CN214898493U

CN214898493U - Chip packaging level light source

Info

Publication number: CN214898493U
Application number: CN202121563637.3U
Authority: CN
Inventors: 董达胜; 欧阳响堂; 付木波
Original assignee: Shenzhen Xin Ju Neng Electronics Co ltd
Current assignee: Shenzhen Xin Ju Neng Electronics Co ltd
Priority date: 2021-07-10
Filing date: 2021-07-10
Publication date: 2021-11-26
Anticipated expiration: 2031-07-10

Abstract

The utility model is suitable for a LED lamp support technical field. The utility model discloses a chip packaging light source, which comprises an LED chip (10), a carrier plate (20) and fluorescent glue (30); the LED chip (10) is provided with two electrodes (11); the carrier plate (20) is provided with two through holes (21); the diameter of each through hole (21) is less than one millimeter, and a circuit pad pattern (211) is arranged on the side edge of each through hole (21); the beneficial effects of the utility model reside in that: firstly, automatic production can be realized, and light-splitting braiding is carried out; secondly, the product can be improved by utilizing the structure of the existing industrial equipment; thirdly, the product has high mounting yield and replaces CSP lamp beads; fourthly, replacing the existing red copper bracket light source with 0.5 watt; fifth, the coating is better applied to the lighting market, the atmosphere market and the decoration market; sixthly, the heat dissipation is good, the structure is simple, the manufacturing cost is low, and the production is easy.

Description

Chip packaging level light source

Technical Field

The utility model relates to a LED lamp support technical field, in particular to chip package level light source.

Background

An LED (Light Emitting Diode) is a solid semiconductor device, which can directly convert electrical energy into Light, and has the advantages of small size, low power consumption, long service life, high brightness, low heat, environmental protection, firmness and durability, and is one of the most ideal Light sources. In daily life, LED lamp light sources are more and more widely used.

The existing LED lamp light source has the following defects: firstly, automatic production cannot be realized; secondly, the product mounting yield is low; thirdly, as the power increases, the cost of packaging the LED lamp rises sharply; fourthly, the cost of the LED lamp is lower than 0.5 watt for the red copper packaging substrate; fifthly, the cost performance cannot be embodied, and the application field is narrow.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the main technical problem who solves provides a chip package level light source, and its heat dissipation is good, simple structure, and the cost of manufacture is low, easily production.

In order to solve the above problems, the present invention provides a chip package level light source, which includes an LED chip, a carrier plate, and a fluorescent glue; the LED chip is provided with two electrodes; the carrier plate is in a square sheet shape, is made of an insulating copper-clad plate and has the thickness of less than one millimeter; the carrier plate is provided with two conducting holes; the diameter of each through hole is less than one millimeter, and a circuit pad graph is arranged on the side edge of each through hole; the front surface and the back surface of the carrier plate are the same, namely a circuit pad pattern is arranged on the side edge of the through hole on the back surface of the carrier plate; the LED chip is packaged on the carrier plate, namely, the two ends of the LED chip are respectively provided with a circuit pad pattern, and the fluorescent glue covers the LED chip.

Furthermore, the circuit pad pattern is used for connecting a power supply to supply power to the LED chip.

Furthermore, the fluorescent glue is used for converting light emitted by the LED chip into required light color to achieve different rated photoelectric indexes.

Furthermore, the via hole is plated through VCP, and hole copper is formed on the hole wall, so that the circuit pad pattern on the front side of the carrier plate is connected with the circuit pad pattern on the back side of the carrier plate.

Furthermore, in the process of encapsulating the LED chip on the carrier plate, different circuit patterns are designed according to different specifications of the LED chip.

Furthermore, the circuit pad pattern is printed with a layer of solder resist on the surface, and the required chip pad pattern is exposed by exposure and development technology.

Furthermore, the insulating copper-clad plate is made of epoxy resin glue, ceramic filler and glass fiber cloth and is formed by pressing the insulating copper-clad plate and the electronic copper foil.

The beneficial effects of the utility model reside in that: firstly, automatic production can be realized, and light-splitting braiding is carried out; secondly, the product can be improved by utilizing the structure of the existing industrial equipment; thirdly, the product has high mounting yield and replaces CSP lamp beads; fourthly, replacing the existing red copper bracket light source with 0.5 watt; fifth, the coating is better applied to the lighting market, the atmosphere market and the decoration market; sixthly, the heat dissipation is good, the structure is simple, the manufacturing cost is low, and the production is easy.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic cross-sectional view of the present invention.

Fig. 2 is a top view of fig. 1.

