KR100977260B1 - High Power LED Package and Manufacturing Method Thereof - Google Patents

High Power LED Package and Manufacturing Method Thereof Download PDF

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Publication number
KR100977260B1
KR100977260B1 KR1020070140815A KR20070140815A KR100977260B1 KR 100977260 B1 KR100977260 B1 KR 100977260B1 KR 1020070140815 A KR1020070140815 A KR 1020070140815A KR 20070140815 A KR20070140815 A KR 20070140815A KR 100977260 B1 KR100977260 B1 KR 100977260B1
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KR
South Korea
Prior art keywords
electrode
light emitting
emitting chip
led
heat sink
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Application number
KR1020070140815A
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Korean (ko)
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KR20090072644A (en
Inventor
김태진
Original Assignee
한국 고덴시 주식회사
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Priority to KR1020070140815A priority Critical patent/KR100977260B1/en
Publication of KR20090072644A publication Critical patent/KR20090072644A/en
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Publication of KR100977260B1 publication Critical patent/KR100977260B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

The present invention relates to a high brightness and high output light emitting LED package using an LED element as a light source, and a method of manufacturing the same. An upper electrode having an insulating pattern having a concave-convex structure is formed on an upper surface of the substrate, and is insulated from each other by an insulating pattern on a lower surface thereof. An anode electrode, a cathode electrode, and a heat sink are attached, and an electrode connection hole having a conductive plating film is formed to electrically connect the upper electrode, the anode electrode, and the cathode electrode, respectively, and a part of the LED joint is coupled to the heat sink. The printed circuit board is formed; A light emitting chip mounted on the heat sink of a portion where the LED cavity is formed; A wire electrically connecting the light emitting chip to the upper electrode; And a lens formed on the light emitting chip of the printed circuit board and formed by transfer molding, wherein the upper electrode of the printed circuit board is formed in a pattern of a concave-convex structure to prevent the lens from being separated. It is possible to enhance the heat dissipation effect from the LED element, it is possible to prevent the separation of the mold resin.

LED, Delamination, Insulation, Pattern

Description

High Power LED Package and Manufacturing Method Thereof

The present invention relates to a high brightness and high output light emitting LED package using an LED element as a light source, and a method of manufacturing the same. More specifically, it is possible to increase the heat dissipation effect from the LED element during light emission, and to reduce the delamination of a lens made of a mold resin. The present invention relates to an LED package capable of preventing delamination and a method of manufacturing the same.

The present invention can be used as a product applied to electric, electronics, automobiles, etc. that require a high power light emitting diode in addition to general lighting, backlighting of LCD displays, headlights of automobiles.

A conventional LED package having an LED element as a light source is operated by mounting an LED element on a substrate, electrically connecting it to a power source, and then emitting light.

In such an LED package, the LED element generates light and heat at the same time according to its characteristics, and when the external emission of the heat is good, it is not overheated so that its useful life and output efficiency can be maintained.

Currently, the surface mount high-power LED products equipped with heat sinks have two types, the LED products of the lead frame structure and the LED products of the printed circuit board.

In the case of the LED product of the lead frame structure, a lens is attached for condensing as a lead frame package of the resin structure, and the LED product of the printed circuit board is attached to the lens as a product using a ceramic substrate or an epoxy resin substrate.

However, the two methods are a method of attaching a lens, and the lenses must be injected separately, and the adhesion process of the lens is additionally required, resulting in a drop in productivity and a factor of price increase.

The present invention is to solve the above-mentioned conventional problems, by processing the lens in a transfer molding mold and working during molding, it is unnecessary to adhere the lens, lower the production cost of the product to achieve productivity and price stability The purpose is to provide an LED package that can be used.

Another object of the present invention is to provide an LED package that can improve the reliability of the product by preventing the delamination (DELAMINATION) by inserting the mold resin departure prevention pattern during pattern design.

Another object of the present invention is to provide an LED package that can be surface-mounted when using a customer by applying a printed circuit board with a metal heat sink and excellent heat dissipation efficiency.

