CN110875418A - Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device - Google Patents
Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device Download PDFInfo
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- CN110875418A CN110875418A CN201811004283.1A CN201811004283A CN110875418A CN 110875418 A CN110875418 A CN 110875418A CN 201811004283 A CN201811004283 A CN 201811004283A CN 110875418 A CN110875418 A CN 110875418A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a lead frame, a support, a manufacturing method of the lead frame, a light-emitting device and a light-emitting device, wherein the manufacturing method of the lead frame comprises the steps of firstly preparing an insulating substrate with at least one group of lead filling through hole pairs; the lead filling through hole pair comprises an anode/cathode lead filling through hole which is arranged on the insulating substrate in an isolated mode; the pair of lead-filling through holes are filled with a conductor to form a positive electrode lead and a negative electrode lead, and the side surfaces of the positive electrode lead and the negative electrode lead are covered in the insulating substrate. The lead frame disclosed by the invention has the advantages that the lead filling through holes arranged on the insulating substrate are aligned to form the lead pairs, so that the occupied area of a single support forming area on the lead frame is reduced, the utilization rate of the lead frame is improved, and the yield and the production efficiency of LED products on a single lead frame are improved; in addition, the side surface of the lead is covered inside the LED support, so that the lead is not exposed out of the side surface of the LED support, and the air tightness of the LED support is improved.
Description
Technical Field
The invention relates to the technical field of Light Emitting Diodes (LEDs), in particular to a lead frame, a support, a manufacturing method of the lead frame, a Light Emitting device and a Light Emitting apparatus.
Background
In recent years, LEDs have been playing an important role in the display field of mobile terminals due to their unique advantages of low price, low power consumption, high brightness, long lifetime, etc., and there is a considerable development space for a long period of time in the future. In the existing LED production process, the adopted lead frame is the lead frame with the hollowed-out support forming area, and the space occupied by the single support forming area on the lead frame is large, so that the number of the LED supports formed on the lead frame in unit area is limited, and the yield is low when the LED light-emitting device is manufactured on each lead frame.
Disclosure of Invention
The embodiment of the invention provides a lead frame, a support, a manufacturing method of the lead frame, a light-emitting device and a light-emitting device, and mainly solves the technical problems that: the problem that the yield is low when the LED light-emitting device is manufactured on the lead frame due to the fact that the forming area of a single support on the existing lead frame occupies a large space.
In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing a lead frame, where the method for manufacturing a lead frame includes:
preparing an insulating substrate having at least one set of pairs of lead-filled vias; the lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode;
filling conductors in the lead filling through hole pairs respectively to form a positive lead and a negative lead; the position between the positive electrode lead and the negative electrode lead corresponds to a cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting.
Preferably, the preparing the insulating substrate having at least one set of pairs of lead-filled vias includes:
and removing materials on the complete insulating substrate corresponding to the preset arrangement positions of the lead filling through hole pairs to form the insulating substrate with at least one group of lead filling through hole pairs.
Preferably, the electrical conductor is made of copper or a copper alloy.
Preferably, after the pair of lead-filled through holes are filled with the electric conductors to form the positive lead and the negative lead, the method further includes:
and covering a reflecting layer on the surfaces of the positive electrode lead and the negative electrode lead.
Preferably, a copper foil layer is further disposed between the reflective layer and the positive electrode lead and the negative electrode lead.
Preferably, the step of filling the pair of lead-filling through holes with a conductor to form a positive lead and a negative lead includes:
respectively filling the lead filling through hole pairs with conductors in a molten state, and forming a positive lead and a negative lead after the conductors are cooled;
or, the lead filling through hole pairs are respectively filled with electric conductors in an interference fit mode to form a positive lead and a negative lead.
