extension arm

121‧‧‧End face

2‧‧‧Insulation seat

21‧‧‧Insulation isolation

22‧‧‧ accommodating holes

200‧‧‧Light Diode Wafer

300‧‧‧Transparent parts

400‧‧‧Carriage module

D1‧‧‧ first direction

D2‧‧‧ second direction

1 is a perspective view of a carrier according to a first embodiment of the present invention.

2 is a perspective view of another perspective of FIG. 1.

3 is a perspective view of the metal bracket of FIG. 1.

4 is a perspective view of another perspective view of the metal bracket of FIG. 1.

Figure 5 is a cross-sectional view taken along line A-A of Figure 1.

FIG. 6A is a perspective view of another embodiment of a carrier according to a first embodiment of the present invention.

Figure 6B is a cross-sectional view taken along line B-B of Figure 6A.

FIG. 6C is a partially enlarged schematic view of the C block of FIG. 6B.

FIG. 7 is a perspective view showing the structure of a light emitting diode according to a first embodiment of the present invention.

FIG. 8 is a perspective view showing another embodiment of the structure of the light emitting diode according to the first embodiment of the present invention.

FIG. 9 is a perspective view showing still another embodiment of the structure of the light emitting diode according to the first embodiment of the present invention.

FIG. 10 is a perspective view of a carrier module according to a first embodiment of the present invention.

Figure 11 is a perspective view of the metal bracket of Figure 10.

Figure 12 is a perspective view of the metal stent of Figure 10 from another perspective.

Figure 13 is a perspective view of the cut of Figure 10.

Figure 14 is a perspective view of a metal bracket according to a second embodiment of the present invention.

Figure 15 is a perspective view of another perspective of Figure 14.

Figure 16 is a perspective view showing the structure of a light-emitting diode according to a second embodiment of the present invention.

Figure 17 is a perspective view showing another embodiment of a structure of a light-emitting diode according to a second embodiment of the present invention.

Figure 18 is a perspective view showing still another embodiment of the structure of the light-emitting diode according to the second embodiment of the present invention.

[First Embodiment]

Referring to FIG. 1 and FIG. 2, a carrier 100 for a light-emitting diode structure of a QFN (quad flat no-lead) process is provided. The carrier 100 includes a metal bracket 1 and an insulating seat 2, and the metal bracket 1 has two spaced-apart conductive racks 11 and a plurality of extending arms 12 integrally extending from the two conductive racks 11.

The insulating seat 2 can be made of thermosetting plastic, such as epoxy resin (Epoxy), silicone resin (Silicone), and the insulating seat 2 covers the two conductive frames 11 and the extending arm 12, and the two conductive frames 11 are insulated by the insulating seat 2. Separating, a partial region of the two conductive frames 11 (ie, the bearing region 1112 and the bonding region 1122 described later) and the end surface 121 of the extending arm 12 are exposed outside the insulating seat 2 such that the surface of the bonding region 1122 and the extending arm 12 are The end face 121 is flush with the insulating seat 2. The space between the two conductive frames 11 is filled by the insulating seat 2, and the portion of the insulating seat 2 filled between the two conductive frames 11 is defined as an insulating spacer 21. It is worth noting that the material of the insulating seat 2 is not limited to the above-mentioned thermosetting plastic, and a thermoplastic plastic such as poly 1,4-cyclohexylene dimethylene terephthalate (Poly1,4-cyclohexylene dimethylene terephthalate, Referred to as PCT).

Referring to FIG. 3 and referring to FIG. 1 as appropriate, the two conductive frames 11 are a convex first conductive frame 11a and a concave second conductive frame 11b of different shapes. The two conductive frames 11 each have There is an identical predetermined thickness (T), and each of the conductive frames 11 defines a front surface 111, a back surface 112, and a ring side surface 113 connected to the periphery of the front surface 111 and the back surface 112. The maximum distance between the front surface 111 and the back surface 112 of each of the conductive frames 11 is the predetermined thickness (T), and the front surface 111 of each of the conductive frames 11 defines a sealing portion 1111 and a bearing portion 1112. The carrying area 1112 is substantially surrounded by the sealing area 1111, and the carrying area 1112 is used to carry (fix) at least one LED chip or for wire bonding.

