KR100705241B1 - Light emitting device package and method for fabricating the same - Google Patents

Abstract

The present invention relates to a light emitting device package and a method of manufacturing the same, comprising: a substrate having a groove formed therein, and a pair of electrode lines spaced apart from each other on the bottom surface of the groove extending along the sidewall of the groove; ; A light emitting device flip-chip bonded on the pair of electrode lines in the groove; A filler filled in the groove and surrounding the light emitting device; It is formed on the filler and comprises a resin film in which phosphors are dispersed.

Accordingly, the present invention forms a resin film in which a phosphor having a uniform thickness is dispersed in a package, and configures the package so that light of the light emitting device passes through the resin film in which the phosphor is dispersed, thereby uniformly converting light of the light emitting device. As a result, an excellent light source having a uniform color distribution can be obtained.

Light emitting element, package, phosphor, thickness, uniformity, light

Description

 Light emitting device package and manufacturing method thereof {Light emitting device package and method for fabricating the same}

1 is a cross-sectional view of a typical light emitting diode

2 is a cross-sectional view of a package mounted with a light emitting diode according to the prior art.

3 is a schematic conceptual view illustrating a light emitting diode structure according to the prior art;

4 is a cross-sectional view of another package mounted with a light emitting diode according to the prior art.

5A to 5E are cross-sectional views illustrating a manufacturing process of a light emitting device package according to a first embodiment of the present invention.

6 is a perspective view of the substrate of the light emitting device package according to the first embodiment of the present invention;

7 is a conceptual diagram illustrating a path of light propagation in a light emitting device package according to the present invention;

8A and 8B are cross-sectional views illustrating a manufacturing process of a light emitting device package according to a second embodiment of the present invention.

9A to 9E are cross-sectional views illustrating a manufacturing process of a light emitting device package according to a third embodiment of the present invention.

10 is a cross-sectional view of a light emitting device package according to a fourth embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100,200,300,320: Board 110,210: Home

121,122: Side grooves 131,132,221,222,311,312: Electrode line

160,260,360,430: Light emitting device 170,270: Filler

180,280 Resin film 321: Through hole

340: bonding means 410, 420: lead

440: Zener diode 460: molding part

The present invention relates to a light emitting device package and a method of manufacturing the same, and more particularly, to form a resin film in which a phosphor having a uniform thickness is dispersed in a package, and to allow light of the light emitting device to pass through the resin film in which the phosphor is dispersed. The present invention relates to a light emitting device package and a method of manufacturing the same, wherein light of the light emitting device is uniformly wavelength-converted to obtain an excellent light source having a uniform color distribution.

In general, light emitting devices such as light emitting diodes or laser diodes using a group 3-5 compound semiconductor material of direct transition compound semiconductors can realize various colors such as red, green, blue, and ultraviolet rays by developing thin film growth technology and device materials. In addition, by using a fluorescent material or a combination of colors it is possible to implement a good white light.

With the development of these technologies, LED backlights, fluorescent lamps, or incandescent lamps, which replace not only display devices, but also cold cathode fluorescent lamps (CCFLs), which form the backlight of optical communication means, transmission modules, and liquid crystal display (LCD) displays, are used. Applications are expanding to replaceable white light emitting diode lighting devices and traffic lights.

On the other hand, in addition to a light emitting diode driven by a direct current power source, a high voltage AC light emitting diode chip that operates in a general AC power source has also been developed. For this purpose, in order to apply a light emitting device, a high operating voltage and a low driving current at the same power are required. Efficiency and brightness should be high.

1 is a cross-sectional view of a general light emitting diode, in which an N-semiconductor layer 11, an active layer 12, and a P-semiconductor layer 13 are sequentially stacked on a substrate 10; Mesa is etched from the P-semiconductor layer (13) to a part of the N-semiconductor layer (11); A transparent electrode 14 is formed on the P-semiconductor layer 14; An N-electrode pad 15 is formed on the mesa-etched N-semiconductor layer 11; The P-electrode pad 16 is formed on the transparent electrode 14.

