CN209298154U - New-type LED support, LED and light emitting device - Google Patents
New-type LED support, LED and light emitting device Download PDFInfo
- Publication number
- CN209298154U CN209298154U CN201821430974.3U CN201821430974U CN209298154U CN 209298154 U CN209298154 U CN 209298154U CN 201821430974 U CN201821430974 U CN 201821430974U CN 209298154 U CN209298154 U CN 209298154U
- Authority
- CN
- China
- Prior art keywords
- electrode substrate
- plane
- enclosure wall
- positive electrode
- negative electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
The utility model provides a kind of new-type LED support, LED and light emitting device, including positive electrode substrate, negative electrode substrate and the insulating isolation belt for being dielectrically separated from the two, and by positive electrode substrate, negative electrode substrate and insulating isolation belt are enclosed in the enclosure wall body of interior insulation, the enclosure wall contact zone that the front of positive electrode substrate and negative electrode substrate has functional areas and contacts with enclosure wall body, positive electrode substrate has the connection transition region for connecting functional areas with enclosure wall contact zone at least one substrate in negative electrode substrate, plane where functional areas is lower than the plane where enclosure wall contact zone, and it is arranged in the side of at least one substrate at least one target side, the surface-pathlength value of the target side is greater than the profile height value of the target side, and the target side is non-planar, moisture can be extended and enter the path in functional areas, to promote LED Bracket and the humidity resistance for utilizing LED made from the LED support.
Description
Technical field
The utility model relates to LED (Light Emitting Diode, light emitting diode) field, more particularly to one kind are new
Formula LED support, LED and light emitting device.
Background technique
Since LED has many advantages, such as that rich in color, small in size, environmental protection and energy saving, service life are long, every field all
Obtain largely use and promote, for example including but be not limited to daily illumination, outdoor lighting, light decoration, advertising logo, vapour
Licence is bright or indicates, traffic instruction etc., since the external environment that LED is used in different field is different, to LED's
Reliability proposes biggish requirement, and wherein the humidity resistance of LED is then an important measurement index of LED reliability, especially
It is the application scenarios for using or storage environment is moister.
Existing LED support is referring to shown in Fig. 1-1 to Fig. 1-2 comprising the plastics enclosure wall 10 for forming reflection cavity is enclosed by plastics
Wall 10 is enclosed in interior positive electrode substrate 11, negative electrode substrate 12 and the isolation for being dielectrically separated from positive electrode substrate 11 and negative electrode substrate 12
Band 13, wherein a part of region in the front of positive electrode substrate 11 and negative electrode substrate 12 is directly contacted with plastics enclosure wall 10 is located at, referred to as
For enclosure wall contact zone；Another part region is then located at reflection cavity bottom as functional areas, which can be used for carrying LED chip
And other possible electronic devices, and wiring, die bond and as light echo area etc..Existing LED support has the following problems:
Positive electrode substrate 11 and the positive enclosure wall contact zone of negative electrode substrate 12 and functional areas are all located in a plane, therefore are worked as
When moisture spreads to substrate front side along the junction of substrate side surfaces and plastics enclosure wall 10, it is just easy to enclosing by substrate front side
Wall contact zone entered function area causes the short circuit in functional areas, device failure even to directly contribute dead lamp；And most of base
The functional areas of plate are coated with metallic silver layer, and metallic silver layer is also easy to corrode under moisture effect, cause functional defect.
The side of positive electrode substrate 11 and negative electrode substrate 12 is all vertical plane, and as shown in Figs. 1-2, therefore moisture is easier edge
The junction of substrate side surfaces and plastics enclosure wall 10 when spreading to substrate front side, be just easy to through positive electrode substrate 11 and cathode base
The side and enclosure wall contact zone entered function area of plate 12, cause the short circuit in functional areas, device failure even to directly contribute
Dead lamp；And the functional areas of most of substrate are coated with metallic silver layer, metallic silver layer is also easy to corrode under moisture effect, causes function
It can property defect.
As it can be seen that existing LED support and poor using the humidity resistance of LED made from the bracket.
Utility model content
New-type LED support, LED and light emitting device provided by the utility model, mainly solving the technical problems that: it solves existing
There is LED support and utilizes the humidity resistance of LED made from the bracket poor.
In order to solve the above technical problems, the utility model provides a kind of new-type LED support, including positive electrode substrate, cathode base
Plate and insulating isolation belt, the insulating isolation belt between the positive electrode substrate and the negative electrode substrate by the two insulate every
From, further include the positive electrode substrate, negative electrode substrate and the insulating isolation belt are enclosed in insulation enclosure wall body；It is described just
In electrode substrate and the negative electrode substrate, there is at least one target side, the target side edge in the side of at least one substrate
The surface-pathlength value of short transverse is greater than the profile height value of the target side, and the target side is non-planar；
There are functional areas and the enclosure wall contacted with the enclosure wall body to connect in the front of the positive electrode substrate and the negative electrode substrate
Touch area；At least one substrate in the positive electrode substrate and the negative electrode substrate, which also has, connects the functional areas and the enclosure wall
The connection transition region for touching area's connection, the plane where the functional areas is lower than the plane where the enclosure wall contact zone.
In an embodiment of the present invention, all there is institute in the side of the positive electrode substrate and the negative electrode substrate
State target side；
And/or
Plane where the functional areas of the positive electrode substrate and the negative electrode substrate is below the enclosure wall contact zone
The plane at place.
In an embodiment of the present invention, all there is institute in the side of the positive electrode substrate and the negative electrode substrate
When stating target side, there is at least one in the side that contacts in the positive electrode substrate and the negative electrode substrate with the enclosure wall body
The target side；
And/or
The side that the positive electrode substrate and the negative electrode substrate are contacted with the insulating isolation belt is the target side.
In an embodiment of the present invention, all there is institute in the side of the positive electrode substrate and the negative electrode substrate
When stating target side, the positive electrode substrate and the positive width of the negative electrode substrate are greater than the width at the back side.
In an embodiment of the present invention, the functional areas of the positive electrode substrate and the negative electrode substrate are located at
The enclosure wall body is formed by the bottom of reflection cavity；The plane where plane and the enclosure wall contact zone where the functional areas
Difference in height be greater than 0, less than or equal to a quarter of the reflection cavity depth.
In an embodiment of the present invention, the target side is curved surface.
In an embodiment of the present invention, the target side is arc-shaped curved surface.
In an embodiment of the present invention, the target side be include plane, inclined-plane, in arcwall face at least
Two combinatorial surfaces being combined.
In an embodiment of the present invention, the target side be include plane, inclined-plane, in arcwall face at least
Two staging pack faces being combined.
In an embodiment of the present invention, the staging pack face is by transverse plane and upright plane and connection institute
State the arcwall face composition between transverse plane and the upright plane.
In an embodiment of the present invention, the connection transition region be inclined-plane, arcwall face, or be combinatorial surface, institute
Stating combinatorial surface and being includes plane, inclined-plane, at least two combination in arcwall face.
To solve the above-mentioned problems, the utility model additionally provides a kind of LED, including new-type LED support as described above
An at least LED chip, the LED chip are set on the positive electrode substrate and/or the negative electrode substrate, the LED core
The positive pin and negative pin of piece are electrically connected with the positive electrode substrate and the negative electrode substrate respectively.
