CN108305926B - LED support, LED module and manufacturing method of LED support - Google Patents

LED support, LED module and manufacturing method of LED support Download PDF

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Publication number
CN108305926B
CN108305926B CN201810127199.2A CN201810127199A CN108305926B CN 108305926 B CN108305926 B CN 108305926B CN 201810127199 A CN201810127199 A CN 201810127199A CN 108305926 B CN108305926 B CN 108305926B
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China
Prior art keywords
electrode
side wall
wing
sidewall
insulating carrier
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CN201810127199.2A
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CN108305926A (en
Inventor
陈静
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Purui Optoelectronics Xiamen Co ltd
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Developing Jing Lighting (xiamen) Co Ltd
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Priority to CN201810127199.2A priority Critical patent/CN108305926B/en
Publication of CN108305926A publication Critical patent/CN108305926A/en
Priority to US16/262,870 priority patent/US11257988B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

The invention relates to an LED bracket, an LED module and a manufacturing method of the LED bracket. The LED support comprises an insulating carrier and a lead frame, wherein the insulating carrier is provided with a first side wall, a second side wall and a spacing part, the first side wall is opposite to the second side wall, and the spacing part is positioned between the first side wall and the second side wall; the lead frame comprises a first electrode and a second electrode, the first electrode and the second electrode are located on two sides of the spacing part and are insulated at intervals through the spacing part, the first electrode is provided with a first bottom part and a first wing part which are connected, the first wing part is bent and extended from the first bottom part to the first inner side surface and is located on the first inner side surface, the second electrode is provided with a second bottom part and a second wing part which are connected, and the second wing part is bent and extended from the second bottom part to the second inner side surface and is located on the second inner side surface. Therefore, the LED support can improve the reflectivity and is not influenced by aging of resin materials.

Description

LED support, LED module and manufacturing method of LED support
Technical Field
The present disclosure relates to a package base, and more particularly, to an LED support, an LED module, and a method for manufacturing an LED support.
Background
A package base, for example, a SMD holder, for packaging a light emitting diode chip is mainly fabricated by combining an etching sheet and a white case, wherein the etching sheet is made of a conductive material such as ceramic, iron, copper, and aluminum, and the white case is made of an insulating material such as PPA, PCT, EMC, and SMC.
Usually, the etching sheet is etched into a flat plate-shaped positive electrode and a flat plate-shaped negative electrode, and then the white shell is injection molded by using a resin material to be combined with the etching sheet. To facilitate directional lighting, most white shells are cupped, thus completing the package base.
The conventional packaging base has the following problems that 1, the light of the light-emitting diode chip is reflected by the reflecting surface at the inner side of the cup-shaped white shell, and the reflectivity is low. 2. White shells turn yellow after aging.
Therefore, how to improve the white shell reflectivity in the package base and yellowing after aging has become one of the problems to be solved by those skilled in the art.
Disclosure of Invention
The embodiment of the invention provides an LED bracket, which comprises an insulating carrier and a lead frame, wherein the lead frame is combined and fixed with the insulating carrier, the insulating carrier is provided with a first side wall, a second side wall and a spacing part, the first side wall is opposite to the second side wall, the spacing part is positioned between the first side wall and the second side wall, the first side wall is provided with an inclined first inner side surface, and the second side wall is provided with an inclined second inner side surface; the lead frame comprises a first electrode and a second electrode, the first electrode and the second electrode are located on two sides of the spacing part and are insulated at intervals through the spacing part, the first electrode is provided with a first bottom part and a first wing part which are connected, the first bottom part is adjacent to the spacing part of the insulating carrier, the first wing part is bent and extended from the first bottom part towards the first inner side surface and is located on the first inner side surface, the second electrode is provided with a second bottom part and a second wing part which are connected, the second bottom part is adjacent to the spacing part of the insulating carrier, and the second wing part is bent and extended from the second bottom part towards the second inner side surface and is located on the second inner side surface.
In one embodiment, the insulating carrier further includes a third sidewall and a fourth sidewall opposite to each other, the third sidewall has a third inner side surface, the fourth sidewall has a fourth inner side surface, and the first sidewall, the third sidewall, the second sidewall and the fourth sidewall are sequentially connected.
In one embodiment, the spacer is connected between the third sidewall and the fourth sidewall; the first electrode also comprises two first secondary wing parts which respectively extend from the first bottom part towards the third inner side surface and the fourth inner side surface in a bending way and are positioned on the third inner side surface and the fourth inner side surface; the second electrode further comprises two second wing parts, and the two second wing parts respectively extend from the second bottom part towards the third inner side surface and the fourth inner side surface in a bending manner and are positioned on the third inner side surface and the fourth inner side surface.
In one embodiment, the spacer is connected to two sides of the first sidewall, and the spacer is formed into a shape of n; the second electrode further comprises a third wing part and a fourth wing part, the third wing part is bent and extended from the second bottom part to the third inner side surface and is positioned on the third inner side surface, and the fourth wing part is bent and extended from the second bottom part to the fourth inner side surface and is positioned on the fourth inner side surface.
In one embodiment, the first electrode further comprises a first branch portion extending from the first bottom portion in a direction of an end portion of the first sidewall and passing through the first sidewall.
In one embodiment, the first branch portion extends from the first bottom portion toward an end portion of the first sidewall, the first branch portion and the first bottom portion have the same thickness, and the first branch portion is exposed from a bottom surface and a side surface of the first sidewall.
In one embodiment, the first branch portion extends from the first bottom portion toward an end portion of the first sidewall, the thickness of the first branch portion is smaller than that of the first bottom portion, and the first branch portion is exposed from a side surface of the first sidewall.
