CN110875404A - Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device - Google Patents
Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device Download PDFInfo
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- CN110875404A CN110875404A CN201811005492.8A CN201811005492A CN110875404A CN 110875404 A CN110875404 A CN 110875404A CN 201811005492 A CN201811005492 A CN 201811005492A CN 110875404 A CN110875404 A CN 110875404A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a lead frame, a support and a manufacturing method thereof, a light-emitting device and a light-emitting device, wherein the manufacturing method of the lead frame comprises the steps of fixing a plate-shaped electrode substrate on a carrier, and then performing penetrating treatment on the plate-shaped electrode substrate in the thickness direction to form at least one filling groove; the filling groove separates the plate-shaped electrode substrate into at least one group of electrode substrate pairs which are respectively fixed on the carrier, the electrode substrate pairs comprise mutually independent positive electrode substrates and negative electrode substrates, and the side surfaces of the electrode substrate pairs are coated in the molding material after the molding material is injected into the filling groove. Through the implementation of the invention, when the lead frame is manufactured, the whole electrode substrate fixed on the carrier is directly penetrated, so that the electrode substrate is separated into the anode substrate and the cathode substrate which are mutually independent, the utilization rate of the lead frame is improved, the yield and the production efficiency of the LED light-emitting device on the single lead frame are improved, and the production cost can be effectively reduced.
Description
Technical Field
The invention relates to the technical field of Light Emitting Diodes (LEDs), in particular to a lead frame, a support, a manufacturing method of the lead frame, a Light Emitting device and a Light Emitting apparatus.
Background
In recent years, LEDs have been playing an important role in the display field of mobile terminals due to their unique advantages of low price, low power consumption, high brightness, long lifetime, etc., and there is a considerable development space for a long period of time in the future. In the existing LED production process, the adopted lead frame is the lead frame with the hollowed-out support forming area, and the space occupied by the single support forming area on the lead frame is large, so that the number of the LED supports formed on the lead frame in unit area is limited, and the yield is low when the LED light-emitting device is manufactured on each lead frame.
Disclosure of Invention
The embodiment of the invention provides a lead frame, a support, a manufacturing method of the lead frame, a light-emitting device and a light-emitting device, and mainly solves the technical problems that: the problem that the yield is low when the LED light-emitting device is manufactured on the lead frame due to the fact that the forming area of a single support on the existing lead frame occupies a large space.
In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a lead frame, where the method for manufacturing a lead frame includes:
fixing a plate-shaped electrode substrate on a carrier;
performing a penetration treatment on the plate-shaped electrode substrate in a thickness direction to form at least one filling groove; the filling groove separates the plate-shaped electrode substrates into at least one group of electrode substrate pairs which are respectively fixed on the carrier, and the electrode substrate pairs comprise mutually independent positive electrode substrates and negative electrode substrates; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material in the filling groove on the LED support obtained after cutting.
Preferably, the fixing of the plate-shaped electrode substrate to the carrier includes:
the plate-like electrode substrate is bonded and fixed to the carrier via the adhesive layer.
Preferably, the fixing of the plate-shaped electrode substrate to the carrier includes:
clamping a plate-shaped electrode substrate with a positioning groove on the bottom surface with a carrier with a positioning bulge matched with the positioning groove on the upper surface, and clamping and fixing the plate-shaped electrode substrate on the carrier;
or, the plate-shaped electrode substrate with the positioning bulges on the bottom surface is clamped with the carrier with the positioning grooves matched with the positioning bulges on the upper surface, and the plate-shaped electrode substrate is clamped and fixed on the carrier.
Preferably, before the plate-shaped electrode substrate is engaged and fixed to the carrier, the method further includes:
coating an adhesive layer on the contact surface of the plate-shaped electrode substrate and/or the carrier when the plate-shaped electrode substrate and the carrier are contacted with each other;
and/or, after the plate-shaped electrode substrate is fixed to the carrier by engagement, further comprising:
and clamping the whole body formed by the plate-shaped electrode substrate and the carrier by a clamp.
Preferably, the method further comprises, after fixing the plate-shaped electrode substrate to the carrier:
and covering a reflecting layer on the surface of the electrode substrate pair.
Preferably, a copper foil layer is further disposed between the reflection layer and the pair of electrode substrates.
Preferably, the depth of the filling groove is equal to the thickness of the electrode substrate pair; or the depth of the filling groove is greater than the thickness of the electrode substrate pair and less than the integral thickness of the electrode substrate pair and the carrier.
