CN1697204A - Support of light emitting diode and preparation method - Google Patents
Support of light emitting diode and preparation method Download PDFInfo
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- CN1697204A CN1697204A CN 200510021033 CN200510021033A CN1697204A CN 1697204 A CN1697204 A CN 1697204A CN 200510021033 CN200510021033 CN 200510021033 CN 200510021033 A CN200510021033 A CN 200510021033A CN 1697204 A CN1697204 A CN 1697204A
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- circuit board
- electrode
- led support
- negative electrode
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Abstract
The method includes following steps: (1) circuit board with electrodes is fabricated from organic resin covered metal foil plate through printing circuit technique; (2) making through hole on circuit board; (3) fixing copper piece inside the through hole. The bracket of light emitting diode includes copper piece, circuit board, as well as positive and negative electrodes. Both positive electrode and negative electrode includes face electrode, bottom electrode, and side electrode, which are printed on top, side and bottom surface at end part of the circuit board. The side electrode is connected to the face electrode and bottom electrode. Based on need, circuit board and copper piece in different shapes are easy to be prepared. Thus, outline of bracket is easy to be changed so as to provide good adaptability for subsequent handling, reduce dependability on die set.
Description
[technical field]
The present invention relates to the large-power light-emitting diodes field, especially about a kind of support of large-power light-emitting diodes.
[background technology]
Light-emitting diode (claiming LED again) support is the supporting body of semiconductor light emitting chip, and it bears fixed chip, chip is connected with external circuit and effect that the heat that produced during with chip operation conducts away.
Fig. 1 and Fig. 2 have disclosed the structure of first kind of existing LED support, and it is that plastic cement and copper spare are combined.This LED support comprises electrode 11, colloid 12 and copper spare 13, and electrode 11 is positioned at colloid 12 both sides and is integrated injection molding with colloid 12, and the middle position of colloid 12 is provided with open-work 121, and copper spare 13 is installed in this open-work 121.The manufacture method of this kind support is as follows: utilize mould to go out the copper plate electrode of platoon, with the plastic cement mould platoon electrode is formed the some groups of assemblies that are made of copper plate electrode and plastic cement with the mode of plastic cement injection mo(u)lding then, stay special-shaped open-work on these assemblies in advance; Go out copper spare (being heat sink body) with mould in addition, this copper spare can be pressed into the special-shaped open-work of reserving on the assembly also can closely cooperate with this open-work.During use, chip is fixed on the copper spare of silver-plated processing, then the copper spare of microarray strip is compressed into toward the plastic cement electrode assemblie, just make a large-power light-emitting diodes through subsequent technique again.But there is following shortcoming in this kind support: use mould too much, have high input, encapsulation frock clamp required precision height, follow-up finished product also must could use by mould molding when using, and causes use to bother.Because strong to the mould dependence, thereby the profile variation is not easy.
Fig. 3 and Fig. 4 have disclosed second kind of existing light-emitting diode support structure, and it is the Metal Substrate template.This LED support comprises Metal Substrate copper clad aluminum plate 22, insulating barrier 23 and is produced on electrode 211,212 on the circuit board.The manufacture method of this support is as follows: make electrode 211,212 with Metal Substrate copper clad aluminum plate 22 through printed circuit board process, 211,212 of positive and negative electroplaxs process one solid brilliant with blind hole or stay next solid brilliant position 221, after consolidating crystalline substance in blind hole or on the solid brilliant position then, the lead-out wire of chip is bonded on the electrode on blind hole 221 (Gu brilliant position) limit, just makes a large-power light-emitting diodes through subsequent technique again.But there is following shortcoming in this kind support: 1) because metal-sheet edges is a conductor, make the lateral electrode difficulty, thereby LED is connected the palpus wire jumper with external circuit; 2) in addition, as making support of aluminium base, then consolidating brilliant blind hole surface treatment difficulty, as making support with copper base, the material price costliness.