The embodiment of the invention also provides a manufacturing method of the LED bracket, which comprises the following steps: forming a plurality of connected lead frames, wherein each lead frame comprises a first electrode and a second electrode, the first electrode is provided with a first bottom and a first wing which are connected, the first wing bends and extends from the first bottom to the direction far away from the first bottom, the second electrode is provided with a second bottom and a second wing which are connected, and the second wing bends and extends from the second bottom to the direction far away from the second bottom; arranging the plurality of connected lead frames in a mould, and performing injection molding on the plurality of connected lead frames in the mould to form a plurality of connected insulating carriers, wherein each insulating carrier is provided with a first side wall, a second side wall and a spacing part, the first side wall is opposite to the second side wall, the spacing part is positioned between the first side wall and the second side wall, the first side wall is provided with an inclined first inner side surface, and the second side wall is provided with an inclined second inner side surface; the first wing part is positioned on the first inner side surface, and the second wing part is positioned on the second inner side surface; and cutting the plurality of connected lead frames and the plurality of connected insulating carriers along the cut.
In one embodiment, the step of forming a plurality of connected lead frames includes etching, cutting and/or stamping.
In one embodiment, the plurality of connected lead frames are connected by connecting branches, and the connecting branches are formed by respectively connecting the first bottom of the first electrode and the second bottom of the second electrode outwards; the first branch portion connected to the first electrode and the second branch portion connected to the second electrode are formed when the connecting branch portion is cut in the process of cutting the plurality of connected lead frames along the cut.
The embodiment of the invention also provides an LED module, which comprises an insulating carrier, a lead frame and an LED chip, wherein the lead frame is combined and fixed with the insulating carrier, the insulating carrier is provided with a first side wall, a second side wall and a spacing part, the first side wall is opposite to the second side wall, the spacing part is positioned between the first side wall and the second side wall, the first side wall is provided with an inclined first inner side surface, and the second side wall is provided with an inclined second inner side surface; the lead frame comprises a first electrode and a second electrode, the first electrode and the second electrode are positioned on two sides of the spacing part and are insulated at intervals through the spacing part, the first electrode is provided with a first bottom part and a first wing part which are connected, the first bottom part is adjacent to the spacing part of the insulating carrier, the first wing part is bent and extended from the first bottom part to the first inner side surface and is positioned on the first inner side surface, the second electrode is provided with a second bottom part and a second wing part which are connected, the second bottom part is adjacent to the spacing part of the insulating carrier, and the second wing part is bent and extended from the second bottom part to the second inner side surface and is positioned on the second inner side surface; the LED chip is electrically coupled to the first bottom and the second bottom respectively.
The lead frame of the LED support and the LED module comprises a first electrode and a second electrode, wherein a first wing part of the first electrode is bent and extends from a first bottom part to the direction of a first inner side surface of a first side wall and is positioned on the first inner side surface, and a second wing part of the second electrode is bent and extends from a second bottom part to the direction of a second inner side surface of a second side wall and is positioned on the second inner side surface; the first wing part and the second wing part can cover most surfaces of the insulating carrier, so that when the LED module is assembled, the insulating carrier can be prevented from being deteriorated by light irradiation, or the problem that the reflection efficiency of the material of the insulating carrier is not high is avoided. Therefore, the LED support can improve the reflectivity of the LED module, can prevent the packaged LED module from being influenced by aging of materials, and effectively prolongs the service life.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented in accordance with the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more clearly understood, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic perspective view of an LED holder according to a first embodiment of the present invention.
Fig. 2 is a top view of the LED fixture of fig. 1.
Fig. 3 is a cross-sectional view taken along III-III' of the LED fixture shown in fig. 2.
Fig. 4 is a cross-sectional view of the LED cradle shown in fig. 2, taken along line IV-IV'.
Fig. 5 is a schematic perspective view of an LED holder according to a second embodiment of the present invention.
Fig. 6 is a cross-sectional view of the LED fixture of fig. 5.
Fig. 7 is a top view of a third embodiment of an LED fixture according to the present invention.
Fig. 8 is a cross-sectional view of the LED holder shown in fig. 7, taken along VIII-VIII'.
Fig. 9 is a schematic cross-sectional view of an LED holder according to a fourth embodiment of the present invention.
Fig. 10 is a schematic view of a substrate in the method for manufacturing an LED support according to the fifth embodiment of the present invention.
FIG. 11 is a cross-sectional view of the substrate shown in FIG. 10 taken along line XI-XI'.
Fig. 12 is a schematic view of the substrate shown in fig. 10 formed in a predetermined pattern.
Fig. 13 is a top view of the substrate shown in fig. 12 formed with a predetermined pattern.
Fig. 14 is a schematic illustration of the substrate of fig. 12 after bending to form a plurality of connected lead frames.
Fig. 15 is a top view of a plurality of connected lead frames shown in fig. 14.
Fig. 16-18 are schematic diagrams of the process of bonding a plurality of connected lead frames shown in fig. 14 to a plurality of insulating carriers in a mold.
Fig. 19 is a schematic view showing connection of a plurality of LED holders in the method for manufacturing an LED holder according to the fifth embodiment of the present invention.
Fig. 20 is a schematic sectional view of a substrate in a method of manufacturing an LED holder according to a sixth embodiment of the present invention.
FIG. 21 is a schematic cross-sectional view of the substrate shown in FIG. 20 formed in a predetermined pattern.
Fig. 22 is a schematic cross-sectional view of the substrate of fig. 21 bent to form a plurality of connected lead frames.
Fig. 23-25 are schematic diagrams of the process of bonding a plurality of connected lead frames shown in fig. 22 to a plurality of insulating carriers in a mold.
Fig. 26 is a schematic view of a plurality of connected lead frames in a method of manufacturing an LED support according to a seventh embodiment of the present invention.
