CN216054689U - High-power module structure - Google Patents
High-power module structure Download PDFInfo
- Publication number
- CN216054689U CN216054689U CN202122657315.1U CN202122657315U CN216054689U CN 216054689 U CN216054689 U CN 216054689U CN 202122657315 U CN202122657315 U CN 202122657315U CN 216054689 U CN216054689 U CN 216054689U
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- China
- Prior art keywords
- frame body
- pin group
- power module
- circuit board
- lead
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
- H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model relates to the field of intelligent power modules, in particular to a high-power module structure, which comprises a lead frame structure, wherein the lead frame structure comprises a single frame structure, the single frame structure comprises a frame body, and a pin group is arranged on the frame body; the frame body is provided with a circuit board and a substrate; the frame body is provided with a fixing mechanism for mounting a circuit board; the fixing mechanism comprises an extrusion part, and the extrusion part comprises an extrusion plate arranged on the frame body. The utility model discloses a high-power module structure, which is convenient for determining the interval of each pin according to the requirement through the design of multiple pins and can increase the application range of the high-power module structure.
Description
Technical Field
The utility model relates to the field of intelligent power modules, in particular to a high-power module structure.
Background
According to the requirements of application markets, the development direction of the current power device tends to modularization, compounding and high integration, and the intelligent power module with high integration is more and more widely applied to the field of power electronics.
However, due to the limitation of each technology, most of the smart power modules in the market are concentrated in a small power section below 30A, and the high power section of 50A-75A is almost blank, wherein the lead frame is used as a key structural member for manufacturing the smart power modules and needs to be synchronously designed and produced.
The current lead frame is designed for matching an intelligent module of a power section below 30A, the volume of a single product is relatively small, the size of a chip capable of bearing the lead frame is limited, the wire diameter and the number of the wires which can be welded at the pin lead part can not be matched with the product of a larger power section, meanwhile, the whole thickness of the current lead frame is mostly below 0.508mm, the overcurrent capacity is relatively insufficient, and the application environment and the packaging requirements of the power section of 50-75A can not be met.
In addition, when the traditional lead frame is connected with a circuit board, a fixing structure is lacked, and the circuit board and the lead frame are easy to misplace and incline when being connected and assembled, so that the subsequent wire bonding operation is influenced.
It is therefore necessary to optimize the design of the existing modular structural components in order to better facilitate the production of high power modular structures.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects of the prior art and provide a module structure convenient for positioning and mounting a circuit board.
In order to achieve the purpose, the utility model adopts the technical scheme that:
a high-power module structure comprises a lead frame structure, wherein the lead frame structure comprises a single frame structure, the single frame structure comprises a frame body, and a pin group is arranged on the frame body; the frame body is provided with a circuit board and a substrate; the frame body is provided with a fixing mechanism for mounting a circuit board; the fixing mechanism comprises an extrusion part, and the extrusion part comprises an extrusion plate arranged on the frame body; the pin group comprises a first pin group and a second pin group; the first pin group is connected with the circuit board through a first lead, and the circuit board is connected with the substrate through a second lead; the substrate is connected with the second pin group; the first pin group and the second pin group are distributed at two opposite ends of the frame body; the first pin group comprises a plurality of first outer pins and a plurality of first inner pins; the second lead group comprises a plurality of second outer leads and a plurality of second inner leads.
The plurality of first outer pins in the first pin group are connected with the plurality of first inner pins through first connecting ribs.
And the plurality of second outer pins in the second pin group are connected with the plurality of second inner pins through second connecting ribs.
And at least two second inner pins in the second pin group are provided with connecting pins.
Each fixing mechanism comprises two extruding parts which are symmetrically distributed at intervals.
One end of each extrusion plate is connected to the edge of the frame body; the other end extends freely; the extrusion plate comprises a connecting plate, and two jacking plates are arranged at the free end of the connecting plate.
The two top pressure plates are distributed in a splayed shape.
The frame body is provided with a sinking groove for placing the substrate.
The frame body is provided with a conveying hole.
And the frame body is provided with a glue inlet hole.
The utility model has the advantages that;
the utility model discloses a high-power module structure, which is convenient for determining the interval of each pin according to the requirement and can increase the application range of the high-power module structure through the design of multiple pins.
Drawings
The contents of the expressions in the various figures of the present specification and the labels in the figures are briefly described as follows:
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural diagram of a lead frame structure according to the present invention.
Fig. 3 is a front view of the securing mechanism of the present invention.
Fig. 4 is a left side view of the securing mechanism of the present invention.
