CN104282821B - Light emitting diode construction, light emitting diode construction metallic support and load bearing seat module - Google Patents
Light emitting diode construction, light emitting diode construction metallic support and load bearing seat module Download PDFInfo
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- CN104282821B CN104282821B CN201310647783.8A CN201310647783A CN104282821B CN 104282821 B CN104282821 B CN 104282821B CN 201310647783 A CN201310647783 A CN 201310647783A CN 104282821 B CN104282821 B CN 104282821B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
A kind of light emitting diode construction, the metallic support of light emitting diode construction and load bearing seat module, the metallic support of light emitting diode construction include two spaced conduction racks with multiple adjutages for extending from the two conduction racks one respectively and being formed.Each conduction rack has front, the back side and is connected in the ring side of front and back side periphery.The front definition of each conduction rack has seal area and the supporting region for substantially being surrounded by seal area.Each conduction rack is formed with an at least separation trough from its seal area is recessed, and separation trough is communicated in ring side and forms two openings on ring side, so that the separation trough of each conduction rack can separate open at least one of those adjutages and supporting region.Thus, by being formed with separation trough and after making insulator coat metallic support, both associativity increases and can slow down aqueous vapor invades.
Description
Technical field
The present invention relates to a kind of ray structure, and more particularly to a kind of light emitting diode construction, light emitting diode construction
Metallic support and with the load bearing seat module installed for multiple light-emitting diode chip for backlight unit.
Background technology
Traditional light emitting diode construction is exported with high wattage, thermoplasticity (Thermoplastic) modeling used by which
Material is gradually replaced by thermosetting (Thermoset) plastics.However, due to known light emitting diode construction metallic support with
Contact area ratio between plastics is less, and then produces many problems, for example：Combination sex chromosome mosaicism between conduction rack and plastics
And aqueous vapor invasion problem.
Then, the present inventor's thoughts above-mentioned disappearances improves, and is that spy concentrates on studies and coordinates the utilization of scientific principle, carries finally
Go out the present invention that is a kind of reasonable in design and being effectively improved above-mentioned disappearance.
The content of the invention
It is an object of the invention to provide a kind of light emitting diode construction and its metallic support and load bearing seat module, which is all
Can pass through to arrange positioned at seal area separation trough (such as the separation trough for connecting adjacent ring side and fall positioned at four corner of conduction rack, or
Ring-type separation trough of the person around supporting region periphery) and associativity between metallic support and insulator is increased and effectively can be slowed down
Aqueous vapor is invaded.
For achieving the above object, the embodiment of the present invention provides a kind of light emitting diode construction, including：One metallic support, its
With two spaced conduction racks and multiple adjutages for extending from the two conduction racks one respectively and being formed, each conduction rack tool
There are a front, a back side and be connected in a ring side of the front and the back side periphery, and the front definition of each conduction rack has
One seal area and a supporting region for substantially being surrounded by the seal area；Wherein, each conduction rack is recessed from its positive seal area
An at least separation trough is formed with, and an at least separation trough is communicated in the ring side and two openings is formed on the ring side, with
The separation trough of each conduction rack is enable to separate out at least one and the supporting region of the adjutage；One light-emitting diodes tube core
Piece, is installed on the supporting region of the metallic support and is electrically connected at two conduction rack；And an insulator, which is coated on the gold
Belong to support, and the back portion region of two conduction rack and the terminal surface of those adjutages are revealed in outside the insulator.
The present invention also provides a kind of metallic support of light emitting diode construction, including：Two conduction racks, which is set in distance,
Each conduction rack has a front, a back side and is connected in a ring side of the front and the back side periphery, and each conduction rack
Front definition have a seal area and a supporting region for substantially being surrounded by the seal area；And multiple adjutages, which is respectively certainly
The two conduction racks one extends and is formed；Wherein, each conduction rack is formed with an at least separation trough from its positive seal area is recessed,
And an at least separation trough is communicated in the ring side and forms two openings on the ring side, so that the separation trough of each conduction rack
At least one and the supporting region of the adjutage can be separated open.