Fig. 27 is a schematic view showing connection of a plurality of LED holders in the method for manufacturing an LED holder according to the seventh embodiment of the present invention.
Fig. 28 is a schematic cross-sectional view of an LED module according to an eighth embodiment of the invention.
Detailed Description
Specific structural and functional details disclosed herein are merely representative and are provided for purposes of describing example embodiments of the present invention. The present invention may, however, be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "center," "lateral," "upper," "lower," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the positional or orientational relationships indicated in the drawings to facilitate the description of the invention and to simplify the description, and are not intended to indicate or imply that the device or component being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified. Furthermore, the term "comprises" and any variations thereof is intended to cover non-exclusive inclusions.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, and the two components can be communicated with each other. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
Fig. 1 is a schematic perspective view of an LED holder according to a first embodiment of the present invention. Fig. 2 is a top view of the LED fixture of fig. 1. Fig. 3 is a cross-sectional view taken along III-III' of the LED fixture shown in fig. 2. Fig. 4 is a cross-sectional view of the LED cradle shown in fig. 2, taken along line IV-IV'. Referring to fig. 1, fig. 2, fig. 3 and fig. 4, an LED support 100 according to a first embodiment of the present invention includes a lead frame 12 and an insulating carrier 14. The lead frame 12 is fixed in combination with an insulating carrier 14. The insulating carrier 14 has a first sidewall 141, a second sidewall 142, and a spacer 145. The spacer 145 is located between the first sidewall 141 and the second sidewall 142. The first sidewall 141 has a sloped first inboard surface 1412 and the second sidewall 142 has a sloped second inboard surface 1422. The leadframe 12 includes a first electrode 122 and a second electrode 124. The first electrode 122 and the second electrode 124 are located on both sides of the spacer 145 and are insulated from each other by the spacer 145. The first electrode 122 has a first base portion 1222 and a first wing portion 1224 connected thereto. The first bottom 1222 is adjacent to the spacer 145 of the insulating carrier 14. The first wing 1224 extends from the first bottom 1222 toward the first inner side surface 1412 of the first sidewall 141 and is located on the first inner side surface 1412. The second electrode 124 has a second bottom portion 1242 and a second wing portion 1244 connected thereto. The second bottom portion 1242 is adjacent to the spacer portion 145 of the insulating carrier 14. The second wing portion 1244 extends from the second bottom portion 1242 toward the second inner side 1422 of the second sidewall 142 and is located on the second inner side 1422.
The lead frame 12 of the LED support 100 includes a first electrode 122 and a second electrode 124, a first wing 1224 of the first electrode 122 extends from the first bottom 1222 toward the first inner side 1412 of the first sidewall 141 and is located on the first inner side 1412, and a second wing 1244 of the second electrode 124 extends from the second bottom 1242 toward the second inner side 1422 of the second sidewall 142 and is located on the second inner side 1422; the first wing part 1224 and the second wing part 1244 can cover most of the surface of the insulation carrier 14, so that when the LED module is assembled, light can be prevented from directly irradiating the insulation carrier 14, thereby preventing the insulation carrier 14 from deteriorating and yellowing, or preventing the insulation carrier 14 from having low material reflection efficiency. Therefore, the LED support 100 can improve the reflectivity of the LED module, and the packaged LED module is not affected by aging of the material, thereby effectively prolonging the service life.
In this embodiment, the LED support 100 may be a rectangular hollow cup-shaped structure. The insulating carrier 14 may further include a third sidewall 143 and a fourth sidewall 144 opposite to each other. The third side 143 wall has a sloped third inner side and the fourth side 144 wall has a sloped fourth inner side. The first sidewall 141, the third sidewall 143, the second sidewall 142, and the fourth sidewall 144 are sequentially connected. The partition 145 is connected between the third and fourth sidewalls 143 and 144, and divides the third and fourth sidewalls 143 and 144 into two sections, respectively. The first electrode 122 further includes two first sub-wings 1226, and the two first sub-wings 1226 respectively extend from the first bottom 1222 toward the third inner side and the fourth inner side and are located on the third inner side and the fourth inner side; namely, a first secondary wing 1226 extends from the first bottom 1222 toward the third inner side surface and is located on the third inner side surface, and another first secondary wing 1226 extends from the first bottom 1222 toward the fourth inner side surface and is located on the fourth inner side surface. The second electrode 124 further includes two second wing portions 1246, and the two second wing portions 1246 respectively extend from the second bottom portion 1242 toward the third inner side surface and the fourth inner side surface and are located on the third inner side surface and the fourth inner side surface; that is, one second wing portion 1246 extends from the second bottom portion 1242 in a bending manner toward the third inner side surface and is located on the third inner side surface, and the other second wing portion 1246 extends from the second bottom portion 1242 in a bending manner toward the fourth inner side surface and is located on the fourth inner side surface. The bending angle of the first wing 1224, the second wing 1244, the first wing 1226 and the second wing 1246 may be 45 to 90 degrees, preferably 60 to 87 degrees.
The first electrode 122 may also include a first leg 1228. The first leg 1228 extends from the first bottom 1222 toward an end of the first sidewall 141 and passes through the first sidewall 141. Specifically, the first leg 1228 is the same thickness as the first base 1222; the first branch 1228 may be two, one of which extends toward a corner between the first and third sidewalls 141 and 143 and is exposed from side surfaces of the first and third sidewalls 141 and 143 and a bottom surface of the LED support 100, and the other of which extends toward a corner between the first and fourth sidewalls 141 and 144 and is exposed from side surfaces of the first and fourth sidewalls 141 and 144 and a bottom surface of the LED support 100. The surfaces of the first branch 1228 exposed from the side surfaces of the first sidewall 141 and the third sidewall 143 and the side surfaces of the first sidewall 141 and the fourth sidewall 144 are not plated, and the surface of the part exposed from the bottom surface of the LED holder 100 is plated.
