CN111629512A - LED (light-emitting diode) wire-free lamp strip flexible circuit board and preparation method thereof - Google Patents
LED (light-emitting diode) wire-free lamp strip flexible circuit board and preparation method thereof Download PDFInfo
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- CN111629512A CN111629512A CN202010686051.XA CN202010686051A CN111629512A CN 111629512 A CN111629512 A CN 111629512A CN 202010686051 A CN202010686051 A CN 202010686051A CN 111629512 A CN111629512 A CN 111629512A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a flexible circuit board of an LED (light-emitting diode) wire-free lamp strip and a preparation method thereof, wherein the flexible circuit board comprises a circuit film layer and a conductive film layer which are compounded together, wherein the circuit film layer comprises a copper foil, a first insulating adhesive layer and a first PET (polyethylene terephthalate) film from top to bottom; the conductive film layer comprises an aluminum foil, a second insulating adhesive layer and a second PET film from top to bottom, the LED circuit is etched on the copper foil, the lead is etched on the aluminum foil, the LED circuit is communicated with the lead through a conductive copper column formed by conductive copper paste, and the conductivity of the whole circuit board is equivalent to that of a flexible circuit board manufactured by the existing copper foil by adjusting the thickness of the aluminum foil, so that the fact that the copper foil is replaced by the aluminum foil is feasible, the cost is greatly reduced, and the economic benefit is very obvious; and can go up soldering tin on electrically conductive copper post after with LED circuit and direction intercommunication through electrically conductive copper post, solve the difficult problem that can't go up soldering tin on the aluminium foil among the prior art.
Description
Technical Field
The invention relates to the technical field of LED (light emitting diode) wire-free lamp belts, in particular to a flexible circuit board of an LED wire-free lamp belt and a preparation method thereof.
Background
The LED is used as a fourth generation lighting source, and has the advantages of remarkable energy saving and service life. With the development of society, the problem of illumination energy consumption in daily life is increasingly prominent, so that the LED lamp with the remarkable energy-saving advantage is more and more favored by people.
The flexible circuit board for the LED soft lamp strip can be bent, folded and wound at will due to the fact that the FPC is soft, and can move and stretch in a three-dimensional space at will without breaking. The decorative plate is suitable for being used in irregular places and narrow spaces, and is also suitable for randomly combining various patterns in advertisement decoration because the decorative plate can be randomly bent and wound. Therefore, the LED flexible circuit board is increasingly used in the scene lighting and mood lighting.
The existing flexible circuit board basically adopts copper wires, the wires between the copper wires are juxtaposed flat wires, the direct clearance between the main wires at two sides and the middle wire is generally 0.6mm, and the direct contact short circuit between the two main wires and the middle wire is easily caused to be scrapped due to the tiny displacement of the flat wires in the wiring of the juxtaposed wires; meanwhile, the main conducting wires and the middle conducting wires on the two sides are not insulated and separated, and in the use process of the soft lamp strip, particularly the high-voltage soft lamp strip, the direct contact short circuit between the two main conducting wires and the middle conducting wires is scrapped due to poor heat dissipation and caused by thermal breakdown.
At present, the LED flexible circuit board without the conducting wire appears on the market, the flexible circuit board is mainly produced by adopting an etching method, and the flexible circuit board produced by the etching method can be used for manufacturing complex circuits. The etching method generally adopts special ink to print patterns on the laminated copper foil, then the copper foil which is not covered by the ink is etched, the ink is cleaned, and the laminated part of the copper foil which is covered by the ink and a base material is left, so that the required flexible circuit board is obtained. The production of the desired pattern on the composite material with ink is a critical step in the manufacture of flexible circuit boards. However, since the cost of copper is relatively high and the price of aluminum is much lower than that of copper, if the circuit can be etched on the aluminum foil, the cost of the whole flexible circuit board can be reduced; however, after the flexible circuit board is manufactured, soldering tin is needed on the circuit to perform subsequent mounting operation of the LED lamp beads in the later period, and soldering tin on the aluminum circuit is a difficult problem in the field of the industry, so that a solution is needed urgently.
Disclosure of Invention
The invention aims to solve the technical problems in the prior art and provides an LED (light-emitting diode) flexible circuit board without a conducting wire strip by replacing copper foil with aluminum foil and a preparation method thereof.