The present invention again provides a kind of load bearing seat module, with being mounted thereon for multiple light-emitting diode chip for backlight unit, the carrying
Seat module includes：Multiple metallic supports, one body phase are linked to be monolithic construction, each metallic support include two conduction racks with it is multiple
Extend the adjutage for being formed respectively from the two conduction racks one, each conduction rack has a front, a back side and is just connected in this
Face and a ring side of the back side periphery, and the front definition of each conduction rack has a seal area and substantially by the seal area institute
The supporting region of encirclement；Wherein, each conduction rack is formed with an at least separation trough from its positive seal area is recessed, and this at least one
Separation trough is communicated in the ring side and forms two openings on the ring side, so as to the separation trough of each conduction rack can be separated out be somebody's turn to do
Adjutage at least one with the supporting region；Wherein, to be respectively defined as one first conductive for two conduction racks of each metallic support
Frame and one second conduction rack, the wantonly two adjacent metallic supports on a first direction are conductive by the first of a wherein metallic support
Frame adjutage is obliquely integrally connected in the second conduction rack adjutage of wherein another metallic support, and the oblique one is connected
Adjutage substantially mutually accompanies an acute angle with the first direction；And multiple insulating bases, which is coated on those metallic support outer rims.
In sum, the embodiment of the present invention is provided light emitting diode construction, the metallic support of light emitting diode construction,
And load bearing seat module, which is sufficiently elevated the associativity between insulator and conduction rack front by being formed with separation trough.
Furthermore, the aqueous vapor penetrated between conduction rack and insulator by adjutage effectively can be engaged with insulator by separation trough
Position completely cut off.Also, the distributing position by separation trough, to reach the work(for avoiding aqueous vapor from invading the conduction rack supporting region
Effect.
To enable the feature and technology contents that are further understood that the present invention, refer to below in connection with the present invention specifically
Bright and accompanying drawing, but these explanations are merely to illustrate the present invention with accompanying drawing, rather than any is made to scope of the presently claimed invention
Restriction.
Description of the drawings
Schematic perspective views of the Fig. 1 for the load bearing seat of first embodiment of the invention.
Schematic perspective views of the Fig. 2 for another visual angles of Fig. 1.
Fig. 3 is the schematic perspective view of metallic support in Fig. 1.
Fig. 4 is the schematic perspective view at another visual angle of metallic support in Fig. 1.
Fig. 5 is cross-sectional schematics of the Fig. 1 along A-A hatching lines.
The load bearing seat another schematic perspective views of implementing aspect of Fig. 6 A for first embodiment of the invention.
Fig. 6 B are cross-sectional schematics of Fig. 6 A along B-B hatching lines.
Close-up schematic views of Fig. 6 C for the C blocks in Fig. 6 B.
Schematic perspective views of the Fig. 7 for the light emitting diode construction of first embodiment of the invention.
The light emitting diode construction another schematic perspective views of implementing aspect of the Fig. 8 for first embodiment of the invention.
The light emitting diode construction another schematic perspective views of implementing aspect of the Fig. 9 for first embodiment of the invention.
Schematic perspective views of the Figure 10 for the load bearing seat module of first embodiment of the invention.
Figure 11 is the schematic perspective view of metallic support in Figure 10.
Figure 12 is the schematic perspective view at another visual angle of metallic support in Figure 10.
Figure 13 is the schematic perspective view after Figure 10 cuttings.
Schematic perspective views of the Figure 14 for the metallic support of second embodiment of the invention.
Schematic perspective views of the Figure 15 for another visual angles of Figure 14.
Schematic perspective views of the Figure 16 for the light emitting diode construction of second embodiment of the invention.
The light emitting diode construction another schematic perspective views of implementing aspect of the Figure 17 for second embodiment of the invention.
The light emitting diode construction another schematic perspective views of implementing aspect of the Figure 18 for second embodiment of the invention.
Specific embodiment
[first embodiment]
Refering to Fig. 1 and Fig. 2, there is provided a kind of carrying of the light emitting diode construction of QFN (quad flat no-lead) technique
Seat 100.Load bearing seat 100 includes a metallic support 1 and an insulating base 2, and above-mentioned metallic support 1 has two spaced conductions
Frame 11 and multiple adjutages 12 for extending from two conduction racks, 11 one respectively and being formed.