The sealing area 1111 is covered by the insulating seat 2, and the bearing area 1112 is exposed outside the insulating seat 2. The bearing area 1112 of the two conductive frames 11 is substantially located between the sealing areas 1111, and the front surface 111 of the two conductive frames 11 and The top surface of the insulating spacer 21 between the two conductive frames 11 is substantially coplanar.

A receiving hole 22 is formed in a substantially circular groove shape at a substantially central portion of the top surface of the insulating base 2, and the bearing portion 1112 of the front surface 111 of each of the conductive frames 11 is exposed outside the insulating seat 2 via the receiving hole 22 . The receiving hole 22 can be a circular groove shape as shown in FIG. 1 , and in actual application, the receiving hole 22 can also be formed in a square groove shape or the like.

Each of the conductive frames 11 is recessed (eg, etched) from the sealing portion 1111 of the front surface 111 to form two substantially triangular-shaped partitioning grooves 1113, and each of the dividing grooves 1113 communicates with the ring side surface 113 and on the ring side surface 113. Two openings 1113a, 1113b of different sizes are formed on the upper portion so that each of the partitioning grooves 1113 can partition at least one top surface of the extending arm 12 from the bearing area 1112. Further, in each of the separation grooves 1113, the smaller opening 1113a faces the inside of the conductive frame 11 and is formed at one corner of the triangular structure, and the larger opening 1113b faces the outside of the conductive frame 11 and is formed. At the opposite side of the corner, the oblique side of the triangular structure extends substantially along the arc of the circular groove. Moreover, the recess depth of the partition groove 1113 is preferably a predetermined thickness (1/2T) of one-half, but not limited thereto, the recess depth of the partition groove 1113 may be approximately one quarter of a predetermined thickness ( 1/4T) to three-quarters of the predetermined thickness (3/4T). It should be noted that the separation groove 1113 and the circular groove-shaped receiving hole 22 are at least 100 micrometers apart, so that the insulating seat 2 It is sufficient to cover the two conductive frames 11 and the extension arms 12.

The partitioning grooves 1113 of the two conductive frames 11 each form an unclosed triangular semi-etched structure, and the partitioning grooves 1113 are disposed around the receiving holes 22 of the insulating seat 2 and are located at the corners of the metal bracket 1 . Thereby, the partitioning groove 1113 is formed so that the front surface 111 of the conductive frame 11 exhibits a high and low undulation, and the bond between the insulating seat 2 and the front surface 111 of the conductive frame 11 is effectively improved. Further, since the portion where the partitioning groove 1113 is joined to the insulating base 2 is higher in bonding property than the surrounding portion, the moisture which permeates between the conductive frame 11 and the insulating seat 2 via the extending arm 12 can be effectively The partition groove 1113 is isolated from the portion where the insulating seat 2 is joined. Moreover, the distribution position of the partitioning groove 1113 is transmitted to achieve the effect of preventing moisture from intruding into the bearing area 1112 of the conductive frame 11.

In each of the conductive frames 11, a portion of the ring side 113 corresponding to the smaller opening 1113a of each of the partitioning grooves 1113 forms a notch 114 that penetrates from the front surface 111 to the back surface 112. Therefore, in order to minimize the bonding area between the conductive frame 11 and the insulating seat 2 in order to obtain the maximum solid crystal and heat dissipation region in the design of the carrier 100, the insulating seat 2 can be permeablely coupled to the angular extension of the notch 114. The edge material penetrates the structure to enhance the bonding force between the insulating seat 2 and the conductive frame 11.