In order to solve the above technical problem, an embodiment of the present invention further provides a method for manufacturing an LED support, where the method for manufacturing an LED support includes:
forming a lead frame by the lead frame manufacturing method;
clamping the lead frame in a mold for injecting molding material to mold at least one dam on the lead frame; the dam is provided with a groove for packaging the LED chip, and the top surfaces of the anode lead and the cathode lead of the lead frame are at least partially exposed out of the bottom surface of the groove;
and cutting the box dam along a position corresponding to the position between the positive electrode lead and the negative electrode lead so that the insulating substrate of the lead frame with the cut side surfaces of the positive electrode lead and the negative electrode lead is covered in the box dam.
To solve the above technical problem, an embodiment of the present invention further provides a lead frame, including: an insulating substrate, a positive electrode lead and a negative electrode lead; the insulating substrate is provided with at least one group of lead filling through hole pairs, each lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode, and the positive lead filling through hole and the negative lead filling through hole are respectively provided with a positive lead and a negative lead which are formed by filling electric conductors; the position between the positive electrode lead and the negative electrode lead corresponds to a cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting.
Preferably, the electrical conductor is made of copper or a copper alloy.
Preferably, the surfaces of the positive electrode lead and the negative electrode lead are further covered with a reflective layer.
Preferably, a copper foil layer is further disposed between the reflective layer and the positive electrode lead and the negative electrode lead.
In order to solve the above technical problem, an embodiment of the present invention further provides an LED bracket, including: the LED chip packaging structure comprises an anode lead, a cathode lead and a dam, wherein the anode lead and the cathode lead are insulated and isolated, the dam is formed on the anode lead and the cathode lead, the anode lead and the cathode lead are obtained by filling an insulating substrate provided with a lead filling through hole pair with an electric conductor, the side surfaces of the anode lead and the cathode lead are covered by the insulating substrate, the dam is provided with a groove for packaging an LED chip, and at least part of the top surfaces of the anode lead and the cathode lead are exposed out of the bottom surface of the groove.
In order to solve the above technical problem, an embodiment of the present invention further provides an LED light emitting device, including: the LED support comprises the LED support and at least one LED chip packaged in the dam of the LED support.
To solve the above technical problem, an embodiment of the present invention further provides a light emitting device, including: in the above light-emitting device, the light-emitting device is a lighting device, an optical signal indicating device, a light supplementing device or a backlight device.
The invention has the beneficial effects that:
according to the lead frame, the support and the manufacturing method thereof, the light-emitting device and the light-emitting device provided by the embodiment of the invention, the manufacturing method of the lead frame comprises the following steps: firstly, preparing an insulating substrate with at least one group of lead filling through hole pairs; the lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode; filling conductors in the lead filling through hole pairs respectively to form a positive lead and a negative lead; the position between the positive electrode lead and the negative electrode lead corresponds to the cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting. The lead frame disclosed by the invention has the advantages that the lead pairs are formed by filling the through holes in the leads arranged on the insulating substrate, the occupied area of a single support forming area on the lead frame is reduced, the utilization rate of the lead frame is improved, the yield and the production efficiency of LED products on a single lead frame are improved, and the production cost can be effectively reduced.
Furthermore, according to the LED support manufactured by the lead frame, the side face of the lead is covered inside, so that the side face of the LED support is not exposed out of the lead, and the air tightness of the LED support is improved.
