CN211238282U

CN211238282U - High-reliability LED support, LED and light-emitting device

Info

Publication number: CN211238282U
Application number: CN201921657319.6U
Authority: CN
Inventors: 杨丽敏; 王传虎; 王东东
Original assignee: Huizhou Jufei Photoelectric Co ltd
Current assignee: Huizhou Jufei Photoelectric Co ltd
Priority date: 2019-09-30
Filing date: 2019-09-30
Publication date: 2020-08-11
Anticipated expiration: 2029-09-30

Abstract

The utility model provides a high reliability LED support, LED and illuminator, including the base plate and with enclosing the enclosure body including the base plate, the enclosure region that the enclosure body formed is including enclosing the inclined plane, wherein, be provided with the recess in the region department that base plate and enclosure body closely laminated, the recess is provided with the coarsening layer that forms after the coarsing treatment, encloses the part or all of inclined plane and is provided with the coarsening layer that forms after the coarsing treatment; the problem of among the prior art LED support and utilize the LED's that this support made reliable performance poor is solved. Namely, the groove with the coarsened layer is arranged on the substrate and in the area tightly attached to the enclosure body, so that the binding force between the enclosure body and the substrate is stronger; meanwhile, the part or the whole of the enclosing inclined plane is provided with the coarsening layer, so that the binding force of the colloid and the enclosing inclined plane is stronger, and the reliability and the durability of the LED support and the LED manufactured by the LED support are improved to a great extent.

Description

High-reliability LED support, LED and light-emitting device

Technical Field

The utility model relates to a LED (Light Emitting Diode) field especially relates to a high reliability LED support, LED and illuminator.

Background

Because the LED has the advantages of rich colors, small volume, environmental protection, energy conservation, long service life and the like, the LED can be widely used and popularized in various fields, such as but not limited to daily illumination, outdoor illumination, light decoration, advertisement marks, automobile illumination or indication, traffic indication and the like.

Referring to fig. 1-1 and fig. 1-2, the conventional LED support includes a plastic enclosure 10 forming a reflective cavity, and a substrate 11 enclosed by the plastic enclosure 10, wherein the plastic enclosure 10 forms an enclosure area 101 including an enclosure slope 1011, and a part of the upper surface of the substrate 11 directly contacts with the plastic enclosure 10, which is called a contact area; the other part of the area is positioned at the bottom of the reflecting cavity and is used as a functional area which can be used for bearing an LED chip and other possible electronic devices, wiring, die bonding, a light reflecting area and the like. In the existing LED support, because the bonding strength between the substrate 11 and the plastic enclosing wall 10 is not enough, external moisture is easy to enter, and the reliability of the LED support is not high.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high reliability LED support, LED and illuminator, the main technical problem who solves is: the problem of current LED support and utilize the LED's that this support made reliable performance poor is solved.

In order to solve the technical problem, the utility model provides a high reliability LED support, high reliability LED support includes the base plate and will the enclosure body including the base plate encloses, the enclosure that the enclosure body formed encloses closes the region including enclosing and closing the inclined plane the base plate with the region department that the enclosure body closely laminated is provided with the recess, the recess is provided with the coarsening layer that forms after the alligatoring is handled, the part or all that enclose and close the inclined plane are provided with the coarsening layer that forms after the alligatoring is handled.

In an embodiment of the present invention, the substrate includes a first substrate, a second substrate, and an insulating isolation strip for isolating the first substrate from the second substrate.

In an embodiment of the present invention, a groove is disposed on the first substrate and at the region where the wall body is tightly attached, and/or a groove is disposed on the second substrate and at the region where the wall body is tightly attached.

In an embodiment of the present invention, the part or the whole area of the inner wall of the groove is a roughened layer formed after roughening treatment.

In an embodiment of the present invention, an included angle between the side surface and the bottom surface of the groove is smaller than 90 degrees.

In an embodiment of the present invention, the coarsening layer is a curved coarsening layer, or a linear coarsening layer.