When the voltage is applied between the P-electrode pad 16 and the N-electrode pad 17 in an external circuit, holes and electrons are injected from the P-electrode pad 16 and the N-electrode pad 17. As holes and electrons recombine in the active layer 12, extra energy is converted into light and emitted to the outside through the transparent electrode and the substrate.

Such a light emitting diode is bonded to a sub-mount substrate made of silicon or ceramic and used as a package, or mounted in another package.

On the other hand, there are two methods of making a white light source using a light emitting diode.

First, there is a method of making a white light source using blue, violet, and red light emitting diodes, or a white light source using phosphors in blue and purple light emitting diodes.

As such, a method of making a white light source using phosphors is inexpensive and many studies have been conducted.

FIG. 2 is a cross-sectional view of a package in which a light emitting diode is mounted according to the related art, and includes a cavity 21 formed on an upper portion of the substrate 20, a light emitting diode 30 mounted on the cavity 21, and the light emitting diode. The resin 35 is coated with the phosphor dispersed in the cavity 21.

In the package configured as described above, the light emitting diode 30 emits light in all directions. When the reflective film is formed in the cavity 21 in which the light emitting diode 30 is mounted, as shown in FIG. 30) to the side and top.

At this time, the light emitted by the 'A' path from the light emitting diode 30 passes through the resin 35 in which the phosphor is dispersed by the 'd1' length and is emitted to the outside, and the light emitted by the 'B' path is the phosphor. Is passed through the dispersed resin 35 by the length 'd2' and emitted to the outside, and the light emitted by the 'C' path is emitted by the 'd3' length through the resin 35 in which the phosphor is dispersed.

Therefore, as shown in FIG. 2, since d1> d3> d2, the light emitted from each surface of the light emitting diodes has a different length passing through the resin from which the phosphors are injected, and thus, the amount of light that is wavelength-converted in the phosphors is different.

That is, the amount of light that is wavelength-converted increases in the light traveling along the 'A' path than the light traveling along the 'B' and 'C' paths.

Therefore, in the prior art as shown in FIG. 2, there is a disadvantage in that the thickness of the resin in which the phosphor is dispersed is not uniform, so that light emitted uniformly cannot be realized.

3 is a schematic conceptual view illustrating a light emitting diode structure according to the prior art, in which a light emitting structure 41 is formed on a substrate 40, and a reflective electrode 42 is formed on the light emitting structure 41. The phosphor film 43 is formed under the substrate 40.

In this structure, the light of the light emitting structure 41 is emitted through the substrate 40 and the phosphor film 43 to the outside.

Therefore, in the above technique, since the phosphor film 43 is not formed on the side surface of the light emitting structure 41, there is a disadvantage that the wavelength conversion efficiency is lowered.

4 is a cross-sectional view of another package in which a light emitting diode is mounted according to the prior art, in which two terminals 51 and 52 formed on a bottom surface of the light emitting diode 50 are flipped onto the sub-mount substrate 60 with solder 61 and 62. Flip chip bonded; A phosphor film 55 is formed surrounding the side surface and the upper surface of the light emitting diode 50.

Thus, in the package configured, it is difficult to form a phosphor film uniformly on each side when using a stencil, and when using an electrophoretic method, a seed metal must be formed, so that loss of power consumed for light extraction of the light emitting diode is generated. There is a problem.

In order to solve the above problems, the present invention forms a resin film in which a phosphor having a uniform thickness is dispersed in a package, and configures the package so that light of the light emitting device passes through the resin film in which the phosphor is dispersed, thereby emitting light. It is an object of the present invention to provide a light emitting device package and a method of manufacturing the same, in which light of a device is uniformly wavelength-converted to obtain an excellent light source having a uniform color distribution.

A first preferred aspect for achieving the above objects of the present invention is

A substrate having a groove formed therein and having a pair of electrode lines spaced apart from each other on the bottom surface of the groove and extending along the sidewall of the groove;

A light emitting device flip-chip bonded on the pair of electrode lines in the groove;

A filler filled in the groove and surrounding the light emitting device;

A light emitting device package is formed on the filler and includes a resin film in which phosphors are dispersed.