Insulating base 2 can be by made by thermosetting plastic, such as epoxy resin (Epoxy), silicones (Silicone), and insulate
2 cladding of seat, two conduction rack 11 and adjutage 12, and make two conduction racks 11 separated by insulating base 2, the portion of two conduction rack 11
The terminal surface 121 of subregion (i.e. supporting region described later 1112 and weld zone 1122) and adjutage 12 be revealed in insulating base 2 it
Outward so that the surface of weld zone 1122 and the terminal surface 121 of adjutage 12 are flushed with insulating base 2.Interval between two conduction racks 11
Filled by insulating base 2, and the position that insulating base 2 is filled between two conduction racks 11 is defined as one and is dielectrically separated from portion 21.It is worth
It is noted that the material of insulating base 2 is not limited with above-mentioned thermosetting plastic, thermoplastic plastic is may also be employed, it is such as poly- to benzene two
Formic acid Isosorbide-5-Nitrae-cyclohexane dicarboxylates (Poly1,4-cyclohexylene dimethylene terephthalate, referred to as
PCT)。
Consider Fig. 1 refering to Fig. 3 and in good time in light of actual conditions, two conduction racks 11 are recessed with one for convex the first conduction rack 11a of different external forms
Shape the second conduction rack 11b.Two conduction rack 11 respectively has an identical predetermined thickness (T), and the definition of each conduction rack 11 has one
Front 111, a back side 112, and it is connected in the ring side 113 in front 111 and 112 periphery of the back side.11 front of each conduction rack
Ultimate range between 111 and the back side 112 is above-mentioned predetermined thickness (T), and the definition of front 111 of each conduction rack 11 has
One seal area 1111 and a supporting region 1112.Above-mentioned supporting region 1112 is substantially surrounded by seal area 1111, and supporting region 1112
To carry (fixed) at least light-emitting diode chip for backlight unit or be used for routing connection.
Seal area 1111 is coated by insulating base 2, and supporting region 1112 is then revealed in outside insulating base 2, two conduction rack
11 supporting region 1112 is located substantially between seal area 1111, and the front 111 of two conduction racks 11 and be located at two conduction racks 11 it
Between be dielectrically separated from 21 top surface of portion substantially in copline arrange.
The approximate centre of 2 top surface of insulating base is recessed to be formed with a substantially accommodating hole 22 in circular groove shape, and each leads
Outside the supporting region 1112 in 11 front 111 of electric frame is exposed to insulating base 2 via above-mentioned accommodating hole 22.Above-mentioned accommodating hole 22 can be with
Circular groove shape is illustrated in figure 1, and when practical application, accommodating hole 22 can also form the such as construction such as square groove shape.
Seal area 1111 of each conduction rack 11 from its front 111 is recessed (such as：Etching) two are formed with substantially in triangular shape
The separation trough 1113 of construction, and each separation trough 1113 is communicated in above-mentioned ring side 113 and size phase formed on the ring side 113
Two different opening 1113a, 1113b, so that each separation trough 1113 can be separated opens 12 top surface of an at least adjutage and supporting region
1112.Further say, in each separation trough 1113, its less opening 1113a is towards inside conduction rack 11, and is formed in
A wherein corner of the triangle columnar structure, and larger opening 1113b is towards outside conduction rack 11, and it is formed in the right of the corner
Side, the hypotenuse of triangle columnar structure extend generally along the camber line of circular groove shape.Furthermore, the cup depth of separation trough 1113 is preferably
/ 2nd predetermined thickness (1/2T), but be not limited, the cup depth of above-mentioned separation trough 1113 can substantially four/
The predetermined thickness (3/4T) of one predetermined thickness (1/4T) to 3/4ths.It should be noted that separation trough 1113 and circular groove shape
At least 100 microns of the distance of accommodating hole 22 so that insulating base 2 can coat two conduction racks 11 and adjutage 12 enough.
The separation trough 1113 of two conduction racks 11 respectively forms half arbor of untight triangle, those separation troughs 1113 be around
2 accommodating hole 22 of insulating base is arranged, and positioned at the surrounding corner of metallic support 1.Thus, by being formed with separation trough 1113, so that
11 front of conduction rack 111 is presented the construction that height rises and falls, and then makes the associativity between 11 front 111 of insulating base 2 and conduction rack
It is sufficiently elevated.Furthermore, the position that separation trough 1113 is engaged with insulating base 2, due to both associativities relatively around it is high, because
And cause the aqueous vapor penetrated between conduction rack 11 and insulating base 2 by adjutage 12, can effectively by separation trough 1113 with it is exhausted
The position that edge seat 2 is engaged is completely cut off.Also, by the distributing position of separation trough 1113, avoid aqueous vapor invasion described to reach
Effect of the supporting region 1112 of conduction rack 11.