In order to solve the above problem, the utility model also provides a LED, include as above high reliability LED support and an at least LED chip, the LED chip set up in on the base plate, the pin of LED chip with the base plate electricity is connected.

In an embodiment of the present invention, the enclosure region is filled with a colloid, and the colloid is adhered to the enclosure inclined plane.

In an embodiment of the present invention, the glue is at least one of an encapsulation glue, a luminescence conversion glue and a diffusion glue.

In order to solve the above problem, the utility model also provides a light emitting device, include as above LED, light emitting device is lighting device, light signal indicating device, light filling device or backlight unit.

The utility model has the advantages that:

the utility model provides a high reliability LED support, LED and illuminator, including the base plate and enclose the enclosure body including the base plate, the enclosure region that the enclosure body formed includes encloses and closes the inclined plane, wherein, be provided with the recess in the region department that base plate and enclosure body closely laminated, the recess is provided with the coarsening layer that forms after the coarsing treatment, encloses the part or all of inclined plane and is provided with the coarsening layer that forms after the coarsing treatment; the problem of among the prior art LED support and utilize the LED's that this support made reliable performance poor is solved. That is, in the utility model, the combination area of the enclosing wall body and the base plate is increased by arranging the groove on the base plate and the area which is tightly attached to the enclosing wall body, and the groove is also provided with the coarsening layer, so that the combination area is further increased, and the combination force of the enclosing wall body and the base plate is stronger; simultaneously the enclosure inclined plane that forms at the enclosure body still has the coarsening layer, should be used for when the encapsulation LED, the colloid is filled and is enclosed in the region, the colloid has been increased and has been enclosed the combination area on inclined plane, make the colloid and enclose the cohesion that closes the inclined plane stronger, even make the colloid and the cohesion of the enclosure body stronger, thereby promoted LED support and utilized the LED's that this LED support made reliability and durability, make the application scene that is applicable to various environment that LED can be better, more do benefit to LED's popularization and use.

Drawings

FIG. 1-1 is a top view of an LED support;

1-2 are cross-sectional views of the LED support shown in FIG. 1-1;

fig. 2-1 is a top view of an LED support according to an embodiment of the present invention;

FIG. 2-2 is a cross-sectional view one of the LED support shown in FIG. 2-1;

fig. 3-1 is a first cross-sectional view of an LED mount according to a second embodiment of the present invention;

fig. 3-2 is a cross-sectional view of a second LED support provided in accordance with a second embodiment of the present invention;

fig. 3-3 are cross-sectional views of a LED mount according to an embodiment of the present invention;

3-4 are cross-sectional views I of the linear groove roughening layer of the LED support shown in FIG. 3-1;

3-5 are first top views of the linear groove roughening layer of the LED support shown in FIG. 3-1;

3-6 are cross-sectional views of the linear groove roughening layer of the LED support shown in FIG. 3-1;

3-7 are second top views of the linear groove roughened layer of the LED support shown in FIG. 3-1;

fig. 4-1 is a first cross-sectional view of a LED bracket according to a third embodiment of the present invention;

FIG. 4-2 is a first cross-sectional view of the curved groove roughening layer of the LED support shown in FIG. 4-1;

FIG. 4-3 is a first top view of the curved groove roughening layer of the LED support shown in FIG. 4-1;

FIG. 4-4 is a second cross-sectional view of the curved groove roughening layer of the LED support shown in FIG. 4-1;