The labels in the above figures are:
1. monomer frame construction, 2, first pin group, 3, second pin group, 4, advance gluey hole, 5, transfer port, 6, fixed establishment, 7, circuit board, 8, base plate.
Detailed Description
The following description of preferred embodiments of the utility model will be made in further detail with reference to the accompanying drawings.
A high-power module structure comprises a lead frame structure 1-1, wherein the lead frame structure 1-1 comprises a single frame structure 1, the single frame structure 1 comprises a frame body 11, and a pin group is arranged on the frame body 11; the frame body 11 is provided with a circuit board 8 and a substrate 7; the frame body 11 is provided with a fixing mechanism 6 for mounting a circuit board 8; the fixing mechanism 6 includes a pressing portion including a pressing plate provided on the frame body 11; the pin group comprises a first pin group 2 and a second pin group 3; the first pin group 2 is connected with a circuit board 8 through a first lead, and the circuit board 8 is connected with the substrate 7 through a second lead; the substrate 7 is connected with the second pin group 3; the first pin group 2 and the second pin group 3 are distributed at two opposite ends of the frame body 11; the first lead group 2 includes a plurality of first outer leads 21 and a plurality of first inner leads 22; the second pin group 3 includes a plurality of second outer pins 31 and a plurality of second inner pins 32; the utility model discloses a high-power module structure, which is convenient for determining the interval of each pin according to the requirement and can increase the application range of the utility model through the design of multiple pins, in addition, the number of the single frame structures 1 can be set according to the requirement, so that high-power modules of different models can be conveniently produced, in addition, each single frame structure 1 is provided with a fixing mechanism 6, and the circuit board 8 arranged in a frame body 11 is convenient for mounting and positioning through the arrangement of the fixing mechanisms 6, so that the circuit board 8 is convenient for mounting and fixing on the frame body 11.
Specifically, the main lead frame structure 1-1 of the high-power module structure disclosed by the utility model is characterized in that the lead frame structure 1-1 comprises a plurality of single frame structures 1, each single frame structure 1 comprises a frame body 11, and the arrangement of the frame bodies 11 facilitates the placement of a circuit board 8 and a substrate 7 and the assembly of the high-power module structure into a basic high-power module structure; specifically, the lead frame structure 1-1 disclosed by the utility model comprises a plurality of single frame structures 1, the adjacent single frame structures 1 are connected, when in actual production, the lead frame can be composed of a plurality of single frame structures 1, and different numbers of single frame structures 1 can be selected according to requirements for production and use when in specific use; in addition, each single frame structure 1 comprises a frame body 11, and the arrangement of the frame body 11 facilitates the placement of subsequent structures such as a chip, a circuit board 8 and the like; in addition, the lead group is arranged on the frame body 11, so that the substrate 7 or the circuit board 8 can be conveniently communicated with the lead group, and meanwhile, the external connection of a circuit is facilitated, and the production of a high-power intelligent module is further facilitated; in addition, the pin group comprises a first pin group 2 and a second pin group, wherein the first pin group 2 is mainly used for connecting with the circuit board 8, and the second pin group 3 is mainly used for connecting with the substrate 7; specifically, in the present invention, the first pin group 2 mainly includes a plurality of first outer pins 21 and second inner pins 32, and the second pin group 3 mainly includes a plurality of second outer pins 31 and second inner pins 32; when the lead frame structure 1-1 is used specifically, the number and the intervals of the first outer pins 21, the second inner pins 32, the second outer pins 31 and the second inner pins 32 are determined according to requirements, so that the lead frame structure 1-1 disclosed by the utility model is suitable for different design requirements.
Further, in the present invention, the plurality of first outer leads 21 in the first lead group 2 are connected to the plurality of first inner leads 22 through first connecting ribs 23; the second outer pins 31 in the second pin group 3 are connected with the second inner pins 32 through second connecting ribs 33; in addition, the arrangement of the first connecting ribs 23 can facilitate the connection of the first outer pins 21 and the second inner pins 32, and the integrity between each first outer pin 21 and each inner pin is ensured, and similarly, the second connecting ribs 33 can be used for the connection between a plurality of second outer pins 31 and a plurality of second inner pins 32 in the utility model, so that the integrity of the connection between the second outer pins 31 and the second inner pins 32 is well ensured.
Furthermore, in the present invention, at least two second inner leads 32 in the second lead group 3 are provided with connecting leads 34; the arrangement of the connection pins 34 facilitates the connection assembly of the second inner pins 32 in the second pin group 3 with the substrate 7.