Fig. 5 and Fig. 6 have disclosed the structure of the third existing LED support, and it is a ceramic mould.The manufacture method of this kind support is as follows: the size according to design is made embryo with mould, through making required printed circuit board after with thick film or ceramic surface metallization behind the sintering, on circuit board 32, make electrode 311,312, solid brilliant on the solid brilliant position 321 of the ceramic circuit board 32 that makes then, just make great power LED through subsequent technique.But there is following shortcoming in this kind support: 1) the special mould system embryo sintering of palpus, and the profile variation flexibility is low; 2) adopt then poor thermal conductivity of low-cost pottery, adopt the ceramic cost of good heat conductivity too high.
[summary of the invention]
The object of the present invention is to provide LED support that a kind of manufacturing process is simple, cost is low, applicability is good and profile changes easily and preparation method thereof.
The object of the present invention is achieved like this: the manufacture method of this LED support is with the carrier of electroded organic resin base circuit board as carrying copper spare.
The manufacture method of this a kind of LED support comprises following process: the circuit board of 1) organic resin base clad with metal foil plate being made the band positive and negative electrode by printed circuit board technology; 2) make open-work in the part of circuit board between positive and negative electrode; 3) copper spare is fixed in the described open-work.
Described positive and negative electrode is formed at the surface at circuit board both ends respectively.
Described positive and negative electrode all is formed at the top surface of battery lead plate end.
Described positive and negative electrode also is formed on circuit board end and the side surface that top surface is connected.
Described positive and negative electrode also is formed on circuit board end and the basal surface that side surface is connected.
The base material of described circuit board is an organic resin base clad with metal foil plate.
This LED support comprises copper spare and circuit board, and this circuit board is provided with open-work, and copper spare is fixed in this open-work, is manufactured with positive and negative electrode by printed circuit board technology on this circuit board.
Described positive and negative electrode includes face electrode, hearth electrode and connects the lateral electrode of this face, hearth electrode, and this face electrode, lateral electrode and hearth electrode are made in top surface, side surface and the basal surface of circuit board end respectively.
Be equipped with easy fault trough on the described positive and negative electrode.
Compared with prior art, the present invention has following advantage: because circuit board and copper spare are made into different shape as required easily, so this contoured cradle changes easily, the light-emitting diode subsequent handling there is applicability preferably, and it is low to the dependence of mould to add man-hour, reduce production cost, simplified manufacturing process.
[description of drawings]
Fig. 1 is the structure charts of a plurality of first kind of prior art LED support when connecting one.
Fig. 2 is the structure chart of first kind of prior art LED support.
Fig. 3 is the structure chart of second kind of prior art LED support.
Fig. 4 is the structure chart of a plurality of LED support of being in array-like arrangement.
Fig. 5 and Fig. 6 are the structural representations of two different angles of the LED support of the third prior art.
Fig. 7 is the cutaway view of LED support of the present invention.
Fig. 8 is the structural representation of another angle of LED support of the present invention.
Fig. 9 is the structure chart of a plurality of LED support of the present invention of being in array-like arrangement.
Figure 10 is the flow chart of the manufacture method of LED support of the present invention.
[embodiment]
See also Fig. 7 to Figure 10, the manufacture method of a kind of LED support of the present invention comprises following process: 1) organic resin base clad with metal foil plate is made into electroded circuit board 4 by printed circuit board technology; 2) on circuit board 4, make open-work 43; 3) copper spare 6 is fixed in the described open-work 43.After forming, this support chip can be fixed on the copper spare.In the step 1), all make electrode 5 by printed circuit board technology on the surface at circuit board both ends, in the present embodiment, electrode is the etching formation on circuit board by existing printed circuit board technology; At top surface 411, the basal surface 413 of battery lead plate 4 ends and connect on the side surface 412 of this top, basal surface and all be manufactured with electrode 5.