FIG. 4-5 is a second top view of the curved groove roughening layer of the LED support shown in FIG. 4-1;

wherein, reference numeral 10 in fig. 1-1 to fig. 1-2 is an enclosing wall body, 11 is a substrate, 101 is an enclosing region formed by the enclosing

wall body

10, 1011 is an enclosing inclined plane included in the enclosing region 101;

reference numeral 20 in fig. 2-1 to 2-2 is a surrounding wall body, 201 is a surrounding area formed by the surrounding

wall body

20, 2011 is a surrounding inclined plane included in the surrounding

area

201, 211 is a first substrate, 212 is a second substrate, 213 is an insulating isolation strip, 214 is a groove disposed on the first substrate 211 and at an area tightly attached to the surrounding

wall body

20, and 215 is a groove disposed on the second substrate 212 and at an area tightly attached to the surrounding wall body 20;

reference numeral 30 in fig. 3-1 to 3-3 is a wall body, 301 is a surrounding region formed by the

wall body

30, 3011 is a surrounding slope included in the surrounding

region

301, 311 is a first substrate, 312 is a second substrate, 313 is an insulating isolation strip, 314 is a groove disposed on the first substrate 311 and in a region tightly attached to the

wall body

30, and 315 is a groove disposed on the second substrate 312 and in a region tightly attached to the wall body 30;

reference numeral 40 in fig. 4-1 is a surrounding wall body, 401 is a surrounding area formed by the surrounding

wall body

40, 4011 is a surrounding inclined plane included in the surrounding

area

401, 411 is a first substrate, 412 is a second substrate, 413 is an insulating isolation strip, 414 is a groove disposed on the first substrate 411 and at an area tightly attached to the surrounding

wall body

40, and 415 is a groove disposed on the second substrate 412 and at an area tightly attached to the surrounding wall body 40.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the embodiments of the present invention are described in further detail below with reference to the accompanying drawings by way of specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

The first embodiment is as follows:

in order to solve the problem that the reliability of the existing LED support is poor, the embodiment provides a high-reliability LED support, including the base plate and the enclosure body enclosing the base plate, the enclosure body forms encloses the area including enclosing the inclined plane, wherein, the area department of closely laminating at base plate and enclosure body is provided with the recess, the recess is provided with the coarsening layer that forms after the coarsening is handled, the part or all that enclose the inclined plane is provided with the coarsening layer that forms after the coarsening is handled.

In this embodiment, the substrate includes a first substrate, a second substrate, an insulating isolation strip for isolating the first substrate from the second substrate, and an insulating enclosure enclosing the first substrate, the second substrate, and the insulating isolation strip. For example, as shown in fig. 2-1 and 2-2, the substrate includes a first substrate 211, a second substrate 212, and an insulating isolation strip 213, wherein the insulating isolation strip 213 is located between the first substrate 211 and the second substrate 212 to insulate and isolate the two; the enclosing region formed by the enclosing wall body 20 is 201 and comprises an enclosing inclined surface 2011, the enclosing wall body 20 encloses the first substrate 211, the second substrate 212 and the insulating isolation belt 213, and the upper surfaces of the first substrate 211 and the second substrate 212 are provided with a functional region and a contact region contacted with the enclosing wall body 20; in one example, the functional regions on the upper surfaces of the first and second substrates are located at the bottom of a reflective cavity formed around the wall.

The first substrate and the second substrate in this embodiment are both conductive substrates, and the conductive substrate in this embodiment may be substrates made of various conductive materials, for example, various metal conductive substrates, including but not limited to a copper substrate, an aluminum substrate, an iron substrate, and a silver substrate; the conductive substrate may also be a hybrid material conductive substrate containing a conductive material, such as a conductive rubber or the like.

Optionally, in this embodiment, a reflective layer may be further disposed in the functional region of at least one of the first substrate and the second substrate to improve the light extraction efficiency of the bracket, and the reflective layer may be various light reflective layers capable of improving the light extraction efficiency, such as, but not limited to, a silver plating layer.

Optionally, in this embodiment, the back surface of at least one of the first substrate and the second substrate is exposed to the bottom of the enclosure body to serve as the electrode pad. Of course, in some examples, the back surface of at least one of the first substrate and the second substrate may not be used as the bonding pad, and the side surface thereof may be used as the bonding pad, and the specific arrangement may be flexibly determined according to the specific application requirement.

