KR100667504B1 - Light emitting device package and method for fabricating the same - Google Patents

Abstract

The present invention relates to a package of a light emitting device and a method of manufacturing the same, and by implementing a lens using a filler used to improve luminous efficiency can reduce the number of parts, improve the work yield, can reduce the manufacturing cost And, there is an effect that can reduce the thickness of the package.

In addition, since the light of the light emitting device emits to the outside through only the filler, the path of the light emitted from the light emitting device is reduced, thereby improving the luminous efficiency.

Light emitting element, filler, lens, processing

Description

Light emitting device package and method for manufacturing the same

1 is a cross-sectional view of a typical light emitting diode

2A to 2G are cross-sectional views illustrating a manufacturing process of a light emitting device package with a lens according to the related art.

3A and 3B are cross-sectional views illustrating a package manufacturing process of a light emitting device according to a first embodiment of the present invention.

4 is a schematic cross-sectional view illustrating a state in which a plurality of light emitting devices are bonded in a package structure according to a first embodiment of the present invention.

5A through 5D are cross-sectional views illustrating a package manufacturing process of a light emitting device according to a second embodiment of the present invention.

FIG. 6 is a cross-sectional view of a state in which individual light emitting device packages are separated in a subsequent process of FIG. 5D; FIG.

7 is a cross-sectional view of a light emitting device package according to a third embodiment of the present invention.

8A and 8B are photographs showing a state in which a lens shape is processed in a filler of a light emitting device package according to the present invention;

9 is a schematic perspective view showing a state in which a plurality of lenses are formed in the filler of the light emitting device package according to the present invention;

<Description of the symbols for the main parts of the drawings>

100,200: Submount Board

110,110a, 110b, 110c, 110d, 110e, 110f, 201,202,203,204: home

120: reflective film 121: insulating film

130a, 130b, 221a, 221b, 410a, 410b: electrode line

141a, 141b: solder 150, 230, 600: light emitting device

160,250,700,910: Filler 161,251,710: Lens shape

211,212,213,510: Through hole 241a, 241b: Bonding means

300,800 light emitting device package 400,500 structure

900 substrate 911 lens

911a: concave lens shape 911b: convex lens shape

The present invention relates to a package of a light emitting device and a method of manufacturing the same, and more particularly, by implementing a lens using a filler used to improve the luminous efficiency can reduce the number of parts, improve the work yield, and manufacture The present invention relates to a package of a light emitting device and a method of manufacturing the same, which can reduce cost and reduce the path of light emitted from the light emitting device because light of the light emitting device emits light to the outside through only the filler.

In general, a light emitting diode is a white light emitting diode lighting device that can replace a light emitting diode backlight, a fluorescent lamp or an incandescent lamp, which replaces a Cold Cathode Fluorescence Lamp (CCFL) constituting a backlight of a liquid crystal display (LCD) display. And the application is expanding to traffic lights.

On the other hand, in addition to the light emitting diodes driven by the direct current power source, a high voltage AC light emitting diode chip that operates in a general AC power source has also been developed. For this purpose, in order to apply a light emitting device, a high operating voltage and a low driving current at the same power are required. Efficiency and brightness should be high.

1 is a cross-sectional view of a general light emitting diode, in which an n-semiconductor layer 11, an active layer 12 and a p-semiconductor layer 13 are sequentially stacked on a sapphire or n-GaAs substrate 10; Mesa is etched from the p-semiconductor layer (13) to a part of the n-semiconductor layer (11); A transparent electrode 14 is formed on the p-semiconductor layer 13; An n-electrode 15 is formed on the mesa-etched n-semiconductor layer 11; The p-electrode 16 is formed on the transparent electrode 14.

In the light emitting diode, when voltage is applied between the p-electrode 16 and the n-electrode 15 in an external circuit, holes and electrons are injected into the p-electrode 16 and the n-electrode 15, and the active layer In (12), when the holes and the electrons recombine, extra energy is converted into light and emitted to the outside through the transparent electrode and the substrate.

After the plurality of light emitting diodes are manufactured on a substrate, the light emitting diodes are separated into individual chips, and the separated individual chip type light emitting diodes are bonded to a silicon or ceramic sub-mount substrate, packaged, or mounted on another package.

2A to 2G are cross-sectional views illustrating a manufacturing process of a light emitting device package with a lens according to the related art. First, as shown in FIG. 2A, a groove 21 is formed on the sub-mount substrate 20. .

After that, an insulating film 30 is formed on the upper surface of the sub-mount substrate 20 and the inner surface of the groove (FIG. 2B), and extends from the upper portion of the sub-mount substrate 20 to the inner surface of the groove 21 and separated from each other. A pair of electrode lines 41a and 41b are formed (FIG. 2C).

Subsequently, solders 51a and 51b are formed on each of the pair of electrode lines 41a and 41b (FIG. 2D).

Next, flip chip bonding is performed on the light emitting diodes 60 on the solders 51a and 51b (FIG. 2E).

Here, by the flip chip bonding, the solders 51a and 51b and the electrodes of the light emitting diode 60 are electrically connected.

Subsequently, a filler 70 surrounding the light emitting diode 60 is applied to the groove 21 (FIG. 2F).

In this case, the filler 70 has a refractive index in order to protect the light emitting diode 60 from the external environment, and to extract light emitted from the light emitting diode having excellent light transmittance and not coming out by the total reflection to increase the light emitting efficiency. To match.

In addition, the filler 70 may be used by dispersing the phosphor to make a white light source or to convert the emission wavelength.

Finally, the lens 80 is attached to the filler 70 in order to change the light pattern of the light emitting diode 60 (FIG. 2G).

Therefore, in the LED package according to the related art described above, since the lenses are manufactured separately and the lenses are attached to the package, the manufacturing process is complicated and manufacturing costs are high.

In addition, since the light emitted from the light emitting diode is emitted to the outside through the filler and the lens, the light emitting efficiency is lowered, and the thickness of the light emitting diode package is increased by the height of the attached lens.

In order to solve the problems described above, the present invention can implement a lens by using a filler used to improve luminous efficiency, thereby reducing the number of parts, improving work yield, and reducing manufacturing costs. An object of the present invention is to provide a package of a light emitting device capable of reducing the thickness of the package and a method of manufacturing the same.

Another object of the present invention is to provide a package of a light emitting device and a method for manufacturing the light emitting device which can improve the light emitting efficiency by reducing the path of light emitted from the light emitting device because the light of the light emitting device emits to the outside through only the filler.

A first preferred aspect for achieving the above objects of the present invention is

A light emitting element for emitting light;

A structure for packaging the upper portion of the light emitting device;

A filler applied to surround the light emitting device exposed to the package;

Provided is a package of a light emitting device comprising a lens formed by processing the filler so as to focus or divert the light emitted from the light emitting device.

A second preferred aspect for achieving the above objects of the present invention is

A substrate on which a plurality of light emitting elements are mounted;

A filler coated on the substrate and surrounding the plurality of light emitting devices;

Provided is a package of a light emitting device comprising a lens formed by processing a filler region positioned above each of the plurality of light emitting devices.

A third preferred aspect for achieving the above objects of the present invention is

A sub-mount substrate having a plurality of grooves spaced apart from each other and a through hole formed between each of the grooves;

Electrode lines extending from the inner surface of the groove to the lower portion of the sub-mount substrate through the through holes and spaced apart from each other;

A plurality of light emitting devices flip-chip bonded to electrode lines existing in the respective grooves;

A plurality of light emitting devices bonded to each of the grooves and formed on the sub-mount substrate so as to have a predetermined thickness (t) from an upper surface of the sub-mount substrate, and formed on top of each of the light emitting devices bonded to each of the grooves. Provided is a package of light emitting devices comprising a filler in which a region is processed into a lens shape.

A fourth preferred aspect for achieving the above objects of the present invention is

A first structure surrounding a side and a lower part of the upper part and having a pair of electrode lines spaced apart from each other;

A second structure having a through hole formed in a central region, the second structure being exposed on the first structure to expose a portion of the pair of electrode lines into the through hole;

A light emitting device inserted into the through hole and flip-chip bonded to the exposed pair of electrode lines;

A package of a light emitting device is provided which is formed on the second structure so as to surround the light emitting device inside the through hole, and includes a filler having an upper region of the light emitting device processed into a lens shape.

A fifth preferred aspect for achieving the above objects of the present invention is

Sequentially forming a reflective film and an insulating film on an upper surface of the sub-mount substrate and an inner surface of the groove having a groove formed thereon;

Forming a pair of electrode lines extending from an upper portion of the sub-mount substrate to an inner surface of a groove and separated from each other;

Flip chip bonding a light emitting device on the pair of electrode lines;

Provided is a method of manufacturing a package of a light emitting device, comprising the step of applying a filler inside the groove to surround the light emitting device, and processing the filler into a lens shape.

The sixth preferred aspect for achieving the above objects of the present invention is

Forming a plurality of grooves spaced apart from each other on the sub-mount substrate, and forming a through hole between each of the grooves;

Forming a pair of electrode lines in each of the grooves extending from the inner surface of the groove to a lower portion of the sub-mount substrate through the through holes and spaced apart from each other;

Flip chip bonding a light emitting device to a pair of electrode lines existing in each of the grooves;

Wrapping a light emitting device bonded to each of the grooves, and applying a filler to the upper portion of the submount substrate so as to have a predetermined thickness t from the upper surface of the submount substrate;

Provided is a method of manufacturing a package of a light emitting device, comprising the step of processing a filler in an upper region of each light emitting device bonded to each of the grooves into a lens shape.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

The present invention is to bond the light emitting device to the mounting portion of the sub-mount substrate, to surround the light emitting device with a filler, and to process the filler into a lens shape.

Here, the mounting portion is preferably a groove formed in the upper portion of the sub-mount substrate.

3A and 3B are cross-sectional views illustrating a package manufacturing process of a light emitting device according to a first embodiment of the present invention. A submount substrate 100 having a groove 110 formed thereon is prepared and the submount substrate ( 100 is a pair of electrode lines formed on the upper surface and the inner surface of the groove in order to form a reflective film 120 and the insulating film 121, and extends from the upper portion of the sub-mount substrate 110 to the inner surface of the groove 110 and separated from each other Fields 130a and 130b, and solders 141a and 141b are formed on the pair of electrode lines 130a and 130b, and light emitting devices 150 are disposed on the solders 141a and 141b. Is flip chip bonded (FIG. 3A).

Here, the solders 141a and 141b bond the light emitting device 150 to the sub-mount substrate 100 by flip chip bonding, and the electrode terminals of the light emitting device 150 are electrode lines 130a and 130b. Corresponds to the bonding means for electrically connecting with.

Thereafter, the filler 160 is applied to the inside of the groove 110 to surround the light emitting device 150, and the filler 160 is processed into a lens shape 161 (FIG. 3B).

Here, it is preferable that the filler 160 is dispersed with a phosphor for converting light wavelengths in order to make a white light source or to convert the emission wavelength.

In addition, the filler 160 may be formed of a photosensitive epoxy to freely photo-etch and remove portions other than the region where the filler 160 is present.

4 is a schematic cross-sectional view illustrating a state in which a plurality of light emitting devices are bonded in the package structure according to the first embodiment of the present invention, and the plurality of grooves 110a and 110b are spaced apart from each other on the sub-mount substrate 100. And 110c, 110d, 110e, and 110f, and an insulating film 121 is formed on the sub-mount substrate 100 including the inner surfaces of the plurality of grooves 110a, 110b, 110c, 110d, 110e, and 110f. The plurality of grooves 110a, 110b, 110c, 110d and 110e extend a pair of electrode lines 130a and 130b extending from the upper portion of the sub-mount substrate 110 to the inner surface of the groove 110 and separated from each other. 110f) and solders 141a and 141b are formed on the pair of electrode lines 130a and 130b formed in the plurality of grooves 110a, 110b, 110c, 110d, 110e and 110f, respectively. The light emitting device 150 is flip-chip bonded to the solders 141a and 141b.

Here, the light emitting device 150 is wrapped, and the filler 160 is coated to form a lens shape 161 thereon.

As such, the package structure in which the plurality of light emitting elements are arranged may be used as a light source of the backlight unit of the display, and in particular, may be used in the display backlight unit of the mobile communication terminal.

Therefore, the light emitting device package of the present invention does not require a process of preparing an additional lens and attaching the lens, and even in a package in which a plurality of light emitting diodes are arranged, a lens shape may be formed in the filler by a single process. It is possible to improve work yield, reduce manufacturing costs, and improve light emission efficiency because light of the light emitting device is emitted to the outside through only the filler.

5A to 5D are cross-sectional views illustrating a package manufacturing process of a light emitting device according to a second exemplary embodiment of the present invention, and form a plurality of grooves 201, 202, 203, and 204 spaced apart from each other on the sub-mount substrate 200. Through holes 211, 212, 213 are formed between each of the grooves 201, 202, 203, and 204, and a pair of electrode lines 221a and 221b extend from the inner surface of the groove to the lower portion of the sub-mount substrate 200 and are spaced apart from each other. ) Is formed in each of the grooves (FIG. 5A).

The through holes 211, 212, and 213 may smoothly form electrode lines 221a and 221b connected to the upper and lower portions of the sub-mount substrate 200.

Thereafter, the light emitting device 230 is flip-chip bonded to the pair of electrode lines 221a and 221b existing in the respective grooves 201, 202, 203 and 204 (FIG. 5B).

Here, the electrode terminals of the light emitting device 230 are flip chip bonded by the bonding means 241a and 241b as shown in FIG. 5B, and are electrically connected to the pair of electrode lines 221a and 221b.

Subsequently, the light emitting devices bonded to the respective grooves are wrapped, and the filler 250 is applied on the submount substrate 200 to have a predetermined thickness t from the upper surface of the submount substrate 200. )

 Finally, the filler 250 in the upper region of each of the light emitting elements bonded to the respective grooves is processed into a lens shape 251 (FIG. 5D).

That is, in the package of the light emitting device according to the second embodiment of the present invention, a plurality of grooves 201, 202, 203, 204 are spaced apart from each other, and through holes 211, 212, 213 are formed between each of the grooves 201, 202, 203, 204. A submount substrate 200; Electrode lines 221a and 221b extending from the inner surface of the groove to the lower portion of the sub-mount substrate 200 through the through holes and spaced apart from each other; A plurality of light emitting devices 230 flip-chip bonded to electrode lines 221a and 221b in the respective grooves 201, 202, 203 and 204; The plurality of light emitting devices 230 bonded to each of the grooves are wrapped and formed on the sub-mount substrate 200 so as to have a predetermined thickness t from the upper surface of the sub-mount substrate 200. An upper region of each of the light emitting devices bonded to the light emitting device includes a filler 250 that is processed into a lens shape 251.

FIG. 6 is a cross-sectional view of the light emitting device package divided into individual light emitting device packages in a subsequent process of FIG. 5D, and the sub-mount substrate 200 and the filler 250 are cut to separate each light emitting device from the package of FIG. 5D. Further performing the process, the individual light emitting device package 300 is manufactured.

FIG. 7 is a cross-sectional view of a light emitting device package according to a third embodiment of the present invention. The light emitting device package 800 includes a pair of electrode lines 410a and 410b that surround side and bottom portions thereof and are spaced apart from each other. The first structure 400 and; The second structure is formed in the central region, the second structure is bonded to the upper portion of the first structure 400 by exposing a portion of the pair of electrode lines (410a, 410b) into the through hole 510 500; A light emitting device 600 inserted into the through hole 510 and flip-chip bonded to the exposed pair of electrode lines 410a and 410b; The filler 700 is formed on the second structure 500 so as to surround the light emitting device 600 in the through hole 510, and the upper region of the light emitting device 600 is processed into a lens shape 710. It is configured to include).

Here, the first and second structures 400 and 500 are preferably made of a ceramic material, and moreover, the first and second structures 400 and 500 may be made of a material having excellent thermal conductivity and excellent insulation.

That is, a material such as AlN or alumina is used.

8A and 8B are photographs showing a state in which the lens shape is processed in the filler of the light emitting device package according to the present invention. As shown in FIG. 8A, a plurality of lens shapes 251 are processed on the filler 250. have.

8B is a side view of one lens shape, and it can be seen that the lens shape 251 is well processed.

The lens shape 251 may be processed in various ways. For example, the lens shape 251 may be formed using a conventional dicing braid.

9 is a schematic perspective view illustrating a state in which a plurality of lenses are formed in a filler of a light emitting device package according to the present invention, and a substrate 900 on which a plurality of light emitting devices are mounted; A filler 910 surrounding the plurality of light emitting devices and coated on the substrate 900; An area of the filler 910 positioned on each of the plurality of light emitting devices is formed by a lens 911 formed by processing.

That is, the lens 911 is formed by processing the upper portion of the filler 910 to be arranged in a micro lens shape.

As described above, the present invention processes the filler applied to the light emitting device to make the lens simple.

Here, the present invention can also be applied to a structure for packaging a single light emitting device of the present invention, the package structure comprising: a light emitting device for emitting light; A structure enclosing the light emitting device and surrounding the light emitting device; A filler applied to surround a portion of the light emitting device exposed to the structure; The filler may be formed of a lens formed by processing the light so as to focus or divert the light emitted from the light emitting device.

10A and 10B are conceptual views illustrating a lens shape formed in a filler of a light emitting device package according to the present invention. The lens shape may be a concave lens shape 911a as shown in FIG. 10A, or a convex lens shape 911b as shown in FIG. 10B. )

Here, the lens shape is to change the pattern of the light of the light emitting device to which the filler is applied, and thus the lens shape is optically aligned with the light of the light emitting device.

That is, the shape formed only by natural coating cannot change the pattern of light emitted from the light emitting device.

As described above, the present invention not only processes the filler in the form of a lens, but also can manufacture a package of various structures in a batch process, and thus, there is an advantage in that mass production is possible while increasing the work yield.

As described above, the present invention can implement a lens by using a material used as a filler used to improve the luminous efficiency can reduce the number of parts, improve the work yield, reduce the manufacturing cost, This can reduce the thickness of the package.

In addition, since the light of the light emitting device emits to the outside through only the filler, the path of the light emitted from the light emitting device is reduced, thereby improving the luminous efficiency.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (13)

A light emitting element for emitting light; A structure enclosing the light emitting device and surrounding the light emitting device; A filler applied to surround a portion of the light emitting device exposed to the structure; And a lens formed by processing the filler to condense or diverge the light emitted from the light emitting device. A substrate on which a plurality of light emitting elements are mounted; A filler coated on the substrate and surrounding the plurality of light emitting devices; And a lens formed by processing a filler region positioned on each of the plurality of light emitting devices. The method of claim 2, The substrate, A pair of electrode lines are formed on the upper portion and spaced apart from each other, an insulating film is formed on the upper surface including the inner surface of the plurality of grooves, extending from the upper to the inner surface of the groove and separated from each other Is formed in each of the plurality of grooves, and the light emitting device is a substrate in which a light emitting element is flip-chip bonded and mounted on a pair of electrode lines formed in each of the plurality of grooves. Package. A sub-mount substrate having a plurality of grooves spaced apart from each other and a through hole formed between each of the grooves; Electrode lines extending from the inner surface of the groove to the lower portion of the sub-mount substrate through the through holes and spaced apart from each other; A plurality of light emitting devices flip-chip bonded to electrode lines existing in the respective grooves; Including a filler is formed on the sub-mount substrate to cover the plurality of light emitting elements bonded to each of the grooves, the upper region of each of the light emitting elements bonded to each of the grooves are processed into a lens shape Package of configured light emitting device. A first structure surrounding a side and a lower part of the upper part and having a pair of electrode lines spaced apart from each other; A second structure having a through hole formed in a central region, the second structure being exposed on the first structure to expose a portion of the pair of electrode lines into the through hole; A light emitting device inserted into the through hole and flip-chip bonded to the exposed pair of electrode lines; The package of the light emitting device is formed by coating the upper portion of the second structure so as to surround the light emitting device inside the through hole, the filler comprises a filler is processed in the upper region of the light emitting device. The method of claim 5, The first and second structures, A package of light emitting devices, characterized in that made of ceramic material. The method according to any one of claims 1 to 6, The lens shape is, A package for a light emitting element, characterized in that it is concave or convex. The method according to any one of claims 1 to 6, In the filler, A package for a light emitting device, wherein a phosphor for converting light wavelengths is dispersed. Sequentially forming a reflective film and an insulating film on an upper surface of the sub-mount substrate and an inner surface of the groove having a groove formed thereon; Forming a pair of electrode lines extending from an upper portion of the sub-mount substrate to an inner surface of a groove and separated from each other; Flip chip bonding a light emitting device on the pair of electrode lines; And applying a filler to the inside of the groove so as to surround the light emitting device, and processing the filler into a lens shape. Forming a plurality of grooves spaced apart from each other on the sub-mount substrate, and forming a through hole between each of the grooves; Forming a pair of electrode lines in each of the grooves extending from the inner surface of the groove to a lower portion of the sub-mount substrate through the through holes and spaced apart from each other; Flip chip bonding a light emitting device to a pair of electrode lines existing in each of the grooves; Wrapping a light emitting device bonded to each of the grooves and applying a filler on the sub-mount substrate; And processing a filler in an upper region of each light emitting device bonded to each of the grooves into a lens shape. The method according to claim 9 or 10, The lens shape is, A package manufacturing method of a light emitting element, characterized by a concave lens or a convex lens shape. The method according to claim 9 or 10, In the filler, The light-emitting device package manufacturing method characterized by dispersing the optical wavelength conversion phosphor. The method of claim 9, The filler, Method of manufacturing a package of a light emitting device, characterized in that formed with a photosensitive epoxy so as to be freely photo-etched and removed outside the region in which the filler is present.

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