CN111162152A - COB packaging substrate and structure - Google Patents
COB packaging substrate and structure Download PDFInfo
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- CN111162152A CN111162152A CN202010005256.7A CN202010005256A CN111162152A CN 111162152 A CN111162152 A CN 111162152A CN 202010005256 A CN202010005256 A CN 202010005256A CN 111162152 A CN111162152 A CN 111162152A
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- substrate
- cob
- cob package
- packaging
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The application provides a COB packaging substrate and structure relates to COB packaging technology field, particularly, relates to a COB packaging substrate and structure. The COB packaging substrate comprises a first substrate and a second substrate, wherein the second substrate is sleeved outside the first substrate to form a packaging substrate; the packaging substrate is used for laying a circuit layer, and the first substrate is used for mounting the light-emitting chip. The application provides a COB packaging substrate has the advantage that the encapsulation cost is lower with the structure.
Description
Technical Field
The application relates to the technical field of COB (chip on board) packaging, in particular to a COB packaging substrate and a structure.
Background
COB (chip On Board light) light source is a high light efficiency integrated surface light source technology for directly pasting an LED chip On a mirror surface metal substrate with high light reflection rate, and the technology eliminates a bracket concept, and has no electroless plating, reflow soldering and pasting processes, so that the processes are reduced by nearly one third, and the cost is also saved by one third. The COB light source can be simply understood as a high-power integrated surface light source, and the light emitting area and the overall dimension of the light source can be designed according to the product overall structure.
However, in order to reduce defects after COB packaging, the material of the substrate used for COB packaging needs to be limited, and generally, a metal, ceramic, or FR4 (flame retardant material grade code) material is selected as the substrate material. Currently, the COB package generally packages the light emitting chip on the whole substrate, so the packaging cost is high, and the packaged finished product is expensive.
Disclosure of Invention
An object of this application is to provide a COB packaging substrate and structure to solve the higher problem of packaging cost among the prior art.
In order to achieve the above purpose, the embodiments of the present application employ the following technical solutions:
in a first aspect, an embodiment of the present application provides a COB package substrate, where the COB package substrate includes a first substrate and a second substrate, and the second substrate is sleeved outside the first substrate to form a package substrate; wherein the content of the first and second substances,
the packaging substrate is used for laying a circuit layer, and the first substrate is used for mounting a light-emitting chip.
Further, a metal slurry layer is filled at the joint of the first substrate and the second substrate.
Furthermore, a first step structure is arranged at the edge of the first substrate, a hollowed-out mounting area is arranged at the middle position of the second substrate, a second step structure is arranged at the edge of the mounting area, the first step structure and the second step structure are the same in size, and the first substrate and the second substrate are connected through the first step structure and the second step structure.
Furthermore, the edge of the first substrate is provided with a groove, the middle position of the second substrate is provided with a hollowed-out mounting area, the edge of the mounting area is provided with a protrusion, the groove is the same as the protrusion in size, and the first substrate is connected with the second substrate through the groove and the protrusion.
Further, the materials for manufacturing the first substrate include metal, ceramic and FR4 material.
Further, the first substrate and the second substrate are soldered by eutectic soldering or solder paste.
On the other hand, this application provides a COB packaging structure, COB packaging structure includes luminescent chip, circuit layer and foretell COB package substrate, the circuit layer lay in on the package substrate, luminescent chip install in on the first base plate.
Further, COB packaging substrate still includes box dam and packaging colloid, the box dam cover is located outside the packaging substrate, the packaging colloid cover in the surface of emitting chip.
Compared with the prior art, the method has the following beneficial effects:
the application provides a COB packaging substrate and a structure, wherein the COB packaging substrate comprises a first substrate and a second substrate, and the second substrate is sleeved outside the first substrate to form a packaging substrate; the packaging substrate is used for laying a circuit layer, and the first substrate is used for mounting the light-emitting chip. Because this application provides COB packaging substrate inlays by first base plate and second base plate and establishes and forms, consequently different materials can be chooseed for use to first base plate and second base plate, and, because luminous chip installs on first base plate, consequently only need select the material of appropriate first base plate according to conventional COB light source encapsulation information such as the power size of COB light source, chip type, chip mode of arrangement, and use ordinary second base plate, can realize COB encapsulation promptly, and the cost is lower.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and it will be apparent to those skilled in the art that other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural view of a COB package substrate provided in an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a COB package structure provided in an embodiment of the present application.