Optionally, in this embodiment, the area of the first substrate is larger than the area of the second substrate. Of course, in some examples, the area of the first substrate may also be smaller than that of the second substrate, and the specific arrangement may be flexibly set according to the specific application requirement.

Optionally, the enclosure body in this embodiment may be made of various insulating materials, for example, but not limited to, various plastics, insulating ceramics, and the like. For example, in one example, the materials that can be used for the enclosure include, but are not limited to, Poly (1, 4-cyclohexanedimethanol terephthalate) (PCT, Poly1, 4-cyclohexylene dimethyl terephthalate), Epoxy Molding Compound (EMC), Unsaturated Polyester (UP) resin, polyester resin (PET), high temperature nylon (PPA plastic), and Polycarbonate (PC, Polycarbonate).

Optionally, the material of the insulating isolation strip in this embodiment may be the same as or different from the wall body, and it may be formed together with the wall body or formed separately.

In addition, it should be understood that the forming manner of the enclosure body in the embodiment may also be flexibly selected, for example, but not limited to, forming by injection molding.

In this embodiment, a groove is disposed on at least one of the first substrate and the second substrate of the LED support and in a region that is tightly attached to the enclosure, it should be understood that the arrangement of the groove can increase a bonding area between the enclosure and the substrate, that is, can enhance a bonding force between the enclosure and the substrate.

In one example, still referring to fig. 2-2, a groove 214 is disposed on the first substrate 211 and closely attached to the enclosure 20, and a groove 215 is disposed on the second substrate 212 and closely attached to the enclosure 20, wherein the groove is provided with a roughened layer formed by roughening treatment.

In an example, the groove 214 may be disposed only on the first substrate 211 and at a region closely attached to the enclosure body 20, wherein the groove is provided with a roughened layer formed by roughening treatment.

In an example, the groove 215 may be disposed only on the second substrate 212 and at a region closely attached to the enclosure body 20, wherein the groove is provided with a roughened layer formed by roughening treatment.

In this embodiment, the enclosing region formed by the enclosing wall body includes an enclosing inclined plane, and a part or all of the enclosing inclined plane is provided with a coarsening layer formed after coarsening treatment.

In one example, for example, as shown in fig. 2-2, a roughened layer formed after a roughening process is provided on a partial region on the enclosing slope 2011.

In one example, a roughened layer formed after roughening processing may be provided on the entire region on the enclosing slope 2011.

It should be clear that, in this embodiment, the forming process of providing the groove on at least one of the first substrate and the second substrate of the LED support and at the region that is tightly attached to the enclosure body may be flexibly selected, for example, including but not limited to etching, cutting, stamping, etc., the forming manner is simple, the cost is low, the efficiency is high, and the reliability of the LED support may be improved while the manufacturing cost and efficiency of the support are ensured.

In this embodiment, the substrate groove may be a curved groove or a linear groove.

In one example, and still referring to fig. 2-2 for example, the groove 214 disposed on the first substrate 211 in the area closely adjacent to the enclosure body 20 is a linear groove, and the groove 215 disposed on the second substrate 212 in the area closely adjacent to the enclosure body 20 is a curved groove.

In one example, the groove 214 disposed on the first substrate 211 at the region closely attached to the enclosure body 20 may be a curved groove, and the groove 215 disposed on the second substrate 212 at the region closely attached to the enclosure body 20 may be a straight groove.

In one example, the groove 214 disposed on the first substrate 211 at the region closely attached to the enclosure body 20 and the groove 215 disposed on the second substrate 212 at the region closely attached to the enclosure body 20 may be both curved grooves.

In one example, the groove 214 disposed on the first substrate 211 and the region closely attached to the enclosure body 20, and the groove 215 disposed on the second substrate 212 and the region closely attached to the enclosure body 20 may be linear grooves.

