CN202068676U

CN202068676U - Novel circuit board of light-emitting diode (LED) lamp

Info

Publication number: CN202068676U
Application number: CN2011201571882U
Authority: CN
Inventors: 龙小飞
Original assignee: ZHUHAI YAOHONG ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: ZHUHAI YAOHONG ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2011-05-17
Filing date: 2011-05-17
Publication date: 2011-12-07
Anticipated expiration: 2021-05-17

Abstract

The utility model provides a novel circuit board of a light-emitting diode (LED) lamp, which comprises a first metal conductive layer, a second metal conductive layer and an insulation layer. The first metal conductive layer is attached to and covered on a first surface of the insulation layer, the second metal conductive layer is attached to and covered on a second surface of the insulation layer, and covering films are attached to and covered on the surfaces of the first metal conductive layer and the second metal conductive layer respectively. The insulation layer, the first metal conductive layer and the covering film on the surface of the first metal conductive layer are respectively provided with a through hole which is filled with conductive objects. The circuit board of the LED lamp adopts a novel circuit board structure of the LED lamp, the conductive objects are filled in the through holes of one metal conductive layer and the insulation layer, so that the circuit board realizes electricity connection between the two metal conductive layers, is simple in manufacture process, low in cost and environment-friendly and has no pollution on environments.

Description

The New LED lamp belt circuit board

Technical field

The utility model relates to the LED technical field, a kind of specifically New LED lamp belt circuit board.

Background technology

Fast development along with the LED technology, the LED light fixture is widely used in the every field in life and the industrial production, as indicating the decorative lighting etc. of edge light, street lamp, outline lighting, tree crown, corridor, window, arched door building, this type of LED light fixture all adopts soft lamp belt circuit board.

See also Fig. 1, be the structural representation of the LED lamp belt circuit board in the known technology.Soft lamp belt circuit board comprises a double layer of metal conductive layer 1 and a layer insulating 2, and insulating barrier 2 is located between the double layer of metal conductive layer 1, and the surface of this double layer of metal conductive layer 1 is respectively equipped with coverlay 3, as solder mask.When LED lamp (figure does not show) work, double layer of metal conductive layer 1 needs energising conducting mutually, traditional manufacture method is on a double layer of metal conductive layer 1 and a layer insulating 2 through hole 4 to be set, by numerous and diverse chemical replacement, chemical plating process, with the metallic conduction thing, as metal objects such as copper, tin, nickel, gold, be plated to the madial wall of through hole 4, form a metal conducting layer 5, to realize the energising conducting of double layer of metal conductive layer 1, adopt this kind LED lamp belt circuit board and manufacture method, have following shortcoming:

1, manufacturing process complexity, the production difficulty is big.

2, need to adopt chemical technologies such as metal replacement, plating, production cost height.

3, this kind manufacture method needs discharging plurality of heavy metal, complex compound, waste gas in process of production, and is big to environment damage.

The utility model content

At above the deficiencies in the prior art and defective, the purpose of this utility model is to provide a kind of New LED lamp belt circuit board.

The purpose of this utility model is achieved by the following technical solution:

A kind of New LED lamp belt circuit board, comprise first metal conducting layer, second metal conducting layer and a layer insulating, this first metal conducting layer is covered on the first surface of insulating barrier, this second metal conducting layer is covered on the second surface of insulating barrier, the surface of this first metal conducting layer and second metal conducting layer is covered with one deck coverlay respectively, be respectively equipped with through hole on the coverlay of the described insulating barrier and first metal conducting layer and the first metallic conduction laminar surface, be filled with conducting objects in this through hole.

As optimal technical scheme of the present utility model, described first metal conducting layer and second metal conducting layer are respectively copper foil layer.

As optimal technical scheme of the present utility model, described conducting objects is silver slurry, copper oil, tin cream or carbon oil.

Compared with prior art, the utility model adopts new LED lamp belt circuit plate structure, conducting objects is filled in the through hole of wherein a metal conducting layer and insulating barrier, realize the energising conducting of double layer of metal conductive layer, manufacturing process is simple, and with low cost, environmental protection can not pollute environment.

Description of drawings

The utility model is described in further detail below in conjunction with accompanying drawing and specific embodiment:

Fig. 1 is the structural representation of the LED lamp belt circuit board in the known technology.

Fig. 2 is the overall structure schematic diagram of the utility model New LED lamp belt circuit board.

Fig. 3 is the decomposition texture schematic diagram of the utility model New LED lamp belt circuit board.

Fig. 4 is the first step action schematic diagram of the utility model New LED lamp belt circuit board manufacture method.

Fig. 5 is second step action schematic diagram of the utility model New LED lamp belt circuit board manufacture method.

