KR20190093282A - Light emitting device package - Google Patents

Abstract

The present invention relates to a light emitting element package capable of increasing a manufacturing yield. According to an embodiment of the present invention, the light emitting element package comprises: a body including an upper surface, a lower surface, and first and second opening units passing through the upper surface and the lower surface; a light emitting element including first and second bonding units individually arranged in the first and second opening units; and first and second frames arranged in the first and second opening units and individually overlapping with the first and second bonding units in a vertical direction. The first frame can include a first part extending in a first direction from the upper surface of the body to the lower surface of the body, and a second part extending in a second direction vertical to the first direction to which the first part is extended.

Description

Light Emitting Device Package {LIGHT EMITTING DEVICE PACKAGE}

The embodiment relates to a semiconductor device package, a method of manufacturing a semiconductor device package, and a light source device.

A semiconductor device including a compound such as GaN, AlGaN, etc. has many advantages, such as having a wide and easy-to-adjust band gap energy, and can be used in various ways as a light emitting device, a light receiving device, and various diodes.

Particularly, light emitting devices such as light emitting diodes or laser diodes using group 3-5 or 2-6 compound semiconductor materials have been developed using thin film growth technology and device materials. There is an advantage that can implement light of various wavelength bands such as blue and ultraviolet. In addition, a light emitting device such as a light emitting diode or a laser diode using a group 3 to 5 or 2 to 6 group compound semiconductor material may implement a white light source having high efficiency by using a fluorescent material or combining colors. Such a light emitting device has advantages of low power consumption, semi-permanent life, fast response speed, safety and environmental friendliness compared to conventional light sources such as fluorescent lamps and incandescent lamps.

In addition, when a light-receiving device such as a photodetector or a solar cell is also fabricated using a Group 3-5 Group 2 or Group 6 compound semiconductor material, development of device materials absorbs light in various wavelength ranges to generate a photocurrent. As a result, light in various wavelengths can be used from gamma rays to radio wavelengths. In addition, such a light receiving device has the advantages of fast response speed, safety, environmental friendliness and easy control of the device material, so that it can be easily used in power control or microwave circuits or communication modules.

Therefore, the semiconductor device may replace a light emitting diode backlight, a fluorescent lamp, or an incandescent bulb, which replaces a cold cathode tube (CCFL) constituting a backlight module of an optical communication means, a backlight of a liquid crystal display (LCD) display device. Applications are expanding to include white light emitting diode lighting devices, automotive headlights and traffic lights, and sensors that detect gas or fire. In addition, the semiconductor device may be extended to high frequency application circuits, other power control devices, and communication modules.

The light emitting device may be provided as a pn junction diode having a characteristic in which electrical energy is converted into light energy using, for example, a group 3-5 element or a group 2-6 element on the periodic table. Various wavelengths can be realized by adjusting the composition ratio.

For example, nitride semiconductors are receiving great attention in the field of optical devices and high power electronic devices due to their high thermal stability and wide bandgap energy. In particular, a blue light emitting device, a green light emitting device, an ultraviolet light emitting device, a red light emitting device using a nitride semiconductor, and the like are commercially used and widely used.

For example, in the case of an ultraviolet light emitting device, a light emitting diode which emits light distributed in a wavelength range of 200 nm to 400 nm, and is used in the wavelength band, for short wavelengths, for sterilization and purification, and for long wavelengths, an exposure machine or a curing machine. Can be used.

 Ultraviolet rays can be classified into UV-A (315nm ~ 400nm), UV-B (280nm ~ 315nm), and UV-C (200nm ~ 280nm) in order of long wavelength. The UV-A (315nm ~ 400nm) area is applied to various fields such as industrial UV curing, printing ink curing, exposure machine, forgery discrimination, photocatalyst sterilization, special lighting (aquarium / agriculture, etc.), and UV-B (280nm ~ 315nm). ) Area is used for medical purposes, UV-C (200nm ~ 280nm) area is applied to air purification, water purification, sterilization products.

Meanwhile, as a semiconductor device capable of providing a high output is requested, research on a semiconductor device capable of increasing output by applying a high power source is being conducted.

In addition, in the semiconductor device package, research has been conducted on a method of improving light extraction efficiency of the semiconductor device and improving brightness at the package end. In addition, in the semiconductor device package, research is being conducted to improve the bonding strength between the package electrode and the semiconductor device.

In addition, in the semiconductor device package, research has been conducted on a method for reducing manufacturing cost and improving manufacturing yield by improving process efficiency and structural change.

The embodiment can provide a semiconductor device package, a method of manufacturing a semiconductor device package, and a light source device capable of improving light extraction efficiency and electrical characteristics.

The embodiment can provide a semiconductor device package, a method of manufacturing a semiconductor device package, and a light source device capable of improving process efficiency and suggesting a new package structure to reduce manufacturing cost and improve manufacturing yield.

The embodiment can provide a semiconductor device package and a method of manufacturing a semiconductor device package that can prevent re-melting from occurring in a bonding region of the semiconductor device package while the semiconductor device package is rebonded to a substrate or the like. have.

According to an embodiment, there is provided a light emitting device package including: a body including an upper surface, a lower surface, first and second openings penetrating the upper surface and the lower surface; A light emitting device including first and second bonding parts disposed on the first and second openings, respectively; And first and second frames disposed in the first and second openings and overlapping the first and second bonding portions in a vertical direction, respectively.

According to an embodiment, the first frame extends in a first direction extending from the upper surface of the body in a first direction toward the lower surface and in a second direction perpendicular to the first direction in which the first portion extends. It may comprise a second portion.

In some embodiments, the first opening includes a first portion and a second portion, the first portion is provided to overlap the first bonding portion in the vertical direction, and the second portion is the first portion. Disposed below and connected to the first portion, wherein a width of an upper region of the second portion is provided to be larger than a width of a lower region of the first portion, and the first frame includes the first opening of the first opening portion; It can be arranged in the first and second parts.

According to an embodiment, the second portion of the first opening may be recessed in an upward direction from a lower surface of the body.

The light emitting device package according to the embodiment may include a first conductor disposed between the first bonding portion and the first frame in the first opening, the second bonding portion and the second bonding portion in the second opening. It may further include a second conductor disposed between the frame.

According to an embodiment, the first bonding portion is provided with a first width in a first direction parallel to the first side surface of the light emitting device, and the first opening portion has a first width in a direction parallel to the first direction. Can be provided with a smaller second width.

The light emitting device package according to the embodiment may include a first conductive portion disposed between the lower surface of the first bonding portion and the first conductor.

In example embodiments, the first conductive part may extend from the lower surface of the first bonding part into the first opening.

According to an embodiment, the first conductor may be disposed between the side surface of the first conductive portion and the side surface of the body providing the first opening, and between the lower surface of the first conductive portion and the upper surface of the first frame. have.

According to an embodiment, the upper surface of the first frame may be disposed in direct contact with the lower surface of the first bonding part.

The light emitting device package according to the embodiment includes a circuit board disposed under the lower surface of the body and includes first and second pads, and is perpendicular to an upper surface of the light emitting device. The second pad may be disposed to overlap the first and second frames.

The light emitting device package according to the embodiment includes first and second adhesives disposed between the body and the circuit board, wherein the first adhesive is electrically connected to the first pad and the first frame. The second adhesive may be electrically connected to the second pad and the second frame, and the first and second adhesive may be disposed so as not to overlap the first and second bonding portions in the vertical direction.

According to the semiconductor device package and the semiconductor device package manufacturing method according to the embodiment, there is an advantage that can improve the light extraction efficiency, electrical characteristics and reliability.

According to the semiconductor device package and the semiconductor device package manufacturing method according to the embodiment, there is an advantage that can improve the process efficiency and propose a new package structure to reduce the manufacturing cost and improve the manufacturing yield.

The semiconductor device package according to the embodiment may provide a body having a high reflectance, thereby preventing the reflector from being discolored, thereby improving the reliability of the semiconductor device package.

According to the semiconductor device package and the semiconductor device manufacturing method according to the embodiment, the re-melting phenomenon can be prevented from occurring in the bonding region of the semiconductor device package during the rebonding of the semiconductor device package, etc. There is this.

1 is a plan view showing a light emitting device package according to an embodiment of the present invention.
FIG. 2 is a bottom view of the light emitting device package shown in FIG. 1.
3 is a cross-sectional view taken along line DD of the light emitting device package shown in FIG. 1.
4 is an exploded perspective view illustrating the light emitting device package illustrated in FIG. 1.
5 is a view showing another example of a light emitting device package according to an embodiment of the present invention.
6 is a view showing another example of a light emitting device package according to an embodiment of the present invention.
7 is a view showing another example of a light emitting device package according to an embodiment of the present invention.
8 is a view showing another example of a light emitting device package according to an embodiment of the present invention.
9 is a view showing another example of a light emitting device package according to an embodiment of the present invention.
10 is a view showing another example of a light emitting device package according to an embodiment of the present invention.
11 is a plan view illustrating an example of a light emitting device applied to a light emitting device package according to an embodiment of the present invention.
12 is a cross-sectional view taken along line FF of the light emitting device of FIG. 11.
13 is a view showing another example of a light emitting device package according to an embodiment of the present invention.

Hereinafter, embodiments will be described with reference to the accompanying drawings. In the description of an embodiment, each layer, region, pattern, or structure is “on / over” or “under” the substrate, each layer, layer, pad, or pattern. In the case where it is described as being formed at, "on / over" and "under" include both "directly" or "indirectly" formed. do. In addition, the criteria for the top / top or bottom of each layer will be described based on the drawings, but the embodiment is not limited thereto.

Hereinafter, a semiconductor device package and a semiconductor device package manufacturing method according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. Hereinafter, a description will be given based on a case where a light emitting device is applied as an example of a semiconductor device.

First, a light emitting device package according to an exemplary embodiment of the present invention will be described with reference to FIGS. 1 to 4.

1 is a plan view showing a light emitting device package according to an embodiment of the present invention, Figure 2 is a bottom view of the light emitting device package shown in Figure 1, Figure 3 is a DD line of the light emitting device package shown in Figure 1 4 is a cross-sectional view illustrating the light emitting device package illustrated in FIG. 1.

For reference, in order to easily understand the structure of the light emitting device package 100 according to the embodiment, FIG. 1 is a state in which the light emitting device 120 and the first and second frames 211 and 212 are not mounted. 2 and 3 illustrate an arrangement relationship between the body 110, the light emitting device 120, and the first and second frames 211 and 212.

The light emitting device package 100 according to the embodiment may include a body 110 and a light emitting device 120, as shown in FIGS. 1 to 4.

The body 110 may include a first body 111 and a second body 113. The second body 113 may be disposed on the first body 111. The second body 113 may be disposed around the upper surface of the first body 111. The second body 113 may provide a cavity C on an upper surface of the first body 111.

In other words, the first body 111 may be referred to as a lower body, and the second body 113 may be referred to as an upper body.

The second body 113 may reflect light emitted from the light emitting device 120 in an upward direction. The second body 113 may be disposed to be inclined with respect to the upper surface of the first body 111.

The body 110 may include the cavity C. The cavity may include a bottom surface and a side surface inclined from the bottom surface to the top surface of the body 110.

For example, the body 110 may be made of polyphthalamide (PPA), polychloro triphenyl (PCT), liquid crystal polymer (LCP), polyamide 9T (PA9T), silicone, epoxy molding compound (EMC), At least one selected from the group consisting of silicon molding compound (SMC), ceramic, photo sensitive glass (PSG), sapphire (Al ₂ O ₃ ), black epoxy molding compound (Black EMC), black silicon molding compound (Black SMC) Can be formed. In addition, the body 110 may include a high refractive filler such as TiO ₂ and SiO ₂ .

In example embodiments, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.

The light emitting structure 123 may include a first conductive semiconductor layer, a second conductive semiconductor layer, an active layer disposed between the first conductive semiconductor layer and the second conductive semiconductor layer. The first bonding part 121 may be electrically connected to the first conductive semiconductor layer. In addition, the second bonding part 122 may be electrically connected to the second conductivity type semiconductor layer. The substrate 124 may support the light emitting structure 123.

The light emitting device 120 may be disposed on the body 110. The light emitting device 120 may be disposed on the first body 111. The light emitting device 120 may be disposed in the cavity C provided by the second body 113.

The first bonding part 121 may be disposed on the bottom surface of the light emitting device 120. The second bonding part 122 may be disposed on the bottom surface of the light emitting device 120. The first bonding part 121 and the second bonding part 122 may be spaced apart from each other on the bottom surface of the light emitting device 120.

The first bonding part 121 may be disposed between the light emitting structure 123 and the first body 111. The second bonding part 122 may be disposed between the light emitting structure 123 and the first body 111.

The first bonding portion 121 and the second bonding portion 122 are Ti, Al, Sn, In, Ir, Ta, Pd, Co, Cr, Mg, Zn, Ni, Si, Ge, Ag, Ag alloy By using one or more materials or alloys selected from the group including Au, Hf, Pt, Ru, Rh, ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, Ni / IrOx / Au / ITO It can be formed in a single layer or multiple layers.

The light emitting device package 100 according to the embodiment may include a first opening TH1 and a second opening TH2, as shown in FIGS. 1 to 4.

The body 110 may include the first opening TH1 penetrating the bottom surface of the body 110 from the bottom surface of the cavity C. The body 110 may include the second opening TH2 penetrating the bottom surface of the body 110 from the bottom surface of the cavity C.

The first opening TH1 may be provided in the first body 111. The first opening TH1 may be provided through the first body 111. The first opening TH1 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The first opening TH1 may be disposed under the light emitting device 120. The first opening TH1 may be provided to overlap with the first bonding part 121 of the light emitting device 120. The first opening TH1 may be provided to overlap the first bonding part 121 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, a lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first opening TH1. A lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first body 111.