Drawings
Fig. 1 is a schematic structural diagram of a lead frame according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of an insulating substrate according to an embodiment of the invention;
fig. 3 is a schematic structural diagram of an LED support according to an embodiment of the present invention before singulation;
fig. 4 is a schematic structural diagram of an LED light-emitting device according to a first embodiment of the present invention;
fig. 5 is a flowchart of a lead frame manufacturing method according to a second embodiment of the present invention;
fig. 6 is a flowchart of a method for manufacturing an LED support according to a second embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
the invention provides a lead frame, aiming at the problem that in the prior art, the yield is low when an LED light-emitting device is manufactured on the lead frame due to the fact that a single support forming area on the lead frame occupies a large space. Referring specifically to fig. 1, the lead frame 10 includes: an insulating substrate 11, a positive electrode lead 12, and a negative electrode lead 13; at least one group of lead filling through hole pairs are arranged on the insulating substrate 11, each lead filling through hole pair comprises a positive lead filling through hole 111 and a negative lead filling through hole 112 which are arranged on the insulating substrate 11 in an isolated mode, and a positive lead 12 and a negative lead 13 which are formed by filling electric conductors are respectively arranged in the positive lead filling through hole 111 and the negative lead filling through hole 112; the position between the positive electrode lead 12 and the negative electrode lead 13 corresponds to the cut position after the LED mount is molded, so that the side surfaces of the positive electrode lead 12 and the negative electrode lead 13 are covered with the insulating substrate 11 on the LED mount obtained after cutting.
Specifically, as shown in fig. 2, which is a schematic structural diagram of the insulating substrate provided in this embodiment, a base material of the lead frame 10 in this embodiment is the insulating substrate 11, a pair of a positive lead filling through hole 111 and a negative lead filling through hole 112 are provided on the insulating substrate 11, the positive lead filling through hole 111 and the negative lead filling through hole 112 are isolated by an insulating material therebetween, the through holes are filled with a conductive body to form a functional region for subsequently mounting an LED chip and a lead electrically connected to the outside, and in addition, when the LED chip mounted on the through holes needs to be electrically connected to the outside through the lead, the bottom surface of the lead is electrically connected to the outside through the bonding region. It should be understood that the insulating substrate prepared in advance in this embodiment may be a whole plate-shaped insulating substrate, and then the material on the insulating substrate at the lead pattern is removed according to the preset lead pattern, so as to form the through hole corresponding to the position where the material is removed, and in practical applications, the material on the insulating substrate at the lead pattern may be removed by using a stamping process or an etching process, so as to form the desired pair of lead-filled through holes; of course, in other embodiments, the pair of wire-filled vias on the insulating substrate is ready-made, i.e., the vias are formed during the molding process of the insulating substrate, and it is not necessary to open the holes on the insulating substrate to form the pair of wire-filled vias during the actual use process. It should be noted that the side surfaces of the lead pair in this embodiment are covered in the insulating substrate, and the position between the positive lead and the negative lead in this embodiment (i.e., on the insulating substrate) corresponds to the cutting position after the LED support is formed on the lead frame, so that the side surfaces of the lead pair are not exposed after cutting.
It should be noted that the specific material type used for the insulating substrate in the present embodiment may be any suitable material with insulating property, for example, but not limited to, epoxy resin (EP), high temperature resistant nylon (PPA plastic), Polyphthalamide (PPA), Poly (1, 4-cyclohexanedimethanol terephthalate) (PCT, Poly1, 4-cyclohexylene dimethyl terephthalate), liquid crystal Polymer (LCP, liquid crystal Polymer), Sheet molding compound (SMC, Sheet molding compound), Epoxy Molding Compound (EMC), Unsaturated Polyester (UP) resin, polyester resin (PET, polyethylene terephthalate), Polycarbonate (PC, Polycarbonate), polyhexamethylene adipamide (nylon 66), and fiberglass (FR4), which are not specifically limited herein, and may be flexibly selected according to production requirements.
Referring to fig. 1 again, the positive lead filling through hole 111 and the negative lead filling through hole 112 in the present embodiment are respectively used for filling a conductive body to form the positive lead and the negative lead 13 of 12, where the conductive body may be various metals or metal alloy materials including but not limited to copper, aluminum, iron, silver, or may also be a mixed material containing a conductive material, such as conductive rubber, and the like. It should be understood that the lead formed using the electrical conductor is not limited to a single layer structure, but may be a composite layer structure composed of multiple layers of electrical conductors in some embodiments.