Fig. 6 is the 3rd step action schematic diagram of the utility model New LED lamp belt circuit board manufacture method.

Fig. 7 is the 4th step action schematic diagram of the utility model New LED lamp belt circuit board manufacture method.

Embodiment

See also Fig. 2 and Fig. 3, be the overall structure schematic diagram and the decomposition texture schematic diagram of the utility model New LED lamp belt circuit board.

This New LED lamp belt circuit board comprises first metal conducting layer 10, second metal conducting layer 20 and a layer insulating 30.In the present embodiment, this first metal conducting layer 10 and second metal conducting layer 20 are respectively copper foil layer, but be not limited thereto, also can first metal conducting layer 10 and second metal conducting layer 20 be designed to other metal conducting layers such as aluminium foil layer, tinfoil paper layer according to designing requirement.

This first metal conducting layer 10 is covered on the first surface 302 of insulating barrier 30, this second metal conducting layer 20 is covered on the second surface 303 of insulating barrier 30, the surface of this first metal conducting layer 10 and second metal conducting layer 20 is covered with the coverlay 101,201 of one deck welding resistance insulation material respectively, as solder mask.

The coverlay 101 on this insulating barrier 30 and first metal conducting layer 10 and first metal conducting layer, 10 surfaces is provided with and is respectively equipped with through hole 301,102,103, wherein, one end of the through hole 301 on the insulating barrier 30 is sealed by second metal conducting layer 20, be filled with conducting objects 40 in through hole 301,102,103, this conducting objects 40 is a kind of in silver slurry, copper oil, tin cream or the carbon oil.

A kind of method of making above-mentioned LED lamp belt circuit board may further comprise the steps:

See also Fig. 3 and Fig. 4, at first the first surface 302 with insulating barrier 30 sticks double faced adhesive tape (figure does not show) with second surface 303, the first metallic conduction laminating 10 is overlying on first surface 302, and pastes one deck release liners 50 on the double faced adhesive tape of second surface 303.

See also Fig. 3 and Fig. 5, hole 301,102 on insulating barrier 30 and first metal conducting layer 10 that is covered on first surface 302, release liners 50, insulating barrier 30 and first metal conducting layer 10 are run through in this hole 301,102.

See also Fig. 3 and Fig. 6, release liners 50(on the double faced adhesive tape (figure does not show) of removal insulating barrier 30 second surfaces 303 sees also Fig. 5), second metal conducting layer 20 is covered on the second surface 303 of insulating barrier 30, make the end sealing of the through hole 301 on the insulating barrier 30, and to first metal conducting layer 10 and second metal conducting layer 20 carry out in the traditional handicraft line pattern transfer, development, etching, move back the film processing.

See also Fig. 3 and Fig. 7, paste one deck coverlay 101,201 respectively on the surface of first metallic conduction 10 and second metal conducting layer 20, as solder mask, wherein, the coverlay 101 that is covered on first metal conducting layer 10 is provided with through hole 103, the position consistency of the through hole 301,102 on the position of this through hole 103 and insulating barrier 30 and first metal conducting layer 10.

Please consult Fig. 2 and Fig. 3 once more, then, adopt mode filling conducting objects 40 through hole 301,102,103 in of silk screen printing, and baking and curing, this conducting objects is a kind of in silver-colored slurry, copper oil, tin cream or the carbon oil.

At last, print treatment process such as markup character, electric performance test, surface treatment, moulding, those treatment process are the treatment process in the traditional handicraft, are known technology, just no longer give unnecessary details at this.

First metal conducting layer 10 and second metal conducting layer 20 in this manufacture method are respectively copper foil layer, but be not limited thereto, also can first metal conducting layer 10 and second metal conducting layer 20 be designed to other metal conducting layers such as aluminium foil layer, tinfoil paper layer according to designing requirement.

The above is preferred embodiment of the present utility model only, is not to be used for limiting practical range of the present utility model; Every equivalence of doing according to the utility model changes and revises, and is all covered by the scope of the utility model claims.

Claims

1. New LED lamp belt circuit board, comprise first metal conducting layer, second metal conducting layer and a layer insulating, this first metal conducting layer is covered on the first surface of insulating barrier, this second metal conducting layer is covered on the second surface of insulating barrier, the surface of this first metal conducting layer and second metal conducting layer is covered with one deck coverlay respectively, it is characterized in that: be respectively equipped with through hole on the coverlay of the described insulating barrier and first metal conducting layer and the first metallic conduction laminar surface, be filled with conducting objects in this through hole.

2. New LED lamp belt circuit board according to claim 1 is characterized in that: described first metal conducting layer and second metal conducting layer are respectively copper foil layer.

3. New LED lamp belt circuit board according to claim 1 is characterized in that: described conducting objects is silver slurry, copper oil, tin cream or carbon oil.