In this embodiment, the groove that sets up on at least one base plate in the first base plate of LED support and the second base plate and with the regional department that the enclosure body closely laminated has the coarsened layer, the combination area of enclosure body and base plate can further be increased in the setting that this kind of groove has the coarsened layer, can further strengthen the cohesion between enclosure body and the base plate, thereby further promoted the reliability and the durability of LED support and the LED that utilizes this LED support to make, make LED can be better satisfy various environment operation requirements, more do benefit to LED's popularization and use.

In an example, the coarsening layer is a curved coarsening layer or a linear coarsening layer, or a coarsening layer in which a curve is combined with a straight line, and in practical application, the coarsening layer can be flexibly adjusted according to a specific application scenario.

In one example, a part or all of the inner wall of the groove may be roughened to form a roughened layer, for example, if the groove is a straight groove having three sides, any one or any combination of the three sides of the inner wall may be roughened to form a roughened layer. In practical application, the method can be flexibly adjusted according to specific application scenes.

In the embodiment, the groove is arranged on the substrate of the LED support and in the area tightly attached to the enclosing wall body, so that the bonding area between the enclosing wall body and the substrate is increased, and the groove is also provided with the coarsening layer, so that the bonding area is further increased, and the bonding force between the enclosing wall body and the substrate is stronger; simultaneously the enclosure inclined plane that forms at the enclosure body still has the coarsening layer, should be used for when the encapsulation LED, the colloid is filled and is enclosed in the region, the colloid has been increased and has been enclosed the combination area on inclined plane, make the colloid and enclose the cohesion that closes the inclined plane stronger, even make the colloid and the cohesion of the enclosure body stronger, thereby promoted LED support and utilized the LED's that this LED support made reliability and durability, make the application scene that is applicable to various environment that LED can be better, more do benefit to LED's popularization and use.

Example two:

for the convenience of understanding, the present embodiment is described by taking a specific LED support as an example.

Referring to fig. 3-1, 3-2, and 3-3, 30 is a surrounding wall body, 301 is a surrounding area formed by the surrounding

wall body

30, 3011 is a surrounding inclined plane included in the surrounding area, 311 is a first substrate, 312 is a second substrate, 313 is an insulating isolation strip, 314 is a linear groove disposed on the first substrate and in a region tightly attached to the surrounding

wall body

30, and 315 is a linear groove disposed on the second substrate and in a region tightly attached to the surrounding wall body 30.

Referring to fig. 3-1, a linear groove is disposed on the substrate in a region that is tightly attached to the enclosure, wherein the linear groove is disposed on the upper surface and the side surface of the substrate, and the included angles between the side surface and the bottom surface of the linear groove on the upper surface and the side surface of the substrate are both equal to 90 degrees, and the linear groove is provided with a roughened layer formed after roughening treatment (not shown in fig. 3-1, see the following description); all of the enclosing inclined plane is provided with a linear type coarsened layer formed after coarsening treatment, and optionally, the part of the enclosing inclined plane can be provided with the linear type coarsened layer formed after coarsening treatment.

Referring to fig. 3-2, a linear groove is disposed on the substrate and in a region tightly attached to the wall body, wherein the linear groove is disposed on the upper surface and the side surface of the substrate, an included angle between the side surface and the bottom surface of the linear groove disposed on the upper surface and the side surface of the substrate is smaller than 90 degrees, and the linear groove is provided with a roughened layer formed after roughening treatment (not shown in fig. 3-2, see the following description); all of the enclosing inclined plane is provided with a linear type coarsened layer formed after coarsening treatment, and optionally, the part of the enclosing inclined plane can be provided with the linear type coarsened layer formed after coarsening treatment.