In practical applications, in order to improve the reflectivity of light emitted by the LED chip mounted on the functional region formed by the lead pair, the surface of the lead may be coated with a reflective layer, where the reflective layer may be silver, aluminum, copper, gold, or the like, and the reflective layer may be preferably coated by electroplating. In addition, a copper foil layer is further arranged between the reflecting layer and the lead, the flatness of the surface of the lead is usually not high, the surface of the lead is coated with the copper foil layer to improve the surface flatness, and then the reflecting layer is coated on the surface of the copper foil layer to form a smooth surface so as to further improve the reflectivity of the surface of the lead.
In this embodiment, the formation of the positive electrode lead and the negative electrode lead by filling the pair of lead filling through holes with the conductors respectively includes, but is not limited to, the following two ways:
the first method is as follows: and filling the lead filling through hole pairs with the conductors in a molten state respectively, and cooling the conductors to form a positive lead and a negative lead. Namely, the conductive material in a molten state is respectively poured into the filling through holes on the insulating substrate through the pouring runner, and then the conductive material is cooled and formed. It should be understood that the insulating substrate in this embodiment should have a melting point of the material that is not damaged by high temperature when the conductive body is poured inside. In addition, the inner wall of the filling through hole in the embodiment can be preferably in an uneven shape, so that the adhesive force of the formed lead in the filling through hole can be improved, and the formed lead is not easy to fall off in actual production.
The second method comprises the following steps: and respectively filling the lead filling through hole pairs with electric conductors in an interference fit manner to form a positive lead and a negative lead. Different from the first method, the conductor in this embodiment is a finished conductor product that can be directly filled, and only needs to be installed in the filling through hole in actual use, and in order to improve the stability of the conductor after being filled on the insulating substrate, the filling conductor is installed in this embodiment by an interference fit method, so as to prevent the conductor serving as the positive lead and the negative lead from accidentally falling off in the production process of the LED product.
Based on the lead frame, the present embodiment further provides an LED support 20, as shown in fig. 3, where fig. 3 is a schematic structural diagram before the LED support is singulated, and a schematic structural diagram of the singulated LED support is shown in a dashed box in fig. 3. The LED support 20 includes: the LED chip comprises a positive electrode lead 12, a negative electrode lead 13 and a dam 21, wherein the positive electrode lead 12 and the negative electrode lead 13 are insulated and isolated, the dam 21 is formed on the positive electrode lead 12 and the negative electrode lead 13, the positive electrode lead 12 and the negative electrode lead 13 are obtained by filling an insulating substrate 11 provided with a lead filling through hole pair with an electric conductor, the side faces of the positive electrode lead 12 and the negative electrode lead 13 are covered by the insulating substrate 11, the dam 21 is provided with a groove 22 for packaging an LED chip, and at least part of the top faces of the positive electrode lead 12 and the negative electrode lead 13 are exposed out of the bottom face of the groove.
In practical applications, the LED frame is clamped in a mold, and then a molding material is injected to mold the LED frame on a frame molding region of the lead frame, a groove serving as a packaging region of the LED chip is formed on a dam of the molded LED frame, wherein at least a portion of a top surface of a lead of the lead frame is exposed to a bottom surface of the groove to serve as a functional region for placing the LED chip, and in addition, when the LED chip needs to be conducted with the outside through the lead, the bottom surface of the lead is used as a bonding region to be electrically connected with the outside in this embodiment. In practical application, the LED chip can be mounted on the positive lead, and then the LED chip is electrically connected to the positive lead through the metal wire, and then the LED chip is connected to the negative lead through the metal wire. The recess is open to the top of the dam so that the interior of the recess can be encapsulated with the sealing material from the opening. It should be understood that the material for forming the dam in the present embodiment may include resin or ceramic, etc., and is not limited thereto. It should be noted that, in the present embodiment, when the single LED support after resin molding is cut, the cutting position corresponds to the position between the positive electrode lead and the negative electrode lead (i.e., on the insulating substrate), so that after the cutting is completed, the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate and are not exposed outside.