In order to solve the above technical problem, an embodiment of the present invention further provides a method for manufacturing an LED support, where the method for manufacturing an LED support includes:
forming a lead frame by the lead frame manufacturing method;
clamping the lead frame in a mold for injection of a molding material to mold at least one base body on the lead frame, the base body including a filling portion molded in a filling groove of the lead frame and a dam molded over a pair of electrode substrates of the lead frame; the dam is provided with a groove for packaging the LED chip, and the top surface of the electrode substrate pair is at least partially exposed out of the bottom surface of the groove;
and cutting the base main body along the position corresponding to the filling groove so that the side surface of the electrode substrate pair is covered by the filling part.
To solve the above technical problem, an embodiment of the present invention further provides a lead frame, including: the electrode substrate pair comprises a positive electrode substrate and a negative electrode substrate which are mutually independent, a filling groove for separating the positive electrode substrate from the negative electrode substrate is arranged between the positive electrode substrate and the negative electrode substrate, and the filling groove is formed by penetrating the plate-shaped electrode substrate in the thickness direction; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material in the filling groove on the LED support obtained after cutting.
Preferably, the surfaces of the electrode substrate pair are further covered with a reflective layer.
Preferably, the pair of electrode substrates is fixed to the carrier by an adhesive layer;
or, the bottom surface of the electrode substrate pair is provided with a positioning groove, the upper surface of the carrier is provided with a positioning bulge matched with the positioning groove, and the electrode substrate pair is fixed on the carrier in a clamping manner;
or, the bottom surface of the electrode substrate pair is provided with a positioning bulge, the upper surface of the carrier is provided with a positioning groove matched with the positioning bulge, and the electrode substrate pair is fixed on the carrier in a clamping manner.
Preferably, the depth of the filling groove is equal to the thickness of the electrode substrate pair; or the depth of the filling groove is greater than the thickness of the electrode substrate pair and less than the integral thickness of the electrode substrate pair and the carrier.
In order to solve the above technical problem, an embodiment of the present invention further provides an LED bracket, including: the LED chip packaging structure comprises an insulated and isolated electrode substrate pair and a base body formed on the electrode substrate pair, wherein the electrode substrate pair comprises a positive electrode substrate and a negative electrode substrate, the electrode substrate pair is obtained by fixing a plate-shaped electrode substrate on a carrier and then performing penetrating treatment on the plate-shaped electrode substrate to form a filling groove, the base body comprises a filling part in the filling groove and a dam above the electrode substrate pair, the side surface of the electrode substrate pair is covered by the filling part, the dam is provided with a groove for packaging an LED chip, and at least part of the top surface of the electrode substrate pair is exposed out of the bottom surface of the groove.
In order to solve the above technical problem, an embodiment of the present invention further provides an LED light emitting device, including: the LED support comprises the LED support and at least one LED chip packaged in the dam of the LED support.
To solve the above technical problem, an embodiment of the present invention further provides a light emitting device, including: in the above light-emitting device, the light-emitting device is a lighting device, an optical signal indicating device, a light supplementing device or a backlight device.
The invention has the beneficial effects that:
according to the lead frame, the support and the manufacturing method thereof, the light-emitting device and the light-emitting device provided by the embodiment of the invention, the manufacturing method of the lead frame comprises the steps of fixing the plate-shaped electrode substrate on a carrier, and then performing penetrating treatment on the plate-shaped electrode substrate in the thickness direction to form at least one filling groove; the filling groove separates the plate-shaped electrode substrate into at least one group of electrode substrate pairs which are respectively fixed on the carrier, and the electrode substrate pairs comprise a positive electrode substrate and a negative electrode substrate which are mutually independent; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material filled in the groove on the LED support obtained after cutting. When the lead frame is manufactured, the whole electrode substrate fixed on the carrier is directly penetrated, so that the electrode substrate is separated into the anode substrate and the cathode substrate which are mutually independent, the utilization rate of the lead frame is improved, the yield and the production efficiency of the LED light-emitting device on the single lead frame are improved, and the production cost can be effectively reduced; furthermore, the electrode substrate and the carrier are fixed in an adhesion or clamping mode, the fixing process is simple and easy to realize, and cost control and production efficiency improvement are further facilitated; in addition, according to the LED support manufactured by the lead frame, the side face of the lead is covered inside, so that the side face of the LED support is not exposed out of the lead, and the air tightness of the LED support is improved.
