CN209266437U - Moisture-proof LED support, LED and light emitting device - Google Patents
Moisture-proof LED support, LED and light emitting device Download PDFInfo
- Publication number
- CN209266437U CN209266437U CN201821484242.2U CN201821484242U CN209266437U CN 209266437 U CN209266437 U CN 209266437U CN 201821484242 U CN201821484242 U CN 201821484242U CN 209266437 U CN209266437 U CN 209266437U
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- electrode substrate
- plane
- positive electrode
- negative electrode
- enclosure wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
Abstract
The utility model provides a kind of moisture-proof LED support, LED and light emitting device, including positive electrode substrate, negative electrode substrate and the insulating isolation belt for being dielectrically separated from the two, it further include by positive electrode substrate, negative electrode substrate and insulating isolation belt are enclosed in the enclosure wall body of interior insulation, the enclosure wall contact zone that the front of positive electrode substrate and negative electrode substrate has functional areas and contacts with enclosure wall body, and the functional areas that positive electrode substrate and at least one substrate in negative electrode substrate is arranged and enclosure wall contact zone are not in one plane, and it is arranged in the side of at least one substrate at least one target side, the surface-pathlength value of the target side is greater than the profile height value of the target side, and the target side is non-planar, moisture can be extended and enter the path in functional areas, to promote LED support and utilize the anti-of LED made from the LED support Damp performance.
Description
Technical field
The utility model relates to LED (Light Emitting Diode, light emitting diode) field, more particularly to one kind are anti-
Damp LED support, LED and light emitting device.
Background technique
Since LED has many advantages, such as that rich in color, small in size, environmental protection and energy saving, service life are long, every field all
Obtain largely use and promote, for example including but be not limited to daily illumination, outdoor lighting, light decoration, advertising logo, vapour
Licence is bright or indicates, traffic instruction etc., since the external environment that LED is used in different field is different, to LED's
Reliability proposes biggish requirement, and wherein the humidity resistance of LED is then an important measurement index of LED reliability, especially
It is the application scenarios for using or storage environment is moister.
Existing LED support is referring to shown in Fig. 1-1 to Fig. 1-2 comprising the plastics enclosure wall 10 for forming reflection cavity is enclosed by plastics
Wall 10 is enclosed in interior positive electrode substrate 11, negative electrode substrate 12 and the isolation for being dielectrically separated from positive electrode substrate 11 and negative electrode substrate 12
Band 13, wherein a part of region in the front of positive electrode substrate 11 and negative electrode substrate 12 is directly contacted with plastics enclosure wall 10 is located at, referred to as
For enclosure wall contact zone；Another part region is then located at reflection cavity bottom as functional areas, which can be used for carrying LED chip
And other possible electronic devices, and wiring, die bond and as light echo area etc..Existing LED support has the following problems:
Positive electrode substrate 11 and the positive enclosure wall contact zone of negative electrode substrate 12 and functional areas are all located in a plane, therefore are worked as
When moisture spreads to substrate front side along the junction of substrate side surfaces and plastics enclosure wall 10, it is just easy to enclosing by substrate front side
Wall contact zone entered function area causes the short circuit in functional areas, device failure even to directly contribute dead lamp；And most of base
The functional areas of plate are coated with metallic silver layer, and metallic silver layer is also easy to corrode under moisture effect, cause functional defect.
The side of positive electrode substrate 11 and negative electrode substrate 12 is all vertical plane, and as shown in Figs. 1-2, therefore moisture is easier edge
The junction of substrate side surfaces and plastics enclosure wall 10 when spreading to substrate front side, be just easy to through positive electrode substrate 11 and cathode base
The side and enclosure wall contact zone entered function area of plate 12, cause the short circuit in functional areas, device failure even to directly contribute
Dead lamp；And the functional areas of most of substrate are coated with metallic silver layer, metallic silver layer is also easy to corrode under moisture effect, causes function
It can property defect.
As it can be seen that existing LED support and poor using the humidity resistance of LED made from the bracket.
Utility model content
Moisture-proof LED support, LED and light emitting device provided by the utility model, mainly solving the technical problems that: it solves existing
There is LED support and utilizes the humidity resistance of LED made from the bracket poor.
In order to solve the above technical problems, the utility model provides a kind of Novel LED support, including positive electrode substrate, cathode base
Plate and insulating isolation belt, the insulating isolation belt between the positive electrode substrate and the negative electrode substrate by the two insulate every
From, further include the positive electrode substrate, negative electrode substrate and the insulating isolation belt are enclosed in insulation enclosure wall body；
In the positive electrode substrate and the negative electrode substrate, there is at least one target side in the side of at least one substrate
Face, which is greater than the profile height value of the target side along the surface-pathlength value of short transverse, and the target side is
It is non-planar；
There are functional areas and the enclosure wall contacted with the enclosure wall body to connect in the front of the positive electrode substrate and the negative electrode substrate
Touch area；The functional areas and the enclosure wall contact zone of the positive electrode substrate and at least one substrate in the negative electrode substrate are not
In one plane.
In an embodiment of the present invention, all there is institute in the side of the positive electrode substrate and the negative electrode substrate
State target side；
And/or
The functional areas and the enclosure wall contact zone of the positive electrode substrate and the negative electrode substrate are not in a plane
On.
In an embodiment of the present invention, the enclosure wall contact zone is directly connected to the functional areas.
At least one substrate in an embodiment of the present invention, in the positive electrode substrate and the negative electrode substrate
The functional areas and the enclosure wall contact zone between also have connection transition region.
In an embodiment of the present invention, all there is institute in the side of the positive electrode substrate and the negative electrode substrate
When stating target side, the positive electrode substrate and the positive width of the negative electrode substrate are greater than the width at the back side.
In an embodiment of the present invention, all there is institute in the side of the positive electrode substrate and the negative electrode substrate
When stating target side, there is at least one in the side that contacts in the positive electrode substrate and the negative electrode substrate with the enclosure wall body
The target side；
And/or
The side that the positive electrode substrate and the negative electrode substrate are contacted with the insulating isolation belt is the target side.
In an embodiment of the present invention, the connection transition region be inclined-plane, arcwall face, or be combinatorial surface, institute
Stating combinatorial surface and being includes plane, inclined-plane, at least two combination in arcwall face.
In an embodiment of the present invention, the plane where the functional areas is higher than where the enclosure wall contact zone
Plane.
In an embodiment of the present invention, the target side is curved surface；
Or,
The target side be include plane, inclined-plane, at least two combinatorial surfaces being combined in arcwall face.
In an embodiment of the present invention, when the target side is curved surface, the target side is that arc is bent
Face.
In an embodiment of the present invention, the target side be include plane, inclined-plane, in arcwall face at least
Two be combined combinatorial surface when, the target side be include plane, inclined-plane, at least two in arcwall face be combined
Staging pack face.