In each conduction rack 11, portion of the ring side 113 corresponding to smaller opening 1113a of each separation trough 1113
Short slot 114 of the position formation one by 111 insertion of front to the back side 112.Thus, when designing in response to load bearing seat 100, to seek maximum die bond
And heat dissipation region, and the situation that the bonded area of conduction rack 11 and insulating base 2 tails off is made, insulating base 2 can be by being incorporated into short slot
114 horn shape extends rim charge and penetrates structure, to lift the adhesion between insulating base 2 and conduction rack 11.
Refer to Fig. 4 and considered in light of actual conditions shown in Fig. 2 in good time, the definition of the back side 112 of each conduction rack 11 have a cladding area 1121 with
One weld zone 1122.Wherein, coat area 1121 be from 112 periphery of the back side (that is, the back side 112 is adjacent to the portion of ring side 113
Position) the recessed formation of institute is (such as：Etching) channel-shaped construction.Cladding area 1121 is coated by insulating base 2, and weld zone 1122 then appears
Outside insulating base 2.The weld zone 1122 of each conduction rack 11 is located substantially on the inside of its cladding area 1121, and two conduction racks 11
Weld zone 1122 and it is connected to 2 bottom surface of insulating base of two conduction racks 11 and substantially arranges in copline.
The predetermined thickness (1/2T) of the thickness of ring side 113 substantially 1/2nd, but be not limited, ring side 113
Thickness can the substantially predetermined thickness (1/4T) to 3/4ths of a quarter predetermined thickness (3/4T).
The adjutage 12 extends from 113 one of ring side of each conduction rack 11 respectively and is formed, and adjutage 12
Thickness is substantially identical to the thickness of ring side 113.That is, the thickness of adjutage 12 for a quarter predetermined thickness (1/4T) extremely
3/4ths predetermined thickness (3/4T), the thickness of adjutage 12 is in the predetermined thickness (1/2T) that the present embodiment is 1/2nd.
Viewed another way, the thickness of adjutage 12 is substantially identical to the thickness at 11 position of conduction rack for being formed with separation trough 1113.
Refer to Fig. 5 and consider Fig. 3 and Fig. 4 in good time in light of actual conditions, above-mentioned convex the first conduction rack 11a is provided with a protuberance 111a, recessed
Shape the second conduction rack 11b in should the position of protuberance 111a be provided with the depressed part corresponding to above-mentioned protuberance 111a
111b.Wherein, the cladding area 1121 of the lower surface of protuberance 111a as above-mentioned construction in the form of slot, and the upper table of depressed part 111b
Face is arranged with a groove 1111b, and the plastics so as to causing to be filled between two conduction racks 11 are presented and misplaced up and down, with heavy insulation
Isolation part 21, and aqueous vapor invasion, the knot come between heavy insulation seat 2 and conduction rack 11 are blocked by there is outer extension plastics up and down
With joint efforts.
Second conduction rack 11b of the metallic support 1 of the present invention from the first conduction rack 11a and spill of convex, to pass through
The conduction rack 11 of male-female engagement reaches the effect for overcoming lateral mechanical shear, and and then efficiently solve above-mentioned conduction rack 11 with it is exhausted
The phenomenon that edge isolation part 21 is peeled off.
Such as Fig. 6 A, positioned at the position of accommodating hole 22, which projects and higher than the first and the of both sides in the portion 21 that is dielectrically separated from
The supporting region 1112 of two conduction rack 11a, 11b, reaches the effect for reducing aqueous vapor invasion whereby, and prevents the light that chip sends the bottom of from
Portion spills.In more detail, as shown in Fig. 6 B and Fig. 6 C, positioned at the position of accommodating hole 22, which is compared in the above-mentioned portion 21 that is dielectrically separated from
For the supporting region 1112 of first and second conduction rack 11a, 11b of both sides, 300-500 microns can be preferably projected, and is covered
The cross-sectional width preferably 300-500 microns in the supporting region 1112 are covered, except aqueous vapor effectively being intercepted by 100 bottom of load bearing seat
Face invasion is outer, can also avoid blocking chip light-emitting angle because be dielectrically separated from portion 21, and have influence on encapsulating structure go out light
Degree.
Furthermore, above-mentioned load bearing seat 100 can be arranged in pairs or groups other elements and be formed a light emitting diode construction.Specifically, please join
Read shown in Fig. 7, which is a kind of light emitting diode construction, comprising the load bearing seat 100, be installed on load bearing seat 100 two light
Diode chip for backlight unit 200, and be arranged at load bearing seat 100 and seal light-emitting diode chip for backlight unit 200 transmission element 300 (such as：Lens).