Drawings
Fig. 1 is a schematic structural diagram of a lead frame according to a first embodiment of the present invention;
fig. 2 is a schematic structural view illustrating a plate-shaped electrode substrate fixed on a carrier according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another lead frame according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another lead frame according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram of an LED support according to an embodiment of the present invention before singulation;
fig. 6 is a schematic structural diagram of an LED light-emitting device according to a second embodiment of the present invention;
fig. 7 is a flowchart of a lead frame manufacturing method according to a second embodiment of the present invention;
fig. 8 is a flowchart of a method for manufacturing an LED support according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
in order to solve the problem of low yield in manufacturing LED light emitting devices on a lead frame due to a large space occupied by a single support molding area on the lead frame in the prior art, the present invention provides a lead frame 10, and specifically, referring to fig. 1, the lead frame 10 includes: the electrode substrate pair comprises a carrier 11 and at least one set of electrode substrate pair fixed on the carrier 11, wherein the electrode substrate pair comprises a positive electrode substrate 12 and a negative electrode substrate 13 which are independent from each other, a filling groove 14 for separating the positive electrode substrate 12 and the negative electrode substrate 13 is arranged between the positive electrode substrate and the negative electrode substrate, and the filling groove 14 is formed by penetrating treatment in the thickness direction of a plate-shaped electrode substrate. Preferably, in the present embodiment, the electrode substrate pair is fixed to the carrier 11 by bonding via the bonding layer 16; the position of the filling groove 14 corresponds to the cutting position after the LED holder molding is completed, so that the side surface of the electrode substrate pair is covered with the molding material in the filling groove 14 on the LED holder obtained after the cutting.
As shown in fig. 2, in the present embodiment, the base material of the lead frame is an electrode substrate made of a conductive material, and the electrode substrate is an integral whole plate-shaped electrode substrate 15, the plate-shaped electrode substrate 15 in the present embodiment is used for manufacturing a positive electrode substrate and a negative electrode substrate required for forming the LED support, so that the plate-shaped electrode substrate 15 needs to be separated into the positive electrode substrate and the negative electrode substrate which are independent from each other, so as to isolate the two substrates from each other and avoid short circuit during electrical connection. Therefore, in the embodiment, the plate-shaped electrode substrate 15 is fixed on the preset carrier 11 in advance, and after the plate-shaped electrode substrate is separated into the plurality of independent positive electrode substrates and negative electrode substrates, the plate-shaped electrode substrate does not scatter to damage the original overall layout, which is more beneficial to subsequent production and easier to realize large-scale batch production. It should be noted that, the electrode substrate pair in this embodiment is encapsulated in the molding material after the molding material is injected into the filling groove, and the position between the positive electrode substrate and the negative electrode substrate (i.e. the position on the filling groove) in this embodiment corresponds to the cutting position after the molding on the lead frame is completed, so that the side surfaces of the electrode substrate pair are not exposed outside after the cutting.
In practical applications, the fixing manner of the electrode substrate to the carrier includes, but is not limited to, the following:
the first method is as follows: the positive electrode substrate 12 and the negative electrode substrate 13 are bonded and fixed to the carrier 11 by the adhesive layer 16. Referring to fig. 1, the contact surface of the plate-shaped electrode substrate and the carrier in the present embodiment is fixed by an adhesive layer 16, wherein the adhesive layer 16 may be pre-disposed on the plate-shaped electrode substrate and/or the carrier, or may be an adhesive layer 16 separately prepared when the adhesive fixation is needed.
The second method comprises the following steps: the bottom surfaces of the anode substrate 12 and the cathode substrate 13 are provided with positioning grooves, the upper surface of the carrier is provided with positioning bulges matched with the positioning grooves, and the electrode substrates are fixed on the carrier in a pair-locking manner. Referring to fig. 3, the plate-shaped electrode substrate and the carrier in this embodiment are fixed by means of engaging, wherein the plate-shaped electrode substrate has a plurality of positioning slots 17, the carrier 11 has a plurality of positioning protrusions 18 matching with the positioning slots 17, and after the plate-shaped electrode substrate is separated, each of the positive electrode substrate 12 and the negative electrode substrate 13 is engaged and fixed with the positioning protrusions 18 on the carrier 11 through the positioning slots 17. It should be noted that, in another embodiment, the clamping fixation of the electrode substrate pair and the carrier can also be realized by positioning protrusions provided on the bottom surface of the electrode substrate pair and positioning grooves provided on the upper surface of the carrier and matched with the positioning protrusions.
In addition, it should be understood that, in order to ensure better fixing performance of the carrier to the electrode substrate pair, in practical applications, the electrode substrate pair may be fixed by combining a plurality of fixing methods, for example, before the plate-shaped electrode substrate is fastened and fixed on the carrier, an adhesive layer may be coated on a contact surface where the plate-shaped electrode substrate and the carrier are in contact with each other, or after the plate-shaped electrode substrate is fastened and fixed on the carrier, the whole body formed by the plate-shaped electrode substrate and the carrier may be clamped by a clamp, and the position stability of the electrode substrate pair may be effectively enhanced by adopting multiple fixing methods, so that the electrode substrate pair is not easy to shift or fall off in practical production.
In this embodiment, the positive electrode substrate and the negative electrode substrate are used as a functional region for subsequently mounting the LED chip and are electrically connected to the outside to supply power to the LED chip, and when the LED chip mounted on the electrode substrate pair needs to be electrically connected to the outside subsequently, the bottom surface of the electrode substrate pair is used as a bonding region to be electrically connected to the outside.