Further, in the present invention, the frame body 11 is provided with a fixing mechanism 6 for mounting the circuit board 8; the fixing mechanism 6 includes a pressing portion including a pressing plate provided on the frame body 11; the fixing mechanism 6 is arranged to conveniently cooperate with the frame body 11 to extrude and fix the circuit board 8 placed on the frame body 11; specifically, the extrusion portion mainly includes the stripper plate, forms the extrusion clearance between stripper plate and the 11 interval distribution of frame body, and this extrusion clearance is less than circuit board 8 thickness, so when circuit board 8 was extruded by the stripper plate, circuit board 8 and above-mentioned extrusion clearance interference fit to the stability of assurance circuit board 8 and installation that can be fine.
Further, in the present invention, one end of the pressing plate is connected to the edge of the frame body 11; the other end extends freely; the extrusion plate comprises a connecting plate 61, and two jacking plates 62 are arranged at the free end of the connecting plate 61; specifically, the connecting plate 61 plays a good bridging role, so that arrangement of the top pressure plate 62 is facilitated, one end of the top pressure plate 62 is connected with the connecting plate 61, the other end of the top pressure plate freely extends to one side of the frame body 11, and due to the arrangement, press mounting and fixing of the circuit board 8 are facilitated.
In addition, each fixing mechanism 6 comprises two extruding parts which are symmetrically distributed at intervals in the utility model; such setting for every monomer frame construction 1 all can extrude fixedly its corresponding circuit board 8, thereby fine assurance circuit board 8 is the stability of placing on monomer frame construction 1.
Further, in the utility model, the two top pressure plates 62 are distributed in a splayed shape; due to the arrangement, the pressing plates 62 are symmetrically and obliquely arranged on the extrusion force of the circuit board 8, so that the stability of the installation of the circuit board 8 can be well guaranteed.
Further, in the present invention, the frame body 11 is provided with a sink 111 for placing the substrate 7; the arrangement of the sinking groove 111 facilitates the arrangement of the substrate 7 on the frame body 11.
Further, in the present invention, the frame body 11 is provided with a transmission hole 5; the arrangement of the conveying hole 5 facilitates the transportation and line changing operation of the lead frame.
Further, in the utility model, the frame body 11 is provided with a glue inlet hole 4; the arrangement of the glue inlet hole 4 facilitates the packaging operation after production.
When the method is concretely implemented;
the utility model discloses a high-power module structure; the module structure mainly comprises a lead frame, a printed circuit board 8 and a ceramic copper-clad substrate 7; the lead frame is mainly used as a carrier for outputting circuit functions, and the single frame structure 1 is used as a frame foundation for description, wherein the single frame structure 1 mainly comprises a frame body 11, and a pin group is arranged on the frame body 11; in actual arrangement, the printed circuit board 8 and the substrate 7 are arranged on the frame body 11; and are connected and communicated through the leads and the pin groups.
In the selection of the materials of the lead frame, because of the output of large current, the thickness of the used copper material is over 40 percent thicker than that of a conventional module, the printed circuit board 8 is used as a carrier and a circuit lead-out of a control chip, the whole body adopts a double-layer design, the space is further saved, the ceramic copper-clad substrate 7 is mainly used as a carrier of a power chip, the good heat conductivity is required, and meanwhile, the ceramic copper-clad substrate 7 is in a strip shape; meanwhile, in order to avoid the warpage of the finished product from exceeding the standard, the thickness of the ceramic is selected to be more than 0.5 mm.
The whole module structure is manufactured as follows:
the ceramic copper-clad substrate 7 is printed with solder paste by means of a tool, then power chip mounting is carried out, tool accessories are installed after mounting, then a frame is assembled, the ceramic copper-clad substrate is transferred to a cleaning basket for cleaning after backflow, the cleaned product is assembled with a printed circuit board 8, the combination of the printed circuit board 8 and the frame is reversely buckled by means of a fixing mechanism 6 of the frame, the printed circuit board 8 is subjected to silver adhesive point coating after being assembled with the printed circuit board 8, then a control chip is attached, the ceramic copper-clad substrate enters an oven for curing the silver adhesive, and a semi-finished product after curing enters a bonding wire bonding process;
firstly, welding a thick aluminum wire (a second lead) on a power chip to enable the power chip to be communicated with a second inner pin on a lead frame, then welding a thin aluminum wire (a first lead) on a control end to enable a printed circuit board 8 to be communicated with the lead frame, finally welding gold wires on functional windows between the control chip and the circuit board to enable signals to be led out to a bonding pad corresponding to the circuit board 8, thus leading out a circuit of the whole product, finally carrying out plastic package operation on the product to seal and insulate the whole product, wherein the plastic package mold adopts three glue filling ports to design to ensure that plastic package materials can be injected into the product in time, designing a telescopic PI N in a mold cavity, pressing the printed circuit board 8 and a copper-clad ceramic substrate 7 to ensure that the relative positions of the structures of the product are not deviated, printing characters after plastic package, electroplating, and cutting ribs and forming of outer pins, and finally, carrying out an electrical property test on the product.