A second preferred aspect for achieving the above objects of the present invention is

A first substrate extending from an upper surface to a lower surface and having a pair of electrode lines spaced apart from each other on the upper surface and the lower surface;

A second substrate attached to the first substrate such that the pair of electrode lines of the first substrate are exposed to the through holes;

A light emitting device flip-chip bonded to the pair of electrode lines exposed to the through-holes of the second substrate;

A filler surrounding the light emitting device and filled in the through hole;

A light emitting device package including a resin film in which phosphors formed on the filler is dispersed is provided.

A third preferred aspect for achieving the above objects of the present invention is

A pair of leads spaced apart from each other;

A light emitting element adhered to an upper portion of one of the leads;

A zener diode adhered to an upper part of the lead to which the light emitting element is bonded;

A conductive portion connecting the light emitting element and the zener diode in parallel and electrically connecting the pair of leads;

A molding part surrounding the light emitting element, the conductive part, and one region of the leads, and exposing the remaining regions of the leads;

A light emitting device package is formed on the molding part and includes a resin film in which phosphors are dispersed.

A fourth preferred aspect for achieving the above objects of the present invention is

Preparing a first substrate extending from an upper surface to a lower surface and having a pair of electrode lines spaced apart from each other on the upper surface and the lower surface;

Preparing a second substrate having a through hole penetrating from an upper portion to a lower portion;

Attaching the first substrate to the second substrate such that the pair of electrode lines are exposed to the through holes;

Flip chip bonding a light emitting device to a pair of electrode lines exposed to a through hole of the second substrate, surrounding the light emitting device, and filling a filler into the through hole;

Provided is a method of manufacturing a light emitting device package including forming a resin film in which phosphors are dispersed on an upper portion of the filler.

A fifth preferred aspect for achieving the above objects of the present invention is

Preparing a first substrate extending from an upper surface to a lower surface and having a pair of electrode lines spaced apart from each other on the upper surface and the lower surface;

Preparing a second substrate having a through hole penetrating from an upper portion to a lower portion;

Attaching the first substrate to the second substrate such that the pair of electrode lines are exposed to the through holes;

Flip chip bonding a light emitting device to a pair of electrode lines exposed to a through hole of the second substrate, surrounding the light emitting device, and filling a filler into the through hole;

Provided is a method of manufacturing a light emitting device package including forming a resin film in which phosphors are dispersed on an upper portion of the filler.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

5A through 5E are cross-sectional views illustrating a manufacturing process of a light emitting device package according to a first embodiment of the present invention. First, grooves 110 are formed in upper portions, and side grooves 121 and 122 are formed in both sides, respectively. The prepared substrate 100 is prepared (FIG. 5A).

This substrate 100 is a substrate as shown in FIG.

The substrate 100 is preferably a silicon substrate or a ceramic substrate.

Next, a pair of electrode lines 131 and 132 spaced apart from each other on the inner bottom surface of the groove 110 extends downward along each of the side grooves 121 and 122 to be spaced apart from each other. )

Subsequently, flip chip bonding is performed on the light emitting device 160 on the pair of electrode lines 131 and 132 disposed on the inner bottom surface of the groove 110 (FIG. 5C).

In this case, the flip chip bonding forms solders 151 and 152 on two electrode terminals of the light emitting device 160 and bonds the upper portions of the pair of electrode lines 131 and 132 or the pair of electrode lines 131 and 132. Bonding the light emitting device 160 by forming a solder thereon.

Thereafter, the light emitting device 160 is wrapped and the filler 170 is filled in the groove 110. (FIG. 5D)

Here, the filler 170 is a transparent material that can transmit light, silicon gel or epoxy.

Finally, a resin film 180 in which phosphors are dispersed is formed on the filler 170 (FIG. 5E).

Accordingly, the light emitting device package according to the first embodiment of the present invention includes a substrate 100 having grooves 110 formed thereon and side grooves 121 and 122 formed on both sides thereof; A pair of electrode lines 131 and 132 spaced apart from each other on the inner bottom surface of the groove 110 and extending downward along each of the side grooves 121 and 122 and spaced apart from each other at the bottom; A light emitting device (160) flip-chip bonded on the pair of electrode lines (131, 132) in the groove (110); A filler 170 surrounding the light emitting device 160 and filled in the groove 110; It is formed on the filler 170, and comprises a resin film 180 in which the phosphor is dispersed.

The light emitting device package of the present invention configured as described above forms a resin film in which phosphors having a uniform thickness are dispersed, and configures the package so that light of the light emitting device passes through the resin film in which the phosphor is dispersed, so that the light of the light emitting device is uniform. The wavelength conversion is an advantage that the color uniformity is excellent.

6 is a perspective view of a substrate of a light emitting device package according to a first embodiment of the present invention, wherein grooves 110 are formed on the substrate 100, and side grooves 121 and 122 are formed on both sides thereof.

Each of the side grooves 121 and 122 may be inclined to be etched inclined to form a protruding shape in the central region of the side surface to smoothly form the electrode line.

The sidewalls of the grooves 110 are also inclined to reflect light emitted from the light emitting device mounted on the bottom surface of the grooves 110 on the inclined sidewalls, thereby increasing the light output to the upper portion of the package. to be.

FIG. 7 is a conceptual view illustrating a path of light in a light emitting device package according to the present invention, in which light emitted to an upper portion of the light emitting device 160 mounted on the bottom surface of the groove 110 is a path of 'B' in FIG. 7. The light emitted to the upper portion of the light emitting device 160 proceeds along the path of 'A'.

Therefore, the light traveling in the A, B, and C paths passes through the resin film in which the phosphor having a uniform thickness is dispersed, so that the light of the light emitting device is uniformly wavelength-converted.

8A and 8B are cross-sectional views illustrating a manufacturing process of a light emitting device package according to a second embodiment of the present invention. First, a groove 210 is formed on an upper portion of the light emitting device package. A pair of spaced apart electrode lines 221 and 222 prepares the substrate 200 extending along the top surface along the sidewalls of the groove 210 (FIG. 8A).

Thereafter, flip chip bonding of the light emitting device 260 on the pair of electrode lines 221 and 222 disposed on the bottom surface of the groove 210, surrounds the light emitting device 260, and covers the groove ( The filler 270 is filled in the inside of the 210, and a resin film 280 in which phosphors are dispersed is formed on the filler 270 (FIG. 8B).

As in the first embodiment of the present invention described above, in the flip chip bonding, solders 251 and 252 are interposed between two electrode terminals of the light emitting device 260 and the pair of electrode lines 221 and 222.

As described above, in the light emitting device package according to the second embodiment of the present invention, the groove 210 is formed on the upper portion, and the pair of electrode lines 221 and 222 spaced apart from each other on the inner bottom surface of the groove 210 are provided with the groove ( A substrate 200 extending along the side wall of the substrate 210 at an upper surface thereof; A light emitting element 260 flip-chip bonded to the pair of electrode lines 221 and 222 in the groove 110; A filler 270 surrounding the light emitting element 260 and filled in the groove 210; It is formed on the filler 270, and comprises a resin film 280 in which the phosphor is dispersed.

9A to 9E are cross-sectional views illustrating a manufacturing process of a light emitting device package according to a third exemplary embodiment of the present invention. A pair is extended from an upper surface to a lower surface and spaced apart from each other on an upper surface and a lower surface. A first substrate 300 having electrode lines 311 and 312 formed thereon is prepared. (FIG. 9A).

As shown in FIG. 9B, a second substrate 320 having a through hole 321 penetrating from top to bottom is prepared.

Here, it is preferable that a reflective film is formed in the through hole 321 of the second substrate 320. If the reflective film is formed, the light emitted from the light emitting device mounted in a subsequent process is reflected by the reflective film and packaged. It is possible to increase the amount of light emitted to the top.

Thereafter, the first substrate 300 is attached to the second substrate 320 so that the pair of electrode lines 311 and 312 are exposed to the through hole 321 (FIG. 9C).

At this time, the attachment process uses an adhesive means 340, such as adhesive resin and adhesive tape.

Subsequently, flip chip bonding of the light emitting device 360 to the pair of electrode lines 311 and 312 exposed to the through hole 321 of the second substrate 320 is carried out, surrounds the light emitting device 360, and covers the through hole ( 320) Fill the filler 270 inside (FIG. 9D).

Finally, a resin film 280 in which phosphors are dispersed is formed on the filler 270 (FIG. 9E).

The first and second substrates 300 and 320 may use a silicon substrate or a ceramic substrate, and in the case of using the ceramic substrate, the substrate is formed of a material having excellent thermal conductivity, and the substrate is formed of a material having excellent insulation such as AlN or alumina. do.

The light emitting device package according to the third embodiment of the present invention manufactured as described above extends from an upper surface to a lower surface, and includes a first substrate on which a pair of electrode lines 311 and 312 are spaced apart from each other on the upper and lower surfaces, respectively. 300; A second substrate 320 attached to the first substrate 300 such that the pair of electrode lines 311 and 312 of the first substrate 300 are exposed to the through holes 321; A light emitting device (360) flip-chip bonded to a pair of electrode lines (311, 312) exposed to the through hole (321) of the second substrate (320); A filler 270 surrounding the light emitting device 360 and filled in the through hole 320; It is configured to include a resin film 280 is dispersed in the phosphor formed on the filler 270.

10 is a cross-sectional view of a light emitting device package according to a fourth exemplary embodiment of the present invention, wherein a pair of leads 410 and 420 are spaced apart from each other; A light emitting element 430 adhered to an upper portion of one of the leads 410.420; A zener diode 440 attached to an upper portion of the lead 420 to which the light emitting device 430 is attached; A conductive part connected to the light emitting device 430 and the zener diode 440 in parallel and electrically connected to the pair of leads 410 and 420; A molding part 460 surrounding the light emitting element, the conductive part and the leads 410 and 420, and exposing the remaining areas of the leads 410 and 420; The resin layer 280 is formed on the molding part 460 and has a phosphor dispersed therein.

Here, the conductive portion is preferably formed of a wire as shown in FIG.

In addition, regions of the leads 410 and 420 which are not wrapped by the molding unit 460 may be formed to have a structure exposed to mount a package in another mounting region as shown in FIG. 10. After protruding regions of the leads 410 and 420 which are not enclosed by the 460 to the side surface of the molding part 460, a bending process may be performed to form a structure having the leads having the bent package.

As described above, when a zener diode is connected in parallel with a light emitting device to configure a package, when a surge voltage is generated in a light emitting device having a weak withstand voltage characteristic, the zener breakdown does not occur near the zener voltage without an overcurrent flowing to the light emitting device that is susceptible to static electricity. It is possible to protect the light emitting device by overcurrent being generated and bypassing the zener diode having a small resistance value.

11A and 11B are cross-sectional views illustrating a process of forming a resin film in which phosphors are dispersed according to the present invention. In FIG. 11A, a resin film in which phosphors are dispersed is formed by a screen printing process.

That is, a stencil 500 having an opening 510 is prepared, the stencil 500 is positioned so that the opening 510 of the stencil 500 is exposed to the filler 170, and the upper portion of the stencil 500 is positioned above the stencil 500. The squeegee 520 is moved to push the resin in which the phosphor is dispersed into the opening 510 to form the resin film 180 in which the phosphor is dispersed on an upper surface of the filler 170. Remove 520.

When the screen printing process is performed, the resin film 180 in which the phosphor having a uniform thickness is dispersed is formed on the filler 170.

And, as shown in Figure 11b, by attaching a resin tape 600, a pre-fabricated phosphor dispersed on the filler 170, by the adhesive means 610, the phosphor is dispersed on the filler 170 in a simple process. The resin film 180 can be formed.

12 is a cross-sectional view illustrating a method of filling a filler into a groove in which a light emitting device is mounted according to the present invention. In order to fill a filler into a groove of a substrate, a nozzle 700 containing a filler is provided in the groove 110 of the substrate. After positioning, the dispensing method of applying the filler 181 to the groove 110 may be used.

As described above, the present invention forms a resin film in which a phosphor having a uniform thickness is dispersed in a package, and configures the package so that light of the light emitting device passes through the resin film in which the phosphor is dispersed, thereby reducing the light of the light emitting device. The wavelength is uniformly converted, thereby obtaining an excellent light source having a uniform color distribution.

Although the invention has been described in detail only with respect to specific examples, it will be apparent to those skilled in the art that various modifications and variations are possible within the spirit of the invention, and such modifications and variations belong to the appended claims.

Claims (14)

A substrate having a groove formed therein and having a pair of electrode lines spaced apart from each other on the bottom surface of the groove and extending along the sidewall of the groove; A light emitting device flip-chip bonded on the pair of electrode lines in the groove; A filler filled in the groove and surrounding the light emitting device; A light emitting device package formed on the filler and including a resin film in which phosphors are dispersed. The method of claim 1, Side grooves are formed on both side surfaces of the substrate, Each of the pair of electrode lines extending on the upper surface of the substrate extends below the substrate along the side grooves and is spaced apart from each other. The method according to claim 1 or 2, The groove sidewall of the upper portion of the substrate, Light emitting device package, characterized in that inclined.  A first substrate extending from an upper surface to a lower surface and having a pair of electrode lines spaced apart from each other on the upper surface and the lower surface; A second substrate attached to the first substrate such that the pair of electrode lines of the first substrate are exposed to the through holes; A light emitting device flip-chip bonded to the pair of electrode lines exposed to the through-holes of the second substrate; A filler surrounding the light emitting device and filled in the through hole; A light emitting device package comprising a resin film in which the phosphor formed on the filler is dispersed. The method of claim 4, wherein The through hole sidewall of the second substrate is inclined, The light emitting device package, characterized in that the reflective film is formed on the side wall of the through hole. The method according to any one of claims 1, 2, 4 and 5, The resin film in which the phosphor is dispersed, The light emitting device package, characterized in that the resin tape is dispersed in the phosphor attached to the filler by the adhesive means. The method according to claim 4 or 5, The substrate, Light emitting device package, characterized in that the silicon substrate or a ceramic substrate. A pair of leads spaced apart from each other; A light emitting element adhered to an upper portion of one of the leads; A zener diode adhered to an upper part of the lead to which the light emitting element is bonded; A conductive portion connecting the light emitting element and the zener diode in parallel and electrically connecting the pair of leads; A molding part surrounding the light emitting element, the conductive part, and one region of the leads, and exposing the remaining regions of the leads; A light emitting device package formed on the molding part and including a resin film in which phosphors are dispersed. The method of claim 8, The resin film in which the phosphor is dispersed, The light emitting device package, characterized in that the resin tape is dispersed in the phosphor attached to the upper portion of the molding by the adhesive means.  Preparing a substrate having grooves formed at an upper portion thereof and side grooves formed at both sides thereof; Forming a pair of electrode lines spaced apart from each other on the bottom surface of the groove downwardly along each of the side grooves to be spaced apart from each other at the bottom; Flip chip bonding a light emitting device on a pair of electrode lines positioned on the bottom surface of the groove; Surrounding the light emitting device and filling a filler into the groove; And forming a resin film in which phosphors are dispersed on the filler. Preparing a first substrate extending from an upper surface to a lower surface and having a pair of electrode lines spaced apart from each other on the upper surface and the lower surface; Preparing a second substrate having a through hole penetrating from an upper portion to a lower portion; Attaching the first substrate to the second substrate such that the pair of electrode lines are exposed to the through holes; Flip chip bonding a light emitting device to a pair of electrode lines exposed to a through hole of the second substrate, surrounding the light emitting device, and filling a filler into the through hole; And forming a resin film in which phosphors are dispersed on the filler. The method of claim 10 or 11, The resin film in which the phosphor is dispersed, Method of manufacturing a light emitting device package, characterized in that formed by performing a screen printing process. The method of claim 10 or 11, Forming the resin film in which the phosphor is dispersed, The method of manufacturing a light emitting device package, characterized in that to form a resin tape in which the phosphor is dispersed as an adhesive means on the filler. The method of claim 11, The through-hole sidewall of the second substrate is inclined, The reflective film is formed on the side wall of the through-hole manufacturing method of the light emitting device package.

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