Referring to FIG. 4 and as appropriate, as shown in FIG. 2, the back surface 112 of each of the conductive frames 11 defines a cladding region 1121 and a soldering region 1122. The cladding region 1121 is a groove-like structure formed by recessing (eg, etching) from the periphery of the back surface 112 (that is, the portion of the back surface 112 adjacent to the ring side surface 113). The cladding region 1121 is covered by the insulating holder 2, and the bonding region 1122 is exposed outside the insulating holder 2. The soldering area 1122 of each of the conductive frames 11 is located substantially inside the covering area 1121, and the soldering area 1122 of the two conductive frames 11 and the bottom surface of the insulating base 2 connected to the two conductive racks 11 are substantially coplanar.

The thickness of the ring side surface 113 is approximately one-half of a predetermined thickness (1/2T), but not limited thereto, the thickness of the ring side surface 113 may be approximately one quarter of a predetermined thickness (1/4T) to four points. The predetermined thickness of the third (3/4T).

The extension arms 12 extend integrally from the ring side 113 of each of the conductive frames 11 Formed, and the thickness of the extension arm 12 is substantially equivalent to the thickness of the ring side 113. That is, the thickness of the extension arm 12 is a predetermined thickness (1/4T) to a predetermined thickness (3/4T) of a quarter, and the thickness of the extension arm 12 is one-half of the embodiment. The predetermined thickness (1/2T). Viewed from another angle, the thickness of the extension arm 12 is substantially equal to the thickness of the portion of the conductive frame 11 on which the separation groove 1113 is formed.

Referring to FIG. 5 and referring to FIG. 3 and FIG. 4 as appropriate, the convex first conductive frame 11a is provided with a protruding portion 111a, and the concave second conductive frame 11b is disposed at a portion corresponding to the protruding portion 111a corresponding to the convex portion. A recessed portion 111b of the outlet portion 111a. The lower surface of the protruding portion 111a is the above-mentioned groove-shaped structure of the cladding portion 1121, and the upper surface of the recessed portion 111b is recessed with a recess 1111b, so that the plastic filled between the two conductive frames 11 is presented. The misalignment is used to strengthen the insulating partition portion 21, and the joint force between the insulating seat 2 and the conductive frame 11 is strengthened by the outer and outer plastics extending to prevent moisture intrusion.

The metal bracket 1 of the present invention selects the convex first conductive frame 11a and the concave second conductive frame 11b to overcome the lateral mechanical shearing force by the concave-convex conductive frame 11 and effectively solve the above problem. The phenomenon that the conductive frame 11 is separated from the insulating spacer 21 is obtained.

As shown in FIG. 6A, the insulating isolation portion 21 is located at a portion of the receiving hole 22, and protrudes from the bearing portion 1112 of the first and second conductive frames 11a and 11b on both sides, thereby reducing the effect of moisture intrusion. And prevent the light emitted by the wafer from leaking out from the bottom. In more detail, as shown in FIG. 6B and FIG. 6C, the insulating spacer portion 21 is located at the portion of the accommodating hole 22, which is compared with the bearing portion 1112 of the first and second conductive frames 11a, 11b on both sides. Preferably, it can protrude 300-500 micrometers, and the cross-sectional width of the bearing area 1112 is preferably 300-500 micrometers, in addition to effectively blocking moisture from being invaded by the bottom surface of the bearing base 100, and the insulating isolation portion can be avoided. The occlusion of 21 to the exit angle of the wafer affects the brightness of the package structure.

Furthermore, the carrier 100 can be combined with other components to form a light emitting diode structure. Specifically, please refer to FIG. 7 , which is a light emitting diode structure. The carrier 100 includes two light-emitting diode chips 200 mounted on the carrier 100, and a light-transmitting member 300 (such as a lens) disposed on the carrier 100 and sealing the LED wafer 200.

The shape of the LED wafer 200 can be wire-bonded or flip-chip. The illuminating diode 200 is disposed in the accommodating hole 22 of the insulating base 2 and is disposed on the carrying area 1112 of the first conductive frame 11a. The illuminating diode 200 is electrically connected to the first conductive frame 11a by wire bonding. And the second conductive frame 11b. The light transmissive member 300 is partially filled in the accommodating hole 22 of the insulating seat 2 to seal the illuminating diode chip 200, and the remaining portion of the light transmitting member 300 is exposed outside the top surface of the insulating seat 2 and formed into a hemispherical shape. Construction. In addition, the light transmissive member 300 can also be formed as shown in FIG. 8 , that is, the light transmissive member 300 is filled in the accommodating hole 22 , and the top surface of the light transmissive member 300 is coplanar with the top surface of the insulating seat 2 .