Fig. 3 is another schematic structural diagram of a COB package structure according to an embodiment of the present disclosure.
In the figure: a 100-COB package substrate; 110-a first substrate; 120-a second substrate; 200-COB package structure; 210-a chip; 220-a box dam; 230-encapsulating glue.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
In the description of the present application, it should be noted that the terms "upper", "lower", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used only for convenience in describing the present application and for simplification of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present application.
In the description of the present application, it is also to be noted that, unless otherwise explicitly specified or limited, the terms "disposed" and "connected" are to be interpreted broadly, e.g., as being either fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
First embodiment
As described in the background art, in order to make the defects after COB packaging smaller, the material of the substrate used in COB packaging needs to be limited, and generally, the material of the substrate is selected from metal, ceramic or FR4 (code of flame-retardant material grade). Currently, the COB package generally packages the light emitting chip on the whole substrate, so the packaging cost is high, and the packaged finished product is expensive.
In view of this, the present application provides a COB package substrate, which utilizes a manner that a first substrate and a second substrate are spliced to form a package substrate and a light emitting chip is packaged on the first substrate, so as to achieve the purpose of reducing the packaging cost.
The following is an exemplary description of the COB package substrate provided in the present application:
referring to fig. 1, as an alternative implementation manner, the COB package substrate 100 includes a first substrate 110 and a second substrate 120, and the second substrate 120 is sleeved outside the first substrate 110 to form a package substrate; the package substrate is used for laying a circuit layer, and the first substrate 110 is used for mounting the light emitting chip 210.
Optionally, in the present application, a suitable material of the first substrate 110 may be selected according to the power of the COB light source, the type of the chip 210, the arrangement of the chip 210, and other conventional COB light source packaging information. The material for manufacturing the first substrate 110 includes metal, ceramic and FR4 material, and the material for manufacturing the second substrate 120 is a common substrate material. Since the first substrate 110 is used for mounting the light emitting chip 210, the application only needs to select the expensive material for the first overtime material, and the common substrate material for the second substrate 120, so as to achieve the effect of saving the package cost.
And, because the COB base plate that this application provided adopts multiple material concatenation to form, consequently it both can supply COB light source encapsulation to use like ordinary base plate, compromise heat conduction, reflection of light, electric conduction, cost advantage simultaneously.
Wherein, mode preparation COB packaging substrate 100 that this application adopted the cover to establish, according to the size and the thickness of first base plate 110 promptly, excavate at second base plate 120 and can supply first base plate 110 to embed, firmly link with processes such as eutectic bonding process or tin cream welding at first base plate 110 and second base plate 120 junction, make two base plates form holistic COB packaging substrate 100.
As a possible implementation manner, the edge of the first substrate 110 is provided with a first step structure, the middle position of the second substrate 120 is provided with a hollowed-out mounting area, the edge of the mounting area is provided with a second step structure, the first step structure and the second step structure have the same size, and the first substrate 110 is connected with the second substrate 120 through the first step structure and the second step structure. In other words, the first substrate 110 and the second substrate 120 are clamped by the first step structure and the second step structure.
As another possible implementation manner, a groove is formed in an edge of the first substrate 110, a hollow-out mounting area is formed in a middle position of the second substrate 120, a protrusion is formed on an edge of the mounting area, the groove and the protrusion have the same size, and the first substrate 110 is connected with the second substrate 120 through the groove and the protrusion.
Certainly, in some other embodiments, the first substrate 110 and the second substrate 120 may also be connected in other manners, for example, the edge of the first substrate 110 is set as an inclined plane, the edge of the hollow-out mounting area of the second substrate 120 is also set as an inclined plane, and the first substrate 110 and the second substrate 120 are pressed together by the cooperation of the inclined planes, so as to realize the connection between the first substrate 110 and the second substrate 120, which is not limited in any way in the present application.