The invention provides a flexible circuit board of an LED leadless lamp strip, which comprises a circuit film layer and a conductive film layer which are compounded together, wherein the circuit film layer comprises a copper foil, a first insulating adhesive layer and a first PET film from top to bottom; the conductive film layer comprises an aluminum foil, a second insulating adhesive layer and a second PET film from top to bottom, an LED circuit is etched on the upper end face of the copper foil, a lead is etched on the upper end face of the aluminum foil, and the lower end face of the first PET film of the circuit film layer is connected with the upper end face of the aluminum foil lead layer of the conductive film layer through a third insulating adhesive layer; run through copper foil, first insulating glue layer, first PET membrane and third insulating glue layer and be equipped with the electrically conductive hole, the electrically conductive hole aligns with the wire on the aluminium foil, the electrically conductive downthehole packing has the electrically conductive copper post that makes LED circuit and wire switch on.
Furthermore, an annular copper ring is arranged at the top end of the conductive copper column and is conducted with the LED circuit and the conducting wire.
Further, the thickness of the aluminum foil is at least one time of that of the copper foil.
Further, the thickness of copper foil is 18um, the thickness of aluminium foil is 55 um.
Further, the thickness of the first PET film and the second PET film is 50-75 um.
Another object of the present invention is to provide a method for manufacturing a flexible circuit board of an LED wire-free strip, comprising the following steps:
s1, compounding of a circuit film layer: coating a first insulating glue layer on the first PET film, wherein the thickness of the first insulating glue layer is 15 mu m, directly compounding the copper foil on the first insulating glue layer of the first PET film after drying, sending the first PET film to an oven for curing, taking the first PET film out, naturally cooling the first PET film for later use, wherein the curing temperature is 140 DEG and the curing time is 8 hours;
s2, compounding the conductive film layer: coating a second insulating glue layer on the second PET film, wherein the thickness of the second insulating glue layer is 15 mu m, directly compounding the aluminum foil on the second insulating glue layer of the second PET film after drying, sending the second PET film to an oven for curing, taking the second PET film out, naturally cooling the second PET film for later use, and curing the second PET film at the curing temperature of 140 DEG and the curing time of 8 hours;
s3, after the conductive film layer is solidified, printing a lead on the upper end face of the aluminum foil by using a printer, drying, performing acid etching, cleaning, drying and rolling for later use;
s4, after the circuit film layer is solidified, coating a third insulating adhesive layer on the lower end face of the first PET film, drying, compounding a release film on the third insulating adhesive layer, punching conductive holes penetrating through the copper foil, the first insulating adhesive layer, the first PET film and the third insulating adhesive layer by using a punching machine, compounding the circuit film layer and the conductive film layer into a new film, and aligning the conductive holes of the circuit film layer with the leads of the conductive film layer;
s5, curing the new film once at the curing temperature of 140 ℃ and the curing time of 5 hours at 150 ℃;
s6, printing blue oil on the upper end face of the copper foil of the new film by using a printing machine, then performing acid etching on the upper end face of the copper foil to form an LED circuit, printing white oil by using a screen printing machine, drying and rolling;
s7, performing anti-oxidation treatment on the upper end face of the circuit film layer;
s8, feeding the new film into a screen printing machine, printing conductive copper paste into the conductive holes, cooling to form conductive copper columns, and conducting the LED circuit with the conducting wires through the conductive copper columns;
and S9, dividing the strips, and detecting and packaging the strips into the LED flexible circuit board without the conducting wires.
Further, the etching solution used in the acidic etching in the steps S3 and S6 is prepared from the following raw materials in percentage by weight: 70% of hydrochloric acid, 5% of chloride, 1% of ferric trichloride and the balance of water.
Further, the conductive copper paste is composed of the following substances in percentage by mass: 10-15% of trimethylolpropane trimethacrylate, 15-20% of N-vinyl pyrrolidone, 3-6% of tert-butyl perbenzoate, 7-10% of alkylphenol polyoxyethylene ether, 16-21% of silver-coated copper powder, 0.05-1% of fumed silica, 11-25% of mixed amyl alcohol, 2-5% of coupling agent and the balance of epoxy acrylic resin.
Further, the temperature of the etching solution during the acid etching was 45 degrees.
Preferably, the chloride salt is sodium chloride.
Compared with the prior art, the LED circuit is etched on the copper foil, the lead is etched on the aluminum foil, the LED circuit is communicated with the lead through the conductive copper column formed by the conductive copper paste, and the conductivity of the whole circuit board is equivalent to that of the flexible circuit board manufactured by the existing copper foil by adjusting the thickness of the aluminum foil, so that the fact that the copper foil is replaced by the aluminum foil is feasible, the cost is greatly reduced, and the economic benefit is very obvious; and can go up soldering tin on electrically conductive copper post after with LED circuit and direction intercommunication through electrically conductive copper post, solve the difficult problem that can't go up soldering tin on the aluminium foil among the prior art.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board of an LED wire-less strip according to the present invention.