To solve the above-mentioned problems, the utility model additionally provides a kind of light emitting device, including LED as described above, institute
Stating light emitting device is lighting device, optical signal instruction device, light compensating apparatus or back lighting device.
The beneficial effects of the utility model are:
New-type LED support, LED and light emitting device provided by the utility model, including positive electrode substrate, negative electrode substrate and general
The insulating isolation belt that the two is dielectrically separated from further includes that positive electrode substrate, negative electrode substrate and insulating isolation belt are enclosed in interior insulation
Enclosure wall body, the enclosure wall contact zone that the front of positive electrode substrate and negative electrode substrate has functional areas and contacts with enclosure wall body, positive base
Plate also has the connection transition region for connecting functional areas with enclosure wall contact zone, functional areas at least one substrate in negative electrode substrate
The plane at place is lower than the plane where enclosure wall contact zone, therefore can extend between the enclosure wall contact zone of substrate and functional areas
Path, namely extend moisture and enter the path in functional areas, to promote LED support and using made from the LED support
The humidity resistance of LED；
In addition, having in the side of at least one substrate in the also settable positive electrode substrate of the utility model and negative electrode substrate
At least one target side, the surface-pathlength value of the target side are greater than the profile height value of the target side, and the target side
Face be it is non-planar, relative to existing substrate side surfaces be vertical plane setting, can further extend the path of substrate side surfaces, Ye Jiyan
Long moisture enters the path in functional areas, to dual promotion LED support and utilize the anti-of LED made from the LED support
Damp performance promotes the reliability and durability of LED, so that LED can preferably be suitable for the application scenarios of various environment, more conducively
The popularization and use of LED.
Detailed description of the invention
Fig. 1-1 is a kind of top view of LED support；
Fig. 1-2 is the sectional view of LED support shown in Fig. 1-1；
Fig. 2-1 is that the utility model embodiment two provides the sectional view one of LED support；
Fig. 2-2 is that the utility model embodiment two provides the sectional view two of LED support；
Fig. 2-3 is that the utility model embodiment two provides the sectional view three of LED support；
Fig. 2-4 is that the utility model embodiment two provides the sectional view four of LED support；
Fig. 3-1 is that the utility model embodiment three provides the sectional view one of LED support；
Fig. 3-2 is that the utility model embodiment three provides the sectional view two of LED support；
Fig. 3-3 is that the utility model embodiment three provides the sectional view three of LED support；
Fig. 3-4 is that the utility model embodiment three provides the sectional view four of LED support；
Fig. 3-5 is that the utility model embodiment three provides the sectional view five of LED support；
Fig. 3-6 is that the utility model embodiment three provides the sectional view six of LED support；
Fig. 3-7 is that the utility model embodiment three provides the sectional view seven of LED support；
Fig. 3-8 is that the utility model embodiment three provides the sectional view eight of LED support；
Fig. 3-9 is that the utility model embodiment three provides the sectional view nine of LED support；
Fig. 3-10 is that the utility model embodiment three provides the sectional view ten of LED support；
Fig. 4-1 is that the utility model embodiment four provides the top view one of LED support；
Fig. 4-2 is that the utility model embodiment four provides the top view two of LED support；
Fig. 4-3 is that the utility model embodiment four provides the top view three of LED support；
Fig. 4-4 is that the utility model embodiment four provides the top view four of LED support；
Fig. 4-5 is that the utility model embodiment four provides the top view five of LED support；
Fig. 4-6 is that the utility model embodiment four provides the top view six of LED support；
Fig. 5-1 is that the utility model embodiment four provides the top view seven of LED support；
Fig. 5-2 is that the utility model embodiment four provides the top view eight of LED support；
Fig. 5-3 is that the utility model embodiment four provides the top view nine of LED support；
Fig. 5-4 is that the utility model embodiment four provides the top view ten of LED support；
Wherein, appended drawing reference 10 of the Fig. 1-1 into Fig. 1-2 is plastics enclosure wall, and 11 be positive electrode substrate, and 12 be negative electrode substrate,
13 be isolation strip；In Fig. 2-1 to Fig. 2-4,20 be enclosure wall body, and 21 be substrate, and 211 be functional areas, and 212 be enclosure wall contact zone, 214
For target side；In Fig. 3-1 to Fig. 3-10,30 be enclosure wall body, and 31 be substrate, and 311 be functional areas, and 312 be enclosure wall contact zone,
313 be connection transition region, and 314 be target side；In Fig. 4-1 to Fig. 4-6,50 be enclosure wall body, and 51 be positive electrode substrate, and 52 be cathode
Substrate, 53 be to be dielectrically separated from area；In Fig. 5-1 to Fig. 5-4,60 be enclosure wall body, and 61 be substrate, and 61 be positive electrode substrate, and 62 are negative
Electrode substrate, 63 be to be dielectrically separated from area.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below by specific embodiment party
Formula combination attached drawing is described in further detail the utility model embodiment.It should be appreciated that specific embodiment described herein
It is only used to explain the utility model, is not used to limit the utility model.
Embodiment one:
In order to solve the problems, such as that existing LED support moisture resistance is poor, a kind of LED branch of high leakproofness is present embodiments provided
Frame comprising positive electrode substrate, negative electrode substrate and insulating isolation belt, insulating isolation belt is between positive electrode substrate and negative electrode substrate
The two is dielectrically separated from, the LED support in the present embodiment further includes being enclosed in positive electrode substrate, negative electrode substrate and insulating isolation belt
There are functional areas and the enclosure wall contacted with enclosure wall body to contact in the front of the enclosure wall body of interior insulation, positive electrode substrate and negative electrode substrate
Area；In a kind of example, positive electrode substrate and the positive functional areas of negative electrode substrate are located at enclosure wall body and are formed by reflection cavity bottom.
Positive electrode substrate and negative electrode substrate in the present embodiment are all electrically-conductive backing plates, and the electrically-conductive backing plate in the present embodiment can be
The substrate that various conductive materials are constituted, may be, for example, various metallic conduction substrates, including but not limited to copper base, aluminum substrate, iron
Substrate, silver-based plate；Electrically-conductive backing plate may be the mixing material electrically-conductive backing plate comprising conductive material, such as conductive rubber etc..
Optionally, also settable anti-in at least one positive functional areas in positive electrode substrate and negative electrode substrate in the present embodiment
Layer is penetrated with the light extraction efficiency of lifting bracket, which can be the reflection layer of various energy improving extraction efficiencies, for example including
But it is not limited to silver coating.
Optionally, the bottom of enclosure wall body is exposed at the back side of at least one of positive electrode substrate and negative electrode substrate in the present embodiment
Portion, as electrode welding zone.Certainly, in some instances, the back side of at least one of positive electrode substrate and negative electrode substrate can also
Not as welding section, and using its side as welding section, specific setting can flexibly be determined according to concrete application demand.