In order to achieve the above object, in the present invention, a metal plating layer is formed on the upper surface of the high output LED package on the substrate, and the metal plating layer is formed of two closed curved upper electrodes and a non-electrode metal by insulated closed curve etching. The upper electrodes are selectively plated with gold to form a concave-convex shape to prevent detachment of the transfer molded lens, and an anode electrode, a cathode electrode, and a heat sink are insulated from each other by an insulating pattern on the lower surface of the substrate. A printed circuit board having an electrode connection hole having a conductive plating film formed thereon to electrically connect the two upper electrodes to the anode electrode and the cathode electrode, wherein an LED cavity is formed in a portion of the portion coupled to the heat sink; A light emitting chip mounted on the heat sink of a portion where the LED cavity is formed; A wire electrically connecting the light emitting chip to the upper electrode; And a lens formed over the light emitting chip and formed by transfer molding, and a pattern connected to the side of the package to form gold selectively on the closed curved upper electrodes to form a connection line. Package.

In the present invention, the upper electrode is formed in a doughnut shape having the LED cavity concentrically, and preferably formed in an insulating pattern divided into two so that each part electrically connected to the anode electrode and the cathode electrode is insulated from each other.

In the embodiment of the present invention, the upper electrode is formed in a donut shape having the LED cavity concentrically, and the donut-type electrode layer is divided into two so that each part electrically connected to the anode electrode and the cathode electrode is insulated from each other, and thus an insulating pattern It can be formed as.

In a preferred embodiment of the present invention, the bisected electrode layer is more preferably formed with a tail-shaped connecting line to be connected to the side for gold plating. This is to limit the gold plated portion to the donut-shaped electrode layer when a plurality of packages are formed on the substrate, and has an advantage of minimizing the gold film used.

In the present invention, it is preferable to form a gold plated layer on the upper electrode, the anode electrode, the cathode electrode and the heat sink.

This is because the copper surface of the electrode is well communicated with electricity, but can be easily oxidized, so that the wire may fall when the wire bonding with the light emitting chip is intact, thereby forming a gold plated layer on the electrode.

In the present invention, a plating layer is formed on a wall surface of the substrate constituting the LED cavity so that a reflector surface for reflecting light of the light emitting chip is formed, and the plating layer uses copper.

In addition, the anode electrode, the cathode electrode and the heat sink of the present invention is attached to the lower surface of the substrate with an electrically conductive adhesive, made of copper, the anode electrode and the cathode electrode is located on both sides of the heat sink.

In addition, a high output LED package manufacturing method for achieving the above object, comprising the steps of: manufacturing a substrate having a metal plating layer formed on the entire surface;
Forming an LED cavity for mounting a light emitting chip in the center of the substrate and forming electrode connection holes at both sides thereof;
The closed curve is etched on the metal plating layer to form an insulated two closed curved upper electrode and a non-electrode metal plating layer, and the upper electrodes may be selectively plated with gold so that a pattern connected to the package side is formed as a connecting line. Step being,
Plating a conductive plating film to be formed in the LED cavity and the electrode connection hole;
Attaching a copper plate to a bottom surface of the substrate;
Etching the copper plate and dividing the copper plate into a heat sink, an anode electrode, and a cathode electrode;
Selectively plating the upper electrodes on the upper surface to form an uneven structure on the upper surface;
Forming a gold plating layer on the anode electrode, the cathode electrode, and the heat sink at the bottom surface thereof;
Mounting a light emitting chip on the LED cavity;
Wire bonding the light emitting chip to the upper electrode; And
Mounting a lens on the light emitting chip by transfer molding;
It is made, including.

In the present invention, the attachment of the copper plate is preferably formed of a conductive adhesive in order to facilitate the electrical connection of the upper electrode and the lower electrode plate.

In the present invention, after the step of wire bonding the light emitting chip and the upper electrode may further comprise the step of manufacturing a white LED by coating the upper portion of the light emitting chip with a liquid resin containing a phosphor powder.

In the present invention, the plurality of light emitting chips may be molded at the same time, and then separated from each element by sawing a substrate. In the practice of the present invention, the metal plating layer is a donut-shaped circle consisting of two circles concentrically with the LED is divided into two, and is connected to the side of the package, it is more preferable to form a gold plating layer only on the donut-shaped electrode surface Do.

According to the present invention having the above configuration, it is possible to mass-produce a product as a manufacturing method using a printed circuit board, and to reduce the manufacturing cost by forming a lens using transfer molding on the substrate.