The kenel of light-emitting diode chip for backlight unit 200 can be routing type, crystal covering type.Light-emitting diode chip for backlight unit 200 is located at insulation
In the accommodating hole 22 of seat 2 and it is installed on the supporting region 1112 of the first conduction rack 11a, light-emitting diode chip for backlight unit 200 passes through routing
And be electrically connected with the first conduction rack 11a and the second conduction rack 11b.300 part of the transmission element is filled in insulating base 2
In accommodating hole 22, to seal light-emitting diode chip for backlight unit 200, and the remainder of transmission element 300 be then revealed in 2 top surface of insulating base it
It is outer and form hemispherical construction.Separately, above-mentioned transmission element 300 can also form the construction such as Fig. 8, that is, transmission element 300 fill and lead up in
In above-mentioned accommodating hole 22, and 300 top surface of transmission element and 2 top surface of insulating base are in copline.
Light emitting diode construction also can only by the metallic support 1, light-emitting diode chip for backlight unit 200 and 300 structures of transmission element
Into.As shown in figure 9,300 direct one coated with conductive frame 11 of transmission element and light-emitting diode chip for backlight unit 200, to form light-emitting diodes
Tubular construction.In other words, light emitting diode construction also can be with 300 replacement insulating base 2 of transmission element.Wherein, the back side of two conduction racks 11
112 weld zone 1122 and the terminal surface 121 of those adjutages 12 are revealed in outside transmission element 300.
For sum total, the light emitting diode construction of the present embodiment is by metallic support 1, is arranged at sending out on metallic support 1
Luminous diode chip 200, and it is coated on metallic support 1 and is constituted with an insulator of light-emitting diode chip for backlight unit 200.
Wherein, when light emitting diode construction for Fig. 7 or Fig. 8 aspect when, insulator comprising alternatively non-transparent insulating base 2 with it is saturating
Light part 300.When aspect of the light emitting diode construction for Fig. 9, insulator is then defined to transmission element 300.But no matter light-emitting diodes
Tubular construction be which kind of aspect, the terminal surface of the weld zone 1122 and those adjutages 12 at the back side 112 of two conduction rack 11
121 all need to be revealed in outside insulator.
Additionally, the single load bearing seat 100 described in the present embodiment, which is by cutting a load bearing seat module when manufacturing
400 and form (such as Figure 10).Specifically, load bearing seat module 400 includes multiple load bearing seats 100 being connected as a body, to
It is mounted thereon for multiple light-emitting diode chip for backlight unit 200.For purposes of illustration only, the schema of the present embodiment is only with part load bearing seat 100
Explanation.
Before the load bearing seat module 400 is formed, be initially formed integrally be connected to multiple metallic supports 1 of monolithic construction (please
Refering to Figure 11 and Figure 12).Wherein, if from the point of view of by a first direction D1, the first conduction rack 11a of each metallic support 1 respectively with
The first conduction rack 11a positioned at its two opposite sides is connected by 12 one of respective adjutage.And the second of each metallic support 1
Conduction rack 11b is connected by 12 one of respective adjutage with the second conduction rack 11b positioned at its two opposite sides respectively, and described
Multiple adjutages 12 being connected are roughly parallel to first direction D1.If by the second direction perpendicular to above-mentioned first direction D1
From the point of view of D2, wantonly two adjacent metallic supports 1 by the first conduction rack 11a adjutages 12 of a wherein metallic support 1 with it is wherein another
Second conduction rack 11b adjutages 12 of one metallic support 1 are integrally connected, and the plurality of adjutage 12 being connected substantially is put down
Row is in second direction D2.
In addition to the above-mentioned adjutage 12 for being roughly parallel to first direction D1 or second direction D2, when next by first direction D1
See, wantonly two adjacent metallic supports 1 are by the first conduction rack 11a adjutages 12 of a wherein metallic support 1 obliquely body phase
It is connected in the second conduction rack 11b adjutages 12 of wherein another metallic support 1, and those adjutages 12 for being connected is substantially with first
Direction D1 phases accompany an acute angle.Whereby, two adjacent metallic supports 1 are somebody's turn to do with strengthening by above-mentioned oblique connected adjutage 12
Stability between two adjacent metallic supports 1, so beneficial to lifted post forming insulating base 2 when injection yield and reduce after
Because excessive glue produces the possibility of burr in continuous processing procedure.
When the plurality of 1 outer rim of metallic support being connected as one is formed with the multiple insulating bases 2 being connected as one, with shape
Into after multiple load bearing seats 100 being connected as a body, implement a cutting step, so that those load bearing seats 100 for being connected as a body
It is cut into multiple load bearing seats 100 separated from one another (such as Figure 13).