Optionally, in the present embodiment enclosure wall body can use various isolation materials enclosure wall body, for example including but be not limited to
Various plastics, insulating ceramics etc..For example, in a kind of example, the material that enclosure wall body can use includes but unlimited epoxy resin
(EP, Epoxide resin), high temperature resistant nylon (PPA plastics), gather polyphthalamide (PPA, Polyphthalamide)
Terephthalic acid (TPA) 1,4-CHDM ester (PCT, Poly1,4-cyclohexylene dimethylene
Terephthalate), liquid crystal polymer (LCP, Liquid Crystal Polymer), sheet molding compound (SMC, Sheet
Molding compound), epoxy molding plastic (EMC, Epoxy molding compound), unsaturated polyester (UP) (UP) resin,
Polyester resin (PET, Polyethylene terephthalate), polycarbonate (PC, Polycarbonate), poly hexamethylene adipamide
Hexamethylene diamine (nylon 66), glass fibre.
Optionally, the material of insulating isolation belt can be identical as enclosure wall body in the present embodiment, can also be different, and its can with enclose
Wall is formed together, and also may be separately formed.
In addition, it is to be understood that in the present embodiment enclosure wall body generation type can also flexible choice, such as can pass through but
Injection molding is not limited to be formed.
In the present embodiment, the functional areas of at least one substrate in the positive electrode substrate and negative electrode substrate of LED support and enclosure wall
Not in one plane, such as the positive functional areas of positive electrode substrate and enclosure wall contact zone are not in one plane for contact zone, and/
Or, the positive functional areas of negative electrode substrate and enclosure wall contact zone are not in one plane；Specific setting positive electrode substrate and negative electrode substrate
In one or two functional areas and enclosure wall contact zone in one plane can not flexibly be set according to specific requirements.Example
Such as, in a kind of example, for the leakproofness of General Promotion LED support, the functional areas of settable positive electrode substrate and negative electrode substrate
Not in one plane with enclosure wall contact zone.This set can extend the road between the enclosure wall contact area functional areas of substrate
Diameter that is to say that extending moisture enters the path in functional areas, so as to promote LED support and utilize the LED support system
The sealing performance of the LED obtained, promotes the reliability and durability of LED, so that LED can better meet various environment uses and want
It asks, the more conducively popularization and use of LED.
In addition, having in the side of at least one substrate in the also settable positive electrode substrate of the utility model and negative electrode substrate
At least one target side, the surface-pathlength value of the target side are greater than the profile height value of the target side, and the target side
Face be it is non-planar, relative to existing substrate side surfaces be vertical plane setting, can further extend the path of substrate side surfaces, Ye Jiyan
Long moisture enters the path in functional areas, to dual promotion LED support and utilize the anti-of LED made from the LED support
Damp performance promotes the reliability and durability of LED, so that LED can preferably be suitable for the application scenarios of various environment, more conducively
The popularization and use of LED.
In a kind of example of the present embodiment, the enclosure wall contact zone of substrate front side can be directly connected to functional areas, and enclosure wall
Contact zone can be inclined-plane, cambered surface or other kinds of face.
In another example of the present embodiment, in order to further extend between the enclosure wall contact zone of substrate and functional areas
Path, can also be arranged connection transition region between the enclosure wall contact zone of substrate and functional areas, and such moisture then needs to pass through enclosure wall
After contact zone and connection transition region, could entered function area, can further lifting bracket humidity resistance.In the present embodiment,
Connecting transition region can also be inclined-plane, arcwall face, or be combinatorial surface, which may also comprise but be not limited to plane, inclined-plane, arc
At least two combination in face.
The present embodiment by setting LED support positive electrode substrate and negative electrode substrate at least one substrate functional areas and
Not in one plane, and optionally, the plane where settable functional areas is higher than where enclosure wall contact zone for enclosure wall contact zone
Plane where plane, or setting functional areas is lower than the plane where enclosure wall contact zone, therefore the enclosure wall that can extend substrate connects
The path between area and functional areas is touched, namely extends moisture and enters the path in functional areas, to promote LED support and benefit
The humidity resistance of the LED made from the LED support.
In order to preferably promote the air-tightness of LED support, to promote its humidity resistance, in some instances, when setting base
When plate side is above-mentioned target side, can be set all has above-mentioned target side in the side of positive electrode substrate and negative electrode substrate,
Such as:
Example one: there is at least one described mesh in the side contacted in setting positive electrode substrate and negative electrode substrate with enclosure wall body
Mark side；
For example, when positive electrode substrate and negative electrode substrate need to contact with enclosure wall body there are three side, and two in width direction
A side is opposite side, and it is above-mentioned target side that these three sides, which can be set, all, or is only arranged in these three sides
Two opposite sides are above-mentioned target side, or it is above-mentioned target side that one of side, which is only arranged,；It specifically can basis
Which side is demand select be set as above-mentioned target side.
Example two:
It is above-mentioned target side that the side that positive electrode substrate and negative electrode substrate are contacted with insulating isolation belt, which is arranged,.
Example three:
Being arranged in the side contacted in positive electrode substrate and negative electrode substrate with enclosure wall body has at least one described target side,
And it is above-mentioned target side that the side that positive electrode substrate and negative electrode substrate are contacted with insulating isolation belt, which is arranged,.
In the present embodiment, target side can be the side along the surface-pathlength value of short transverse greater than the target side
Height value, and the target side is nonplanar arbitrary face；Such as can be curved surface, and be curved surface when, the curved surface setting can be
The arc-shaped curved surface of rule, can also be irregular surface.In another example in some instances, which can also be combinatorial surface, it should
Combinatorial surface includes but is not limited to plane, inclined-plane, at least two combinatorial surfaces being combined in arcwall face.It and is combinatorial surface
When, can also be includes plane, inclined-plane, at least two staging pack faces being combined in arcwall face, further to extend side
Face path promotes humidity resistance.For example, staging pack face is horizontal flat by transverse plane and upright plane and connection in a kind of example
Arcwall face composition between face and upright plane；Or be made of multiple inclined-planes, or be made of transverse plane or upright plane with inclined-plane, or by
Upright plane, inclined-plane and cambered surface composition, or be made of transverse plane, inclined-plane and cambered surface；Specifically combine building form that can flexibly set.
In a kind of example of the present embodiment, positive electrode substrate can be set and the positive width of negative electrode substrate is greater than the back side
Width preferably to prevent extraneous moisture by substrate side surfaces entered function area, and is also more conducive to the system of substrate and LED support
Make, processing.
In the present embodiment, the generation type of target side can be through but not limited to modes such as punching press, etching, cuttings.
The present embodiment is by being arranged in positive electrode substrate and negative electrode substrate, the surface of at least one side of at least one substrate
Path values are greater than the profile height value of the side, and the side is non-planar, is setting for vertical plane relative to existing substrate side surfaces
Set, can extend the path of substrate side surfaces, namely extend moisture and enter the path in functional areas, thus promoted LED support with
And the humidity resistance using LED made from the LED support, the reliability and durability of LED are promoted, so that LED can be fitted preferably
For the application scenarios of various environment, the more conducively popularization and use of LED.