The second opening TH2 may be provided in the first body 111. The second opening TH2 may be provided through the first body 111. The second opening TH2 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The second opening TH2 may be disposed under the light emitting device 120. The second opening TH2 may overlap the second bonding part 122 of the light emitting device 120. The second opening TH2 may be provided to overlap the second bonding part 122 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, the lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the second opening TH2. The lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the first body 111.

The first opening TH1 and the second opening TH2 may be spaced apart from each other. The first opening TH1 and the second opening TH2 may be spaced apart from each other under a lower surface of the light emitting device 120.

According to an embodiment, the width of the upper region of the first opening TH1 may be provided smaller than the width of the bottom surface of the first bonding part 121. In addition, the width of the upper region of the second opening TH2 may be smaller than the width of the bottom surface of the second bonding portion 122.

In addition, the width of the upper region of the first opening TH1 may be smaller than or equal to the width of the lower region of the first opening TH1. In addition, the width of the upper region of the second opening TH2 may be smaller than or equal to the width of the lower region of the second opening TH2.

The first opening TH1 may be provided in an inclined form in which the width gradually decreases from the lower region to the upper region. The second opening TH2 may be provided in an inclined form in which the width gradually decreases from the lower region to the upper region.

However, the present disclosure is not limited thereto, and the inclined surfaces between the upper and lower regions of the first and second openings TH1 and TH2 may have a plurality of inclined surfaces having different inclinations, and the inclined surfaces may be disposed with curvature. .

A width between the first opening part TH1 and the second opening part TH2 in the lower surface area of the first body 111 may be provided to several hundred micrometers. For example, a width between the first opening TH1 and the second opening TH2 may be provided in a range of 100 micrometers to 300 micrometers in the lower region of the first body 111.

The width between the first opening TH1 and the second opening TH2 in the lower surface area of the first body 111 is that the light emitting device package 100 according to the embodiment is later mounted on a circuit board, a submount, or the like. If so, it may be selected to be provided over a certain distance to prevent a short between bonding pads.

According to an embodiment, the body 110 may include an upper surface and a lower surface. The body 110 may include first and second openings TH1 and TH2 penetrating the upper surface and the lower surface. The light emitting device 120 according to the embodiment may include the first and second bonding parts 121 and 122 disposed on the first and second openings TH1 and TH2.

The first and second bonding parts 121 and 122 may be provided with a first width in a first direction parallel to the first side surface of the light emitting device 120. The first and second openings TH1 and TH2 may be provided with a second width smaller than the first width in a direction parallel to the first direction.

The first side surface of the light emitting device 120 may be a side surface along the long axis direction of the light emitting device 120. In addition, the first side surface of the light emitting device 120 may be a side surface along the short axis direction of the light emitting device 120.

In addition, the light emitting device package 100 according to the embodiment may include first and second conductors 321 and 322 and first and second frames 211 and 212.

The first and second conductors 321 and 332 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second conductors 321 and 322 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second conductors 321 and 322, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second bonding parts 121 and 122, respectively.

The first conductor 321 may be disposed in the first opening TH1 and may be electrically connected to the first bonding part 121. The first conductor 321 may be disposed between the first bonding part 121 and the first frame 211 in the first opening TH1.

The second conductor 322 may be disposed in the second opening TH2 and may be electrically connected to the second bonding part 122. The second conductor 322 may be disposed between the second bonding part 122 and the second frame 212 in the second opening TH2.

The first opening TH1 may include a first portion S1 and a second portion S2. The first portion S1 may be provided to overlap with the first bonding portion 121 in the vertical direction. The second portion S2 may be provided below the first portion S1. The second part S2 may be connected to the first part S1. The width of the upper region of the second portion S2 may be provided larger than the width of the lower region of the first portion S1.

The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the body 110. The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the first body 111. The second portion S2 may be provided in the form of a recess on a lower surface of the first body 111.

The first frame 211 may be disposed in the first and second portions S1 and S2 of the first opening TH1.

The first frame 211 protrudes from the upper surface of the first portion and the first portion disposed in parallel to the lower surface of the body 110 in the first opening TH1 to the first conductor. It may include a second portion in direct contact with the bottom surface of 321.

The second opening TH2 may include a third portion S3 and a fourth portion S4. The third portion S3 may be provided to overlap with the second bonding portion 122 in the vertical direction. The fourth part S4 may be provided below the third part S3. The fourth part S4 may be connected to the third part S3. The width of the upper region of the fourth portion S4 may be provided larger than the width of the lower region of the third portion S3.

The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the body 110. The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the first body 111. The fourth portion S4 may be provided in the form of a recess on the bottom surface of the first body 111.

The second frame 212 may be disposed in the third and fourth portions S3 and S4 of the second opening TH2.

The second frame 212 protrudes from the upper surface of the third portion disposed in parallel with the lower surface of the body 110 in the second opening TH2 and from the upper surface of the third conductor to form the second conductor. And a fourth portion in direct contact with the bottom surface of 322.

The light emitting device package 100 according to the embodiment may include the first resin 130.

The first resin 130 may be disposed between the light emitting device 120 and the first body 111. The first resin 130 may be disposed between the first bonding portion 121 and the second bonding portion 122. For example, the first resin 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.

The first resin 130 may provide a stable fixing force between the light emitting device 120 and the first body 111. For example, the first resin 130 may be disposed in direct contact with an upper surface of the first body 111. In addition, the first resin 130 may be disposed in direct contact with the lower surface of the light emitting device 120.

The first resin 130 may be provided on the entire bottom surface of the cavity provided by the second body 113. The first resin 130 may be disposed on an upper surface of the first body 111 exposed by the second body 113. When viewed from an upper direction of the light emitting device 120, the first resin 130 may be disposed around the light emitting device 120.

In addition, the physical properties of the first resin 130 may be selected in consideration of Coefficient of Thermal Expansion (CTE) matching between the first resin 130, the body 110, and the light emitting device 120. The first resin 130 may be selected from resins having a low CTE value. In this case, the first resin 130 may be referred to as a low CTE bottom reflector (LCBR), and may improve a problem in which a crack or peeling problem due to thermal shock occurs.

For example, the first resin 130 may be provided as an insulating adhesive. For example, the first resin 130 may include at least one of an epoxy-based material, a silicon-based material, a hybrid material including an epoxy-based material and a silicon-based material. Can be. As another example, when the first resin 130 includes a reflective function, the adhesive may include white silicone. The first resin 130 may be referred to as an adhesive.

The first resin 130 may provide a stable fixing force between the first body 111 and the light emitting device 120, and when light is emitted to the lower surface of the light emitting device 120, The light diffusion function can be provided between the bodies. When light is emitted from the light emitting device 120 to the bottom surface of the light emitting device 120, the first resin 130 may improve light extraction efficiency of the light emitting device package 100 by providing a light diffusion function. have.

In some embodiments, the first resin 130 may be provided in a portion of the body 110 provided with the first and second openings TH1 and TH2. For example, the first resin 130 may be provided on a portion of the upper surface of the first body 111 through a method such as application, dotting, or injection.

Subsequently, the light emitting device 120 may be attached onto the first body 111. Accordingly, the first resin 130 may be diffused and moved between the light emitting device 120 and the first body 111. The first resin 130 may be provided to be spread around the first and second bonding parts 121 and 122. The first resin 130 may also be disposed in a region between the first and second bonding portions 121 and 122 and the first and second openings TH1 and TH2. In addition, the first resin 130 may be controlled not to move into the first and second openings TH1 and TH2 due to viscosity and surface tension.

In addition, the first resin 130 may be disposed under the light emitting device 120 to perform a sealing function. The first resin 130 may seal upper regions of the first and second openings TH1 and TH2. The first resin 130 may seal the peripheral regions of the first and second bonding parts 121 and 122. Accordingly, moisture or foreign matter from the first and second openings TH1 and TH2 may be blocked from entering the region where the light emitting device 120 is disposed.

Meanwhile, as shown in FIG. 13, at least one recess R may be provided on an upper surface of the first body 111. The recess R may be provided between the first opening TH1 and the second opening TH2. The recess R may be provided concave in a first direction from the upper surface of the first body 111 toward the lower surface. The recess R may be disposed under the light emitting device 120. The recess R may overlap the light emitting device 120 in the first direction.

When the recess R is provided on the top surface of the first body 111, the first resin 130 is provided to the recess R, so that the recess R is the light emitting device. The lower portion of 120 may provide an appropriate space in which a kind of underfill process may be performed. When the first resin 130 is provided in the recess R disposed on the upper surface of the first body 111, an injection region and an injection amount of the first resin 130 may be easily controlled. .

In addition, the light emitting device package 100 according to the embodiment may include a second resin 140.

The second resin 140 may be provided on the light emitting device 120. The second resin 140 may be disposed on the first body 111. The second resin 140 may be disposed in the cavity C provided by the second body 113.

The second resin 140 may include an insulating material. The second resin 140 may be provided as a clear molding member. For example, the second resin 140 may include a silicone-based or epoxy-based resin.

In addition, the second resin 140 may include wavelength conversion means for receiving the light emitted from the light emitting device 120 and providing the wavelength-converted light. For example, the second resin 140 may include a phosphor, a quantum dot, and the like.

According to an embodiment, after the light emitting device 120 is mounted on the body 110, the first and second conductors 321 and 322 are provided in the first and second openings TH1 and TH2. Can be. In addition, the first and second frames 211 and 212 may be provided in the first and second openings TH1 and TH2, and curing of the first and second conductors 321 and 322 may be performed. have.

For example, the first and second conductors 321 and 322 may be provided as conductive adhesives. The first and second conductors 321 and 322 may be provided in the first and second openings TH1 and TH2 through a method such as dotting or jetting.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2 to contact the first and second conductors 321 and 322, respectively. The hardening process enables the first and second frames 211 and 212 to be stably mounted in the first and second openings TH1 and TH2.

For example, the first and second conductors 321 and 322 may include at least one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited thereto, and the first and second conductors 321 and 322 may be formed of a material capable of securing a conductive function.

For example, the first and second conductors 321 and 322 may be formed using a conductive paste. The conductive paste may include a solder paste, a silver paste, or the like, and may include a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. For example, the first and second conductors 321 and 322 may include SAC (Sn-Ag-Cu) materials.

The first and second frames 211 and 212 may be provided as conductive frames. The first and second frames 211 and 212 may include a metal layer and a plating layer formed on the metal layer. The first and second frames 211 and 222 may include a single layer or a multilayer including at least one material selected from the group including Cu, Ni, Ag, and the like. In addition, the first and second frames 211 and 222 may include an alloy layer including at least one material selected from the group consisting of Cu, Ni, Ag, and the like.

In addition, according to the embodiment, the light emitting structure 123 may be provided as a compound semiconductor. The light emitting structure 123 may be provided as a group 2-6 or 3-5 compound semiconductor. For example, the light emitting structure 123 may include at least two elements selected from aluminum (Al), gallium (Ga), indium (In), phosphorus (P), arsenic (As), and nitrogen (N). Can be.

The light emitting structure 123 may include a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer.

The first and second conductivity-type semiconductor layers may be implemented as at least one of a compound semiconductor of Groups 3-5 or 2-6. The first and the semiconductor material having a composition formula of the second conductivity type semiconductor layer is, for example _{In x Al y Ga 1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x + y≤1) It can be formed as. For example, the first and second conductivity-type semiconductor layers may include at least one selected from the group consisting of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like. . The first conductive semiconductor layer may be an n-type semiconductor layer doped with n-type dopants such as Si, Ge, Sn, Se, Te, or the like. The second conductive semiconductor layer may be a p-type semiconductor layer doped with p-type dopants such as Mg, Zn, Ca, Sr, and Ba.

The active layer may be implemented with a compound semiconductor. The active layer may be implemented as at least one of a compound semiconductor of Group 3-Group 5 or Group 2-6, for example. When the active layer is implemented as a multi-well structure, the active layer may include a plurality of well layers and a plurality of barrier layers that are alternately arranged, and In _x Al _y Ga _{1 -x- y} N (0 _{≦ x ≦} 1 , 0 ≦ y ≦ 1, 0 ≦ x + y ≦ 1). For example, the active layer is selected from the group comprising InGaN / GaN, GaN / AlGaN, AlGaN / AlGaN, InGaN / AlGaN, InGaN / InGaN, AlGaAs / GaAs, InGaAs / GaAs, InGaP / GaP, AlInGaP / InGaP, InP / GaAs. It may include at least one.

In the light emitting device package 100 according to the embodiment, power is connected to the first bonding part 121 through the first conductor 321 and the first frame 211 provided in the first opening TH1. In addition, power may be connected to the second bonding part 122 through the second conductor 322 and the second frame 212 provided in the second opening TH2.

Accordingly, the light emitting device 120 may be driven by driving power supplied through the first bonding part 121 and the second bonding part 122. In addition, the light emitted from the light emitting device 120 may be provided in an upper direction of the body 110.

On the other hand, the light emitting device package 100 according to the embodiment described above may be mounted on a sub-mount or a circuit board and supplied.

However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high temperature process such as a reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, thereby weakening the stability of the electrical connection and the physical coupling.

However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding portion and the second bonding portion 121, 122 of the light emitting device 120 according to the embodiment is the first and second The driving power may be provided through the second conductors 321 and 322 and the first and second frames 211 and 212. The melting point of the first and second conductors 321 and 322 may be selected to have a higher value than the melting point of the general bonding material.

Therefore, the light emitting device package 100 according to the embodiment does not cause re-melting even when bonded to a main substrate through a reflow process, so that electrical connection and physical bonding force are not degraded. There is no advantage.

In addition, according to the light emitting device package 100 and the light emitting device package manufacturing method according to an embodiment, a conductive paste may be used as the first and second conductors 321 and 322, and manufacturing a light emitting device package. In the body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, the body 110 may be prevented from being damaged or discolored due to exposure to high temperature.

Accordingly, the selection range for the material constituting the body 110 can be widened. According to an embodiment, the body 110 may be provided using a relatively inexpensive resin material as well as an expensive material such as a ceramic.