Fig. 2 is another schematic structural diagram of the flexible circuit board of the LED wire-less strip according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. The specific embodiments described herein are merely illustrative of the invention and do not limit the invention.
Example 1
As shown in fig. 1, the flexible circuit board for an LED strip without conducting wires of this embodiment includes a circuit film layer and a conductive film layer that are combined together, where the circuit film layer includes, from top to bottom, a copper foil 1, a first insulating adhesive layer 2, and a first PET film 3; the conductive film layer comprises an aluminum foil 5, a second insulating adhesive layer 6 and a second PET film 7 from top to bottom, an LED circuit is etched on the upper end face of the copper foil 1, a lead is etched on the upper end face of the aluminum foil 5, and the lower end face of the first PET film 3 of the circuit film layer is connected with the upper end face of the lead layer of the aluminum foil 5 of the conductive film layer through a third insulating adhesive layer 4; run through copper foil 1, first insulating glue layer 2, first PET membrane 3 and third insulating glue layer 4 and be equipped with electrically conductive hole 8, electrically conductive hole 8 aligns with the wire on the aluminium foil 5, electrically conductive hole 8 intussuseption is filled with the electrically conductive copper post 9 that makes LED circuit and wire switch on.
In the embodiment, the LED circuit is etched on the copper foil 1, the wire is etched on the aluminum foil 5, and finally the LED circuit is communicated with the wire through the conductive copper column 9 formed by conductive copper paste, so that the LED flexible circuit board without the wire and the lamp strip is formed. Certainly, follow-up thereby can be at electrically conductive copper post top soldering tin carry out LED lamp pearl paster, just also solved the difficult problem that can't tin soldering on the aluminium foil among the prior art naturally.
In this embodiment, the thickness of the first PET film and the second PET film is 50-75 um.
In this embodiment, as shown in fig. 2, in order to facilitate subsequent LED lamp bead mounting, an annular copper ring 10 is disposed at the top end of the conductive copper column 9, and the annular copper ring 10 is conducted with an LED circuit and a wire, so as to facilitate soldering operation.
Because the conductivity of aluminum is weaker than that of copper, the conductivity of copper is 54.02485, the conductivity of aluminum is 35.33569, the conductivity of copper is 1.53 times that of aluminum, the thicknesses of copper foils commonly used in the market are 18um and 35um, and according to the conductivity difference of copper and aluminum, the copper foil with the thickness of 18um is taken as an example in the embodiment; in this embodiment, through the thickness of adjustment aluminium foil, the thickness of aluminium foil is one time of copper foil thickness at least, specifically, the thickness of copper foil 1 is 18um, the thickness of aluminium foil 5 is 55 um. The conductivity of the whole circuit board is equivalent to that of the flexible circuit board made of the existing copper foil, which indicates that the aluminum foil is feasible to replace the copper foil.
Example 2
The embodiment provides a method for manufacturing a flexible circuit board of an LED wire-free lamp strip, which comprises the following steps:
s1, compounding of a circuit film layer: coating a first insulating glue layer on the first PET film, wherein the thickness of the first insulating glue layer is 15 mu m, directly compounding the copper foil on the first insulating glue layer of the first PET film after drying, sending the first PET film to an oven for curing, taking the first PET film out, naturally cooling the first PET film for later use, wherein the curing temperature is 140 DEG and the curing time is 8 hours;
s2, compounding the conductive film layer: coating a second insulating glue layer on the second PET film, wherein the thickness of the second insulating glue layer is 15 mu m, directly compounding the aluminum foil on the second insulating glue layer of the second PET film after drying, sending the second PET film to an oven for curing, taking the second PET film out, naturally cooling the second PET film for later use, and curing the second PET film at the curing temperature of 140 DEG and the curing time of 8 hours;
s3, after the conductive film layer is solidified, printing a lead on the upper end face of the aluminum foil by using a printer, drying and then carrying out acid etching, wherein etching solution used for the acid etching is prepared from the following raw materials in percentage by weight: 70% of hydrochloric acid, 5% of chloride, 1% of ferric trichloride and the balance of water; the temperature of the etching solution is 45 ℃; cleaning, drying and rolling for later use;
s4, after the circuit film layer is solidified, coating a third insulating adhesive layer on the lower end face of the first PET film, drying, compounding a release film on the third insulating adhesive layer, punching conductive holes penetrating through the copper foil, the first insulating adhesive layer, the first PET film and the third insulating adhesive layer by using a punching machine, compounding the circuit film layer and the conductive film layer into a new film, and aligning the conductive holes of the circuit film layer with the leads of the conductive film layer;
s5, curing the new film once at the curing temperature of 140 ℃ and the curing time of 5 hours at 150 ℃;
s6, printing blue oil on the upper end face of the copper foil of the new film by using a printer, and then performing acid etching on the upper end face of the copper foil to form an LED circuit, wherein the etching solution used for the acid etching is prepared from the following raw materials in percentage by weight: 70% of hydrochloric acid, 5% of sodium chloride, 1% of ferric trichloride and the balance of water; the temperature of the etching solution is 45 ℃; printing white oil by a screen printer, drying and rolling;
s7, performing anti-oxidation treatment on the upper end face of the circuit film layer;
s8, feeding the new film into a screen printing machine, printing conductive copper paste into the conductive holes, cooling to form conductive copper columns, and conducting the LED circuit with the conducting wires through the conductive copper columns;
and S9, dividing the strips, and detecting and packaging the strips into the LED flexible circuit board without the conducting wires.