In an embodiment of the present invention, the staging pack face is by transverse plane and upright plane and connection institute
State the arcwall face composition between transverse plane and the upright plane.
To solve the above-mentioned problems, the utility model additionally provides a kind of LED, including Novel LED support as described above
An at least LED chip, the LED chip are set on the positive electrode substrate and/or the negative electrode substrate, the LED core
The positive pin and negative pin of piece are electrically connected with the positive electrode substrate and the negative electrode substrate respectively.
To solve the above-mentioned problems, the utility model additionally provides a kind of light emitting device, including LED as described above, institute
Stating light emitting device is lighting device, optical signal instruction device, light compensating apparatus or back lighting device.
The beneficial effects of the utility model are:
Moisture-proof LED support, LED and light emitting device provided by the utility model, including positive electrode substrate, negative electrode substrate and general
The insulating isolation belt that the two is dielectrically separated from further includes that positive electrode substrate, negative electrode substrate and insulating isolation belt are enclosed in interior insulation
Enclosure wall body, the enclosure wall contact zone that the front of positive electrode substrate and negative electrode substrate has functional areas and contact with enclosure wall body, and setting
The functional areas and enclosure wall contact zone of at least one substrate in positive electrode substrate and negative electrode substrate not in one plane, therefore can be with
Extend the path between the enclosure wall contact zone and functional areas of substrate, namely extends moisture and enter the path in functional areas, thus
Promote LED support and the humidity resistance using LED made from the LED support；
In addition, having in the side of at least one substrate in the also settable positive electrode substrate of the utility model and negative electrode substrate
At least one target side, the surface-pathlength value of the target side are greater than the profile height value of the target side, and the target side
Face be it is non-planar, relative to existing substrate side surfaces be vertical plane setting, can further extend the path of substrate side surfaces, Ye Jiyan
Long moisture enters the path in functional areas, to dual promotion LED support and utilize the anti-of LED made from the LED support
Damp performance promotes the reliability and durability of LED, so that LED can preferably be suitable for the application scenarios of various environment, more conducively
The popularization and use of LED.
Detailed description of the invention
Fig. 1-1 is a kind of top view of LED support；
Fig. 1-2 is the sectional view of LED support shown in Fig. 1-1；
Fig. 2-1 is that the utility model embodiment two provides the sectional view one of LED support；
Fig. 2-2 is that the utility model embodiment two provides the sectional view two of LED support；
Fig. 2-3 is that the utility model embodiment two provides the sectional view three of LED support；
Fig. 2-4 is that the utility model embodiment two provides the sectional view four of LED support；
Fig. 3-1 is that the utility model embodiment three provides the sectional view one of LED support；
Fig. 3-2 is that the utility model embodiment three provides the sectional view two of LED support；
Fig. 3-3 is that the utility model embodiment three provides the sectional view three of LED support；
Fig. 3-4 is that the utility model embodiment three provides the sectional view four of LED support；
Fig. 3-5 is that the utility model embodiment three provides the sectional view five of LED support；
Fig. 3-6 is that the utility model embodiment three provides the sectional view six of LED support；
Fig. 3-7 is that the utility model embodiment three provides the sectional view seven of LED support；
Fig. 3-8 is that the utility model embodiment three provides the sectional view eight of LED support；
Fig. 3-9 is that the utility model embodiment three provides the sectional view nine of LED support；
Fig. 3-10 is that the utility model embodiment three provides the sectional view ten of LED support；
Fig. 4-1 is that the utility model embodiment four provides the top view one of LED support；
Fig. 4-2 is that the utility model embodiment four provides the top view two of LED support；
Fig. 4-3 is that the utility model embodiment four provides the top view three of LED support；
Fig. 4-4 is that the utility model embodiment four provides the top view four of LED support；
Fig. 4-5 is that the utility model embodiment four provides the top view five of LED support；
Fig. 4-6 is that the utility model embodiment four provides the top view six of LED support；
Fig. 5-1 is that the utility model embodiment four provides the top view seven of LED support；
Fig. 5-2 is that the utility model embodiment four provides the top view eight of LED support；
Fig. 5-3 is that the utility model embodiment four provides the top view nine of LED support；
Fig. 5-4 is that the utility model embodiment four provides the top view ten of LED support；
Wherein, appended drawing reference 10 of the Fig. 1-1 into Fig. 1-2 is plastics enclosure wall, and 11 be positive electrode substrate, and 12 be negative electrode substrate,
13 be isolation strip；In Fig. 2-1 to Fig. 2-4,20 be enclosure wall body, and 21 be substrate, and 211 be functional areas, and 212 be enclosure wall contact zone, 214
For target side；In Fig. 3-1 to Fig. 3-10,30 be enclosure wall body, and 31 be substrate, and 311 be functional areas, and 312 be enclosure wall contact zone,
313 be connection transition region, and 314 be target side；In Fig. 4-1 to Fig. 4-6,50 be enclosure wall body, and 51 be positive electrode substrate, and 52 be cathode
Substrate, 53 be to be dielectrically separated from area；In Fig. 5-1 to Fig. 5-4,60 be enclosure wall body, and 61 be substrate, and 61 be positive electrode substrate, and 62 be cathode
Substrate, 63 be to be dielectrically separated from area.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below by specific embodiment party
Formula combination attached drawing is described in further detail the utility model embodiment.It should be appreciated that specific embodiment described herein
It is only used to explain the utility model, is not used to limit the utility model.
Embodiment one:
In order to solve the problems, such as that existing LED support moisture resistance is poor, a kind of LED branch of high leakproofness is present embodiments provided
Frame comprising positive electrode substrate, negative electrode substrate and insulating isolation belt, insulating isolation belt is between positive electrode substrate and negative electrode substrate
The two is dielectrically separated from, the LED support in the present embodiment further includes being enclosed in positive electrode substrate, negative electrode substrate and insulating isolation belt
There are functional areas and the enclosure wall contacted with enclosure wall body to contact in the front of the enclosure wall body of interior insulation, positive electrode substrate and negative electrode substrate
Area；In a kind of example, positive electrode substrate and the positive functional areas of negative electrode substrate are located at enclosure wall body and are formed by reflection cavity bottom.
Positive electrode substrate and negative electrode substrate in the present embodiment are all electrically-conductive backing plates, and the electrically-conductive backing plate in the present embodiment can be
The substrate that various conductive materials are constituted, may be, for example, various metallic conduction substrates, including but not limited to copper base, aluminum substrate, iron
Substrate, silver-based plate；Electrically-conductive backing plate may be the mixing material electrically-conductive backing plate comprising conductive material, such as conductive rubber etc..
Optionally, also settable anti-in at least one positive functional areas in positive electrode substrate and negative electrode substrate in the present embodiment
Layer is penetrated with the light extraction efficiency of lifting bracket, which can be the reflection layer of various energy improving extraction efficiencies, for example including
But it is not limited to silver coating.