See also Fig. 7 to Fig. 9, during production in enormous quantities, can make several LED support on a circuit board 7, it comprises following process: 1) organic resin base clad with metal foil plate is made into circuit board 7 with some electrodes by printed circuit board technology, these some electrodes 5 are arranged in array; 2) produce open-work 43 on circuit board, each open-work 43 is all in same row between the two adjacent electrodes 5; 3) symmetry axis along each electrode 5 mills out easy fault trough 53 on circuit board 7; 4) circuit board 7 is cut into strip; 5) separate each strip circuit board and form some circuit board monomers 4 along each easy fault trough 53; 6) copper spare 6 is fixed in the open-work 43 of each circuit board monomer 4.Easily fault trough 53 can be " V " type, sawtooth pattern, shape such as round.
A kind of LED support of the present invention comprises circuit board 4 and the copper spare 6 with electrode 5.Circuit board 4 can adopt existing organic resin base cladded aluminum foil or copper foil plate to make base material, also can be other organic resin base clad with metal foil plate certainly.The middle position of this circuit board runs through and is provided with open-work 43, and this open-work 43 is roughly stepped, and certainly, this open-work can be made into other shape as required.Electrode 5 is produced on the electrode of making on 41,42, two ends 41,42, both ends of circuit board 4 length directions 4 and is respectively positive and negative electrode 51,52 by printed circuit board technology, this positive and negative electrode 51,52 is used for electrically connecting with the positive and negative electrode of chip.Positive and negative electrode 51,52 includes three parts, it is respectively face electrode 511,521, lateral electrode 513,523 and hearth electrode 512,522, face electrode 511,521 and hearth electrode 512,522 are produced on the top surface 411 and basal surface 413 of circuit board 4 ends, lateral electrode 513,523 is produced on the side surface 412 of circuit board 4 ends, and lateral electrode 513 connected surface electrodes 511 and hearth electrode 512, lateral electrode 523 connected surface electrodes 521 and hearth electrode 522, thus face electrode, lateral electrode and hearth electrode one are connected.Because top surface 411, side surface 412 and the basal surface 413 of the end of circuit board 4 all are manufactured with electrode 5, so that production technology has been simplified in the welding of electrode 5.
Copper spare 6 surfaces are through silver-plated processing, its roughly stepped and with the shape of open-work 43 and size coupling, this copper spare 6 can fixedly be embedded in the open-work 43, thereby make described LED support, certainly, this copper spare also can be designed to other shape as required.After making support, chip can be fixed on (promptly solid brilliant) on the top surface of copper spare.In the present embodiment, copper spare 6 also can be metalworks such as silver, gold, magnesium or aluminium.
When producing in enormous quantities, also can on a circuit board 7, form several LED support.In this way, this circuit board 7 comprises the circuit board monomer 4 that some one-tenth array-likes distribute, the middle position of each circuit board monomer 4 all runs through and is provided with open-work 43, and is printed with electrode 5 between same row's adjacent circuit plate monomer 4, and the centre position of this electrode 5 mills out easy fault trough 53.By this kind design, when forming single LED support, only need to use suitable dynamics to act on easy fault trough 53 parts, can realize the separation between each circuit board monomer 4, and in this process, electrode 5 separated into two parts between the adjacent circuit plate monomer 4 make the both ends of each circuit board monomer 4 that electrode all be arranged.
Because adopt the organic resin base circuit board to make the circuit structure of support, copper spare is done heat sink.The organic resin base circuit board very easily carries out machining, and small lot is made and during sample making, geometry need only just can be made quickly and accurately through numerical controlled machinery processing, and must mould; Copper spare also can be easy to machining and come out.Therefore its profile, size can easily change according to follow-up use needs; Produce a less investment, it is fast to go into operation.Also only need two stamping dies as producing in enormous quantities, thereby die cost is also very low when producing in enormous quantities.