For example, the body 110 may include at least one material selected from the group consisting of PolyPhtalAmide (PPA) resin, PolyCyclohexylenedimethylene Terephthalate (PCT) resin, epoxy molding compound (EMC) resin, and silicone molding compound (SMC) resin. can do.

In addition, according to the light emitting device package 100 according to the embodiment, the first frame 211 and the second frame 212 may be spaced apart from each other at a sufficient distance from the lower surface of the body 110. . Accordingly, when the light emitting device package 100 according to the embodiment is mounted on a sub mount or a main substrate, the light emitting device package 100 may be electrically connected to the sub mount or the main substrate through the first and second frames 211 and 212. An electrical short may be prevented between the first and second frames 211 and 212.

On the other hand, according to the light emitting device package according to the embodiment described above, the body 110 may be provided so as to include only the support member having a flat upper surface, not including the reflective portion disposed obliquely.

In other words, according to the light emitting device package according to the embodiment, the body 110 may be provided in a structure providing a cavity (C). In addition, the body 110 may be provided in a structure having a flat upper surface without providing the cavity (C).

Next, another example of the light emitting device package according to the embodiment will be described with reference to FIG. 5. 5 is a view showing another example of a light emitting device package according to an embodiment of the present invention.

In the description of the light emitting device package according to the exemplary embodiment with reference to FIG. 5, the descriptions overlapping the contents described with reference to FIGS. 1 to 4 may be omitted.

The light emitting device package 200 according to the exemplary embodiment of the present invention illustrated in FIG. 5 illustrates an example in which the light emitting device package 100 described with reference to FIGS. 1 to 4 is mounted and supplied to a circuit board 310. .

The light emitting device package 200 according to the embodiment may include a circuit board 310, a body 110, and a light emitting device 120, as shown in FIG. 5.

The circuit board 310 may include a first pad and a second pad. The circuit board 310 may include a substrate 313 provided with a first pad and a second pad. A power supply circuit for controlling the driving of the light emitting device 120 may be provided on the substrate 313.

The body 110 may be disposed on the circuit board 310. First and second adhesives 311 and 312 may be disposed between the body 110 and the circuit board 310. The first and second adhesives 311 and 312 may be provided as conductive adhesives.

According to an embodiment, the first and second frames 211 and 212 provided on the body 110 may be electrically connected to the first and second pads provided on the circuit board 310, respectively. The first adhesive 311 may be provided between the first frame 211 and the first pad, and the second adhesive 312 may be provided between the second frame 212 and the second pad. Can be.

The first pad region of the circuit board 310 and the first bonding portion 121 of the light emitting device 120 are formed through the first conductor 321, the first frame 211, and the first adhesive 311. Can be electrically connected. In addition, the second pad region of the circuit board 310 and the second bonding portion 122 of the light emitting device 120 may include a second conductor 322, a second frame 212, and a second adhesive 312. It can be electrically connected through.

For example, the first and second adhesives 311 and 312 may include at least one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited thereto, and the first and second adhesives 311 and 312 may be formed of a material capable of securing a conductive function.

For example, the first and second adhesives 311 and 312 may be formed using a conductive paste. The conductive paste may include a solder paste, a silver paste, or the like, and may include a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. For example, the first and second adhesives 311 and 312 may include an SAC (Sn-Ag-Cu) material.

The body 110 may include a first body 111 and a second body 113. The second body 113 may be disposed on the first body 111. The second body 113 may be disposed around the upper surface of the first body 111. The second body 113 may provide a cavity C on an upper surface of the first body 111.

In example embodiments, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.

The light emitting device 120 may be disposed on the body 110. The light emitting device 120 may be disposed on the first body 111. The light emitting device 120 may be disposed in the cavity C provided by the second body 113.

The first bonding part 121 may be disposed on the bottom surface of the light emitting device 120. The second bonding part 122 may be disposed on the bottom surface of the light emitting device 120. The first bonding part 121 and the second bonding part 122 may be spaced apart from each other on the bottom surface of the light emitting device 120.

The first bonding part 121 may be disposed between the light emitting structure 123 and the first body 111. The second bonding part 122 may be disposed between the light emitting structure 123 and the first body 111.

The light emitting device package 200 according to the embodiment may include a first opening TH1 and a second opening TH2.

The first opening TH1 may be provided in the first body 111. The first opening TH1 may be provided through the first body 111. The first opening TH1 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The first opening TH1 may be disposed under the light emitting device 120. The first opening TH1 may be provided to overlap with the first bonding part 121 of the light emitting device 120. The first opening TH1 may be provided to overlap the first bonding part 121 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, a lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first opening TH1. A lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first body 111.

The second opening TH2 may be provided in the first body 111. The second opening TH2 may be provided through the first body 111. The second opening TH2 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The second opening TH2 may be disposed under the light emitting device 120. The second opening TH2 may overlap the second bonding part 122 of the light emitting device 120. The second opening TH2 may be provided to overlap the second bonding part 122 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, the lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the second opening TH2. The lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the first body 111.

The first opening TH1 and the second opening TH2 may be spaced apart from each other. The first opening TH1 and the second opening TH2 may be spaced apart from each other under a lower surface of the light emitting device 120.

According to an embodiment, the body 110 may include an upper surface and a lower surface. The body 110 may include first and second openings TH1 and TH2 penetrating the upper surface and the lower surface. The light emitting device package 100 according to the embodiment may include the first and second bonding parts 121 and 122 disposed on the first and second openings TH1 and TH2.

The first and second bonding parts 121 and 122 may be provided with a first width in a first direction parallel to the first side surface of the light emitting device 120. The first and second openings TH1 and TH2 may be provided with a second width smaller than the first width in a direction parallel to the first direction.

The first side surface of the light emitting device 120 may be a side surface along the long axis direction of the light emitting device 120. In addition, the first side surface of the light emitting device 120 may be a side surface along the short axis direction of the light emitting device 120.

In addition, the light emitting device package 100 according to the embodiment may include first and second conductors 321 and 322 and first and second frames 211 and 212.

The first and second conductors 321 and 332 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second conductors 321 and 322 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second conductors 321 and 322, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second bonding parts 121 and 122, respectively.

The first conductor 321 may be disposed in the first opening TH1 and may be electrically connected to the first bonding part 121. The first conductor 321 may be disposed between the first bonding part 121 and the first frame 211 in the first opening TH1.

The second conductor 322 may be disposed in the second opening TH2 and may be electrically connected to the second bonding part 122. The second conductor 322 may be disposed between the second bonding part 122 and the second frame 212 in the second opening TH2.

The first opening TH1 may include a first portion S1 and a second portion S2. The first portion S1 may be provided to overlap with the first bonding portion 121 in the vertical direction. The second portion S2 may be provided below the first portion S1. The second part S2 may be connected to the first part S1. The width of the upper region of the second portion S2 may be provided larger than the width of the lower region of the first portion S1.

The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the body 110. The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the first body 111. The second portion S2 may be provided in the form of a recess on a lower surface of the first body 111.

The first frame 211 may be disposed in the first and second portions S1 and S2 of the first opening TH1.

The first frame 211 protrudes from the upper surface of the first portion and the first portion disposed in parallel to the lower surface of the body 110 in the first opening TH1 to the first conductor. It may include a second portion in direct contact with the bottom surface of 321.

The second opening TH2 may include a third portion S3 and a fourth portion S4. The third portion S3 may be provided to overlap with the second bonding portion 122 in the vertical direction. The fourth part S4 may be provided below the third part S3. The fourth part S4 may be connected to the third part S3. The width of the upper region of the fourth portion S4 may be provided larger than the width of the lower region of the third portion S3.

The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the body 110. The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the first body 111. The fourth portion S4 may be provided in the form of a recess on the bottom surface of the first body 111.

The second frame 212 may be disposed in the third and fourth portions S3 and S4 of the second opening TH2.

The second frame 212 protrudes from the upper surface of the third portion disposed in parallel with the lower surface of the body 110 in the second opening TH2 and from the upper surface of the third conductor to form the second conductor. And a fourth portion in direct contact with the bottom surface of 322.

The first adhesive 311 may be electrically connected to the first pad and the first frame 211. The second adhesive 312 may be electrically connected to the second pad and the second frame 212.

The first adhesive 311 may be disposed not to overlap the first portion of the first opening TH1 in a vertical direction. The second adhesive 312 may be disposed not to overlap the third portion of the second opening TH2 in a vertical direction.

The first and second adhesives 311 and 312 may be disposed so as not to overlap with the first and second bonding portions 121 and 122 in the vertical direction.

Here, the vertical direction may mean a direction perpendicular to the upper surface of the light emitting device 120. In addition, the vertical direction may mean a direction perpendicular to the upper surface of the body 110.

In addition, the light emitting device package 200 according to the embodiment may include the first resin 130.

The first resin 130 may be disposed between the light emitting device 120 and the first body 111. The first resin 130 may be disposed between the first bonding portion 121 and the second bonding portion 122. For example, the first resin 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.

The first resin 130 may provide a stable fixing force between the light emitting device 120 and the first body 111. For example, the first resin 130 may be disposed in direct contact with an upper surface of the first body 111. In addition, the first resin 130 may be disposed in direct contact with the lower surface of the light emitting device 120.

The first resin 130 may be provided on the entire bottom surface of the cavity provided by the second body 113. The first resin 130 may be disposed on an upper surface of the first body 111 exposed by the second body 113. When viewed from an upper direction of the light emitting device 120, the first resin 130 may be disposed around the light emitting device 120.

In addition, the physical properties of the first resin 130 may be selected in consideration of Coefficient of Thermal Expansion (CTE) matching between the first resin 130, the body 110, and the light emitting device 120. The first resin 130 may be selected from resins having a low CTE value. In this case, the first resin 130 may be referred to as a low CTE bottom reflector (LCBR), and may improve a problem in which a crack or peeling problem due to thermal shock occurs.

For example, the first resin 130 may be provided as an insulating adhesive. For example, the first resin 130 may include at least one of an epoxy-based material, a silicon-based material, a hybrid material including an epoxy-based material and a silicon-based material. Can be. As another example, when the first resin 130 includes a reflective function, the adhesive may include white silicone. The first resin 130 may be referred to as an adhesive.

In some embodiments, the first resin 130 may be provided in a portion of the body 110 provided with the first and second openings TH1 and TH2. For example, the first resin 130 may be provided on a portion of the upper surface of the first body 111 through a method such as application, dotting, or injection.

Subsequently, the light emitting device 120 may be attached onto the first body 111. Accordingly, the first resin 130 may be diffused and moved between the light emitting device 120 and the first body 111. The first resin 130 may be provided to be spread around the first and second bonding parts 121 and 122. The first resin 130 may also be disposed in a region between the first and second bonding portions 121 and 122 and the first and second openings TH1 and TH2. In addition, the first resin 130 may be controlled not to move into the first and second openings TH1 and TH2 due to viscosity and surface tension.

In addition, the first resin 130 may be disposed under the light emitting device 120 to perform a sealing function. The first resin 130 may seal upper regions of the first and second openings TH1 and TH2. The first resin 130 may seal the peripheral regions of the first and second bonding parts 121 and 122. Accordingly, moisture or foreign matter from the first and second openings TH1 and TH2 may be blocked from entering the region where the light emitting device 120 is disposed.

In addition, the light emitting device package 300 according to the embodiment may include a second resin 140.

The second resin 140 may be provided on the light emitting device 120. The second resin 140 may be disposed on the first body 111. The second resin 140 may be disposed in the cavity C provided by the second body 113.

The second resin 140 may include an insulating material. The second resin 140 may be provided as a clear molding member. For example, the second resin 140 may include a silicone-based or epoxy-based resin.

In addition, the second resin 140 may include wavelength conversion means for receiving the light emitted from the light emitting device 120 and providing the wavelength-converted light. For example, the second resin 140 may include a phosphor, a quantum dot, and the like.

According to an embodiment, after the light emitting device 120 is mounted on the body 110, the first and second conductors 321 and 322 are provided in the first and second openings TH1 and TH2. Can be. In addition, the first and second frames 211 and 212 may be provided in the first and second openings TH1 and TH2, and curing of the first and second conductors 321 and 322 may be performed. have.

For example, the first and second conductors 321 and 322 may be provided as conductive adhesives, for example. The first and second conductors 321 and 322 may be provided in the first and second openings TH1 and TH2 through a method such as dotting or jetting.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2 to contact the first and second conductors 321 and 322, respectively. The hardening process enables the first and second frames 211 and 212 to be stably mounted in the first and second openings TH1 and TH2.

For example, the first and second conductors 321 and 322 may include at least one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited thereto, and the first and second conductors 321 and 322 may be formed of a material capable of securing a conductive function.

For example, the first and second conductors 321 and 322 may be formed using a conductive paste. The conductive paste may include a solder paste, a silver paste, or the like, and may include a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. For example, the first and second conductors 321 and 322 may include SAC (Sn-Ag-Cu) materials.

The first and second frames 211 and 212 may be provided as conductive frames. The first and second frames 211 and 212 may include a metal layer and a plating layer formed on the metal layer. The first and second frames 211 and 222 may include a single layer or a multilayer including at least one material selected from the group including Cu, Ni, Ag, and the like. In addition, the first and second frames 211 and 222 may include an alloy layer including at least one material selected from the group consisting of Cu, Ni, Ag, and the like.

According to an embodiment, the body 110 on which the light emitting device 120 is mounted may be attached onto the circuit board 310 through the first and second adhesives 311 and 312.

In the light emitting device package 200 according to the embodiment, power is connected to the first bonding part 121 through the first conductor 321 and the first frame 211 provided in the first opening TH1. In addition, power may be connected to the second bonding part 122 through the second conductor 322 and the second frame 212 provided in the second opening TH2.

Accordingly, the light emitting device 120 may be driven by driving power supplied through the first bonding part 121 and the second bonding part 122. In addition, the light emitted from the light emitting device 120 may be provided in an upper direction of the body 110.

When a conventional light emitting device package is mounted on a sub-mount or a circuit board, a high temperature process such as a reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, thereby weakening the stability of the electrical connection and the physical coupling.