The second electrode 124 may also include a second branch 1448. The second branch 1448 extends from the second bottom 1242 in a direction of an end of the second sidewall 142 and passes through the second sidewall 142. Specifically, the second branch 1448 has the same thickness as the second bottom 1242; the second leg 1448 may have two portions, one of which extends toward the corner between the second sidewall 142 and the third sidewall 143 and is exposed from the side surfaces of the second sidewall 142 and the third sidewall 143 and the bottom surface of the LED holder 100, and the other of which extends toward the corner between the second sidewall 142 and the fourth sidewall 144 and is exposed from the side surfaces of the second sidewall 142 and the fourth sidewall 144 and the bottom surface of the LED holder 100. The exposed portions of the second branch 1448 from the side surfaces of the second sidewall 142 and the third sidewall 143 and the exposed portions of the second sidewall 142 and the fourth sidewall 144 are not plated, and the surface of the exposed portion from the bottom surface of the LED support 100 is plated.
The insulating carrier 14 may be made of a resin material, for example, a resin material such as PPA, PCT, EMC, SMC, or the like. The lead frame 12 may be made of iron, copper, aluminum, etc., and may be formed into a predetermined shape by cutting, etching, and/or stamping, etc., and then a metal having high reflectivity and a conductive effect, such as silver, may be plated on the surface thereof.
Fig. 5 is a schematic perspective view of an LED holder according to a second embodiment of the present invention. Fig. 6 is a cross-sectional view of the LED fixture of fig. 5. Referring to fig. 5 and 6, an LED support 300 according to a second embodiment of the present invention is similar to the LED support 100 according to the first embodiment, and includes a lead frame 32 and an insulating carrier 34. The lead frame 32 is fixed in combination with an insulating carrier 34. The insulating carrier 34 has a first sidewall 341, a third sidewall 343, a second sidewall 342, and a fourth sidewall 344 connected in sequence, and a spacer 345. The lead frame 32 includes a first electrode 322 and a second electrode 324. The first electrode 322 can also include a first bottom portion 3222, a first wing portion 3224, two first minor wing portions 3226 and a first branch portion 3228, and the second electrode 324 can also include a second bottom portion 3442, a second wing portion 3444, two second minor wing portions 3446 and a second branch portion 3448.
It differs in that the thickness of first branch 3228 is less than the thickness of first bottom 3222; the first branch 3228 may have two first branches, one of the first branches extends toward a corner between the first sidewall 341 and the third sidewall 343 and is exposed from the side surfaces of the first sidewall 341 and the third sidewall 343, and the exposed portion may not be plated; the other is extended toward the corner between the first sidewall 341 and the fourth sidewall 344 and exposed from the side surfaces of the first sidewall 341 and the fourth sidewall 344, and the exposed portion may not be plated. The first branch portion 3228 is not exposed from the bottom surface of the LED support 300. Second leg 3448 is less than the thickness of second foot 3242; there may be two second branch portions 3448, one of which extends toward the corner between the second side wall 342 and the third side wall 343 and is exposed from the side surfaces of the second side wall 342 and the third side wall 343, and the exposed portion may not be plated; the other one extends toward the corner between the second side wall 342 and the fourth side wall 344 and is exposed from the side surfaces of the second side wall 342 and the fourth side wall 344, and the exposed portion may not be plated. The second branch portion 3448 is not exposed from the bottom surface of the LED holder 300.
The first branch portion 3228 and the second branch portion 3448 are only partially exposed from the side surface of the insulating carrier 34, and other portions are covered by the insulating carrier 34, so that the bonding force between the lead frame 32 and the insulating carrier 34 can be further improved, thereby improving the connection strength between the lead frame 32 and the insulating carrier 34.
Further, the thickness of the first wing portion 3224 and the two first secondary wing portions 3226 may be less than the thickness of the first bottom portion 3222, and the thickness of the second wing portion 3444 and the two second secondary wing portions 3446 may be less than the thickness of the second bottom portion 3442.
Fig. 7 is a top view of a third embodiment of an LED fixture according to the present invention. Fig. 8 is a cross-sectional view of the LED holder shown in fig. 7, taken along VIII-VIII'. Referring to fig. 7 and 8, an LED support 500 according to a third embodiment of the present invention is similar to the LED support 100 according to the first embodiment, and includes a lead frame 52 and an insulating carrier 54. The lead frame 52 is fixed in combination with an insulating carrier 54. The insulating carrier 54 has a first sidewall 541, a third sidewall 543, a second sidewall 542, and a fourth sidewall 544, which are connected in sequence, and a spacer 545. The lead frame 52 includes a first electrode 522 and a second electrode 524.
The difference is that the spacing portions 545 are connected to two sides of the first sidewall 541, the spacing portions 545 form an n-shape, an opening side of the n-shape spacing portion 545 faces the first sidewall 541, and two opposite sides of the n-shape spacing portion 545 are respectively positioned on the third sidewall and the fourth sidewall to separate and insulate the first electrode 522 and the second electrode 524; the first electrode 522 has a first wing 5224 connected to the first base 5222, and the second electrode 524 has a second wing 5244, a third wing 5246 and a fourth wing 5247 connected to the second base 5242. The first wing portion 5224 is bent and extended toward the first inner side surface of the first sidewall 541 and is located on the first inner side surface, the second wing portion 5244 is bent and extended toward the second inner side surface of the second sidewall 542 and is located on the second inner side surface, the third wing portion 5246 is bent and extended toward the third inner side surface of the third sidewall 543 and is located on the third inner side surface, and the fourth wing portion 5247 is bent and extended toward the fourth inner side surface of the fourth sidewall 544 and is located on the fourth inner side surface. Specifically, the first bottom 5222 is adjacent to the inner side of the n-shaped spacer 545, and the third wing 5246, the second bottom 5242 and the fourth wing 5247 are adjacent to the outer side of the n-shaped spacer 545, respectively.