Referring to fig. 3-3, a linear groove is disposed on the substrate and in a region tightly attached to the wall, wherein the linear groove is disposed on the upper surface and the side surface of the substrate, an included angle between the side surface of the linear groove on the upper surface of the substrate and the bottom surface is smaller than 90 degrees, an included angle between the side surface of the linear groove on the side surface of the substrate and the bottom surface is equal to 90 degrees, and a roughening layer (not shown in fig. 3-3, see the following description) is disposed on the linear groove; all of the enclosing inclined plane is provided with a linear type coarsened layer formed after coarsening treatment, and optionally, the part of the enclosing inclined plane can be provided with the linear type coarsened layer formed after coarsening treatment.

It should be understood that when the grooves are formed by etching, specifically, a masking plate may be formed on the upper surface and/or the side surface of the substrate to expose the shape of the grooves (the angle between the side surface and the bottom surface of the grooves is less than 90 degrees as in the above example), and the other portions may be covered, and the portions not exposed may be etched away by using a specific chemical solution to obtain the desired shape of the grooves. It should be noted that, the specific etching method is only used as an example to form the groove, and in practical applications, the method needs to be flexibly adjusted according to specific application scenarios.

In order to better show the roughened layer formed after roughening treatment in the grooves, the straight grooves shown in fig. 3-1 are taken as an example for description:

in one example, as shown in FIGS. 3-4 and 3-5, the entire region of the inner wall of the linear groove is roughened to form a curved roughened layer. Alternatively, a partial region of the inner wall of the linear groove may be roughened to form a curved roughened layer.

In one example, as shown in FIGS. 3-6 and 3-7, the entire region of the inner wall of the linear groove is roughened to form a linear roughened layer. Alternatively, a partial region of the inner wall of the linear groove may be roughened to form a linear roughened layer.

In the embodiment, the linear grooves with the coarsened layers are arranged on the first substrate and the second substrate of the LED support and in the areas tightly attached to the enclosure body, so that the bonding area between the enclosure body and the substrates is increased, and the bonding force between the enclosure body and the substrates is stronger; meanwhile, the enclosing inclined plane formed by the enclosing wall body is provided with the coarsening layer, so that the combination area of the colloid and the enclosing inclined plane is increased, the combination force of the colloid and the enclosing wall body is stronger, the reliability and the durability of the LED support and the LED manufactured by the LED support are improved to a great extent, the LED can be better suitable for application scenes of various environments, and the popularization and the use of the LED are more facilitated.

Example three:

Referring to fig. 4-1, 40 is a surrounding wall body, 401 is a surrounding area formed by the surrounding

wall body

40, 4011 is a surrounding inclined plane included in the surrounding area, 411 is a first substrate, 412 is a second substrate, 413 is an insulating isolation strip, 414 is a curved groove disposed on the first substrate and in close contact with the surrounding

wall body

40, and 415 is a curved groove disposed on the second substrate and in close contact with the surrounding wall body 40.

Referring to fig. 4-1, a curved groove is disposed on a region of the substrate and closely attached to the wall body, wherein the curved groove is located on the upper surface and the side surface of the substrate, and included angles between the side surface and the bottom surface of the curved groove located on the upper surface and the side surface of the substrate are both greater than 90 degrees, it can be understood that, for the curved groove, the included angle is formed by a tangent line of a side surface (i.e., a side edge) of the groove and a tangent line of a bottom surface (i.e., a bottom edge), and the curved groove is provided with a roughened layer formed after roughening treatment (not shown in fig. 4-1, see the following description); the part of the enclosing inclined plane is provided with a curved coarsening layer formed after coarsening treatment, and optionally, all of the enclosing inclined plane can be provided with a curved coarsening layer formed after coarsening treatment.

In order to better show the roughened layer formed after the roughening treatment provided in the groove, the curved groove shown in fig. 4-1 is taken as an example for explanation:

in one example, as shown in fig. 4-2 and 4-3, the entire region of the inner wall of the curved groove is roughened to form a curved roughened layer. Optionally, a part of the region of the inner wall of the curved groove may be roughened to form a curved roughened layer.

In one example, as shown in fig. 4-4 and 4-5, the entire region of the inner wall of the curved groove is roughened to form a linear roughened layer. Alternatively, a part of the region of the inner wall of the curved groove may be roughened to form a linear roughened layer.