As shown in fig. 4, the present embodiment further provides an LED light emitting device 100 manufactured by using the LED support 20, which includes the LED support 20 and at least one LED chip 30 encapsulated in the dam 21 of the LED support 20.
Referring to fig. 4 again, in the single LED light emitting device 100 formed by cutting the LED support 20, the side surfaces of the anode lead 12 and the cathode lead 13 of the LED support 20 are preferably covered in the LED support, so that the side surfaces of the lead pair are not exposed, and the air tightness of the LED light emitting device can be improved.
The colors of the LED light-emitting device provided by the embodiment, which are emitted by illumination and presented to a user, can be flexibly set according to actual requirements and application scenes. What color the light of the LED lighting device emits can be flexibly controlled by, but not limited to, the following factors: the color of light emitted by the LED chip itself, whether the LED lighting device is provided with a luminescence conversion layer, the type of luminescence conversion layer provided when the LED lighting device is provided with a luminescence conversion layer.
In an example of the embodiment, the LED light emitting device may further include a lens adhesive layer or a diffusion adhesive layer disposed on the LED chip (when the light emitting conversion adhesive layer is disposed on the LED chip, the light emitting conversion adhesive layer is disposed on the light emitting conversion adhesive layer); of course, in some examples, a layer of transparent glue may also be provided over the LED chip.
It should be understood that, in an example, the luminescence conversion glue layer may be a phosphor glue layer containing phosphor, or may be a colloid containing quantum dot photo-induced material, or other luminescence conversion glue or film capable of realizing luminescence conversion, and may also include diffusing powder or silicon powder, etc. as required; the light emitting conversion glue layer, the lens glue layer or the diffusion glue layer formed on the LED chip in this embodiment includes, but is not limited to, dispensing, molding, spraying, pasting, and the like.
For example, the luminescence conversion paste layer may include a phosphor paste layer, a phosphor film, or a quantum dot QD film; the phosphor glue layer and the phosphor film can be made of inorganic phosphor, and can be inorganic phosphor doped with rare earth elements, wherein the inorganic phosphor includes but is not limited to at least one of silicate, aluminate, phosphate, nitride and fluoride phosphor.
For another example, the quantum dot QD film may be fabricated using quantum dot phosphors; quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd (SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI 3.
In this embodiment, the type of light emitted by the LED chip itself may be visible light, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light emitting conversion layer may be disposed on the LED chip to convert the invisible light to visible light, so that the light emitted by the LED light emitting device is visible to the user. For example, when the light emitted from the LED chip itself is ultraviolet light, if the LED light emitting device is supposed to display white light visible to a user, the light emitting conversion layer may be made by mixing red, green, and blue phosphors.
The lead frame provided by the embodiment of the invention comprises: an insulating substrate, a positive electrode lead and a negative electrode lead; the insulating substrate is provided with at least one group of lead filling through hole pairs, each lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode, and a positive lead and a negative lead which are formed by filling electric conductors are arranged in the positive lead filling through hole and the negative lead filling through hole respectively; the position between the positive electrode lead and the negative electrode lead corresponds to the cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting. The lead pairs are formed by filling the through holes in the pairs with the leads arranged on the insulating substrate, so that the occupied area of a single support forming area on the lead frame is reduced, the utilization rate of the lead frame is improved, the yield and the production efficiency of LED products on a single lead frame are improved, and the production cost can be effectively reduced; in addition, according to the LED support manufactured by the lead frame, the side face of the lead is covered inside, so that the side face of the LED support is not exposed out of the lead, and the air tightness of the LED support is improved.
Example two:
in order to facilitate an overall understanding of the present invention, the present embodiment illustrates a manufacturing process of the lead frame provided by the present invention.
Referring to fig. 5, fig. 5 is a flowchart of a method for manufacturing a lead frame according to the present embodiment, and when manufacturing the lead frame, the method includes the following specific steps:
s501, preparing an insulating substrate with at least one group of lead filling through hole pairs; the lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode.