Optionally, the bottom of enclosure wall body is exposed at the back side of at least one of positive electrode substrate and negative electrode substrate in the present embodiment
Portion, as electrode welding zone.Certainly, in some instances, the back side of at least one of positive electrode substrate and negative electrode substrate can also
Not as welding section, and using its side as welding section, specific setting can flexibly be determined according to concrete application demand.
Optionally, in the present embodiment enclosure wall body can use various isolation materials enclosure wall body, for example including but be not limited to
Various plastics, insulating ceramics etc..For example, in a kind of example, the material that enclosure wall body can use includes but unlimited epoxy resin
(EP, Epoxide resin), high temperature resistant nylon (PPA plastics), gather polyphthalamide (PPA, Polyphthalamide)
Terephthalic acid (TPA) 1,4-CHDM ester (PCT, Poly1,4-cyclohexylene dimethylene
Terephthalate), liquid crystal polymer (LCP, Liquid Crystal Polymer), sheet molding compound (SMC, Sheet
Molding compound), epoxy molding plastic (EMC, Epoxy molding compound), unsaturated polyester (UP) (UP) resin,
Polyester resin (PET, Polyethylene terephthalate), polycarbonate (PC, Polycarbonate), poly hexamethylene adipamide
Hexamethylene diamine (nylon66), glass fibre.
Optionally, the material of insulating isolation belt can be identical as enclosure wall body in the present embodiment, can also be different, and its can with enclose
Wall is formed together, and also may be separately formed.
In addition, it is to be understood that in the present embodiment enclosure wall body generation type can also flexible choice, such as can pass through but
Injection molding is not limited to be formed.
In the present embodiment, be arranged at least one substrate in the positive electrode substrate and negative electrode substrate of LED support functional areas and
Not in one plane, such as the positive functional areas of positive electrode substrate and enclosure wall contact zone are not in one plane for enclosure wall contact zone,
And/or the positive functional areas of negative electrode substrate and enclosure wall contact zone are not in one plane；Specific setting positive electrode substrate and cathode base
One or two functional areas and enclosure wall contact zone in plate in one plane can not flexibly be set according to specific requirements.Example
Such as, in a kind of example, for the leakproofness of General Promotion LED support, the functional areas of settable positive electrode substrate and negative electrode substrate
Not in one plane with enclosure wall contact zone.This set can extend the road between the enclosure wall contact area functional areas of substrate
Diameter that is to say that extending moisture enters the path in functional areas, so as to promote LED support and utilize the LED support system
The sealing performance of the LED obtained, promotes the reliability and durability of LED, so that LED can better meet various environment uses and want
It asks, the more conducively popularization and use of LED.
In addition, can also be arranged in positive electrode substrate and negative electrode substrate simultaneously, have at least one in the side of at least one substrate
A target side, the surface-pathlength value of the target side is greater than the profile height value of the target side, and the target side is non-
Plane is the setting of vertical plane relative to existing substrate side surfaces, can further extend the path of substrate side surfaces, namely extend moisture
The path in functional areas is entered, thus dual promotion LED support and the humidity resistance using LED made from the LED support,
The reliability and durability of LED are promoted, so that LED can preferably be suitable for the application scenarios of various environment, more conducively LED's is pushed away
It is wide to use.
In a kind of example of the present embodiment, the enclosure wall contact zone of substrate front side can be directly connected to functional areas, and enclosure wall
Contact zone can be inclined-plane, cambered surface or other kinds of face.
In another example of the present embodiment, in order to further extend between the enclosure wall contact zone of substrate and functional areas
Path, can also be arranged connection transition region between the enclosure wall contact zone of substrate and functional areas, and such moisture then needs to pass through enclosure wall
After contact zone and connection transition region, could entered function area, can further lifting bracket humidity resistance.In the present embodiment,
Connecting transition region can also be inclined-plane, arcwall face, or be combinatorial surface, which may also comprise but be not limited to plane, inclined-plane, arc
At least two combination in face.
In order to preferably promote the air-tightness of LED support, to promote its humidity resistance, in some instances, when setting base
When plate side is above-mentioned target side, can be set all has above-mentioned target side in the side of positive electrode substrate and negative electrode substrate,
Such as:
Example one: there is at least one described mesh in the side contacted in setting positive electrode substrate and negative electrode substrate with enclosure wall body
Mark side；
For example, when positive electrode substrate and negative electrode substrate need to contact with enclosure wall body there are three side, and two in width direction
A side is opposite side, and it is above-mentioned target side that these three sides, which can be set, all, or is only arranged in these three sides
Two opposite sides are above-mentioned target side, or it is above-mentioned target side that one of side, which is only arranged,；It specifically can basis
Which side is demand select be set as above-mentioned target side.
Example two:
It is above-mentioned target side that the side that positive electrode substrate and negative electrode substrate are contacted with insulating isolation belt, which is arranged,.
Example three:
Being arranged in the side contacted in positive electrode substrate and negative electrode substrate with enclosure wall body has at least one described target side,
And it is above-mentioned target side that the side that positive electrode substrate and negative electrode substrate are contacted with insulating isolation belt, which is arranged,.
In the present embodiment, target side can be the side along the surface-pathlength value of short transverse greater than the target side
Height value, and the target side is nonplanar arbitrary face；Such as can be curved surface, and be curved surface when, the curved surface setting can be
The arc-shaped curved surface of rule, can also be irregular surface.In another example in some instances, which can also be combinatorial surface, it should
Combinatorial surface includes but is not limited to plane, inclined-plane, at least two combinatorial surfaces being combined in arcwall face.It and is combinatorial surface
When, can also be includes plane, inclined-plane, at least two staging pack faces being combined in arcwall face, further to extend side
Face path promotes humidity resistance.For example, staging pack face is horizontal flat by transverse plane and upright plane and connection in a kind of example
Arcwall face composition between face and upright plane；Or be made of multiple inclined-planes, or be made of transverse plane or upright plane with inclined-plane, or by
Upright plane, inclined-plane and cambered surface composition, or be made of transverse plane, inclined-plane and cambered surface；Specifically combine building form that can flexibly set.
In a kind of example of the present embodiment, positive electrode substrate can be set and the positive width of negative electrode substrate is greater than the back side
Width preferably to prevent extraneous moisture by substrate side surfaces entered function area, and is also more conducive to the system of substrate and LED support
Make, processing.
In the present embodiment, the generation type of target side can be through but not limited to modes such as punching press, etching, cuttings.
The present embodiment is by being arranged in positive electrode substrate and negative electrode substrate, the surface of at least one side of at least one substrate
Path values are greater than the profile height value of the side, and the side is non-planar, is setting for vertical plane relative to existing substrate side surfaces
Set, can extend the path of substrate side surfaces, namely extend moisture and enter the path in functional areas, thus promoted LED support with
And the humidity resistance using LED made from the LED support, the reliability and durability of LED are promoted, so that LED can be fitted preferably
For the application scenarios of various environment, the more conducively popularization and use of LED.