The present embodiment by setting LED support positive electrode substrate and negative electrode substrate at least one substrate functional areas and
Not in one plane, and optionally, the plane where settable functional areas is higher than where enclosure wall contact zone for enclosure wall contact zone
Plane where plane, or setting functional areas is lower than the plane where enclosure wall contact zone；Positive electrode substrate and cathode base are set simultaneously
In plate, there is at least one target side in the side of at least one substrate, the surface-pathlength value of the target side is greater than the mesh
The profile height value of side is marked, and the target side is non-planar, is the setting of vertical plane relative to existing substrate side surfaces, it can be into
One step extend substrate side surfaces path, namely extend moisture enter the path in functional areas, thus dual promotion LED support with
And the humidity resistance using LED made from the LED bracket, the reliability and durability of LED are promoted, so that LED can be fitted preferably
For the application scenarios of various environment, the more conducively popularization and use of LED.
Embodiment two:
In order to make it easy to understand, the present embodiment is directly connected to the enclosure wall contact zone on substrate with functional areas, and function position
On enclosure wall contact zone, it is illustrated in conjunction with several exemplary target side structures for example.
It refers to shown in Fig. 2-1, the enclosure wall contact zone which show on a kind of substrate shows with what functional areas were directly connected to
It is intended to, wherein 20 be enclosure wall body, 21 be substrate (may be positive electrode substrate and/or negative electrode substrate), and 211 be functional areas, and 212 are
Enclosure wall contact zone, 214 be target side.In Figure 2-1, enclosure wall contact zone 212 is inclined-plane, and functional areas 211 are to connect positioned at enclosure wall
Touch area 212 plane, certainly according to demand functional areas 211 may be alternatively provided as it is non-planar.Enclosure wall contact zone 212 and functional areas 211
Between path be set to conplane path relative to existing enclosure wall contact zone and functional areas and be obviously prolonged, therefore can be with
Lengthen the path in moisture entered function area, and then the humidity resistance of lifting bracket, promoted using LED lamp bead made from the bracket or
The reliability of other products.In addition, two opposite sides of substrate have been both configured to target side 214, and target in Fig. 1
Side 214 is curved surface, and substrate front side width is consistent substantially with back side width, and target side 214 is in height side in Fig. 2-1
Upward surface-pathlength value be then 212 in figure indicated by lines length value, relative to substrate side surfaces be vertical plane setting side
Formula, path are obviously prolonged, therefore can further lengthen the path in moisture entered function area, and then dual lifting bracket
Humidity resistance is promoted and utilizes LED lamp bead or the reliability of other products made from the bracket.Certainly, in some instances, target
Side may be alternatively provided as inclined-plane, and opposing substrate side is vertical plane set-up mode, can also extend moisture entrance to a certain extent
The path of functional areas, but the set-up mode path of its relative surface or combinatorial surface is shorter, and it is set as curved surface or combinatorial surface also more
Conducive to substrate side surfaces in conjunction with enclosure wall body 20 or insulating isolation belt, increase the two bonded area, while promoting air-tightness, also
Can lifting bracket integral strength.
In some instances, enclosure wall contact zone 212 can not also be inclined-plane, and be other kinds of face.For example, with reference to Fig. 2-
Shown in 2, enclosure wall contact zone 212 is then cambered surface in the figure, and the convex globoidal that the cambered surface is protruded to the outside of substrate 21, Fig. 2-2 institute
The setting of the convex globoidal shown can further extend the path in moisture entered function area, therefore relative to inclined-plane shown in Fig. 2-1
Dampproof effect can further be promoted.And in some instances, substrate front side width can not also be consistent with back side width, such as
Referring to fig. 2 shown in -2, target side 214 therein still uses the set-up mode of curved surface, but the curved surface of two sides is integral into " eight "
Font extends outwardly, so that substrate front side width is less than back side width；This setup can further extend moisture and enter function
The path in energy area；Certainly, target side 214 shown in Fig. 2-4 can also reversely extend internally；And target side in the present embodiment
When using curved surface, curved surface theoretically can be set to any Irregular Boundary Surface, may be alternatively provided as ruled surface.
In some instances, when enclosure wall contact zone 212 is cambered surface, other than it can be convex globoidal shown in Fig. 2-2, can also be
Other kinds of cambered surface.For example, see shown in Fig. 2-3, being the intrados recessed to 21 inside of substrate, relative to shown in Fig. 2-1
Inclined-plane, can also further extend the path in moisture entered function area, therefore can further promote dampproof effect.Meanwhile joining
As shown in Fig. 2-3, target side 214 can be composed of multiple continuous small curved surfaces, and this setup makes target side
And enclosure wall body 20 or insulating isolation belt can be more firm combination, lifting bracket intensity and air-tightness.Referring to fig. 2 shown in -4, target
Side 214 opposed, inwardly directed can extend so that substrate front side width be greater than back side width, more conducively substrate and LED support plus
Work.
However, it is to be understood that enclosure wall contact zone 212 is other than it can be inclined-plane or cambered surface in the present embodiment, according to need
It asks the other kinds of face that may be alternatively provided as, and its concretely regular face, can also be irregular face.For example, with reference to Fig. 2-4 institute
Show, enclosure wall contact zone 212 can also further extend moisture entered function relative to inclined-plane shown in Fig. 2-1 for curved face
The path in area, therefore can further promote dampproof effect.
In addition, it is to be understood that in Fig. 2-1 to Fig. 2-4 the enclosure wall contact zone 212 of opposite sides may be configured as it is identical
Face may be alternatively provided as different faces, specifically can flexibly be set according to application scenarios, and functional areas 211 can also be in the present embodiment
It is set to lower than enclosure wall contact zone；The present embodiment only illustrates several schematic diagrames for setting target side on curved surface, and should
Understand, when there are at least two sides on substrate for above-mentioned target side, each target side can be set to identical
Face may be set to be different faces；And when all there is target side on positive electrode substrate and negative electrode substrate, positive electrode substrate and negative
Target side on electrode substrate may be alternatively provided as identical face, or be set as different faces.Such as the system in view of processing
One property can be both configured to identical target side.
In some instances, the formation process of above-mentioned enclosure wall contact zone 212 and target side 214 can be with flexible choice, example
It such as include but is not limited to etching, cutting, punching press, generation type is simple and at low cost, and it is high-efficient, it can be fabricated to guaranteeing bracket
While this is with efficiency, the humidity resistance of LED support is promoted.
Embodiment three:
In order to make it easy to understand, the present embodiment has connection transition region with the enclosure wall contact zone on substrate and between functional areas,
And functional areas are located under enclosure wall contact zone and are illustrated for example.
In a kind of example of the present embodiment, the plane where the functional areas of settable positive electrode substrate and negative electrode substrate is all low
Plane where enclosure wall contact zone.
In a kind of example of the present embodiment, the functional areas of positive electrode substrate and negative electrode substrate are located at enclosure wall body and are formed by instead
Penetrate the bottom of chamber；The value of plane and the difference in height of the plane where enclosure wall contact zone where functional areas can flexibly be set, example
Such as difference in height may be configured as being greater than 0, less than or equal to a quarter of reflection cavity depth；Certainly it may also set up according to specific requirements
It for other values, such as is set as difference in height and may be configured as being greater than 0, less than or equal to 1/5th of reflection cavity depth, 1/6th
Or one third etc..
In the present embodiment, connection transition region can be inclined-plane, arcwall face, or be combinatorial surface, the combinatorial surface be include plane,
At least two combination in inclined-plane, arcwall face.