In addition, in practical applications, a material at a preset position on the plate-shaped electrode substrate in this embodiment may be removed by stamping or etching to form a filling groove on the plate-shaped electrode substrate, and it is noted that the material removal process needs to be performed on the plate-shaped electrode substrate in a penetrating manner, so as to completely break in the thickness direction of the plate-shaped electrode substrate, and thus achieve the insulating isolation between the formed positive electrode substrate and the negative electrode substrate.
In the present embodiment, the material of the plate-shaped electrode substrate may be various metals or metal alloy materials, including but not limited to copper, aluminum, iron, silver, or may be a mixed material containing a conductive material, such as conductive rubber, etc., and the plate-shaped electrode substrate in the present embodiment is preferably made of copper or copper alloy, which can ensure good electrical conductivity and heat dissipation. It should be understood that the plate-shaped electrode substrate formed using the conductive material is not limited to a single-layer structure, and may be a composite-layer structure composed of multiple layers of conductive materials in some embodiments.
In practical applications, in order to improve the reflectivity of light emitted from the LED chip mounted on the functional region formed by the electrode substrate pair, the surface of the electrode substrate pair may be coated with a reflective layer, where the reflective layer may be silver, aluminum, copper, gold, or the like, and the reflective layer may be preferably coated by electroplating, and it should be noted that the reflective layer coating process may be performed on the entire plate-shaped electrode substrate before the LED support is formed, on the positive electrode substrate and the negative electrode substrate after the plate-shaped electrode substrate is subjected to the penetrating process, or may be performed on only the electrode substrate where the functional region for mounting the LED chip is located after the LED support is formed. In addition, a copper foil layer is further arranged between the reflecting layer and the electrode substrate pair, the flatness of the surface of the electrode substrate pair is not high generally, the surface of the electrode substrate pair is coated with the copper foil layer to improve the surface flatness, and then the reflecting layer is coated on the surface of the copper foil layer to form a smooth surface, so that the reflectivity of the surface of the electrode substrate pair is further improved.
It should be noted that, in order to ensure that the plate-shaped electrode substrate can be separated into the positive electrode substrate and the negative electrode substrate independent of each other by the filling groove, referring to fig. 1 again, in one case, the depth of the filling groove 14 is equal to the thickness of the positive electrode substrate 12 and the negative electrode substrate 13, that is, the depth when the penetration treatment is performed is just the thickness of the plate-shaped electrode substrate, so that the plate-shaped electrode substrate is just disconnected, and the treatment of the carrier is not involved in the penetration treatment; referring to fig. 4, in another case, the depth of the filling groove 14 is greater than the thickness of the positive electrode substrate 12 and the negative electrode substrate 13 and less than the total thickness of the positive electrode substrate 12/the negative electrode substrate 13 and the carrier 11, that is, when the plate-shaped electrode substrate is penetrated, the plate-shaped electrode substrate is penetrated and extended into the carrier, so that the plate-shaped electrode substrate is absolutely separated and the carrier is still kept as a whole.
Based on the lead frame, the present embodiment further provides an LED support 20, as shown in fig. 5, where fig. 5 is a schematic structural diagram before the LED support is singulated, and a schematic structural diagram of the singulated LED support is shown in a dashed box in fig. 5. The LED support 20 includes: the LED chip packaging structure comprises an insulated and isolated electrode substrate pair and a base body formed on the electrode substrate pair, wherein the electrode substrate pair comprises a positive electrode substrate 12 and a negative electrode substrate 13, the electrode substrate pair is obtained by fixing a plate-shaped electrode substrate on a carrier 11 and then performing penetrating treatment on the plate-shaped electrode substrate to form a filling groove, the base body comprises a filling part 21 in the filling groove and a dam 22 above the electrode substrate pair, the side surface of the electrode substrate pair is covered by the filling part 21, the dam 22 is provided with a groove 23 for packaging an LED chip, and at least part of the top surface of the electrode substrate pair is exposed out of the bottom surface of the groove 23.