The present embodiment by setting LED support positive electrode substrate and negative electrode substrate at least one substrate functional areas and
Not in one plane, and optionally, the plane where settable functional areas is higher than where enclosure wall contact zone for enclosure wall contact zone
Plane where plane, or setting functional areas is lower than the plane where enclosure wall contact zone；Positive electrode substrate and cathode base are set simultaneously
In plate, there is at least one target side in the side of at least one substrate, the surface-pathlength value of the target side is greater than the mesh
The profile height value of side is marked, and the target side is non-planar, is the setting of vertical plane relative to existing substrate side surfaces, it can be into
One step extend substrate side surfaces path, namely extend moisture enter the path in functional areas, thus dual promotion LED support with
And the humidity resistance using LED made from the LED support, the reliability and durability of LED are promoted, so that LED can be fitted preferably
For the application scenarios of various environment, the more conducively popularization and use of LED.
Embodiment two:
In order to make it easy to understand, the present embodiment is directly connected to the enclosure wall contact zone on substrate with functional areas, and function position
On enclosure wall contact zone, it is illustrated in conjunction with several exemplary target side structures for example.
It refers to shown in Fig. 2-1, the enclosure wall contact zone which show on a kind of substrate shows with what functional areas were directly connected to
It is intended to, wherein 20 be enclosure wall body, 21 be substrate (may be positive electrode substrate and/or negative electrode substrate), and 211 be functional areas, and 212 be to enclose
Wall contact zone, 214 be target side.In Figure 2-1, enclosure wall contact zone 212 is inclined-plane, and functional areas 211 are to contact positioned at enclosure wall
The plane in area 212, certainly according to demand functional areas 211 may be alternatively provided as it is non-planar.Enclosure wall contact zone 212 and functional areas 211 it
Between path be set to conplane path relative to existing enclosure wall contact zone and functional areas and be obviously prolonged, therefore can add
The path in long moisture entered function area, and then the humidity resistance of lifting bracket, promoted using LED lamp bead made from the bracket or its
The reliability of his product.In addition, two opposite sides of substrate have been both configured to target side 214, and target side in Fig. 1
Face 214 is curved surface, and substrate front side width is consistent substantially with back side width, and target side 214 is in the height direction in Fig. 2-1
Surface-pathlength value be then 212 in figure indicated by lines length value, relative to substrate side surfaces be vertical plane set-up mode,
Path is obviously prolonged, therefore can further lengthen the path in moisture entered function area, and then dual lifting bracket is moisture-proof
Performance is promoted and utilizes LED lamp bead or the reliability of other products made from the bracket.Certainly, in some instances, target side
It may be alternatively provided as inclined-plane, opposing substrate side is vertical plane set-up mode, can also extend moisture entered function to a certain extent
The path in area, but the set-up mode path of its relative surface or combinatorial surface is shorter, and it is set as curved surface or combinatorial surface is also more conducive to
In conjunction with enclosure wall body 20 or insulating isolation belt, increasing the two bonded area can also mention substrate side surfaces while promoting air-tightness
The integral strength of ascending branch frame.
In some instances, enclosure wall contact zone 212 can not also be inclined-plane, and be other kinds of face.For example, with reference to Fig. 2-
Shown in 2, enclosure wall contact zone 212 is then cambered surface in the figure, and the convex globoidal that the cambered surface is protruded to the outside of substrate 21, Fig. 2-2 institute
The setting of the convex globoidal shown can further extend the path in moisture entered function area, therefore relative to inclined-plane shown in Fig. 2-1
Dampproof effect can further be promoted.And in some instances, substrate front side width can not also be consistent with back side width, such as
Referring to fig. 2 shown in -2, target side 214 therein still uses the set-up mode of curved surface, but the curved surface of two sides is integral into " eight "
Font extends outwardly, so that substrate front side width is less than back side width；This setup can further extend moisture and enter function
The path in energy area；Certainly, target side 214 shown in Fig. 2-4 can also reversely extend internally；And target side in the present embodiment
When using curved surface, curved surface theoretically can be set to any Irregular Boundary Surface, may be alternatively provided as ruled surface.
In some instances, when enclosure wall contact zone 212 is cambered surface, other than it can be convex globoidal shown in Fig. 2-2, can also be
Other kinds of cambered surface.For example, see shown in Fig. 2-3, being the intrados recessed to 21 inside of substrate, relative to shown in Fig. 2-1
Inclined-plane, can also further extend the path in moisture entered function area, therefore can further promote dampproof effect.Meanwhile joining
As shown in Fig. 2-3, target side 214 can be composed of multiple continuous small curved surfaces, and this setup makes target side
And enclosure wall body 20 or insulating isolation belt can be more firm combination, lifting bracket intensity and air-tightness.Referring to fig. 2 shown in -4, target
Side 214 opposed, inwardly directed can extend so that substrate front side width be greater than back side width, more conducively substrate and LED support plus
Work.
However, it is to be understood that enclosure wall contact zone 212 is other than it can be inclined-plane or cambered surface in the present embodiment, according to need
It asks the other kinds of face that may be alternatively provided as, and its concretely regular face, can also be irregular face.For example, with reference to Fig. 2-4 institute
Show, enclosure wall contact zone 212 can also further extend moisture entered function relative to inclined-plane shown in Fig. 2-1 for curved face
The path in area, therefore can further promote dampproof effect.
In addition, it is to be understood that in Fig. 2-1 to Fig. 2-4 the enclosure wall contact zone 212 of opposite sides may be configured as it is identical
Face may be alternatively provided as different faces, specifically can flexibly be set according to application scenarios；The present embodiment only illustrates several by target side
Face is set as the schematic diagram of curved surface, and it should be understood that when there are at least two sides being above-mentioned target side on substrate,
Each target side can be set to identical face, may be set to be different faces；And work as on positive electrode substrate and negative electrode substrate all
There are when target side, the target side on positive electrode substrate and negative electrode substrate may be alternatively provided as identical face, or be set as different
Face.Such as the uniformity in view of processing, identical target side can be both configured to.
In some instances, the formation process of above-mentioned enclosure wall contact zone 212 and target side 214 can be with flexible choice, example
It such as include but is not limited to etching, cutting, punching press, generation type is simple and at low cost, and it is high-efficient, it can be fabricated to guaranteeing bracket
While this is with efficiency, the humidity resistance of LED support is promoted.
Embodiment three:
In order to make it easy to understand, the present embodiment has connection transition region with the enclosure wall contact zone on substrate and between functional areas,
And functional areas are located on enclosure wall contact zone, are illustrated in conjunction with several exemplary target side structures for example.
Optionally, in the present embodiment, the plane where functional areas can be higher than the plane where enclosure wall contact zone, and the two
Between specific difference in height can flexibly be set according to application scenarios, such as where the plane where functional areas and enclosure wall contact zone
Plane difference in height may be configured as be greater than 0, less than or equal to a quarter of reflection cavity depth；It certainly can also according to specific requirements
Other values are set as, such as is set as difference in height and may be configured as being greater than 0, less than or equal to 1/5th of reflection cavity depth, six points
One of or one third etc..