In this embodiment, the insulating substrate has at least one pair of lead-filled via pairs, wherein each pair of lead-filled via pairs is isolated from each other, and the positive lead-filled via and the negative lead-filled via of the pair of lead-filled via pairs are isolated from each other.
In one implementation, preparing an insulating substrate having at least one set of pairs of lead-filled vias includes: and removing the material on the complete insulating substrate at the position of the lead pattern according to a preset lead pattern to form the insulating substrate with at least one group of lead filling through hole pairs. That is, the insulating substrate prepared in advance in this embodiment is a whole plate-shaped insulating substrate, and then the material at the lead pattern is removed from the whole insulating substrate according to the preset lead pattern, so as to form a through hole corresponding to the position where the material is removed, and in practical application, the material at the lead pattern on the insulating substrate can be removed by stamping or etching, so as to form a desired pair of lead-filled through holes; of course, in other embodiments, the pair of wire-filled vias on the insulating substrate is ready-made, i.e., the vias are formed during the molding process of the insulating substrate, and it is not necessary to open the holes on the insulating substrate to form the pair of wire-filled vias during the actual use process.
S502, respectively filling conductors in the lead filling through hole pairs to form a positive lead and a negative lead; the position between the positive electrode lead and the negative electrode lead corresponds to the cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting.
The pair of lead-filled through holes in this embodiment is used to fill electrical conductors to form a functional region for mounting an LED chip and a positive lead and a negative lead for conducting with the outside. It should also be noted that the side surfaces of the pair of leads in this embodiment are covered in the insulating substrate, and the position between the positive and negative leads in this embodiment (i.e., on the insulating substrate) corresponds to the cutting position after the resin molding is completed on the lead frame, so that the side surfaces of the pair of leads are not exposed after cutting.
In addition, in practical application, in order to improve the reflectivity of the lead to the light emitted by the LED chip placed on the functional region, the surface of the lead may be coated with a reflective layer, wherein the reflective layer may be silver, aluminum, copper, gold, or the like, and the reflective layer may be preferably coated by electroplating. In addition, a copper foil layer is further arranged between the reflecting layer and the lead, the flatness of the surface of the lead is usually not high, the surface of the lead is coated with the copper foil layer to improve the surface flatness, and then the reflecting layer is coated on the surface of the copper foil layer to form a smooth surface so as to further improve the reflectivity of the surface of the lead.
It should be further noted that, in practical applications, the positive electrode lead and the negative electrode lead are formed by filling the lead filling through hole pairs with the electric conductors, respectively, but are not limited to the following two ways:
the first method is as follows: and filling the lead filling through hole pairs with the conductors in a molten state respectively, and cooling the conductors to form a positive lead and a negative lead. Namely, the conductive material in a molten state is respectively poured into the filling through holes on the insulating substrate through the pouring runner, and then the conductive material is cooled and formed.
The second method comprises the following steps: and respectively filling the lead filling through hole pairs with electric conductors in an interference fit manner to form a positive lead and a negative lead. The conductor in this embodiment is a finished conductor product that can be directly filled, and in actual use, it is only necessary to install the conductor product into the filled through hole in an interference fit manner.
Further, the present embodiment also illustrates a process of manufacturing an LED support by using the lead frame manufactured by the above manufacturing process.
Referring to fig. 6, fig. 6 is a flowchart of a method for manufacturing an LED bracket according to this embodiment, and when manufacturing an LED bracket, the specific implementation steps include:
s601, preparing a lead frame; the lead frame comprises an insulating substrate and a positive electrode lead and a negative electrode lead which are filled in the lead filling through hole pairs on the insulating substrate.
S602, clamping the lead frame in a mold to inject molding material, and molding at least one dam on the lead frame; the dam is provided with a groove for packaging the LED chip, and the top surfaces of the anode lead and the cathode lead of the lead frame are at least partially exposed out of the bottom surface of the groove.