Because adopt the organic resin circuit board to make the circuit structure of support, the processing technology of employing is the printed circuit board machining process, assembly is linked to be row, be linked to be bar, join together very flexibly, only depends on subsequent production to set type and gets final product; Chip is connected with external circuit with number of electrodes what and form, also only depends on subsequent production to set type and gets final product.
Owing to adopt the organic resin base circuit board to make the circuit structure of support,, just make lateral electrode easily and the circuit structure system is become the SMD patch-type with the hole metallization method of printed circuit manufacture craft.Therefore make finished product light-emitting diode and external circuit ease of connection, subsequent product is produced the efficient height in batches.
The LED finished product of making owing to platoon, in flakes or during latticing processing support, milled out the easy fault trough of zigzag between monomer, need only just can be folded down when single-piece is used with suitable dynamics.
Adopt copper to make heat sink thermal conductivity height (more than the 300w/mk), thermal resistance almost is zero.
It is extremely low to the dependence of mould that LED support of the present invention adds man-hour, not only reduced production cost, contoured cradle and chip are connected with external circuit with number of electrodes what and form, also can change without scruple according to the needs of follow-up finished product, have the stronger adaptability to follow-up use.
Claims (10)
1. the manufacture method of a LED support is characterized in that: it is with the carrier of electroded organic resin base circuit board as carrying copper spare.
2. the manufacture method of a LED support, it is characterized in that: it comprises following process: the circuit board of 1) organic resin base clad with metal foil plate being made the band positive and negative electrode by printed circuit board technology;
2) make open-work in the part of circuit board between positive and negative electrode; 3) copper spare is fixed in the described open-work.
3. the manufacture method of a kind of LED support as claimed in claim 1, it is characterized in that: described positive and negative electrode is formed at the surface at circuit board both ends respectively.
4. the manufacture method of a kind of LED support as claimed in claim 3, it is characterized in that: described positive and negative electrode all is formed at the top surface of battery lead plate end.
5. the manufacture method of a kind of LED support as claimed in claim 4 is characterized in that: described positive and negative electrode also is formed on circuit board end and the side surface that top surface is connected.
6. the manufacture method of a kind of LED support as claimed in claim 5 is characterized in that: described positive and negative electrode also is formed on circuit board end and the basal surface that side surface is connected.
7. as the manufacture method of any described a kind of LED support among the claim 2-6, it is characterized in that: the base material of described circuit board is an organic resin base clad with metal foil plate.
8. LED support, it is characterized in that: comprise copper spare and circuit board, this circuit board is provided with open-work, and copper spare is fixed in this open-work, is manufactured with positive and negative electrode by printed circuit board technology on this circuit board.
9. a kind of LED support as claimed in claim 8, it is characterized in that: described positive and negative electrode includes face electrode, hearth electrode and connects the lateral electrode of this face, hearth electrode, and this face electrode, lateral electrode and hearth electrode are made in top surface, side surface and the basal surface of circuit board end respectively.