In practical applications, the LED frame is formed on a frame forming region of the lead frame by clamping the lead frame in a mold, and then injecting a molding material, wherein the molding material forms a filling portion in a filling groove of the pair of electrode substrates, and insulates and isolates the pair of electrode substrates, and a dam is formed on the pair of electrode substrates, a groove serving as a packaging region of the LED chip is formed on the dam of the formed LED frame, wherein at least a portion of an upper surface of the pair of electrode substrates of the lead frame is exposed to a bottom surface of the groove to serve as a functional region for mounting the LED chip, and further, when the LED chip needs to be conducted to the outside through the pair of electrode substrates, the bottom surface of the pair of electrode substrates is used as a bonding region to be electrically connected to the outside in this embodiment. In practical application, the LED chip may be mounted on the anode substrate, and then the LED chip is electrically connected to the anode substrate through the metal wire, and then the LED chip is connected to the cathode substrate through the metal wire. The recess is open to the top of the dam so that the interior of the recess can be encapsulated with the sealing material from the opening. It should be understood that the material for forming the dam in the present embodiment may include resin or ceramic, etc., and is not limited thereto. It should be noted that, in the present embodiment, when the single molded LED support is cut, the cutting position corresponds to the position between the positive substrate and the negative substrate (i.e., on the filling groove), so that after the cutting is completed, the side surfaces of the positive substrate and the negative substrate are covered by the molding material and are not exposed.
As shown in fig. 6, the present embodiment further provides an LED light emitting device 100 manufactured by using the LED support 20, which includes the LED support 20 and at least one LED chip 30 encapsulated in the dam 22 of the LED support 20.
Referring to fig. 6 again, in the single LED light emitting device 100 formed by cutting the LED support 20, the side surfaces of the anode substrate 12 and the cathode substrate 13 of the LED support 20 are covered in the filling portion 21 of the LED support, so that the side surfaces of the pair of electrode substrates are not exposed, and the air tightness of the LED light emitting device can be improved.
The colors of the LED light-emitting device provided by the embodiment, which are emitted by illumination and presented to a user, can be flexibly set according to actual requirements and application scenes. What color the light of the LED lighting device emits can be flexibly controlled by, but not limited to, the following factors: the color of light emitted by the LED chip itself, whether the LED lighting device is provided with a luminescence conversion layer, the type of luminescence conversion layer provided when the LED lighting device is provided with a luminescence conversion layer.
In an example of the embodiment, the LED light emitting device may further include a lens adhesive layer or a diffusion adhesive layer disposed on the LED chip (when the light emitting conversion adhesive layer is disposed on the LED chip, the light emitting conversion adhesive layer is disposed on the light emitting conversion adhesive layer); of course, in some examples, a layer of transparent glue may also be provided over the LED chip.
It should be understood that, in an example, the luminescence conversion glue layer may be a phosphor glue layer containing phosphor, or may be a colloid containing quantum dot photo-induced material, or other luminescence conversion glue or film capable of realizing luminescence conversion, and may also include diffusing powder or silicon powder, etc. as required; the light emitting conversion glue layer, the lens glue layer or the diffusion glue layer formed on the LED chip in this embodiment includes, but is not limited to, dispensing, molding, spraying, pasting, and the like.
For example, the luminescence conversion paste layer may include a phosphor paste layer, a phosphor film, or a quantum dot QD film; the phosphor glue layer and the phosphor film can be made of inorganic phosphor, and can be inorganic phosphor doped with rare earth elements, wherein the inorganic phosphor includes but is not limited to at least one of silicate, aluminate, phosphate, nitride and fluoride phosphor.
For another example, the quantum dot QD film may be fabricated using quantum dot phosphors; quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd (SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI 3.
In this embodiment, the type of light emitted by the LED chip itself may be visible light, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light emitting conversion layer may be disposed on the LED chip to convert the invisible light to visible light, so that the light emitted by the LED light emitting device is visible to the user. For example, when the light emitted from the LED chip itself is ultraviolet light, if the LED light emitting device is supposed to display white light visible to a user, the light emitting conversion layer may be made by mixing red, green, and blue phosphors.
An embodiment of the present invention provides a lead frame, including: the electrode substrate pair comprises a positive electrode substrate and a negative electrode substrate which are mutually independent, a filling groove for separating the positive electrode substrate from the negative electrode substrate is arranged between the positive electrode substrate and the negative electrode substrate, and the filling groove is formed by penetrating in the thickness direction of the plate-shaped electrode substrate; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material filled in the groove on the LED support obtained after cutting. When the lead frame is manufactured, the whole electrode substrate fixed on the carrier is directly penetrated, so that the electrode substrate is separated into the anode substrate and the cathode substrate which are mutually independent, the utilization rate of the lead frame is improved, the yield and the production efficiency of LED products on the single lead frame are improved, and the production cost can be effectively reduced; furthermore, the electrode substrate and the carrier are fixed in an adhesion or clamping mode, the fixing process is simple and easy to realize, and cost control and production efficiency improvement are further facilitated; in addition, according to the LED support manufactured by the lead frame, the side face of the lead is covered inside, so that the side face of the LED support is not exposed out of the lead, and the air tightness of the LED support is improved.
Example two:
in order to facilitate an overall understanding of the present invention, the present embodiment illustrates a manufacturing process of the lead frame provided by the present invention.
Referring to fig. 7, fig. 7 is a flowchart of a method for manufacturing a lead frame according to the present embodiment, and when manufacturing the lead frame, the method includes the following specific steps:
s701, fixing the plate-shaped electrode substrate on a carrier.