And optionally, connection transition region at least partly region can also be contacted with enclosure wall body, to promote substrate and enclosure wall simultaneously
The contact area of body, and then the intensity of lifting bracket.
Enclosure wall contact zone in the present embodiment can be identical with the technique used when connection transition region type and/or formation,
It can also be different.And it should be understood that enclosure wall contact zone can also be the face of several types shown in embodiment two in the present embodiment.
For example, in a kind of example, referring to shown in Fig. 3-1, wherein 30 be enclosure wall body, 31 be substrate (may be positive electrode substrate
And/or negative electrode substrate), 311 be functional areas, and 312 be enclosure wall contact zone, and 313 be connection transition region, and 314 be target side.Scheming
In 3-1, the region of enclosure wall contact zone 312 is the plane domain that substrate front side is directly contacted with enclosure wall body 30, connects transition region 313
For the chamfered region for connecting enclosure wall contact zone 312 and functional areas 11.Setting by connecting transition region 313 can further increase
Path between enclosure wall contact zone 312 and functional areas 311, the humidity resistance of lifting bracket.And in Fig. 3-1, target side is set
It is set to arc-shaped curved surface, a kind of instance object side 214 is arc-shaped curved surface shown in Fig. 3-1, the arc-shaped curved surface hyper-base plate concave shaped
At concave arc shape curved surface, the specific radian of the arc-shaped curved surface can flexibly set according to demand.Arc shown in Fig. 3-1 is bent
The setting in face can further extend the path in moisture entered function area and promote substrate side surfaces and enclosure wall body or be dielectrically separated from
The combination stability of band, and substrate front side width is made to be greater than back side width, the more conducively processing of substrate and LED support.
In another example, referring to shown in Fig. 3-2, the region of enclosure wall contact zone 312 is substrate front side and enclosure wall body in a kind of example
30 plane domains directly contacted, connection transition region 313 are to connect the arcwall face region of enclosure wall contact zone 312 and functional areas 11,
In the example shown in Fig. 3-2, arcwall face region is the cancave cambered surface region recessed to 31 back side of substrate, and cancave cambered surface region transfers connect
Path between enclosure wall contact zone 312 and functional areas 311 can be further increased by connecing area opposed facets transition region, therefore can be into
The humidity resistance and intensity of one step lifting bracket.It is connection enclosure wall contact zone 312 and function that transition region 313 is connected in the present embodiment
, can also be for the convex globoidal region of substrate 31 upper front protrusion, referring to shown in Fig. 3-4 when the arcwall face region in area 11, phase
Path between enclosure wall contact zone 312 and functional areas 311 can also be further increased to chamfered transition bonding pad, can also further be mentioned
The humidity resistance and intensity of ascending branch frame.In addition, when the target side in the present embodiment is arc-shaped curved surface, in addition to that can be concave arc shape song
It can also be convex curved surface outside face.A kind of example is referring to shown in Fig. 3-2, and target side 314 shown in the figure is then for outside substrate
The convex curved surface of protrusion, can further extend the path in moisture entered function area and promote substrate side surfaces and enclosure wall body
Or the bonded area of insulating isolation belt, increase support intensity；Substrate front side width is made to be less than back side width simultaneously, more conducively
The heat dissipation of LED support.
It can also be combinatorial surface that transition region is connected in the present embodiment, which may include but be not limited to plane, inclined-plane, arc
At least two combination in face.In the present embodiment, target side may be combinatorial surface, and according to above-mentioned analysis it is found that
The combinatorial surface includes but is not limited to plane, inclined-plane, at least two combinatorial surfaces being combined in arcwall face.It and is combination
When face, can also be includes plane, inclined-plane, at least two staging pack faces being combined in arcwall face, further to extend
Lateral approach promotes humidity resistance.For example, staging pack face is horizontal by transverse plane and upright plane and connection in a kind of example
Arcwall face composition between plane and upright plane；Or be made of multiple inclined-planes, or be made of transverse plane or upright plane with inclined-plane, or
It is made of upright plane, inclined-plane and cambered surface, or is made of transverse plane, inclined-plane and cambered surface；Specifically combine building form that can flexibly set
It is fixed.It is below that example is illustrated using several specific target sides as the structure of combinatorial surface.
In another example, referring to shown in Fig. 3-3, the region of enclosure wall contact zone 312 is substrate front side and enclosure wall body in a kind of example
30 plane domains directly contacted, connection transition region 313 are that substrate front side connects the flat of enclosure wall contact zone 312 and functional areas 311
Face region and chamfered region combine the combinatorial surface of composition, which can also further increase enclosure wall contact zone 312 and function
Path between area 311 is to promote humidity resistance.
For example, in Fig. 3-3, target side 314 is by two inclined-planes and to connect the plane on the two inclined-planes and combine
The combinatorial surface arrived, and in Fig. 3-1, the angle of junction is all greater than 90 ° between each face, and this setup is relative to angle
It less than or equal to 90 °, can prevent from forming bubble in the junction of angle during injection molding etc., road can be entered extending moisture
While diameter, the generation of bubble is further prevented, thus the further humidity resistance of lifting bracket.In another example in figures 3-4,
Target side 314 is by two upright planes and the transverse plane between two upright planes, and respectively by two upright planes
The arcwall face composition connecting with the transverse plane, connect intersection with transverse plane in upright plane in this way as arc-shaped curved surface, can also be to prevent
Bubble only is formed in junction during injection molding etc., the production of bubble can be further prevented while extending moisture access path
It is raw, the humidity resistance of lifting bracket.
For example, with reference to shown in Fig. 3-5, the region of enclosure wall contact zone 312 is what substrate front side was directly contacted with enclosure wall body 30
Plane domain, connection transition region 313 are the plane and arcwall face knot that substrate front side connects enclosure wall contact zone 312 and functional areas 311
The combinatorial surface of conjunction, and the arcwall face is to the convex globoidal region of substrate 31 upper front protrusion.In another example referring to shown in Fig. 3-6,
The difference of itself and bracket shown in Fig. 3-5 is that connection transition region 313 is to be made up of plane and cancave cambered surface region, the combination
Face can also further increase the path between enclosure wall contact zone 312 and functional areas 311 to promote humidity resistance.Fig. 3-5 institute
In example, target side 314 is oblique by two by two inclined-planes and the transverse plane between two inclined-planes, and respectively
The arcwall face composition that face is connect with the transverse plane, connecting intersection with transverse plane on inclined-plane in this way is arc-shaped curved surface, can also be into one
Step prevents injection molding etc. from forming bubble in junction in the process.In the example shown in figure -6, target side 314 is by inclined-plane, erects
Plane and and the transverse plane between inclined-plane and upright plane, and respectively by two inclined-planes and upright plane and the transverse plane
The arcwall face of connection forms, and connecting intersection with transverse plane and upright plane with transverse plane on inclined-plane in this way is arc-shaped curved surface,
Injection molding etc. can be further prevented to form bubble in junction in the process.