Optionally, in the present embodiment, the connection transition region between enclosure wall contact zone and functional areas can also at least partly area
Domain is contacted with enclosure wall body, so as to promote the contact area of substrate Yu enclosure wall body, the intensity of lifting bracket, while further
Extend the path in moisture entered function area.
Enclosure wall contact zone in the present embodiment with connect transition region can be in the same plane, may be alternatively located at different flat
On face, and the type of the two can be identical, can also be different.And it should be understood that enclosure wall contact zone can also be in the present embodiment
The face of several types shown in embodiment two.
For example, in a kind of example, referring to shown in Fig. 3-1, wherein 30 be enclosure wall body, 31 be substrate (may be positive electrode substrate
And/or negative electrode substrate), 311 be functional areas, and 312 be enclosure wall contact zone, and 313 be connection transition region, and 314 be target side.Scheming
In 3-1, the region of enclosure wall contact zone 312 is the chamfered region that substrate front side is directly contacted with enclosure wall body 30, connects transition region 313
For substrate front side and enclosure wall body 30 not in contact with chamfered region, connection transition region 313 and enclosure wall contact zone 312 form one tiltedly
Face namely the two are located on the same face.Setting by connecting transition region 313 can further increase enclosure wall contact zone 312 and function
Path between energy area 311, the humidity resistance of lifting bracket.And in Fig. 3-1, target side is set as arc-shaped curved surface, a kind of
Arc-shaped curved surface shown in Fig. 3-1 is in instance object side 214, the concave arc shape curved surface which is recessed,
The specific radian of the arc-shaped curved surface can flexibly be set according to demand.The setting of arc-shaped curved surface shown in Fig. 3-1 can be further
Extend the path in moisture entered function area, and the combination stability of substrate side surfaces and enclosure wall body or insulating isolation belt can be promoted, and
So that substrate front side width is greater than back side width, the more conducively processing of substrate and LED support.
In another example, referring to shown in Fig. 3-2, the region of enclosure wall contact zone 312 is substrate front side and enclosure wall body in a kind of example
30 plane domains directly contacted, connection transition region 313 are that substrate front side connects the oblique of enclosure wall contact zone 312 and functional areas 311
Face region, in the example shown in Fig. 3-2, connection transition region 313 also some directly contacted with enclosure wall body 30, therefore into
While one step increases the path between enclosure wall contact zone 312 and functional areas 311, can also lifting bracket intensity, also can be same
When lifting bracket humidity resistance and intensity.In addition, when the target side in the present embodiment is arc-shaped curved surface, in addition to that can be concave arc
It can also be convex curved surface outside shape curved surface.Referring to shown in Fig. 3-2, target side 314 shown in the figure is then Xiang Ji for a kind of example
The convex curved surface of plate outer lug can further extend the path in moisture entered function area and promote substrate side surfaces and enclose
The bonded area of wall or insulating isolation belt increases support intensity；Substrate front side width is made to be less than back side width simultaneously, it is more sharp
In the heat dissipation of LED support.
In another example, referring to shown in Fig. 3-3, the region of enclosure wall contact zone 312 is substrate front side and enclosure wall body in a kind of example
30 plane domains directly contacted, connection transition region 313 are the arc that substrate front side connects enclosure wall contact zone 312 and functional areas 311
Face region, the cambered surface region are to the convex globoidal region of 31 outside protrusion of substrate；In the example shown in Fig. 3-3, transition is connected
Area 313 also some directly contacted with enclosure wall body 30, therefore enclosure wall contact zone 312 and functional areas can also further increased
While path between 311 is to promote humidity resistance, can lifting bracket intensity.Certainly, the connection transition in the present embodiment
Area 313 can be also the cancave cambered surface recessed to the inside of substrate 31 other than it can be convex globoidal, for example, see shown in Fig. 3-4, shown in the figure
Then it is the case where exemplary connection transition region 313 of one kind is cancave cambered surface, enclosure wall contact zone 312 and function can also be being further increased
Can path between area 311 to promote humidity resistance while, can lifting bracket intensity.
In the present embodiment, target side can be combinatorial surface, and according to above-mentioned analysis it is found that the combinatorial surface includes but not
It is limited to plane, inclined-plane, at least two combinatorial surfaces being combined in arcwall face.It can also be to include and when being combinatorial surface
Plane, inclined-plane, at least two staging pack faces being combined in arcwall face are promoted anti-with further extending lateral approach
Damp performance.For example, in a kind of example, staging pack face by transverse plane and upright plane and connection transverse plane and upright plane it
Between arcwall face composition；Or it is made of multiple inclined-planes, or be made of transverse plane or upright plane with inclined-plane, or by upright plane, inclined-plane
It is formed with cambered surface, or be made of transverse plane, inclined-plane and cambered surface；Specifically combine building form that can flexibly set.Below with several
Specific target side is that the structure of combinatorial surface is that example is illustrated.
For example, in Fig. 3-3, target side 314 is by two inclined-planes and to connect the plane on the two inclined-planes and combine
The combinatorial surface arrived, and in Fig. 3-1, the angle of junction is all greater than 90 ° between each face, and this setup is relative to angle
It less than or equal to 90 °, can prevent from forming bubble in the junction of angle during injection molding etc., road can be entered extending moisture
While diameter, the generation of bubble is further prevented, thus the further humidity resistance of lifting bracket.In another example in figures 3-4,
Target side 314 is by two upright planes and the transverse plane between two upright planes, and respectively by two upright planes
The arcwall face composition connecting with the transverse plane, connect intersection with transverse plane in upright plane in this way as arc-shaped curved surface, can also be to prevent
Bubble only is formed in junction during injection molding etc., the production of bubble can be further prevented while extending moisture access path
It is raw, the humidity resistance of lifting bracket.
In addition, it is to be understood that the connection transition region 313 of substrate front side opposite sides may be alternatively provided as in the present embodiment
The face of same type, or it is set as different types of face.For example, see the connection transition region 313 shown in Fig. 3-5, in substrate side
It is set as convex globoidal, the connection transition region 313 of the opposite other side is then set as cancave cambered surface, and specific set-up mode can be according to tool
Body application scenarios and the technique of use flexibly determine.In this example, target side 314 is by two inclined-planes and positioned at two
Transverse plane between inclined-plane, and the arcwall face for respectively connecting on two inclined-planes with the transverse plane form, in this way on inclined-plane and cross
It is arc-shaped curved surface that plane, which connects intersection, and injection molding etc. can also be further prevented to form bubble in junction in the process.
It can also be combinatorial surface that transition region is connected in the present embodiment, which may include but be not limited to plane, inclined-plane, arc
At least two combination in face.
