CN100386897C - Support of light emitting diode and preparation method - Google Patents

Support of light emitting diode and preparation method Download PDF

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CN100386897C
CN100386897C CN 200510021033 CN200510021033A CN100386897C CN 100386897 C CN100386897 C CN 100386897C CN 200510021033 CN200510021033 CN 200510021033 CN 200510021033 A CN200510021033 A CN 200510021033A CN 100386897 C CN100386897 C CN 100386897C
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circuit board
light emitting
electrode
emitting diode
electrodes
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CN 200510021033
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CN1697204A (en
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锋 李
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锋 李
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Abstract

本发明一种发光二极管支架的制作方法,包括如下进程:1)将有机树脂覆金属箔板通过印制电路工艺制成带电极的电路板;2)在电路板上制作透孔;3)将铜件固定在所述的透孔内。 A light emitting diode manufacturing method of the stent of the present invention, comprises the following processes: 1) an organic resin coated metal foil sheets made by the process of the printed circuit board with electrodes; 2) making a through hole on the circuit board; 3) copper permeable member is fixed to said aperture. 该发光二极管支架包括铜件、电路板及正、负电极,该电路板上设有透孔,铜件固定在该透孔内,正、负电极印刷在电路板上。 The copper member includes a light emitting diode holder, the circuit board and the positive and negative electrodes, the circuit board is provided with through holes, the copper member is fixed in the through hole, the positive, the negative electrode printed circuit board. 正、负电极均包括面电极、底电极及连接该面、底电极的侧电极,该面电极、侧电极及底电极分别印刷于电路板端部的顶表面、侧表面及底表面。 Positive and negative electrodes comprises an electrode surface, and electrodes connected to the bottom surface, the bottom electrode side electrode, the surface electrode and the bottom electrode side electrode are printed on the top surface of the end portion of the circuit board, the side surface and the bottom surface. 由于电路板和铜件根据需要容易制作成各种形状,所以该支架外形容易变化,对发光二极管后续工序有较好的适用性,且加工时对模具的依赖性低,降低了生产成本,简化了制造工艺。 Since the circuit board, and pieces of copper required easily made into various shapes, it is easy to change the shape of the stent, has good applicability to a subsequent step of the light emitting diode, and a low dependence on the processing of the mold, reduce production costs, simplify the manufacturing process.

Description

一种发光二极管支架的制作方法 A method of making a light emitting diode holder

【技术领域】 TECHNICAL FIELD

本发明涉及大功率发光二极管领域,尤其是关于一种大功率发光二极管的支架。 The present invention relates to a high-power light emitting diodes, and more particularly relates to a stent power light emitting diode. 【背景技术】 【Background technique】

发光二极管(又称LED)支架是半导体发光芯片的承栽体,它承担固定芯片、将芯片与外部电路连接以及将芯片工作时所产生的热量传导走的作用。 A light emitting diode (also called LED) holder is bearing plant material of the semiconductor light emitting chip, which bears a fixed chip, the chip and the external circuit connection and the heat generated when the chip operates conducting away effect.

图1及图2揭示了第一种现有的发光二极管支架的结构,其为塑胶与铜件组合型。 FIG 1 and FIG 2 discloses a structure of a first conventional light emitting diode holder, which is a type of plastic in combination with a copper member. 该发光二极管支架包括电极11、胶体12及铜件13,电极ll 位于胶体12两侧并与胶体12为一体注塑成型,胶体12的中央位置设有透孔121,铜件13安装在该透孔121内。 The light emitting diode includes an electrode holder 11, 12 and copper colloid member 13, 12 positioned on both sides of the electrode ll and the colloidal and 12 integrally injection molded colloid, colloid central location 12 is provided through hole 121, a copper member 13 mounted in the through hole 121 inside. 该种支架的制造方法如下:利用模具冲出连排的铜片电极,然后用塑胶模将连排电极用塑胶注塑成型的方式形成若干组由铜片电极与塑胶构成的组件,这些组件上预留下异形透孔; 另外用模具沖出铜件(即热沉体),将该铜件可压入组件上预留的异形透孔并可与该透孔紧密配合。 The method for producing the seed holder follows: using a mold for continuous discharge electrode out of copper sheet, and then the plastic molding with even rows of electrodes are formed of plastic injection molding components consisting of several sets of electrodes of copper and plastic, these pre-assembly leaving a profiled through hole; additional pieces of copper out of the mold (i.e., the heat sink material), the copper member is pressed into the through hole reserved on the shaped component can mate with the through hole. 使用时,将芯片固定在经镀银处理的铜件上,然后将带芯片的铜件往塑胶电极组件压进去,再经后续工艺便制成一个大功率发光二极管。 When used, the chip is fixed on a copper member by silver plating, and then with copper chip member to the electrode assembly is pressed into the plastic, and then subsequent process will be made by a high-power light emitting diode. 但是该种支架存在如下缺点:使用模具过多、投入大,封装工装夹具精度要求高,后续成品在应用时,还须模具成型才能使用,导致使用麻烦。 However, the presence of the seed holder disadvantage: the use of excessive mold, investment, high precision fixture packaging, finished in a subsequent application, must molding can be used, resulting in cumbersome to use. 由于对模具依赖性强,因而外形多样化不容易。 Due to the strong dependence of the mold, and therefore not easy to shape diversity.

图3及图4揭示了第二种现有的发光二极管支架结构,其为金属基板型。 FIG 3 and FIG 4 discloses a second conventional light emitting diode support structure, which is a type of metal substrate. 该发光二极管支架包括金属基铝铜箔板22、绝缘层23及制作在电路板上的电极211、 212。 The light emitting diode support plate includes a metal substrate 22 of aluminum foil, the insulating layer 23 and the electrode on the circuit board 211 made of, 212. 该支架的制作方法如下:用金属基铝铜箔板22经印制电路板工艺制出电极211、 212,在正、负电板211、 212间加工出一个固晶用盲孔或留下一个固晶位221,然后在盲孔内或固晶位上固晶后, 将芯片的引出线键合在盲孔221 (固晶位)边的电极上,再经后续工艺便制成一个大功率发光二极管。 The method of making the stent as follows: an aluminum foil with a metal base plate 22 via the electrode 211 made of printed circuit board technology, 212, in the positive and negative plates 211, 212 by machining a blind hole or a solid crystal to leave a solid sites is 221, then the blind bore in the solid or solid crystal grain bits, the chip is bonded on the electrode lead blind hole 221 (the solid crystal bit) side, and then subsequent process will be made by a high-power light emitting diode. 但是该种支架存在如下缺点:l)由于金属板边缘是导体,制作侧电极困难,因而LED与外部电路连接须用跳线;2) 另外,如用铝基板制作支架、则固晶盲孔表面处理困难,如用铜基板制作支架,材料价格昂贵。 However, the presence of the seed holder disadvantage: l) Since the edge of the metal plate is a conductor, making difficult the side electrode LED and thus to be connected with an external circuit jumper; 2) Further, as aluminum substrate of making a stent, the surface of the solid crystal blind holes processing difficulties, such as copper production substrate holder, the material is expensive.

图5及图6揭示了第三种现有的发光二极管支架的结构,其为陶瓷型。 FIG 5 and FIG 6 discloses a structure of a conventional light emitting diode third stent, which is a ceramic. 该种支架的制作方法如下:根据设计的尺寸用模具制出胚,经烧结后用厚膜法或陶f:表面金属化后制出所需印制电路板,在电路板32上制作电极 The method of making the seed holder follows: The size of the design mold made out of the embryo, after sintering method or a thick film ceramic f: a rear surface metallization of the desired printed circuit board, making an electrode on the circuit board 32

311、 312,然后在制好的陶瓷电路板32的固晶位321上固晶,经后续工艺便制好大功率LED。 311, 312, and die bonding position 321 in the ready-made solid crystal ceramic circuit board 32, a subsequent process will be made good by high power LED. 但是该种支架存在如下缺点:l)须专门模具制胚烧结, 外形变化灵活性低;2)采用低成本陶瓷则导热性差,采用导热性能好的陶资成本太高。 However, this type of stent has the following disadvantages: l) shall be prepared specifically embryos sintering mold, shape change of low flexibility; 2) the use of low cost ceramic with poor thermal conductivity, good thermal conductivity ceramic using high capital cost. 【发明内容】 [SUMMARY]

本发明的目的在于提供一种制造工艺简单、成本低、适用性好且外形容易变化的发光二极管支架及其制作方法。 Object of the present invention is to provide with simple manufacturing process, low cost, and easy applicability of the outer shape of the light emitting diode changes stent and manufacturing method.

本发明的目的是这样实现的: 一种发光二极管支架的制作方法,它包括如下进程:1 )将有机树脂基金属箔板通过印刷电路板工艺制作成带若干电极的电路板,该若干电极呈阵列排布;2)在同一排中两相邻电极之间制作出透孔;3)沿着各电极的对称轴在电路板上铣出易断槽;4)将电路板切割成条状;5)沿着各易断槽分离各条状电路板而形成若千电路板单体; 6)将铜件固定于各电路板单体的透孔中。 Object of the present invention is implemented as follows: a light emitting diode manufacturing method of a stent, which comprises the following processes: 1) an organic resin-based metal foil sheet through the printed circuit board fabrication into a circuit board with a plurality of electrodes, the plurality of electrodes form arranged in an array; 2) prepared in the same row between two adjacent holes through the electrodes; 3) along the axis of symmetry of the electrodes frangible groove milled in a circuit board; 4) the board was cut into strips; 5) along respective breakable grooves separating each strip of the circuit board to form a circuit board, if one thousand monomer; 6) the copper member is fixed to the circuit board through holes of the monomers.

所述的易断槽为V型、锯齿型或圓型。 Said frangible grooves are V-shaped, zigzag or circular.

与现有技术相比,本发明具有如下优点:由于电路板和铜件根据需要容易制作成各种形状,所以该支架外形容易变化,对发光二极管后续工序有较好的适用性,且加工时对模具的依赖性低,降低了生产成本,简化了制造工艺。 Compared with the prior art, the present invention has the following advantages: Since the circuit board, and pieces of copper required easily made into various shapes, it is easy to change the shape of the stent, has good applicability to the subsequent step of the light emitting diode, and processing low dependence of the mold, to reduce production costs, simplifying the manufacturing process. 【附图说明】 BRIEF DESCRIPTION

图1是多个第一种现有技术发光二极管支架连接一体时的结构图。 FIG 1 is a configuration diagram when a plurality of a first prior art light emitting diode is integrally connected to the bracket.

图2是第一种现有技术发光二极管支架的结构图。 FIG 2 is a configuration diagram of a first prior art LED holder.

图3是第二种现有技术发光二极管支架的结构图。 FIG 3 is a block diagram of a second prior art light emitting diode holder.

图4是呈阵列状排列的多个发光二极管支架的结构图。 FIG 4 is a configuration diagram of a plurality of light emitting diodes as a holder arranged in an array.

图5及图6是第三种现有技术的发光二极管支架的两个不同角度的结构示意图。 5 and FIG. 6 is a schematic view of two different angles of light emitting diode support third prior art.

图7是本发明发光二极管支架的剖视图。 7 is a sectional view of the stent of the present invention a light emitting diode. 图8是本发明发光二极管支架的另一个角度的结构示意图。 FIG 8 is a schematic view of a light emitting diode another angle bracket of the present invention. 图9是呈阵列状排列的多个本发明发光二极管支架的结构图。 9 is a configuration diagram of the form of a plurality of light emitting diodes according to the present invention, the holder arranged in an array. 图IO是本发明发光二极管支架的制作方法的流程图。 FIG IO is a flowchart of a method of manufacturing the stent of the present invention is a light emitting diode. 【具体实施方式】 【Detailed ways】

请参阅图7至图10,本发明一种发光二极管支架的制作方法包括如下进程:l)将有机树脂基覆金属箔板通过印刷电路板工艺制作成带电极的电路板4; 2)在电路板4上制作透孔43; 3)将铜件6固定在所述的透孔43内。 Please refer to FIG. 7 to FIG. 10, a light emitting diode manufacturing method of the stent of the present invention includes the process of: l) an organic resin-based metal-clad plate prepared by the process to a printed circuit board with electrodes of the circuit board 4; 2) in the circuit 43 through holes made on the plate 4; 3) the copper member 6 is fixed within the through hole 43. 该支架形成后即可将芯片固定在铜件上。 The chip can be fixed on the rear bracket member is formed of copper. 步骤l)中,在电路板两端部的表面上均通过印刷电路板工艺制作电极5,在本实施方式中,电极是通过现 Step l), the both end portions of the upper surface of the circuit board are made by printed circuit board technology electrode 5, in the present embodiment, the electrode is by now

有印刷电路板工艺而在电路板上蚀刻形成;在电路板4端部的顶表面411、 底表面413及连接该顶、底表面的侧表面412上均制作有电极5。 A printed circuit board processes etching is formed on the circuit board; the end portion of the top surface 4 of the circuit board 411, connected to the bottom surface 413 and top electrode 412 are fabricated with a side surface 5 of the bottom surface.

请参阅图7至图9,大批量生产时,可在一块电路板7上制作若干个发光二极管支架,其包括如下进程:1)将有机树脂基覆金属箔板通过印刷电路板工艺制作成带若干电极的电路板7,该若干电极5呈阵列排布;2) 在电路板上制作出透孔43,各透孔43均位于同一排中两相邻电极5之间; 3)沿着各电极5的对称轴在电路板7上铣出易断槽53; 4)将电路板7切割成条状;5)沿着各易断槽53分离各条状电路板而形成若干电路板单体4,; 6)将铜件6固定于各电路板单体4'的透孔43中。 Please refer to FIG. 7 to FIG. 9, mass production, a plurality of light emitting diodes can be fabricated on a circuit board holder 7, which comprises the following processes: 1) the organic resin substrate clad with a metal foil sheet as produced by the process of the printed circuit board a plurality of electrodes of the circuit board 7, the number of electrodes 5 arranged in an array; 2) on a circuit board fabricated through holes 43, each of the through-holes 43 are located between two adjacent electrodes of the same row 5; 3) along the respective axis of symmetry of the electrode 5 is milled out on the circuit board 7 frangible groove 53; 4) cut into strips the circuit board 7; 5) along respective breakable grooves 53 separating each strip forming a plurality of circuit board circuit board monomer 4 ,; 6) the copper member 6 is fixed to each of the circuit board 43 in the monomer 4 'through hole. 易断槽53可以为"V" 型、锯齿型、圓型等形状。 Frangible groove 53 may be "V" type, zigzag, circular shape.

本发明一种发光二极管支架包括具有电极5的电路板4及铜件6。 A light emitting diode according to the present invention comprises a holder having a circuit board and a copper electrode 5 4 6. 电路板4可采用现有的有机树脂基覆铝箔或铜箔板作基材,当然也可为其它有机树脂基覆金属箔板。 The circuit board 4 may be any conventional organic or resin-based copper clad aluminum plate as a substrate, of course, be a metal-clad resin plate to another organic group. 该电路板的中央位置贯穿设有透孔43,且该透孔43大致呈阶梯状,当然,该透孔可根据需要制作成其它形状。 Central position of the circuit board through the through-hole 43 is provided, and the through hole 43 is substantially stepped, of course, the through holes may be made into other shapes as desired. 电极5通过印刷电路板工艺制作在电路板4长度方向的两端部41、 42,两个端部41、 42上制作的电极4分别为正、负电极51、 52,该正、负电极51、 52用于和芯片的正、负极电性连接。 Electrode 5 through the printed circuit board fabrication both end portions in the longitudinal direction of the circuit board 4 of 41, 42, two end portions 41, 42 created on the electrode 4, respectively positive and negative electrodes 51, 52, the positive and negative electrodes 51 , 52 chips for the positive and negative electrode is electrically connected. 正、负电极51、 52均包括三个部分,其分别为面电极511、 521、侧电极513、 523及底电极512、 522,面电极511、 521及底电极512、522分别制作在电路板4端部的顶表面411和底表面413 上,側电极513、 523制作在电路板4端部的側表面412,且側电极513连通面电极511和底电极512,侧电极523连通面电极521和底电极522,从而使面电极、侧电极及底电极一体连接。 Positive and negative electrodes 51, 52 each comprise three portions, which are electrode surfaces 511, 521, the side electrodes 513, 523 and the bottom electrode 512, 522, the surface electrode 511, bottom electrodes 512, 522 and 521 were produced in the circuit board the top surface of the fourth end 411 and bottom surface 413, side electrodes 513, 523 fabricated side 4 an end portion of the circuit board surface 412, and the side electrode 513 communicates surface electrode 511 and bottom electrode 512, the side electrode 523 communicates surface electrode 521 and a bottom electrode 522, so that the surface of the electrode, the electrode and the bottom electrode side are integrally connected. 由于电路板4的端部的顶表面411、 侧表面412及底表面413均制作有电极5,所以便于电极5的焊接,简化了生产工艺。 Since the top surface of the end portion 411 of the circuit board 4, side surface 412 and bottom surface 413 are fabricated with an electrode 5, so facilitating the welding electrode 5, simplifies the production process.

铜件6表面经过镀银处理,其大致呈阶梯状并与透孔43的形状和大小匹配,使该铜件6能固定嵌设于透孔43内,从而制成所述的发光二极管支架,当然,该铜件也可根据需要设计成其它形状。 6 after the silver-plated surface of the copper member, and which is generally stepped shape and size matching with the through hole 43, so that the copper member 6 can be fixed is embedded in the through hole 43, so that the stent is made of a light emitting diode, Of course, the copper pieces may also be designed into other shapes as desired. 制作好支架后,即可将芯片固定在铜件的顶表面上(即固晶)。 After building the holder, the chip can be fixed on the top surface of the copper member (i.e., crystalline solid). 在本实施方式中,铜件6也可以为银、金、镁或铝等金属件。 In the present embodiment, the copper metal member 6 may be silver, gold, aluminum, magnesium or the like.

在大批量生产时,也可在一块电路板7上形成若干个发光二极管支架。 In mass production, may be formed in a plurality of light emitting diodes on a circuit board holder 7. 在此种方式下,该电路板7包括若干成阵列状分布的电路板单体4',各个电路板单体4,的中央位置均贯穿设有透孔43,且位于同一排的相邻电路板单体4,之间印刷有电极5,该电极5的中间位置铣出易断槽53。 In this manner, the circuit board 7 in an array comprising a plurality of distribution board monomer 4 ', 4, the central position of the respective circuit boards through the monomers are provided with through holes 43, located in the same row and adjacent circuits monomers plate 4, between the printed electrode 5, the electrode 5 of the milled intermediate position frangible groove 53. 通过此种设计,在形成单个发光二极管支架时,只需要使用适当的力度作用于易断槽53部分,即可实现各个电路板单体4'之间的分离,且此过程中,相邻 By this design, a single light emitting diode is formed when the holder only need to use an appropriate intensity applied to the frangible portion of the groove 53, to achieve the separation between the respective circuit boards monomer 4 ', and this process, the adjacent

电路板单体4,之间的电极5分成两部分,使每个电路板单体4,的两端部均有电极。 4 between both ends of the electrode 5, divided into two parts, each circuit board 4 monomers, monomers are a circuit board electrodes.

由于采用有机树脂基电路板作支架的电路结构,铜件作热沉。 Since the circuit configuration of the base circuit board using an organic resin as a bracket, for a copper heat sink member. 有机树脂基电路板极易进行机械加工,小批量制作及样板制作时,几何形状只须经数控机械加工便能快速精确地制作出来,而不须模具;铜件也可以很容易机械加工出来。 An organic resin substrate board can easily be machined, and small batch production production model, the geometry of the NC machining subject only able to quickly and accurately make out, without having to mold; copper member may be easily machined out. 因此其外形、尺寸可根据后续使用需要轻松改变;生产一次投入少,投产快。 Accordingly its shape, size can be easily changed according to need subsequent use; produce a small investment, quick production. 如大批量生产也只需两个沖压模,因而大批量生产时模具成本也很低。 The mass production are also two stamping die only, and thus when low cost mass production mold.

由于采用有机树脂电路板作支架的电路结构,采用的加工工艺是印制电路板加工工艺,组件连成排、连成条、连成一片非常灵活,只视乎后续 Since the circuit board using an organic resin as the circuit structure of the stent, a process using a printed circuit board processing, assembly and even rows, even the strips, even as a very flexible, depending on only the subsequent

生产需要排版即可;芯片与外部电路连接用电极数量多少与形式,也只视乎后续生产需要排版即可。 Layout to production needs; chip and the external circuit connection number and the number of electrodes forms, depending on the subsequent production needs only to layout.

由于采用有机树脂基电路板作支架的电路结构,用印刷电路制作工艺的孔金属化法,便很轻易地制出侧电极而将电路结构体制成SMD贴片型。 Since the organic resin base circuit board as the circuit structure of the stent, the metallized holes of the printed circuit fabrication process of the method, they produced an easily-side electrode to the circuit configuration of the SMD chip type system. 因此制成成品发光二极管与外部电路连接容易,后续产品批量生产效率高。 Thus finished products with an external circuit connected to the light emitting diode is easy, high-volume productivity of the subsequent product.

制成的LED成品,由于连排、连片或连条加工支架时,已在单体间铣出锯齿状易断槽,单件使用时只须用适当的力度便能折下来。 LED products manufactured, due to even rows, or even contiguous strip processing holder, has milled zigzag groove between the frangible monomer, only a single piece with the appropriate strength will be able to fold down when in use.

采用铜作热沉导热率高(300w/mk以上),热阻几乎是零。 As a heat sink made of copper having high thermal conductivity (300w / mk or more), the thermal resistance is almost zero.

本发明发光二极管支架加工时对模具的依赖极低,不但降低了生产成本,支架外形及芯片与外部电路连接用电极数量多少与形式,还可根据后续成品的需要毫无顾忌地改变,具有较强的对后续使用的适应性。 The present invention is a light emitting diode holder during machining of a mold is extremely low dependence not only reduces production costs, and the holder and chip shape with a number of external circuit connecting the electrodes and how many forms, may also vary according to the impunity require subsequent finished product, has a more adaptable for subsequent use.

Claims (2)

1.一种发光二极管支架的制作方法,其特征在于:它包括如下进程:1)将有机树脂基金属箔板通过印刷电路板工艺制作成带若干电极的电路板,该若干电极呈阵列排布;2)在同一排中两相邻电极之间制作出透孔;3)沿着各电极的对称轴在电路板上铣出易断槽;4)将电路板切割成条状;5)沿着各易断槽分离各条状电路板而形成若干电路板单体;6)将铜件固定于各电路板单体的透孔中。 1. A method for manufacturing a light emitting diode holder, characterized in that: it comprises the following processes: 1) an organic resin-based metal foil is made into a plate with a plurality of electrodes of the circuit board by printed circuit board technology, the number of electrodes arranged in an array ; 2) prepared in the same row between two adjacent electrodes of the through holes; 3) along the axis of symmetry of the electrodes frangible groove milled in a circuit board; 4) the board was cut into strips; 5) along each frangible separation grooves with each strip forming a plurality of circuit boards and the circuit board monomer; through hole 6) is secured to each of the copper circuit board monomer.
2. 根据权利要求1所述的一种发光二极管支架的制作方法,其特征在于: 所述的易断槽为V型、锯齿型或圓型。 The method for manufacturing a light emitting diode holder according to claim 1, wherein: said frangible grooves are V-shaped, zigzag or circular.
CN 200510021033 2005-05-31 2005-05-31 Support of light emitting diode and preparation method CN100386897C (en)

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CN101490702B (en) 2006-06-19 2013-07-17 纳格雷德股份有限公司 Method of manufacturing cards comprising at least one electronic module, assembly produced during this method and intermediate products
CN102097576A (en) * 2010-12-30 2011-06-15 江苏欣力光电有限公司 Light emitting diode (LED) copper bracket
CN102185085A (en) * 2011-05-03 2011-09-14 安徽莱德光电技术有限公司 High-power LED (Light Emitting Diode) encapsulating bracket
CN103000772A (en) * 2011-09-13 2013-03-27 复盛精密工业股份有限公司 Light emitting diode support structure manufacturing method
CN104576904B (en) * 2013-10-15 2017-09-19 展晶科技(深圳)有限公司 LED package and a manufacturing method

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US6562643B2 (en) 2000-10-06 2003-05-13 Solidlite Corporation Packaging types of light-emitting diode
CN1466782A (en) 2001-08-28 2004-01-07 松下电工株式会社 Loghting device using LED
CN1434522A (en) 2002-01-21 2003-08-06 诠兴开发科技股份有限公司 Method for package of high power LED

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