It is clear that the specific implementation of the utility model is not restricted to the above-described embodiments, but that various insubstantial modifications of the inventive process concept and technical solutions are within the scope of protection of the utility model.
Claims (10)
1. A high-power module structure is characterized by comprising a lead frame structure, wherein the lead frame structure comprises a single frame structure, the single frame structure comprises a frame body, and a pin group is arranged on the frame body; the frame body is provided with a circuit board and a substrate; the frame body is provided with a fixing mechanism for mounting a circuit board; the fixing mechanism comprises an extrusion part, and the extrusion part comprises an extrusion plate arranged on the frame body; the pin group comprises a first pin group and a second pin group; the first pin group is connected with the circuit board through a first lead, and the circuit board is connected with the substrate through a second lead; the substrate is connected with the second pin group; the first pin group and the second pin group are distributed at two opposite ends of the frame body; the first pin group comprises a plurality of first outer pins and a plurality of first inner pins; the second lead group comprises a plurality of second outer leads and a plurality of second inner leads.
2. The high power module structure according to claim 1, wherein the first outer pins of the first pin group are connected to the first inner pins through first connecting ribs.
3. The high-power module structure according to claim 1, wherein the second outer pins in the second pin group are connected to the second inner pins through second connecting ribs.
4. The high power module structure of claim 1, wherein at least two second inner leads of the second lead group are provided with connection leads.
5. The high power modular structure of claim 1, wherein each of said securing mechanisms comprises two spaced, symmetrically disposed extrusions.
6. The high power modular structure of claim 5, wherein each of said compression plates is connected at one end to an edge of the frame body; the other end extends freely; the extrusion plate comprises a connecting plate, and two jacking plates are arranged at the free end of the connecting plate.
7. The high power module structure of claim 6, wherein two of said top press plates are arranged in a splayed shape.
8. The high power module structure of claim 1, wherein the frame body is provided with a sink for placing a substrate.
9. The high power module structure of claim 1, wherein the frame body is provided with a transmission hole.
10. The high power module structure of claim 1, wherein the frame body is provided with a glue inlet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122657315.1U CN216054689U (en) | 2021-11-02 | 2021-11-02 | High-power module structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122657315.1U CN216054689U (en) | 2021-11-02 | 2021-11-02 | High-power module structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216054689U true CN216054689U (en) | 2022-03-15 |
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ID=80612936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122657315.1U Active CN216054689U (en) | 2021-11-02 | 2021-11-02 | High-power module structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216054689U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547971A (en) * | 2022-12-02 | 2022-12-30 | 常州市鼎一电子有限公司 | Lead frame for photovoltaic module |
| CN115692361B (en) * | 2022-11-17 | 2023-09-29 | 海信家电集团股份有限公司 | Frame assembly |
| WO2024104166A1 (en) * | 2022-11-17 | 2024-05-23 | 海信家电集团股份有限公司 | Frame assembly, power module and apparatus |
-
2021
- 2021-11-02 CN CN202122657315.1U patent/CN216054689U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115692361B (en) * | 2022-11-17 | 2023-09-29 | 海信家电集团股份有限公司 | Frame assembly |
| WO2024104166A1 (en) * | 2022-11-17 | 2024-05-23 | 海信家电集团股份有限公司 | Frame assembly, power module and apparatus |
| CN115547971A (en) * | 2022-12-02 | 2022-12-30 | 常州市鼎一电子有限公司 | Lead frame for photovoltaic module |
| CN115547971B (en) * | 2022-12-02 | 2023-02-03 | 常州市鼎一电子有限公司 | Lead frame for photovoltaic module |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 241000 1803, building 3, service outsourcing park, Wuhu high tech Industrial Development Zone, Anhui Province Patentee after: Anhui Changfei Advanced Semiconductor Co.,Ltd. Address before: 241000 1803, building 3, service outsourcing park, high tech Industrial Development Zone, Yijiang District, Wuhu City, Anhui Province Patentee before: WUHU QIDI SEMICONDUCTOR Co.,Ltd. |
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| CP03 | Change of name, title or address |