For example, with reference to shown in Fig. 3-6, the region of enclosure wall contact zone 312 is what substrate front side was directly contacted with enclosure wall body 30
Plane domain, connection transition region 313 are the inclined-plane and arcwall face knot that substrate front side connects enclosure wall contact zone 312 and functional areas 311
The combinatorial surface of conjunction；Target side 314 be by inclined-plane, upright plane and and transverse plane between inclined-plane and upright plane, with
And the arcwall face for respectively connecting two inclined-planes and upright plane with the transverse plane forms, in this way in inclined-plane and transverse plane and perpendicular flat
It is arc-shaped curved surface that face, which connect intersection with transverse plane, and injection molding etc. can also be further prevented to form bubble in junction in the process.
In another example the difference with bracket shown in Fig. 3-6 is referring to shown in Fig. 3-7, connection transition region 313 is to pass through
Two inclined-planes and the planar junction for connecting two inclined-planes are combined into；Target side 312 is by upright plane, transverse plane and arcwall face
The step combinatorial surface with multi-stage stairs of composition, this step combinatorial surface can further extend moisture access path, promoted and
The bonded area of enclosure wall body or insulating isolation belt promotes the air-tightness and integral strength of LED support.
In another example the difference with bracket shown in Fig. 3-6 and Fig. 3-7 is referring to shown in Fig. 3-8, transition region 313 is connected
It is formed to be combined by sequentially connected inclined-plane, plane and arcwall face.As it can be seen that the connection transition region 313 in the present embodiment is
When combinatorial surface, specific combination can flexibly be set.And it should be understood that enclosure wall contact zone 312 in the present embodiment
Can also be combinatorial surface, and can for the combinatorial surface that connect 313 same type of transition region, can also be different from transition region 313 is connected
The combinatorial surface of type.In the figure, target side 312 is the combinatorial surface being made of inclined-plane, and the angle between two inclined-planes is big
In 90 °.
Referring to shown in Fig. 3-9, target side 314 is to be combined by the arcwall face between two inclined-planes in two inclined-planes and connection
Obtained combinatorial surface.According to above-mentioned each example it is found that specific combination can when target side is combinatorial surface in the present embodiment
With flexible and changeable, substrate front side width can also can be made integrally to be greater than base according to specific requirements flexible choice, and in setting
Back width；Certainly can also being flexibly set as substrate front side width according to demand, to be integrally less than or equal to substrate back wide
Degree.
As above shown in analysis, in this embodiment, when there are at least two sides on substrate for above-mentioned target side, each mesh
Mark side can be set to identical face, may be set to be different faces；It is opposite in substrate for example, see shown in Fig. 3-10
Two target sides 314 are set to different combinatorial surfaces.Certainly, can also one be set as combinatorial surface, one is set as curved surface,
Or one be both set as different curved surfaces.
In the enclosure wall contact zone on substrate and between functional areas, further setting connects transition region to the present embodiment, can be further
Increase the path between enclosure wall contact zone 312 and functional areas 311 to promote humidity resistance；And optionally, also settable to connect
At least partly contacting with enclosure wall body for area is crossed, to promote the contact area of substrate Yu enclosure wall body simultaneously, and then lifting bracket is strong
Degree；In addition at least one side of also settable substrate is target side, enters the road in LED support further to extend moisture
Diameter and the intensity for promoting LED support.
Example IV:
Referring to the insulating isolation belt shown in Fig. 1-1 to Fig. 1-2, in existing LED support, between positive electrode substrate and negative electrode substrate
It is perpendicular to bracket long side, it is disposed in parallel with positive electrode substrate and negative electrode substrate；And insulating isolation belt is the fragile insulation of comparison
Material causes to be easy to happen fracture at insulating isolation belt, reduces LED support along with the narrower width of insulating isolation belt
Integral strength and reliability.
For this problem, additionally provided in the present embodiment it is a kind of there is new structural LED support, the LED support it is exhausted
Two opposite long sides of edge isolation strip cross-sectional profiles are arc-shaped side, or for curved curved side at least one, or are tool
There is the fold-line edge bent at least one, or the angle between the short side of negative electrode substrate is more than or equal to 10 °, it is oblique less than 90 °
Suffered mechanical force can be transmitted a part to positive electrode substrate, negative electrode substrate and enclosure wall body in this way when isolation strip stress by side
On, therefore the intensity of insulating isolation belt can be increased.
Optionally, two opposite long sides of the cross-sectional profiles of insulating isolation belt can be parallel in the present embodiment, can also be with
It is set as not parallel, specifically can flexibly set according to demand；In order to make it easy to understand, the present embodiment is separately below to be arranged in parallel
It is illustrated with two kinds of examples of non-parallel setting.
Example is arranged in parallel:
Referring to fig. 4 shown in -1, wherein 50 be enclosure wall body, 51 be positive electrode substrate, and 52 be negative electrode substrate, and 53 be to be dielectrically separated from
Area.In Fig. 4-1, dotted line is the short side of negative electrode substrate 52.In Fig. 4-1,53 cross-sectional profiles of insulating isolation belt it is opposite two
Long side is that the included angle A between the short side of negative electrode substrate is more than or equal to 10 °, and the bevel edge less than 90 °, the value of the included angle A can
It is flexible according at least one of material used by the strength demand of concrete application scene, insulating isolation belt, formation process etc.
Setting.Such as in a kind of example, the value of included angle A can be 75 ° to 85 °, such as specific value is 75 °, 78 °, 80 °, 83 °, 85 °
Deng a part of mechanical force being subject to being transferred to positive electrode substrate 51, cathode in this way when insulating isolation belt 53 is by mechanical force
On substrate 52 and enclosure wall body 50, to promote the intensity of insulating isolation belt 53, and then the integral strength of LED support and reliable is promoted
Property.
Two opposite long sides of 53 cross-sectional profiles of insulating isolation belt can also be arc other than it can be bevel edge in the present embodiment
Shape side.For example, a kind of be arranged referring to fig. 4 shown in -2, two opposite long sides of 53 cross-sectional profiles of insulating isolation belt are mutually flat
Two capable arc-shaped sides, when the setting of arc-shaped side also may make insulating isolation belt 53 by mechanical force, a part of machine for will being subject to
Tool power is transferred on positive electrode substrate 51, negative electrode substrate 52 and enclosure wall body 50, promotes the intensity of insulating isolation belt 53.
Two opposite long sides of 53 cross-sectional profiles of insulating isolation belt be other than it can be bevel edge and arc-shaped side in the present embodiment,
It can also be curved side.For example, a kind of be arranged referring to fig. 4 shown in -3, two opposite long sides of 53 cross-sectional profiles of insulating isolation belt
For two curved sides being parallel to each other, when the setting of curved side also may make insulating isolation belt 53 by mechanical force, will be subject to one
Some mechanical power is transferred on positive electrode substrate 51, negative electrode substrate 52 and enclosure wall body 50, promotes the intensity of insulating isolation belt 53.This reality
Applying curved side in example can be with flexible setting in addition to the quantity in knee, such as other than the curved side shown in Fig. 4-3, can also be
Curved side shown in Fig. 4-5 can also be the curved side of other forms certainly.