In this embodiment, the electrode substrate is a whole plate-shaped electrode substrate, and the electrode substrate in this embodiment is used to manufacture the positive electrode substrate and the negative electrode substrate required for the subsequent LED support molding, so that the plate-shaped electrode substrate needs to be separated into the positive electrode substrate and the negative electrode substrate which are independent from each other.
In one embodiment, the plate-shaped electrode substrate is adhesively fixed to the carrier by an adhesive layer, that is, the contact surface of the plate-shaped electrode substrate and the carrier is fixed by the adhesive layer, wherein the adhesive layer may be provided on the plate-shaped electrode substrate and/or the carrier in advance, or may be an adhesive layer separately prepared when the adhesive layer needs to be adhesively fixed.
In another implementation manner, a plate-shaped electrode substrate having a positioning groove on the bottom surface is engaged with a carrier having a positioning protrusion on the upper surface matching with the positioning groove, and the plate-shaped electrode substrate is engaged and fixed on the carrier. That is, the plate-shaped electrode substrate and the carrier are fixed in a clamping manner, wherein the plate-shaped electrode substrate is provided with a plurality of positioning grooves, the carrier is provided with a plurality of positioning bulges matched with the positioning grooves, and after the plate-shaped electrode substrate is separated, each positive electrode substrate and each negative electrode substrate are clamped and fixed with the positioning bulges on the carrier through the positioning grooves. It should be understood that the snap-fit fixation of the electrode substrate pair to the carrier may also be achieved by positioning protrusions provided on the bottom surface of the electrode substrate pair, and positioning grooves provided on the upper surface of the carrier to match the positioning protrusions.
In order to ensure a better fixing performance of the carrier to the electrode substrate pair, the electrode substrate pair may be fixed by combining a plurality of fixing methods in practical applications, for example, before the plate-shaped electrode substrate is fastened and fixed to the carrier, an adhesive layer may be coated on a contact surface where the plate-shaped electrode substrate and the carrier are in contact with each other, or after the plate-shaped electrode substrate is fastened and fixed to the carrier, the whole of the plate-shaped electrode substrate and the carrier may be clamped by a jig.
S702, performing a penetration process on the plate-shaped electrode substrate in a thickness direction to form at least one filling groove; the filling groove separates the plate-shaped electrode substrate into at least one group of electrode substrate pairs which are respectively fixed on the carrier, and the electrode substrate pairs comprise a positive electrode substrate and a negative electrode substrate which are mutually independent; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material filled in the groove on the LED support obtained after cutting.
In this embodiment, in order to ensure that the plate-shaped electrode substrate can be separated into the positive electrode substrate and the negative electrode substrate which are independent of each other by the filling groove, in one embodiment, the depth of the filling groove is equal to the thickness of the electrode substrate pair, that is, the depth when the penetration treatment is performed is just equal to the thickness of the plate-shaped electrode substrate, so that the plate-shaped electrode substrate is just disconnected, and the penetration treatment does not involve the treatment of the carrier; in another embodiment, the depth of the filling groove is greater than the thickness of the electrode substrate pair and less than the whole thickness of the electrode substrate pair and the carrier, that is, when the plate-shaped electrode substrate is penetrated, the plate-shaped electrode substrate is penetrated and extends into the carrier, so that the absolute separation of the plate-shaped electrode substrate can be ensured, and the carrier still keeps a whole. It should be noted that, the electrode substrate pair in this embodiment is encapsulated in the molding material after the molding material is injected into the filling groove, and the position between the positive electrode substrate and the negative electrode substrate (i.e. the position on the filling groove) in this embodiment corresponds to the cutting position after the molding on the lead frame is completed, so that the side surfaces of the electrode substrate pair are not exposed outside after the cutting.
In this embodiment, in order to increase the reflectance of light emitted from the LED chip mounted on the functional region formed by the pair of electrode substrates, the surface of the pair of electrode substrates may be coated with a reflective layer, which may be silver, aluminum, copper, gold, or the like. Furthermore, a copper foil layer is further arranged between the reflection layer and the electrode substrate pair, the flatness of the surface of the electrode substrate pair is not high generally, the surface of the electrode substrate pair is coated with the copper foil layer to improve the surface flatness, and then the reflection layer is coated on the surface of the copper foil layer to form a smooth surface, so that the reflectivity of the surface of the electrode substrate pair is further improved.
Further, the present embodiment also illustrates a process of manufacturing an LED support by using the lead frame manufactured by the above manufacturing process.
Referring to fig. 8, fig. 8 is a flowchart of a method for manufacturing an LED bracket according to this embodiment, and when manufacturing an LED bracket, the specific implementation steps include:
s801, preparing a lead frame; the lead frame includes a carrier and at least one pair of mutually independent electrode substrates fixed to the carrier after a plate-like electrode substrate fixed to the carrier is subjected to a penetration treatment in a thickness direction.
S802, clamping the lead frame in a mold to inject molding materials, and molding at least one base body on the lead frame, wherein the base body comprises a filling part molded in a filling groove of the lead frame and a dam molded above an electrode substrate pair of the lead frame; the dam has a groove for packaging the LED chip, and the top surface of the electrode substrate pair is at least partially exposed to the bottom surface of the groove.
S803, the susceptor body is cut along the position corresponding to the filling groove so that the side surface of the electrode substrate pair is covered by the filling portion.
In practical applications, the LED frame is formed on a frame forming region of the lead frame by clamping the lead frame in a mold, and then injecting a molding material, wherein the molding material forms a filling portion in a filling groove of the pair of electrode substrates, and insulates and isolates the pair of electrode substrates, and forms a dam on the pair of electrode substrates, a groove serving as a packaging region of the LED chip is formed on the dam of the formed LED frame, wherein at least a portion of a top surface of the pair of electrode substrates of the lead frame is exposed to a bottom surface of the groove to serve as a functional region for mounting the LED chip, and further, when the LED chip needs to be conducted to the outside through the pair of electrode substrates, the bottom surface of the pair of electrode substrates is used as a bonding region to be electrically connected to the outside in this embodiment. It should be noted that, in the present embodiment, when the single molded LED support is cut, the cutting position corresponds to the position between the positive substrate and the negative substrate (i.e., on the filling groove), so that after the cutting is completed, the side surfaces of the positive substrate and the negative substrate are covered by the molding material and are not exposed.
The lead frame manufacturing method provided by the embodiment of the invention comprises the following steps: fixing a plate-shaped electrode substrate on a carrier; performing a penetrating treatment on the plate-shaped electrode substrate in a thickness direction to form at least one filling groove; the filling groove separates the plate-shaped electrode substrate into at least one group of electrode substrate pairs which are respectively fixed on the carrier, and the electrode substrate pairs comprise a positive electrode substrate and a negative electrode substrate which are mutually independent; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material filled in the groove on the LED support obtained after cutting. The whole electrode substrate fixed on the carrier is penetrated, so that the electrode substrate is directly separated into the anode substrate and the cathode substrate which are independent from each other, the utilization rate of the lead frame is improved, the yield and the production efficiency of LED products on the single lead frame are improved, and the production cost can be effectively reduced.
Example three:
the present embodiment provides a light-emitting apparatus including the LED light-emitting device exemplified in the first or second embodiment. The light emitting device in this embodiment may be a lighting device, an optical signal indicating device, a light supplementing device, or a backlight device. When the lighting device is used, the lighting device can be specifically applied to various fields, such as a table lamp, a fluorescent lamp, a ceiling lamp, a down lamp, a street lamp, a projection lamp and the like in daily life, a high beam lamp, a dipped beam lamp, an atmosphere lamp and the like in an automobile, an operation lamp, a low electromagnetic lighting lamp and a lighting lamp of various medical instruments in medical use, and various colored lamps, landscape lighting lamps, advertisement lamps and the like in the field of decoration; when the optical signal indicating device is used, the optical signal indicating device can be applied to various fields, such as signal indicating lamps in the traffic field and various signal state indicating lamps on communication equipment in the communication field; when the device is a light supplement device, the device can be a light supplement lamp in the photographic field, such as a flash lamp and a light supplement lamp, and can also be a plant light supplement lamp for supplementing light to plants in the agricultural field; in the case of the backlight device, the backlight device may be applied to various backlight fields, for example, a display, a television, a mobile terminal such as a mobile phone, and an advertisement machine.
It should be understood that the above applications are only exemplary of the present embodiment, and that the application of the LED light emitting device is not limited to the exemplary fields.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (15)
1. A lead frame manufacturing method is characterized by comprising the following steps:
fixing a plate-shaped electrode substrate on a carrier;
performing a penetration treatment on the plate-shaped electrode substrate in a thickness direction to form at least one filling groove; the filling groove separates the plate-shaped electrode substrates into at least one group of electrode substrate pairs which are respectively fixed on the carrier, and the electrode substrate pairs comprise mutually independent positive electrode substrates and negative electrode substrates; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material in the filling groove on the LED support obtained after cutting.
2. The lead frame manufacturing method according to claim 1, wherein the fixing of the plate-like electrode substrate to the carrier comprises:
the plate-like electrode substrate is bonded and fixed to the carrier via the adhesive layer.