In addition, the first electrode 522 may further include a first branch portion, the second electrode 524 may further include a second branch portion, and the first branch portion and/or the second branch portion may respectively adopt the structures of the above embodiments, which is not described in detail in this embodiment.
Fig. 9 is a schematic cross-sectional view of an LED holder according to a fourth embodiment of the present invention. Referring to fig. 9, an LED support 500 ' according to a fourth embodiment of the invention is similar to the LED support 500 according to the third embodiment, and the differences are that, in the first electrode 522 ' and the second electrode 524 ' of the lead frame 52 ' of the LED support 500 ', the thickness of the first branch portion is smaller than that of the first bottom portion, the thickness of the second branch portion is smaller than that of the second bottom portion, the thickness of the first wing portion 5224 ' is smaller than that of the first bottom portion 5222 ', and the thicknesses of the second wing portion 5444 ', the third wing portion and the fourth wing portion are respectively smaller than that of the second bottom portion 5442 '.
Fig. 10 is a schematic view of a substrate in the method for manufacturing an LED support according to the fifth embodiment of the present invention. FIG. 11 is a cross-sectional view of the substrate shown in FIG. 10 taken along line XI-XI'. Fig. 12 is a schematic view of the substrate shown in fig. 10 formed in a predetermined pattern. Fig. 13 is a top view of the substrate shown in fig. 12 formed with a predetermined pattern. Fig. 14 is a schematic illustration of the substrate of fig. 12 after bending to form a plurality of connected lead frames. Fig. 15 is a top view of a plurality of connected lead frames shown in fig. 14. Fig. 16-18 are schematic diagrams of the process of bonding a plurality of connected lead frames shown in fig. 14 to a plurality of insulating carriers in a mold. Fig. 19 is a schematic view showing connection of a plurality of LED holders in the method for manufacturing an LED holder according to the fifth embodiment of the present invention. Referring to fig. 10 to 19, a fifth embodiment of the invention further provides a method for manufacturing an LED support, which includes the following steps.
In step one, as shown in fig. 15, a plurality of connected lead frames 62 are formed, and each lead frame 62 includes a first electrode 622 and a second electrode 624. The first electrode 622 has a first base portion 6222 and a first wing portion 6224 connected thereto. The first wing portion 6224 extends from the first bottom portion 6222 in a manner that bends away from the first bottom portion 6222. The second electrode 624 has a second bottom portion 6242 and a second wing portion 6244 connected thereto. The second wing 6244 extends from the second bottom portion 6242 in a bent manner in a direction away from the second bottom portion 6242. The angle of the bend may be 45-90 degrees, preferably 60-87 degrees.
In particular, in the present embodiment, the lead frame 62 takes nine as an example, the first electrode 622 can further include two first secondary wings 6226 and two first branches 6228, and the first secondary wings 6226 and the first branches 6228 are respectively connected to the first bottom portion 6222; the second electrode 624 further includes two second secondary wings 6246 and second branches 6448, and the second secondary wings 6246 and the second branches 6448 are connected to the second bottom portion 6242, respectively.
Step two, as shown in fig. 16 and 19, the plurality of connected lead frames 62 are set in a mold 61, and a plurality of insulating carriers 64 are injection-molded on the connected lead frames 62 in the mold 61. Each of the insulating carriers 64 has a first sidewall 641, a second sidewall 642, and a spacer 645. The first side wall 641 is opposite to the second side wall 642, and the spacing portion 645 is located between the first side wall 641 and the second side wall 642. The first side wall 641 has an inclined first inner side surface, and the second side wall 642 has an inclined second inner side surface. The first wing 6224 is located on the first inboard surface and the second wing 6244 is located on the second inboard surface.
In particular, in the present embodiment, each of the insulating carriers 64 may further include a third sidewall 643 and a fourth sidewall 644 which are opposite to each other. The third side 643 wall has a sloped third interior side and the fourth side wall 644 has a sloped fourth interior side. The first side wall 641, the third side wall 643, the second side wall 642 and the fourth side wall 644 are connected in sequence. The partition 645 is connected between the third sidewall 643 and the fourth sidewall 644, and divides the third sidewall and the fourth sidewall into two sections.
Step three, as shown in fig. 19, the plurality of connected lead frames 62 and the plurality of connected insulating carriers 64 are cut along the cuts 682, 684, thereby forming a single LED holder. The LED support structure may be the same as or similar to the LED support 100 in the first embodiment of the present invention. Where cuts 682, 684 may be tangential.
Specifically, in the present embodiment, the plurality of connected lead frames 62 may include materials such as iron, copper, aluminum, etc., which may be formed into a predetermined shape by cutting, etching and/or stamping, etc., and then plated with a metal having high reflectivity and conductive effect, such as silver, on the surface thereof.
Referring to fig. 10-15, the following steps may be included in the formation of a plurality of connected lead frames 62.
First, a sheet-shaped substrate 620 is provided, and a metal with high reflectivity and conductive effect may be plated on the sheet-shaped substrate 620, as shown in fig. 10 and 11. The sheet substrate 620 may have a rectangular flat plate shape, and the thickness thereof is the same throughout.
Next, a predetermined pattern 6202 is formed on the sheet-like base material 620, as shown in fig. 12 and 13. The predetermined pattern 6202 may be formed by etching or cutting. The predetermined pattern 6202 may define a structure of the first electrode 622 and the second electrode 624. The predetermined pattern 6202 may include a cut 6203 formed around the portion for forming the wing portion or the branch portion, and a hole 6204 formed between the portion for forming the first electrode 622 and the second electrode 624.