Two opposite long sides of 53 cross-sectional profiles of insulating isolation belt are other than it can be bevel edge, outside arc-shaped side in the present embodiment
It, can also be for the fold-line edge bent at least one outside curved side.For example, a kind of setting is dielectrically separated from referring to fig. 4 shown in -4
It is two fold-line edges being parallel to each other with two opposite long sides of 53 cross-sectional profiles, the setting of fold-line edge, which also may make, to be dielectrically separated from
When band 53 is by mechanical force, a part of mechanical force being subject to is transferred on positive electrode substrate 51, negative electrode substrate 52 and enclosure wall body 50,
Promote the intensity of insulating isolation belt 53.Fold-line edge in the present embodiment in addition to bending place quantity can with flexible setting, such as except
It can be also fold-line edge shown in Fig. 4-6 outside fold-line edge shown in Fig. 4-4, certainly can also be the fold-line edge of other forms.
Non-parallel setting example:
Referring to shown in Fig. 5-1, wherein 60 be enclosure wall body, 61 be positive electrode substrate, and 62 be negative electrode substrate, and 63 be to be dielectrically separated from
Area.In Fig. 5-1, two opposite long sides of 63 cross-sectional profiles of insulating isolation belt are the folder between the short side of negative electrode substrate 62
Angle is more than or equal to 10 °, the bevel edge less than 90 °, between this two bevel edges and not parallel, in this way when insulating isolation belt 63 is by machinery
When power, a part of mechanical force being subject to can be transferred on positive electrode substrate 61, negative electrode substrate 62 and enclosure wall body 60, to be promoted exhausted
The intensity of edge isolation strip 63, and then promote the integral strength and reliability of LED support.
Two opposite long sides of 63 cross-sectional profiles of insulating isolation belt can also be arc other than it can be bevel edge in the present embodiment
Shape side.For example, a kind of setting is referring to shown in Fig. 5-2, two opposite long sides of 63 cross-sectional profiles of insulating isolation belt are two non-
Parallel arc-shaped side, when the setting of nonparallel arc-shaped side also may make insulating isolation belt 63 by mechanical force, will be subject to one
Some mechanical power is transferred on positive electrode substrate 61, negative electrode substrate 62 and enclosure wall body 60, promotes the intensity of insulating isolation belt 63.
Two opposite long sides of 63 cross-sectional profiles of insulating isolation belt be other than it can be bevel edge and arc-shaped side in the present embodiment,
It can also be curved side.For example, a kind of setting is referring to shown in Fig. 5-3, two opposite long sides of 63 cross-sectional profiles of insulating isolation belt
It will when the setting of two non-parallel curved sides also may make insulating isolation belt 63 by mechanical force for two non-parallel curved sides
A part of mechanical force being subject to is transferred on positive electrode substrate 61, negative electrode substrate 62 and enclosure wall body 60, promotes insulating isolation belt 63
Intensity.
Two opposite long sides of 63 cross-sectional profiles of insulating isolation belt are other than it can be bevel edge, outside arc-shaped side in the present embodiment
It, can also be for the fold-line edge bent at least one outside curved side.For example, a kind of be arranged referring to shown in Fig. 5-4, it is dielectrically separated from
It is two non-parallel fold-line edges with two opposite long sides of 63 cross-sectional profiles, the setting of two non-parallel fold-line edges also may make
When insulating isolation belt 63 is by mechanical force, a part of mechanical force being subject to is transferred to positive electrode substrate 61, negative electrode substrate 62 and is enclosed
On wall 60, the intensity of insulating isolation belt 63 is promoted.
Arc-shaped side or curved side are set by two opposite long sides of insulating isolation belt cross-sectional profiles in the present embodiment,
Or fold-line edge, or angle between the short side of negative electrode substrate is more than or equal to 10 °, the bevel edge less than 90 °, when isolation strip stress
When, suffered mechanical force transmitting a part can be given on positive electrode substrate, negative electrode substrate and enclosure wall body, therefore insulation can be increased
The intensity of isolation strip promotes LED support and integral strength and reliability using LED made from the bracket.
Embodiment five:
A kind of LED is present embodiments provided, including as above LED support shown in each embodiment, also there is an at least LED
Chip, the LED chip are set on positive electrode substrate and/or negative electrode substrate, the positive pin and negative pin of LED chip respectively with
Positive electrode substrate and negative electrode substrate electrical connection, it should be appreciated that the LED chip in the present embodiment can be flip LED core
Piece, can also be with packed LED chip, and the positive pin and negative pin of LED chip are real with positive electrode substrate and negative electrode substrate respectively
The mode being now electrically connected includes but is not limited to: being realized by the conductive material of electric wire, conducting resinl or other forms.
It should be understood that the color that the illumination of LED provided in this embodiment shoots out, is presented to the user, it can basis
Actual demand and application scenarios carry out flexible setting.The illumination of LED shoots out, which kind of color show is, can by but
Following factor is not limited to flexibly to control: the color of light that LED chip itself issues, LED whether include luminescent conversion layer, when
The type of luminescent conversion layer when LED includes luminescent conversion layer.
In a kind of example of the present embodiment, LED, which may also include, to be set to LED chip and (is provided with hair on LED chip
Light convert glue-line when, then be set on luminescent conversion glue-line) on lens glue-line or diffusion glue-line.
It should be understood that luminescent conversion glue-line can be the fluorescent adhesive layer comprising fluorescent powder in a kind of example, it can also
To be the colloid comprising the photic material of quantum dot or other can realize the luminescent conversion glue or film of luminescent conversion, and according to need
It also may include spread powder or silicon powder etc.；Luminescent conversion glue-line, lens glue-line or expansion are formed in the present embodiment in LED chip
The mode for dissipating glue-line includes but is not limited to dispensing, molding, spraying, stickup etc..
For example, luminescent conversion layer may include fluorescent powder glue-line, fluorescent film or quantum dot QD film；Fluorescent powder glue-line, fluorescent film
Can be used inorganic fluorescent powder production, can be the inorganic fluorescent powder for being doped with rare earth element, wherein inorganic fluorescent powder include but
It is not limited at least one of silicate, aluminate, phosphate, nitride, fluorination matter fluorescent powder.
In another example the production of quantum dot fluorescence powder can be used in quantum dot QD film；Quantum dot fluorescence powder include but is not limited to BaS,
AgInS2、NaCl、Fe2O3、In2O3、InAs、InN、InP、CdS、CdSe、CdTe、ZnS、ZnSe、ZnTe、GaAs、GaN、
GaS、GaSe、InGaAs、MgSe、MgS、MgTe、PbS、PbSe、PbTe、Cd(SxSe1-x)、BaTiO3、PbZrO3、
At least one of CsPbCl3, CsPbBr3, CsPbI3.