Wherein, the predetermined thickness of conduction rack 11 is less than by the thickness of adjutage 12, e.g., the thickness of adjutage 12 is four points
One of predetermined thickness (1/4T) to 3/4ths predetermined thickness (3/4T).Whereby, in cutting step, cutter institute can be reduced
12 thickness of adjutage that need to be cut, and then reduce cutter loss and the generation probability of burr can be reduced, and can be prevented effectively from and prolong
12 terminal surface 121 (cut-out point) of semi-girder is peeling phenomenon with insulating base 2, to slow down the speed that aqueous vapor is invaded by adjutage 12.
[second embodiment]
Refering to Figure 14 to Figure 18, which is the second embodiment of the present invention, and the present embodiment is similar with above-mentioned first embodiment, phase
Exist together, no longer repeat, and both difference essentially consists in the separation trough 1113 on conduction rack 11, is described as follows.
As shown in Figure 14 and Figure 15, seal area 1111 of each conduction rack 11 from its front 111 is recessed (such as：Etching) formed
Have one substantially to construct and the separation trough 1113 with equal wide in U-shaped, above-mentioned two U-shaped separation trough 1113 is along insulating base 2
Accommodating hole 22 on the outside of be distributed to surround the supporting region 1112.Further say, the separation trough 1113 of two conduction rack 11
Around outside supporting region 1112, and within the outer peripheral edge of metallic support 1.That is, the separation trough of two conduction rack 11
1113 inner edge is more than or equal to 1112 outer rim of supporting region, and the outer rim of the separation trough 1113 of two conduction rack 11 is less than or equal to gold
The outer rim of category support 1.
Each separation trough 1113 is communicated in two conduction racks, 11 frame ring side 113 toward each other, and U-shaped separation trough
1113 two ends formed on the ring side 113 two roughly the same opening 1113a of size (that is, the two of separation trough 1113 opens
Mouth 1113a is respectively formed in two ends of U-shaped construction) so that each separation trough 1113 separates out supporting region 1112 and owns
12 top surface of adjutage.
In the predetermined thickness (1/2T) of 1113 cup depth of separation trough substantially 1/2nd of the present embodiment, and width is little
In equal to 1T, but it is not limited.The cup depth of above-mentioned separation trough 1113 can be for the predetermined thickness (1/4T) of a quarter extremely
3/4ths predetermined thickness (3/4T).
Furthermore, in each conduction rack 11, two opening 1113as of the ring side 113 corresponding to each separation trough 1113
Position respectively formed one by 111 insertion of front to the back side 112 short slot 114.
Separately, the light emitting diode construction described in the present embodiment can also form the structure as shown in first embodiment Fig. 7 to Fig. 9
Make.Such as：Figure 16 show the present embodiment light emitting diode construction corresponding to the construction shown in first embodiment Fig. 7；Shown in Figure 17
It is that the present embodiment light emitting diode construction corresponds to the construction shown in first embodiment Fig. 8；Figure 18 show the present embodiment and lights
Diode structure is corresponding to the construction shown in first embodiment Fig. 9.
[possibility effect of the embodiment of the present invention]
In sum, the embodiment of the present invention is by being formed with separation trough, to make the knot between insulating base and conduction rack front
Conjunction property is sufficiently elevated, and then the aqueous vapor that order is penetrated between conduction rack and insulating base by adjutage, effectively can be divided
The position that separate slot is engaged with insulating base is completely cut off.Also, the distributing position by separation trough, avoids aqueous vapor invasion institute to reach
State effect of the supporting region of conduction rack.Separately, insulating base can penetrate structure by being incorporated into the horn shape extension rim charge of short slot, to be lifted
Adhesion between insulating base and conduction rack.
In more detail, in the first embodiment, accommodating hole is shaped as circular groove shape, and separation trough corresponds to the accommodating of circular groove shape
Hole, designs half arbor of triangle for being located in four corners of conduction rack and connected ring side in limited seal area, increases
Plus the adhesion of insulating base and conduction rack.In a second embodiment, accommodating hole is square groove shape, separation trough correspondence square groove shape it is accommodating
Hole, designs U-shaped separation trough along the outer rim of square groove shape accommodating hole, increased the adhesion of insulating base and conduction rack.
The metallic support provided by the embodiment of the present invention, its two conduction rack for passing through male-female engagement reach and overcome lateral machinery
The effect of shearing, and efficiently solve the phenomenon that above-mentioned conduction rack is peeled off with the portion of being dielectrically separated from.Furthermore, by the following table of protuberance
Face construction in the form of slot, and the upper surface of depressed part is provided with groove so that the plastics being filled between two conduction racks present wrong up and down
Position, with heavy insulation isolation part, and blocks aqueous vapor invasion by there is outer extension plastics up and down, comes heavy insulation seat and conduction rack
Between adhesion.
In the load bearing seat module provided by the embodiment of the present invention, wantonly two adjacent metallic supports are by oblique connected extension
Arm, to strengthen the stability between the two adjacent metallic support, and then beneficial to injection yield when lifting post forming insulating base,
And because excessive glue produces the possibility of burr in reduction successive process.Furthermore, it is predetermined less than conduction rack by the thickness of adjutage
Thickness, whereby in cutting step, reduces the adjutage thickness of cutting needed for cutter, and then reduces cutter loss and can reduce hair
The generation probability on side, and adjutage terminal surface and insulating base can be prevented effectively from be peeling phenomenon, to slow down aqueous vapor by extending
The speed of arm invasion.
The preferable possible embodiments of the present invention are the foregoing is only, which simultaneously is not used to limit to the scope of the claims of the present invention, all
Any change done according to scope of the invention as claimed and modification, should all belong to the right stated of the present invention
It is interior.
Claims (9)
1. a kind of light emitting diode construction, it is characterised in that include：
One metallic support, there are two spaced conduction racks to extend shape from described two conduction racks one respectively with multiple for which
Into adjutage, each conduction rack has a front, a back side and is connected in a ring side of the front and the back side periphery
Face, and the front definition of each conduction rack has a seal area and a supporting region surrounded by the seal area；
Wherein, each conduction rack is formed with an at least separation trough, and at least one separation from its positive seal area is recessed
Groove is communicated in the ring side and two openings is formed on the ring side, so that the separation trough of each conduction rack can be separated out
At least one of the plurality of adjutage and the supporting region；
Wherein, the separation trough quantity of each conduction rack is for multiple, and each separation trough is in triangle columnar structure, Mei Yisuo
The size for stating two openings of separation trough is different, and in each separation trough, its less opening is formed in the triangle columnar structure
A wherein corner, and larger opening is then formed in the opposite side in the corner；
One light-emitting diode chip for backlight unit, is installed on the supporting region of the metallic support and is electrically connected at described two conduction racks；With
And
One insulator, which is coated on the metallic support, and the back portion region of described two conduction racks and the plurality of prolongs
The terminal surface of semi-girder is revealed in outside the insulator.
2. light emitting diode construction as claimed in claim 1, wherein, the insulator includes an insulating base, the insulating base bag
The interval overlayed between described two conduction racks and the plurality of adjutage, and described two conduction racks is filled by the insulating base,
So that described two conduction racks are separated by the insulating base, the front supporting region of described two conduction racks and back portion region with
And the terminal surface of the plurality of adjutage is revealed in outside the insulating base.
3. light emitting diode construction as claimed in claim 2, wherein, the insulating base is filled in the portion between described two conduction racks
Position is defined as one and is dielectrically separated from portion, and this is dielectrically separated from portion surface and stretches out and be covered in the front of described two conduction racks and holds
Carry area.
4. light emitting diode construction as claimed in claim 2, wherein, the insulating base top surface is recessed to be formed with an accommodating hole, and
Outside the positive supporting region of each conduction rack is exposed to the insulating base by the accommodating hole, the light-emitting diode chip for backlight unit position
In the accommodating hole of the insulating base, the insulator also includes a transmission element, and the transmission element is at least partly filled in the insulating base
Accommodating hole in, to seal the light-emitting diode chip for backlight unit.
5. light emitting diode construction as claimed in claim 1, wherein, the insulator is further defined to a transmission element, and this is saturating
Light part integrally coats the metallic support and the light-emitting diode chip for backlight unit, and back portion region and the institute of described two conduction racks
The terminal surface for stating multiple adjutages is revealed in outside the transmission element.
6. a kind of load bearing seat module, it is characterised in that with being mounted thereon for multiple light-emitting diode chip for backlight unit, the load bearing seat mould
Block includes：
Multiple metallic supports, one body phase are linked to be monolithic construction, each metallic support include two conduction racks with it is multiple
Extend the adjutage for being formed respectively from described two conduction racks one, each conduction rack has a front, a back side and phase
It is connected in a ring side in the front and the back side periphery, and the front definition of each conduction rack has a seal area and by this
The supporting region surrounded by seal area；
Wherein, each conduction rack is formed with an at least separation trough, and at least one separation from its positive seal area is recessed
Groove is communicated in the ring side and two openings is formed on the ring side, so that the separation trough of each conduction rack can be separated out
The adjutage at least one with the supporting region；
Wherein, the separation trough quantity of each conduction rack is for multiple, and each separation trough is in triangle columnar structure, Mei Yisuo
The size for stating two openings of separation trough is different, and in each separation trough, its less opening is formed in the triangle columnar structure
A wherein corner, and larger opening is then formed in the opposite side in the corner；
Wherein, two conduction racks of each metallic support are respectively defined as one first conduction rack and one second conduction rack, edge
Any two adjacent metal support on one first direction passes through the first conduction rack adjutage of a wherein metallic support obliquely
Integrally be connected in the second conduction rack adjutage of wherein another metallic support, and the adjutage that is connected of the oblique one with this first
Direction mutually accompanies an acute angle；And
Multiple insulating bases, which is coated on the plurality of metallic support outer rim.
7. a kind of metallic support of light emitting diode construction, it is characterised in that include：
Two conduction racks, which is set in distance, each conduction rack have a front, a back side and be connected in the front with
One ring side of the back side periphery, and the front definition of each conduction rack has a seal area to be surrounded by the seal area with one
Supporting region；And
Multiple adjutages, which extends from described two conduction racks one respectively and is formed；
Wherein, each conduction rack is formed with an at least separation trough, and at least one separation from its positive seal area is recessed
Groove is communicated in the ring side and two openings is formed on the ring side, so that described at least the one of each conduction rack separates
Groove can separate open at least one of the plurality of adjutage and the supporting region；
Wherein, the separation trough quantity of each conduction rack is for multiple, and each separation trough is in triangle columnar structure, Mei Yisuo
The size for stating two openings of separation trough is different, and in each separation trough, its less opening is formed in the triangle columnar structure
A wherein corner, and larger opening is then formed in the opposite side in the corner.
8. the metallic support of light emitting diode construction as claimed in claim 7, wherein, in each conduction rack, the ring
Side corresponds to the short slot of the position formation one by the front insertion to the back side of the smaller opening of each separation trough.
9. the metallic support of light emitting diode construction as claimed in claim 7, wherein, wherein the one of described two conduction racks lead
Electric frame is in convex and to be provided with a protuberance, and another conduction rack it is concave and in should the position of protuberance be provided with corresponding to this
One depressed part of protuberance, the lower surface of the protuberance form channel-shaped construction, and the upper surface of the depressed part is arranged with a groove.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/327,643 US9583689B2 (en) | 2013-07-12 | 2014-07-10 | LED package |
| TW103123972A TWI511337B (en) | 2013-07-12 | 2014-07-11 | Led package |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361845526P | 2013-07-12 | 2013-07-12 | |
| US61/845,526 | 2013-07-12 |
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| CN201310647783.8A Active CN104282821B (en) | 2013-07-12 | 2013-12-04 | Light emitting diode construction, light emitting diode construction metallic support and load bearing seat module |
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| TW (2) | TWI513068B (en) |
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| CN105261694B (en) * | 2015-10-27 | 2018-07-27 | 东莞智昊光电科技有限公司 | LED support and its production method |
| CN105609616A (en) * | 2016-03-21 | 2016-05-25 | 福建天电光电有限公司 | Manufacturing method of EMC package infrared device and EMC connecting bracket |
| CN108305926B (en) * | 2018-02-08 | 2020-02-07 | 开发晶照明（厦门）有限公司 | LED support, LED module and manufacturing method of LED support |
| CN110970384A (en) * | 2018-09-28 | 2020-04-07 | 光宝光电(常州)有限公司 | Lead frame array for carrying chip and multi-chip light-emitting diode packaging structure |
| TWI679740B (en) * | 2018-09-28 | 2019-12-11 | 大陸商光寶光電（常州）有限公司 | Lead frame array for carrying chips and led package structure with multiple chips |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN104282821A (en) | 2015-01-14 |
| TW201503423A (en) | 2015-01-16 |
| TW201503429A (en) | 2015-01-16 |
| TWI511337B (en) | 2015-12-01 |
| TWI513068B (en) | 2015-12-11 |
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