In addition, the surface shape of the uneven structure is formed on the upper surface of the printed circuit board to prevent the release of the mold resin to solve the delamination problem, by forming a heat sink on the bottom has an excellent effect of heat dissipation.

Hereinafter, an embodiment of the LED package of the present invention and a manufacturing method thereof will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing an LED package according to the present invention, Figures 2a to 2g is a cross-sectional view sequentially showing a manufacturing method of a printed circuit board according to the present invention, Figures 3a to 3d is a printing according to the present invention The circuit board is shown in layers.

In the LED package according to the present invention, as shown in FIG. 1, a copper plating layer 13 is formed on an upper surface of the substrate 12, and the copper plating layer 13 is formed of a metal other than the upper electrodes 13a and 13b. A printed circuit board formed of plating layers 13a 'and 13b', a light emitting chip 20 mounted in an LED cavity of the printed circuit board, the light emitting chip 20 and the upper electrodes 13a and 13b. It comprises a wire 50 for electrically connecting the lens 50 and the lens 60 which is covered on the light emitting chip 20 of the printed circuit board and manufactured by transfer molding.

The printed circuit board includes a substrate 12 made of an epoxy resin layer.

It is preferable that the substrate 12 is made of an epoxy resin layer having a thickness of 0.3 mm, and a copper plating layer 13 is formed on an upper surface thereof, and a pattern in the form of a closed curve is formed on the copper plating layer 13 to form an upper electrode ( 13a) 13b are formed.

In the printed circuit board of the present invention, electrode patterns for supplying power to the light emitting chip 20 are formed, and the electrode patterns are formed on the upper and lower surfaces of the substrate 12.

The electrode pattern formed on the upper surface of the printed circuit board 10 is for making an electrical connection with the light emitting chip 20 constituting the light source, and the electrode pattern formed on the lower surface of the LED package is a surface mounted device (SMD) type. It is mounted on the surface of another printed circuit board (not shown) to form a pad for making an electrical connection.

The upper electrodes 13a and 13b of the present invention are formed of an insulating pattern having an uneven structure to prevent delamination of the mold resin.

Specifically, the upper electrodes 13a and 13b of the present invention etch the copper plated layer 13 to form an insulating pattern having an uneven structure. As shown in FIG. 3B, an LED cavity in which the light emitting chip 20 is mounted is mounted. It is formed in the shape of a donut having a concentric circle (12a), and is divided into two so as to insulate each of the portions electrically connected to the electrode pattern formed on the bottom of the substrate. As shown in the figure, each of the upper electrodes 13a and 13b is preferably divided into two by forming an insulating surface in an obliquely inclined form.

As such, the upper plating layer may be formed in a pattern having an uneven structure to prevent detachment of the lens.

On the other hand, an anode electrode 10a, a cathode electrode 10c, and a heat sink 10b which are insulated from each other by an insulating pattern are attached to the bottom surface of the substrate 12.

The anode electrode 10a, the cathode electrode 10c, and the heat sink 10b are attached to the lower surface of the substrate 12 with an electrically conductive adhesive 11, and the electrically conductive adhesive 11 has excellent heat transfer. (Eg, Ag epoxy) is preferably used.

The anode electrode 10a, the cathode electrode 10c, and the heat sink 10b are preferably made of copper, and are formed by etching a copper film (t = 0.35mm).

In this case, as shown in FIG. 3D, the heat sink 10b is formed at the center, and the anode electrode 10a and the cathode electrode 10c are positioned at both sides of the heat sink 10b.

An LED cavity 12a is formed in a portion of the substrate 12 that is coupled to the heat sink 10b, and the upper electrodes 13a, 13b, the anode electrode 10a, and the cathode electrode Electrode connection holes 12b are provided to electrically connect 10c to each other.

That is, the upper and lower electrode patterns are electrically connected through the through holes Via 12b penetrating through the substrate 12. A plating layer 16 is formed in the electrode connecting holes 12b.

Meanwhile, a plating layer 15 is formed on a wall surface of the substrate constituting the LED cavity 12a so that a reflector surface for reflecting light of the light emitting chip 20 is formed, and the plating layer uses copper.

Further, gold plating layers 14a, 14b, 18a, 18b, and 18c are formed on the upper electrodes 13a and 13b, the anode electrode 10a, the cathode electrode 10c, and the heat sink 10b.