In addition, it is to be understood that the connection transition region 313 of substrate front side opposite sides may be alternatively provided as in the present embodiment
The face of same type, or it is set as different types of face.For example, see the connection transition region 313 shown in Fig. 3-8, in substrate side
It is set as combinatorial surface of the plane in conjunction with inclined-plane, the connection transition region 313 of the opposite other side is then plane in conjunction with cancave cambered surface
Combinatorial surface, specific set-up mode can flexibly determine according to concrete application scene and the technique of use.In the figure, target side
Face 312 is the combinatorial surface being made of inclined-plane, and the angle between two inclined-planes is greater than 90 °.
In addition, the present embodiment is in the enclosure wall contact zone on substrate and between functional areas, further setting connection transition region can be extremely
Small part is directly contacted with enclosure wall contact zone 312 is added, to promote the contact area of substrate Yu enclosure wall body simultaneously.For example, see Fig. 3-
Shown in 7, is directly contacted with enclosure wall contact zone 312 completely by the combinatorial surface 313 that inclined-plane and plane combine, can further promote base
The contact area of plate and enclosure wall body, and then the intensity of lifting bracket；Simultaneously can further lifting bracket air-tightness, with further
Promote humidity resistance；In figure 3-7, target side 312 is to be made of upright plane, transverse plane and arcwall face with multistage platform
The step combinatorial surface of rank, this step combinatorial surface can further extend moisture access path, promoted and enclosure wall body or are dielectrically separated from
The bonded area of band promotes the air-tightness and integral strength of LED support.
Referring to shown in Fig. 3-9, target side 314 is to be combined by the arcwall face between two inclined-planes in two inclined-planes and connection
Obtained combinatorial surface.According to above-mentioned each example it is found that specific combination can when target side is combinatorial surface in the present embodiment
With flexible and changeable, substrate front side width can also can be made integrally to be greater than base according to specific requirements flexible choice, and in setting
Back width；Certainly can also being flexibly set as substrate front side width according to demand, to be integrally less than or equal to substrate back wide
Degree.
As above shown in analysis, in this embodiment, when there are at least two sides on substrate for above-mentioned target side, each mesh
Mark side can be set to identical face, may be set to be different faces；It is opposite in substrate for example, see shown in Fig. 3-10
Two target sides 314 be set to different combinatorial surfaces.Certainly, can also one be set as combinatorial surface, one is set as bent
Face or one are both set as different curved surfaces.
In the enclosure wall contact zone on substrate and between functional areas, further setting connects transition region to the present embodiment, can be further
Increase the path between enclosure wall contact zone 312 and functional areas 311 to promote humidity resistance；And optionally, also settable to connect
At least partly contacting with enclosure wall body for area is crossed, to promote the contact area of substrate Yu enclosure wall body simultaneously, and then lifting bracket is strong
Degree；In addition at least one side of also settable substrate is target side, enters the road in LED support further to extend moisture
Diameter and the intensity for promoting LED support.
Example IV:
Referring to the insulating isolation belt shown in Fig. 1-1 to Fig. 1-2, in existing LED support, between positive electrode substrate and negative electrode substrate
It is perpendicular to the long side of positive electrode substrate and negative electrode substrate, and parallel with positive electrode substrate with negative electrode substrate；And insulating isolation belt is
Compare fragile isolation material, along with the narrower width of insulating isolation belt, cause to be easy to happen fracture at insulating isolation belt, drops
The low integral strength and reliability of LED support.
For this problem, additionally provided in the present embodiment it is a kind of there is new structural LED support, the LED bracket it is exhausted
Two opposite long sides of edge isolation strip cross-sectional profiles are arc-shaped side, or for curved curved side at least one, or are tool
There is the fold-line edge bent at least one, or the angle between the short side of negative electrode substrate is more than or equal to 10 °, it is oblique less than 90 °
Suffered mechanical force can be transmitted a part to positive electrode substrate, negative electrode substrate and enclosure wall body in this way when isolation strip stress by side
On, therefore the intensity of insulating isolation belt can be increased.
Optionally, two opposite long sides of the cross-sectional profiles of insulating isolation belt can be parallel in the present embodiment, can also be with
It is set as not parallel, specifically can flexibly set according to demand；In order to make it easy to understand, the present embodiment is separately below to be arranged in parallel
It is illustrated with two kinds of examples of non-parallel setting.
Example is arranged in parallel:
Referring to fig. 4 shown in -1, wherein 50 be enclosure wall body, 51 be positive electrode substrate, and 52 be negative electrode substrate, and 53 be to be dielectrically separated from
Area.In Fig. 4-1, dotted line is the short side of negative electrode substrate 52.In Fig. 4-1,53 cross-sectional profiles of insulating isolation belt it is opposite two
Long side is that the included angle A between the short side of negative electrode substrate is more than or equal to 10 °, and the value of the bevel edge less than 90 °, the angle can root
It is flexibly set according at least one of material used by the strength demand of concrete application scene, insulating isolation belt, formation process etc.
It sets.Such as in a kind of example, the value of included angle A can be 75 ° to 85 °, such as specific value is 75 °, 78 °, 80 °, 83 °, 85 °
Deng a part of mechanical force being subject to being transferred to positive electrode substrate 51, cathode in this way when insulating isolation belt 53 is by mechanical force
On substrate 52 and enclosure wall body 50, to promote the intensity of insulating isolation belt 53, and then the integral strength of LED support and reliable is promoted
Property.
Two opposite long sides of 53 cross-sectional profiles of insulating isolation belt can also be arc other than it can be bevel edge in the present embodiment
Shape side.For example, a kind of be arranged referring to fig. 4 shown in -2, two opposite long sides of 53 cross-sectional profiles of insulating isolation belt are mutually flat
Two capable arc-shaped sides, when the setting of arc-shaped side also may make insulating isolation belt 53 by mechanical force, a part of machine for will being subject to
Tool power is transferred on positive electrode substrate 51, negative electrode substrate 52 and enclosure wall body 50, promotes the intensity of insulating isolation belt 53.
Two opposite long sides of 53 cross-sectional profiles of insulating isolation belt be other than it can be bevel edge and arc-shaped side in the present embodiment,
It can also be curved side.For example, a kind of be arranged referring to fig. 4 shown in -3, two opposite long sides of 53 cross-sectional profiles of insulating isolation belt
For two curved sides being parallel to each other, when the setting of curved side also may make insulating isolation belt 53 by mechanical force, will be subject to one
Some mechanical power is transferred on positive electrode substrate 51, negative electrode substrate 52 and enclosure wall body 50, promotes the intensity of insulating isolation belt 53.This
Curved side in embodiment can be with flexible setting in addition to the quantity in knee, such as other than the curved side shown in Fig. 4-3, may be used also
It certainly can also be the curved side of other forms for curved side shown in Fig. 4-5.
Two opposite long sides of 53 cross-sectional profiles of insulating isolation belt are other than it can be bevel edge, outside arc-shaped side in the present embodiment
It, can also be for the fold-line edge bent at least one outside curved side.For example, a kind of setting is dielectrically separated from referring to fig. 4 shown in -4
It is two fold-line edges being parallel to each other with two opposite long sides of 53 cross-sectional profiles, the setting of fold-line edge, which also may make, to be dielectrically separated from
When band 53 is by mechanical force, a part of mechanical force being subject to is transferred on positive electrode substrate 51, negative electrode substrate 52 and enclosure wall body 50,
Promote the intensity of insulating isolation belt 53.Fold-line edge in the present embodiment in addition to bending place quantity can with flexible setting, such as except
It can be also fold-line edge shown in Fig. 4-6 outside fold-line edge shown in Fig. 4-4, certainly can also be the fold-line edge of other forms.