And S603, cutting the box dam along the position corresponding to the position between the positive electrode lead and the negative electrode lead so that the insulating substrate of the lead frame with the cut side surfaces of the positive electrode lead and the negative electrode lead is covered in the box dam.
In practical applications, the LED frame is clamped in a mold, and then a molding material is injected to mold the LED frame on a frame molding region of the lead frame, a groove serving as a packaging region of the LED chip is formed on a dam of the molded LED frame, wherein at least a portion of a top surface of a lead of the lead frame is exposed to a bottom surface of the groove to serve as a functional region for placing the LED chip, and in addition, when the LED chip needs to be conducted with the outside through the lead, the bottom surface of the lead is used as a bonding region to be electrically connected with the outside in this embodiment. It should be noted that, in the present embodiment, when the single LED support after resin molding is cut, the cutting position corresponds to the position between the positive electrode lead and the negative electrode lead (i.e., on the insulating substrate), so that after the cutting is completed, the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate and are not exposed outside.
The lead frame manufacturing method provided by the embodiment of the invention comprises the following steps: preparing an insulating substrate having at least one set of pairs of lead-filled vias; the lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode; filling conductors in the lead filling through hole pairs respectively to form a positive lead and a negative lead; the position between the positive electrode lead and the negative electrode lead corresponds to the cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting. The lead pairs are formed by filling the through holes in the leads arranged on the insulating substrate, the occupied area of a single support forming area on the lead frame is reduced, the utilization rate of the lead frame is improved, the yield and the production efficiency of LED products on a single lead frame are improved, and the production cost can be effectively reduced.
Example three:
the present embodiment provides a light-emitting apparatus including the LED light-emitting device exemplified in the first or second embodiment. The light emitting device in this embodiment may be a lighting device, an optical signal indicating device, a light supplementing device, or a backlight device. When the lighting device is used, the lighting device can be specifically applied to various fields, such as a table lamp, a fluorescent lamp, a ceiling lamp, a down lamp, a street lamp, a projection lamp and the like in daily life, a high beam lamp, a dipped beam lamp, an atmosphere lamp and the like in an automobile, an operation lamp, a low electromagnetic lighting lamp and a lighting lamp of various medical instruments in medical use, and various colored lamps, landscape lighting lamps, advertisement lamps and the like in the field of decoration; when the optical signal indicating device is used, the optical signal indicating device can be applied to various fields, such as signal indicating lamps in the traffic field and various signal state indicating lamps on communication equipment in the communication field; when the device is a light supplement device, the device can be a light supplement lamp in the photographic field, such as a flash lamp and a light supplement lamp, and can also be a plant light supplement lamp for supplementing light to plants in the agricultural field; in the case of the backlight device, the backlight device may be applied to various backlight fields, for example, a display, a television, a mobile terminal such as a mobile phone, and an advertisement machine.
It should be understood that the above applications are only exemplary of the present embodiment, and that the application of the LED light emitting device is not limited to the exemplary fields.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (14)
1. A lead frame manufacturing method is characterized by comprising the following steps:
preparing an insulating substrate having at least one set of pairs of lead-filled vias; the lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode;
filling conductors in the lead filling through hole pairs respectively to form a positive lead and a negative lead; the position between the positive electrode lead and the negative electrode lead corresponds to a cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting.
2. The lead frame fabrication method of claim 1, wherein said preparing an insulating substrate having at least one set of pairs of lead-filled vias comprises:
and removing materials on the complete insulating substrate corresponding to the preset arrangement positions of the lead filling through hole pairs to form the insulating substrate with at least one group of lead filling through hole pairs.
3. Lead frame manufacturing method according to claim 1, characterized in that the electrical conductor is made of copper or a copper alloy.