Next, the etched or cut sheet-like substrate is pressed and bent to form the first electrode 622 and the second electrode 624, as shown in fig. 14 and 15. The plurality of connected lead frames 62 after molding may be connected to each other by a connecting support portion 6447. The connecting branch portion 6447 can be formed by extending the first bottom portion 6222 of the first electrode 622 and the second bottom portion 6242 of the second electrode 624 outward, respectively, and when the connecting branch portion 6447 is cut, the first branch portion 6228 of the first electrode 622 or the second branch portion 6448 of the second electrode 624 can be formed. In addition, when stamping the bend, the bend of the first and second secondary tabs 6224 and 6246 of the first and second electrodes 622 and 624 to a predetermined angle, which may be 45-90 degrees, preferably 60-87 degrees, may be stamped.
The insulating carrier 64 may be made of resin, for example, resin such as PPA, PCT, EMC, SMC, or the like. As shown in fig. 16 to 18, after the plurality of connected lead frames 62 are disposed in the mold 61, liquefied resin may be injected from an injection port of the mold into a predetermined space provided in the mold 61, and after the resin is cured, a plurality of connected insulating carriers 64 fixed in combination with the plurality of connected lead frames 62 are formed. Specifically, in the present embodiment, the mold 61 may include an upper mold 612 and a lower mold 614. The periphery of the upper mold 612 may be provided with a fence 6122, and the middle of the upper mold 612 is formed with a groove 6124 corresponding to the wing part and the secondary wing part. One sidewall of the groove 6124 is adapted to closely engage with one surface of the corresponding wing or secondary wing. The depth D of the groove 6124 may be equal to or greater than the height H of the wing and the secondary wing, preferably greater than the height H of the wing and the secondary wing. The lower die 614 is used for bonding to the bottom of the lead frame 62; optionally, the periphery of the lower mold 614 may also be provided with a fence. The lower mold 614 is fitted to the upper mold 612 to hold the lead frame 62, and prevents the resin material from leaking from the periphery during injection molding.
In the manufacturing process of the LED holder, after the first wing portion 6224 and the second wing portion 6244 formed by bending in the lead frame 62 are combined with the insulating carrier 64, most of the surface of the insulating carrier 64 can be covered, so that when the LED module is assembled, the insulating carrier 64 can be prevented from being deteriorated due to the light irradiated to the insulating carrier 64, or the problem that the material reflection efficiency of the insulating carrier 64 itself is not high can be avoided. Further, a plurality of lead frames 62 may be connected by the connecting support portions 6447, so that a plurality of connected lead frames 62 may be simultaneously placed in a mold during the manufacturing process while a plurality of corresponding insulating carriers 64 are formed on the lead frames 62, which is beneficial to improving the production efficiency.
Fig. 20 is a schematic sectional view of a substrate in a method of manufacturing an LED holder according to a sixth embodiment of the present invention. FIG. 21 is a schematic cross-sectional view of the substrate shown in FIG. 20 formed in a predetermined pattern. Fig. 22 is a schematic cross-sectional view of the substrate of fig. 21 bent to form a plurality of connected lead frames. Fig. 23-25 are schematic diagrams of the process of bonding a plurality of connected lead frames shown in fig. 22 to a plurality of insulating carriers in a mold. Referring to fig. 20 to 25, a sixth embodiment of the present invention further provides a method for manufacturing an LED support, which is similar to the method for manufacturing the LED support of the fifth embodiment, and the difference is that: the thicknesses of the adopted sheet-shaped base materials 720 are not uniform and equal, but the thicknesses of the parts of the wing parts, the secondary wing parts and the connecting parts which are correspondingly manufactured subsequently are smaller than the thicknesses of the parts which are correspondingly manufactured subsequently as the bottoms. That is, when a plurality of connected lead frames 72 are formed, the thickness of the first wing part, the first secondary wing part and the first branch part of the lead frame 72 in the first electrode 722 is smaller than that of the first bottom part; in the second electrode 724, the thickness of the second wing portion, the second secondary wing portion and the second branch portion is smaller than that of the second bottom portion.
Referring to fig. 20-22, in particular, the following steps may be included in the formation of a plurality of connected lead frames 72.
First, a sheet-shaped substrate 720 is provided, and a metal with high reflectivity and conductive effect may be plated on the sheet-shaped substrate 720, as shown in fig. 20. The web 720 varies in thickness throughout.
Next, a predetermined pattern 7202 is formed on the web 720, as shown in fig. 21 and 22. The predetermined pattern 7202 may be formed by etching or cutting. The predetermined pattern 7202 may define the structure of the first electrode 722 and the second electrode 724. The predetermined pattern 7202 may include a cut or a hole 7204, for example, a cut is formed around a portion for forming a wing or a branch, and a through hole is formed at a portion between the portions for forming the first and second electrodes 722 and 724.
It is understood that in other embodiments, the thicknesses of the first wing, the first secondary wing and the first branch of the first electrode 722 and the thicknesses of the second wing, the second secondary wing and the second branch of the second electrode 724 may be formed after the predetermined pattern 7202 is formed, for example, by etching or cutting.
Fig. 26 is a schematic view of a plurality of connected lead frames in a method of manufacturing an LED support according to a seventh embodiment of the present invention. Fig. 27 is a schematic view showing connection of a plurality of LED holders in the method for manufacturing an LED holder according to the seventh embodiment of the present invention. Referring to fig. 26 and 27, a seventh embodiment of the invention further provides a manufacturing method of an LED support, which is similar to the manufacturing method of the LED support of the fifth embodiment, and includes the following steps.