It should be noted that, in this embodiment, the conductive copper paste is composed of the following substances by mass percent: 10-15% of trimethylolpropane trimethacrylate, 15-20% of N-vinyl pyrrolidone, 3-6% of tert-butyl perbenzoate, 7-10% of alkylphenol polyoxyethylene ether, 16-21% of silver-coated copper powder, 0.05-1% of fumed silica, 11-25% of mixed amyl alcohol, 2-5% of coupling agent and the balance of epoxy acrylic resin. The conductive copper paste has good conductive performance, and the LED lamp bead paster can be conveniently and subsequently soldered at the top end of the conductive copper column.
In order to verify the advantages of the flexible circuit board of the LED wire-less strip of the invention, the test sample of the copper and aluminum conductive circuits (with a circuit width of 3mm) with a length of 1.2 m prepared in the above example 2 was compared to find that the resistance of the 55 micron thick aluminum foil circuit was 0.2 ohm and the resistance of the 35 micron thick copper foil circuit was 0.25 ohm, which indicates that it is feasible to improve the conductivity of the product by adjusting the thickness of the aluminum foil. In other words, it is entirely feasible to replace the copper foil with an aluminum foil.
In addition, it can be found by calculation that: at present, the market price of the copper foil with the thickness of 18 microns is 9 yuan/square meter, the market price of the aluminum foil with the thickness of 35 microns is 1.8 yuan/square meter, the difference between the two is 7.2 yuan/square meter, the market price of the copper foil with the thickness of 35 microns is 16 yuan/square meter, the market price of the aluminum foil with the thickness of 55 microns is 2.8 yuan/square meter, and the difference between the two is 13.2 yuan/square meter. Therefore, the aluminum foil is used for replacing the copper foil, so that the cost for processing and preparing the flexible circuit board of the LED wire-free lamp strip can be greatly reduced. At present, the monthly throughput of the domestic soft board market is more than 500 ten thousand square meters, and the economic benefit is very obvious.
The technical solution of the present invention is not limited to the limitations of the above specific embodiments, and all technical modifications made according to the technical solution of the present invention fall within the protection scope of the present invention.
Claims (10)
1. The utility model provides a LED does not have wire lamp area flexible line way board, includes the compound circuit rete and the electrically conductive rete that are in the same place, its characterized in that: the circuit film layer comprises a copper foil, a first insulating adhesive layer and a first PET film from top to bottom; the conductive film layer comprises an aluminum foil, a second insulating adhesive layer and a second PET film from top to bottom, an LED circuit is etched on the upper end face of the copper foil, a lead is etched on the upper end face of the aluminum foil, and the lower end face of the first PET film of the circuit film layer is connected with the upper end face of the aluminum foil lead layer of the conductive film layer through a third insulating adhesive layer; run through copper foil, first insulating glue layer, first PET membrane and third insulating glue layer and be equipped with the electrically conductive hole, the electrically conductive hole aligns with the wire on the aluminium foil, the electrically conductive downthehole packing has the electrically conductive copper post that makes LED circuit and wire switch on.
2. The LED wire-less strip flexible wiring board of claim 1, wherein: and the top end of the conductive copper column is provided with an annular copper ring, and the annular copper ring is communicated with the LED circuit and the lead.
3. The LED wire-less strip flexible wiring board of claim 1, wherein: the thickness of the aluminum foil is at least one time of that of the copper foil.
4. The LED leadless light strip flexible circuit board of claim 3, wherein: the thickness of copper foil is 18um, the thickness of aluminium foil is 55 um.
5. The LED wire-less strip flexible wiring board of claim 1, wherein: the thickness of first PET membrane and second PET membrane is 50-75 um.