The light-emitting diode structure can also be composed only of the metal holder 1, the light-emitting diode wafer 200, and the light-transmitting member 300. As shown in FIG. 9, the light transmissive member 300 directly covers the conductive frame 11 and the LED substrate 200 to form a light emitting diode structure. In other words, the light-emitting diode structure can also replace the insulating seat 2 with the light-transmitting member 300. The soldering area 1122 of the back surface 112 of the two conductive frames 11 and the end surface 121 of the extending arms 12 are exposed outside the light transmitting member 300.

In summary, the LED structure of the present embodiment is a metal holder 1 , a light emitting diode chip 200 disposed on the metal holder 1 , and a cover of the metal holder 1 and the LED array 200 . Made up of insulators.

Wherein, when the structure of the light emitting diode is the aspect of FIG. 7 or FIG. 8 , the insulator comprises the insulating seat 2 and the light transmitting member 300 that are not transparent to light. When the structure of the light emitting diode is the same as that of FIG. 9, the insulator is defined as the light transmitting member 300. However, regardless of the structure of the light-emitting diode structure, the land 1122 of the back surface 112 of the two conductive frames 11 and the end faces 121 of the extending arms 12 need to be exposed outside the insulator.

In addition, the single carrier 100 described in this embodiment is formed by cutting a carrier module 400 when manufactured (see FIG. 10). Specifically, the bearing mold The set 400 includes a plurality of integrally connected carriers 100 for mounting a plurality of light emitting diode chips 200 thereon. For ease of explanation, the drawings of the present embodiment are illustrated only by the partial carrier 100.

Prior to forming the carrier module 400, a plurality of metal brackets 1 integrally connected in a single piece configuration are formed (see FIGS. 11 and 12). When viewed from a first direction D1, the first conductive frame 11a of each metal bracket 1 is integrally connected to the first conductive frame 11a on the opposite sides thereof through the respective extension arms 12. The second conductive frame 11b of each metal bracket 1 is integrally connected with the second conductive frame 11b on the opposite sides thereof through the respective extending arms 12, and the connected extending arms 12 are substantially parallel to the first direction D1. . If viewed from a second direction D2 perpendicular to the first direction D1, any two adjacent metal brackets 1 pass through the first conductive frame 11a of one of the metal brackets 1 and extend the arm 12 and the other of the metal brackets 1 The two conductive frames 11b extend the arms 12 integrally connected, and the connected extending arms 12 are substantially parallel to the second direction D2.

In addition to the extending arm 12 substantially parallel to the first direction D1 or the second direction D2, any two adjacent metal brackets 1 pass through the first conductive frame 11a of one of the metal brackets 1 when viewed from the first direction D1. The extension arm 12 is obliquely integrally connected to the second conductive frame 11b extension arm 12 of the other metal bracket 1, and the connected extension arms 12 are substantially at an acute angle with the first direction D1. Thereby, the two adjacent metal brackets 1 pass through the obliquely extending extending arms 12 to enhance the stability between the two adjacent metal brackets 1 , thereby facilitating the improvement of the injection yield when the insulating seat 2 is subsequently formed, and Reduce the possibility of burrs from spilling glue in subsequent processes.

When the outer edges of the integrally connected metal brackets 1 are formed with a plurality of insulating seats 2 integrally connected to form a plurality of integrally connected carrier seats 100, a cutting step is performed to make the connected bodies integrated The carrier 100 is cut into a plurality of carriers 100 that are separated from one another (Fig. 13).