As described above, forming a gold plated layer on the surface of the electrode may be easily oxidized, although the copper surface of the electrode may be easily oxidized, so that the wire 50 may fall when wire bonding with the light emitting chip 20 as it is. In this case, gold-plated layers 14a, 14b, 18a, 18b, and 18c are formed on the copper electrode.

3A to 3D are plan views illustrating the printed circuit board according to the present invention layer by layer, and FIG. 3A shows the display of the cathode mark M on the first layer of the copper plating layer 13 using the printing method. 3B shows that the first layer has a pattern for preventing the upper electrode and the delamination (DELAMINATION), each electrode is insulated.

As described above, the first layer is formed by etching the copper plating layer 13 to form an insulating pattern having a concave-convex structure. The first layer is formed in a donut shape having concentric circles of the LED cavity 12a on which the light emitting chip 20 is mounted. Each part electrically connected to the electrode pattern formed at the bottom of the substrate may be divided into two parts so as to be insulated from each other. As shown in the figure, each of the upper electrodes 13a and 13b is preferably divided into two by forming an insulating surface in an obliquely inclined form.

3C is a plan view showing a second layer, which is an insulating epoxy resin layer, in which a reflecting reflector surface is formed on the wall surface of the LED cavity 12a, and electrode connection holes 12b are formed on both sides, so that currents of the upper and lower electrodes are formed. Used as a connecting passage.

FIG. 3D is a plan view showing a third layer used as an SMT terminal, and includes an anode terminal 10a, a heat sink 10b, and a cathode terminal 10c.

The method of manufacturing an LED package according to the present invention as described above undergoes the following process steps.

First, after manufacturing a substrate 12 having a metal plating layer 13 formed on its upper surface (FIG. 2A), an LED cavity 12a for mounting a light emitting chip in the center of the substrate 12 is formed, and electrodes are formed on both sides thereof. The connection hole 12b is formed (FIG. 2B).

Here, the metal plating layer 13 is preferably made of a copper plating layer, and the LED cavity 12a and the electrode connection hole 12b drill holes.

Thereafter, the metal plating layer 13 of the substrate is etched to form upper electrodes 13a and 13b having an insulating pattern having an uneven structure. (FIG. 2C).

Thereafter, plating is performed such that conductive plating films 15 and 16 are formed in the LED cavity 12a and the electrode connection hole 12b.

Subsequently, a copper plate 10 is attached to the lower surface of the substrate 12 with an electrically conductive adhesive 11 (FIG. 2E), and the copper plate 10 is etched to etch the heat sink 10b, the anode electrode 10a, and the cathode electrode. Divide by 10c. (FIG. 2F)

Subsequently, gold plated layers 14a, 14b, 18a, 18b, and 18c are formed on the upper electrode, the anode electrode, the cathode electrode, and the heat sink to complete the manufacture of the printed circuit board.

4 is a plan view illustrating a printed circuit board completed according to the present invention.

5 is a photograph showing a front surface of a printed circuit board manufactured according to the present invention, and FIG. 6 is a photograph showing a back surface of a printed circuit board manufactured according to the present invention and manufactured using the printed circuit board according to the present invention. The method allows mass production of the product.

In the method of manufacturing a package using the printed circuit board manufactured as described above, the light emitting chip 20 is mounted in the LED cavity 12a, and the light emitting chip 20 and the upper electrodes 13a and 13b are formed. The wire 50 is bonded to the gold plating layers 14a and 14b, and the lens 60 is mounted on the light emitting chip 20 by transfer molding to complete the manufacture of the package.

In the present invention, after the step of wire bonding the light emitting chip and the upper electrode may further comprise the step of manufacturing a white LED by coating the upper portion of the light emitting chip with a liquid resin containing a phosphor powder.

Figure 7 is a photograph showing the LED package manufactured according to the present invention, the bisected electrode layer is formed with a tail-shaped connecting line 200 to be connected to the side for gold plating. The LED package of the present invention can solve the delamination problem by forming the lens 60 using the transfer molding on the substrate while preventing the separation of the mold resin by forming a pattern shape of the uneven structure.