Fig. 3 is a schematic view of the carrier plate of the present invention.

Fig. 4 is a side view of the LED chip of the present invention.

The objects, features and advantages of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments, not all embodiments, of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

The first embodiment is as follows:

as shown in fig. 1 to 4, the chip package level light source includes an LED chip 10, a carrier 20, and a fluorescent glue 30; the LED chip 10 is provided with two electrodes 11; the carrier plate 20 is in a square sheet shape, is made of an insulating copper-clad plate and has a thickness less than one millimeter; the carrier plate 20 is provided with two via holes 21; the diameter of the via holes 21 is less than one millimeter, and a circuit pad pattern 211 is arranged on the side edge of each via hole 21; the front surface of the carrier plate 20 is the same as the back surface thereof, i.e. a circuit pad pattern 211 is arranged on the side edge of the via hole 21 on the back surface thereof; the LED chip 10 is packaged on the carrier 20, that is, the two ends of the LED chip 10 are respectively mounted on the circuit pad patterns 211, and the fluorescent glue 30 covers the LED chip 10.

As shown in fig. 1 to 4, the circuit pad pattern 211 is used for connecting a power supply to supply power to the LED chip 10.

As shown in fig. 1 and 2, the fluorescent glue 30 is used to convert the light emitted from the LED chip 10 into a desired light color to achieve different additional photoelectric indexes.

As shown in fig. 1 to fig. 3, the via hole 21 is formed with a via copper wall by VCP electroplating, so that the circuit pad pattern 211 on the front surface of the carrier board 20 is electrically connected to the circuit pad pattern 211 on the back surface thereof.

As shown in fig. 1 to 4, in the process of encapsulating the LED chip 10 on the carrier 20, different circuit patterns are designed according to different specifications of the LED chip 10.

As shown in fig. 1 to 3, the circuit pad pattern 211 is printed with a layer of solder resist on its surface, and the required chip pad pattern is exposed by exposure and development; the glass has the effects of beauty, insulation, light reflection and the like; pad patterns, namely pads, basic construction units of surface mount assembly, which are used for constructing pad patterns of a circuit board, namely various pad combinations designed for special element types; the exposure and development technology refers to the exposure imaging and development technology used when the circuit pattern is manufactured on the PCB multi-layer circuit board or the flexible circuit board.

As shown in fig. 1, the insulating copper-clad plate is made of epoxy resin glue, ceramic filler and glass fiber cloth, and is formed by pressing with an electronic copper foil; the thermal conductivity coefficient is more than or equal to 0.6 w/m.k.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: it is to be understood that modifications may be made to the above-described arrangements in the embodiments or equivalents may be substituted for some of the features of the embodiments without departing from the spirit or scope of the present invention.

Claims

1. The chip packaging light source is characterized by comprising an LED chip (10), a carrier plate (20) and fluorescent glue (30); the LED chip (10) is provided with two electrodes (11); the carrier plate (20) is in a square sheet shape, is made of an insulating copper-clad plate and is less than one millimeter thick; the carrier plate (20) is provided with two through holes (21); the diameter of each through hole (21) is less than one millimeter, and a circuit pad pattern (211) is arranged on the side edge of each through hole (21); the front surface and the back surface of the carrier plate (20) are the same, namely a circuit pad pattern (211) is arranged on the side edge of the through hole (21) on the back surface; the LED chip (10) is packaged on the carrier plate (20), namely, the two ends of the LED chip (10) are respectively provided with a circuit pad pattern (211), and the fluorescent glue (30) covers the LED chip (10).

2. The chip package level light source in claim 1, wherein the circuit pad pattern (211) is used to connect a power supply to power the LED chip (10).

3. The chip package level light source according to claim 1, wherein the fluorescent glue (30) is used to convert the light emitted from the LED chip (10) into a desired light color to achieve different nominal luminous indices.

4. The light source of claim 1, wherein the via hole (21) is formed by VCP plating to form a copper via hole, so that the circuit pad pattern (211) on the front side of the carrier (20) is electrically connected to the circuit pad pattern (211) on the back side.

5. The LED chip package level light source according to claim 1, wherein the LED chips (10) are designed into different circuit patterns according to different LED chip (10) specifications during the process of packaging the LED chips (10) on the carrier board (20).

6. The chip package level light source of claim 1, wherein the circuit pad pattern (211) is printed with a solder resist on its surface, and the required chip pad pattern is exposed by exposure and development.

7. The chip package level light source of claim 1, wherein the insulating copper-clad plate is made of epoxy resin glue, ceramic filler and glass fiber cloth, and is formed by laminating with an electronic copper foil.