3. The lead frame manufacturing method according to claim 1, wherein the fixing of the plate-like electrode substrate to the carrier comprises:
clamping a plate-shaped electrode substrate with a positioning groove on the bottom surface with a carrier with a positioning bulge matched with the positioning groove on the upper surface, and clamping and fixing the plate-shaped electrode substrate on the carrier;
or, the plate-shaped electrode substrate with the positioning bulges on the bottom surface is clamped with the carrier with the positioning grooves matched with the positioning bulges on the upper surface, and the plate-shaped electrode substrate is clamped and fixed on the carrier.
4. The method of manufacturing a lead frame according to claim 3, further comprising, before the step of engaging and fixing the plate-like electrode substrate to the carrier, the step of:
coating an adhesive layer on the contact surface of the plate-shaped electrode substrate and/or the carrier when the plate-shaped electrode substrate and the carrier are contacted with each other;
and/or, after the plate-shaped electrode substrate is fixed to the carrier by engagement, further comprising:
and clamping the whole body formed by the plate-shaped electrode substrate and the carrier by a clamp.
5. The lead frame manufacturing method according to claim 1, further comprising, after fixing the plate-like electrode substrate to the carrier:
and covering a reflecting layer on the surface of the electrode substrate pair.
6. The lead frame manufacturing method according to claim 5, wherein a copper foil layer is further provided between the reflective layer and the pair of electrode substrates.
7. Lead frame manufacturing method according to any of claims 1 to 6, characterized in that the depth of the filling groove is equal to the thickness of the pair of electrode substrates; or the depth of the filling groove is greater than the thickness of the electrode substrate pair and less than the integral thickness of the electrode substrate pair and the carrier.
8. A manufacturing method of an LED bracket is characterized by comprising the following steps:
forming a lead frame by the lead frame fabrication method of any one of claims 1 to 7;
clamping the lead frame in a mold for injection of a molding material to mold at least one base body on the lead frame, the base body including a filling portion molded in a filling groove of the lead frame and a dam molded over a pair of electrode substrates of the lead frame; the dam is provided with a groove for packaging the LED chip, and the top surface of the electrode substrate pair is at least partially exposed out of the bottom surface of the groove;
and cutting the base main body along the position corresponding to the filling groove so that the side surface of the electrode substrate pair is covered by the filling part.
9. A lead frame, comprising: the electrode substrate pair comprises a positive electrode substrate and a negative electrode substrate which are mutually independent, a filling groove for separating the positive electrode substrate from the negative electrode substrate is arranged between the positive electrode substrate and the negative electrode substrate, and the filling groove is formed by penetrating the plate-shaped electrode substrate in the thickness direction; the position of the filling groove corresponds to the cutting position after the LED support is formed, so that the side face of the electrode substrate pair is covered by the forming material in the filling groove on the LED support obtained after cutting.
10. The lead frame according to claim 9, wherein surfaces of the pair of electrode substrates are further covered with a reflective layer.
11. The lead frame according to claim 9, wherein the pair of electrode substrates are adhesively secured to the carrier by an adhesive layer;
or, the bottom surface of the electrode substrate pair is provided with a positioning groove, the upper surface of the carrier is provided with a positioning bulge matched with the positioning groove, and the electrode substrate pair is fixed on the carrier in a clamping manner;
or, the bottom surface of the electrode substrate pair is provided with a positioning bulge, the upper surface of the carrier is provided with a positioning groove matched with the positioning bulge, and the electrode substrate pair is fixed on the carrier in a clamping manner.
12. The lead frame according to any one of claims 9 to 11, characterized in that the depth of the filling groove is equal to the thickness of the pair of electrode substrates; or the depth of the filling groove is greater than the thickness of the electrode substrate pair and less than the integral thickness of the electrode substrate pair and the carrier.
13. An LED support, comprising: the LED chip packaging structure comprises an insulated and isolated electrode substrate pair and a base body formed on the electrode substrate pair, wherein the electrode substrate pair comprises a positive electrode substrate and a negative electrode substrate, the electrode substrate pair is obtained by fixing a plate-shaped electrode substrate on a carrier and then performing penetrating treatment on the plate-shaped electrode substrate to form a filling groove, the base body comprises a filling part in the filling groove and a dam above the electrode substrate pair, the side surface of the electrode substrate pair is covered by the filling part, the dam is provided with a groove for packaging an LED chip, and at least part of the top surface of the electrode substrate pair is exposed out of the bottom surface of the groove.
14. An LED light emitting device comprising the LED support of claim 13 and at least one LED chip encapsulated within the dam of the LED support.
15. A lighting device comprising the LED device as claimed in claim 14, wherein the lighting device is a lighting device, a light signal indicating device, a light supplementing device or a backlight device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811005492.8A CN110875404A (en) | 2018-08-30 | 2018-08-30 | Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device |
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| CN201811005492.8A CN110875404A (en) | 2018-08-30 | 2018-08-30 | Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device |
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