In the embodiment, the curved grooves with the coarsened layers are arranged on the first substrate and the second substrate of the LED support and in the areas which are tightly attached to the enclosure body, so that the bonding area of the enclosure body and the substrates is increased, and the bonding force between the enclosure body and the substrates is stronger; meanwhile, the enclosing inclined plane formed by the enclosing wall body is provided with the coarsening layer, so that the combination area of the colloid and the enclosing inclined plane is increased, the combination force of the colloid and the enclosing wall body is stronger, the reliability and the durability of the LED support and the LED manufactured by the LED support are improved to a great extent, the LED can be better suitable for application scenes of various environments, and the popularization and the use of the LED are more facilitated.

Example four:

the embodiment provides an LED, which includes the LED support shown in the above embodiments, and further includes at least one LED chip, where the LED chip is disposed on the substrate, and the pins of the LED chip are electrically connected to the substrate. It should be understood that the LED chip in this embodiment may be a flip LED chip or a front-mounted LED chip, and the pins of the LED chip and the substrate are electrically connected by, but not limited to, a conductive wire, a conductive adhesive or other conductive material.

It should be clear that the LED support in the above embodiments is used for LED packaging, and the LED chip is fixed at the bottom of the reflective cavity, i.e. at the functional area. The specific implementation manner may be that after the welding and fixing of the LED chip are completed, a colloid is filled into the enclosed area to seal the LED chip, where the colloid may be one or a combination of a packaging adhesive, a light emitting conversion adhesive, and a diffusion adhesive, for example, when the LED chip is a blue light emitting LED chip, the phosphor may be a green phosphor and a red phosphor, and a white light with a better effect may be obtained by exciting the green phosphor and the red phosphor by the blue light; the packaging adhesive can be epoxy resin, silica gel, silicon resin and the like with cohesiveness, the packaging adhesive and the fluorescent powder are mixed into a colloid, and the colloid is injected into the enclosing wall body through the glue injection machine to encapsulate the LED chip. Because the enclosure inclined plane in the enclosure region is the coarsening layer, so the combination effect of the enclosure inclined plane and the packaging adhesive is better, the overall combination effect of the adhesive and the enclosure body can be improved, and the reliability of the LED is improved to a great extent.

It should be understood that the colors of the LED lights presented to the user according to the present embodiment can be flexibly set according to the actual needs and application scenarios. What color the LED emits and appears can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED includes a luminescence conversion layer, the type of luminescence conversion layer when the LED includes a luminescence conversion layer.

In an example of this embodiment, the LED may further include a packaging adhesive layer or a diffusion adhesive layer disposed on the LED chip (when the light emitting conversion adhesive layer is disposed on the LED chip, the diffusion adhesive layer is formed by adding diffusion powder or silicon powder into the packaging adhesive).

It should be understood that, in an example, the luminescence conversion glue layer may be a phosphor glue layer containing phosphor, or may be a colloid containing quantum dot photo-induced material, or other luminescence conversion glue or film capable of realizing luminescence conversion, and may also include diffusing powder or silicon powder, etc. as required; in this embodiment, the manner of forming the encapsulation adhesive layer, the light emitting conversion adhesive layer or the diffusion adhesive layer on the LED chip includes, but is not limited to, dispensing, molding, spraying, pasting, and the like.

For example, the luminescence conversion layer may include a phosphor paste layer, a phosphor film, or a quantum dot QD film; the phosphor glue layer and the phosphor film can be made of inorganic phosphor, and can be inorganic phosphor doped with rare earth elements, wherein the inorganic phosphor includes but is not limited to at least one of silicate, aluminate, phosphate, nitride and fluoride phosphor.

For another example, the quantum dot QD film may be fabricated using quantum dot phosphors; quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd (SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI 3.