Non-parallel setting example:
Referring to shown in Fig. 5-1, wherein 60 be enclosure wall body, 61 be positive electrode substrate, and 62 be negative electrode substrate, and 63 be to be dielectrically separated from
Area.In Fig. 5-1, two opposite long sides of 63 cross-sectional profiles of insulating isolation belt are the angle between the short side of negative electrode substrate
A is more than or equal to 10 °, the bevel edge less than 90 °, between this two bevel edges and not parallel, in this way when insulating isolation belt 63 is by machinery
When power, a part of mechanical force being subject to can be transferred on positive electrode substrate 61, negative electrode substrate 62 and enclosure wall body 60, to be promoted exhausted
The intensity of edge isolation strip 63, and then promote the integral strength and reliability of LED support.
Two opposite long sides of 63 cross-sectional profiles of insulating isolation belt can also be arc other than it can be bevel edge in the present embodiment
Shape side.For example, a kind of setting is referring to shown in Fig. 5-2, two opposite long sides of 63 cross-sectional profiles of insulating isolation belt are two non-
Parallel arc-shaped side, when the setting of nonparallel arc-shaped side also may make insulating isolation belt 63 by mechanical force, will be subject to one
Some mechanical power is transferred on positive electrode substrate 61, negative electrode substrate 62 and enclosure wall body 60, promotes the intensity of insulating isolation belt 63.
Two opposite long sides of 63 cross-sectional profiles of insulating isolation belt be other than it can be bevel edge and arc-shaped side in the present embodiment,
It can also be curved side.For example, a kind of setting is referring to shown in Fig. 5-3, two opposite long sides of 63 cross-sectional profiles of insulating isolation belt
It will when the setting of two non-parallel curved sides also may make insulating isolation belt 63 by mechanical force for two non-parallel curved sides
A part of mechanical force being subject to is transferred on positive electrode substrate 61, negative electrode substrate 62 and enclosure wall body 60, promotes insulating isolation belt 63
Intensity.
Two opposite long sides of 63 cross-sectional profiles of insulating isolation belt are other than it can be bevel edge, outside arc-shaped side in the present embodiment
It, can also be for the fold-line edge bent at least one outside curved side.For example, a kind of be arranged referring to shown in Fig. 5-4, it is dielectrically separated from
It is two non-parallel fold-line edges with two opposite long sides of 63 cross-sectional profiles, the setting of two non-parallel fold-line edges also may make
When insulating isolation belt 63 is by mechanical force, a part of mechanical force being subject to is transferred to positive electrode substrate 61, negative electrode substrate 62 and is enclosed
On wall 60, the intensity of insulating isolation belt 63 is promoted.
In another example of the present embodiment, in order to further enhance the intensity of insulating isolation belt, also settable insulation every
Front from band is higher than the front of positive electrode substrate and negative electrode substrate；And the raised area can also be across in positive electrode substrate and negative electrode substrate
On, further to promote the intensity of insulating isolation belt.
Arc-shaped side or curved side are set by two opposite long sides of insulating isolation belt cross-sectional profiles in the present embodiment,
Or fold-line edge, or angle between the short side of negative electrode substrate is more than or equal to 10 °, the bevel edge less than 90 °, when isolation strip stress
When, suffered mechanical force transmitting a part can be given on positive electrode substrate, negative electrode substrate and enclosure wall body, therefore insulation can be increased
The intensity of isolation strip promotes LED support and integral strength and reliability using LED made from the bracket.
Embodiment five:
A kind of LED is present embodiments provided, including as above LED support shown in each embodiment, also there is an at least LED
Chip, the LED chip are set on positive electrode substrate and/or negative electrode substrate, the positive pin and negative pin of LED chip respectively with
Positive electrode substrate and negative electrode substrate electrical connection.
It should be understood that the color that the illumination of LED provided in this embodiment shoots out, is presented to the user, it can basis
Actual demand and application scenarios carry out flexible setting.The illumination of LED shoots out, which kind of color show is, can by but
Following factor is not limited to flexibly to control: the color of light that LED chip itself issues, LED whether include luminescent conversion layer, when
The type of luminescent conversion layer when LED includes luminescent conversion layer.
In a kind of example of the present embodiment, LED, which may also include, to be set to LED chip and (is provided with hair on LED chip
Light convert glue-line when, then be set on luminescent conversion glue-line) on lens glue-line or diffusion glue-line.
It should be understood that luminescent conversion glue-line can be the fluorescent adhesive layer comprising fluorescent powder in a kind of example, it can also
To be the colloid comprising the photic material of quantum dot or other can realize the luminescent conversion glue or film of luminescent conversion, and according to need
It also may include spread powder or silicon powder etc.；Luminescent conversion glue-line, lens glue-line or expansion are formed in the present embodiment in LED chip
The mode for dissipating glue-line includes but is not limited to dispensing, molding, spraying, stickup etc..
For example, luminescent conversion layer may include fluorescent powder glue-line, fluorescent film or quantum dot QD film；Fluorescent powder glue-line, fluorescent film
Can be used inorganic fluorescent powder production, can be the inorganic fluorescent powder for being doped with rare earth element, wherein inorganic fluorescent powder include but
It is not limited at least one of silicate, aluminate, phosphate, nitride, fluorination matter fluorescent powder.
In another example the production of quantum dot fluorescence powder can be used in quantum dot QD film；Quantum dot fluorescence powder include but is not limited to BaS,
AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、 ZnS、ZnSe、ZnTe、GaAs、GaN、
GaS、GaSe、InGaAs、MgSe、MgS、MgTe、 PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、
At least one of CsPbCl3, CsPbBr3, CsPbI3.
In the present embodiment, the type for the light that LED chip itself issues can be macroscopic visible light, be also possible to
Visually sightless ultraviolet light, infrared light；When the type for the light that LED chip itself issues is the sightless ultraviolet light of naked eyes, red
When outer smooth, luminescent conversion layer can be set on LED chip, naked eyes black light is converted into naked eyes visible light, so that LED
Irradiating the light come is the visible light of user.For example, when the light that LED chip itself issues is ultraviolet light, if thinking LED in current
The visible white light in family, then luminescent conversion layer can be red, green, blue fluorescent powder is mixed after be fabricated to.
The present embodiment also provides a kind of light emitting device, which includes LED exemplified by above-described embodiment.This implementation
Light emitting device in example can be lighting device, optical signal instruction device, light compensating apparatus or back lighting device etc..When for lighting device,
It is specifically as follows the lighting device applied to various fields, such as the desk lamp in daily life, fluorescent lamp, ceiling lamp, downlight, road
Lamp, projecting lamp etc., in another example high beam, dipped headlight, atmosphere lamp etc. in automobile, in another example operating lamp, low electricity in medical
The headlamp of magnetic headlamp, various medical apparatus, in another example answer furnishing fields illuminate in various color lamps, landscape spotlight, wide
Accuse lamp etc.；When for optical signal instruction device, it is specifically as follows the optical signal instruction device applied to various fields, such as traffic
The signal lamp in field, the various signal condition indicator lamps in the communications field on communication equipment, the various indicator lights on vehicle
Deng；It can be the light compensating lamp of photography, such as flash lamp, light compensating lamp, or agriculture field is to plant when for light compensating apparatus
The light supplementing lamp for plants etc. of object light filling；It can be the backlight module applied to various field of backlights, such as can answer when for back lighting device
For equipment such as the mobile terminals such as display, television set, mobile phone, advertisement machines.