In step one, as shown in fig. 26, a plurality of connected lead frames 82 are formed, each lead frame 82 including a first electrode 822 and a second electrode 824. The first electrode 822 has a first base portion 8222 and a first wing portion 8224 connected thereto. The first wing portion 8224 is bent and extended from the first bottom portion 8222 in a direction away from the first bottom portion 8222. The second electrode 824 has a second bottom portion 8242 and a second wing portion 8244 connected thereto. The second wing portion 8244 is bent and extended from the second bottom portion 8242 in a direction away from the second bottom portion 8242.
In particular, in the present embodiment, the first electrode 822 may further include a first branch portion 8228, and the first branch portion 8228 is connected to the first bottom portion 8222; the second electrode 624 further includes a third wing portion 8246, a fourth wing portion 8247 and a second branch portion 8448, and the third wing portion 8246, the fourth wing portion 8247 and the second branch portion 6448 are respectively connected to the second bottom portion 8242.
Step two, as shown in fig. 27, the plurality of connected lead frames 82 are set in a mold, and a plurality of insulating carriers 84 are injection-molded on the connected lead frames 82 in the mold. Each of the insulating carriers 84 has a first sidewall 841, a second sidewall 842, and a spacer 845. The first side wall 841 is opposite to the second side wall 842, and the spacer 845 is located between the first side wall 841 and the second side wall 842. The first sidewall 841 has an inclined first inner side surface, and the second sidewall 842 has an inclined second inner side surface. A first wing 8224 is positioned on the first inner side and a second wing 8244 is positioned on the second inner side.
In particular, in the present embodiment, each of the insulating carriers 84 may further include third and fourth opposing sidewalls 843 and 844. The third side 843 wall has a sloped third inner side and the fourth side 844 wall has a sloped fourth inner side. The first, third, second and fourth sidewalls 841, 843, 842 and 844 are connected in sequence. The spacer 845 is connected between the third sidewall 843 and the fourth sidewall 844, the spacer 845 is n-shaped, an opening side of the n-shaped spacer 845 faces the first sidewall 841, and two opposite sides of the n-shaped spacer 845 are respectively located on the third sidewall and the fourth sidewall. Third wing 8246 is positioned on third inboard surface 843 and fourth wing 8247 is positioned on fourth inboard surface 844. Specifically, the first bottom 8222 is adjacent to the inner side of the n-shaped spacer 845, and the third wing 8246, the second bottom 8242 and the fourth wing 8247 are adjacent to the outer side of the n-shaped spacer 845, respectively.
Step three, the plurality of connected lead frames 82 and the plurality of connected insulating carriers 84 are cut along the cuts 882, 884 to form a single LED mount, as shown in fig. 27. Wherein the LED support structure may be the same as or similar to the LED support 500 of the third embodiment of the present invention.
Fig. 28 is a schematic cross-sectional view of an LED module according to an eighth embodiment of the invention. Referring to fig. 28, the LED module according to the fifth embodiment of the present invention includes an insulating carrier 94, a lead frame 92 and an LED chip 96. The LED in which the insulating carrier 94 and the lead frame 92 form is similar to the LED support 100 described above. The LED chip 96 is electrically coupled to the first bottom portion 9222 of the first electrode 922 and the second bottom portion 9242 of the second electrode 924, respectively.
In summary, the LED frame and the LED module lead frame include a first electrode and a second electrode, a first wing of the first electrode is bent and extended from a first bottom toward a first inner side of the first sidewall and is located on the first inner side, and a second wing of the second electrode is bent and extended from a second bottom toward a second inner side of the second sidewall and is located on the second inner side; the first wing part and the second wing part can cover most surfaces of the insulating carrier, so that when the LED module is assembled, the insulating carrier can be prevented from being deteriorated by light irradiated to the insulating carrier, or the problem that the reflection efficiency of the material of the insulating carrier is not high is avoided. Therefore, the LED support can improve the reflectivity of the LED module, can prevent the packaged LED module from being influenced by aging of materials, and effectively prolongs the service life.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (10)

1. An LED support comprises an insulating carrier and a lead frame, wherein the lead frame is combined and fixed with the insulating carrier, and the LED support is characterized in that the insulating carrier is provided with a first side wall, a second side wall, a third side wall, a fourth side wall and a spacing part, the first side wall is opposite to the second side wall, the third side wall is opposite to the fourth side wall, the spacing part is positioned between the first side wall and the second side wall, the first side wall is provided with an inclined first inner side face, and the second side wall is provided with an inclined second inner side face; the lead frame comprises a first electrode and a second electrode, the first electrode and the second electrode are positioned at two sides of the spacing part and are insulated at intervals through the spacing part, the first electrode is provided with a first bottom part and a first wing part which are connected, the first bottom part is adjacent to the spacing part of the insulating carrier, the first wing part is bent and extended from the first bottom part to the first inner side surface and is positioned on the first inner side surface, the second electrode is provided with a second bottom part and a second wing part which are connected, the second bottom part is adjacent to the spacing part of the insulating carrier, the second wing part is bent and extended from the second bottom part to the second inner side surface and is positioned on the second inner side surface,
wherein the content of the first and second substances,
the lower surface of the first bottom of the first electrode is exposed out of the bottom of the LED support and is flush with the bottom of the insulating carrier;
the lower surface of the second bottom of the second electrode is exposed out of the bottom of the LED support and is flush with the bottom of the insulating carrier;
the first electrode also comprises a first branch part, the first branch part extends outwards from the first bottom towards a first included angle between the first side wall and the third side wall or the fourth side wall, and the side surface of the first branch part, which is far away from the first bottom, is flush with the outer side surface of the insulating carrier;
the second electrode further comprises a second branch part, the second branch part extends outwards from the second bottom towards a second included angle between the second side wall and the third side wall or the fourth side wall, and the side surface of the second branch part, which is far away from the first bottom, is flush with the outer side surface of the insulating carrier.