Wherein, the thickness of the through-extension arm 12 is smaller than a predetermined thickness of the conductive frame 11, for example, the thickness of the extension arm 12 is a predetermined thickness (1/4T) to three-quarters of a quarter. Thickness (3/4T). Thereby, in the cutting step, the thickness of the extension arm 12 required for cutting the tool can be reduced, thereby reducing the tool loss and reducing the generation probability of the burr, and effectively avoiding the end face 121 (cutting point) and the insulating seat of the extension arm 12 2 A peeling phenomenon occurs to slow the rate at which moisture is invaded by the extension arm 12.

[Second embodiment]

Referring to FIG. 14 to FIG. 18, which is a second embodiment of the present invention, the present embodiment is similar to the first embodiment described above, and the same portions are not described again, and the difference between the two is mainly in the separation slot 1113 on the conductive frame 11. The specific description is as follows.

As shown in FIG. 14 and FIG. 15, each of the conductive frames 11 is recessed (eg, etched) from the sealing portion 1111 of the front surface 111 thereof to form a partitioning groove 1113 having a substantially U-shaped configuration and having an equal width. The partitioning groove 1113 is distributed along the outside of the accommodating hole 22 of the insulating seat 2 to surround the bearing area 1112. Further, the partitioning groove 1113 of the two conductive frames 11 surrounds the bearing area 1112 and is located inside the outer circumference of the metal bracket 1. That is, the inner edge of the partitioning groove 1113 of the two conductive frames 11 is greater than or equal to the outer edge of the bearing zone 1112, and the outer edge of the dividing groove 1113 of the two conductive frames 11 is less than or equal to the outer edge of the metal bracket 1.

Each of the partitioning grooves 1113 communicates with the ring side surfaces 113 of the two conductive frames 11 facing each other, and the two ends of the U-shaped dividing grooves 1113 form two openings 1113a of substantially the same size on the ring side surface 113 (that is, the partitioning grooves 1113 Two openings 1113a are formed at both ends of the U-shaped configuration, respectively, such that each of the separation grooves 1113 is spaced apart from the load-bearing area 1112 and the top surface of all of the extension arms 12.

The partitioning groove 1113 of the present embodiment has a recessed depth of approximately one-half of a predetermined thickness (1/2T) and a width of less than or equal to 1T, but is not limited thereto. The recessed depth of the above-described separation groove 1113 may be a predetermined thickness (3/4T) of a predetermined thickness (1/4T) to three-quarters of a quarter.

Furthermore, in each of the conductive frames 11, the ring side surface 113 defines a notch 114 that penetrates from the front surface 111 to the back surface 112 corresponding to each of the two openings 1113a of each of the partitioning grooves 1113.

In addition, the light-emitting diode structure described in this embodiment can also be constructed as shown in FIGS. 7 to 9 of the first embodiment. For example, FIG. 16 shows the structure of the light-emitting diode of the present embodiment corresponding to the structure shown in FIG. 7 of the first embodiment; FIG. 17 shows the structure of the light-emitting diode of the present embodiment corresponding to FIG. 8 of the first embodiment. The configuration shown in Fig. 18 shows the structure of the light-emitting diode of the present embodiment corresponding to that shown in Fig. 9 of the first embodiment.

[Possible effects of embodiments of the present invention]

In summary, the embodiment of the present invention forms a partitioning groove so that the bond between the insulating seat and the front surface of the conductive frame is effectively lifted, thereby allowing water and gas to penetrate between the conductive frame and the insulating seat via the extending arm. It can be effectively isolated by the portion where the partition groove is joined to the insulating seat. Moreover, the distribution position of the separation groove is transmitted to achieve the effect of preventing moisture from intruding into the bearing area of the conductive frame. In addition, the insulating seat can penetrate the corner extending structure of the rim by the gusset to improve the bonding force between the insulating seat and the conductive frame.

In more detail, in the first embodiment, the shape of the receiving hole is a circular groove shape, and the partitioning groove is designed to be seated in the four corners of the conductive frame in a limited sealing area in response to the circular groove-shaped receiving hole. The triangular semi-etched structure on the side of the ring increases the bonding force between the insulating seat and the conductive frame. In the second embodiment, the accommodating hole is in the shape of a square groove, and the partitioning groove is formed with a U-shaped separating groove corresponding to the groove-shaped accommodating hole of the square groove-shaped accommodating hole, and the insulating seat and the conductive frame are added. The combination of strength.

