KR100609970B1 - Substrate for mounting light emitting device, fabricating method thereof and package using the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting a light emitting device, a method for manufacturing the same, and a package using the same. A light emitting device mounting groove and an electrode line drawing-through hole are formed in a support plate, and a zener diode is formed in a serial process to mount a light emitting device. At the same time, there is an effect that can complement the withstand voltage characteristics of the light emitting device.

In addition, the present invention by forming a molding unit surrounding the light emitting device with a molding compound resin in which the phosphor powder is dispersed, there is an effect that can implement a light emitting source that emits light of various wavelengths, including a white light source.

Light Emitting Device, Substrate, Zener Diode, Package, Through Hole, Groove

Description

 Substrate for mounting light emitting device, fabricating method approximately and package using the same}

1 is a cross-sectional view of a light emitting diode according to the prior art.

2 is a schematic cross-sectional view of a surface mount light emitting device package using a molding technique of a lead frame according to the related art.

3A to 3E are cross-sectional views illustrating a manufacturing process of a substrate for mounting a light emitting device according to the present invention.

4 is a cross-sectional view showing a state in which a bonding member is formed on an electrode line in order to mount a light emitting device on a support plate according to the present invention.

5 is a cross-sectional view showing a package using the substrate for mounting the light emitting device of FIG.

6 is a cross-sectional view showing a state in which a molding part for protecting a package using a substrate for mounting a light emitting device according to the present invention is formed.

<Description of the symbols for the main parts of the drawings>

100: support plate 101a, 101b: through hole

103: groove 110a, 110b: mask layer

120a and 120b: diffusion layers 131a and 131b and 132a and 132b and electrode lines

141a, 141b: bonding member 150: light emitting element

160: molding part

The present invention relates to a substrate for mounting a light emitting device, a method for manufacturing the same, and a package using the same. More specifically, a groove for mounting a light emitting device and a through hole for drawing out an electrode line are formed in a support plate, and a zener diode is formed by a serial process. A light emitting device mounting substrate, a method for manufacturing the same, and a package using the same, which facilitates mounting of a light emitting device and complements the breakdown voltage characteristics of the light emitting device.

In general, light emitting devices such as light emitting diodes or laser diodes using a group 3-5 or 2-6 compound semiconductor material of a direct transition compound semiconductor are developed using thin film growth technology and device materials such as red, green, blue and ultraviolet light. Various colors can be realized, and efficient white rays can be realized by using fluorescent materials or combining colors.

The development of these technologies replaces not only display devices but also LED backlights, fluorescent lamps or incandescent lamps, which replace the Cold Cathode Fluorescence Lamp (CCFL), which forms the backlight of optical communication means, transmission modules, and liquid crystal display (LCD) displays. Applications are expanding to white light emitting diode lighting devices, automotive headlights and traffic lights.

In order to apply the light emitting device for this purpose, the operating voltage of the device should be low, and the luminous efficiency and luminance should be high.

1 is a cross-sectional view of a light emitting diode according to the prior art, in which an n-semiconductor layer 11, an active layer 12, and a p-semiconductor layer 13 are sequentially stacked on a sapphire or n-GaAs substrate 10. ; Mesa is etched from the p-semiconductor layer (13) to a part of the n-semiconductor layer (11); A transparent electrode 14 is formed on the p-semiconductor layer 13; An n-electrode 15 is formed on the mesa-etched n-semiconductor layer 11; The p-electrode 16 is formed on the transparent electrode 14.

In the light emitting diode, when a voltage is applied between the p-electrode 16 and the n-electrode 15 from an external power source, holes and electrons are injected into the p-electrode 16 and the n-electrode 15, and the active layer At 12, as the holes and the electrons recombine, extra energy is converted into light and emitted to the outside through the transparent electrode and the substrate.

The light emitting diode manufactured by the above method is mounted on a package and bonded to a printed circuit board together with other components.

On the other hand, semiconductor device packages are classified into an insert package and a surface mount package, and a surface mount package can be more integrated and thinner than an insert package, and a system integrated package can be implemented, so that a package for a light emitting diode device is provided. In the furnace, surface-mount packages are the mainstream.

2 is a schematic cross-sectional view of a surface mount light emitting device package using a lead frame molding technique according to the related art. The light emitting diode 51 is bonded to the lead frame 50, and the electrode of the light emitting diode 51 is bonded. Terminals (not shown) are bonded to the lead frame 50 and the wire 52, and are molded while wrapping the lead frame 50, the light emitting diode 51, and the wire 52.

In the molding process, the lead frame 50, the light emitting diodes 51, and the wires 52 are wrapped with the molding resin 53.