2. The LED support of claim 1, wherein the third sidewall has a sloped third inner side, the fourth sidewall has a sloped fourth inner side, and the first sidewall, the third sidewall, the second sidewall and the fourth sidewall are connected in sequence.
3. The LED holder according to claim 2, wherein the spacer is connected between the third sidewall and the fourth sidewall; the first electrode also comprises two first secondary wing parts which respectively extend from the first bottom part towards the third inner side surface and the fourth inner side surface in a bending way and are positioned on the third inner side surface and the fourth inner side surface; the second electrode further comprises two second wing parts, and the two second wing parts respectively extend from the second bottom part towards the third inner side surface and the fourth inner side surface in a bending manner and are positioned on the third inner side surface and the fourth inner side surface.
4. The LED support of claim 2, wherein the spacers are connected to two sides of the first sidewall, and the spacers are formed into a n-shape; the second electrode further comprises a third wing part and a fourth wing part, the third wing part is bent and extended from the second bottom part to the third inner side surface and is positioned on the third inner side surface, and the fourth wing part is bent and extended from the second bottom part to the fourth inner side surface and is positioned on the fourth inner side surface.
5. The LED support of claim 1, wherein the first leg portion has the same thickness as the first bottom portion, and the first leg portion is exposed from the bottom and side surfaces of the first sidewall.
6. The LED support of claim 1, wherein the first leg has a thickness less than a thickness of the first base, the first leg being exposed from a side of the first sidewall.
7. A manufacturing method of an LED support is characterized by comprising the following steps: forming a plurality of connected lead frames, wherein each lead frame comprises a first electrode and a second electrode, the first electrode is provided with a first bottom and a first wing which are connected, the first wing bends and extends from the first bottom to the direction far away from the first bottom, the second electrode is provided with a second bottom and a second wing which are connected, and the second wing bends and extends from the second bottom to the direction far away from the second bottom;
arranging the plurality of connected lead frames in a mould, and performing injection molding on the plurality of connected lead frames in the mould to form a plurality of connected insulating carriers, wherein each insulating carrier is provided with a first side wall, a second side wall, a third side wall, a fourth side wall and a spacing part, the first side wall is opposite to the second side wall, the third side wall is opposite to the fourth side wall, the spacing part is positioned between the first side wall and the second side wall, the first side wall is provided with an inclined first inner side face, and the second side wall is provided with an inclined second inner side face; the first wing part is positioned on the first inner side surface, and the second wing part is positioned on the second inner side surface; and
cutting the plurality of connected lead frames and the plurality of connected insulating carriers along the cuts,
wherein the content of the first and second substances,
the lower surface of the first bottom of the first electrode is exposed out of the bottom of the LED support and is flush with the bottom of the insulating carrier;
the lower surface of the second bottom of the second electrode is exposed out of the bottom of the LED support and is flush with the bottom of the insulating carrier;
the first electrode also comprises a first branch part, the first branch part extends outwards from the first bottom towards a first included angle between the first side wall and the third side wall or the fourth side wall, and the side surface of the first branch part, which is far away from the first bottom, is flush with the outer side surface of the insulating carrier;
the second electrode further comprises a second branch part, the second branch part extends outwards from the second bottom towards a second included angle between the second side wall and the third side wall or the fourth side wall, and the side surface of the second branch part, which is far away from the first bottom, is flush with the outer side surface of the insulating carrier.
8. The method of claim 7, wherein the step of forming the plurality of connected lead frames comprises etching, cutting and/or stamping.
9. The method according to claim 7, wherein the plurality of connected lead frames are connected by connecting branches, and the connecting branches are formed by respectively extending outwards the first bottom of the first electrode and the second bottom of the second electrode; the first branch portion connected to the first electrode and the second branch portion connected to the second electrode are formed when the connecting branch portion is cut in the process of cutting the plurality of connected lead frames along the cut.
10. An LED module comprises an LED support and an LED chip, wherein the LED support comprises an insulating carrier and a lead frame, and the lead frame is combined and fixed with the insulating carrier; the lead frame comprises a first electrode and a second electrode, the first electrode and the second electrode are positioned on two sides of the spacing part and are insulated at intervals through the spacing part, the first electrode is provided with a first bottom part and a first wing part which are connected, the first bottom part is adjacent to the spacing part of the insulating carrier, the first wing part is bent and extended from the first bottom part to the first inner side surface and is positioned on the first inner side surface, the second electrode is provided with a second bottom part and a second wing part which are connected, the second bottom part is adjacent to the spacing part of the insulating carrier, and the second wing part is bent and extended from the second bottom part to the second inner side surface and is positioned on the second inner side surface; the LED chip is electrically coupled to the first bottom and the second bottom respectively,
wherein the content of the first and second substances,
the lower surface of the first bottom of the first electrode is exposed out of the bottom of the LED support and is flush with the bottom of the insulating carrier;
the lower surface of the second bottom of the second electrode is exposed out of the bottom of the LED support and is flush with the bottom of the insulating carrier;
the first electrode also comprises a first branch part, the first branch part extends outwards from the first bottom towards a first included angle between the first side wall and the third side wall or the fourth side wall, and the side surface of the first branch part, which is far away from the first bottom, is flush with the outer side surface of the insulating carrier;
the second electrode further comprises a second branch part, the second branch part extends outwards from the second bottom towards a second included angle between the second side wall and the third side wall or the fourth side wall, and the side surface of the second branch part, which is far away from the first bottom, is flush with the outer side surface of the insulating carrier.
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