Generally, a groove may occur at the connection of the first substrate 110 and the second substrate 120, which is not reliable for plating a metal layer on the package substrate at a later stage. In view of this, the present application fills a metal paste layer at the connection between the first substrate 110 and the second substrate 120, so that no recess occurs in the substrates.
Through the implementation mode, the first substrate 110 can ensure that the function of the main function area reaches the standard, the cost can be saved in the first substrate 110 area, the use is convenient, the use is not different from that of a conventional substrate, and the manufacturing process and equipment cost are not required to be added. Meanwhile, the COB package substrate 100 provided by the application is convenient to manufacture, the existing processes can be met, and industrialization can be rapidly formed.
Second embodiment
Referring to fig. 2 and 3, the present embodiment further provides a COB package structure 200, where the COB package structure 200 includes a light-emitting chip 210, a circuit layer and the COB package substrate 100 according to the first embodiment, the circuit layer is disposed on the package substrate, and the light-emitting chip 210 is mounted on the first substrate 110.
The COB package substrate 100 further includes a dam 220 and a molding compound 230, wherein the dam 220 is sleeved outside the package substrate, and the molding compound 230 covers the surface of the light emitting chip 210.
In summary, the present application provides a COB package substrate and a structure thereof, where the COB package substrate includes a first substrate and a second substrate, and the second substrate is sleeved outside the first substrate to form a package substrate; the packaging substrate is used for laying a circuit layer, and the first substrate is used for mounting the light-emitting chip. Because this application provides COB packaging substrate inlays by first base plate and second base plate and establishes and forms, consequently different materials can be chooseed for use to first base plate and second base plate, and, because luminous chip installs on first base plate, consequently only need select the material of appropriate first base plate according to conventional COB light source encapsulation information such as the power size of COB light source, chip type, chip mode of arrangement, and use ordinary second base plate, can realize COB encapsulation promptly, and the cost is lower.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
It is obvious to a person skilled in the art that the present application is not restricted to details of the above-described exemplary embodiments, but that it can be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. A COB package substrate is characterized by comprising a first substrate and a second substrate, wherein the second substrate is sleeved outside the first substrate to form a package substrate; wherein the content of the first and second substances,
the packaging substrate is used for laying a circuit layer, and the first substrate is used for mounting a light-emitting chip.
2. The COB package substrate of claim 1, wherein a joint of the first substrate and the second substrate is filled with a metal paste layer.
3. The COB package substrate of claim 1, wherein an edge of the first substrate is provided with a first step structure, a middle position of the second substrate is provided with a hollowed-out mounting area, an edge of the mounting area is provided with a second step structure, the first step structure and the second step structure are the same in size, and the first substrate and the second substrate are connected through the first step structure and the second step structure.
4. The COB package substrate of claim 1, wherein a groove is formed in an edge of the first substrate, a hollowed-out mounting area is formed in a middle position of the second substrate, a protrusion is formed in an edge of the mounting area, the groove and the protrusion are the same in size, and the first substrate and the second substrate are connected through the groove and the protrusion.
5. The COB package substrate of claim 1, wherein the first substrate is made of a material including metal, ceramic, and FR4 material.
6. The COB package substrate of claim 1, wherein the first substrate and the second substrate are bonded by eutectic bonding or solder paste.
7. A COB package structure, characterized in that COB package structure includes light-emitting chip, circuit layer and claim 1 ~ 6 any the COB package substrate, the circuit layer lays on the package substrate, light-emitting chip installs on first base plate.
8. The COB package structure of claim 7, wherein the COB package substrate further includes a dam and an encapsulant, the dam is sleeved outside the package substrate, and the encapsulant covers the surface of the light emitting chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010005256.7A CN111162152A (en) | 2020-01-03 | 2020-01-03 | COB packaging substrate and structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010005256.7A CN111162152A (en) | 2020-01-03 | 2020-01-03 | COB packaging substrate and structure |
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| CN111162152A true CN111162152A (en) | 2020-05-15 |
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| CN202010005256.7A Pending CN111162152A (en) | 2020-01-03 | 2020-01-03 | COB packaging substrate and structure |
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Application publication date: 20200515 |