As a result, a surface mount light emitting device package using a molding technique of a lead frame is realized.

On the other hand, since the light emitting diode has a weak withstand voltage characteristic, in order to supplement the withstand voltage characteristic of the light emitting diode device, a zener diode or another electrostatic protection element (not shown) is used in parallel with the light emitting diode 51.

However, the above-described package structure requires a separate package for mounting a protective device, thereby increasing the size of the light emitting device package and additionally requiring a process and a cost of making a protective device package.

In order to solve the above problems, the present invention forms a light emitting device mounting groove and an electrode line drawing through hole in a support plate, and a zener diode is formed in a serial process to facilitate mounting of the light emitting device. It is an object of the present invention to provide a light emitting device mounting substrate and a method of manufacturing the same, which can supplement the voltage resistance characteristics of the light emitting device.

It is another object of the present invention to form a molding part surrounding a light emitting device with a molding resin in which phosphor powder is dispersed, thereby using a light emitting device mounting substrate capable of realizing a light emitting source that emits light of various wavelengths including a white light source. The package is provided.

A preferred aspect for achieving the above objects of the present invention,

Grooves are formed in the upper portion, and through holes are formed in each of the spaced apart support plate regions around the grooves;

A pair of diffusion layers in which impurities having a second polarity opposite to the first polarity of the support plate are injected and diffused are formed in the mutually spaced areas below the support plate opposite the grooves;

A light emitting device mounting substrate is provided in which each of the pair of electrode lines spaced apart from the inner surface of the groove and extended to the lower side of the support plate is connected to each of the pair of diffusion layers.

Another preferred aspect for achieving the above object of the present invention,

The upper mask layer is formed except for a region for forming a groove and a pair of through holes on the support plate having a first polarity, and corresponds to regions for forming a pair of through holes on the support plate. Forming a lower mask layer under the support plate except regions;

Masking the upper and lower mask layers, etching a region to form the groove to form a groove in the upper portion of the support plate, and a pair of through holes penetrating the support plate by etching regions to form a pair of through holes. Forming them;

Forming a pair of diffusion layers by injecting and diffusing impurities having a second polarity opposite to the first polarity of the support plate in spaced areas below the support plate opposite to the grooves;

Forming a pair of electrode lines spaced apart from each other at an inner surface of the groove on an upper portion of the support plate and an inner portion of the pair of through holes;

Forming electrode lines on the lower side of the pair of through holes and on the lower side of the support plate such that each of the pair of electrode lines formed on the upper side of the pair of through holes is connected to the pair of diffusion layers. Provided is a method of manufacturing a light emitting device mounting substrate.

Another preferred aspect for achieving the above object of the present invention,

Grooves are formed in the upper portion, through-holes are formed in each of the mutually spaced support plate regions around the groove, and in the mutually spaced regions below the support plate opposite to the grooves, a first polarity opposite to the first polarity of the support plate is formed. A pair of diffusion layers in which impurities having bipolarity are injected and diffused are formed, and each of the pair of electrode lines spaced apart from the inner surface of the groove and extending below the support plate through the through holes is formed in the pair of diffusion layers. A light emitting element mounting substrate connected to each one;

Provided is a package using a light emitting device mounting substrate including a light emitting device flip-chipd on top of electrode lines of the support plate.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

3A to 3E are cross-sectional views illustrating a manufacturing process of a substrate for mounting a light emitting device according to the present invention. First, an area for forming a groove and a pair of through holes are formed in an upper portion of a support plate 100 having a first polarity. An upper mask layer 110a is formed except for regions to be formed, and a lower mask layer (under the support plate 100 is formed) except for regions corresponding to regions in which a pair of through holes are to be formed on the support plate 100. 110b) (FIG. 3A).

The support plate 100 is preferably a silicon substrate.

Thereafter, the upper and lower mask layers 110a and 110b are masked, and an area to form the groove is etched to form a groove 103 on the support plate 100 and to form a pair of through holes. The regions are etched to form a pair of through holes 101a and 101b penetrating the support plate 100 (FIG. 3B).

Here, the groove 103 performs an anisotropic wet etching process to form the sidewall of the groove 103 to be inclined.

That is, when the sidewall of the groove 103 is inclined, since the reflective surface for reflecting the light emitted from the light emitting device is formed, the amount of light emitted upward from the light emitting device can be increased.

In addition, when the through hole is formed by performing an anisotropic wet etching process on the upper and lower portions of the support plate 100, the upper side and the lower side inside the through hole are inclined, and the center region is formed to protrude.

At this time, if the inner surface of the through hole is inclined, the electrode lines described later are well deposited, and thus the electrode lines can be smoothly formed.