4. The method for manufacturing a lead frame according to claim 1, wherein after the pair of lead-filled through-holes are filled with the electric conductors to form the positive lead and the negative lead, respectively, the method further comprises:
and covering a reflecting layer on the surfaces of the positive electrode lead and the negative electrode lead.
5. The lead frame manufacturing method according to claim 4, wherein a copper foil layer is further provided between the reflective layer and the positive electrode lead and the negative electrode lead.
6. The lead frame manufacturing method according to any one of claims 1 to 5, wherein the forming of the positive electrode lead and the negative electrode lead by filling the pair of lead-filling through-holes with the electric conductors respectively comprises:
respectively filling the lead filling through hole pairs with conductors in a molten state, and forming a positive lead and a negative lead after the conductors are cooled;
or, the lead filling through hole pairs are respectively filled with electric conductors in an interference fit mode to form a positive lead and a negative lead.
7. A manufacturing method of an LED bracket is characterized by comprising the following steps:
forming a lead frame by the lead frame fabrication method of any one of claims 1 to 6;
clamping the lead frame in a mold for injecting molding material to mold at least one dam on the lead frame; the dam is provided with a groove for packaging the LED chip, and the top surfaces of the anode lead and the cathode lead of the lead frame are at least partially exposed out of the bottom surface of the groove;
and cutting the box dam along a position corresponding to the position between the positive electrode lead and the negative electrode lead so that the insulating substrate of the lead frame with the cut side surfaces of the positive electrode lead and the negative electrode lead is covered in the box dam.
8. A lead frame, comprising: an insulating substrate, a positive electrode lead and a negative electrode lead; the insulating substrate is provided with at least one group of lead filling through hole pairs, each lead filling through hole pair comprises a positive lead filling through hole and a negative lead filling through hole which are arranged on the insulating substrate in an isolated mode, and the positive lead filling through hole and the negative lead filling through hole are respectively provided with a positive lead and a negative lead which are formed by filling electric conductors; the position between the positive electrode lead and the negative electrode lead corresponds to a cutting position after the LED support is formed, so that the side surfaces of the positive electrode lead and the negative electrode lead are covered by the insulating substrate on the LED support obtained after cutting.
9. Leadframe according to claim 8, characterized in that the electrical conductor is made of copper or a copper alloy.
10. The lead frame according to claim 8 or 9, wherein the surface of the positive electrode lead and the negative electrode lead is further covered with a reflective layer.
11. The lead frame of claim 10, wherein a copper foil layer is further disposed between the reflective layer and the positive and negative leads.
12. An LED support, comprising: the LED chip packaging structure comprises an anode lead, a cathode lead and a dam, wherein the anode lead and the cathode lead are insulated and isolated, the dam is formed on the anode lead and the cathode lead, the anode lead and the cathode lead are obtained by filling an insulating substrate provided with a lead filling through hole pair with an electric conductor, the side surfaces of the anode lead and the cathode lead are covered by the insulating substrate, the dam is provided with a groove for packaging an LED chip, and at least part of the top surfaces of the anode lead and the cathode lead are exposed out of the bottom surface of the groove.
13. An LED light emitting device comprising the LED support of claim 12 and at least one LED chip encapsulated within the dam of the LED support.
14. A lighting device comprising the LED device as claimed in claim 13, wherein the lighting device is a lighting device, a light signal indicating device, a light supplementing device or a backlight device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811004283.1A CN110875418A (en) | 2018-08-30 | 2018-08-30 | Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811004283.1A CN110875418A (en) | 2018-08-30 | 2018-08-30 | Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device |
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| CN110875418A true CN110875418A (en) | 2020-03-10 |
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|---|---|---|---|
| CN201811004283.1A Pending CN110875418A (en) | 2018-08-30 | 2018-08-30 | Lead frame, support, manufacturing method of lead frame, support, light-emitting device and light-emitting device |
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| Country | Link |
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| CN (1) | CN110875418A (en) |
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