1 is a cross-sectional view showing an LED package according to the present invention,

2A to 2G are cross-sectional views sequentially illustrating a method of manufacturing a printed circuit board according to the present invention;

3A to 3D show a printed circuit board according to the present invention layer by layer,

3A is a plan view of a cathode mark printed on a first layer;

3B is a plan view showing a first layer,

3C is a plan view showing a second layer,

3D is a plan view showing a third layer,

4 is a plan view showing a printed circuit board completed according to the present invention;

5 is a photograph showing a front surface of a printed circuit board manufactured according to the present invention;

6 is a photograph showing the back side of a printed circuit board manufactured according to the present invention;

Figure 7 is a photograph showing the LED package manufactured according to the present invention.

<Description of the symbols for the main parts of the drawings>

Claims (9)

A metal plating layer is formed on the upper surface of the substrate as a whole, and the metal plating layer is divided into two closed curved upper electrodes and a non-electrode metal plating layer by insulated closed curve etching, and the upper electrodes are selectively plated with gold to form a trans To form the irregularities to prevent the detachment of the fur-molded lens, An anode electrode, a cathode electrode, and a heat sink insulated from each other by an insulating pattern are attached to the lower surface of the substrate, An electrode connection hole having a conductive plating film formed thereon to electrically connect the two upper electrodes to the anode electrode and the cathode electrode, A printed circuit board having an LED cavity formed in a portion of the portion coupled to the heat sink; A light emitting chip mounted on the heat sink of a portion where the LED cavity is formed; A wire electrically connecting the light emitting chip to the upper electrode; And a lens covering the light emitting chip and manufactured by transfer molding. The high power LED package, characterized in that the pattern is connected to the side of the package to selectively plate the gold on the closed curved top electrode is formed by a connecting line. The method of claim 1, The closed lead-type upper electrode is a high power LED package, characterized in that the donut having a concentric circle of the LED cavity is formed of two electrodes of a bisected form. The method according to claim 1 or 2, High-power LED package, characterized in that to form a gold-plated layer on the anode, cathode and heat sink. The method of claim 1, And a plating layer is formed on a wall surface of the substrate constituting the LED cavity so that a reflector surface for reflecting light of the light emitting chip is formed. delete The method of claim 1, The anode electrode, the cathode electrode and the heat sink is made of copper, the high output LED package, characterized in that the anode electrode and the cathode electrode is located on both sides of the heat sink. Manufacturing a substrate having a metal plating layer formed on an entire surface thereof; Forming an LED cavity for mounting a light emitting chip in the center of the substrate and forming electrode connection holes at both sides thereof; The closed curve is etched on the metal plating layer to form an insulated two closed curved upper electrode and a non-electrode metal plating layer, and the upper electrodes may be selectively plated with gold so that a pattern connected to the package side is formed as a connecting line. Step being, Plating a conductive plating film to be formed in the LED cavity and the electrode connection hole; Attaching a copper plate to a bottom surface of the substrate; Etching the copper plate and dividing the copper plate into a heat sink, an anode electrode, and a cathode electrode; Selectively plating the upper electrodes on the upper surface to form an uneven structure on the upper surface; Forming a gold plating layer on the anode electrode, the cathode electrode, and the heat sink at the bottom surface thereof; Mounting a light emitting chip on the LED cavity; Wire bonding the light emitting chip to the upper electrode; And Mounting a lens on the light emitting chip by transfer molding; High output LED package manufacturing method that includes a. The method of claim 7, wherein After the step of wire bonding the light emitting chip and the upper electrode, the method of manufacturing a high output LED package, characterized in that it further comprises the step of coating a top of the light emitting chip with a liquid resin containing phosphor powder to produce a white LED. The method of claim 7, wherein the two closed curved upper electrodes have a donut-shaped concentric circle made up of two circles.
KR1020070140815A 2007-12-28 2007-12-28 High Power LED Package and Manufacturing Method Thereof KR100977260B1 (en)

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KR101204428B1 (en) 2010-04-08 2012-11-26 신찬수 Fabrication method of light emitting diode LED package using SOI wafer
WO2018117361A1 (en) * 2016-12-23 2018-06-28 주식회사 루멘스 Micro led module and manufacturing method therefor

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WO2018117361A1 (en) * 2016-12-23 2018-06-28 주식회사 루멘스 Micro led module and manufacturing method therefor
US10410998B2 (en) 2016-12-23 2019-09-10 Lumens Co., Ltd. Micro-LED module and method for fabricating the same

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