The metal bracket provided by the embodiment of the invention achieves the effect of overcoming the lateral mechanical shearing force by the two conductive brackets which are combined with the concave and convex, and effectively solves the phenomenon that the conductive frame and the insulating spacer are peeled off. Furthermore, the lower surface of the protruding portion has a groove-like structure, and the upper surface of the concave portion is provided with a groove, so that the plastic filled between the two conductive frames is displaced up and down to strengthen the insulating partition, and Both have extended plastics to prevent water and gas intrusion, and strengthen the bonding force between the insulating seat and the conductive frame.

In the carrier module provided by the embodiment of the present invention, any two adjacent metal brackets are transmitted through the obliquely extending extending arms to enhance the stability between the two adjacent metal brackets. The degree is further improved by the yield of the subsequent forming of the insulating seat and the possibility of burrs due to the overflow of the subsequent process. Moreover, the thickness of the extending arm is smaller than the predetermined thickness of the conductive frame, thereby reducing the thickness of the extending arm required for cutting the cutting tool in the cutting step, thereby reducing tool loss and reducing the probability of generation of the burr, and effectively avoiding the end of the extended arm The surface and the insulating seat are peeled off to slow the intrusion of water vapor by the extension arm.

The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the invention, and the equivalent variations and modifications of the scope of the invention are intended to be within the scope of the invention.

1‧‧‧Metal bracket

11‧‧‧Conducting frame

111‧‧‧ positive

1111‧‧‧ Sealed area

1112‧‧‧ Carrying area

1113‧‧‧Separation slot

1113a, 1113b‧‧‧ openings

112‧‧‧Back

113‧‧‧ ring side

114‧‧‧ Missing slots

11a‧‧‧First Conductor

111a‧‧‧protrusion

11b‧‧‧Second conductive frame

111b‧‧‧Depression

1111b‧‧‧ Groove

12‧‧‧Extension arm

121‧‧‧End face

Claims (12)