It should be understood that above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that LED's
Using several fields that it is not limited to the above example.
The above content is combining specific embodiment to be further described to made by the utility model embodiment, no
It can assert that the specific implementation of the utility model is only limited to these instructions.For the common skill of the utility model technical field
For art personnel, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made, all should
It is considered as belonging to the protection scope of the utility model.
Claims (13)
1. a kind of new-type LED support, which is characterized in that including positive electrode substrate, negative electrode substrate and insulating isolation belt, the insulation
The two is dielectrically separated from by isolation strip between the positive electrode substrate and the negative electrode substrate, further include by the positive electrode substrate,
Negative electrode substrate and the insulating isolation belt are enclosed in the enclosure wall body of interior insulation；In the positive electrode substrate and the negative electrode substrate,
There is at least one target side, which is greater than along the surface-pathlength value of short transverse in the side of at least one substrate
The profile height value of the target side, and the target side is non-planar；
The enclosure wall contact zone that the front of the positive electrode substrate and the negative electrode substrate has functional areas and contacts with the enclosure wall body；
At least one substrate in the positive electrode substrate and the negative electrode substrate also has the functional areas and the enclosure wall contact zone
The connection transition region of connection, the plane where the functional areas is lower than the plane where the enclosure wall contact zone.
2. new-type LED support as described in claim 1, which is characterized in that the side of the positive electrode substrate and the negative electrode substrate
All there is the target side in face；
And/or
Plane where the functional areas of the positive electrode substrate and the negative electrode substrate is below where the enclosure wall contact zone
Plane.
3. new-type LED support as claimed in claim 2, which is characterized in that the side of the positive electrode substrate and the negative electrode substrate
When all there is the target side in face, in the side that is contacted with the enclosure wall body in the positive electrode substrate and the negative electrode substrate
With target side described at least one；
And/or
The side that the positive electrode substrate and the negative electrode substrate are contacted with the insulating isolation belt is the target side.
4. new-type LED support as claimed in claim 2, which is characterized in that the side of the positive electrode substrate and the negative electrode substrate
When all having the target side in face, the positive electrode substrate and the positive width of the negative electrode substrate are greater than the width at the back side.
5. new-type LED support according to any one of claims 1-4, which is characterized in that the positive electrode substrate and the cathode
The functional areas of substrate are located at the bottom that the enclosure wall body is formed by reflection cavity；Plane where the functional areas with it is described
The difference in height of plane where enclosure wall contact zone is greater than 0, less than or equal to a quarter of the reflection cavity depth.
6. new-type LED support according to any one of claims 1-4, which is characterized in that the target side is curved surface.
7. new-type LED support as claimed in claim 6, which is characterized in that the target side is arc-shaped curved surface.
8. new-type LED support according to any one of claims 1-4, which is characterized in that the target side be include plane,
At least two in inclined-plane, the arcwall face combinatorial surfaces being combined.
9. new-type LED support as claimed in claim 8, which is characterized in that the target side be include plane, inclined-plane, arc
At least two in the shape face staging pack faces being combined.
10. new-type LED support as claimed in claim 9, which is characterized in that the staging pack face is by transverse plane and erects flat
Face and the arcwall face connected between the transverse plane and the upright plane form.
11. new-type LED support according to any one of claims 1-4, which is characterized in that the connection transition region is inclined-plane,
Arcwall face, or be combinatorial surface, the combinatorial surface be include plane, inclined-plane, at least two combination in arcwall face.
12. a kind of LED, which is characterized in that including the described in any item new-type LED supports of such as claim 1-11 and at least one
LED chip, the LED chip are set on the positive electrode substrate and/or the negative electrode substrate, and the anode of the LED chip draws
Foot and negative pin are electrically connected with the positive electrode substrate and the negative electrode substrate respectively.
13. a kind of light emitting device, which is characterized in that including LED as claimed in claim 12, the light emitting device is illumination dress
It sets, optical signal instruction device, light compensating apparatus or back lighting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821430974.3U CN209298154U (en) | 2018-08-30 | 2018-08-30 | New-type LED support, LED and light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821430974.3U CN209298154U (en) | 2018-08-30 | 2018-08-30 | New-type LED support, LED and light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209298154U true CN209298154U (en) | 2019-08-23 |
Family
ID=67652228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821430974.3U Active CN209298154U (en) | 2018-08-30 | 2018-08-30 | New-type LED support, LED and light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209298154U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110875412A (en) * | 2018-08-30 | 2020-03-10 | 深圳市聚飞光电股份有限公司 | Novel LED bracket, LED and light-emitting device |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
-
2018
- 2018-08-30 CN CN201821430974.3U patent/CN209298154U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110875412A (en) * | 2018-08-30 | 2020-03-10 | 深圳市聚飞光电股份有限公司 | Novel LED bracket, LED and light-emitting device |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN113257980A (en) | LED device, backlight module and display unit | |
| CN209298154U (en) | New-type LED support, LED and light emitting device | |
| CN209266437U (en) | Moisture-proof LED support, LED and light emitting device | |
| CN107086263A (en) | Display device and its four sides are emitting led | |
| CN208923192U (en) | A kind of lead frame, bracket, luminescent device and light emitting device | |
| CN209298155U (en) | High-intensitive LED support, LED and light emitting device | |
| CN209199978U (en) | High-intensitive LED support, LED and light emitting device | |
| CN215418213U (en) | LED device, backlight module and display unit | |
| CN209266436U (en) | High leakproofness LED support, LED and light emitting device | |
| CN209087898U (en) | High-air-tightness LED support, LED and light emitting device | |
| CN105810800A (en) | LED (Light Emitting Diode) integrated light emitting device and manufacturing method thereof | |
| CN209389056U (en) | Highly reliable LED support, LED and light emitting device | |
| CN106206920A (en) | LED encapsulation structure, method for packing and there is the LED of this LED encapsulation structure | |
| CN102254909A (en) | Light emitting device package | |
| CN218788375U (en) | LED lamp bead and backlight module | |
| CN211238282U (en) | High-reliability LED support, LED and light-emitting device | |
| CN110875413A (en) | High-reliability LED support, LED and light-emitting device | |
| US20220013695A1 (en) | High-strength led support, led and light-emitting device | |
| CN105280622A (en) | LED packaging structure and light emitting device | |
| CN203384679U (en) | LED (light-emitting diode) bulb lamp capable of emitting light in all directions | |
| CN103423617A (en) | Light emitting diode module | |
| CN112582518A (en) | High-reliability LED support, manufacturing method, LED and light-emitting device | |
| CN2586251Y (en) | Packing structure of white light LED | |
| CN110875414A (en) | High-reliability LED support, LED and light-emitting device | |
| CN110875412A (en) | Novel LED bracket, LED and light-emitting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |