CN201787364U - LED support and circuit boar integrated front-lighting LED module and support circuit board - Google Patents
LED support and circuit boar integrated front-lighting LED module and support circuit board Download PDFInfo
- Publication number
- CN201787364U CN201787364U CN2010201593783U CN201020159378U CN201787364U CN 201787364 U CN201787364 U CN 201787364U CN 2010201593783 U CN2010201593783 U CN 2010201593783U CN 201020159378 U CN201020159378 U CN 201020159378U CN 201787364 U CN201787364 U CN 201787364U
- Authority
- CN
- China
- Prior art keywords
- led
- circuit board
- support
- circuit
- led support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
An LED support and circuit board integrated front-lighting LED module comprises an LED support, a circuit board and an LED packaged on the LED support, the LED support and the circuit board are formed integrally, and the LED emits light from the front. The LED support and the circuit board are manufactured integrally, and the LED is fixed without welding, so that the LED module is more reliable in performance, and simultaneously, materials can be saved, manufacturing time is shortened, and production efficiency is increased greatly, environmental pollution caused by etching in the conventional PCB manufacturing process is reduced, and production cost is decreased greatly.
Description
Technical field
The utility model relates to the making and the application of LED module, is specifically related to the led support design in circuit board the positive luminous led circuit module that allows led support and circuit board be integrated, and support circuitry plate.The structure of this led circuit module makes LED to weld, and is more reliable on the structural behaviour, and its manufacture method has also been saved material and shortened Production Time simultaneously, has improved production efficiency greatly; Reduce traditional mode of production and made etching pollution on the environment in the PCB process; Also reduced production cost greatly.Responded the call of country for energy-saving and emission-reduction.
Background technology
In the making and application of traditional LED module, the LED module is not an integral forming, but adopts substep to carry out, and makes LED earlier, makes the PCB printed circuit board again, just LED is inserted on the PCB circuit board one by one then, welds by hand.This lamp bar circuit board and led support are to form separately respectively, are not configured as one.
In the making and application of traditional LED module, its preparation method is:
First step LED makes: go out led support → platings → cleanings led support with copper coin or iron plate with mould, and oven dry → led chip check → LED expand sheet → LED point glue → LED and be equipped with glue → LED and sting sheet → LED by hand and shelve automatically → LED sintering → LED pressure welding → LED sealing → LED curing and after curing → LED cut muscle
The second step wiring board is made: plate → etch copper → go etchingresistant printing material, oven dry → wire mark welding resistance figure → wire mark character marking → open, short-circuit test → cleaning, oven dry → precoating to help the weldering antioxidant is repaiied in copper-clad plate → open material → boring or punching → anti-etching figure of wire mark circuit or use dry film → curing inspection.
The 3rd step LED and wiring board welding: LED is inserted in prints on the pcb board → welding → traditional LED module.
This traditional fabrication method not only production process is quite loaded down with trivial details, and Production Time is long.But also environment is caused severe contamination.
Therefore, in order to overcome above defective and deficiency, need the more simple and reliable LED module of a kind of structure, its structure makes led support and circuit board integral forming, mechanical strength height, good reliability.And the production efficiency height of its production technology, speed is fast, and its production technology can respond country for the call of energy-saving and emission-reduction, can overcome the defective and the deficiency of above-mentioned traditional handicraft, and its manufacture craft is cheap simply again, alternative existing loaded down with trivial details traditional manufacturing technique.
The utility model content
Before describing the utility model in detail, it will be appreciated by those skilled in the art that in addition term " wiring board " and " circuit board " can use interchangeably in the application, and term " circuit " and " circuit " can use interchangeably also in the application.
Although the utility model is described the utility model in conjunction with LED, but those skilled in the art are to be understood that, LED in the utility model obviously also can other electrical equipment replace, and the LED in the utility model can be the LED of any kind, comprise LED of all kinds, white light LEDs, great power LED or the like, therefore scope of the present utility model is only limited by claims.
In the utility model, the light emission direction that " positive luminous " refers to LED is to be substantially perpendicular to the residing plane of circuit board, and its light emission direction is to send from the front of circuit board.
According to the present invention, relating to the luminous led circuit module in led support and the integrated front of circuit board substitutes traditional LED and prints the new method that PCB separate making, and PCB manufacturing process is printed in minimizing and LED is inserted in the technology of welding on the printing pcb board, save the material of making PCB, accomplished the discharging of no etching pollutant.Compare with printed circuit board construction with traditional technology, the present invention is integrated with led support and circuit board, LED need not weld, improved the structural behaviour of LED module, not only reduced production cost greatly, shortened the technological process of making led circuit module, improved production efficiency, also responded the call of country for energy-saving and emission-reduction.
According to the utility model, provide a kind of with the luminous LED module of led support and the incorporate front of circuit board, comprising:
Led support;
Circuit board; With
Be encapsulated in the LED on the led support, it is characterized in that: led support and circuit board are integrally formed, and LED is positive luminous.
According to a preferred embodiment of the present utility model, the led support structural design is realized the monolithic molding of led support and circuit board like this in circuit board, and directly on the led support in the circuit board, carry out the encapsulation of LED.
According to a preferred embodiment of the present utility model, the luminous direction of illumination of LED is perpendicular to the circuit plane of circuit board.
According to a preferred embodiment of the present utility model, the used material of circuit board is the thick copper material of 0.2-0.8mm or iron material or steel.
According to a preferred embodiment of the present utility model, stamp UV resistance plating printing ink in the front of circuit board.
According to a preferred embodiment of the present utility model, be coated with PI coverlay or PET coverlay at the back side of circuit board.
According to a preferred embodiment of the present utility model, the luminous of LED is to send from the front of circuit board.
According to a preferred embodiment of the present utility model, circuit board and led support are integrated that goes out by mould.
It is a kind of with led support and the incorporate support circuitry plate of circuit board that the utility model also provides, and described support circuitry plate comprises circuit board and the led support that is shaped of shaping with it.
According to a preferred embodiment of the present utility model, led support has wafer bowl face and the solder joint through electroplating processes.
According to a preferred embodiment of the present utility model, the material of the incorporate led circuit module of above-mentioned led support and circuit board material therefor is: or copper material or iron material or steel.
According to a preferred embodiment of the present utility model, above-mentioned making is to go out incorporate led support circuit board continuously with the whole volume of mould
According to a preferred embodiment of the present utility model, used resistance plating printing ink is the resistance plating printing ink of circuit board.
According to a preferred embodiment of the present utility model, electroplating processes is wanted in wafer bowl face and solder joint position.
According to a preferred embodiment of the present utility model, resistance adopts the mode of SMT to weld resistance in the circuit.
According to a preferred embodiment of the present utility model, above-mentioned line layer is the thick steel plate of 0.2～0.8mm or copper coin or iron plate.
In following description, will set forth one or more embodiments of the detail of the present utility model to the drawings and specific embodiments.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present utility model.
In following description, will set forth one or more embodiments of the detail of the present invention to the drawings and specific embodiments.From these descriptions, accompanying drawing and claim, can know other features, objects and advantages of the present invention.
Description of drawings
Among Fig. 1,1 (A) will be preferably thick steel plate of 0.2～0.8mm or copper coin or iron plate with the led support circuit board blank schematic diagram of mould behind led support circuit board and the wafer bowl 2.1 (B) is wafer bowl 2 cross sectional representation.
Among Fig. 2,2 (A) have shown the schematic diagram after the support circuitry plate blank back side pastes epiphragma 3.2 (B) have shown that support circuitry plate blank front stamps the schematic diagram of UV resistance plating printing ink 4
Fig. 3 has shown the schematic diagram behind wafer bowl face and solder joint position silver-plated 6 and the SMT welding resistance 5.
Among Fig. 4,4 (A): shown the schematic perspective view behind the protruding led support 7.4 (B) are the cross sectional representation behind the protruding led support 7.
Among Fig. 5,5 (A) have shown the schematic perspective view after reinforcing wire led chip and sealing 8 are solidified.5 (B) are the cross sectional representation after sealing 8 is solidified.
Among Fig. 6,6 (A) have shown the led circuit module cross-sectional structure schematic diagram that goes to prejudge position 1 back formation; 6 (B) have shown the positive planar structure schematic diagram that removes to prejudge the led circuit module that forms behind the position 1.
The specific embodiment
To the concrete enforcement of the luminous led circuit module in the integrated front of led support circuit board of the present invention be described in more detail below.
One, the incorporate making of support circuitry plate
1, with steel plate or the copper coin or the iron plate of rolling, thickness is preferably 0.2～0.8 millimeter, dash with the whole continuously volume of mould, go out and shown in Fig. 1 (A), leave the support circuitry plate blank of prejudging position 1, wafer bowl 2 also is rushed out (shown in Fig. 1 (A), 1 (B)) simultaneously, and its medium-height trestle and circuit board are an integral body.In the support circuitry plate after the shaping shown in Fig. 6 (A), support 7 and circuit 9 are actually integrally and are shaped.
2, support circuitry plate blank is carried out the oil removing pickling, and the coverlay 3 that dry → will hold window again successfully is attached to support circuitry backboard face, uses fast press with 180 ℃ of temperature then, pressure is 150kg/cm
2, pressing time is that the parameter of 2min presses together support circuitry plate blank and coverlay 3 (shown in Fig. 2 (A)) → cleaning, drying, and is positive with traditional screen printing UV resistance plating printing ink 4 (shown in Fig. 2 (B)) at the support circuitry plate.
3, wafer bowl face and the bond pad locations that will post coverlay 3 and print the support circuitry plate of UV resistance plating printing ink 4 carried out silver-plated 6 processing → seal tin creams, and SMT welds resistance 5 (as shown in Figure 3).
4, with mould towards protruding led support 7 (shown in Fig. 4 (A), 4 (B)).
Two, LED encapsulation
Clean led support circuit board → reinforcing wire led chip → sealing 8 → curing (shown in Fig. 5 (A), 5 (B))
Because above-mentioned LED packaging technology belongs to traditional technology, belong to those skilled in the art and know, just no longer carefully state at this.
Three, led circuit module finished product
Support circuitry plate behind the package curing is put on the mould bases, washes out and prejudge position 1, finish making (shown in Fig. 6 (A), 6 (B)) → test → packing of led circuit module product.In the structure chart of Fig. 6 (A), 6 (B), clearly illustrated the support circuitry plate of integrally formed led support 7 and circuit (circuit board) 9.
Below in conjunction with the accompanying drawings the incorporate led circuit module of support circuitry plate specific embodiment is described in detail the present invention.But, it will be appreciated by those skilled in the art that the above only is to illustrate and describe some specific embodiment, to scope of the present invention, especially the scope of claim does not have any restriction.
Claims (9)
1. luminous LED module of led support and the incorporate front of circuit board comprises:
Led support;
Circuit board; With
Be encapsulated in the LED on the led support, it is characterized in that:
Described led support and circuit board are integrally formed, and LED is positive luminous.
2. led circuit module according to claim 1 is characterized in that: the led support structural design is realized the monolithic molding of led support and circuit board like this in circuit board, and directly carry out the encapsulation of LED on the led support in the circuit board.
3. led circuit module according to claim 1 is characterized in that: the luminous direction of illumination of LED is perpendicular to the circuit plane of circuit board.
4. led circuit module according to claim 1 is characterized in that: the used material of circuit board is the thick copper material of 0.2-0.8mm or iron material or steel.
5. led circuit module according to claim 1 is characterized in that: stamp UV resistance plating printing ink in the front of circuit board.
6. led circuit module according to claim 1 is characterized in that: be coated with PI coverlay or PET coverlay at the back side of circuit board.
7. led circuit module according to claim 1 is characterized in that: the luminous of LED is to send from the front of circuit board.
8. led circuit module according to claim 1 is characterized in that: circuit board and led support are integrated that goes out by mould.
9. one kind with led support and the incorporate support circuitry plate of circuit board, it is characterized in that, described support circuitry plate comprises circuit board and the led support that is shaped of shaping with it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201593783U CN201787364U (en) | 2010-04-09 | 2010-04-09 | LED support and circuit boar integrated front-lighting LED module and support circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201593783U CN201787364U (en) | 2010-04-09 | 2010-04-09 | LED support and circuit boar integrated front-lighting LED module and support circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201787364U true CN201787364U (en) | 2011-04-06 |
Family
ID=43819326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201593783U Expired - Lifetime CN201787364U (en) | 2010-04-09 | 2010-04-09 | LED support and circuit boar integrated front-lighting LED module and support circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201787364U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767707A (en) * | 2012-05-21 | 2012-11-07 | 王定锋 | LED (Light-Emitting Diode) module capable of directly forming LED support on wire circuit board, and manufacturing method of LED module |
| CN102809081A (en) * | 2012-08-15 | 2012-12-05 | 苏州金科信汇光电科技有限公司 | Penetration meteor tube |
| CN103078044A (en) * | 2013-01-09 | 2013-05-01 | 宏齐光电子(深圳)有限公司 | Production method of ultrasmall-sized red-green-blue (RGB) full-color light emitting diode (LED) for high-definition display screen |
| CN103715328A (en) * | 2012-10-08 | 2014-04-09 | 深圳市子元技术有限公司 | LED chip packaging method |
| CN103715329A (en) * | 2012-10-08 | 2014-04-09 | 深圳市子元技术有限公司 | High-power LED chip making method |
-
2010
- 2010-04-09 CN CN2010201593783U patent/CN201787364U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102767707A (en) * | 2012-05-21 | 2012-11-07 | 王定锋 | LED (Light-Emitting Diode) module capable of directly forming LED support on wire circuit board, and manufacturing method of LED module |
| CN102809081A (en) * | 2012-08-15 | 2012-12-05 | 苏州金科信汇光电科技有限公司 | Penetration meteor tube |
| CN103715328A (en) * | 2012-10-08 | 2014-04-09 | 深圳市子元技术有限公司 | LED chip packaging method |
| CN103715329A (en) * | 2012-10-08 | 2014-04-09 | 深圳市子元技术有限公司 | High-power LED chip making method |
| CN103078044A (en) * | 2013-01-09 | 2013-05-01 | 宏齐光电子(深圳)有限公司 | Production method of ultrasmall-sized red-green-blue (RGB) full-color light emitting diode (LED) for high-definition display screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201787364U (en) | LED support and circuit boar integrated front-lighting LED module and support circuit board | |
| CN103280436A (en) | Surface-mounted device and production method thereof | |
| CN105578778A (en) | Manufacturing method of single-face local thick-gold plated PCB | |
| CN109874232A (en) | A kind of preparation method for the wiring board that high thickness to diameter ratio and route are unevenly distributed | |
| CN102340931A (en) | Method for making single-sided circuit board with flat wires arranged side by side | |
| CN201435876Y (en) | Positioning device pasted on surface of circuit board | |
| CN201877457U (en) | Side-emitting LED (light-emitting diode) module integrated with LED bracket and circuit board and bracket circuit board | |
| CN216054689U (en) | High-power module structure | |
| CN201811008U (en) | LED flexible Great Wall-shaped lamp strip integrated with flexible circuit | |
| CN201383901Y (en) | Buried hole type circuit board | |
| CN102883519A (en) | Blind-hole type two-sided thermal-conduction circuit board and manufacturing process thereof | |
| CN102107552B (en) | Surface mount technology (SMT) printing steel mesh | |
| CN108307593A (en) | A kind of thin plate core plate beats rivet fixture | |
| CN202068676U (en) | Novel circuit board of light-emitting diode (LED) lamp | |
| CN201860518U (en) | Jack device of circuit board | |
| CN203691754U (en) | Combined and jointed board based on various kinds of samples | |
| CN218244021U (en) | Whole multilayer pastes dress capacitor equipment tool | |
| CN204377247U (en) | The LED lamp bar wiring board that a kind of cross cutting metal forming makes | |
| CN102651945A (en) | Environment-friendly LED (Light-Emitting Diode) light bar circuit board and manufacturing method thereof | |
| CN202178915U (en) | Blind hole double-face heat conducting circuit board | |
| CN202210535U (en) | Flexible circuit board for LED | |
| CN201689913U (en) | LED encapsulation structure with simple structure | |
| CN201616952U (en) | Double-faced circuit board | |
| CN102724812A (en) | Exposed character manufactured by directly welding LEDs on flexible circuit board and method | |
| CN201860515U (en) | Two-sided LED circuit board component for welding, connecting and conducting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110406 |
|
| CX01 | Expiry of patent term |