JP2019021919A - Light emitting device package - Google Patents

Abstract

To provide a semiconductor device package improving the light extraction efficiency and electrical characteristics and improving the process efficiency.SOLUTION: An embodiment includes: a body 110 including first and second openings TH1, TH2 passing through upper and lower surfaces of the body; a light emitting device 120 disposed on the body and including first and second bonding parts; and first and second conductive layers 321, 322 disposed under the body and electrically connected to the first and second bonding parts, respectively. The first and second bonding parts may include respective protrusion portions protruding and extending downward within the first and second openings.SELECTED DRAWING: Figure 3

Description

  Embodiments relate to a semiconductor element package, a method for manufacturing the semiconductor element package, and a light source device.

  Semiconductor devices including compounds such as GaN and AlGaN have various advantages such as wide and easily adjustable band gap energy, and thus are widely used in light emitting devices, light receiving devices, various diodes, and the like.

  In particular, light emitting devices such as light emitting diodes and laser diodes using III-V or II-VI compound semiconductor materials are red due to the development of thin film growth technology and device materials. There is an advantage that light of various wavelength bands such as green, blue and ultraviolet can be realized. In addition, light-emitting elements such as light-emitting diodes and laser diodes that use Group III-V or Group II-VI group compound semiconductor materials use fluorescent materials or combine colors to create an efficient white light source. It can be implemented. Such a light emitting element has advantages of low power consumption, semi-permanent lifetime, fast response speed, safety, and environmental friendliness as compared with existing light sources such as fluorescent lamps and incandescent lamps.

  Furthermore, when light-receiving elements such as photodetectors and solar cells are manufactured using Group III-V or Group II-VI compound semiconductor materials, light in various wavelength regions is absorbed by the development of element materials. By generating photocurrent, light in various wavelength regions from gamma rays to radio wavelength regions can be used. Also, such light receiving elements have advantages such as fast response speed, safety, environmental compatibility and easy adjustment of element materials, so that they can be easily used for power control or ultra high frequency circuits and communication modules. Can do.

  Therefore, the semiconductor element is a light emitting diode backlight, a fluorescent lamp or an incandescent lamp that can replace the CCFL (Cold Cathode Fluorescence Lamp) constituting the transmission module of the optical communication means, the backlight of the LCD (Liquid Crystal Display) display device. Applications are spreading to white light-emitting diode illuminators that can replace light bulbs, automobile headlights and signal lights, and sensors that detect gas and fire. In addition, applications of semiconductor elements are being expanded to high-frequency application circuits, other power control devices, and communication modules.

  Light Emitting Device is provided as a pn junction diode with the characteristic that electrical energy is converted into light energy using Group III-V element or Group II-VI element on the periodic table, for example In addition, various wavelengths can be realized by adjusting the composition ratio of the compound semiconductor.

  For example, nitride semiconductors have attracted a great deal of attention in the field of development of optical devices and high-power electronic devices due to their high thermal stability and wide band gap energy. In particular, a blue light emitting element, a green light emitting element, an ultraviolet (UV) light emitting element, a red (RED) light emitting element and the like using a nitride semiconductor are commercially used and widely used.

  For example, in the case of an ultraviolet light emitting element, as a light emitting diode that generates light distributed in a wavelength band of 200 nm to 400 nm, in the wavelength band, in the case of a short wavelength, it is used for sterilization, purification, etc. Used in an exposure apparatus or a curing apparatus.

  Ultraviolet rays are classified into three types, UV-A (315 nm to 400 nm), UV-B (280 nm to 315 nm), and UV-C (200 nm to 280 nm) in order of increasing wavelength. The UV-A (315 nm to 400 nm) region is applied to various fields such as industrial UV curing, printing ink curing, exposure equipment, counterfeit identification, photocatalytic sterilization, special lighting (aquarium / agricultural use, etc.). The B (280 nm to 315 nm) region is used for medical purposes, and the UV-C (200 nm to 280 nm) region is applied to air purification, water purification, sterilization products, and the like.

  On the other hand, there is a demand for semiconductor elements that can provide high output, and research is being conducted on semiconductor elements that can increase output by applying a high power source.

  In addition, in a semiconductor device package, research has been conducted on a method capable of improving the light extraction efficiency of the semiconductor device and improving the luminous intensity at the package end. In addition, in a semiconductor device package, research has been conducted on a method capable of improving the bonding force between the package electrode and the semiconductor device.

  In semiconductor device packages, research has been conducted on methods that can reduce manufacturing costs and improve manufacturing yields by improving process efficiency and changing the structure.

  An object of the embodiment is to provide a semiconductor device package, a method of manufacturing the semiconductor device package, and a light source device capable of improving light extraction efficiency and electrical characteristics.

  Embodiments also provide a semiconductor device package, a manufacturing method of the semiconductor device package, and a light source device that can improve the process efficiency, present a new package structure, reduce the manufacturing cost, and improve the manufacturing yield. With the goal.

  In addition, the embodiment provides a semiconductor device package and a semiconductor device package that can prevent a re-melting phenomenon from occurring in a bonding region of the semiconductor device package during the process of re-bonding the semiconductor device package to a substrate or the like. An object is to provide a manufacturing method.

  A light emitting device package according to an embodiment includes a main body including first and second openings penetrating an upper surface and a lower surface, a light emitting device disposed on the main body and including first and second bonding portions, and the main body. And first and second conductive layers electrically connected to the first and second bonding parts, respectively, and the first and second bonding parts include the first and second openings. Each of the protrusions may extend in a lower direction from the inside of the portion and protrude.

  The light emitting device package according to the embodiment may further include a resin disposed between the main body and the light emitting device.

  According to an embodiment, the protrusions of the first and second bonding portions are disposed in the first and second openings, respectively.

  According to an embodiment, the lower surface of the protruding portion of the first bonding portion is disposed lower than the upper surface of the first opening.

  According to an embodiment, the protrusion of the first bonding part is provided in a columnar shape or a polygonal column shape.

  According to an embodiment, the shapes of the first and second bonding portions are provided corresponding to the shapes of the upper regions of the first and second openings.

  According to an embodiment, the first conductive layer and the second conductive layer are spaced apart from each other on the lower surface of the main body.

  According to an embodiment, the width of the protrusion of the first and second bonding portions is provided smaller than the width of the upper region of the first and second openings.

  According to an embodiment, the first region on the top surface of the first conductive layer is disposed under the first opening, and the second region on the top surface of the first conductive layer is below the bottom surface of the body. Placed in.

  According to an embodiment, the first region of the upper surface of the first conductive layer is disposed so as to overlap with the first opening.

  According to an embodiment, the second region of the upper surface of the first conductive layer is disposed so as to overlap with the lower surface of the main body in the vertical direction.

  According to an embodiment, a partial region of the first conductive layer is disposed around the protruding portion of the first bonding portion.

  According to an embodiment, the first and second bonding parts include Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Ag alloy, Au, Hf. , Pt, Ru, Rh, Sn, Cu, ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, Ni / IrOx / Au / ITO, or an alloy thereof Can be included.

  According to an embodiment, the first and second conductive layers include at least one substance selected from the group including Ag, Au, Pt, Sn, Cu, and SAC (Sn—Ag—Cu) or an alloy thereof. be able to.

  According to an embodiment, the resin may include white silicone.

  According to an embodiment, the resin is provided in direct contact with the upper surface of the main body and the lower surface of the light emitting device.

  According to an embodiment, the resin is provided around the first and second bonding parts.

  According to an embodiment, the main body further includes a recess provided to be recessed from the upper surface of the main body toward the lower surface, and the resin is provided to the recess.

  According to an embodiment, the side surface of the main body and the side surface of the first conductive layer are provided on the same plane.

  According to an embodiment, the upper surface of the body is provided in a flat shape in the entire area.

  A light emitting device package according to an embodiment includes a main body including first and second openings penetrating an upper surface and a lower surface, a light emitting device disposed on the main body, and an adhesive including a reflective material, The main body includes a first recess disposed between the first opening and the second opening, the adhesive is disposed in the first recess, and the light emitting element includes the first opening. A first electrode disposed on the second opening, a second electrode disposed on the second opening, a first semiconductor layer electrically connected to the first electrode, and the second electrode electrically A semiconductor structure including a second semiconductor layer coupled to the semiconductor layer, an active layer disposed between the first and second semiconductor layers, and a substrate disposed on the semiconductor structure, One electrode includes a first bonding portion that overlaps the first opening in the first direction and the first bond Including a first branch electrode extending from the first portion, the second electrode including a second bonding portion overlapping the second opening in the first direction, and the first direction extending from the lower surface of the body. The sum of the areas of the first and second bonding portions is 10% or less based on the upper surface area of the substrate.

  According to an embodiment, the area where the adhesive overlaps with the light emitting device based on the first direction is larger than the area where the first and second openings overlap with the first and second bonding portions. Is done.

  According to an embodiment, the adhesive is disposed in direct contact with the upper surface of the main body and the lower surface of the light emitting device.

  A light emitting device package according to an embodiment is provided in the first opening, and is provided in the second opening, the first conductive layer disposed in direct contact with the lower surface of the first bonding portion, and the first opening. And a second conductive layer disposed in direct contact with the lower surface of the bonding part.

  The first conductive layer may include a first upper conductive layer provided in an upper region of the first opening and a first lower conductive layer provided in a lower region of the first opening. The first upper conductive layer and the first lower conductive layer may include different materials.

  The light emitting device package according to the embodiment is provided on the upper surface of the main body, and is provided on the upper surface of the main body and spaced apart from the second opening. And a second upper recess arranged in the same manner.

  The light emitting device package according to the embodiment includes a first resin portion provided to the first upper recess and a second resin portion provided to the second upper recess, and the first resin portion and the second resin portion. Can include white silicone.

  The light emitting device package according to the embodiment is provided on a lower surface of the main body, and is provided on a lower surface of the main body and spaced apart from the second opening. And a second lower recess disposed in the same manner.

  The light emitting device package according to the embodiment includes a first resin portion provided to the first lower recess and a second resin portion provided to the second lower recess, and the first resin portion and the second resin portion. May include the same material as the body.

  A light emitting device package according to an embodiment includes a main body including first and second openings penetrating an upper surface and a lower surface, and a first recess disposed between the first and second openings, and the first recess. An adhesive disposed on the adhesive, a light emitting element disposed on the adhesive, and first and second conductors disposed between the main body and the light emitting element, the light emitting element The first conductive semiconductor electrically connected to the first electrode disposed on the first opening, the second electrode disposed on the second opening, and the first electrode. A semiconductor structure including a layer, a second conductive semiconductor layer electrically connected to the second electrode, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer And a substrate disposed on the semiconductor structure, wherein the first conductor is in front of the first electrode. Is disposed to the inside of the first opening, the second conductor is disposed from the second electrode to the inside of the second opening.

  According to an embodiment, the first electrode includes a first bonding portion that overlaps the first opening in a first direction and a first branch electrode that extends from the first bonding portion, and the second electrode includes: A second bonding portion that overlaps the second opening in the first direction, wherein the first direction is a direction from a lower surface of the main body toward an upper surface of the main body, and the first and second bonding portions The sum of the areas is provided to 10% or less based on the upper surface area of the substrate.

  A light emitting device package according to an embodiment includes a main body including first and second openings penetrating an upper surface and a lower surface, a light emitting device disposed on the main body and including a first electrode and a second electrode, and the main body. And an adhesive including a reflective material, a first conductor disposed in the first opening of the main body and electrically connected to the first electrode of the light emitting element; A second conductor disposed in the second opening of the main body and electrically connected to the second electrode of the light emitting element; and disposed in the first opening and electrically connected to the first conductor. A first conductive layer connected to the second opening, and a second conductive layer disposed in the second opening and electrically connected to the second conductor. The light emitting device includes: a substrate; The first semiconductor layer, the second semiconductor layer, and the first and second semiconductor layers disposed on the upper surface. An active layer, disposed on the first semiconductor layer, the first electrode including a first pad electrode and a first branch electrode extending from the first pad electrode, and disposed on the second semiconductor layer And the second electrode including a second pad electrode, the body includes a first recess disposed between the first opening and the second opening, and the adhesive includes the The first opening is disposed in a first recess, and the first opening overlaps the first pad electrode with respect to a first direction from the lower surface of the main body toward the upper surface of the main body, and the second opening is in the first direction. The first conductive layer is disposed in direct contact with the lower surface and the side surface of the first conductor, and the second conductive layer includes the lower surface of the second conductor and the second pad electrode. It is placed in direct contact with the side.

  According to an embodiment, the sum of the areas of the first and second pad electrodes is provided to 10% or less based on the upper surface area of the substrate.

  According to an embodiment, the area where the adhesive overlaps with the light emitting element based on the first direction is larger than the area of the area where the first and second openings and the first and second pad electrodes overlap. Is done.

  A light emitting device package according to an embodiment is provided in the first opening, provided in a first conductive layer disposed in direct contact with a side surface and a lower surface of the first bonding unit, and provided in the second opening. And a second conductive layer disposed in direct contact with a side surface and a lower surface of the second bonding part.

  The first conductive layer may include a first upper conductive layer provided in an upper region of the first opening and a first lower conductive layer provided in a lower region of the first opening. The first upper conductive layer and the first lower conductive layer may include different materials.

  According to the semiconductor device package and the manufacturing method of the semiconductor device package according to the embodiment, there is an advantage that the light extraction efficiency, the electrical characteristics, and the reliability can be improved.

  According to the semiconductor device package and the method for manufacturing the semiconductor device package according to the embodiment, there is an advantage that the process efficiency is improved and a new package structure is presented to reduce the manufacturing cost and improve the manufacturing yield.

  The semiconductor device package according to the embodiment provides a main body having a high reflectivity, so that the reflector can be prevented from being discolored, and there is an advantage that the reliability of the semiconductor device package can be improved.

  According to the semiconductor device package and the semiconductor device manufacturing method according to the embodiment, a re-melting phenomenon occurs in the bonding region of the semiconductor device package in the process of re-bonding the semiconductor device package to the substrate or the like. There is an advantage that can be prevented.

1 is a plan view of a light emitting device package according to an embodiment of the present invention. FIG. 2 is a bottom view of the light emitting device package shown in FIG. 1. FIG. 2 is a cross-sectional view of the light emitting device package shown in FIG. 1 taken along the line DD. 3 is a view illustrating a method for manufacturing a light emitting device package according to an embodiment of the present invention. 3 is a view illustrating a method for manufacturing a light emitting device package according to an embodiment of the present invention. 3 is a view illustrating a method for manufacturing a light emitting device package according to an embodiment of the present invention. 3 is a view illustrating a method for manufacturing a light emitting device package according to an embodiment of the present invention. 3 is a view illustrating a method for manufacturing a light emitting device package according to an embodiment of the present invention. 4 is a diagram illustrating a modification of the main body applied to the light emitting device package shown in FIG. 3. 4 is a diagram illustrating a modification of the main body applied to the light emitting device package shown in FIG. 3. 4 is a diagram illustrating a modification of the main body applied to the light emitting device package shown in FIG. 3. 4 is a diagram illustrating another modification of the main body applied to the light emitting device package shown in FIG. 3. 4 is a diagram illustrating another modification of the main body applied to the light emitting device package shown in FIG. 3. 4 is a diagram illustrating another modification of the main body applied to the light emitting device package shown in FIG. 3. 6 is a view for explaining still another modification of the main body applied to the light emitting device package shown in FIG. 3. 6 is a view for explaining still another modification of the main body applied to the light emitting device package shown in FIG. 3. 6 is a view for explaining still another modification of the main body applied to the light emitting device package shown in FIG. 3. 6 is a view showing another example of a light emitting device package according to an embodiment of the present invention. FIG. 19 is a diagram illustrating a positional relationship between a first frame, a second frame, and a main body applied to the light emitting device package shown in FIG. 18. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a diagram illustrating a modification of an opening applied to a light emitting device package according to an embodiment of the present invention. 6 is a diagram illustrating a modification of an opening applied to a light emitting device package according to an embodiment of the present invention. 6 is a diagram illustrating a modification of an opening applied to a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. It is a top view explaining the electrode arrangement | positioning of the light emitting element applied to the light emitting element package based on the Example of this invention. FIG. 34 is a cross-sectional view of the light emitting device shown in FIG. 33 taken along the line FF. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention. 6 is a view showing still another example of a light emitting device package according to an embodiment of the present invention.

  Hereinafter, embodiments will be described with reference to the accompanying drawings. In the description of the embodiments, when it is described that each layer (film), region, pattern, or structure is formed “above” or “below” the substrate, each layer (film), region, pad, or pattern, "And" under "also include those formed" directly "or" via other layers ". Moreover, although the reference | standard with respect to the upper or lower of each floor is demonstrated on the basis of drawing, an Example is not limited to this.

  Hereinafter, a semiconductor device package and a method for manufacturing the semiconductor device package according to embodiments of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, as an example of the semiconductor element, a case where a light-emitting element is applied will be described.

  First, a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS.

  1 is a plan view of a light emitting device package according to an embodiment of the present invention, FIG. 2 is a bottom view of the light emitting device package according to an embodiment of the present invention, and FIG. 3 is a light emitting device package shown in FIG. It is the DD sectional view taken on the line.

  The light emitting device package 100 according to the embodiment may include a package body 110 and a light emitting device 120 as shown in FIGS.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line. The main body 113 can also be referred to as an insulating member.

  The main body 113 is disposed on the first frame 111. The main body 113 is disposed on the second frame 112.

  The main body 113 may provide an inclined surface disposed on the first frame 111 and the second frame 112. A cavity C is provided on the first frame 111 and the second frame 112 by the inclined surface of the main body 113.

  According to an embodiment, the package body 110 may be provided with a structure having a cavity C, or may be provided with a structure having a flat upper surface without the cavity C.

For example, the main body 113 is made of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide 9T), silicone, EMC (Epoxy Molding Compound), SMC (Silicone Molding Compound), ceramic, PSG. (photo sensitive glass), sapphire (Al ₂ O ₃ ), or the like. The main body 113 may include a high refractive filler such as TiO ₂ and SiO ₂ .

  The first frame 111 and the second frame 112 are provided from an insulating frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110.

  In addition, the first frame 111 and the second frame 112 may be provided from a conductive frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and are electrically connected to the light emitting device 120.

  The difference between the case where the first frame 111 and the second frame 112 are formed from an insulating frame and the case where they are formed from a conductive frame will be further described later.

  According to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  As shown in FIG. 3, the light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The first pad electrode 121 and the second pad electrode 122 may be referred to as a bonding part. For example, the first pad electrode 121 may be referred to as a first bonding portion, and the second pad electrode 122 may be referred to as a second bonding portion.

  The semiconductor structure 123 may include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer. The first pad electrode 121 is electrically connected to the first conductive semiconductor layer. The second pad electrode 122 is electrically connected to the second conductive semiconductor layer.

  The light emitting device 120 is disposed on the package body 110. The light emitting device 120 is disposed on the first frame 111 and the second frame 112. The light emitting device 120 is disposed in the cavity C provided by the package body 110.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first pad electrode 121 is disposed on the first frame 111. The second pad electrode 122 is disposed on the second frame 112.

  The first pad electrode 121 is disposed between the semiconductor structure 123 and the first frame 111. The second pad electrode 122 is disposed between the semiconductor structure 123 and the second frame 112.

  The first pad electrode 121 and the second pad electrode 122 are Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, One or more substances or alloys selected from the group comprising Pt, Ru, Rh, Sn, Cu, ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, Ni / IrOx / Au / ITO It is formed into a single layer or multiple layers using it.

  Meanwhile, the light emitting device package 100 according to the embodiment may include a first opening TH1 and a second opening TH2, as illustrated in FIGS. The first frame 111 may include the first opening TH1. The second frame 112 may include the second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to the embodiment, the lower region of the first pad electrode 121 is disposed in the upper region of the first opening TH1. The bottom surface of the first pad electrode 121 is disposed lower than the top surface of the first frame 111.

  The lower region of the second pad electrode 122 is disposed in the upper region of the second opening TH2. The bottom surface of the second pad electrode 122 is disposed lower than the top surface of the second frame 112.

  In addition, the width W1 of the upper region of the first opening TH1 is smaller than or equal to the width W2 of the lower region of the first opening TH1. Further, the width of the upper region of the second opening TH2 is provided smaller than or the same as the width of the lower region of the second opening TH2.

  The first opening TH1 is provided in an inclined form in which the width gradually decreases from the lower region to the upper region. The second opening TH2 is provided in an inclined form in which the width gradually decreases from the lower region to the upper region.

  However, the present invention is not limited to this, and the inclined surfaces between the upper and lower regions of the first and second openings TH1 and TH2 may have a plurality of inclined surfaces having different inclinations, The inclined surface is arranged with a curvature.

  In the lower surface region of the first frame 111 and the second frame 112, a width W3 between the first opening TH1 and the second opening TH2 is provided to several hundred μm. In a lower surface region of the first frame 111 and the second frame 112, a width W3 between the first opening TH1 and the second opening TH2 is provided, for example, to 100 μm to 150 μm.

  The width W3 between the first opening TH1 and the second opening TH2 in the lower surface region of the first frame 111 and the second frame 112 is determined so that the light emitting device package 100 according to the embodiment is a circuit board in the future. In order to prevent the occurrence of an electrical short between pads when mounted on a submount or the like, it is selected to be provided over a certain distance.

  In addition, the light emitting device package 100 according to the embodiment may include an adhesive 130.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  In addition, the light emitting device package 100 according to the embodiment may include a recess R as illustrated in FIGS.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, when the adhesive 130 includes a reflective function, the adhesive may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved. Further, the adhesive 130 can reflect light emitted from the light emitting device 120. When the adhesive 130 includes a reflective function, the adhesive 130 is made of a material including TiO ₂ , silicone, and the like.

  According to an embodiment, the depth T1 of the recess R is provided smaller than the depth T2 of the first opening TH1 or the depth T2 of the second opening TH2.

  The depth T1 of the recess R is determined in consideration of the adhesive force of the adhesive 130. In addition, the depth T1 of the recess R is determined in consideration of a stable strength of the main body 113 and / or a crack is not generated in the light emitting device package 100 due to heat released from the light emitting device 120. To be determined.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. Here, the underfill process is a process of disposing the adhesive 130 under the light emitting device 120 after the light emitting device 120 is mounted on the package body 110, or the light emitting device 120 is disposed in the package body. 110 is a step of disposing the light emitting device 120 after disposing the adhesive 130 in the recess R for mounting via the adhesive 130. The recess R is provided at a first depth or more so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. In addition, the recess R is provided at a second depth or less in order to provide a stable strength of the main body 113.

  The depth T1 and the width W4 of the recess R may affect the formation position and fixing force of the adhesive 130. The depth T1 and the width W4 of the recess R are determined so that a sufficient fixing force is provided by the adhesive 130 disposed between the main body 113 and the light emitting device 120.

  For example, the depth T1 of the recess R is provided to several tens of μm. The depth T1 of the recess R is provided to 40 μm to 60 μm.

  The width R4 of the recess R is provided from several tens of μm to several hundreds of μm. Here, the width R 4 of the recess R is provided in the long axis direction of the light emitting device 120.

  A width W4 of the recess R is provided to be narrower than an interval between the first pad electrode 121 and the second pad electrode 122. A width W4 of the recess R is provided in a range of 140 μm to 160 μm. For example, the width R4 of the recess R is provided to 150 μm.

  The depth T2 of the first opening TH1 is provided corresponding to the thickness of the first frame 111. The depth T2 of the first opening TH1 is provided to a thickness that can maintain a stable strength of the first frame 111.

  The depth T2 of the second opening TH2 is provided corresponding to the thickness of the second frame 112. The depth T2 of the second opening TH2 is provided to a thickness that can maintain a stable strength of the second frame 112.

  The depth T2 of the first opening TH1 and the depth T2 of the second opening TH2 are provided corresponding to the thickness of the main body 113. The depth T2 of the first opening TH1 and the depth T2 of the second opening TH2 are provided with thicknesses that can maintain a stable strength of the main body 113.

  For example, the depth T2 of the first opening TH1 is provided to several hundred μm. The first opening TH1 has a depth T2 of 180 μm to 220 μm. For example, the depth T2 of the first opening TH1 is provided to 200 μm.

  For example, the thickness of T2-T1 is selected to be at least 100 μm. This is because the thickness of the injection process that can provide crack free of the main body 113 is taken into consideration.

  According to an embodiment, the ratio of T1 thickness to T2 thickness (T2 / T1) is provided between 2-10. For example, when the thickness of T2 is provided to 200 μm, the thickness of T1 is provided to 20 μm to 100 μm.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package 100 according to the embodiment may include a molding unit 140 as illustrated in FIGS.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110.

  The molding part 140 may include an insulating material. In addition, the molding unit 140 may include wavelength conversion means that receives light emitted from the light emitting device 120 and provides wavelength-converted light. For example, the molding unit 140 may include at least one selected from the group including phosphors, quantum dots, and the like.

  In addition, the light emitting device package 100 according to the embodiment may include a first conductive layer 321 and a second conductive layer 322 as illustrated in FIGS. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  The first pad electrode 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first pad electrode 121 is smaller than the width of the first opening TH1 in the second direction.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the first frame 111.

  The upper portion of the first conductive layer 321 is disposed around the lower portion of the first pad electrode 121 in the upper region of the first opening TH1. The upper surface of the first conductive layer 321 is disposed higher than the lower surface of the first pad electrode 121.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  The second pad electrode 122 may have a width in a second direction perpendicular to the first direction in which the second opening TH2 is formed. The width of the second pad electrode 122 is smaller than the width of the second opening TH2 in the second direction.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the second frame 112.

  The upper portion of the second conductive layer 322 is disposed around the lower portion of the second pad electrode 122 in the upper region of the second opening TH2. The upper surface of the second conductive layer 322 is disposed higher than the lower surface of the second pad electrode 122.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package 100 according to the embodiment may include a first lower recess R10 and a second lower recess R20 as illustrated in FIGS. The first lower recess R10 and the second lower recess R20 are spaced apart from each other.

  The first lower recess R <b> 10 is provided on the lower surface of the first frame 111. The first lower recess R10 is provided so as to be recessed from the lower surface of the first frame 111 in the upper surface direction. The first lower recess R10 is spaced apart from the first opening TH1.

  The first lower recess R10 is provided with a width of several μm to several tens of μm. A resin part is provided in the first lower recess R10. The resin portion filled in the first lower recess R10 is provided from the same material as the main body 113, for example.

  However, the present invention is not limited to this, and the resin portion is provided by being selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion is provided by being selected from materials having a low surface tension with the first and second conductive layers 321 and 322.

  For example, the resin portion filled in the first lower recess R10 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  The resin portion filled in the first lower recess R10 is disposed around the lower surface region of the first frame 111 that provides the first opening TH1. The lower surface region of the first frame 111 providing the first opening TH1 is disposed in a kind of island shape separately from the lower surface forming the surrounding first frame 111.

  For example, as shown in FIG. 2, the lower surface region of the first frame 111 that provides the first opening TH <b> 1 is surrounded by the resin portion filled in the first lower recess R <b> 10 and the main body 113. Isolation is performed from the first frame 111.

  Therefore, the resin part has a poor adhesion or wettability with the first and second conductive layers 321 and 322 or a surface tension between the resin part and the first and second conductive layers 321 and 322. When the first conductive layer 321 provided in the first opening TH1 is removed from the first opening TH1, the resin portion or the main body 113 filled in the first lower recess R10 is disposed when the material is disposed with a low material. It is prevented from spreading beyond.

  This is because the adhesive relationship between the first conductive layer 321 and the resin portion and the main body 113 or wettability between the resin portion and the first and second conductive layers 321 and 322, surface tension, etc. are not good. It is used. That is, the material forming the first conductive layer 321 is selected to have good adhesive properties with the first frame 111. The material forming the first conductive layer 321 is selected so as to have poor adhesive properties with the resin portion and the main body 113.

  Accordingly, the first conductive layer 321 overflows from the first opening TH1 toward the region where the resin portion or the main body 113 is provided, and overflows outside the region where the resin portion or the main body 113 is provided. Diffusion is prevented, and the first conductive layer 321 is stably disposed in a region where the first opening TH1 is provided. Therefore, when the first conductive layer 321 disposed in the first opening TH1 overflows, the first conductive layer 321 extends to an outer region of the first lower recess R10 where the resin portion or the main body 113 is provided. This can be prevented. In addition, the first conductive layer 321 is stably connected to the lower surface of the first pad electrode 121 in the first opening TH1.

  Therefore, when the light emitting device package is mounted on the circuit board, the first conductive layer 321 and the second conductive layer 322 can be prevented from being in contact with each other and short-circuited, and the first and second conductive layers 321 can be prevented. In the step of disposing 322, the amount of the first and second conductive layers 321 and 322 can be easily controlled.

  In addition, the first conductive layer 321 is disposed to extend from the first opening TH1 to the first lower recess R10. Accordingly, the first conductive layer 321 and / or the resin portion is disposed in the first lower recess R10.

  In addition, the second lower recess R <b> 20 is provided on the lower surface of the second frame 112. The second lower recess R20 is provided so as to be recessed from the lower surface of the second frame 112 in the upper surface direction. The second lower recess R20 is spaced apart from the second opening TH2.

  The second lower recess R20 is provided with a width of several μm to several tens of μm. A resin part is provided in the second lower recess R20. The resin part filled in the second lower recess R20 is provided from the same material as the main body 113, for example.

  However, the present invention is not limited to this, and the resin portion is provided by being selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion is provided by being selected from materials having a low surface tension with the first and second conductive layers 321 and 322.

  For example, the resin portion filled in the second lower recess R20 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  The resin portion filled in the second lower recess R20 is disposed around the lower surface region of the second frame 112 that provides the second opening TH2. The lower surface region of the second frame 112 providing the second opening TH2 is disposed in a kind of island shape separately from the lower surface forming the surrounding second frame 112.

  For example, as shown in FIG. 2, the lower surface region of the second frame 112 that provides the second opening TH <b> 2 is surrounded by the resin portion filled in the second lower recess R <b> 20 and the main body 113. Isolation is performed from the second frame 112.

  Therefore, the resin part has a poor adhesion or wettability with the first and second conductive layers 321 and 322 or a surface tension between the resin part and the first and second conductive layers 321 and 322. When the second conductive layer 322 provided to the second opening TH2 is removed from the second opening TH2, the resin portion or the main body 113 filled in the second lower recess R20 is disposed when the low-substance material is disposed. It is prevented from spreading beyond.

  This is because the adhesion between the second conductive layer 322 and the resin part and the main body 113 or the wettability between the resin part and the first and second conductive layers 321 and 322, surface tension, etc. are not good. It is used. That is, the material forming the second conductive layer 322 is selected to have good adhesive properties with the second frame 112. The material forming the second conductive layer 322 is selected so as to have poor adhesive properties with the resin portion and the main body 113.

  Accordingly, the second conductive layer 322 overflows from the second opening TH2 toward the region where the resin portion or the main body 113 is provided, and overflows outside the region where the resin portion or the main body 113 is provided. The diffusion is prevented, and the second conductive layer 322 is stably disposed in the region where the second opening TH2 is provided. Therefore, when the second conductive layer 322 disposed in the second opening TH2 overflows, the second conductive layer 322 extends to an outer region of the second lower recess R20 provided with the resin portion or the main body 113. This can be prevented. In addition, the second conductive layer 322 is stably connected to the lower surface of the second pad electrode 122 in the second opening TH2.

  Therefore, when the light emitting device package is mounted on the circuit board, the first conductive layer 321 and the second conductive layer 322 can be prevented from being in contact with each other and short-circuited, and the first and second conductive layers 321 can be prevented. In the step of disposing 322, the amount of the first and second conductive layers 321 and 322 can be easily controlled.

  In addition, the second conductive layer 322 is disposed to extend from the second opening TH2 to the second lower recess R20. Therefore, the second conductive layer 321 and / or the resin portion is disposed in the second lower recess R20.

  In addition, the light emitting device package 100 according to the embodiment may include a resin portion 135 as illustrated in FIG.

  For reference, in the illustration of FIG. 1, the resin portion 135 and the molding portion 140 are not shown so that the arrangement relationship of the first frame 111, the second frame 112, and the main body 113 is clear.

  The resin part 135 is disposed between the first frame 111 and the light emitting device 120. The resin part 135 is disposed between the second frame 112 and the light emitting device 120. The resin part 135 is provided on the bottom surface of the cavity C provided in the package body 110.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . The resin part 135 may be a reflective part that reflects light emitted from the light emitting device 120, and may be made of a resin containing a reflective material such as TiO ₂ or white silicone. ).

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. In the resin part 135, the first conductive layer 321 and the second conductive layer 322 diffuse out of the first opening TH1 region and the second opening TH2 region toward the outer surface of the light emitting device 120. It can be prevented from moving. When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 are in contact with the active layer of the light emitting device 120. May cause failure due to short circuit. Therefore, when the resin part 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, and the reliability of the light emitting device package according to the embodiment can be improved. it can.

  In addition, according to the embodiment, a protective layer may be provided on and around the lower surface of the light emitting device 120. In such a case, since an insulating protective layer is provided on the surface of the active layer, the first and second conductive layers 321 and 322 are diffused and moved in the direction of the outer surface of the light emitting device 120. In addition, the first and second conductive layers 321 and 322 can be prevented from being electrically connected to the active layer of the light emitting device 120.

  Meanwhile, even when an insulating protective layer is disposed around and around the light emitting device 120, an insulating protective layer may not be disposed around the substrate 124 of the light emitting device 120. At this time, if the substrate 124 is provided from a conductive material, a defect due to a short circuit may occur when the first and second conductive layers 321 and 322 are in contact with the substrate 124. Therefore, when the resin part 135 is disposed, a short circuit between the first and second conductive layers 321 and 322 and the substrate 124 can be prevented, and the reliability of the light emitting device package according to the embodiment can be improved. Can do.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  Meanwhile, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the molding part 140 is in direct contact with the first frame 111 and the second frame 112. It may be arranged to do.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  Meanwhile, the adhesive 130 may be disposed in an upper region of the first and second openings TH1 and TH2. In the process in which the light emitting device 120 is provided on the package body 110, a part of the adhesive 130 may move to the first and second openings TH1 and TH2. A part of the adhesive 130 is disposed in a side region of the first and second pad electrodes 121 and 122 inside the first and second openings TH1 and TH2. A part of the adhesive 130 may be disposed on the first and second conductive layers 321 and 322 inside the first and second openings TH1 and TH2.

  The adhesive 130 can seal the upper regions of the first and second openings TH1 and TH2, and moisture or foreign substances can be emitted from the outside through the first and second openings TH1 and TH2. It is possible to prevent the element 120 from flowing into a region where the element 120 is disposed.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In addition, according to the embodiment, the semiconductor structure 123 is provided from a compound semiconductor. The semiconductor structure 123 is provided from, for example, a Group II-VI or Group III-V compound semiconductor. For example, the semiconductor structure 123 includes at least two elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N). Provided.

  The semiconductor structure 123 may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer.

The first and second conductivity type semiconductor layers may be implemented by at least one of a group III-V or group II-VI compound semiconductor. Said first and second conductivity type semiconductor layer has, for example, _{In x Al y Ga 1-x} -y composition formula N (0 ≦ x ≦ 1,0 ≦ y ≦ 1,0 ≦ x + y ≦ 1) It is formed from a semiconductor material. For example, the first and second conductive semiconductor layers include at least one selected from the group including GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP. be able to. The first conductive semiconductor layer may be an n-type semiconductor layer doped with an n-type dopant such as Si, Ge, Sn, Se, or Te. The second conductive semiconductor layer may be a p-type semiconductor layer doped with a p-type dopant such as Mg, Zn, Ca, Sr, or Ba.

The active layer may be realized from a compound semiconductor. The active layer may be implemented, for example, from at least one of Group III-V or Group II-VI compound semiconductors. When the active layer is implemented with a multi-well structure, the active layer may include a plurality of well layers and a plurality of barrier layers arranged alternately, and In _x Al _y Ga _1-xy N (0 ≦ x ≦ 1, 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1). For example, the active layer is selected from the group comprising InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs. Can be included.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 100 according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, a method for manufacturing a light emitting device package according to an embodiment of the present invention will be described with reference to FIGS.

  With reference to FIGS. 4 to 8, a method for manufacturing a light emitting device package according to an embodiment of the present invention will be described with respect to items that overlap the contents described with reference to FIGS. 1 to 3. May be omitted.

  First, according to the method for manufacturing a light emitting device package according to an embodiment of the present invention, a package body 110 is provided as shown in FIG.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112.

  The main body 113 is disposed on the first frame 111. The main body 113 is disposed on the second frame 112.

  The main body 113 may provide an inclined surface disposed on the first frame 111 and the second frame 112. A cavity C is provided on the first frame 111 and the second frame 112 by the inclined surface of the main body 113.

  In addition, the first frame 111 may include a first opening TH1. The second frame 112 may include a second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The package body 110 may include a recess R provided to the body 113.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface.

  According to the embodiment, the length L2 of the recess R is provided larger than the length L1 of the first opening TH1 or the length L1 of the second opening TH2.

  Next, according to the method for manufacturing the light emitting device package according to the embodiment, the adhesive 130 is provided to the recess R as shown in FIG.

  The adhesive 130 is provided in the recess R region by a DOTTING method or the like. For example, the adhesive 130 is provided in a certain amount in the region where the recess R is formed, and is provided so as to overflow the recess R.

  In addition, according to the embodiment, as shown in FIG. 4, the length L2 of the recess R is provided larger than the length L1 of the second opening TH2. The length L1 of the second opening TH2 is provided to be smaller than the length of the light emitting device 120 in the minor axis direction. In addition, the length L2 of the recess R is provided to be greater than the length of the light emitting device 120 in the minor axis direction.

  In the light emitting device package manufacturing process according to the embodiment, when the amount of the adhesive 130 provided below the light emitting device 120 is large, the adhesive 130 provided to the recess R is disposed below the light emitting device 120. The portion overflowing while bonding moves in the direction of the length L2 of the recess R. Accordingly, even when the amount of the adhesive 130 is applied more than designed, the light emitting device 120 is stably fixed without being lifted from the main body 113.

  In addition, according to the method for manufacturing the light emitting device package according to the embodiment, the light emitting device 120 is provided on the package body 110 as shown in FIG.

  According to the embodiment, the recess R may serve as a kind of align key in the process in which the light emitting device 120 is disposed on the package body 110.

  The light emitting device 120 is fixed to the main body 113 by the adhesive 130. A part of the adhesive 130 provided in the recess R moves toward the first pad electrode 121 and the second pad electrode 122 of the light emitting device 120 and is cured.

  Accordingly, the adhesive 130 is provided in a wide area between the lower surface of the light emitting device 120 and the upper surface of the main body 113, and the fixing force between the light emitting device 120 and the main body 113 is improved.

  According to the embodiment, as described with reference to FIG. 3, the first opening TH <b> 1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  Next, according to the method for manufacturing the light emitting device package according to the example, as illustrated in FIG. 6, the first conductive layer 321 and the second conductive layer 322 are formed.

  In the light emitting device package 100 according to the embodiment, as illustrated in FIGS. 3 and 6, the lower surface of the first pad electrode 121 is exposed through the first opening TH1. In addition, the lower surface of the second pad electrode 122 is exposed through the second opening TH2.

  According to the embodiment, the first conductive layer 321 is formed in the first opening TH1. In addition, the second conductive layer 322 is formed in the second opening TH2.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121. The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the first frame 111.

  As shown in FIG. 3, the upper portion of the first conductive layer 321 is disposed around the lower portion of the first pad electrode 121 in the upper region of the first opening TH1. The upper surface of the first conductive layer 321 is disposed higher than the lower surface of the first pad electrode 121.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122. The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the second frame 112.

  As shown in FIG. 3, the upper portion of the second conductive layer 322 is disposed around the lower portion of the second pad electrode 122 in the upper region of the second opening TH2. The upper surface of the second conductive layer 322 is disposed higher than the lower surface of the second pad electrode 122.

  For example, the first conductive layer 321 and the second conductive layer 322 may be formed using a conductive paste. The first conductive layer 321 and the second conductive layer 322 may be formed using a solder paste or a silver paste.

  And according to the manufacturing method of the light emitting element package which concerns on an Example, as FIG. 7 showed, the resin part 135 is formed.

  As described with reference to FIG. 3, the resin part 135 is disposed between the first frame 111 and the light emitting device 120. The resin part 135 is disposed between the second frame 112 and the light emitting device 120.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . For example, the resin part 135 may be a reflective part that reflects light emitted from the light emitting device 120, and may be made of a resin containing a reflective material such as TiO ₂ . The resin part 135 may include white silicone.
The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  Next, according to the method for manufacturing the light emitting device package according to the embodiment, the molding part 140 is provided on the light emitting device 120 as shown in FIG.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  The molding part 140 may include an insulating material. In addition, the molding unit 140 may include wavelength conversion means that receives light emitted from the light emitting device 120 and provides wavelength-converted light. For example, the molding unit 140 may include at least one selected from the group including phosphors, quantum dots, and the like.

  On the other hand, in the above description, the first conductive layer 321 and the second conductive layer 322 are formed first as shown in FIG. 6, and the resin portion 135 and the first conductive layer 322 are formed as shown in FIGS. The case where the molding part 140 is formed has been described as a reference.

  However, according to another example of the method of manufacturing the light emitting device package according to the embodiment, the resin part 135 and the molding part 140 are formed first, and the first conductive layer 321 and the second conductive layer 322 are formed later. It may be formed.

  Further, according to still another example of the method for manufacturing a light emitting device package according to the embodiment, the resin part 135 may not be formed, and only the molding part 140 may be formed in the cavity of the package body 110.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 100 according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in a bonding region between the frame provided to the light emitting device package and the light emitting device, and the stability of electrical connection and physical coupling is weakened. In some cases, the position of the light emitting device is changed, and the optical, electrical characteristics, and reliability of the light emitting device package may be deteriorated.

  However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first electrode and the second electrode of the light emitting device according to the embodiment are driven by a driving power source through the conductive layer disposed in the opening. Provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  Meanwhile, the light emitting device package according to the embodiment described above may include various modifications.

  First, a modification of the main body applied to the light emitting device package according to the embodiment will be described with reference to FIGS. In the description of the light emitting device package according to the embodiment with reference to FIG. 9 to FIG. 17, the description overlapping with the content described with reference to FIG. 1 to FIG.

  9 to 11 are views for explaining modifications of the main body applied to the light emitting device package shown in FIG.

  According to the light emitting device package 100 according to the embodiment, as illustrated in FIG. 9, the main body 113 may include at least two recesses provided on the upper surface.

  For example, the main body 113 may include a first recess R11 disposed on the first frame 111 side from the upper surface central region. The first recess R11 is provided in contact with the end of the first frame 111.

  Further, the main body 113 may include a second recess R12 disposed on the second frame 112 side from the upper surface central region. The second recess R12 is provided in contact with the end of the second frame 112.

  The first recess R11 is provided to be recessed downward from the upper surface of the main body 113 and the upper surface of the first frame 111. The second recess R12 is provided to be recessed downward from the upper surface of the main body 113 and the upper surface of the second frame 112.

  According to the light emitting device package 100 according to the embodiment, the adhesive 130 is provided to the first recess R11 and the second recess R12. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The first recess R <b> 11 and the second recess R <b> 12 may provide an appropriate space under the light emitting device 120 that can perform a kind of underfill process.

  The first recess R11 and the second recess R12 are provided at a depth greater than the first depth so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. . In addition, the first recess R11 and the second recess R12 are provided below a second depth in order to provide a stable strength of the main body 113.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  In addition, the first recess R11 and the adhesive 130 may prevent the first conductive layer 321 provided in the first opening TH1 from moving to a lower region of the light emitting device 120. In addition, the second recess R12 and the adhesive 130 may prevent the second conductive layer 322 provided in the second opening TH2 from moving to a lower region of the light emitting device 120. Accordingly, it is possible to prevent the light emitting device 120 from being electrically short-circuited or deteriorated due to the movement of the first conductive layer 321 or the movement of the second conductive layer 322.

  On the other hand, FIG. 9 is a cross-sectional view of the main body 113 applied to the light emitting device package according to the embodiment, and FIGS. 10 and 11 are plan views of the main body 113 shown in FIG.

  For example, as shown in FIG. 10, the first recess R <b> 11 and the second recess R <b> 12 are spaced apart from each other across the central region of the main body 113. The first recess R11 and the second recess R12 are disposed so as to be parallel to each other across the central region of the main body 113.

  In addition, as shown in FIG. 11, the first recess R11 and the second recess R12 are spaced apart from each other across the central region of the main body 113. On the other hand, the first recess R11 and the second recess R12 may be arranged to be connected in a closed loop around the central region of the main body 113.

  On the other hand, FIGS. 12 to 14 are diagrams illustrating another modification of the main body applied to the light emitting device package shown in FIG.

  According to the light emitting device package 100 according to the embodiment, as illustrated in FIG. 12, the main body 113 may include at least three recesses provided on the upper surface.

  For example, the main body 113 may include a first recess R21 disposed on the first frame 111 side from the upper surface central region. The first recess R21 is provided to be recessed from the upper surface of the main body 113 toward the lower surface.

  In addition, the main body 113 may include a third recess R23 disposed on the second frame 112 side from the upper surface central region. The third recess R23 is provided to be recessed from the upper surface of the main body 113 toward the lower surface.

  In addition, the main body 113 may include a second recess R22 disposed in a central region on the upper surface. The second recess R22 is provided to be recessed from the upper surface of the main body 113 toward the lower surface. The second recess R22 is disposed between the first recess R21 and the third recess R23.

  According to the light emitting device package 100 according to the embodiment, the adhesive 130 is provided to the first recess R21, the second recess R22, and the third recess R23. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The first recess R21, the second recess R22, and the third recess R23 perform a kind of underfill process under the light emitting device 120 in order to attach the light emitting device 120 to the package body. Proper space that can be executed can be provided.

  The first recess R21, the second recess R22, and the third recess R23 have a first depth so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. More than just offered. In addition, the first recess R21, the second recess R22, and the third recess R23 are provided below a second depth in order to provide a stable strength of the main body 113.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  In addition, the first recess R21 and the adhesive 130 may prevent the first conductive layer 321 provided in the first opening TH1 from moving to a lower region of the light emitting device 120. In addition, the third recess R23 and the adhesive 130 may prevent the second conductive layer 322 provided in the second opening TH2 from moving to a lower region of the light emitting device 120. Accordingly, it is possible to prevent the light emitting device 120 from being electrically short-circuited or deteriorated due to the movement of the first conductive layer 321 or the movement of the second conductive layer 322.

  On the other hand, FIG. 12 is a cross-sectional view of the main body 113 applied to the light emitting device package according to the embodiment, and FIGS. 13 and 14 are plan views of the main body 113 shown in FIG.

  For example, as shown in FIG. 13, the first recess R21, the second recess R22, and the third recess R23 are spaced apart from each other on the upper surface of the main body 113 so as to be parallel to one direction. . The first recess R21, the second recess R22, and the third recess R23 are extended from the upper surface of the main body 113 in one direction.

  As shown in FIG. 14, the first recess R21 and the third recess R23 are spaced apart from each other with a central region of the main body 113 interposed therebetween. On the other hand, the first recess R21 and the third recess R23 may be arranged to be connected in a closed loop around the central region of the main body 113. The second recess R22 is disposed in the central region of the main body 113. The second recess R22 may be disposed in a space surrounded by the first recess R21 and the third recess R23.

  15 to 17 are views for explaining still another modification of the main body applied to the light emitting device package shown in FIG.

  According to the light emitting device package 100 according to the embodiment, as illustrated in FIG. 15, the main body 113 may include at least two recesses provided on the upper surface.

  For example, the main body 113 may include a first recess R31 disposed on the first frame 111 side from the upper surface central region. The first recess R31 is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The first recess R31 is spaced apart from the end of the first frame 111.

  In addition, the main body 113 may include a second recess R32 disposed on the second frame 112 side from an upper surface central region. The second recess R32 is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The second recess R32 is spaced apart from the end of the second frame 112.

  According to the light emitting device package 100 according to the embodiment, the adhesive 130 is provided to the first recess R31 and the second recess R32. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The first recess R31 and the second recess R32 may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed.

  The first recess R31 and the second recess R32 are provided to a depth greater than the first depth so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. . In addition, the first recess R31 and the second recess R32 are provided below a second depth in order to provide a stable strength of the main body 113.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  In addition, the first recess R31 and the adhesive 130 may prevent the first conductive layer 321 provided in the first opening TH1 from moving to a lower region of the light emitting device 120. In addition, the second recess R32 and the adhesive 130 may prevent the second conductive layer 322 provided in the second opening TH2 from moving to a lower region of the light emitting device 120. Accordingly, it is possible to prevent the light emitting device 120 from being electrically short-circuited or deteriorated due to the movement of the first conductive layer 321 or the movement of the second conductive layer 322.

  15 is a cross-sectional view of the main body 113 applied to the light emitting device package according to the embodiment, and FIGS. 16 and 17 are plan views of the main body 113 shown in FIG.

  For example, as shown in FIG. 16, the first recess R31 and the second recess R32 are disposed on the upper surface of the main body 113 so as to be separated from each other and parallel to one direction. The first recess R31 and the second recess R32 are arranged extending in one direction from the upper surface of the main body 113.

  In addition, as shown in FIG. 17, the first recess R31 and the second recess R32 are spaced apart from each other across the central region of the main body 113. Meanwhile, the first recess R31 and the second recess R32 may be arranged in a closed loop around the central region of the main body 113.

  Next, another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIGS.

  18 is a view showing another example of the light emitting device package according to the embodiment of the present invention, and FIG. 19 is a view of the first frame, the second frame, and the main body applied to the light emitting device package shown in FIG. It is drawing explaining arrangement | positioning relationship.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 18 and FIG. 19, the description overlapping with the content described with reference to FIG.

  The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in FIGS.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line.

  The first frame 111 and the second frame 112 are provided from an insulating frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110.

  In addition, the first frame 111 and the second frame 112 may be provided from a conductive frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and are electrically connected to the light emitting device 120.

  The difference between the case where the first frame 111 and the second frame 112 are formed from an insulating frame and the case where they are formed from a conductive frame will be further described later.

For example, the main body 113 is made of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide 9T), silicone, EMC (Epoxy Molding Compound), SMC (Silicone Molding Compound), ceramic, PSG. (photo sensitive glass), sapphire (Al ₂ O ₃ ), or the like. The main body 113 may include a high refractive filler such as TiO ₂ and SiO ₂ .

  According to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  The light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124 as shown in FIG. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The light emitting device 120 is disposed on the package body 110. The light emitting device 120 is disposed on the first frame 111 and the second frame 112. The light emitting device 120 is disposed in the cavity C provided by the package body 110.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first pad electrode 121 is disposed on the first frame 111. The second pad electrode 122 is disposed on the second frame 112.

  The first pad electrode 121 is disposed between the semiconductor structure 123 and the first frame 111. The second pad electrode 122 is disposed between the semiconductor structure 123 and the second frame 112.

  Meanwhile, as illustrated in FIGS. 18 and 19, the light emitting device package according to the embodiment may include a first opening TH1 and a second opening TH2. The first frame 111 may include the first opening TH1. The second frame 112 may include the second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to the embodiment, the lower region of the first pad electrode 121 is disposed in the upper region of the first opening TH1. The bottom surface of the first pad electrode 121 is disposed lower than the top surface of the first frame 111.

  The lower region of the second pad electrode 122 is disposed in the upper region of the second opening TH2. The bottom surface of the second pad electrode 122 is disposed lower than the top surface of the second frame 112.

  The light emitting device package according to the embodiment may include an adhesive 130.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  The light emitting device package according to the embodiment may include a recess R as illustrated in FIGS. 18 and 19.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. The recess R is provided at a first depth or more so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. In addition, the recess R is provided at a second depth or less in order to provide a stable strength of the main body 113.

  In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  The first pad electrode 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first pad electrode 121 is smaller than the width of the first opening TH1 in the second direction.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the first frame 111.

  The upper portion of the first conductive layer 321 is disposed around the lower portion of the first pad electrode 121 in the upper region of the first opening TH1. The upper surface of the first conductive layer 321 is disposed higher than the lower surface of the first pad electrode 121.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  The second pad electrode 122 may have a width in a second direction perpendicular to the first direction in which the second opening TH2 is formed. The width of the second pad electrode 122 is smaller than the width of the second opening TH2 in the second direction.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the second frame 112.

  The upper portion of the second conductive layer 322 is disposed around the lower portion of the second pad electrode 122 in the upper region of the second opening TH2. The upper surface of the second conductive layer 322 is disposed higher than the lower surface of the second pad electrode 122.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package according to the embodiment may include a first lower recess R10 and a second lower recess R20 as shown in FIGS. The first lower recess R10 and the second lower recess R20 are spaced apart from each other.

  The first lower recess R <b> 10 is provided on the lower surface of the first frame 111. The first lower recess R10 is provided so as to be recessed from the lower surface of the first frame 111 in the upper surface direction. The first lower recess R10 is spaced apart from the first opening TH1.

  The first lower recess R10 is provided with a width of several μm to several tens of μm. A resin part is provided in the first lower recess R10. The resin portion filled in the first lower recess R10 is provided from the same material as the main body 113, for example.

  For example, the resin portion filled in the first lower recess R10 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  As described with reference to FIG. 2, the resin portion filled in the first lower recess R10 is disposed around the lower surface region of the first frame 111 that provides the first opening TH1. The lower surface region of the first frame 111 providing the first opening TH1 is disposed in a kind of island shape separately from the lower surface forming the surrounding first frame 111.

  For example, as described with reference to FIG. 2, the lower surface region of the first frame 111 that provides the first opening TH <b> 1 is surrounded by the resin portion filled in the first lower recess R <b> 10 and the main body 113. The first frame 111 is isolated.

  Accordingly, the first conductive layer 321 provided in the first opening TH1 may be detached from the first opening TH1 and diffused beyond the resin portion or the main body 113 filled in the first lower recess R10. Is prevented.

  Accordingly, the first conductive layer 321 is prevented from overflowing from the region where the resin portion or the main body 113 is provided, and the first conductive layer 321 is stable in the region where the first opening TH1 is provided. Placed in. In addition, the first conductive layer 321 is stably connected to the lower surface of the first pad electrode 121 in the first opening TH1.

  In addition, the second lower recess R <b> 20 is provided on the lower surface of the second frame 112. The second lower recess R20 is provided so as to be recessed from the lower surface of the second frame 112 in the upper surface direction. The second lower recess R20 is spaced apart from the second opening TH2.

  The second lower recess R20 is provided with a width of several μm to several tens of μm. A resin part is provided in the second lower recess R20. The resin part filled in the second lower recess R20 is provided from the same material as the main body 113, for example.

  For example, the resin portion filled in the second lower recess R20 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  As described with reference to FIG. 2, the resin portion filled in the second lower recess R20 is disposed around the lower surface region of the second frame 112 that provides the second opening TH2. The lower surface region of the second frame 112 providing the second opening TH2 is disposed in a kind of island shape separately from the lower surface forming the surrounding second frame 112.

  For example, as described with reference to FIG. 2, the lower surface region of the second frame 112 that provides the second opening TH <b> 2 is surrounded by the resin portion filled in the second lower recess R <b> 20 and the main body 113. The second frame 112 is isolated.

  Therefore, the second conductive layer 322 provided to the second opening TH2 is detached from the second opening TH2, and diffuses beyond the resin portion or the main body 113 filled in the second lower recess R20. Is prevented.

  Accordingly, the second conductive layer 322 is prevented from overflowing from the region where the resin portion or the main body 113 is provided, and the second conductive layer 322 is stable in the region where the second opening TH2 is provided. Placed in. In addition, the second conductive layer 322 is stably connected to the lower surface of the second pad electrode 122 in the second opening TH2.

  In addition, the light emitting device package according to the embodiment may include a first upper recess R3 and a second upper recess R4 as illustrated in FIGS.

  The first upper recess R <b> 3 is provided on the upper surface of the first frame 111. The first upper recess R3 is provided so as to be recessed from the upper surface of the first frame 111 toward the lower surface. The first upper recess R3 is spaced apart from the first opening TH1.

  As shown in FIG. 19, the first upper recess R3 is provided adjacent to the periphery of the first pad electrode 121 when viewed from above. For example, the first upper recess R <b> 3 is provided in a “[” shape around the first pad electrode 121.

  According to an embodiment, the first upper recess R3 is provided so as not to overlap the first lower recess R10 in the vertical direction. When the first upper recess R3 and the first lower recess R10 overlap in the vertical direction, the strength of the first frame 111 is weakened when the thickness of the first frame 111 disposed therebetween is provided thin. This is a consideration of the point.

  According to another embodiment, when the thickness of the first frame 111 is sufficiently provided, the first upper recess R3 and the first lower recess R10 may be provided to overlap each other in the vertical direction.

  The second upper recess R <b> 4 is provided on the upper surface of the second frame 112. The second upper recess R4 is provided to be recessed from the upper surface of the second frame 112 toward the lower surface. The second upper recess R4 is spaced apart from the second opening TH2.

  According to an embodiment, the second upper recess R4 is provided so as not to overlap the second lower recess R20 in the vertical direction. When the second upper recess R4 and the second lower recess R20 overlap in the vertical direction, the strength of the second frame 112 is weakened when the thickness of the second frame 112 disposed therebetween is provided thin. This is a consideration of the point.

  According to another embodiment, when the thickness of the second frame 112 is sufficiently provided, the second upper recess R4 and the second lower recess R20 may be provided to overlap each other in the vertical direction.

  As shown in FIG. 19, the second upper recess R4 is provided adjacent to the periphery of the second pad electrode 122 when viewed from above. For example, the second upper recess R4 is provided in the form of “]” around the second pad electrode 122.

  For example, the first upper recess R3 and the second upper recess R4 are provided with a width of several tens of μm to several hundreds of μm.

  In addition, the light emitting device package according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is provided to the first upper recess R3 and the second upper recess R4.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is provided to the first upper recess R3 and extended to a region where the first pad electrode 121 is disposed. The resin part 135 is disposed under the semiconductor structure 123.

  A distance L11 from the end of the first upper recess R3 to the adjacent end of the light emitting device 120 is provided to be several hundred μm or less. For example, the distance L11 from the end of the first upper recess R3 to the adjacent end of the light emitting device 120 is equal to or smaller than 200 μm.

  A distance L11 from the end of the first upper recess R3 to the adjacent end of the light emitting device 120 is determined by the viscosity of the resin part 135 filled in the first upper recess R3.

  The distance L11 from the terminal end of the first upper recess R3 to the adjacent terminal of the light emitting device 120 is the region where the resin part 135 applied to the first upper recess R3 is disposed on the first pad electrode 121. A distance that can be formed in an extended manner is selected.

  The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is provided to the second upper recess R4 and extended to a region where the second pad electrode 122 is disposed. The resin part 135 is disposed under the semiconductor structure 123.

  The resin part 135 is also provided on the side surface of the semiconductor structure 123. By arranging the resin part 135 on the side surface of the semiconductor structure 123, it is possible to effectively prevent the first and second conductive layers 321 and 322 from moving to the side surface of the semiconductor structure 123. it can. In addition, when the resin part 135 is disposed on the side surface of the semiconductor structure 123, the resin part 135 may be disposed under the active layer of the semiconductor structure 123, thereby extracting light from the light emitting device 120. Efficiency can be improved.

  The first upper recess R3 and the second upper recess R4 may provide a sufficient space in which the resin part 135 is provided.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . In addition, the resin part 135 may include a reflective material, for example, white silicone including TiO ₂ and / or silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin part 135 moves by diffusing the first conductive layer 321 and the second conductive layer 322 in the direction of the light emitting element 120 outside the first opening TH1 region and the second opening TH2 region. Can be prevented.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package according to the embodiment may include a molding unit 140.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  Meanwhile, the adhesive 130 may be disposed in an upper region of the first and second openings TH1 and TH2. In the process in which the light emitting device 120 is provided on the package body 110, a part of the adhesive 130 may move to the first and second openings TH1 and TH2. A part of the adhesive 130 is disposed in a side region of the first and second pad electrodes 121 and 122 inside the first and second openings TH1 and TH2. A part of the adhesive 130 may be disposed on the first and second conductive layers 321 and 322 inside the first and second openings TH1 and TH2.

  The adhesive 130 can seal the upper regions of the first and second openings TH1 and TH2, and moisture or foreign substances can be emitted from the outside through the first and second openings TH1 and TH2. It is possible to prevent the element 120 from flowing into a region where the element 120 is disposed.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 100 according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 20, the description overlapping with the content described with reference to FIGS.

  The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in FIG.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line.

  The first frame 111 and the second frame 112 are provided from an insulating frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110.

  In addition, the first frame 111 and the second frame 112 may be provided from a conductive frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and are electrically connected to the light emitting device 120.

  The difference between the case where the first frame 111 and the second frame 112 are formed from an insulating frame and the case where they are formed from a conductive frame will be further described later.

For example, the main body 113 is made of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide 9T), silicone, EMC (Epoxy Molding Compound), SMC (Silicone Molding Compound), ceramic, PSG. (photo sensitive glass), sapphire (Al ₂ O ₃ ), or the like. The main body 113 may include a high refractive filler such as TiO ₂ and SiO ₂ .

  According to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  The light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124, as shown in FIG. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The light emitting device 120 is disposed on the package body 110. The light emitting device 120 is disposed on the first frame 111 and the second frame 112. The light emitting device 120 is disposed in the cavity C provided by the package body 110.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first pad electrode 121 is disposed on the first frame 111. The second pad electrode 122 is disposed on the second frame 112.

  The first pad electrode 121 is disposed between the semiconductor structure 123 and the first frame 111. The second pad electrode 122 is disposed between the semiconductor structure 123 and the second frame 112.

  Meanwhile, the light emitting device package according to the embodiment may include a first opening TH1 and a second opening TH2, as shown in FIG. The first frame 111 may include the first opening TH1. The second frame 112 may include the second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to the embodiment, the lower region of the first pad electrode 121 is disposed in the upper region of the first opening TH1. The bottom surface of the first pad electrode 121 is disposed lower than the top surface of the first frame 111.

  The lower region of the second pad electrode 122 is disposed in the upper region of the second opening TH2. The bottom surface of the second pad electrode 122 is disposed lower than the top surface of the second frame 112.

  The light emitting device package according to the embodiment may include an adhesive 130.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  The light emitting device package according to the embodiment may include a recess R as shown in FIG.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. The recess R is provided at a first depth or more so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. In addition, the recess R is provided at a second depth or less in order to provide a stable strength of the main body 113.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  The first pad electrode 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first pad electrode 121 is smaller than the width of the first opening TH1 in the second direction.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the first frame 111.

  The upper portion of the first conductive layer 321 is disposed around the lower portion of the first pad electrode 121 in the upper region of the first opening TH1. The upper surface of the first conductive layer 321 is disposed higher than the lower surface of the first pad electrode 121.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  The second pad electrode 122 may have a width in a second direction perpendicular to the first direction in which the second opening TH2 is formed. The width of the second pad electrode 122 is smaller than the width of the second opening TH2 in the second direction.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the second frame 112.

  The upper portion of the second conductive layer 322 is disposed around the lower portion of the second pad electrode 122 in the upper region of the second opening TH2. The upper surface of the second conductive layer 322 is disposed higher than the lower surface of the second pad electrode 122.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package according to the embodiment may include a first upper recess R3 and a second upper recess R4 as illustrated in FIG.

  The first upper recess R <b> 3 is provided on the upper surface of the first frame 111. The first upper recess R3 is provided so as to be recessed from the upper surface of the first frame 111 toward the lower surface. The first upper recess R3 is spaced apart from the first opening TH1.

  As shown in FIG. 19, the first upper recess R3 is provided adjacent to the periphery of the first pad electrode 121 when viewed from above. For example, the first upper recess R <b> 3 is provided in a “[” shape around the first pad electrode 121.

  The second upper recess R <b> 4 is provided on the upper surface of the second frame 112. The second upper recess R4 is provided to be recessed from the upper surface of the second frame 112 toward the lower surface. The second upper recess R4 is spaced apart from the second opening TH2.

  As shown in FIG. 19, the second upper recess R4 is provided adjacent to the periphery of the second pad electrode 122 when viewed from above. For example, the second upper recess R4 is provided in the form of “]” around the second pad electrode 122.

  For example, the first upper recess R3 and the second upper recess R4 are provided with a width of several tens of μm to several hundreds of μm.

  In addition, the light emitting device package according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is provided to the first upper recess R3 and the second upper recess R4.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is provided to the first upper recess R3 and extended to a region where the first pad electrode 121 is disposed. The resin part 135 is disposed under the semiconductor structure 123.

  A distance L11 from the end of the first upper recess R3 to the adjacent end of the light emitting device 120 is provided to be several hundred μm or less. For example, the distance L11 from the end of the first upper recess R3 to the adjacent end of the light emitting device 120 is equal to or smaller than 200 μm.

  A distance L11 from the end of the first upper recess R3 to the adjacent end of the light emitting device 120 is determined by the viscosity of the resin part 135 filled in the first upper recess R3.

  The distance L11 from the terminal end of the first upper recess R3 to the adjacent terminal of the light emitting device 120 is the region where the resin part 135 applied to the first upper recess R3 is disposed on the first pad electrode 121. A distance that can be formed in an extended manner is selected.

  The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is provided to the second upper recess R4 and extended to a region where the second pad electrode 122 is disposed. The resin part 135 is disposed under the semiconductor structure 123.

  The resin part 135 is also provided on the side surface of the semiconductor structure 123. By arranging the resin part 135 on the side surface of the semiconductor structure 123, it is possible to effectively prevent the first and second conductive layers 321 and 322 from moving to the side surface of the semiconductor structure 123. it can. In addition, when the resin part 135 is disposed on the side surface of the semiconductor structure 123, the resin part 135 may be disposed under the active layer of the semiconductor structure 123, thereby extracting light from the light emitting device 120. Efficiency can be improved.

  The first upper recess R3 and the second upper recess R4 may provide a sufficient space in which the resin part 135 is provided.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . In addition, the resin part 135 may include a reflective material, for example, white silicone including TiO ₂ and / or silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin part 135 moves by diffusing the first conductive layer 321 and the second conductive layer 322 in the direction of the light emitting element 120 outside the first opening TH1 region and the second opening TH2 region. Can be prevented.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, the light emitting device package according to the embodiment may include a molding unit 140.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  Meanwhile, the adhesive 130 may be disposed in an upper region of the first and second openings TH1 and TH2. In the process in which the light emitting device 120 is provided on the package body 110, a part of the adhesive 130 may move to the first and second openings TH1 and TH2. A part of the adhesive 130 is disposed in a side region of the first and second pad electrodes 121 and 122 inside the first and second openings TH1 and TH2. A part of the adhesive 130 may be disposed on the first and second conductive layers 321 and 322 inside the first and second openings TH1 and TH2.

  The adhesive 130 can seal the upper regions of the first and second openings TH1 and TH2, and moisture or foreign substances can be emitted from the outside through the first and second openings TH1 and TH2. It is possible to prevent the element 120 from flowing into a region where the element 120 is disposed.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 100 according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 21, the description overlapping with the content described with reference to FIGS.

  The light emitting device package shown in FIG. 21 differs from the light emitting device package described with reference to FIGS. 18 to 20 in the formation positions of the first upper recess R3 and the second upper recess R4.

  As shown in FIG. 21, the light emitting device package according to the embodiment is provided such that a partial region of the first upper recess R <b> 3 overlaps the semiconductor structure 123 in the vertical direction when viewed from above. . For example, a side region of the first upper recess R 3 adjacent to the first pad electrode 121 may be extended under the semiconductor structure 123.

  In addition, as shown in FIG. 21, the light emitting device package according to the embodiment has a part of the second upper recess R4 overlapped with the semiconductor structure 123 in the vertical direction when viewed from the upper direction. Provided. For example, a side region of the second upper recess R 4 adjacent to the second pad electrode 122 may be extended under the semiconductor structure 123.

  Accordingly, the resin portion 135 filled in the first upper recess R3 and the second upper recess R4 can effectively seal the periphery of the first pad electrode 321 and the second pad electrode 122.

  In addition, the first upper recess R3 and the second upper recess R4 may provide a sufficient space in which the resin part 135 is provided under the light emitting device 120. The first upper recess R <b> 3 and the second upper recess R <b> 4 may provide an appropriate space under the light emitting device 120 for performing a kind of underfill process.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . For example, the resin part 135 may be a reflective part that reflects light emitted from the light emitting device 120, and may be made of a resin containing a reflective material such as TiO ₂ . The resin part 135 may include white silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin part 135 moves by diffusing the first conductive layer 321 and the second conductive layer 322 in the direction of the light emitting element 120 outside the first opening TH1 region and the second opening TH2 region. Can be prevented.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 100 according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 22, the description overlapping with the content described with reference to FIGS. 1 to 21 may be omitted.

  The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120 as shown in FIG.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line.

  The first frame 111 and the second frame 112 are provided from an insulating frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110.

  In addition, the first frame 111 and the second frame 112 may be provided from a conductive frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and are electrically connected to the light emitting device 120.

  The difference between the case where the first frame 111 and the second frame 112 are formed from an insulating frame and the case where they are formed from a conductive frame will be further described later.

  According to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  The light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124, as shown in FIG. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first pad electrode 121 is disposed on the first frame 111. The second pad electrode 122 is disposed on the second frame 112.

  Meanwhile, the light emitting device package 100 according to the embodiment may include a first opening TH1 and a second opening TH2, as illustrated in FIG. The first frame 111 may include the first opening TH1. The second frame 112 may include the second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to the embodiment, the lower region of the first pad electrode 121 is disposed in the upper region of the first opening TH1. The bottom surface of the first pad electrode 121 is disposed lower than the top surface of the first frame 111.

  The lower region of the second pad electrode 122 is disposed in the upper region of the second opening TH2. The bottom surface of the second pad electrode 122 is disposed lower than the top surface of the second frame 112.

  The light emitting device package 100 according to the embodiment may include an adhesive 130 as illustrated in FIG.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  In addition, the light emitting device package 100 according to the embodiment may include a recess R as illustrated in FIG.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. The recess R is provided at a first depth or more so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. In addition, the recess R is provided at a second depth or less in order to provide a stable strength of the main body 113.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package 100 according to the embodiment may include a first conductive layer 321 and a second conductive layer 322 as illustrated in FIG. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  The first pad electrode 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first pad electrode 121 is smaller than the width of the first opening TH1 in the second direction.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the first frame 111.

  The upper portion of the first conductive layer 321 is disposed around the lower portion of the first pad electrode 121 in the upper region of the first opening TH1. The upper surface of the first conductive layer 321 is disposed higher than the lower surface of the first pad electrode 121.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  The second pad electrode 122 may have a width in a second direction perpendicular to the first direction in which the second opening TH2 is formed. The width of the second pad electrode 122 is smaller than the width of the second opening TH2 in the second direction.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the second frame 112.

  The upper portion of the second conductive layer 322 is disposed around the lower portion of the second pad electrode 122 in the upper region of the second opening TH2. The upper surface of the second conductive layer 322 is disposed higher than the lower surface of the second pad electrode 122.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include a solder paste, a silver paste, or the like.

  Meanwhile, the first conductive layer 321 and the second conductive layer 322 according to the embodiment may be provided as a plurality of layers as shown in FIG. It may be composed of a multilayer or a single layer composed of For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  For example, the first conductive layer 321 may include a first upper conductive layer 321a and a first lower conductive layer 321b. The first upper conductive layer 321a is provided in an upper region of the first opening TH1. The first lower conductive layer 321b is provided in a lower region of the first opening TH1.

  The second conductive layer 322 may include a second upper conductive layer 322a and a second lower conductive layer 322b. The second upper conductive layer 322a is provided in an upper region of the second opening TH2. The second lower conductive layer 322b is provided in a lower region of the second opening TH2.

  According to the embodiment, the first upper conductive layer 321a and the first lower conductive layer 321b may include different materials. The first upper conductive layer 321a and the first lower conductive layer 321b may have different melting points. For example, the melting point of the first upper conductive layer 321a is selected to be higher than the melting point of the first lower conductive layer 321b.

  For example, the conductive paste for forming the first upper conductive layer 321a and the conductive paste for forming the first lower conductive layer 321b are provided to be different from each other. According to an embodiment, the first upper conductive layer 321a may be formed using, for example, silver paste, and the first lower conductive layer 321b may be formed using, for example, solder paste.

  According to the embodiment, when the first upper conductive layer 321a is formed of silver paste, the silver paste provided to the first opening TH1 is between the first pad electrode 121 and the first frame 111. It was detected that the extent of diffusing and penetrating was weak or not.

  Therefore, when the first upper conductive layer 321a is formed of silver paste, the light emitting device 120 can be prevented from being electrically short-circuited or deteriorated.

  Further, when the first upper conductive layer 321a is formed from a silver paste and the first lower conductive layer 321b is formed from a solder paste, the manufacturing cost can be reduced as compared with the case where the entire first conductive layer 321 is formed from a silver paste. There is also.

  Similarly, the conductive paste for forming the second upper conductive layer 322a and the conductive paste for forming the second lower conductive layer 322b are provided to be different from each other. According to the embodiment, the second upper conductive layer 322a may be formed using, for example, silver paste, and the second lower conductive layer 322b may be formed using, for example, solder paste.

  According to the embodiment, when the second upper conductive layer 322a is formed of a silver paste, the silver paste provided to the second opening TH2 is between the second pad electrode 122 and the second frame 112. It was detected that the extent of diffusing and penetrating was weak or not.

  Therefore, when the second upper conductive layer 322a is formed from a silver paste, the light emitting device 120 can be prevented from being electrically short-circuited or deteriorated.

  Further, when the second upper conductive layer 322a is formed from a silver paste and the second lower conductive layer 321b is formed from a solder paste, the manufacturing cost can be reduced as compared with the case where the entire second conductive layer 322 is formed from a silver paste. There is also.

  Meanwhile, the light emitting device package 100 according to the embodiment may include a first lower recess R10 and a second lower recess R20 as illustrated in FIG. The first lower recess R10 and the second lower recess R20 are spaced apart from each other.

  The first lower recess R <b> 10 is provided on the lower surface of the first frame 111. The first lower recess R10 is provided so as to be recessed from the lower surface of the first frame 111 in the upper surface direction. The first lower recess R10 is spaced apart from the first opening TH1.

  The first lower recess R10 is provided with a width of several μm to several tens of μm. A resin part is provided in the first lower recess R10. The resin portion filled in the first lower recess R10 is provided from the same material as the main body 113, for example.

  For example, the resin portion filled in the first lower recess R10 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  The resin portion filled in the first lower recess R10 is disposed around the lower surface region of the first frame 111 that provides the first opening TH1. The lower surface region of the first frame 111 providing the first opening TH1 is disposed in a kind of island shape separately from the lower surface forming the surrounding first frame 111.

  For example, as shown in FIG. 2, the lower surface region of the first frame 111 that provides the first opening TH <b> 1 is surrounded by the resin portion filled in the first lower recess R <b> 10 and the main body 113. Isolation is performed from the first frame 111.

  Accordingly, the first conductive layer 321 provided in the first opening TH1 may be detached from the first opening TH1 and diffused beyond the resin portion or the main body 113 filled in the first lower recess R10. Is prevented.

  Accordingly, the first conductive layer 321 is prevented from overflowing from the region where the resin portion or the main body 113 is provided, and the first conductive layer 321 is stable in the region where the first opening TH1 is provided. Placed in. In addition, the first conductive layer 321 is stably connected to the lower surface of the first pad electrode 121 in the first opening TH1.

  In addition, the second lower recess R <b> 20 is provided on the lower surface of the second frame 112. The second lower recess R20 is provided so as to be recessed from the lower surface of the second frame 112 in the upper surface direction. The second lower recess R20 is spaced apart from the second opening TH2.

  The second lower recess R20 is provided with a width of several μm to several tens of μm. A resin part is provided in the second lower recess R20. The resin part filled in the second lower recess R20 is provided from the same material as the main body 113, for example.

  For example, the resin portion filled in the second lower recess R20 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  The resin portion filled in the second lower recess R20 is disposed around the lower surface region of the second frame 112 that provides the second opening TH2. The lower surface region of the second frame 112 providing the second opening TH2 is disposed in a kind of island shape separately from the lower surface forming the surrounding second frame 112.

  For example, as shown in FIG. 2, the lower surface region of the second frame 112 that provides the second opening TH <b> 2 is surrounded by the resin portion filled in the second lower recess R <b> 20 and the main body 113. Isolation is performed from the second frame 112.

  Therefore, the second conductive layer 322 provided to the second opening TH2 is detached from the second opening TH2, and diffuses beyond the resin portion or the main body 113 filled in the second lower recess R20. Is prevented.

  Accordingly, the second conductive layer 322 is prevented from overflowing from the region where the resin portion or the main body 113 is provided, and the second conductive layer 322 is stable in the region where the second opening TH2 is provided. Placed in. In addition, the second conductive layer 322 is stably connected to the lower surface of the second pad electrode 122 in the second opening TH2.

  In addition, the light emitting device package 100 according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is disposed between the first frame 111 and the light emitting device 120. The resin part 135 is disposed between the second frame 112 and the light emitting device 120. The resin part 135 is provided on the bottom surface of the cavity C provided in the package body 110.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

  For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . For example, the resin part 135 may be a reflection part that reflects light emitted from the light emitting device 120, and may be made of a resin containing a reflective material such as TiO 2. The resin part 135 may include white silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin part 135 moves by diffusing the first conductive layer 321 and the second conductive layer 322 in the direction of the light emitting element 120 outside the first opening TH1 region and the second opening TH2 region. Can be prevented.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, the light emitting device package 100 according to the embodiment may include a molding unit 140 as illustrated in FIG.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  Meanwhile, the adhesive 130 may be disposed in an upper region of the first and second openings TH1 and TH2. In the process in which the light emitting device 120 is provided on the package body 110, a part of the adhesive 130 may move to the first and second openings TH1 and TH2. A part of the adhesive 130 is disposed in a side region of the first and second pad electrodes 121 and 122 inside the first and second openings TH1 and TH2. A part of the adhesive 130 may be disposed on the first and second conductive layers 321 and 322 inside the first and second openings TH1 and TH2.

  The adhesive 130 can seal the upper regions of the first and second openings TH1 and TH2, and moisture or foreign substances can be emitted from the outside through the first and second openings TH1 and TH2. It is possible to prevent the element 120 from flowing into a region where the element 120 is disposed.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  Meanwhile, according to the light emitting device package 100 according to the embodiment described above, the first frame 111 may include a lower recess provided on the lower surface and an upper recess provided on the upper surface. For example, the first frame 111 may include at least one lower recess provided on a lower surface. In addition, the first frame 111 may include at least one upper recess provided on an upper surface. In addition, the first frame 111 may include at least one upper recess provided on the upper surface and at least one lower recess provided on the lower surface. The first frame 111 may be provided with a structure in which no recess is formed on either the upper surface or the lower surface.

  Similarly, the second frame 112 may include at least one lower recess provided on a lower surface. In addition, the second frame 112 may include at least one upper recess provided on an upper surface. The second frame 112 may include at least one upper recess provided on the upper surface and at least one lower recess provided on the lower surface. In addition, the second frame 112 may be provided with a structure in which no recess is formed on either the upper surface or the lower surface.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 100 according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Meanwhile, the light emitting device package 100 according to the embodiment described with reference to FIGS. 1 to 22 may be supplied mounted on a submount or a circuit board.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  A light emitting device package 300 according to the embodiment of the present invention shown in FIG. 23 shows an example in which the light emitting device package 100 described with reference to FIGS. 1 to 22 is mounted on a circuit board 310 and supplied.

  In the description of the light emitting device package 300 according to the embodiment of the present invention with reference to FIG. 23, the description overlapping with the content described with reference to FIGS. is there.

  The light emitting device package 300 according to the embodiment may include a circuit board 310, a package body 110, and a light emitting device 120, as shown in FIG.

  The circuit board 310 may include a first pad 311, a second pad 312, and a board 313. A power supply circuit for controlling driving of the light emitting device 120 is provided on the substrate 313.

  The package body 110 is disposed on the circuit board 310. The first pad 311 and the first pad electrode 121 are electrically connected. The second pad 312 and the second pad electrode 122 are electrically connected.

  The first pad 311 and the second pad 312 may include a conductive material. For example, the first pad 311 and the second pad 312 are at least selected from the group including Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, Sn, Zn, and Al. One substance or an alloy thereof can be included. The first pad 311 and the second pad 312 may be provided as a single layer or multiple layers.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line.

  The first frame 111 and the second frame 112 are provided from an insulating frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110.

  In addition, the first frame 111 and the second frame 112 may be provided from a conductive frame. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and are electrically connected to the light emitting device 120.

  The package body 110 may include a first opening TH1 and a second opening TH2 penetrating in a first direction from the upper surface to the lower surface. The first frame 111 may include the first opening TH1. The second frame 112 may include the second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to the embodiment, the lower region of the first pad electrode 121 is disposed in the upper region of the first opening TH1. The bottom surface of the first pad electrode 121 is disposed lower than the top surface of the first frame 111.

  The lower region of the second pad electrode 122 is disposed in the upper region of the second opening TH2. The bottom surface of the second pad electrode 122 is disposed lower than the top surface of the second frame 112.

  The light emitting device package 300 according to the embodiment may include an adhesive 130 as illustrated in FIG.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  In addition, the light emitting device package 300 according to the embodiment may include a recess R as illustrated in FIG.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusion function, thereby improving the light extraction efficiency of the light emitting device package 300.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package 300 according to the embodiment may include a first conductive layer 321 and a second conductive layer 322 as illustrated in FIG. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  The first pad electrode 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first pad electrode 121 is smaller than the width of the first opening TH1 in the second direction.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the first frame 111.

  The upper portion of the first conductive layer 321 is disposed around the lower portion of the first pad electrode 121 in the upper region of the first opening TH1. The upper surface of the first conductive layer 321 is disposed higher than the lower surface of the first pad electrode 121.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  The second pad electrode 122 may have a width in a second direction perpendicular to the first direction in which the second opening TH2 is formed. The width of the second pad electrode 122 is smaller than the width of the second opening TH2 in the second direction.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the second frame 112.

  The upper portion of the second conductive layer 322 is disposed around the lower portion of the second pad electrode 122 in the upper region of the second opening TH2. The upper surface of the second conductive layer 322 is disposed higher than the lower surface of the second pad electrode 122.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  According to the embodiment, the first pad 311 of the circuit board 310 and the first conductive layer 321 are electrically connected. In addition, the second pad 312 of the circuit board 310 and the second conductive layer 322 are electrically connected.

  Meanwhile, according to an embodiment, a separate bonding layer may be further provided between the first pad 311 and the first conductive layer 321. In addition, a separate bonding layer may be further provided between the second pad 312 and the second conductive layer 322.

  According to another embodiment, the first conductive layer 321 and the second conductive layer 322 are mounted on the circuit board 310 by eutectic bonding.

  In the light emitting device package 300 according to the embodiment described with reference to FIG. 23, the power supplied from the circuit board 310 receives the first pad electrode 121 via the first conductive layer 321 and the second conductive layer 322. And transmitted to the second pad electrode 122, respectively. At this time, the first pad 311 of the circuit board 310 and the first conductive layer 321 are in direct contact, and the second pad 312 of the circuit board 310 and the second conductive layer 322 are in direct contact.

  Therefore, according to the light emitting device package 300 according to the embodiment shown in FIG. 23, the first frame 111 and the second frame 112 may be formed of an insulating frame. In addition, according to the light emitting device package 300 according to the embodiment shown in FIG. 23, the first frame 111 and the second frame 112 may be formed of a conductive frame.

  As described above, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are electrically conductive disposed in the opening. Drive power is provided through the layers. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Accordingly, even when the light emitting device package according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur. There is an advantage not to deteriorate.

  In addition, according to the light emitting device package and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Meanwhile, the light emitting device package 400 according to the embodiment of the present invention illustrated in FIG. 24 is another example in which the light emitting device package 100 described with reference to FIGS. Indicates.

  Referring to FIG. 24, in the description of the light emitting device package 400 according to the embodiment of the present invention, the description overlapping the contents described with reference to FIGS. 1 to 23 may be omitted. is there.

  The light emitting device package 400 according to the embodiment may include a circuit board 410, a package body 110, and a light emitting device 120, as shown in FIG.

  The circuit board 410 may include a first pad 411, a second pad 412, and a board 413. A power supply circuit for controlling driving of the light emitting device 120 is provided on the substrate 313.

  The package body 110 is disposed on the circuit board 410. The first pad 411 and the first pad electrode 121 are electrically connected. The second pad 412 and the second pad electrode 122 are electrically connected.

  The first pad 411 and the second pad 412 may include a conductive material. For example, the first pad 411 and the second pad 412 are at least selected from the group including Ti, Cu, Ni, Au, Cr, Ta, Pt, Sn, Ag, P, Fe, Sn, Zn, and Al. One substance or an alloy thereof can be included. The first pad 411 and the second pad 412 may be provided as a single layer or multiple layers.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line.

  The first frame 111 and the second frame 112 are provided from conductive frames. The first frame 111 and the second frame 112 can stably provide the structural strength of the package body 110 and are electrically connected to the light emitting device 120.

  The package body 110 may include a first opening TH1 and a second opening TH2 penetrating in a first direction from the upper surface to the lower surface. The first frame 111 may include the first opening TH1. The second frame 112 may include the second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to the embodiment, the lower region of the first pad electrode 121 is disposed in the upper region of the first opening TH1. The bottom surface of the first pad electrode 121 is disposed lower than the top surface of the first frame 111.

  The lower region of the second pad electrode 122 is disposed in the upper region of the second opening TH2. The bottom surface of the second pad electrode 122 is disposed lower than the top surface of the second frame 112.

  The light emitting device package 400 according to the embodiment may include an adhesive 130 as illustrated in FIG.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  In addition, the light emitting device package 400 according to the embodiment may include a recess R as illustrated in FIG.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusion function, thereby improving the light extraction efficiency of the light emitting device package 300.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package 400 according to the embodiment may include a first conductive layer 321 and a second conductive layer 322 as illustrated in FIG. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  The first pad electrode 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first pad electrode 121 is smaller than the width of the first opening TH1 in the second direction.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the first frame 111.

  The upper portion of the first conductive layer 321 is disposed around the lower portion of the first pad electrode 121 in the upper region of the first opening TH1. The upper surface of the first conductive layer 321 is disposed higher than the lower surface of the first pad electrode 121.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  The second pad electrode 122 may have a width in a second direction perpendicular to the first direction in which the second opening TH2 is formed. The width of the second pad electrode 122 is smaller than the width of the second opening TH2 in the second direction.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the second frame 112.

  The upper portion of the second conductive layer 322 is disposed around the lower portion of the second pad electrode 122 in the upper region of the second opening TH2. The upper surface of the second conductive layer 322 is disposed higher than the lower surface of the second pad electrode 122.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  According to the embodiment, the first pad 411 of the circuit board 410 and the first conductive layer 321 are electrically connected. In addition, the second pad 412 of the circuit board 410 and the second conductive layer 322 are electrically connected.

  The first pad 411 is electrically connected to the first frame 111. In addition, the second pad 412 is electrically connected to the second frame 112.

  Meanwhile, according to an embodiment, a separate bonding layer may be further provided between the first pad 411 and the first frame 111. In addition, a separate bonding layer may be further provided between the second pad 412 and the second frame 112.

  In the light emitting device package 400 according to the embodiment described with reference to FIG. 24, the power supplied from the circuit board 410 receives the first pad electrode 121 via the first conductive layer 321 and the second conductive layer 322. And transmitted to the second pad electrode 122, respectively. At this time, the first pad 411 of the circuit board 410 and the first frame 111 are in direct contact with each other, and the second pad 412 of the circuit board 410 and the second frame 112 are in direct contact with each other.

  As described above, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are electrically conductive disposed in the opening. Drive power is provided through the layers. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Accordingly, even when the light emitting device package according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur. There is an advantage not to deteriorate.

  In addition, according to the light emitting device package and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  On the other hand, in the case of the light emitting device package according to the embodiment described above, the description is based on the case where one opening is provided under each pad electrode.

  However, according to the light emitting device package according to another embodiment, a plurality of openings may be provided under each pad electrode. The plurality of openings may be provided as openings having different widths.

  In addition, the shape of the opening according to the embodiment may be provided in various shapes as illustrated in FIGS.

  For example, as shown in FIG. 25, the opening TH3 according to the embodiment may be provided with the same width from the upper region to the lower region.

  In addition, as illustrated in FIG. 26, the opening TH4 according to the embodiment may be provided in the shape of a multistage structure. For example, the opening TH4 may be provided in a shape having different inclination angles of a two-stage structure. Further, the opening TH4 may be provided in a shape having three or more steps of different inclination angles.

  Further, as shown in FIG. 27, the opening TH5 may be provided in a shape in which the width changes while going from the upper region to the lower region. For example, the opening TH5 may be provided in a shape having a curvature while going from the upper region to the lower region.

  In addition, according to the light emitting device package according to the embodiment described above, the package body 110 may be provided so as to include only the member 113 having a flat upper surface and not include the reflective portion arranged to be inclined. Good.

  As another expression, according to the light emitting device package according to the embodiment, the package body 110 may be provided with a structure providing the cavity C. Also, the package body 110 may be provided with a flat upper surface without the cavity C.

  The light emitting device package according to the embodiment described above is based on the case where the first and second openings TH1 and TH2 are provided in the first and second frames 111 and 112 of the package body 110. As described above, the first and second openings TH1 and TH2 may be provided in the main body 113 of the package main body 110.

  As described above, when the first and second openings TH1 and TH2 are provided in the main body 113 of the package main body 110, the upper surface length of the main body 113 in the long axis direction of the light emitting element 120 is the light emission. The element 120 is provided to be larger than the length between the first pad electrode 121 and the second pad electrode 122.

  In addition, when the first and second openings TH1 and TH2 are provided in the main body 113 of the package main body 110, the light emitting device package according to the embodiment does not include the first and second frames 111 and 112. Good.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 28, the description overlapping the contents described with reference to FIGS. 1 to 27 may be omitted.

  The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in FIG.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line.

For example, the main body 113 is made of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide 9T), silicone, EMC (Epoxy Molding Compound), SMC (Silicone Molding Compound), ceramic, PSG. (photo sensitive glass), sapphire (formed from at least one selected from the group including Al ₂ O ₃ etc. The main body 113 may include a high refractive filler such as TiO ₂ and SiO _2. it can.

  According to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  The light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124 as shown in FIG. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The light emitting device 120 is disposed on the package body 110. The light emitting device 120 is disposed on the first frame 111 and the second frame 112. The light emitting device 120 is disposed in the cavity C provided by the package body 110.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first pad electrode 121 is disposed on the first frame 111. The second pad electrode 122 is disposed on the second frame 112.

  The first pad electrode 121 is disposed between the semiconductor structure 123 and the first frame 111. The second pad electrode 122 is disposed between the semiconductor structure 123 and the second frame 112.

  In addition, the light emitting device package according to the embodiment may include an adhesive 130.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  The light emitting device package according to the embodiment may include a recess R as shown in FIG.

  The recess R is provided in the main body 113. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. The recess R is provided at a first depth or more so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. In addition, the recess R is provided at a second depth or less in order to provide a stable strength of the main body 113.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided on the first frame 111. The first conductive layer 321 is disposed under the first pad electrode 121.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 may provide a function of fixing the first pad electrode 121 and the first frame 111.

  The second conductive layer 322 is provided on the second frame 112. The second conductive layer 322 is disposed under the second pad electrode 122.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 may provide a function of fixing the second pad electrode 122 and the second frame 112.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . In addition, the resin part 135 may include a reflective material, for example, white silicone including TiO ₂ and / or silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin part 135 is formed in the light emitting device 120 direction by separating the first conductive layer 321 and the second conductive layer 322 from the region under the first pad electrode 121 and the region under the second pad electrode 122. Can be prevented from diffusing and moving.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, the light emitting device package according to the embodiment may include a molding unit 140.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first conductive layer 321, and a power source is connected to the second pad electrode 122 through the second conductive layer 322. Is done.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 100 according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are disposed via the conductive layer provided on the frame. A drive power supply is provided. The melting point of the conductive layer disposed on the frame is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 29, the description overlapping the contents described with reference to FIGS. 1 to 28 may be omitted.

  The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in FIG.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line.

For example, the main body 113 is made of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide 9T), silicone, EMC (Epoxy Molding Compound), SMC (Silicone Molding Compound), ceramic, PSG. (photo sensitive glass), sapphire (Al ₂ O ₃ ), or the like. The main body 113 may include a high refractive filler such as TiO ₂ and SiO ₂ .

  According to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  The light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124 as shown in FIG. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The light emitting device 120 is disposed on the package body 110. The light emitting device 120 is disposed on the first frame 111 and the second frame 112. The light emitting device 120 is disposed in the cavity C provided by the package body 110.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first pad electrode 121 is disposed on the first frame 111. The second pad electrode 122 is disposed on the second frame 112.

  The first pad electrode 121 is disposed between the semiconductor structure 123 and the first frame 111. The second pad electrode 122 is disposed between the semiconductor structure 123 and the second frame 112.

  In addition, the light emitting device package according to the embodiment may include an adhesive 130.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  The light emitting device package according to the embodiment may include a recess R as shown in FIG.

  The recess R is provided in the package body 110. The recess R is provided so as to be recessed from the upper surface of the package body 110 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  The recess R is provided by the upper surface of the first frame 111, the upper surface of the main body 113, and the upper surface of the second frame 112. For example, the upper surface of the main body 113 is provided in a flat shape, the upper surface of the first frame 111 is provided in a stepped step shape, and the upper surface of the second frame 112 is provided in a stepped step shape.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the package body 110. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. The adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122. The adhesive 130 is provided between the stepped stepped region of the first frame 111 and the stepped stepped region of the second frame 112.

  As described above, according to the embodiment, the recess R is extended from a partial region of the upper surface of the first frame 111 to a partial region of the upper surface of the second frame 112 to be provided widely.

  Accordingly, the adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the first frame 111. The adhesive 130 may provide a stable fixing force between the light emitting device 120 and the second frame 112.

  The adhesive 130 is disposed in direct contact with the upper surface of the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the first frame 111. The adhesive 130 is disposed in direct contact with the upper surface of the second frame 112. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. The recess R is provided at a first depth or more so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. In addition, the recess R is provided at a second depth or less in order to provide a stable strength of the main body 113.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120 in a wide and thick manner. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is provided on the first frame 111. The first conductive layer 321 is disposed under the first pad electrode 121.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 may provide a function of fixing the first pad electrode 121 and the first frame 111.

  The second conductive layer 322 is provided on the second frame 112. The second conductive layer 322 is disposed under the second pad electrode 122.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 may provide a function of fixing the second pad electrode 122 and the second frame 112.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . In addition, the resin part 135 may include a reflective material, for example, white silicone including TiO ₂ and / or silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin part 135 is formed in the light emitting device 120 direction by separating the first conductive layer 321 and the second conductive layer 322 from the region under the first pad electrode 121 and the region under the second pad electrode 122. Can be prevented from diffusing and moving.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, the light emitting device package according to the embodiment may include a molding unit 140.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In the light emitting device package according to the embodiment, a power source is connected to the first pad electrode 121 through the first conductive layer 321, and a power source is connected to the second pad electrode 122 through the second conductive layer 322. The

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed on the frame. Power is provided. The melting point of the conductive layer disposed on the frame is selected to have a higher value than the melting point of a general bonding material.

  Accordingly, even when the light emitting device package according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur. There is an advantage not to deteriorate.

  In addition, according to the light emitting device package and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 30, the description overlapping with the content described with reference to FIGS. 1 to 29 may be omitted.

  The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in FIG.

  The light emitting device package according to the embodiment shown in FIG. 30 may further include a first recess R1 and a second recess R2 as compared with the light emitting device package described with reference to FIG.

  The first recess R <b> 1 is provided on the upper surface of the first frame 111. The first recess R1 is provided to be recessed from the upper surface of the first frame 111 toward the lower surface. The first recess R1 is spaced apart from the recess R.

  The second recess R <b> 2 is provided on the upper surface of the second frame 112. The second recess R2 is provided so as to be recessed from the upper surface of the second frame 112 toward the lower surface. The second upper recess R4 is spaced apart from the recess R.

  According to an embodiment, the first conductive layer 321 is provided in the first recess R1. The first pad electrode 121 is provided in the first recess R1 region. In addition, the second conductive layer 322 is provided in the second recess R2. The second pad electrode 122 is provided in the second recess R2 region. The first and second recesses R1 and R2 may provide a sufficient space in which the first and second conductive layers 321 and 322 are provided.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . In addition, the resin part 135 may include a reflective material, for example, white silicone including TiO ₂ and / or silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin portion 135 prevents the first conductive layer 321 and the second conductive layer 322 from diffusing and moving in the direction of the light emitting element 120 outside the first recess R1 region and the second recess R2 region. can do.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package according to the embodiment may include a molding unit 140.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In the light emitting device package according to the embodiment, a power source is connected to the first pad electrode 121 through the first conductive layer 321, and a power source is connected to the second pad electrode 122 through the second conductive layer 322. The

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Therefore, even when the light emitting device package 100 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur, so that the electrical connection and the physical bonding force can be achieved. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 100 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 31, the description overlapping the contents described with reference to FIGS. 1 to 30 may be omitted.

  The light emitting device package according to the embodiment may include a package body 110 and a light emitting device 120, as shown in FIG.

  The light emitting device package according to the embodiment shown in FIG. 31 may further include a first recess R1 and a second recess R2 as compared with the light emitting device package described with reference to FIG.

  The first recess R <b> 1 is provided on the upper surface of the first frame 111. The first recess R1 is provided to be recessed from the upper surface of the first frame 111 toward the lower surface. The first recess R1 is spaced apart from the recess R.

  The second recess R <b> 2 is provided on the upper surface of the second frame 112. The second recess R2 is provided so as to be recessed from the upper surface of the second frame 112 toward the lower surface. The second upper recess R4 is spaced apart from the recess R.

  According to an embodiment, the first conductive layer 321 is provided in the first recess R1. The first pad electrode 121 is provided in the first recess R1 region. In addition, the second conductive layer 322 is provided in the second recess R2. The second pad electrode 122 is provided in the second recess R2 region. The first and second recesses R1 and R2 may provide a sufficient space in which the first and second conductive layers 321 and 322 are provided.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . In addition, the resin part 135 may include a reflective material, for example, white silicone including TiO ₂ and / or silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin portion 135 prevents the first conductive layer 321 and the second conductive layer 322 from diffusing and moving in the direction of the light emitting element 120 outside the first recess R1 region and the second recess R2 region. can do.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package according to the embodiment may include a molding unit 140.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In the light emitting device package according to the embodiment, a power source is connected to the first pad electrode 121 through the first conductive layer 321, and a power source is connected to the second pad electrode 122 through the second conductive layer 322. The

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed on the frame. Power is provided. The melting point of the conductive layer disposed on the frame is selected to have a higher value than the melting point of a general bonding material.

  Accordingly, even when the light emitting device package according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur. There is an advantage not to deteriorate.

  In addition, according to the light emitting device package and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  Next, still another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 32, the description overlapping with the content described with reference to FIGS. 1 to 31 may be omitted.

  The light emitting device package according to the embodiment may include a main body 113 and a light emitting device 120, as shown in FIG.

  According to the embodiment, the main body 113 is provided with a recess R, a first opening TH1, and a second opening TH2. The recess R is provided on the upper surface of the main body 113. As shown in FIG. 32, the main body 113 may include the first opening TH1 and the second opening TH2.

  In addition, according to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  The light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124 as shown in FIG. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The light emitting device 120 is disposed on the main body 113. The light emitting device 120 is disposed in the cavity C provided by the main body 113.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first opening TH1 is provided in the main body 113. The first opening TH1 is provided through the main body 113. The first opening TH1 is provided through the upper surface and the lower surface of the main body 113 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the main body 113.

  The second opening TH2 is provided in the main body 113. The second opening TH2 is provided through the main body 113. The second opening TH2 is provided through the upper surface and the lower surface of the main body 113 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the main body 113.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  According to an embodiment, a lower region of the first pad electrode 121 is disposed in the first opening TH1. The bottom surface of the first pad electrode 121 is disposed lower than the top surface of the main body 113.

  A lower region of the second pad electrode 122 is disposed in the second opening TH2. The bottom surface of the second pad electrode 122 is disposed lower than the top surface of the main body 113.

  In addition, the light emitting device package according to the embodiment may include an adhesive 130.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  The light emitting device package according to the embodiment may include the recess R as shown in FIG.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, the adhesive 130 may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

  The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. The recess R is provided at a first depth or more so that the adhesive 130 is sufficiently provided between the lower surface of the light emitting device 120 and the upper surface of the main body 113. In addition, the recess R is provided at a second depth or less in order to provide a stable strength of the main body 113.

For example, the main body 113 is made of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide 9T), silicone, EMC (Epoxy Molding Compound), SMC (Silicone Molding Compound), ceramic, PSG. (photo sensitive glass), sapphire (Al ₂ O ₃ ), or the like. The main body 113 may include a high refractive filler such as TiO ₂ and SiO ₂ .

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Accordingly, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package, thereby improving light extraction efficiency.

  In addition, the light emitting device package according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductive layer 321 is disposed in a first lower recess R <b> 5 provided on the lower surface of the main body 113. The first conductive layer 321 is disposed under the main body 113. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  The first pad electrode 121 may have a width in a second direction perpendicular to the first direction in which the first opening TH1 is formed. The width of the first pad electrode 121 is smaller than the width of the first opening TH1 in the second direction.

  The first conductive layer 321 is disposed in direct contact with the lower surface of the first pad electrode 121. The first conductive layer 321 is electrically connected to the first pad electrode 121. The first conductive layer 321 is disposed so as to be surrounded by the main body 113 in the first lower recess R5.

  The second conductive layer 322 is disposed in a second lower recess R <b> 6 provided on the lower surface of the main body 113. The second conductive layer 322 is disposed under the main body 113. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  The second pad electrode 122 may have a width in a second direction perpendicular to the first direction in which the second opening TH2 is formed. The width of the second pad electrode 122 is smaller than the width of the second opening TH2 in the second direction.

  The second conductive layer 322 is disposed in direct contact with the lower surface of the second pad electrode 122. The second conductive layer 322 is electrically connected to the second pad electrode 122. The second conductive layer 322 is disposed so as to be surrounded by the main body 113 in the second lower recess R6.

  The first region on the upper surface of the first conductive layer 321 is disposed under the first opening TH1. The first region on the upper surface of the first conductive layer 321 is disposed to overlap the first opening TH1 in the vertical direction.

  The second region on the upper surface of the first conductive layer 321 is disposed under the lower surface of the main body 113. The second region on the upper surface of the first conductive layer 321 is disposed to overlap the lower surface of the main body 113 in the vertical direction.

  The first region on the upper surface of the second conductive layer 322 is disposed under the second opening TH2. The first region on the upper surface of the second conductive layer 322 is disposed so as to overlap with the second opening TH2.

  The second region on the upper surface of the second conductive layer 322 is disposed below the lower surface of the main body 113. The second region on the upper surface of the second conductive layer 322 is disposed so as to overlap the lower surface of the main body 113 in the vertical direction.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  The first conductive layer 321 and the second conductive layer 322 are formed of a metal material having good heat dissipation characteristics or an alloy thereof. Since the first conductive layer 321 and the second conductive layer 322 are formed of a material having good heat dissipation characteristics, heat generated from the light emitting device 120 is effectively released to the outside. Thereby, the reliability of the light emitting device package according to the embodiment is improved.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first and second conductive layers 321 and 322 may include a SAC (Sn—Ag—Cu) material.

  In addition, the light emitting device package according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . In addition, the resin part 135 may include a reflective material, for example, white silicone including TiO ₂ and / or silicone.

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin part 135 can improve the adhesive force between the light emitting element 120 and the main body 113.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. The resin part 135 moves by diffusing the first conductive layer 321 and the second conductive layer 322 in the direction of the light emitting element 120 outside the first opening TH1 region and the second opening TH2 region. Can be prevented.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  In addition, the light emitting device package according to the embodiment may include a molding unit 140.

  The molding part 140 is provided on the light emitting device 120. The molding part 140 is disposed on the main body 113. The molding part 140 is disposed in a cavity C provided by the main body 113. The molding part 140 is disposed on the resin part 135.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  Meanwhile, the adhesive 130 may be disposed in an upper region of the first and second openings TH1 and TH2. In the process in which the light emitting device 120 is provided on the package body 110, a part of the adhesive 130 may move to the first and second openings TH1 and TH2. A part of the adhesive 130 is disposed in a side region of the first and second pad electrodes 121 and 122 inside the first and second openings TH1 and TH2. A part of the adhesive 130 may be disposed on the first and second conductive layers 321 and 322 inside the first and second openings TH1 and TH2.

  The adhesive 130 can seal the upper regions of the first and second openings TH1 and TH2, and moisture or foreign substances can be emitted from the outside through the first and second openings TH1 and TH2. It is possible to prevent the element 120 from flowing into a region where the element 120 is disposed.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  According to another embodiment, the first and second conductive layers 321 and 322 are extended to the end of the side wall of the main body 113. In addition, the first and second conductive layers 321 and 322 may be disposed on the lower surface of the main body 113 via an adhesive resin or the like. The side surface of the first conductive layer 321 and the first side surface of the main body 113 are provided on the same plane. In addition, the side surface of the second conductive layer 322 and the second side surface of the main body 113 are provided on the same plane.

  In the light emitting device package 100 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  According to another embodiment, the adhesive 130, the resin part 135, and the main body 113 may include the same material.

  According to the embodiment, the adhesive 130 and the resin portion 135 are considered in consideration of CTE (Coefficient of Thermal Expansion) matching among the main body 113, the adhesive 130, the resin portion 135, and the light emitting device 120. By selecting the physical properties, it is possible to improve the occurrence of cracks and peeling problems due to thermal shock.

  Meanwhile, the light emitting device package according to the embodiment described above may be supplied by being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are interposed through the conductive layer disposed under the opening. Drive power is provided. The melting point of the conductive layer disposed under the opening is selected to have a higher value than the melting point of a general bonding material.

  Accordingly, even when the light emitting device package according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur. There is an advantage not to deteriorate.

  Further, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, it is not necessary to expose the main body 113 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the main body 113 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  On the other hand, for example, a flip chip light emitting device is provided in the light emitting device package described above.

  For example, the flip chip light emitting device may be provided as a transmissive flip chip light emitting device that emits light in the six-plane direction, or may be provided as a reflective flip chip light emitting device that emits light in the five surface direction. Good.

  The reflective flip-chip light emitting device that emits light in the five-plane direction may have a structure in which a reflective layer is disposed in a direction close to the package body 110. For example, the reflective flip-chip light emitting device includes an insulating reflective layer (for example, Distributed Bragg Reflector, Omni Directional Reflector, etc.) and / or a conductive reflective layer (for example, the first and second electrode pads) and the semiconductor structure. , Ag, Al, Ni, Au, etc.).

  In addition, the flip chip light emitting device that emits light in the six-plane direction includes a first electrode that is electrically connected to the first conductive semiconductor layer and a second electrode that is electrically connected to the second conductive semiconductor layer. It may be provided as a general horizontal light emitting device having electrodes and emitting light from between the first electrode and the second electrode.

  The flip chip light emitting device that emits light in the six-plane direction includes both a reflective region in which a reflective layer is disposed between the first and second electrode pads and a transmissive region from which light is emitted. It may be provided as a mold flip chip light emitting device.

  Here, the transmissive flip-chip light emitting element means an element from which light is emitted from six surfaces including an upper surface, four side surfaces, and a lower surface. The reflective flip-chip light emitting element means an element that emits light from five surfaces of the upper surface and the four side surfaces.

  Next, an example of a flip chip light emitting device applied to a light emitting device package according to an embodiment of the present invention will be described with reference to the accompanying drawings.

  First, a light emitting device according to an embodiment of the present invention will be described with reference to FIGS. FIG. 33 is a plan view for explaining the electrode arrangement of the light emitting device applied to the light emitting device package according to the embodiment of the present invention, and FIG. 34 is a cross-sectional view taken along line FF of the light emitting device shown in FIG. .

  On the other hand, for easy understanding, only the relative positional relationship between the first electrode 127 and the second electrode 128 is conceptually illustrated in FIG. The first electrode 127 may include a first pad electrode 121 and a first branch electrode 125. The second electrode 128 may include a second pad electrode 122 and a second branch electrode 126.

  The light emitting device according to the embodiment may include a semiconductor structure 123 disposed on a substrate 124 as illustrated in FIGS. 33 and 34.

The substrate 124 is selected from the group including sapphire substrate (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, and Ge. For example, the substrate 124 is provided as a PSS (Patterned Sapphire Substrate) having an uneven pattern formed on the upper surface.

  The semiconductor structure 123 may include a first conductive semiconductor layer 123a, an active layer 123b, and a second conductive semiconductor layer 123c. The active layer 123b is disposed between the first conductive semiconductor layer 123a and the second conductive semiconductor layer 123c. For example, the active layer 123b is disposed on the first conductive semiconductor layer 123a, and the second conductive semiconductor layer 123c is disposed on the active layer 123b.

  According to an embodiment, the first conductive semiconductor layer 123a is provided as an n-type semiconductor layer, and the second conductive semiconductor layer 123c is provided as a p-type semiconductor layer. Of course, according to another embodiment, the first conductive semiconductor layer 123a may be provided as a p-type semiconductor layer, and the second conductive semiconductor layer 123c may be provided as an n-type semiconductor layer.

  The light emitting device according to the embodiment may include a first electrode 127 and a second electrode 128 as illustrated in FIGS. 33 and 34.

  The first electrode 127 may include a first pad electrode 121 and a first branch electrode 125. The first electrode 127 is electrically connected to the second conductive semiconductor layer 123c. The first branch electrode 125 is branched from the first pad electrode 121. The first branch electrode 125 may include a plurality of branch electrodes branched from the first pad electrode 121.

  The second electrode 128 may include a second pad electrode 122 and a second branch electrode 126. The second electrode 128 is electrically connected to the first conductive semiconductor layer 123a. The second branch electrode 126 is branched from the second pad electrode 122. The second branch electrode 126 may include a plurality of branch electrodes branched from the second pad electrode 122.

  The first branch electrode 125 and the second branch electrode 126 may be alternately arranged in a finger shape. The first branch electrode 125 and the second branch electrode 126 provide power supplied through the first pad electrode 121 and the second pad electrode 122 by being diffused throughout the semiconductor structure 123.

  The first electrode 127 and the second electrode 128 may be formed in a single layer or a multilayer structure. For example, the first electrode 127 and the second electrode 128 may be ohmic electrodes. For example, the first electrode 127 and the second electrode 128 include ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, and Ni / IrOx / Au / ITO, Ag, Ni, Cr, Ti, It can be made of at least one of Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, and Hf, or an alloy of two or more of these substances.

  Meanwhile, a protective layer may be further provided on the semiconductor structure 123. The protective layer is provided on the upper surface of the semiconductor structure 123. In addition, the protective layer may be provided on a side surface of the semiconductor structure 123. The protective layer is provided such that the first pad electrode 121 and the second pad electrode 122 are exposed. In addition, the protective layer is selectively provided around and on the lower surface of the substrate 124.

For example, the protective layer is provided from an insulating material. For example, the protective layer is formed of at least one material selected from the group including Si _x O _y , SiO _x N _y , Si _x N _y , and Al _x O _y .

  In the light emitting device according to the embodiment, the light generated from the active layer 123b can emit light in the six plane directions of the light emitting device. Light generated from the active layer 123b is emitted in six directions through the top, bottom, and four side surfaces of the light emitting device.

  The light emitted to the upper surface of the light emitting element enters the recess R region described with reference to FIGS.

  For reference, the arrangement direction of the light emitting elements described with reference to FIGS. 1 to 32 and the arrangement direction of the light emitting elements shown in FIGS. 33 and 34 are shown opposite to each other.

  1 to 32, the light emitted between the first pad electrode 121 and the second pad electrode 122 is applied to the adhesive 130 disposed in the recess R region. Incident. The light emitted in the lower direction of the light emitting device is diffused by the adhesive 130, and the light extraction efficiency is improved.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

For example, the width of the first pad electrode 121 in the long axis direction of the light emitting element is provided to several tens of μm. The width of the first pad electrode 121 may be 70 μm to 90 μm, for example. In addition, the area of the first pad electrode 121 may be several thousand μm ² .

Further, the width of the second pad electrode 122 in the major axis direction of the light emitting element is provided to several tens of μm. For example, the width of the second pad electrode 122 is 70 μm to 90 μm. Further, the area of the second pad electrode 122 is provided to several thousand μm ² .

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Accordingly, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package, thereby improving light extraction efficiency.

  Meanwhile, the light emitting device package according to the embodiment described above has been described based on the case where the first and second pad electrodes 121 and 122 are in direct contact with the first and second conductive layers 321 and 322.

  However, according to another example of the light emitting device package according to the embodiment, a separate conductive structure is provided between the first and second pad electrodes 121 and 122 and the first and second conductive layers 321 and 322. Elements may be further arranged.

  Next, still another example of the light emitting device package according to the embodiment will be described with reference to FIG.

  In the description of the light emitting device package according to the embodiment with reference to FIG. 35, the description overlapping the contents described with reference to FIGS. 1 to 34 may be omitted.

  The light emitting device package 200 according to the embodiment may include a package body 110 and a light emitting device 120 as shown in FIG.

  The package body 110 may include a first frame 111 and a second frame 112. The first frame 111 and the second frame 112 are spaced apart from each other.

  The package body 110 may include a body 113. The main body 113 is disposed between the first frame 111 and the second frame 112. The main body 113 can function as a kind of electrode separation line. The main body 113 can also be referred to as an insulating member.

  The main body 113 is disposed on the first frame 111. The main body 113 is disposed on the second frame 112.

  The main body 113 may provide an inclined surface disposed on the first frame 111 and the second frame 112. A cavity C is provided on the first frame 111 and the second frame 112 by the inclined surface of the main body 113.

  According to an embodiment, the package body 110 may be provided with a structure having a cavity C, or may be provided with a structure having a flat upper surface without the cavity C.

For example, the main body 113 is made of PPA (Polyphthalamide), PCT (Polychloro Triphenyl), LCP (Liquid Crystal Polymer), PA9T (Polyamide 9T), silicone, EMC (Epoxy Molding Compound), SMC (Silicone Molding Compound), ceramic, PSG. (photo sensitive glass), sapphire (Al ₂ O ₃ ), or the like. The main body 113 may include a high refractive filler such as TiO ₂ and SiO ₂ .

  According to the embodiment, the light emitting device 120 may include a first pad electrode 121, a second pad electrode 122, a semiconductor structure 123, and a substrate 124.

  The light emitting device 120 may include the semiconductor structure 123 disposed under the substrate 124, as shown in FIG. The first pad electrode 121 and the second pad electrode 122 are disposed between the semiconductor structure 123 and the main body 113.

  The semiconductor structure 123 may include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer. The first pad electrode 121 is electrically connected to the first conductive semiconductor layer. The second pad electrode 122 is electrically connected to the second conductive semiconductor layer.

  The light emitting device 120 is disposed on the package body 110. The light emitting device 120 is disposed on the first frame 111 and the second frame 112. The light emitting device 120 is disposed in the cavity C provided by the package body 110.

  The first pad electrode 121 is disposed on the lower surface of the light emitting device 120. The second pad electrode 122 is disposed on the lower surface of the light emitting device 120. The first pad electrode 121 and the second pad electrode 122 are spaced apart from each other on the lower surface of the light emitting device 120.

  The first pad electrode 121 is disposed on the first frame 111. The second pad electrode 122 is disposed on the second frame 112.

  The first pad electrode 121 is disposed between the semiconductor structure 123 and the first frame 111. The second pad electrode 122 is disposed between the semiconductor structure 123 and the second frame 112.

  Meanwhile, the light emitting device package 200 according to the embodiment may include a first opening TH1 and a second opening TH2, as shown in FIG. The first frame 111 may include the first opening TH1. The second frame 112 may include the second opening TH2.

  The first opening TH1 is provided in the first frame 111. The first opening TH1 is provided through the first frame 111. The first opening TH1 is provided through the upper and lower surfaces of the first frame 111 in the first direction.

  The first opening TH1 is disposed under the first pad electrode 121 of the light emitting device 120. The first opening TH <b> 1 is provided to overlap the first pad electrode 121 of the light emitting device 120. The first opening TH1 is provided to overlap the first pad electrode 121 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the first frame 111.

  The second opening TH2 is provided in the second frame 112. The second opening TH2 is provided through the second frame 112. The second opening TH2 is provided through the upper surface and the lower surface of the second frame 112 in the first direction.

  The second opening TH2 is disposed under the second pad electrode 122 of the light emitting device 120. The second opening TH <b> 2 is provided to overlap the second pad electrode 122 of the light emitting device 120. The second opening TH2 is provided to overlap the second pad electrode 122 of the light emitting device 120 in a first direction from the upper surface to the lower surface of the second frame 112.

  The first opening TH1 and the second opening TH2 are spaced apart from each other. The first opening TH1 and the second opening TH2 are spaced apart from each other under the lower surface of the light emitting device 120.

  According to the embodiment, the width W1 of the upper region of the first opening TH1 is provided larger than the width of the first pad electrode 121. In addition, the width of the upper region of the second opening TH2 is provided larger than the width of the second pad electrode 122.

  The light emitting device package 200 according to the embodiment may include a first conductor 221 and a second conductor 222 as illustrated in FIG. In addition, the light emitting device package 200 according to the embodiment may include a first conductive layer 321 and a second conductive layer 322. The first conductive layer 321 is spaced apart from the second conductive layer 322.

  The first conductor 221 is disposed under the first pad electrode 121. The first conductor 221 is electrically connected to the first pad electrode 121. The first conductor 221 is disposed to overlap the first pad electrode 121 in the first direction.

  The first conductor 221 is provided in the first opening TH1. The first conductor 221 is disposed between the first pad electrode 121 and the first conductive layer 321. The first conductor 221 is electrically connected to the first pad electrode 121 and the first conductive layer 321.

  The lower surface of the first conductor 221 is disposed lower than the upper surface of the first opening TH1. The lower surface of the first conductor 221 is disposed lower than the upper surface of the first conductive layer 321.

  The first conductor 221 is disposed on the first opening TH1. In addition, the first conductor 221 extends from the first pad electrode 121 to the inside of the first opening TH1.

  The second conductor 222 is disposed under the second pad electrode 122. The second conductor 222 is electrically connected to the second pad electrode 122. The second conductor 222 is disposed to overlap the second pad electrode 122 in the first direction.

  The second conductor 222 is provided in the second opening TH2. The second conductor 222 is disposed between the second pad electrode 122 and the second conductive layer 322. The second conductor 222 is electrically connected to the second pad electrode 122 and the second conductive layer 322.

  The lower surface of the second conductor 222 is disposed lower than the upper surface of the second opening TH2. The lower surface of the second conductor 222 is disposed lower than the upper surface of the second conductive layer 322.

  The second conductor 222 is disposed on the second opening TH2. The second conductor 222 is disposed to extend from the second pad electrode 122 to the inside of the second opening TH2.

  According to the embodiment, the first conductive layer 321 is disposed on the lower surface and the side surface of the first conductor 221. The first conductive layer 321 is disposed in direct contact with the lower and side surfaces of the first conductor 221.

  The first conductive layer 321 is provided in the first opening TH1. The first conductive layer 321 is disposed under the first pad electrode 121. The width of the first conductive layer 321 may be larger than the width of the first pad electrode 121.

  As described above, according to the light emitting device package 200 according to the embodiment, the first conductor 221 provides more stable electrical coupling between the first conductive layer 321 and the first pad electrode 121.

  In addition, according to the embodiment, the second conductive layer 322 is disposed on the lower surface and the side surface of the second conductor 222. The second conductive layer 322 is disposed in direct contact with the lower and side surfaces of the second conductor 222.

  The second conductive layer 322 is provided in the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The width of the second conductive layer 322 may be larger than the width of the second pad electrode 122.

  As described above, according to the light emitting device package 200 according to the embodiment, the second conductor 222 provides more stable electrical coupling between the second conductive layer 322 and the second pad electrode 122.

  For example, the first and second conductors 221 and 222 are stably bonded to the first and second pad electrodes 121 and 122 through separate bonding materials, respectively. The side surfaces and the lower surface of the first and second conductors 221 and 222 are in contact with the first and second conductive layers 321 and 322, respectively. Therefore, the first and second conductive layers 321 and 322 are in contact with the lower surfaces of the first and second pad electrodes 121 and 122, respectively, compared with the case where the first and second conductive layers 321 and 322 are in direct contact with the first and second pad electrodes 121 and 122, respectively. In addition, the area in contact with each of the second conductors 221 and 222 is increased. Accordingly, power is stably supplied from the first and second conductive layers 321 and 322 to the first and second pad electrodes 121 and 122 through the first and second conductors 221 and 222, respectively. .

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. .

  In addition, the first and second conductors 221 and 222 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, and the like, or an alloy thereof. However, the present invention is not limited to this, and the first and second conductors 221 and 222 may be made of a material that can ensure a conductive function.

  In addition, the light emitting device package 100 according to the embodiment may include an adhesive 130.

  The adhesive 130 is disposed between the main body 113 and the light emitting device 120. The adhesive 130 is disposed between the upper surface of the main body 113 and the lower surface of the light emitting device 120.

  In addition, the light emitting device package 100 according to the embodiment may include a recess R as illustrated in FIG.

  The recess R is provided in the main body 113. The recess R is provided between the first opening TH1 and the second opening TH2. The recess R is provided so as to be recessed from the upper surface of the main body 113 toward the lower surface. The recess R is disposed under the light emitting device 120. The recess R is provided to overlap the light emitting device 120 in the first direction.

  For example, the adhesive 130 is disposed in the recess R. The adhesive 130 is disposed between the light emitting device 120 and the main body 113. The adhesive 130 is disposed between the first pad electrode 121 and the second pad electrode 122. For example, the adhesive 130 is disposed in contact with the side surface of the first pad electrode 121 and the side surface of the second pad electrode 122.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the package body 110. The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may include at least one of an epoxy-based material, a silicone-based material, and a hybrid material including an epoxy-based material and a silicone-based material. . For example, when the adhesive 130 includes a reflective function, the adhesive may include white silicone. The adhesive 130 may be referred to as a first resin as another expression.

The adhesive 130 can provide a stable fixing force between the main body 113 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, the light emitting device 120 and the main body. 113 can provide a light diffusion function. When light is emitted from the light emitting device 120 to the lower surface of the light emitting device 120, the adhesive 130 provides a light diffusing function, so that the light extraction efficiency of the light emitting device package 100 can be improved. Further, the adhesive 130 can reflect light emitted from the light emitting device 120. When the adhesive 130 includes a reflective function, the adhesive 130 is made of a material including TiO ₂ , silicone, and the like.

  According to an embodiment, the depth T1 of the recess R is provided smaller than the depth T2 of the first opening TH1 or the depth T2 of the second opening TH2.

  The depth T1 of the recess R is determined in consideration of the adhesive force of the adhesive 130. In addition, the depth T1 of the recess R is determined in consideration of a stable strength of the main body 113 and / or a crack is not generated in the light emitting device package 100 due to heat released from the light emitting device 120. To be determined.

  The recess R may provide a proper space under the light emitting device 120 in which a kind of underfill process can be performed. Here, the underfill process is a process of disposing the adhesive 130 under the light emitting device 120 after the light emitting device 120 is mounted on the package body 110, or the light emitting device 120 is disposed in the package body. 110 is a step of disposing the light emitting device 120 after disposing the adhesive 130 in the recess R for mounting via the adhesive 130.

  The depth T1 and the width W4 of the recess R may affect the formation position and fixing force of the adhesive 130. The depth T1 and the width W4 of the recess R are determined so that a sufficient fixing force is provided by the adhesive 130 disposed between the main body 113 and the light emitting device 120.

  For example, the depth T1 of the recess R is provided to several tens of μm. The depth T1 of the recess R is provided to 40 μm to 60 μm.

  The width R4 of the recess R is provided from several tens of μm to several hundreds of μm. Here, the width R 4 of the recess R is provided in the long axis direction of the light emitting device 120.

  A width W4 of the recess R is provided to be narrower than an interval between the first pad electrode 121 and the second pad electrode 122. A width W4 of the recess R may be provided several hundred μm larger than the width or diameter of the first and second pad electrodes 121 and 122. For example, the width R4 of the recess R is provided in the range of 300 μm to 400 μm.

  The depth T2 of the first opening TH1 is provided corresponding to the thickness of the first frame 111. The depth T2 of the first opening TH1 is provided to a thickness that can maintain a stable strength of the first frame 111.

  The depth T2 of the second opening TH2 is provided corresponding to the thickness of the second frame 112. The depth T2 of the second opening TH2 is provided to a thickness that can maintain a stable strength of the second frame 112.

  The depth T2 of the first opening TH1 and the depth T2 of the second opening TH2 are provided corresponding to the thickness of the main body 113. The depth T2 of the first opening TH1 and the depth T2 of the second opening TH2 are provided with thicknesses that can maintain a stable strength of the main body 113.

  For example, the depth T2 of the first opening TH1 is provided to several hundred μm. The first opening TH1 has a depth T2 of 180 μm to 220 μm. For example, the depth T2 of the first opening TH1 is provided to 200 μm.

  For example, the thickness of T2-T1 is selected to be at least 100 μm. This is because the thickness of the injection process that can provide crack free of the main body 113 is taken into consideration.

  According to an embodiment, the ratio of T1 thickness to T2 thickness (T2 / T1) is provided between 2-10. For example, when the thickness of T2 is provided to 200 μm, the thickness of T1 is provided to 20 μm to 100 μm.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  In addition, according to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is such that the first conductor 221 and the second conductor 222 are stably disposed. The upper surface area of the substrate 124 is set to 0.7% or more.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  In addition, the light emitting device package 200 according to the embodiment may include a molding unit 140 as illustrated in FIG.

  The molding part 140 is provided on the light emitting device 120. The molding unit 140 is disposed on the first frame 111 and the second frame 112. The molding part 140 is disposed in a cavity C provided by the package body 110.

  The molding part 140 may include an insulating material. In addition, the molding unit 140 may include wavelength conversion means that receives light emitted from the light emitting device 120 and provides wavelength-converted light. For example, the molding unit 140 may include at least one selected from the group including phosphors, quantum dots, and the like.

  In addition, the light emitting device package 200 according to the embodiment may include a first lower recess R10 and a second lower recess R20, as shown in FIG. The first lower recess R10 and the second lower recess R20 are spaced apart from each other.

  The first lower recess R <b> 10 is provided on the lower surface of the first frame 111. The first lower recess R10 is provided so as to be recessed from the lower surface of the first frame 111 in the upper surface direction. The first lower recess R10 is spaced apart from the first opening TH1.

  The first lower recess R10 is provided with a width of several μm to several tens of μm. A resin part is provided in the first lower recess R10. The resin portion filled in the first lower recess R10 is provided from the same material as the main body 113, for example.

  However, the present invention is not limited to this, and the resin portion is provided by being selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion is provided by being selected from materials having a low surface tension with the first and second conductive layers 321 and 322.

  For example, the resin portion filled in the first lower recess R10 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  The resin portion filled in the first lower recess R10 is disposed around the lower surface region of the first frame 111 that provides the first opening TH1. The lower surface region of the first frame 111 providing the first opening TH1 is disposed in a kind of island shape separately from the lower surface forming the surrounding first frame 111.

  Therefore, the resin part has a poor adhesion or wettability with the first and second conductive layers 321 and 322 or a surface tension between the resin part and the first and second conductive layers 321 and 322. When the first conductive layer 321 provided in the first opening TH1 is removed from the first opening TH1, the resin portion or the main body 113 filled in the first lower recess R10 is disposed when the material is disposed with a low material. It is prevented from spreading beyond.

  This is because the adhesive relationship between the first conductive layer 321 and the resin portion and the main body 113 or wettability between the resin portion and the first and second conductive layers 321 and 322, surface tension, etc. are not good. It is used. That is, the material forming the first conductive layer 321 is selected to have good adhesive properties with the first frame 111. The material forming the first conductive layer 321 is selected so as to have poor adhesive properties with the resin portion and the main body 113.

  Accordingly, the first conductive layer 321 overflows from the first opening TH1 toward the region where the resin portion or the main body 113 is provided, and overflows outside the region where the resin portion or the main body 113 is provided. Diffusion is prevented, and the first conductive layer 321 is stably disposed in a region where the first opening TH1 is provided. Therefore, when the first conductive layer 321 disposed in the first opening TH1 overflows, the first conductive layer 321 extends to an outer region of the first lower recess R10 where the resin portion or the main body 113 is provided. This can be prevented. In addition, the first conductive layer 321 is stably connected to the lower surface of the first pad electrode 121 in the first opening TH1.

  Therefore, when the light emitting device package is mounted on the circuit board, the first conductive layer 321 and the second conductive layer 322 can be prevented from being in contact with each other and short-circuited, and the first and second conductive layers 321 can be prevented. In the step of disposing 322, the amount of the first and second conductive layers 321 and 322 can be easily controlled.

  In addition, the first conductive layer 321 is disposed to extend from the first opening TH1 to the first lower recess R10. Accordingly, the first conductive layer 321 and / or the resin portion is disposed in the first lower recess R10.

  In addition, the second lower recess R <b> 20 is provided on the lower surface of the second frame 112. The second lower recess R20 is provided so as to be recessed from the lower surface of the second frame 112 in the upper surface direction. The second lower recess R20 is spaced apart from the second opening TH2.

  The second lower recess R20 is provided with a width of several μm to several tens of μm. A resin part is provided in the second lower recess R20. The resin part filled in the second lower recess R20 is provided from the same material as the main body 113, for example.

  However, the present invention is not limited to this, and the resin portion is provided by being selected from materials having poor adhesion and wettability with the first and second conductive layers 321 and 322. Alternatively, the resin portion is provided by being selected from materials having a low surface tension with the first and second conductive layers 321 and 322.

  For example, the resin portion filled in the second lower recess R20 is provided in a process in which the first frame 111, the second frame 112, and the main body 113 are formed by an injection process or the like.

  The resin portion filled in the second lower recess R20 is disposed around the lower surface region of the second frame 112 that provides the second opening TH2. The lower surface region of the second frame 112 providing the second opening TH2 is disposed in a kind of island shape separately from the lower surface forming the surrounding second frame 112.

  Therefore, the resin part has a poor adhesion or wettability with the first and second conductive layers 321 and 322 or a surface tension between the resin part and the first and second conductive layers 321 and 322. When the second conductive layer 322 provided to the second opening TH2 is removed from the second opening TH2, the resin portion or the main body 113 filled in the second lower recess R20 is disposed when the low-substance material is disposed. It is prevented from spreading beyond.

  This is because the adhesion between the second conductive layer 322 and the resin part and the main body 113 or the wettability between the resin part and the first and second conductive layers 321 and 322, surface tension, etc. are not good. It is used. That is, the material forming the second conductive layer 322 is selected to have good adhesive properties with the second frame 112. The material forming the second conductive layer 322 is selected so as to have poor adhesive properties with the resin portion and the main body 113.

  Accordingly, the second conductive layer 322 overflows from the second opening TH2 toward the region where the resin portion or the main body 113 is provided, and overflows outside the region where the resin portion or the main body 113 is provided. The diffusion is prevented, and the second conductive layer 322 is stably disposed in the region where the second opening TH2 is provided. Therefore, when the second conductive layer 322 disposed in the second opening TH2 overflows, the second conductive layer 322 extends to an outer region of the second lower recess R20 provided with the resin portion or the main body 113. This can be prevented. In addition, the second conductive layer 322 is stably connected to the lower surface of the second pad electrode 122 in the second opening TH2.

  Therefore, when the light emitting device package is mounted on the circuit board, the first conductive layer 321 and the second conductive layer 322 can be prevented from being in contact with each other and short-circuited, and the first and second conductive layers 321 can be prevented. In the step of disposing 322, the amount of the first and second conductive layers 321 and 322 can be easily controlled.

  In addition, the second conductive layer 322 is disposed to extend from the second opening TH2 to the second lower recess R20. Therefore, the second conductive layer 321 and / or the resin portion is disposed in the second lower recess R20.

  In addition, the light emitting device package 200 according to the embodiment may include a resin portion 135 as illustrated in FIG.

  The resin part 135 is disposed between the first frame 111 and the light emitting device 120. The resin part 135 is disposed between the second frame 112 and the light emitting device 120. The resin part 135 is provided on the bottom surface of the cavity C provided in the package body 110.

  The resin part 135 is disposed on a side surface of the first pad electrode 121. The resin part 135 is disposed on a side surface of the second pad electrode 122. The resin part 135 is disposed under the semiconductor structure 123.

For example, the resin part 135 may include at least one of an epoxy material, a silicone material, and a hybrid material including an epoxy material and a silicone material. . The resin part 135 may be a reflective part that reflects light emitted from the light emitting device 120, and may be made of a resin containing a reflective material such as TiO ₂ or white silicone. ).

  The resin part 135 may be disposed under the light emitting device 120 to perform a sealing function. In addition, the resin portion 135 can improve the adhesive force between the light emitting device 120 and the first frame 111. The resin part 135 can improve the adhesive force between the light emitting device 120 and the second frame 112.

  The resin part 135 may seal the periphery of the first pad electrode 121 and the second pad electrode 122. In the resin part 135, the first conductive layer 321 and the second conductive layer 322 diffuse out of the first opening TH1 region and the second opening TH2 region toward the outer surface of the light emitting device 120. It can be prevented from moving. When the first and second conductive layers 321 and 322 are diffused and moved in the outer surface direction of the light emitting device 120, the first and second conductive layers 321 and 322 are in contact with the active layer of the light emitting device 120. May cause failure due to short circuit. Therefore, when the resin part 135 is disposed, a short circuit due to the first and second conductive layers 321 and 322 and the active layer can be prevented, and the reliability of the light emitting device package according to the embodiment can be improved. it can.

  In addition, according to the embodiment, a protective layer may be provided on and around the lower surface of the light emitting device 120. In such a case, since an insulating protective layer is provided on the surface of the active layer, the first and second conductive layers 321 and 322 are diffused and moved in the direction of the outer surface of the light emitting device 120. In addition, the first and second conductive layers 321 and 322 can be prevented from being electrically connected to the active layer of the light emitting device 120.

  On the other hand, even when an insulating protective layer is disposed on and around the lower surface of the light emitting device 120, the insulating protective layer is not disposed on the upper side surface of the light emitting device 120 or around the substrate 124. There is also. At this time, when the substrate 124 is provided from a conductive material, if the first and second conductive layers 321 and 322 are in contact with the upper side surface of the light emitting device 120 or the substrate 124, a defect due to a short circuit occurs. May occur. Therefore, when the resin part 135 is disposed, it is possible to prevent a short circuit due to the first and second conductive layers 321 and 322 and the upper side surface of the light emitting element 120 or the substrate 124, which is related to the embodiment. The reliability of the light emitting device package can be improved.

  In addition, when the resin part 135 includes a material having reflective properties such as white silicone, the resin part 135 reflects light provided from the light emitting element 120 toward the upper part of the package body 110 to emit light. The light extraction efficiency of the element package 100 can be improved.

  Meanwhile, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the molding part 140 is in direct contact with the first frame 111 and the second frame 112. It may be arranged to do.

  In addition, according to another example of the light emitting device package according to the embodiment of the present invention, the resin part 135 is not provided separately, and the adhesive 130 is disposed around the first and second pad electrodes 121 and 122. It may be arranged.

  At this time, the adhesive 130 may be referred to as a first resin, and the first and second pad electrodes 121 and 122 may be referred to as first and second bonding portions, respectively.

  Meanwhile, the adhesive 130 may be disposed in an upper region of the first and second openings TH1 and TH2. In the process in which the light emitting device 120 is provided on the package body 110, a part of the adhesive 130 may move to the first and second openings TH1 and TH2. A part of the adhesive 130 is disposed in a side region of the first and second pad electrodes 121 and 122 inside the first and second openings TH1 and TH2. A part of the adhesive 130 may be disposed on the first and second conductive layers 321 and 322 inside the first and second openings TH1 and TH2. Further, a part of the adhesive 130 may be disposed on the side surfaces of the first and second conductors 221 and 222 inside the first and second openings TH1 and TH2.

  The adhesive 130 can seal the upper regions of the first and second openings TH1 and TH2, and moisture or foreign substances can be emitted from the outside through the first and second openings TH1 and TH2. It is possible to prevent the element 120 from flowing into a region where the element 120 is disposed.

  In addition, the recess R may not be provided on the upper surface of the package body 110 when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the package body 110 can be secured.

  In the light emitting device package 200 according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Are concatenated.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the package body 110.

  Meanwhile, the light emitting device package 200 according to the embodiment described above may be supplied after being mounted on a submount or a circuit board.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Accordingly, even when the light emitting device package 200 according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur. There is an advantage that does not deteriorate.

  Further, according to the light emitting device package 200 and the light emitting device package manufacturing method according to the embodiment, it is not necessary to expose the package body 110 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the package body 110 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to be 10% or less based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, in order to secure a light emitting area emitted from the light emitting device and increase light extraction efficiency, the sum of the areas of the first and second pad electrodes 121 and 122 is the substrate 124. The upper surface area is set to 10% or less.

  In addition, according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is provided to 0.7% or more based on the upper surface area of the substrate 124. According to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is the upper surface area of the substrate 124 in order to provide a stable bonding force to the mounted light emitting device. Is set to 0.7% or more with reference to.

  In addition, according to the light emitting device package according to the embodiment, the sum of the areas of the first and second pad electrodes 121 and 122 is such that the first conductor 221 and the second conductor 222 are stably disposed. The upper surface area of the substrate 124 is set to 0.7% or more.

  According to the embodiment, the area where the adhesive 130 overlaps the light emitting device 120 with respect to the first direction is the first and second openings TH1 and TH2 and the first and second pad electrodes 121 and 122. Is provided larger than the area of the overlapping region.

  As described above, since the first and second pad electrodes 121 and 122 are provided with a small area, the amount of light transmitted to the lower surface of the light emitting device 120 is increased. Also, the adhesive 130 having excellent reflection characteristics is provided under the light emitting device 120. Therefore, the light emitted in the lower direction of the light emitting device 120 is reflected by the adhesive 130 and is effectively emitted in the upper direction of the light emitting device package 100, thereby improving the light extraction efficiency.

  On the other hand, the light emitting device package according to the embodiment described above can be applied to a light source device.

  The light source device can include a display device, a lighting device, a headlamp, and the like depending on the industrial field.

  As an example of a light source device, a display device includes a bottom cover, a reflecting plate disposed on the bottom cover, a light emitting module that emits light and includes a light emitting element, and is disposed in front of the reflecting plate and emits light from the light emitting module. A light guide plate for guiding the light to be forwarded, an optical sheet including a prism sheet disposed in front of the light guide plate, a display panel disposed in front of the optical sheet, and an image connected to the display panel. An image signal output circuit for supplying a signal and a color filter disposed in front of the display panel may be included. Here, the bottom cover, the reflection plate, the light emitting module, the light guide plate, and the optical sheet can constitute a backlight unit. The display device may have a structure in which light emitting elements that do not include a color filter and emit red, green, and blue light are arranged.

  As another example of a light source device, a headlamp includes a light emitting module including a light emitting element package disposed on a substrate, a reflector that reflects light emitted from the light emitting module in a certain direction, for example, a front, and a reflector. Includes a lens that refracts the reflected light forward, and a shade that blocks or reflects a portion of the light reflected by the reflector toward the lens to produce the light distribution pattern desired by the designer Can do.

  An illumination device, which is another example of the light source device, can include a cover, a light source module, a radiator, a power supply unit, an inner case, and a socket. In addition, the light source device according to the embodiment may further include any one or more of a member and a holder. The light source module may include a light emitting device package according to an embodiment.

  Meanwhile, the light emitting device package according to the embodiment described above may include various modifications.

  Hereinafter, modifications of the light emitting device package according to the embodiment will be described with reference to the drawings. Each modification can be applied to the embodiment of the light emitting device package described above. Moreover, you may apply each modification demonstrated below in combination with a some modification within the range which does not mutually collide.

  First, another example of the light emitting device package according to the embodiment of the present invention will be described with reference to FIG. In the description of the light emitting device package according to the embodiment with reference to FIG. 36, the description overlapping with the contents described above may be omitted.

  The light emitting device package according to the embodiment may include a main body 113 and a light emitting device 120. The main body 113 may include first and second openings TH1 and TH2. The light emitting device 120 may include first and second pad electrodes 121 and 122.

  The first and second pad electrodes 121 and 122 are electrically connected to the first and second semiconductor layers of the light emitting device 120, respectively, and may be referred to as first and second bonding parts, respectively.

  The first and second pad electrodes 121 and 122 may include protrusions 121a and 122a, respectively. For example, the first and second pad electrodes 121 and 122 may include protrusions 121a and 122a extending downward in the first and second openings TH1 and TH2, respectively. The protrusions 121a and 122a of the first and second pad electrodes 121 and 122 are disposed in the first and second openings TH1 and TH2, respectively.

  The lower surface of the protrusion 121a of the first pad electrode 121 is disposed lower than the upper surface of the first opening TH1. The lower surface of the protrusion 122a of the second pad electrode 122 is disposed lower than the upper surface of the second opening TH2.

  The protrusions 121a and 122a of the first and second pad electrodes 121 and 122 are provided in a columnar shape or a polygonal column shape, for example. The shapes of the first and second pad electrodes 121 and 122 are selected according to the shape of the upper region of the first and second openings TH1 and TH2. The protrusions 121a and 122a of the first and second pad electrodes 121 and 122 may have a width or diameter smaller than the width or diameter of the upper region of the first and second openings TH1 and TH2.

  The light emitting device package according to the embodiment may include first and second conductive layers 321 and 322. The first conductive layer 321 is spaced apart from the second conductive layer 322. The first and second conductive layers 321 and 322 are spaced apart from each other on the lower surface of the main body 113.

  The first region on the upper surface of the first conductive layer 321 is disposed under the first opening TH1. The first region on the upper surface of the first conductive layer 321 is disposed to overlap the first opening TH1 in the vertical direction. The first conductive layer 321 is disposed under the first pad electrode 121. The first conductive layer 321 is disposed around the protrusion 121 a of the first pad electrode 121.

  The second region on the upper surface of the first conductive layer 321 is disposed under the lower surface of the main body 113. The second region on the upper surface of the first conductive layer 321 is disposed to overlap the lower surface of the main body 113 in the vertical direction. For example, the upper surface of the first conductive layer 321 may be coupled to the lower surface of the main body 113 via an adhesive resin.

  The first region on the upper surface of the second conductive layer 322 is disposed under the second opening TH2. The first region on the upper surface of the second conductive layer 322 is disposed so as to overlap with the second opening TH2. The second conductive layer 322 is disposed under the second pad electrode 122. The second conductive layer 322 is disposed around the protrusion 122 a of the second pad electrode 122.

  The second region on the upper surface of the second conductive layer 322 is disposed below the lower surface of the main body 113. The second region on the upper surface of the second conductive layer 322 is disposed to overlap the lower surface of the main body 113 in the vertical direction. For example, the upper surface of the second conductive layer 322 may be coupled to the lower surface of the main body 113 via an adhesive resin.

  The first conductive layer 321 and the second conductive layer 322 may include one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited to this, and a material that can ensure a conductive function can be used for the first conductive layer 321 and the second conductive layer 322.

  For example, the first conductive layer 321 and the second conductive layer 322 are formed using a conductive paste. The conductive paste may include solder paste, silver paste, and the like, and may be configured as a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. . For example, the first conductive layer 321 and the second conductive layer 322 may include a SAC (Sn—Ag—Cu) material.

  The first and second conductive layers 321 and 322 are extended to the end of the side wall of the main body 113.

  The first and second conductive layers 321 and 322 may provide a kind of lead frame function. The first and second conductive layers 321 and 322 are electrically connected to the first and second pad electrodes 121 and 122, respectively.

  In addition, the light emitting device package according to the embodiment may include an adhesive 130. The adhesive can be referred to as a first resin as described above.

  The adhesive 130 can provide a stable fixing force between the light emitting device 120 and the main body 113. The adhesive 130 is disposed in direct contact with the upper surface of the main body 113, for example. In addition, the adhesive 130 is disposed in direct contact with the lower surface of the light emitting device 120.

  For example, the adhesive 130 may be moved around the first and second pad electrodes 121 and 122 and below the light emitting device 120. In addition, the adhesive 130 may be disposed inside the first and second openings TH1 and TH2.

  The adhesive 130 can seal the upper regions of the first and second openings TH1 and TH2, and moisture or foreign substances can be emitted from the outside through the first and second openings TH1 and TH2. It is possible to prevent the element 120 from flowing into a region where the element 120 is disposed. Further, the adhesive 130 can improve the fixing force between the light emitting device 120 and the main body 113.

  In addition, when a sufficient space for the adhesive 130 to be provided between the light emitting device 120 and the main body 113 can be secured, a recess may not be provided on the upper surface of the main body 113.

  The light emitting device package according to the embodiment may be supplied mounted on a submount or a circuit board. At this time, the first and second conductive layers 321 and 322 are electrically connected to first and second pad portions provided on a submount or a circuit board, respectively.

  In the light emitting device package according to the embodiment, a power source is connected to the first pad electrode 121 through the first opening TH1 region, and a power source is connected to the second pad electrode 122 through the second opening TH2 region. Connected.

  As a result, the light emitting device 120 is driven by the driving power supplied through the first pad electrode 121 and the second pad electrode 122. The light emitted from the light emitting device 120 is provided in the upper direction of the main body 113.

  Conventionally, when a light emitting device package is mounted on a submount or a circuit board, a high temperature process such as reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame provided in the light emitting device package and the light emitting device, and the stability of the electrical connection and the physical connection is improved. May weaken.

  However, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, the first pad electrode and the second pad electrode of the light emitting device according to the embodiment are driven through the conductive layer disposed in the opening. Power is provided. The melting point of the conductive layer disposed in the opening is selected to have a higher value than the melting point of a general bonding material.

  Accordingly, even when the light emitting device package according to the embodiment is bonded to the main substrate or the like through a reflow process, the re-melting phenomenon does not occur. There is an advantage not to deteriorate.

  Further, according to the light emitting device package and the method for manufacturing the light emitting device package according to the embodiment, it is not necessary to expose the main body 113 to a high temperature in the process of manufacturing the light emitting device package. Therefore, according to the embodiment, it is possible to prevent the main body 113 from being exposed to high temperature and being damaged or discoloration.

  As a result, the selection range for the substance constituting the main body 113 is increased. According to the embodiment, the main body 113 may be provided using not only an expensive material such as ceramic but also a relatively inexpensive resin material.

  For example, the main body 113 may include at least one substance selected from the group including PPA (PolyPhtalAmide) resin, PCT (PolyCyclohexylenedimethylene Terephthalate) resin, EMC (Epoxy Molding Compound) resin, and SMC (Silicone Molding Compound) resin. it can.

  On the other hand, the above description is based on the case where the main body 113 includes the cavity C. The light emitting device 120 is disposed in the cavity C. However, according to another embodiment, as shown in FIG. 37, the body 113 may be provided without a cavity. For example, the main body 113 may not include a cavity and may be provided with a flat top surface.

  The side surface of the main body 113 and the side surface of the first conductive layer 321 are provided on the same plane. In addition, the other side surface of the main body 113 and the side surface of the second conductive layer 322 are provided on the same plane.

  In the above description, the case where the first and second conductive layers 321 and 322 arranged on the lower surface of the main body 113 are extended to the side surface of the main body 113 is described as a reference. However, the first and second conductive layers 321 and 322 disposed on the lower surface of the main body 113 may not be extended to the side surface of the main body 113 and may be disposed only in a partial region of the lower surface of the main body 113. It may be arranged so as to overlap the cavity C in the vertical direction.

Meanwhile, the adhesive 130 is also disposed on the side surface of the light emitting device 120. This is because the adhesive 130 may rise along the side surface of the light emitting device 120 due to OH ⁻ provided on the surface of the light emitting device 120. At this time, if the thickness of the adhesive 130 provided on the side surface of the light emitting device 120 is too thick, the luminous intensity Po is lowered, and thus an appropriate thickness control is required. In addition, since the adhesive 130 is disposed on the side surface of the light emitting device 120, the adhesive 130 is provided with a double protective film structure to improve moisture resistance and to protect the light emitting device 120 from other contaminants.

  In addition, the adhesive 130 may be provided below and around the light emitting device 120 so that, for example, the adhesive 130 may be provided by a centrifugal separation method or the like. The adhesive 130 is applied to the main body 113, and the adhesive 130 is provided by diffusing to the lower and surrounding areas of the light emitting device 120 by a centrifugal separation method. As described above, when a centrifugal separation method or the like is applied, the reflective material included in the adhesive 130 settles in the lower region. Accordingly, only a kind of clear molding part is disposed on the side surface of the active layer of the light emitting device 120, and the reflective material is disposed in a region lower than the active layer of the light emitting device 120, thereby further improving the luminous intensity Po. Can do.

  Further, according to another embodiment, the adhesive 130 and the main body 113 may include the same material.

  In addition, according to the embodiment, by selecting physical properties of the adhesive 130 in consideration of CTE (Coefficient of Thermal Expansion) matching among the main body 113, the adhesive 130, and the light emitting device 120, thermal shock It is possible to improve the problem of cracks and delamination caused by the above.

  The features, structures, effects, and the like described in the above embodiments are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like exemplified in each embodiment can be implemented by combining or modifying another embodiment by those who have ordinary knowledge in the field to which the embodiment belongs. Accordingly, the contents relating to such combinations and modifications should be construed as being included in the scope of the embodiments.

  Although the embodiments have been described above, this is merely an example and is not intended to limit the embodiments. Anyone who has ordinary knowledge in the field to which the embodiments belong can be used. Various modifications and applications not described above may be made without departing from the above characteristics. For example, each of the components specifically shown in the embodiments can be modified and implemented, and the difference between such modifications and applications is within the scope of the embodiments set in the appended claims. Should be construed as included.

110 package body, 111 first frame, 112 second frame, 113 body, 120 light emitting element, 121 first pad electrode, 122 second pad electrode, 123 semiconductor structure, 125 first branch electrode, 126 second branch electrode, 127 1st electrode, 128 2nd electrode, 130 Adhesive, 135 Resin part, 140 Molding part, 221 1st conductor, 222 2nd conductor, 310 Circuit board, 311 1st pad, 312 2nd pad, 313 board , 321a first conductive layer, 321a first upper conductive layer, 321b first lower conductive layer, 322 second conductive layer, 322a second upper conductive layer, 322b second lower conductive layer, R recess, TH1 first opening, TH2 Second opening.

Claims (20)

A body including first and second openings penetrating the top and bottom surfaces;
A light emitting device disposed on the body and including first and second bonding portions;
First and second conductive layers disposed under the body and electrically connected to the first and second bonding parts, respectively;
Including
The light emitting device package according to claim 1, wherein the first and second bonding parts include protrusions extending downward from the first and second openings.   The light emitting device package according to claim 1, further comprising a resin disposed between the main body and the light emitting device.   3. The light emitting device package according to claim 1, wherein the protrusions of the first and second bonding portions are disposed in the first and second openings, respectively.   4. The light emitting device package according to claim 1, wherein a lower surface of the protruding portion of the first bonding portion is disposed lower than an upper surface of the first opening.   5. The light emitting device package according to claim 1, wherein the protruding portion of the first bonding portion is provided in a columnar shape or a polygonal column shape.   6. The light emitting device package according to claim 1, wherein shapes of the first and second bonding portions are provided corresponding to shapes of upper regions of the first and second openings. 6.   The light emitting device package according to any one of claims 1 to 6, wherein the first conductive layer and the second conductive layer are spaced apart from each other on the lower surface of the main body.   8. The light emitting device according to claim 1, wherein a width of the protruding portion of the first and second bonding portions is provided smaller than a width of an upper region of the first and second openings. package. A first region on an upper surface of the first conductive layer is disposed under the first opening;
9. The light emitting device package according to claim 1, wherein the second region of the upper surface of the first conductive layer is disposed under the lower surface of the main body.   10. The light emitting device package according to claim 9, wherein the first region on the upper surface of the first conductive layer is disposed so as to overlap with the first opening.   11. The light emitting device package according to claim 9, wherein the second region of the upper surface of the first conductive layer is disposed so as to overlap with the lower surface of the main body in a vertical direction.   The light emitting device package according to claim 1, wherein a partial region of the first conductive layer is disposed around the protruding portion of the first bonding portion.   The first and second bonding parts include Ti, Al, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Ag alloy, Au, Hf, Pt, Ru, Rh. And at least one substance selected from the group comprising Sn, Cu, ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, Ni / IrOx / Au / ITO, or an alloy thereof. The light emitting device package according to any one of 1 to 12.   The first and second conductive layers include at least one substance selected from the group including Ag, Au, Pt, Sn, Cu, and SAC (Sn-Ag-Cu) or an alloy thereof. The light emitting device package according to any one of the above.   The light emitting device package according to claim 2, wherein the resin includes white silicone.   The light emitting device package according to claim 2, wherein the resin is provided in direct contact with the upper surface of the main body and the lower surface of the light emitting device.   The light emitting device package according to claim 2, 15 or 16, wherein the resin is provided around the first and second bonding portions. The main body further includes a recess provided to be recessed from the upper surface of the main body toward the lower surface,
The light emitting device package according to claim 2, wherein the resin is provided in the recess.   The light emitting device package according to claim 1, wherein a side surface of the main body and a side surface of the first conductive layer are provided on the same plane.   The light emitting device package according to claim 1, wherein the upper surface of the main body is provided in a flat shape in an entire region.

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