10. a kind of as claimed in claim 8 or 9 LED support is characterized in that: be equipped with easy fault trough on the described positive and negative electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100210335A CN100386897C (en) | 2005-05-31 | 2005-05-31 | Support of light emitting diode and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100210335A CN100386897C (en) | 2005-05-31 | 2005-05-31 | Support of light emitting diode and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1697204A true CN1697204A (en) | 2005-11-16 |
| CN100386897C CN100386897C (en) | 2008-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100210335A Active CN100386897C (en) | 2005-05-31 | 2005-05-31 | Support of light emitting diode and preparation method |
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| CN (1) | CN100386897C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102097576A (en) * | 2010-12-30 | 2011-06-15 | 江苏欣力光电有限公司 | Light emitting diode (LED) copper bracket |
| CN102185085A (en) * | 2011-05-03 | 2011-09-14 | 安徽莱德光电技术有限公司 | High-power LED (Light Emitting Diode) encapsulating bracket |
| CN103000772A (en) * | 2011-09-13 | 2013-03-27 | 复盛精密工业股份有限公司 | Light emitting diode support structure manufacturing method |
| CN101490702B (en) * | 2006-06-19 | 2013-07-17 | 纳格雷德股份有限公司 | Method of manufacturing cards comprising at least one electronic module, assembly produced during this method and intermediate products |
| CN104576904A (en) * | 2013-10-15 | 2015-04-29 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN105957787A (en) * | 2016-06-17 | 2016-09-21 | 深圳市槟城电子有限公司 | Assembly for gas discharge tube, gas discharge tube and integrated part of gas discharge tube |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW521409B (en) * | 2000-10-06 | 2003-02-21 | Shing Chen | Package of LED |
| JP4045781B2 (en) * | 2001-08-28 | 2008-02-13 | 松下電工株式会社 | Light emitting device |
| CN1206749C (en) * | 2002-01-21 | 2005-06-15 | 诠兴开发科技股份有限公司 | Method for package of high power LED |
| JP4039552B2 (en) * | 2002-03-01 | 2008-01-30 | シチズン電子株式会社 | Manufacturing method of surface mount type light emitting diode |
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2005
- 2005-05-31 CN CNB2005100210335A patent/CN100386897C/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101490702B (en) * | 2006-06-19 | 2013-07-17 | 纳格雷德股份有限公司 | Method of manufacturing cards comprising at least one electronic module, assembly produced during this method and intermediate products |
| CN102097576A (en) * | 2010-12-30 | 2011-06-15 | 江苏欣力光电有限公司 | Light emitting diode (LED) copper bracket |
| CN102185085A (en) * | 2011-05-03 | 2011-09-14 | 安徽莱德光电技术有限公司 | High-power LED (Light Emitting Diode) encapsulating bracket |
| CN103000772A (en) * | 2011-09-13 | 2013-03-27 | 复盛精密工业股份有限公司 | Light emitting diode support structure manufacturing method |
| CN104576904A (en) * | 2013-10-15 | 2015-04-29 | 展晶科技(深圳)有限公司 | Light emitting diode packaging structure and manufacturing method thereof |
| CN104576904B (en) * | 2013-10-15 | 2017-09-19 | 展晶科技(深圳)有限公司 | Package structure for LED and its manufacture method |
| CN105957787A (en) * | 2016-06-17 | 2016-09-21 | 深圳市槟城电子有限公司 | Assembly for gas discharge tube, gas discharge tube and integrated part of gas discharge tube |
| CN105957787B (en) * | 2016-06-17 | 2024-03-29 | 深圳市槟城电子股份有限公司 | Assembly for gas discharge tube, gas discharge tube and integrated piece thereof |
| CN111162152A (en) * | 2020-01-03 | 2020-05-15 | 广东省半导体产业技术研究院 | COB packaging substrate and structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100386897C (en) | 2008-05-07 |
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Owner name: SHENZHEN KERUI ELECTRONIC INDUSTRIAL CO., LTD. Free format text: FORMER OWNER: LI FENG Effective date: 20090424 |
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Effective date of registration: 20090424 Address after: Baoan District Fuyong Town, Shenzhen city of Guangdong province and new HUAFA Industrial Park fifth Patentee after: Shenzhen Kerui Electronic Industrial Co.,Ltd. Address before: 504, South Garden, Shekou Bay Garden, Shenzhen, Guangdong, Nanshan District Patentee before: Li Feng |
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| CP03 | Change of name, title or address |
Address after: Baoan District Fuyong Town, Shenzhen city of Guangdong province and 518000 new HUAFA Industrial Park building A5 Patentee after: Shenzhen hi tech materials Limited by Share Ltd Address before: Baoan District Fuyong town Shenzhen city Guangdong province 518000 new and HUAFA Industrial Park fifth Patentee before: Shenzhen Kerui Electronic Industrial Co.,Ltd. |
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| CP03 | Change of name, title or address |