In this embodiment, the type of light emitted by the LED chip itself may be visible light, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light emitting conversion layer may be disposed on the LED chip to convert the invisible light to visible light, so that the light emitted from the LED is visible to the user. For example, when the light emitted from the LED chip itself is ultraviolet light, if the LED is supposed to display white light visible to the user, the light conversion layer may be made by mixing red, green, and blue phosphors.

The present embodiment also provides a light emitting device including the LED exemplified in the above embodiment. The light emitting device in this embodiment may be a lighting device, an optical signal indicating device, a light supplementing device, or a backlight device. When the lighting device is used, the lighting device can be specifically applied to various fields, such as a table lamp, a fluorescent lamp, a ceiling lamp, a down lamp, a street lamp, a projection lamp and the like in daily life, a high beam lamp, a dipped beam lamp, an atmosphere lamp and the like in an automobile, an operation lamp, a low electromagnetic lighting lamp and a lighting lamp of various medical instruments in medical use, and various colored lamps, landscape lighting lamps, advertisement lamps and the like in the field of decoration; when the light signal indicating device is used, the light signal indicating device can be applied to various fields, such as signal indicating lamps in the traffic field, various signal state indicating lamps on communication equipment in the communication field, various indicating lamps on vehicles and the like; when the device is a light supplement device, the device can be a light supplement lamp in the photographic field, such as a flash lamp and a light supplement lamp, and can also be a plant light supplement lamp for supplementing light to plants in the agricultural field; in the case of the backlight device, the backlight device may be applied to various backlight fields, for example, a display, a television, a mobile terminal such as a mobile phone, and an advertisement machine.

It should be understood that the above applications are only a few of the applications exemplified by the present embodiment, and that the application of LEDs is not limited to the above exemplified fields.

The foregoing is a more detailed description of embodiments of the present invention, and the specific embodiments are not to be considered in a limiting sense. To the utility model belongs to the technical field of ordinary technical personnel, do not deviate from the utility model discloses under the prerequisite of design, can also make a plurality of simple deductions or replacement, all should regard as belonging to the utility model discloses a protection scope.

Claims

1. The utility model provides a high reliability LED support, includes the base plate and will the enclosure body including the base plate encloses, the enclosure that the enclosure body formed encloses the region including enclosing the inclined plane, its characterized in that the base plate with the region department that the enclosure body closely laminated is provided with the recess, the recess is provided with the coarsening layer that forms after the coarsing treatment, the part or all of enclosing the inclined plane are provided with the coarsening layer that forms after the coarsing treatment.

2. The high reliability LED mount according to claim 1, wherein the substrate comprises a first substrate, a second substrate, and an insulating spacer tape that separates the first substrate from the second substrate.

3. The high-reliability LED bracket according to claim 2, wherein a groove is provided at a region where the first substrate is closely attached to the enclosure body, and/or a groove is provided at a region where the second substrate is closely attached to the enclosure body.

4. The high-reliability LED support according to any one of claims 1 to 3, wherein part or all of the region of the inner wall of the groove is a roughened layer formed by roughening treatment.

5. The high reliability LED support of any of claims 1-3, wherein the side surface of the groove forms an angle of less than 90 degrees with the bottom surface.

6. The high reliability LED support of any of claims 1-3, wherein the roughened layer is a curved roughened layer, or a straight roughened layer.

7. An LED, comprising the high-reliability LED support according to any one of claims 1 to 6 and at least one LED chip, wherein the LED chip is disposed on the substrate, and the LED chip is electrically connected to the substrate.

8. The LED of claim 7, wherein the enclosure region is filled with a gel, and the gel is bonded to the enclosure slope.

9. The LED of claim 8, wherein the encapsulant is at least one of an encapsulant, a luminescence conversion paste, and a diffusion paste.

10. A lighting device comprising the LED according to any one of claims 7-9, wherein the lighting device is a lighting device, a light signal indicating device, a light supplementing device, or a backlight device.