A light-emitting diode structure includes: a metal bracket having two spaced-apart conductive frames and a plurality of extending arms integrally extending from the two conductive frames, each conductive frame having a predetermined thickness, each conductive frame Having a front surface, a back surface, and a ring side surface connected to the front surface and the back surface of the back surface, and a front surface of each conductive frame defines a sealing area and a bearing area substantially surrounded by the sealing area; wherein each conductive frame Forming at least one separation groove from the sealing portion of the front surface thereof, each of the separation grooves may have a depression depth of approximately one quarter of the predetermined thickness to three quarters of the predetermined thickness, and the at least one separation groove is connected Forming two openings on the side of the ring and on the side of the ring, so that the partitioning groove of each conductive frame can be separated from at least one of the extending arms and the carrying area; a light emitting diode chip is mounted And electrically connected to the two conductive frames on the carrying area of the metal bracket; and an insulator covering the metal bracket, and the back surface portion of the two conductive racks and the end faces of the extending arms Exposed to the outside of the insulator. The illuminating diode structure of claim 1, wherein the insulator comprises an insulating seat, the insulating seat covers the two conductive frames and the extending arms, and the spacing between the two conductive frames is the insulating seat The two conductive frames are filled by the insulating seat, and the front bearing area and the back side portion of the two conductive frames and the end faces of the extending arms are exposed outside the insulating seat. The illuminating diode structure of claim 2, wherein the portion of the insulating seat filled between the two conductive frames is defined as an insulating spacer, and the surface of the insulating spacer is flush or protrudes from the two conductive portions. The front bearing area of the rack. The illuminating diode structure of claim 2, wherein the recessed surface of the insulating seat is formed with a receiving hole, and the bearing area of the front surface of each conductive frame is exposed to the insulating seat via the receiving hole The light emitting diode chip is located in the receiving hole of the insulating seat, and the insulator further includes a light transmitting member, the light transmitting member is at least partially The accommodating hole of the insulating seat is filled to seal the illuminating diode chip. The light emitting diode structure of claim 1, wherein the insulator is further defined as a light transmissive member, the light transmissive member integrally covering the metal bracket and the light emitting diode chip, and the back sides of the two conductive frames The partial regions and the end faces of the extension arms are exposed outside the light transmissive member. A carrier module for mounting a plurality of LED chips thereon, the carrier module comprising: a plurality of metal brackets integrally connected in a single piece structure, each metal bracket comprising two conductive frames And a plurality of extending arms integrally extending from the two conductive frames, each of the conductive frames having a predetermined thickness, each of the conductive frames having a front surface, a back surface, and a ring side connected to the front surface and the rear surface of the back surface, and The front surface of each of the conductive frames defines a sealing area and a bearing area substantially surrounded by the sealing area; wherein each of the conductive frames is recessed from the sealing area of the front surface thereof to form at least one dividing groove, and the recess of each dividing groove The depth may be approximately one quarter of the predetermined thickness to three quarters of the predetermined thickness, and the at least one separation groove communicates with the side of the ring and forms two openings on the side of the ring to make each of the conductive frames The partitioning slot can be separated from at least one of the extending arm and the carrying area; wherein the two conductive frames of each metal bracket are respectively defined as a first conductive frame and a second conductive frame, along a first direction Ren An adjacent metal bracket is obliquely integrally connected to the second conductive frame extending arm of the other metal bracket through the first conductive frame extending arm of one of the metal brackets, and the obliquely integrally connected extending arm is substantially opposite to the first direction The clip has an acute angle; and a plurality of insulating seats are coated on the outer edges of the metal brackets. A metal bracket with a light-emitting diode structure includes: two conductive frames disposed at intervals, each conductive frame having a predetermined thickness, each conductive frame having a front surface, a back surface, and a front surface and a rear surface of the back surface One side of the ring, and the front side of each of the conductive frames defines a sealing area and a a load-bearing area substantially surrounded by the sealing area; and a plurality of extending arms respectively extending from the two conductive frames; wherein each conductive frame is recessed from the sealing area of the front surface thereof to form at least one dividing groove, each The recessed depth of the partitioning grooves may be approximately one quarter of the predetermined thickness to three quarters of the predetermined thickness, and the at least one dividing groove communicates with the side of the ring and forms two openings on the side of the ring, so that The dividing groove of each of the conductive frames can be spaced apart from at least one of the extending arms and the carrying area. The metal bracket of the light-emitting diode structure according to claim 7, wherein the number of the separation grooves of each of the conductive frames is plural, and each of the separation grooves has a substantially triangular shape, and the size of the two openings of each of the separation grooves Differently, in each of the separation grooves, a smaller opening is formed in one of the corners of the triangular structure, and a larger opening is formed on the opposite side of the corner. The metal bracket of the light-emitting diode structure of claim 8, wherein in each of the conductive frames, a portion of the ring side corresponding to a smaller opening of each of the partition grooves forms a front surface penetrating from the front surface to the back surface Missing slot. The metal bracket of the light-emitting diode structure of claim 7, wherein the number of the partitioning grooves of each of the conductive racks is a single and substantially U-shaped structure, and in each of the conductive racks, the two openings of the partitioning groove are The sizes are substantially the same and are respectively formed at both ends of the U-shaped structure, and the partitioning groove area separates the carrying area from the extending arms. The metal bracket of the light-emitting diode structure of claim 10, wherein in each of the conductive frames, the side of the ring corresponding to the two openings of the partitioning groove respectively form a slot extending from the front surface to the back surface . The metal bracket of the light-emitting diode structure of claim 7, wherein one of the two conductive frames has a convex shape and is provided with a convex portion, and the other conductive frame is concave and correspondingly convex. The portion of the outlet portion is provided with a recessed portion corresponding to the protruding portion, and the lower surface of the protruding portion is formed in a groove-like configuration, and a concave surface is recessed on the upper surface of the recessed portion.