For example, forming the aforementioned groove and the through hole may be simply performed by performing a silicon bulk micromachining process.

Subsequently, a pair of diffusion layers 120a and 120b are implanted into and diffused into the mutually spaced areas below the support plate opposite to the groove 103 to have impurities having a second polarity opposite to the first polarity of the support plate 100. ) (FIG. 3C).

When the first polarity of the support plate 100 is P type, since the second polarity of the diffusion layers 120a and 120b is N type, the support plate 100 and the diffusion layers 120a and 120b may be PN Zener diodes.

Next, a pair of electrode lines 131a and 131b spaced apart from each other on the inner surface of the groove 103 is formed in the upper portion of the support plate 100 and in the upper portion of the pair of through holes 101a and 101b. 3d)

Finally, the pair of penetrations are formed such that each of the pair of electrode lines 131a and 131b formed on the upper side of the pair of through holes 101a and 101b is connected to the pair of diffusion layers 120a and 120b. Electrode lines 132a and 132b are formed on the lower side of the holes 101a and 101b and the lower portion of the support plate 100 (FIG. 3E).

As a result, when a zener diode is connected to each of the electrode lines 132a and 132b to mount the light emitting device, the withstand voltage characteristics may be compensated for.

By the above-mentioned process, manufacture of the board | substrate for light emitting element mounting is completed.

That is, in the light emitting device mounting substrate according to the present invention, grooves 103 are formed in upper portions, and through holes 101a and 101b are formed in each of the regions of the support plate 100 spaced apart from each other around the grooves 103. It is done; A pair of diffusion layers 120a and 120b in which impurities having a second polarity opposite to the first polarity of the support plate 100 are injected and diffused into the mutually spaced areas below the support plate opposite to the groove 103 are formed. Formed; Each of the pair of electrode lines spaced apart from the inner surface of the groove and extending below the support plate 100 through the through holes 101a and 101b is connected to each of the pair of diffusion layers 120a and 120b. .

4 is a cross-sectional view illustrating a bonding member formed on an upper electrode line in order to mount a light emitting device on a support plate according to the present invention, and is located on the inner surface of the groove 103 formed in the support plate 100 of FIG. 3E. Bonding members 141a and 141b are formed on the electrode lines 131a and 131b.

The bonding members 141a and 141b serve to bond the light emitting device to the upper portion of the support plate 100 and to electrically connect the electrode terminals of the light emitting device to the electrode lines of the support plate.

FIG. 5 is a cross-sectional view illustrating a package using the light emitting device mounting substrate of FIG. 4, and bonding members 141a and 141b are formed on the electrode lines 131a and 131b of the support plate 100. The light emitting device 150 is flip chip bonded to 141a and 141b.

Here, the bonding members 141a and 141b are preferably solder.

6 is a cross-sectional view showing a state in which a molding part for protecting a package using a substrate for mounting a light emitting device according to the present invention is formed. In the package with the molding part, a groove 103 is formed on an upper portion thereof, and the groove ( Through holes 101a and 101b are formed in each of the regions of the support plate 100 spaced apart from each other, and the regions of the support plate 100 are spaced apart from each other below the support plate opposite to the grooves 103. A pair of diffusion layers 120a and 120b in which impurities having a second polarity opposite to the first polarity are injected and diffused are formed, and are spaced apart from the inner surface of the groove to support the through plate 101a and 101b. A light emitting device mounting substrate on which a pair of electrode lines extending downwards are connected to each of the pair of diffusion layers 120a and 120b; A light emitting device 150 that is flip-chipd over the electrode lines 131a and 131b of the support plate 100; In order to protect the light emitting device 150 from the outside, it is composed of a molding unit 160 surrounding the upper portion of the support plate (100).

That is, when the light emitting device 150 is bonded to the light emitting device mounting substrate, and the transfer molding process of the light emitting device mounting substrate, the molding unit 160 surrounding the light emitting device 150 is the support plate 100 It is formed on the top.

In this case, when the transfer molding process is performed, a tape is adhered to the lower portion of the support plate 100 to prevent contamination of the insulating material from the electrode line, and then a molding process is performed.

In addition, when the molding unit 160 is formed in a state in which phosphor powder is dispersed in a molding composite resin, the molding unit 160 may switch the wavelength of light emitted from the light emitting device.

For example, if the light emitted from the light emitting device is blue light, and the phosphor powder is a green phosphor and a red phosphor powder, the blue light emitted from the light emitting device enters the green phosphor and the red phosphor dispersed in the molding part, and the green light and The wavelength is converted into red light and is emitted to the outside, and blue light that is not incident on the phosphor is emitted to the outside as it is, so that the white light in which blue light, green light and red light are combined is emitted to the outside.