In the present embodiment, the type for the light that LED chip itself issues can be macroscopic visible light, be also possible to
Visually sightless ultraviolet light, infrared light；When the type for the light that LED chip itself issues is the sightless ultraviolet light of naked eyes, red
When outer smooth, luminescent conversion layer can be set on LED chip, naked eyes black light is converted into naked eyes visible light, so that LED
Irradiating the light come is the visible light of user.For example, when the light that LED chip itself issues is ultraviolet light, if thinking LED in current
The visible white light in family, then luminescent conversion layer can be red, green, blue fluorescent powder is mixed after be fabricated to.
The present embodiment also provides a kind of light emitting device, which includes LED exemplified by above-described embodiment.This implementation
Light emitting device in example can be lighting device, optical signal instruction device, light compensating apparatus or back lighting device etc..When for lighting device,
It is specifically as follows the lighting device applied to various fields, such as the desk lamp in daily life, fluorescent lamp, ceiling lamp, downlight, road
Lamp, projecting lamp etc., in another example high beam, dipped headlight, atmosphere lamp etc. in automobile, in another example operating lamp, low electricity in medical
The headlamp of magnetic headlamp, various medical apparatus, in another example answer furnishing fields illuminate in various color lamps, landscape spotlight, wide
Accuse lamp etc.；When for optical signal instruction device, it is specifically as follows the optical signal instruction device applied to various fields, such as traffic
The signal lamp in field, the various signal condition indicator lamps in the communications field on communication equipment, the various indicator lights on vehicle
Deng；It can be the light compensating lamp of photography, such as flash lamp, light compensating lamp, or agriculture field is to plant when for light compensating apparatus
The light supplementing lamp for plants etc. of object light filling；It can be the backlight module applied to various field of backlights, such as can answer when for back lighting device
For equipment such as the mobile terminals such as display, television set, mobile phone, advertisement machines.
It should be understood that above-mentioned application is only several applications exemplified by the present embodiment, it should be appreciated that LED's
Using several fields that it is not limited to the above example.
The above content is combining specific embodiment to be further described to made by the utility model embodiment, no
It can assert that the specific implementation of the utility model is only limited to these instructions.For the common skill of the utility model technical field
For art personnel, without departing from the concept of the premise utility, a number of simple deductions or replacements can also be made, all should
It is considered as belonging to the protection scope of the utility model.
Claims (14)
1. a kind of moisture-proof LED support, which is characterized in that including positive electrode substrate, negative electrode substrate and insulating isolation belt, the insulation
The two is dielectrically separated from by isolation strip between the positive electrode substrate and the negative electrode substrate, further include by the positive electrode substrate,
Negative electrode substrate and the insulating isolation belt are enclosed in the enclosure wall body of interior insulation；
In the positive electrode substrate and the negative electrode substrate, there is at least one target side in the side of at least one substrate, it should
Target side is greater than the profile height value of the target side along the surface-pathlength value of short transverse, and the target side is non-flat
Face；
The enclosure wall contact zone that the front of the positive electrode substrate and the negative electrode substrate has functional areas and contacts with the enclosure wall body；
The functional areas and the enclosure wall contact zone of the positive electrode substrate and at least one substrate in the negative electrode substrate are not one
In a plane.
2. moisture-proof LED support as described in claim 1, which is characterized in that the side of the positive electrode substrate and the negative electrode substrate
All there is the target side in face；
And/or
The functional areas and the enclosure wall contact zone of the positive electrode substrate and the negative electrode substrate are not in one plane.
3. moisture-proof LED support as described in claim 1, which is characterized in that the enclosure wall contact zone and the functional areas are direct
Connection.
4. moisture-proof LED support as described in claim 1, which is characterized in that in the positive electrode substrate and the negative electrode substrate
Also there is connection transition region between the functional areas of at least one substrate and the enclosure wall contact zone.
5. moisture-proof LED support as claimed in claim 2, which is characterized in that the side of the positive electrode substrate and the negative electrode substrate
When all having the target side in face, the positive electrode substrate and the positive width of the negative electrode substrate are greater than the width at the back side.
6. moisture-proof LED support as claimed in claim 2, which is characterized in that the side of the positive electrode substrate and the negative electrode substrate
When all there is the target side in face, in the side that is contacted with the enclosure wall body in the positive electrode substrate and the negative electrode substrate
With target side described at least one；
And/or
The side that the positive electrode substrate and the negative electrode substrate are contacted with the insulating isolation belt is the target side.
7. moisture-proof LED support as claimed in claim 4, which is characterized in that the connection transition region is inclined-plane, arcwall face, or
For combinatorial surface, the combinatorial surface be include plane, inclined-plane, at least two combination in arcwall face.
8. such as the described in any item moisture-proof LED supports of claim 1-7, which is characterized in that the plane where the functional areas is high
Plane where the enclosure wall contact zone.
9. such as the described in any item moisture-proof LED supports of claim 1-7, which is characterized in that the target side is curved surface；
Or,
The target side be include plane, inclined-plane, at least two combinatorial surfaces being combined in arcwall face.
10. moisture-proof LED support as claimed in claim 9, which is characterized in that when the target side is curved surface, the target
Side is arc-shaped curved surface.
11. moisture-proof LED support as claimed in claim 9, which is characterized in that the target side be include plane, inclined-plane, arc
At least two in shape face be combined combinatorial surface when, the target side be include plane, inclined-plane, in arcwall face at least
Two staging pack faces being combined.
12. moisture-proof LED support as claimed in claim 11, which is characterized in that the staging pack face is by transverse plane and erects flat
Face and the arcwall face connected between the transverse plane and the upright plane form.
13. a kind of LED, which is characterized in that including the described in any item moisture-proof LED supports of such as claim 1-12 and at least one
LED chip, the LED chip are set on the positive electrode substrate and/or the negative electrode substrate, and the anode of the LED chip draws
Foot and negative pin are electrically connected with the positive electrode substrate and the negative electrode substrate respectively.
14. a kind of light emitting device, which is characterized in that including LED as claimed in claim 13, the light emitting device is illumination dress
It sets, optical signal instruction device, light compensating apparatus or back lighting device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821419017 | 2018-08-30 | ||
| CN2018214190170 | 2018-08-30 |
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| CN201821484242.2U Active CN209266437U (en) | 2018-08-30 | 2018-09-11 | Moisture-proof LED support, LED and light emitting device |
| CN201811054876.9A Pending CN110875415A (en) | 2018-08-30 | 2018-09-11 | Dampproofing LED support, LED and illuminator |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201811054876.9A Pending CN110875415A (en) | 2018-08-30 | 2018-09-11 | Dampproofing LED support, LED and illuminator |
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| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
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2018
- 2018-09-11 CN CN201821484242.2U patent/CN209266437U/en active Active
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|---|---|---|---|---|
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
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