However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding portion and the second bonding portion 121, 122 of the light emitting device 120 according to the embodiment is the first and second The driving power may be provided through the second conductors 321 and 322 and the first and second frames 211 and 212. The melting point of the first and second conductors 321 and 322 may be selected to have a higher value than the melting point of the general bonding material.

Therefore, the light emitting device package 200 according to the embodiment does not cause re-melting even when bonded to a main substrate through a reflow process, so that electrical connection and physical bonding force are not degraded. There are advantages.

In addition, according to the light emitting device package 200 and the light emitting device package manufacturing method according to the embodiment, a conductive paste may be used as the first and second conductors 321 and 322, a process for manufacturing a light emitting device package In the body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, the body 110 may be prevented from being damaged or discolored due to exposure to high temperature.

Accordingly, the selection range for the material constituting the body 110 can be widened. According to an embodiment, the body 110 may be provided using a relatively inexpensive resin material as well as an expensive material such as a ceramic.

For example, the body 110 may include at least one material selected from the group consisting of PolyPhtalAmide (PPA) resin, PolyCyclohexylenedimethylene Terephthalate (PCT) resin, epoxy molding compound (EMC) resin, and silicone molding compound (SMC) resin. can do.

In addition, according to the light emitting device package 200 according to the embodiment, the first frame 211 and the second frame 212 may be spaced apart from each other at a sufficient distance from the lower surface of the body 110. . Accordingly, the first and second frames 211 and 212 are attached to the circuit board 310 through the first and second adhesives 311 and 312. An electrical short between 211 and 212 can be prevented.

Next, another example of the light emitting device package according to the embodiment will be described with reference to FIG. 6. 6 is a view showing another example of a light emitting device package according to an embodiment of the present invention.

In the description of the light emitting device package according to the exemplary embodiment with reference to FIG. 6, the descriptions overlapping the contents described with reference to FIGS. 1 to 5 may be omitted.

The light emitting device package 300 according to the embodiment may include a body 110 and the light emitting device 120.

The body 110 may include a first body 111 and a second body 113. The second body 113 may be disposed on the first body 111. The second body 113 may be disposed around the upper surface of the first body 111. The second body 113 may provide a cavity C on an upper surface of the first body 111.

In example embodiments, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.

The first bonding part 121 may be disposed on the bottom surface of the light emitting device 120. The second bonding part 122 may be disposed on the bottom surface of the light emitting device 120. The first bonding part 121 and the second bonding part 122 may be spaced apart from each other on the bottom surface of the light emitting device 120.

The light emitting device package 300 according to the embodiment may include a first opening TH1 and a second opening TH2.

The body 110 may include the first opening TH1 penetrating the bottom surface of the body 110 from the bottom surface of the cavity C. The body 110 may include the second opening TH2 penetrating the bottom surface of the body 110 from the bottom surface of the cavity C.

The first opening TH1 may be provided in the first body 111. The first opening TH1 may be provided through the first body 111. The first opening TH1 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The first opening TH1 may be disposed under the light emitting device 120. The first opening TH1 may be provided to overlap with the first bonding part 121 of the light emitting device 120. The first opening TH1 may be provided to overlap the first bonding part 121 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, a lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first opening TH1. A lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first body 111.

The second opening TH2 may be provided in the first body 111. The second opening TH2 may be provided through the first body 111. The second opening TH2 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The second opening TH2 may be disposed under the light emitting device 120. The second opening TH2 may overlap the second bonding part 122 of the light emitting device 120. The second opening TH2 may be provided to overlap the second bonding part 122 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, the lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the second opening TH2. The lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the first body 111.

The first opening TH1 and the second opening TH2 may be spaced apart from each other. The first opening TH1 and the second opening TH2 may be spaced apart from each other under a lower surface of the light emitting device 120.

According to an embodiment, the body 110 may include an upper surface and a lower surface. The body 110 may include first and second openings TH1 and TH2 penetrating the upper surface and the lower surface. The light emitting device package 300 according to the embodiment may include the first and second bonding parts 121 and 122 disposed on the first and second openings TH1 and TH2.

The first and second bonding parts 121 and 122 may be provided with a first width in a first direction parallel to the first side surface of the light emitting device 120. The first and second openings TH1 and TH2 may be provided with a second width smaller than the first width in a direction parallel to the first direction.

The first side surface of the light emitting device 120 may be a side surface along the long axis direction of the light emitting device 120. In addition, the first side surface of the light emitting device 120 may be a side surface along the short axis direction of the light emitting device 120.

In addition, the light emitting device package 300 according to the embodiment may include first and second conductors 321 and 322 and first and second frames 211 and 212.

The first and second conductors 321 and 332 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second conductors 321 and 322 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second conductors 321 and 322, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second bonding parts 121 and 122, respectively.

The first conductor 321 may be disposed in the first opening TH1 and may be electrically connected to the first bonding part 121. The first conductor 321 may be disposed between the first bonding part 121 and the first frame 211 in the first opening TH1.

The second conductor 322 may be disposed in the second opening TH2 and may be electrically connected to the second bonding part 122. The second conductor 322 may be disposed between the second bonding part 122 and the second frame 212 in the second opening TH2.

The first opening TH1 may include a first portion S1 and a second portion S2. The first portion S1 may be provided to overlap with the first bonding portion 121 in the vertical direction. The second portion S2 may be provided below the first portion S1. The second part S2 may be connected to the first part S1. The width of the upper region of the second portion S2 may be provided larger than the width of the lower region of the first portion S1.

The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the body 110. The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the first body 111. The second portion S2 may be provided in the form of a recess on a lower surface of the first body 111.

The first frame 211 may be disposed in the first and second portions S1 and S2 of the first opening TH1.

The first frame 211 protrudes from the upper surface of the first portion and the first portion disposed in parallel to the lower surface of the body 110 in the first opening TH1 to the first conductor. It may include a second portion in direct contact with the bottom surface of 321.

According to an embodiment, the first conductor 321 may be disposed between an upper surface of the second portion of the first frame 211 and a lower surface of the first bonding part 121. In addition, the first conductor 321 may be disposed between the side surface of the second portion of the first frame 211 and the side surface of the first body 111 providing the first opening TH1. have.

The second opening TH2 may include a third portion S3 and a fourth portion S4. The third portion S3 may be provided to overlap with the second bonding portion 122 in the vertical direction. The fourth part S4 may be provided below the third part S3. The fourth part S4 may be connected to the third part S3. The width of the upper region of the fourth portion S4 may be provided larger than the width of the lower region of the third portion S3.

The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the body 110. The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the first body 111. The fourth portion S4 may be provided in the form of a recess on the bottom surface of the first body 111.

The second frame 212 may be disposed in the third and fourth portions S3 and S4 of the second opening TH2.

The second frame 212 protrudes from the upper surface of the third portion disposed in parallel with the lower surface of the body 110 in the second opening TH2 and from the upper surface of the third conductor to form the second conductor. And a fourth portion in direct contact with the bottom surface of 322.

In some embodiments, the second conductor 322 may be disposed between an upper surface of the fourth portion of the second frame 212 and a lower surface of the second bonding portion 122. In addition, the second conductor 322 may be disposed between the side surface of the fourth portion of the second frame 212 and the side surface of the first body 111 providing the second opening TH2. have.

The light emitting device package 300 according to the embodiment may include the first resin 130.

The first resin 130 may be disposed between the light emitting device 120 and the first body 111. The first resin 130 may be disposed between the first bonding portion 121 and the second bonding portion 122. For example, the first resin 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.

The first resin 130 may be provided on the entire bottom surface of the cavity provided by the second body 113. The first resin 130 may be disposed on an upper surface of the first body 111 exposed by the second body 113. When viewed from an upper direction of the light emitting device 120, the first resin 130 may be disposed around the light emitting device 120.

In addition, the physical properties of the first resin 130 may be selected in consideration of Coefficient of Thermal Expansion (CTE) matching between the first resin 130, the body 110, and the light emitting device 120. The first resin 130 may be selected from resins having a low CTE value. In this case, the first resin 130 may be referred to as a low CTE bottom reflector (LCBR), and may improve a problem in which a crack or peeling problem due to thermal shock occurs.

In some embodiments, the first resin 130 may be provided in a portion of the body 110 provided with the first and second openings TH1 and TH2. For example, the first resin 130 may be provided on a portion of the upper surface of the first body 111 through a method such as application, dotting, or injection.

Subsequently, the light emitting device 120 may be attached onto the first body 111. Accordingly, the first resin 130 may be diffused and moved between the light emitting device 120 and the first body 111. The first resin 130 may be provided to be spread around the first and second bonding parts 121 and 122. The first resin 130 may also be disposed in a region between the first and second bonding portions 121 and 122 and the first and second openings TH1 and TH2. In addition, the first resin 130 may be controlled not to move into the first and second openings TH1 and TH2 due to viscosity and surface tension.

In addition, the first resin 130 may be disposed under the light emitting device 120 to perform a sealing function. The first resin 130 may seal upper regions of the first and second openings TH1 and TH2. The first resin 130 may seal the peripheral regions of the first and second bonding parts 121 and 122. Accordingly, moisture or foreign matter from the first and second openings TH1 and TH2 may be blocked from entering the region where the light emitting device 120 is disposed.

In addition, the light emitting device package 300 according to the embodiment may include a second resin 140.

The second resin 140 may be provided on the light emitting device 120. The second resin 140 may be disposed on the first body 111. The second resin 140 may be disposed in the cavity C provided by the second body 113.

The second resin 140 may include an insulating material. The second resin 140 may be provided as a clear molding member. For example, the second resin 140 may include a silicone-based or epoxy-based resin.

In addition, the second resin 140 may include wavelength conversion means for receiving the light emitted from the light emitting device 120 and providing the wavelength-converted light. For example, the second resin 140 may include a phosphor, a quantum dot, and the like.

According to an embodiment, after the light emitting device 120 is mounted on the body 110, the first and second conductors 321 and 322 are provided in the first and second openings TH1 and TH2. Can be. In addition, the first and second frames 211 and 212 may be provided in the first and second openings TH1 and TH2, and curing of the first and second conductors 321 and 322 may be performed. have.

For example, the first and second conductors 321 and 322 may be provided as conductive adhesives. The first and second conductors 321 and 322 may be provided in the first and second openings TH1 and TH2 through a method such as dotting or jetting.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2 to contact the first and second conductors 321 and 322, respectively. The hardening process enables the first and second frames 211 and 212 to be stably mounted in the first and second openings TH1 and TH2.

For example, the first and second conductors 321 and 322 may include at least one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited thereto, and the first and second conductors 321 and 322 may be formed of a material capable of securing a conductive function.

For example, the first and second conductors 321 and 322 may be formed using a conductive paste. The conductive paste may include a solder paste, a silver paste, or the like, and may include a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. For example, the first and second conductors 321 and 322 may include SAC (Sn-Ag-Cu) materials.

The first and second frames 211 and 212 may be provided as conductive frames. The first and second frames 211 and 212 may include a metal layer and a plating layer formed on the metal layer. The first and second frames 211 and 222 may include a single layer or a multilayer including at least one material selected from the group including Cu, Ni, Ag, and the like. In addition, the first and second frames 211 and 222 may include an alloy layer including at least one material selected from the group consisting of Cu, Ni, Ag, and the like.

In the light emitting device package 300 according to the embodiment, power is connected to the first bonding part 121 through the first conductor 321 and the first frame 211 provided in the first opening TH1. In addition, power may be connected to the second bonding part 122 through the second conductor 322 and the second frame 212 provided in the second opening TH2.

Accordingly, the light emitting device 120 may be driven by driving power supplied through the first bonding part 121 and the second bonding part 122. In addition, the light emitted from the light emitting device 120 may be provided in an upper direction of the body 110.

On the other hand, the light emitting device package 300 according to the embodiment described above may be mounted and supplied to a sub-mount or a circuit board.

However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high temperature process such as a reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, thereby weakening the stability of the electrical connection and the physical coupling.

However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding portion and the second bonding portion 121, 122 of the light emitting device 120 according to the embodiment is the first and second The driving power may be provided through the second conductors 321 and 322 and the first and second frames 211 and 212. The melting point of the first and second conductors 321 and 322 may be selected to have a higher value than the melting point of the general bonding material.

Therefore, the light emitting device package 300 according to the embodiment does not cause a remelting phenomenon even when bonded to a main substrate through a reflow process, so that electrical connection and physical bonding force are not degraded. There is no advantage.

In addition, according to the light emitting device package 300 and the light emitting device package manufacturing method according to the embodiment, a conductive paste may be used as the first and second conductors 321 and 322, a process for manufacturing a light emitting device package In the body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, the body 110 may be prevented from being damaged or discolored due to exposure to high temperature.

Accordingly, the selection range for the material constituting the body 110 can be widened. According to an embodiment, the body 110 may be provided using a relatively inexpensive resin material as well as an expensive material such as a ceramic.

For example, the body 110 may include at least one material selected from the group consisting of PolyPhtalAmide (PPA) resin, PolyCyclohexylenedimethylene Terephthalate (PCT) resin, epoxy molding compound (EMC) resin, and silicone molding compound (SMC) resin. can do.

In addition, according to the light emitting device package 300 according to the embodiment, the first frame 211 and the second frame 212 may be spaced apart from each other at a sufficient distance from the lower surface of the body 110. . Accordingly, when the light emitting device package 300 according to the embodiment is mounted on the sub-mount or the main substrate, the light emitting device package 300 may be electrically connected to the sub-mount or the main substrate through the first and second frames 211 and 212. An electrical short may be prevented between the first and second frames 211 and 212.

Next, another example of the light emitting device package according to the embodiment will be described with reference to FIG. 7. 7 is a view showing another example of a light emitting device package according to an embodiment of the present invention.

In the description of the light emitting device package according to the exemplary embodiment with reference to FIG. 7, the descriptions overlapping the contents described with reference to FIGS. 1 to 6 may be omitted.

The light emitting device package 400 according to the embodiment may include a body 110 and the light emitting device 120.

The body 110 may include a first body 111 and a second body 113. The second body 113 may be disposed on the first body 111. The second body 113 may be disposed around the upper surface of the first body 111. The second body 113 may provide a cavity C on an upper surface of the first body 111.

In example embodiments, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.

The first bonding part 121 may be disposed on the bottom surface of the light emitting device 120. The second bonding part 122 may be disposed on the bottom surface of the light emitting device 120. The first bonding part 121 and the second bonding part 122 may be spaced apart from each other on the bottom surface of the light emitting device 120.

The light emitting device package 400 according to the embodiment may include a first opening TH1 and a second opening TH2.

The first opening TH1 may be provided in the first body 111. The first opening TH1 may be provided through the first body 111. The first opening TH1 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The first opening TH1 may be disposed under the light emitting device 120. The first opening TH1 may be provided to overlap with the first bonding part 121 of the light emitting device 120. The first opening TH1 may be provided to overlap the first bonding part 121 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, a lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first opening TH1. A lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first body 111.

The second opening TH2 may be provided in the first body 111. The second opening TH2 may be provided through the first body 111. The second opening TH2 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The second opening TH2 may be disposed under the light emitting device 120. The second opening TH2 may overlap the second bonding part 122 of the light emitting device 120. The second opening TH2 may be provided to overlap the second bonding part 122 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, the lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the second opening TH2. The lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the first body 111.

The first opening TH1 and the second opening TH2 may be spaced apart from each other. The first opening TH1 and the second opening TH2 may be spaced apart from each other under a lower surface of the light emitting device 120.

According to an embodiment, the body 110 may include an upper surface and a lower surface. The body 110 may include first and second openings TH1 and TH2 penetrating the upper surface and the lower surface. The light emitting device package 300 according to the embodiment may include the first and second bonding parts 121 and 122 disposed on the first and second openings TH1 and TH2.

The first and second bonding parts 121 and 122 may be provided with a first width in a first direction parallel to the first side surface of the light emitting device 120. The first and second openings TH1 and TH2 may be provided with a second width smaller than the first width in a direction parallel to the first direction.

The first side surface of the light emitting device 120 may be a side surface along the long axis direction of the light emitting device 120. In addition, the first side surface of the light emitting device 120 may be a side surface along the short axis direction of the light emitting device 120.

In addition, the light emitting device package 400 according to the embodiment may include first and second conductors 321 and 322 and first and second metal layers 231 and 232. For example, the first and second metal layers 231 and 232 may be formed in the first and second openings TH1 and TH2 through deposition or plating.

The first and second metal layers 231 and 232 may be referred to as first and second frames similarly to the light emitting device package according to the exemplary embodiment described above.

The first and second conductors 321 and 332 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second conductors 321 and 322 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first and second metal layers 231 and 232 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second metal layers 231 and 232 may be electrically connected to the first and second conductors 321 and 322, respectively. The first and second metal layers 231 and 232 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first conductor 321 may be disposed in the first opening TH1 and may be electrically connected to the first bonding part 121. The first conductor 321 may be disposed between the first bonding part 121 and the first metal layer 231 in the first opening TH1.

The second conductor 322 may be disposed in the second opening TH2 and may be electrically connected to the second bonding part 122. The second conductor 322 may be disposed between the second bonding part 122 and the second metal layer 232 in the second opening TH2.

The first opening TH1 may include a first portion S1 and a second portion S2. The first portion S1 may be provided to overlap with the first bonding portion 121 in the vertical direction. The second portion S2 may be provided below the first portion S1. The second part S2 may be connected to the first part S1. The width of the upper region of the second portion S2 may be provided larger than the width of the lower region of the first portion S1.

The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the body 110. The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the first body 111. The second portion S2 may be provided in the form of a recess on a lower surface of the first body 111.

The first metal layer 231 may be disposed in the first and second portions S1 and S2 of the first opening TH1.

The first metal layer 231 extends in an upper direction from an upper surface of the first portion and the first portion disposed in parallel to the lower surface of the body 110 in the first opening TH1 and the first bonding portion. It may include a second portion in direct contact with the bottom surface of (121).

The second opening TH2 may include a third portion S3 and a fourth portion S4. The third portion S3 may be provided to overlap with the second bonding portion 122 in the vertical direction. The fourth part S4 may be provided below the third part S3. The fourth part S4 may be connected to the third part S3. The width of the upper region of the fourth portion S4 may be provided larger than the width of the lower region of the third portion S3.

The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the body 110. The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the first body 111. The fourth portion S4 may be provided in the form of a recess on the bottom surface of the first body 111.

The second metal layer 232 may be disposed in the third and fourth portions S3 and S4 of the second opening TH2.

The second metal layer 232 extends in an upper direction from an upper surface of the third portion disposed in parallel to the lower surface of the body 110 in the second opening TH2 and the second bonding portion. And a fourth portion in direct contact with the bottom surface of 122.

The light emitting device package 400 according to the embodiment may include the first resin 130.

The first resin 130 may be disposed between the light emitting device 120 and the first body 111. The first resin 130 may be disposed between the first bonding portion 121 and the second bonding portion 122. For example, the first resin 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.

The first resin 130 may be provided on the entire bottom surface of the cavity provided by the second body 113. The first resin 130 may be disposed on an upper surface of the first body 111 exposed by the second body 113. When viewed from an upper direction of the light emitting device 120, the first resin 130 may be disposed around the light emitting device 120.

In addition, the physical properties of the first resin 130 may be selected in consideration of Coefficient of Thermal Expansion (CTE) matching between the first resin 130, the body 110, and the light emitting device 120. The first resin 130 may be selected from resins having a low CTE value. In this case, the first resin 130 may be referred to as a low CTE bottom reflector (LCBR), and may improve a problem in which a crack or peeling problem due to thermal shock occurs.

In some embodiments, the first resin 130 may be provided in a portion of the body 110 provided with the first and second openings TH1 and TH2. For example, the first resin 130 may be provided on a portion of the upper surface of the first body 111 through a method such as application, dotting, or injection.

Subsequently, the light emitting device 120 may be attached onto the first body 111. Accordingly, the first resin 130 may be diffused and moved between the light emitting device 120 and the first body 111. The first resin 130 may be provided to be spread around the first and second bonding parts 121 and 122. The first resin 130 may also be disposed in a region between the first and second bonding portions 121 and 122 and the first and second openings TH1 and TH2. In addition, the first resin 130 may be controlled not to move into the first and second openings TH1 and TH2 due to viscosity and surface tension.

In addition, the first resin 130 may be disposed under the light emitting device 120 to perform a sealing function. The first resin 130 may seal upper regions of the first and second openings TH1 and TH2. The first resin 130 may seal the peripheral regions of the first and second bonding parts 121 and 122. Accordingly, moisture or foreign matter from the first and second openings TH1 and TH2 may be blocked from entering the region where the light emitting device 120 is disposed.

In addition, the light emitting device package 400 according to the embodiment may include a second resin 140.

The second resin 140 may be provided on the light emitting device 120. The second resin 140 may be disposed on the first body 111. The second resin 140 may be disposed in the cavity C provided by the second body 113.

The second resin 140 may include an insulating material. The second resin 140 may be provided as a clear molding member. For example, the second resin 140 may include a silicone-based or epoxy-based resin.

In addition, the second resin 140 may include wavelength conversion means for receiving the light emitted from the light emitting device 120 and providing the wavelength-converted light. For example, the second resin 140 may include a phosphor, a quantum dot, and the like.

For example, the first and second conductors 321 and 322 may be provided as conductive adhesives. The first and second conductors 321 and 322 may be provided in the first and second openings TH1 and TH2 through a method such as dotting or jetting.

For example, the first and second conductors 321 and 322 may include at least one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited thereto, and the first and second conductors 321 and 322 may be formed of a material capable of securing a conductive function.

For example, the first and second conductors 321 and 322 may be formed using a conductive paste. The conductive paste may include a solder paste, a silver paste, or the like, and may include a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. For example, the first and second conductors 321 and 322 may include SAC (Sn-Ag-Cu) materials.

The first and second metal layers 231 and 232 may include a single layer or a multilayer including at least one material selected from the group including Cu, Ni, Ag, and the like. In addition, the first and second metal layers 231 and 232 may include an alloy layer including at least one material selected from the group consisting of Cu, Ni, Ag, and the like.

In the light emitting device package 400 according to the embodiment, power is connected to the first bonding part 121 through the first conductor 321 and the first metal layer 231 provided in the first opening TH1. The power may be connected to the second bonding portion 122 through the second conductor 322 and the second metal layer 232 provided in the second opening TH2.

Accordingly, the light emitting device 120 may be driven by driving power supplied through the first bonding part 121 and the second bonding part 122. In addition, the light emitted from the light emitting device 120 may be provided in an upper direction of the body 110.

On the other hand, the light emitting device package 400 according to the embodiment described above may be mounted on a sub-mount or a circuit board and supplied.

However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high temperature process such as a reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, thereby weakening the stability of the electrical connection and the physical coupling.

However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding portion and the second bonding portion 121, 122 of the light emitting device 120 according to the embodiment is the first and second The driving power may be provided through the second conductors 321 and 322 and the first and second metal layers 231 and 232. The melting point of the first and second conductors 321 and 322 may be selected to have a higher value than the melting point of the general bonding material.

Therefore, the light emitting device package 400 according to the embodiment does not deteriorate the electrical connection and the physical bonding force since remelting does not occur even when the main substrate is bonded to the main substrate through a reflow process. There is no advantage.

In addition, according to the light emitting device package 400 and the light emitting device package manufacturing method according to the embodiment, a conductive paste may be used as the first and second conductors 321 and 322, and a process for manufacturing a light emitting device package In the body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, the body 110 may be prevented from being damaged or discolored due to exposure to high temperature.

Accordingly, the selection range for the material constituting the body 110 can be widened. According to an embodiment, the body 110 may be provided using a relatively inexpensive resin material as well as an expensive material such as a ceramic.

For example, the body 110 may include at least one material selected from the group consisting of PolyPhtalAmide (PPA) resin, PolyCyclohexylenedimethylene Terephthalate (PCT) resin, epoxy molding compound (EMC) resin, and silicone molding compound (SMC) resin. can do.

In addition, according to the light emitting device package 400 according to the embodiment, the first metal layer 231 and the second metal layer 232 may be spaced apart from each other at a sufficient distance from the lower surface of the body 110. . Accordingly, when the light emitting device package 400 according to the embodiment is mounted on a sub mount or a main substrate, the light emitting device package 400 may be electrically connected to the sub mount or the main substrate through the first and second metal layers 231 and 232. In addition, an electrical short may be prevented between the first and second metal layers 231 and 232.

Next, another example of the light emitting device package according to the embodiment will be described with reference to FIG. 8. 8 is a view showing another example of a light emitting device package according to an embodiment of the present invention.

In the description of the light emitting device package according to the exemplary embodiment with reference to FIG. 8, the descriptions that are the same as those described with reference to FIGS. 1 to 7 may be omitted.

The light emitting device package 500 according to the embodiment may include a body 110 and the light emitting device 120.

The body 110 may include a first body 111 and a second body 113. The second body 113 may be disposed on the first body 111. The second body 113 may be disposed around the upper surface of the first body 111. The second body 113 may provide a cavity C on an upper surface of the first body 111.

In example embodiments, the light emitting device 120 may include a first bonding part 121, a second bonding part 122, a light emitting structure 123, and a substrate 124.

The first bonding part 121 may be disposed on the bottom surface of the light emitting device 120. The second bonding part 122 may be disposed on the bottom surface of the light emitting device 120. The first bonding part 121 and the second bonding part 122 may be spaced apart from each other on the bottom surface of the light emitting device 120.

The light emitting device package 500 according to the embodiment may include a first opening TH1 and a second opening TH2.

The body 110 may include the first opening TH1 penetrating the bottom surface of the body 110 from the bottom surface of the cavity C. The body 110 may include the second opening TH2 penetrating the bottom surface of the body 110 from the bottom surface of the cavity C.

The first opening TH1 may be provided in the first body 111. The first opening TH1 may be provided through the first body 111. The first opening TH1 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The first opening TH1 may be disposed under the light emitting device 120. The first opening TH1 may be provided to overlap with the first bonding part 121 of the light emitting device 120. The first opening TH1 may be provided to overlap the first bonding part 121 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, a lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first opening TH1. A lower surface of the first bonding part 121 may be disposed higher than an upper surface of the first body 111.

The second opening TH2 may be provided in the first body 111. The second opening TH2 may be provided through the first body 111. The second opening TH2 may be provided through the upper and lower surfaces of the first body 111 in the first direction.

The second opening TH2 may be disposed under the light emitting device 120. The second opening TH2 may overlap the second bonding part 122 of the light emitting device 120. The second opening TH2 may be provided to overlap the second bonding part 122 of the light emitting device 120 in a first direction from the upper surface of the first body 111 to the lower surface.

For example, the lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the second opening TH2. The lower surface of the second bonding portion 122 may be disposed higher than the upper surface of the first body 111.

The first opening TH1 and the second opening TH2 may be spaced apart from each other. The first opening TH1 and the second opening TH2 may be spaced apart from each other under a lower surface of the light emitting device 120.

According to an embodiment, the body 110 may include an upper surface and a lower surface. The body 110 may include first and second openings TH1 and TH2 penetrating the upper surface and the lower surface. The light emitting device package 500 according to the embodiment may include the first and second bonding parts 121 and 122 disposed on the first and second openings TH1 and TH2.

The first and second bonding parts 121 and 122 may be provided with a first width in a first direction parallel to the first side surface of the light emitting device 120. The first and second openings TH1 and TH2 may be provided with a second width smaller than the first width in a direction parallel to the first direction.

The first side surface of the light emitting device 120 may be a side surface along the long axis direction of the light emitting device 120. In addition, the first side surface of the light emitting device 120 may be a side surface along the short axis direction of the light emitting device 120.

In addition, the light emitting device package 500 according to the embodiment may include first and second conductive parts 221 and 222, first and second conductors 321 and 322, and first and second frames 211 and 212. ) May be included.

The first and second conductive parts 221 and 222 may extend from the lower surfaces of the first and second bonding parts 121 and 122 into the first and second openings TH1 and TH2, respectively. .

The first and second conductors 321 and 332 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second conductors 321 and 322 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second conductors 321 and 322, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second bonding parts 121 and 122, respectively.

The first conductor 321 may be disposed in the first opening TH1 and may be electrically connected to the first bonding part 121. The first conductor 321 may be disposed between the first bonding part 121 and the first frame 211 in the first opening TH1. The first conductor 321 may be disposed between the side surface of the first conductive portion 221 and the side surface of the body 110 providing the first opening TH1. In addition, the first conductor 321 may be disposed between the bottom surface of the first conductive portion 221 and the top surface of the first frame 211.

The second conductor 322 may be disposed in the second opening TH2 and may be electrically connected to the second bonding part 122. The second conductor 322 may be disposed between the second bonding part 122 and the second frame 212 in the second opening TH2. The second conductor 322 may be disposed between the side surface of the second conductive portion 222 and the side surface of the body 110 providing the second opening TH2. In addition, the second conductor 322 may be disposed between the bottom surface of the second conductive portion 222 and the top surface of the second frame 212.

The first opening TH1 may include a first portion S1 and a second portion S2. The first portion S1 may be provided to overlap with the first bonding portion 121 in the vertical direction. The second portion S2 may be provided below the first portion S1. The second part S2 may be connected to the first part S1. The width of the upper region of the second portion S2 may be provided larger than the width of the lower region of the first portion S1.

The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the body 110. The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the first body 111. The second portion S2 may be provided in the form of a recess on a lower surface of the first body 111.

The first frame 211 may be disposed in the first and second portions S1 and S2 of the first opening TH1.

The first frame 211 protrudes from the upper surface of the first portion and the first portion disposed in parallel to the lower surface of the body 110 in the first opening TH1 to the first conductor. It may include a second portion in direct contact with the bottom surface of 321.

The second opening TH2 may include a third portion S3 and a fourth portion S4. The third portion S3 may be provided to overlap with the second bonding portion 122 in the vertical direction. The fourth part S4 may be provided below the third part S3. The fourth part S4 may be connected to the third part S3. The width of the upper region of the fourth portion S4 may be provided larger than the width of the lower region of the third portion S3.

The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the body 110. The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the first body 111. The fourth portion S4 may be provided in the form of a recess on the bottom surface of the first body 111.

The second frame 212 may be disposed in the third and fourth portions S3 and S4 of the second opening TH2.

The second frame 212 protrudes from the upper surface of the third portion disposed in parallel with the lower surface of the body 110 in the second opening TH2 and from the upper surface of the third conductor to form the second conductor. And a fourth portion in direct contact with the bottom surface of 322.

The first conductive portion 221 may be disposed under the first bonding portion 121. The first conductive portion 221 may be electrically connected to the first bonding portion 121. The first conductive portion 221 may be disposed to overlap the first bonding portion 121 in the first direction.

The first conductive portion 221 may be provided in the first opening TH1. The first conductive portion 221 may be disposed between the first bonding portion 121 and the first conductor 321. The first conductive portion 221 may be electrically connected to the first bonding portion 121 and the first conductor 321.

The lower surface of the first conductive portion 221 may be disposed lower than the upper surface of the first opening TH1. The lower surface of the first conductive portion 221 may be disposed lower than the upper surface of the first conductor 321.

The first conductive portion 221 may be disposed on the first opening TH1. In addition, the first conductive portion 221 may extend from the first bonding portion 121 to the inside of the first opening TH1.

In addition, the second conductive portion 222 may be disposed under the second bonding portion 122. The second conductive portion 222 may be electrically connected to the second bonding portion 122. The second conductive portion 222 may be disposed to overlap the second bonding portion 122 in the first direction.

The second conductive portion 222 may be provided in the second opening TH2. The second conductive portion 222 may be disposed between the second bonding portion 122 and the second conductor 322. The second conductive portion 222 may be electrically connected to the second bonding portion 122 and the second conductor 322.

The lower surface of the second conductive portion 222 may be disposed lower than the upper surface of the second opening TH2. The lower surface of the second conductive portion 222 may be lower than the upper surface of the second conductor 322.

The second conductive portion 222 may be disposed on the second opening TH2. In addition, the second conductive portion 222 may extend from the second bonding portion 122 to the inside of the second opening TH2.

According to an embodiment, the first conductor 321 may be disposed on the bottom and side surfaces of the first conductive portion 221. The first conductor 321 may be disposed in direct contact with a lower surface and a side surface of the first conductive portion 221.

In addition, according to an embodiment, the second conductor 322 may be disposed on the lower surface and the side surface of the second conductive portion 222. The second conductor 322 may be disposed in direct contact with a lower surface and a side surface of the second conductive portion 222.

As described above, according to the light emitting device package according to the embodiment, the first and second conductors 321 and 322 and the first and second bonding parts may be formed by the first and second conductive parts 221 and 222. The electrical coupling between 121 and 122 can be provided more stably.

For example, the first and second conductive parts 221 and 222 may be stably bonded to the first and second bonding parts 121 and 122 through separate bonding materials, respectively. In addition, side and bottom surfaces of the first and second conductive parts 221 and 222 may contact the first and second conductors 321 and 322, respectively.

In addition, the first and second conductive parts 221 and 222 may be provided to the first and second bonding parts 121 and 122 through a plating process. For example, a seed layer is provided on the first and second bonding portions 121 and 122 at a wafer level on which a plurality of light emitting devices are formed, and a mask layer such as a photoresist film is formed on the seed layer, followed by plating. The process can be performed. After the plating process is performed, the first and second conductive parts 221 and 222 may be formed only in a predetermined region of the first and second bonding parts 121 and 122 by removing the photoresist film.

For example, the first and second conductive parts 221 and 222 may be formed as a single layer or a multilayer including at least one material selected from the group including Ag, Au, Cu, Ti, Ni, and the like. In addition, the first and second conductive parts 221 and 222 may include the seed layer. The seed layer may be formed as a single layer or a multilayer including at least one material selected from the group including, for example, Ti, Ni, Cu, and the like.

The first and second conductive parts 221 and 222 may be provided in, for example, a circular columnar shape or a polygonal columnar shape. Shapes of the first and second conductive parts 221 and 222 may be selected corresponding to shapes of upper regions of the first and second openings TH1 and TH2. Widths or diameters of the first and second conductive parts 221 and 222 may be provided smaller than widths or diameters of upper regions of the first and second openings TH1 and TH2.

The first and second conductive parts 221 and 222 and the first and second bonding parts 121 and 122 may be formed of different materials in separate processes. Accordingly, the first and second conductive parts 221 and 222 and the first and second bonding parts 121 and 122 may include different materials and different stacked structures.

According to an embodiment, the first and second conductors 321 and 322 may be disposed on the lower surfaces of the first and second bonding parts 121 and 122 without providing the first and second conductive parts 221 and 222. Compared to the direct contact, the area where the first and second conductors 321 and 322 are in contact with the first and second conductive parts 221 and 222 may be larger. Accordingly, power is stable from the first and second conductors 321 and 322 to the first and second bonding parts 121 and 122 through the first and second conductive parts 221 and 222, respectively. Can be supplied.

The light emitting device package 500 according to the embodiment may include the first resin 130.

The first resin 130 may be disposed between the light emitting device 120 and the first body 111. The first resin 130 may be disposed between the first bonding portion 121 and the second bonding portion 122. For example, the first resin 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.

The first resin 130 may be provided on the entire bottom surface of the cavity provided by the second body 113. The first resin 130 may be disposed on an upper surface of the first body 111 exposed by the second body 113. When viewed from an upper direction of the light emitting device 120, the first resin 130 may be disposed around the light emitting device 120.

In addition, the physical properties of the first resin 130 may be selected in consideration of Coefficient of Thermal Expansion (CTE) matching between the first resin 130, the body 110, and the light emitting device 120. The first resin 130 may be selected from resins having a low CTE value. In this case, the first resin 130 may be referred to as a low CTE bottom reflector (LCBR), and may improve a problem in which a crack or peeling problem due to thermal shock occurs.

In some embodiments, the first resin 130 may be provided in a portion of the body 110 provided with the first and second openings TH1 and TH2. For example, the first resin 130 may be provided on a portion of the upper surface of the first body 111 through a method such as application, dotting, or injection.

Subsequently, the light emitting device 120 may be attached onto the first body 111. Accordingly, the first resin 130 may be diffused and moved between the light emitting device 120 and the first body 111. The first resin 130 may be provided to be spread around the first and second bonding parts 121 and 122. The first resin 130 may also be disposed in a region between the first and second bonding portions 121 and 122 and the first and second openings TH1 and TH2. In addition, the first resin 130 may be controlled not to move into the first and second openings TH1 and TH2 due to viscosity and surface tension.

In addition, the first resin 130 may be disposed under the light emitting device 120 to perform a sealing function. The first resin 130 may seal upper regions of the first and second openings TH1 and TH2. The first resin 130 may seal the peripheral regions of the first and second bonding parts 121 and 122. Accordingly, moisture or foreign matter from the first and second openings TH1 and TH2 may be blocked from entering the region where the light emitting device 120 is disposed.

In addition, the light emitting device package 500 according to the embodiment may include a second resin 140.

The second resin 140 may be provided on the light emitting device 120. The second resin 140 may be disposed on the first body 111. The second resin 140 may be disposed in the cavity C provided by the second body 113.

The second resin 140 may include an insulating material. The second resin 140 may be provided as a clear molding member. For example, the second resin 140 may include a silicone-based or epoxy-based resin.

In addition, the second resin 140 may include wavelength conversion means for receiving the light emitted from the light emitting device 120 and providing the wavelength-converted light. For example, the second resin 140 may include a phosphor, a quantum dot, and the like.

According to an embodiment, after the light emitting device 120 is mounted on the body 110, the first and second conductors 321 and 322 are provided in the first and second openings TH1 and TH2. Can be. In addition, the first and second frames 211 and 212 may be provided in the first and second openings TH1 and TH2, and curing of the first and second conductors 321 and 322 may be performed. have.

For example, the first and second conductors 321 and 322 may be provided as conductive adhesives. The first and second conductors 321 and 322 may be provided in the first and second openings TH1 and TH2 through a method such as dotting or jetting.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2 to contact the first and second conductors 321 and 322, respectively. The hardening process enables the first and second frames 211 and 212 to be stably mounted in the first and second openings TH1 and TH2.

For example, the first and second conductors 321 and 322 may include at least one material selected from the group including Ag, Au, Pt, Sn, Cu, or an alloy thereof. However, the present invention is not limited thereto, and the first and second conductors 321 and 322 may be formed of a material capable of securing a conductive function.

For example, the first and second conductors 321 and 322 may be formed using a conductive paste. The conductive paste may include a solder paste, a silver paste, or the like, and may include a multilayer or a single layer composed of a multilayer or an alloy composed of different materials. For example, the first and second conductors 321 and 322 may include SAC (Sn-Ag-Cu) materials.

The first and second frames 211 and 212 may be provided as conductive frames. The first and second frames 211 and 212 may include a metal layer and a plating layer formed on the metal layer. The first and second frames 211 and 222 may include a single layer or a multilayer including at least one material selected from the group including Cu, Ni, Ag, and the like. In addition, the first and second frames 211 and 222 may include an alloy layer including at least one material selected from the group consisting of Cu, Ni, Ag, and the like.

In the light emitting device package 500 according to the embodiment, power is connected to the first bonding part 121 through the first conductor 321 and the first frame 211 provided in the first opening TH1. In addition, power may be connected to the second bonding part 122 through the second conductor 322 and the second frame 212 provided in the second opening TH2.

Accordingly, the light emitting device 120 may be driven by driving power supplied through the first bonding part 121 and the second bonding part 122. In addition, the light emitted from the light emitting device 120 may be provided in an upper direction of the body 110.

On the other hand, the light emitting device package 500 according to the embodiment described above may be mounted on a sub-mount or a circuit board and supplied.

However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high temperature process such as a reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, thereby weakening the stability of the electrical connection and the physical coupling.

However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding portion and the second bonding portion 121, 122 of the light emitting device 120 according to the embodiment is the first and second The driving power may be provided through the second conductors 321 and 322 and the first and second frames 211 and 212. The melting point of the first and second conductors 321 and 322 may be selected to have a higher value than the melting point of the general bonding material.

Accordingly, the light emitting device package 500 according to the embodiment does not cause re-melting even when bonded to a main substrate through a reflow process, so that electrical connection and physical bonding force are not degraded. There is no advantage.

In addition, according to the light emitting device package 500 and the light emitting device package manufacturing method according to an embodiment, a conductive paste may be used as the first and second conductors 321 and 322, and manufacturing a light emitting device package. In the body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, the body 110 may be prevented from being damaged or discolored due to exposure to high temperature.

Accordingly, the selection range for the material constituting the body 110 can be widened. According to an embodiment, the body 110 may be provided using a relatively inexpensive resin material as well as an expensive material such as a ceramic.

For example, the body 110 may include at least one material selected from the group consisting of PolyPhtalAmide (PPA) resin, PolyCyclohexylenedimethylene Terephthalate (PCT) resin, epoxy molding compound (EMC) resin, and silicone molding compound (SMC) resin. can do.

In addition, according to the light emitting device package 500 according to the embodiment, the first frame 211 and the second frame 212 may be spaced apart from each other at a sufficient distance from the lower surface of the body 110. . Accordingly, when the light emitting device package 500 according to the embodiment is mounted on a sub-mount or main board, the light-emitting device package 500 may be electrically connected to the sub-mount or main board through the first and second frames 211 and 212. An electrical short may be prevented between the first and second frames 211 and 212.

Next, another example of the light emitting device package according to the embodiment will be described with reference to FIG. 9. 9 is a view showing another example of a light emitting device package according to an embodiment of the present invention.

In the description of the light emitting device package according to the exemplary embodiment with reference to FIG. 9, the descriptions overlapping the contents described with reference to FIGS. 1 to 8 may be omitted.

The light emitting device package 600 according to the embodiment may have first and second openings TH1 and TH2 and the first and second frames 211 as compared with the light emitting device package according to the embodiments described with reference to FIGS. 1 to 8. , There is a difference in the arrangement position of 212).

The light emitting device package 600 according to the embodiment may include a body 110 and a light emitting device 120.

The body 110 may include an upper surface and a lower surface. The body 110 may include first and second openings TH1 and TH2 penetrating the upper surface and the lower surface. The light emitting device 120 may include first and second bonding parts 121 and 122 disposed on the first and second openings TH1 and TH2.

In addition, the light emitting device package 600 according to the embodiment may include first and second conductors 321 and 322 and first and second frames 211 and 212.

The first and second conductors 321 and 332 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second conductors 321 and 322 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second conductors 321 and 322, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second bonding parts 121 and 122, respectively.

The first conductor 321 may be disposed in the first opening TH1 and may be electrically connected to the first bonding part 121. The first conductor 321 may be disposed between the first bonding part 121 and the first frame 211 in the first opening TH1.

The second conductor 322 may be disposed in the second opening TH2 and may be electrically connected to the second bonding part 122. The second conductor 322 may be disposed between the second bonding part 122 and the second frame 212 in the second opening TH2.

The first opening TH1 may include a first portion S1 and a second portion S2. The first portion S1 may be provided to overlap with the first bonding portion 121 in the vertical direction. The second portion S2 may be provided below the first portion S1. The second part S2 may be connected to the first part S1. The width of the upper region of the second portion S2 may be provided larger than the width of the lower region of the first portion S1.

The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the body 110. The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the first body 111. The second portion S2 may be provided in the form of a recess on a lower surface of the first body 111.

The first frame 211 may be disposed in the first and second portions S1 and S2 of the first opening TH1.

The first frame 211 protrudes from the upper surface of the first portion and the first portion disposed in parallel to the lower surface of the body 110 in the first opening TH1 to the first conductor. It may include a second portion in direct contact with the bottom surface of 321.

When viewed from the upper direction of the light emitting device 120, the first frame 211 may be disposed in an area defined by the bottom surface of the cavity C. The second portion of the first opening TH1 may be disposed in an area defined by the bottom surface of the cavity.

The second opening TH2 may include a third portion S3 and a fourth portion S4. The third portion S3 may be provided to overlap with the second bonding portion 122 in the vertical direction. The fourth part S4 may be provided below the third part S3. The fourth part S4 may be connected to the third part S3. The width of the upper region of the fourth portion S4 may be provided larger than the width of the lower region of the third portion S3.

The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the body 110. The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the first body 111. The fourth portion S4 may be provided in the form of a recess on the bottom surface of the first body 111.

The second frame 212 may be disposed in the third and fourth portions S3 and S4 of the second opening TH2.

The second frame 212 protrudes from the upper surface of the third portion disposed in parallel with the lower surface of the body 110 in the second opening TH2 and from the upper surface of the third conductor to form the second conductor. And a fourth portion in direct contact with the bottom surface of 322.

When viewed from the upper direction of the light emitting device 120, the second frame 212 may be disposed in an area defined by the bottom surface of the cavity C. The second portion of the second opening TH2 may be disposed in an area defined by the bottom surface of the cavity.

The light emitting device package 600 according to the embodiment may include the first resin 130.

The first resin 130 may be disposed between the light emitting device 120 and the first body 111. The first resin 130 may be disposed between the first bonding portion 121 and the second bonding portion 122. For example, the first resin 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.

The first resin 130 may be provided on the entire bottom surface of the cavity provided by the second body 113. The first resin 130 may be disposed on an upper surface of the first body 111 exposed by the second body 113. When viewed from an upper direction of the light emitting device 120, the first resin 130 may be disposed around the light emitting device 120.

In addition, the physical properties of the first resin 130 may be selected in consideration of Coefficient of Thermal Expansion (CTE) matching between the first resin 130, the body 110, and the light emitting device 120. The first resin 130 may be selected from resins having a low CTE value. In this case, the first resin 130 may be referred to as a low CTE bottom reflector (LCBR), and may improve a problem in which a crack or peeling problem due to thermal shock occurs.

In addition, the first resin 130 may be disposed under the light emitting device 120 to perform a sealing function. The first resin 130 may seal upper regions of the first and second openings TH1 and TH2. The first resin 130 may seal the peripheral regions of the first and second bonding parts 121 and 122. Accordingly, moisture or foreign matter from the first and second openings TH1 and TH2 may be blocked from entering the region where the light emitting device 120 is disposed.

In addition, the light emitting device package 600 according to the embodiment may include a second resin 140.

The second resin 140 may be provided on the light emitting device 120. The second resin 140 may be disposed on the first body 111. The second resin 140 may be disposed in the cavity C provided by the second body 113.

The second resin 140 may include an insulating material. The second resin 140 may be provided as a clear molding member. For example, the second resin 140 may include a silicone-based or epoxy-based resin.

In addition, the second resin 140 may include wavelength conversion means for receiving the light emitted from the light emitting device 120 and providing the wavelength-converted light. For example, the second resin 140 may include a phosphor, a quantum dot, and the like.

According to an embodiment, after the light emitting device 120 is mounted on the body 110, the first and second conductors 321 and 322 are provided in the first and second openings TH1 and TH2. Can be. In addition, the first and second frames 211 and 212 may be provided in the first and second openings TH1 and TH2, and curing of the first and second conductors 321 and 322 may be performed. have.

For example, the first and second conductors 321 and 322 may be provided as conductive adhesives. The first and second conductors 321 and 322 may be provided in the first and second openings TH1 and TH2 through a method such as dotting or jetting.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2 to contact the first and second conductors 321 and 322, respectively. The hardening process enables the first and second frames 211 and 212 to be stably mounted in the first and second openings TH1 and TH2.

In the light emitting device package 600 according to the embodiment, power is connected to the first bonding part 121 through the first conductor 321 and the first frame 211 provided in the first opening TH1. In addition, power may be connected to the second bonding part 122 through the second conductor 322 and the second frame 212 provided in the second opening TH2.

Accordingly, the light emitting device 120 may be driven by driving power supplied through the first bonding part 121 and the second bonding part 122. In addition, the light emitted from the light emitting device 120 may be provided in an upper direction of the body 110.

On the other hand, the light emitting device package 600 according to the embodiment described above may be mounted on a sub-mount or a circuit board and supplied.

However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high temperature process such as a reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, thereby weakening the stability of the electrical connection and the physical coupling.

However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding portion and the second bonding portion 121, 122 of the light emitting device 120 according to the embodiment is the first and second The driving power may be provided through the second conductors 321 and 322 and the first and second frames 211 and 212. The melting point of the first and second conductors 321 and 322 may be selected to have a higher value than the melting point of the general bonding material.

Therefore, the light emitting device package 600 according to the embodiment does not cause a remelting phenomenon even when bonded to a main substrate through a reflow process, so that electrical connection and physical bonding force are not degraded. There are advantages.

In addition, according to the light emitting device package 600 and the light emitting device package manufacturing method according to the embodiment, a conductive paste may be used as the first and second conductors 321 and 322, a process for manufacturing a light emitting device package In the body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, the body 110 may be prevented from being damaged or discolored due to exposure to high temperature.

Accordingly, the selection range for the material constituting the body 110 can be widened. According to an embodiment, the body 110 may be provided using a relatively inexpensive resin material as well as an expensive material such as a ceramic.

For example, the body 110 may include at least one material selected from the group consisting of PolyPhtalAmide (PPA) resin, PolyCyclohexylenedimethylene Terephthalate (PCT) resin, epoxy molding compound (EMC) resin, and silicone molding compound (SMC) resin. can do.

In addition, according to the light emitting device package 600 according to the embodiment, the first frame 211 and the second frame 212 may be spaced apart from each other at a sufficient distance from the lower surface of the body 110. . Accordingly, when the light emitting device package 600 according to the embodiment is mounted on the sub-mount or the main substrate, the light emitting device package 600 may be electrically connected to the sub-mount or the main substrate through the first and second frames 211 and 212. An electrical short may be prevented between the first and second frames 211 and 212.

Next, another example of the light emitting device package according to the embodiment will be described with reference to FIG. 10. 10 is a view showing another example of a light emitting device package according to an embodiment of the present invention.

In the description of the light emitting device package according to the exemplary embodiment with reference to FIG. 10, the descriptions that overlap with the contents described with reference to FIGS. 1 to 9 may be omitted.

The light emitting device package 700 according to the embodiment has first and second openings TH1 and TH2 and the first and second frames 211 as compared to the light emitting device packages according to the embodiments described with reference to FIGS. 1 to 9. , There is a difference in the arrangement position of 212).

The light emitting device package 700 according to the embodiment may include a body 110 and a light emitting device 120.

The body 110 may include an upper surface and a lower surface. The body 110 may include first and second openings TH1 and TH2 penetrating the upper surface and the lower surface. The light emitting device 120 may include first and second bonding parts 121 and 122 disposed on the first and second openings TH1 and TH2.

In addition, the light emitting device package 700 according to the embodiment may include first and second conductors 321 and 322 and first and second frames 211 and 212.

The first and second conductors 321 and 332 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second conductors 321 and 322 may be electrically connected to the first and second bonding portions 121 and 122, respectively.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second conductors 321 and 322, respectively. The first and second frames 211 and 212 may be electrically connected to the first and second bonding parts 121 and 122, respectively.

The first conductor 321 may be disposed in the first opening TH1 and may be electrically connected to the first bonding part 121. The first conductor 321 may be disposed between the first bonding part 121 and the first frame 211 in the first opening TH1.

The second conductor 322 may be disposed in the second opening TH2 and may be electrically connected to the second bonding part 122. The second conductor 322 may be disposed between the second bonding part 122 and the second frame 212 in the second opening TH2.

The first opening TH1 may include a first portion S1 and a second portion S2. The first portion S1 may be provided to overlap with the first bonding portion 121 in the vertical direction. The second portion S2 may be provided below the first portion S1. The second part S2 may be connected to the first part S1. The width of the upper region of the second portion S2 may be provided larger than the width of the lower region of the first portion S1.

The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the body 110. The second portion S2 of the first opening TH1 may be recessed in an upward direction from a lower surface of the first body 111. The second portion S2 may be provided in the form of a recess on a lower surface of the first body 111.

The first frame 211 may be disposed in the first and second portions S1 and S2 of the first opening TH1.

The first frame 211 protrudes from the upper surface of the first portion and the first portion disposed in parallel to the lower surface of the body 110 in the first opening TH1 to the first conductor. It may include a second portion in direct contact with the bottom surface of 321.

In addition, the first frame 211 may further include a protrusion 211a protruding from the end of the second portion in the upper surface direction of the body 110. Mechanical coupling strength may be improved between the upper surface of the first frame 211 and the lower surface of the body 110 by the protrusion 211a.

The second opening TH2 may include a third portion S3 and a fourth portion S4. The third portion S3 may be provided to overlap with the second bonding portion 122 in the vertical direction. The fourth part S4 may be provided below the third part S3. The fourth part S4 may be connected to the third part S3. The width of the upper region of the fourth portion S4 may be provided larger than the width of the lower region of the third portion S3.

The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the body 110. The fourth portion S4 of the second opening TH2 may be recessed in an upward direction from a lower surface of the first body 111. The fourth portion S4 may be provided in the form of a recess on the bottom surface of the first body 111.

The second frame 212 may be disposed in the third and fourth portions S3 and S4 of the second opening TH2.

The second frame 212 protrudes from the upper surface of the third portion disposed in parallel with the lower surface of the body 110 in the second opening TH2 and from the upper surface of the third conductor to form the second conductor. And a fourth portion in direct contact with the bottom surface of 322.

In addition, the second frame 212 may further include a protrusion 212a protruding from the end of the fourth portion in the upper surface direction of the body 110. Mechanical coupling strength may be improved between the upper surface of the second frame 212 and the lower surface of the body 110 by the protrusion 212a.

The light emitting device package 700 according to the embodiment may include the first resin 130.

The first resin 130 may be disposed between the light emitting device 120 and the first body 111. The first resin 130 may be disposed between the first bonding portion 121 and the second bonding portion 122. For example, the first resin 130 may be disposed in contact with a side surface of the first bonding portion 121 and a side surface of the second bonding portion 122.

The first resin 130 may be provided on the entire bottom surface of the cavity provided by the second body 113. The first resin 130 may be disposed on an upper surface of the first body 111 exposed by the second body 113. When viewed from an upper direction of the light emitting device 120, the first resin 130 may be disposed around the light emitting device 120.

In addition, the physical properties of the first resin 130 may be selected in consideration of Coefficient of Thermal Expansion (CTE) matching between the first resin 130, the body 110, and the light emitting device 120. The first resin 130 may be selected from resins having a low CTE value. In this case, the first resin 130 may be referred to as a low CTE bottom reflector (LCBR), and may improve a problem in which a crack or peeling problem due to thermal shock occurs.

In addition, the first resin 130 may be disposed under the light emitting device 120 to perform a sealing function. The first resin 130 may seal upper regions of the first and second openings TH1 and TH2. The first resin 130 may seal the peripheral regions of the first and second bonding parts 121 and 122. Accordingly, moisture or foreign matter from the first and second openings TH1 and TH2 may be blocked from entering the region where the light emitting device 120 is disposed.

In addition, the light emitting device package 700 according to the embodiment may include a second resin 140.

The second resin 140 may be provided on the light emitting device 120. The second resin 140 may be disposed on the first body 111. The second resin 140 may be disposed in the cavity C provided by the second body 113.

The second resin 140 may include an insulating material. The second resin 140 may be provided as a clear molding member. For example, the second resin 140 may include a silicone-based or epoxy-based resin.

In addition, the second resin 140 may include wavelength conversion means for receiving the light emitted from the light emitting device 120 and providing the wavelength-converted light. For example, the second resin 140 may include a phosphor, a quantum dot, and the like.

According to an embodiment, after the light emitting device 120 is mounted on the body 110, the first and second conductors 321 and 322 are provided in the first and second openings TH1 and TH2. Can be. In addition, the first and second frames 211 and 212 may be provided in the first and second openings TH1 and TH2, and curing of the first and second conductors 321 and 322 may be performed. have.

For example, the first and second conductors 321 and 322 may be provided as conductive adhesives. The first and second conductors 321 and 322 may be provided in the first and second openings TH1 and TH2 through a method such as dotting or jetting.

The first and second frames 211 and 212 may be disposed in the first and second openings TH1 and TH2 to contact the first and second conductors 321 and 322, respectively. The hardening process enables the first and second frames 211 and 212 to be stably mounted in the first and second openings TH1 and TH2.

In the light emitting device package 700 according to the embodiment, power is connected to the first bonding part 121 through the first conductor 321 and the first frame 211 provided in the first opening TH1. In addition, power may be connected to the second bonding part 122 through the second conductor 322 and the second frame 212 provided in the second opening TH2.

Accordingly, the light emitting device 120 may be driven by driving power supplied through the first bonding part 121 and the second bonding part 122. In addition, the light emitted from the light emitting device 120 may be provided in an upper direction of the body 110.

On the other hand, the light emitting device package 700 according to the embodiment described above may be mounted on a sub-mount or a circuit board and supplied.

However, when a conventional light emitting device package is mounted on a submount or a circuit board, a high temperature process such as a reflow may be applied. At this time, in the reflow process, a re-melting phenomenon occurs in the bonding region between the lead frame and the light emitting device provided in the light emitting device package, thereby weakening the stability of the electrical connection and the physical coupling.

However, according to the light emitting device package and the method of manufacturing the light emitting device package according to the embodiment, the first bonding portion and the second bonding portion 121, 122 of the light emitting device 120 according to the embodiment is the first and second The driving power may be provided through the second conductors 321 and 322 and the first and second frames 211 and 212. The melting point of the first and second conductors 321 and 322 may be selected to have a higher value than the melting point of the general bonding material.

Therefore, the light emitting device package 700 according to the embodiment does not have a remelting phenomenon even when bonded to a main substrate through a reflow process, so that electrical connection and physical bonding force are not degraded. There is no advantage.

In addition, according to the light emitting device package 700 and the light emitting device package manufacturing method according to an embodiment, a conductive paste may be used as the first and second conductors 321 and 322, and a process of manufacturing a light emitting device package. In the body 110 does not need to be exposed to high temperatures. Therefore, according to the embodiment, the body 110 may be prevented from being damaged or discolored due to exposure to high temperature.

Accordingly, the selection range for the material constituting the body 110 can be widened. According to an embodiment, the body 110 may be provided using a relatively inexpensive resin material as well as an expensive material such as a ceramic.

For example, the body 110 may include at least one material selected from the group consisting of PolyPhtalAmide (PPA) resin, PolyCyclohexylenedimethylene Terephthalate (PCT) resin, epoxy molding compound (EMC) resin, and silicone molding compound (SMC) resin. can do.

In addition, according to the light emitting device package 700 according to the embodiment, the first frame 211 and the second frame 212 may be spaced apart from each other at a sufficient distance from the lower surface of the body 110. . Accordingly, when the light emitting device package 700 according to the embodiment is mounted on the sub-mount or the main substrate, the light-emitting device package 700 may be electrically connected to the sub-mount or the main substrate through the first and second frames 211 and 212. An electrical short may be prevented between the first and second frames 211 and 212.

As described above, the light emitting device package according to the embodiment may include a body 110 provided with the first opening TH1 and the second opening TH2. The first and second openings TH1 and TH2 may be provided through the first direction toward the lower surface from the upper surface of the body 110.

The first and second openings TH1 and TH2 may be provided, for example, in a quadrangular shape on an upper surface of the body 110. In addition, the first and second openings TH1 and TH2 may be provided in a quadrangular shape at a lower surface of the body 110.

In addition, according to another embodiment, the first and second openings TH1 and TH2 may be provided in a circular shape on the upper and lower surfaces of the body 110. In addition, the first opening TH1 may be provided as a plurality of openings, and the second opening TH2 may be provided as a plurality of openings.

Meanwhile, the above-described light emitting device package may be provided with, for example, a flip chip light emitting device.

For example, the flip chip light emitting device may be provided as a transmissive flip chip light emitting device in which light is emitted in six plane directions, or may be provided as a reflective flip chip light emitting device in which light is emitted in a five plane direction.

The reflective flip chip light emitting device that emits light in five surface directions may have a structure in which a reflective layer is disposed in a direction close to the package body. For example, the reflective flip chip light emitting device may include an insulating reflective layer (eg, Distributed Bragg Reflector, Omni Directional Reflector, etc.) and / or a conductive reflective layer (eg, Ag, Al) between the first and second electrode pads and the light emitting structure. , Ni, Au, and the like).

In addition, the flip chip light emitting device that emits light in the six plane direction has a first electrode electrically connected to the first conductive semiconductor layer and a second electrode electrically connected to the second conductive semiconductor layer. The light emitting device may be provided as a general horizontal light emitting device in which light is emitted between an electrode and the second electrode.

In addition, the flip chip light emitting device in which light is emitted in the six plane directions may be provided as a transmissive flip chip light emitting device including both a reflecting region in which a reflective layer is disposed between the first and second electrode pads and a transmitting region in which light is emitted. Can be.

Here, the transmissive flip chip light emitting device refers to a device in which light is emitted to the top surface, four sides, and six surfaces of the bottom surface. In addition, the reflective flip chip light emitting device refers to a device that emits light to the top surface, five surfaces of four sides.

Next, an example of a flip chip light emitting device applied to a light emitting device package according to an exemplary embodiment of the present invention will be described with reference to the accompanying drawings.

11 is a plan view illustrating an electrode arrangement of a light emitting device applied to a light emitting device package according to an exemplary embodiment of the present invention, and FIG. 12 is a cross-sectional view taken along line F-F of the light emitting device of FIG. 11.

On the other hand, for the sake of understanding, in FIG. 11, only a relative arrangement relationship between the first electrode 127 and the second electrode 128 is conceptually illustrated. The first electrode 127 may include a first bonding part 121 and a first branch electrode 125. The second electrode 128 may include a second bonding part 122 and a second branch electrode 126.

The light emitting device according to the embodiment may include a light emitting structure 123 disposed on the substrate 124.

The substrate 124 may be selected from a group including sapphire substrate (Al ₂ O ₃ ), SiC, GaAs, GaN, ZnO, Si, GaP, InP, Ge. For example, the substrate 124 may be provided as a patterned sapphire substrate (PSS) having an uneven pattern formed on an upper surface thereof.

The light emitting structure 123 may include a first conductive semiconductor layer 123aa, an active layer 123b, and a second conductive semiconductor layer 123c. The light emitting device according to the embodiment may include a first electrode 127 and a second electrode 128.

The first electrode 127 may include a first bonding part 121 and a first branch electrode 125. The first electrode 127 may be electrically connected to the second conductivity type semiconductor layer 123c. The first branch electrode 125 may be branched from the first bonding part 121. The first branch electrode 125 may include a plurality of branch electrodes branched from the first bonding part 121.

The second electrode 128 may include a second bonding part 122 and a second branch electrode 126. The second electrode 128 may be electrically connected to the first conductivity type semiconductor layer 123a. The second branch electrode 126 may be branched from the second bonding part 122. The second branch electrode 126 may include a plurality of branch electrodes branched from the second bonding part 122.

The first branch electrode 125 and the second branch electrode 126 may be alternately arranged in a finger shape. Power supplied through the first bonding portion 121 and the second bonding portion 122 by the first branch electrode 125 and the second branch electrode 126 to the entire light emitting structure 123. It can be spread and provided.

The first electrode 127 and the second electrode 128 may be formed in a single layer or a multilayer structure. For example, the first electrode 127 and the second electrode 128 may be ohmic electrodes. For example, the first electrode 127 and the second electrode 128 may be ZnO, IrOx, RuOx, NiO, RuOx / ITO, Ni / IrOx / Au, and Ni / IrOx / Au / ITO, Ag, Ni At least one of Cr, Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, or an alloy of two or more of these materials.

Meanwhile, a protective layer may be further provided on the light emitting structure 123. The protective layer may be provided on an upper surface of the light emitting structure 123. In addition, the protective layer may be provided on the side surface of the light emitting structure 123. The protective layer may be provided to expose the first bonding portion 121 and the second bonding portion 122. In addition, the protective layer may be selectively provided on the circumference and the lower surface of the substrate 124.

For example, the protective layer may be provided as an insulating material. For example, the protective layer is Si _x O _y , SiO _x N _y , Si _x N _y , Al _x O _y It may be formed of at least one material selected from the group containing.

In the light emitting device according to the embodiment, the light generated by the active layer 123b may emit light in six directions of the light emitting device. Light generated by the active layer 123b may be emitted in six surface directions through the top, bottom, and four side surfaces of the light emitting device.

For reference, the vertical arrangement direction of the light emitting device described with reference to FIGS. 1 to 10 and the vertical placement direction of the light emitting device illustrated in FIGS. 11 and 12 are shown to be opposite to each other.

Meanwhile, the light emitting device package according to the embodiment may be applied to the light source device.

In addition, the light source device may include a display device, a lighting device, a head lamp, or the like according to an industrial field.

As an example of the light source device, the display device includes a bottom cover, a reflector disposed on the bottom cover, a light emitting module that emits light and includes a light emitting element, and a light disposed in front of the reflector and guiding light emitted from the light emitting module to the front. An optical sheet including a light guide plate, prism sheets disposed in front of the light guide plate, a display panel disposed in front of the optical sheet, an image signal output circuit connected to the display panel and supplying an image signal to the display panel; It may include a color filter disposed in front. The bottom cover, the reflector, the light emitting module, the light guide plate, and the optical sheet may form a backlight unit. In addition, the display device does not include a color filter, and may have a structure in which light emitting devices emitting red, green, and blue light are disposed.

As another example of the light source device, the head lamp may include a light emitting module including a light emitting device package disposed on a substrate, a reflector reflecting light emitted from the light emitting module in a predetermined direction, for example, a front, and reflected by the reflector. It may include a lens for refracting the light forward, and a shade for blocking or reflecting a portion of the light reflected by the reflector toward the lens to achieve a light distribution pattern desired by the designer.

Another example of a light source device may include a lighting device, a cover, a light source module, a heat sink, a power supply, an inner case, and a socket. In addition, the light source device according to the embodiment may further include any one or more of the member and the holder. The light source module may include a light emitting device package according to the embodiment.

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment, but are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be interpreted that the contents related to such a combination and modification are included in the scope of the embodiments.

Although the above description has been made with reference to the embodiments, these are only examples and are not intended to limit embodiments. It will be appreciated that eggplant modifications and applications are possible. For example, each component specifically shown in the embodiment can be modified. And differences related to such modifications and applications will have to be construed as being included in the scope of the embodiments set out in the appended claims.

110 Body 111 First body
113 Second Body 120 Light-Emitting Element
121 First bonding part 122 Second bonding part
123 Light emitting structure 130 First resin
140 Second Resin 211 First Frame
212 Second frame 221 First conductive part
222 Second conductive part 310 Circuit board
321 First Conductor 322 Second Conductor
TH1 first opening TH2 second opening

Claims (12)

An upper surface, a lower surface, a body including first and second openings penetrating the upper surface and the lower surface;
A light emitting device including first and second bonding parts disposed on the first and second openings, respectively; And
First and second frames disposed in the first and second openings and overlapping the first and second bonding portions in a vertical direction, respectively;
Light emitting device package comprising a. The method of claim 1,
The first frame may include a first portion extending in a first direction from the upper surface of the body toward the lower surface and a second portion extending in a second direction perpendicular to the first direction in which the first portion extends. Light emitting device package comprising. The method of claim 1,
The first opening includes a first portion and a second portion,
The first portion is provided to overlap with the first bonding portion in the vertical direction,
The second portion is disposed below the first portion and is connected with the first portion, the width of the upper region of the second portion is provided larger than the width of the lower region of the first portion,
The first frame is a light emitting device package disposed in the first and second portions of the first opening. The method of claim 3,
The second portion of the first opening is a light emitting device package provided concave in the direction of the upper surface from the lower surface of the body. The method of claim 1,
A first conductor disposed in the first opening portion between the first bonding portion and the first frame;
And a second conductor disposed in the second opening portion between the second bonding portion and the second frame. The method of claim 1,
The first bonding portion is provided with a first width in a first direction parallel to the first side surface of the light emitting device,
The first opening is a light emitting device package provided in a second width smaller than the first width in a direction parallel to the first direction. The method of claim 5,
The light emitting device package including a first conductive portion disposed between the lower surface of the first bonding portion and the first conductor. The method of claim 7, wherein
The first conductive portion is a light emitting device package disposed to extend from the lower surface of the first bonding portion into the first opening. The method of claim 7, wherein
The first conductor is disposed between the side of the first conductive portion and the side of the body providing the first opening, and between the lower surface of the first conductive portion and the upper surface of the first frame. The method of claim 1,
The upper surface of the first frame is disposed in direct contact with the lower surface of the first bonding portion. The method of claim 1,
A circuit board disposed below the bottom surface of the body, the circuit board including first and second pads;
The light emitting device package of claim 1, wherein the first and second pads overlap the first and second frames in a direction perpendicular to an upper surface of the light emitting device. The method of claim 11,
First and second adhesives disposed between the body and the circuit board,
The first adhesive is electrically connected to the first pad and the first frame,
The second adhesive is electrically connected to the second pad and the second frame,
The first and second adhesives are disposed so as not to overlap the first and second bonding portions in the vertical direction.

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