Therefore, it is possible to implement a light emitting source that emits light of various wavelengths, including a white light source.

Therefore, it is preferable that the phosphor powder is any one or two or more of blue phosphor powder, green phosphor powder, red phosphor powder, and yellow phosphor powder.

As described above, the present invention forms a light emitting device mounting groove and an electrode line drawing-through hole in a support plate, and a zener diode is formed in a serial process to facilitate mounting of the light emitting device and at the same time the withstand voltage of the light emitting device. There is an effect to supplement the characteristics.

In addition, the present invention by forming a molding portion surrounding the light emitting device with a molding compound resin in which the phosphor powder is dispersed, there is an effect that can implement a light emitting source that emits light of various wavelengths, including a white light source.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (14)

Grooves are formed in the upper portion, and through holes are formed in each of the spaced apart support plate regions around the grooves; A pair of diffusion layers in which impurities having a second polarity opposite to the first polarity of the support plate are injected and diffused are formed in the mutually spaced areas below the support plate opposite the grooves; And a pair of electrode lines spaced apart from the inner surface of the groove and extending through the through holes to the lower side of the support plate, respectively, connected to the pair of diffusion layers. The method of claim 1, The support plate, A substrate for mounting a light emitting element, characterized in that the silicon substrate. The method of claim 1, The side wall of the groove, A substrate for mounting a light emitting element, characterized by being inclined. The method of claim 1, The upper side and the lower side of the inside of the through hole is inclined, the light emitting device mounting substrate, characterized in that the central region is formed in a protruding shape. The upper mask layer is formed except for a region for forming a groove and a pair of through holes on the support plate having a first polarity, and corresponds to regions for forming a pair of through holes on the support plate. Forming a lower mask layer under the support plate except regions; Masking the upper and lower mask layers, etching a region to form the groove to form a groove in the upper portion of the support plate, and a pair of through holes penetrating the support plate by etching regions to form a pair of through holes. Forming them; Forming a pair of diffusion layers by injecting and diffusing impurities having a second polarity opposite to the first polarity of the support plate in spaced areas below the support plate opposite to the grooves; Forming a pair of electrode lines spaced apart from each other at an inner surface of the groove on an upper portion of the support plate and an inner portion of the pair of through holes; Forming electrode lines on the lower side of the pair of through holes and on the lower side of the support plate such that each of the pair of electrode lines formed on the upper side of the pair of through holes is connected to the pair of diffusion layers. The manufacturing method of the board | substrate for light emitting element mounting. The method of claim 5, wherein The grooves are formed by inclining sidewalls of the grooves by performing an anisotropic wet etching process. The through-holes are formed by performing anisotropic wet etching on the upper and lower portions of the support plate to form a shape in which the upper and lower surfaces of the through-hole are inclined and protrude from the center region. Method of preparation. Grooves are formed in the upper portion, through-holes are formed in each of the mutually spaced support plate regions around the groove, and in the mutually spaced regions below the support plate opposite to the grooves, a first polarity opposite to the first polarity of the support plate is formed. A pair of diffusion layers in which impurities having bipolarity are injected and diffused are formed, and each of the pair of electrode lines spaced apart from the inner surface of the groove and extending below the support plate through the through holes is formed in the pair of diffusion layers. A light emitting element mounting substrate connected to each one; A package using a light emitting device mounting substrate comprising a light emitting device that is flip-chip over the electrode lines of the support plate. The method of claim 7, wherein A package using a substrate for mounting a light emitting device, characterized in that the molding unit surrounding the upper portion of the support plate is further provided to protect the light emitting device from the outside. The method of claim 8, The molding part, A package using a light emitting device mounting substrate, characterized in that the phosphor powder is dispersed in a molding composite resin. The method of claim 9, The phosphor powder, A package using a light emitting device mounting substrate, characterized in that any one or two or more of blue phosphor powder, green phosphor powder, red phosphor powder and yellow phosphor powder. The method of claim 7, wherein The light emitting device is a package using a light emitting device mounting substrate, characterized in that the flip chip bonding on the solder formed on each of the electrode lines. The method according to any one of claims 7 to 11, The support plate, A package using a substrate for mounting a light emitting element, characterized in that the silicon substrate. The method according to any one of claims 7 to 11, The side wall of the groove, The package using the board | substrate for light emitting element mounting characterized by the inclination. The method according to any one of claims 7 to 11, The upper side and the lower side of the inside of the through-hole is inclined, the package using a substrate for mounting a light emitting element, characterized in that the central region is formed in a protruding shape.

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