6. A method for preparing the flexible circuit board of the LED leadless light belt of any one of claims 1-4, characterized by comprising the following steps:
s1, compounding of a circuit film layer: coating a first insulating glue layer on the first PET film, wherein the thickness of the first insulating glue layer is 15 mu m, directly compounding the copper foil on the first insulating glue layer of the first PET film after drying, sending the first PET film to an oven for curing, taking the first PET film out, naturally cooling the first PET film for later use, wherein the curing temperature is 140 DEG and the curing time is 8 hours;
s2, compounding the conductive film layer: coating a second insulating glue layer on the second PET film, wherein the thickness of the second insulating glue layer is 15 mu m, directly compounding the aluminum foil on the second insulating glue layer of the second PET film after drying, sending the second PET film to an oven for curing, taking the second PET film out, naturally cooling the second PET film for later use, and curing the second PET film at the curing temperature of 140 DEG and the curing time of 8 hours;
s3, after the conductive film layer is solidified, printing a lead on the upper end face of the aluminum foil by using a printer, drying, performing acid etching, cleaning, drying and rolling for later use;
s4, after the circuit film layer is solidified, coating a third insulating adhesive layer on the lower end face of the first PET film, drying, compounding a release film on the third insulating adhesive layer, punching conductive holes penetrating through the copper foil, the first insulating adhesive layer, the first PET film and the third insulating adhesive layer by using a punching machine, compounding the circuit film layer and the conductive film layer into a new film, and aligning the conductive holes of the circuit film layer with the leads of the conductive film layer;
s5, curing the new film once at the curing temperature of 140 ℃ and the curing time of 5 hours at 150 ℃;
s6, printing blue oil on the upper end face of the copper foil of the new film by using a printing machine, then performing acid etching on the upper end face of the copper foil to form an LED circuit, printing white oil by using a screen printing machine, drying and rolling;
s7, performing anti-oxidation treatment on the upper end face of the circuit film layer;
s8, feeding the new film into a screen printing machine, printing conductive copper paste into the conductive holes, cooling to form conductive copper columns, and conducting the LED circuit with the conducting wires through the conductive copper columns;
and S9, dividing the strips, and detecting and packaging the strips into the LED flexible circuit board without the conducting wires.
7. The method for preparing the flexible circuit board of the LED leadless lamp strip according to claim 6, wherein the method comprises the following steps: the etching solution used in the acidic etching in the steps S3 and S6 is prepared from the following raw materials in percentage by weight: 70% of hydrochloric acid, 5% of chloride, 1% of ferric trichloride and the balance of water.
8. The method for preparing the flexible circuit board of the LED leadless lamp strip according to claim 1, characterized in that: the conductive copper paste comprises the following substances in percentage by mass: 10-15% of trimethylolpropane trimethacrylate, 15-20% of N-vinyl pyrrolidone, 3-6% of tert-butyl perbenzoate, 7-10% of alkylphenol polyoxyethylene ether, 16-21% of silver-coated copper powder, 0.05-1% of fumed silica, 11-25% of mixed amyl alcohol, 2-5% of coupling agent and the balance of epoxy acrylic resin.
9. The method for preparing the flexible circuit board of the LED leadless lamp strip according to claim 7, wherein the method comprises the following steps: the temperature of the etching solution during the acid etching is 45 ℃.
10. The method for preparing the flexible circuit board of the LED leadless lamp strip according to claim 7, wherein the method comprises the following steps: the chloride salt is sodium chloride.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010686051.XA CN111629512A (en) | 2020-07-16 | 2020-07-16 | LED (light-emitting diode) wire-free lamp strip flexible circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010686051.XA CN111629512A (en) | 2020-07-16 | 2020-07-16 | LED (light-emitting diode) wire-free lamp strip flexible circuit board and preparation method thereof |
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| CN111629512A true CN111629512A (en) | 2020-09-04 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114360773A (en) * | 2022-02-15 | 2022-04-15 | 单县多米石墨烯科技有限公司 | Anti-oxidation flexible conductive film and preparation method thereof |
| CN114501856A (en) * | 2021-12-13 | 2022-05-13 | 深圳市华鼎星科技有限公司 | Multi-layer conductive circuit, manufacturing method thereof and display module |
-
2020
- 2020-07-16 CN CN202010686051.XA patent/CN111629512A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114501856A (en) * | 2021-12-13 | 2022-05-13 | 深圳市华鼎星科技有限公司 | Multi-layer conductive circuit, manufacturing method thereof and display module |
| CN114360773A (en) * | 2022-02-15 | 2022-04-15 | 单县多米石墨烯科技有限公司 | Anti-oxidation flexible conductive film and preparation method thereof |
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