CN208142172U - A kind of small spacing lamp bead encapsulating structure based on SMD technology - Google Patents
A kind of small spacing lamp bead encapsulating structure based on SMD technology Download PDFInfo
- Publication number
- CN208142172U CN208142172U CN201820589044.6U CN201820589044U CN208142172U CN 208142172 U CN208142172 U CN 208142172U CN 201820589044 U CN201820589044 U CN 201820589044U CN 208142172 U CN208142172 U CN 208142172U
- Authority
- CN
- China
- Prior art keywords
- fixedly installed
- lamp bead
- mounting rack
- encapsulating structure
- small spacing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of small spacing lamp bead encapsulating structure based on SMD technology, including substrate, the upper end of the substrate is fixedly installed mounting rack, two sides are fixedly installed ventilation duct respectively inside the mounting rack, the inside lower end of mounting rack is fixedly installed insulating layer between two ventilation ducts, the upper end of the insulating layer is fixedly installed copper foil layer, the upper end of the copper foil layer is fixedly installed conducting resinl, the upper end of the conducting resinl is fixedly installed installation part, the upper end of the installation part is fixedly installed several installation pedestals respectively, the upper end of the installation pedestal is fixedly installed pcb board, the upper end of the pcb board is fixedly installed several LED chips.The utility model will become white light after the light reflection mixing of different colours by setting radiation mixed organization and project away, lamp bead is made of yellow light sources and at least two monochromatic source of blue light source, possesses wider colour gamut, avoids light-source structure complicated, production is difficult and expensive.
Description
Technical field
The utility model relates to lamp bead encapsulating structure field, specially a kind of small spacing lamp bead encapsulation based on SMD technology
Structure.
Background technique
SMD is meant：Surface mount device, it is one of SMT component, in the primary rank of electronic circuit board production
Section, via hole assembly are completed by manually completely.After first batch of automatic machinery is released, they can place some simple patch members
Part, but there is still a need for place that wave-soldering can be carried out by hand for complicated element.Surface mount device mainly have rectangle slice component,
Cylindrical slice component, compound slice component, special-shaped slice component, current some lamp beads shared body when actual use
Product is larger, is unfavorable for using and install, LED light is one piece of electroluminescent chip of semiconductor material, with elargol or latex solidified
Onto bracket, is then sealed with silver wire or gold thread connection chip and circuit board, surrounding with epoxy resin, play protection internal core
Effect, shell is finally installed, so the anti-seismic performance of LED light is good, we feel to see white light, in fact this only it is blue with
The complex light of yellow two kinds of color mixing together, existing white light LEDs lamp bead encapsulation be added by blue chip fluorescent powder mix and
At white light, for colour gamut generally 72% or so, the light-source structure is complicated, and production is difficult.If high 100% or more colour gamut can pass through indigo plant
Light lamp bar+quantum dot diaphragm is realized, but quantum dot diaphragm is expensive, and the service life is short.
Utility model content
The purpose of this utility model is to provide a kind of small spacing lamp bead encapsulating structure based on SMD technology, on solving
State the problem of proposing in background technique.
To achieve the above object, the utility model provides the following technical solutions：A kind of small spacing lamp bead based on SMD technology
Encapsulating structure, including substrate, the upper end of the substrate are fixedly installed mounting rack, and fixation is set respectively for two sides inside the mounting rack
Be equipped with ventilation duct, the inside lower end of mounting rack is fixedly installed insulating layer between two ventilation ducts, the insulating layer it is upper
End is fixedly installed copper foil layer, and the upper end of the copper foil layer is fixedly installed conducting resinl, the upper end fixed setting of the conducting resinl
There is installation part, the upper end of the installation part is fixedly installed several installation pedestals respectively, and the upper end fixation of the installation pedestal is set
Be equipped with pcb board, the upper end of the pcb board is fixedly installed several LED chips, the upper end LED chip of the installation pedestal it is outer
Side is fixedly installed packaging plastic, and the upper end of the packaging plastic is fixedly installed reflection mixed organization, and the lower end of the substrate is fixed
It is provided with heat-conducting glue, the lower end of the heat-conducting glue is fixedly installed heat sink.
Preferably, the two sides of the mounting rack are fixedly installed terminal pin.
Preferably, the upper end of the mounting rack is fixedly equipped with lens.
Preferably, for several LED chips at least provided with two, two LED chips are respectively yellow light, blue light.
Preferably, it is electrically connected between the LED chip by bonding line, passes through electricity between the bonding line and terminal pin
Property connection.
Compared with prior art, the utility model has the beneficial effects that：
1, LED chip is welded on pcb board by the utility model, is connected terminal pin with LED chip by bonding line, is connect
Circuit between logical LED chip and LED chip, and then lead to chip light emitting, the heat transfer for being run device by heat-conducting glue
It is extremely heat sink, it is radiated by heat sink, avoids chip due to the excessively high damage of temperature, while LED chip is carried out by ventilation duct
Heat dissipation, improves the service life of device, while insulating layer is arranged, the circuit on printed circuit board is avoided to interfere the work of chip, leads to
It crosses packaging plastic to fix chip, is stand-by circuit by setting copper foil layer, avoid route from damaging or wherein some chip damages
It is bad and device is caused integrally to deactivate, white light will be become after the light reflection mixing of different colours by setting reflection mixed organization and projected
It goes out, lamp bead is made of yellow light sources and at least two monochromatic source of blue light source, is possessed wider colour gamut, is avoided light-source structure
Complexity, production are difficult and expensive.
2, the utility model is projected by setting lens convenient for the polymerization of light source, is improved intensity of illumination, is improved heat dissipation and subtract
Light decay is lacked, by the way that terminal pin is arranged, installation and easy-to-connect convenient for device are convenient for by setting installation part and installation pedestal
The installation of device and the fixation of LED chip, improve the stability of device.
Detailed description of the invention
Fig. 1 is a kind of small spacing lamp bead encapsulating structure overall structure diagram based on SMD technology of the utility model；
Fig. 2 is the enlarged view in a kind of small spacing lamp bead encapsulating structure Fig. 1 based on SMD technology of the utility model at A.
In figure：1- substrate；2- mounting rack；3- ventilation duct；4- insulating layer；5- copper foil layer；6- conducting resinl；7- installation part；8-
Installation pedestal；9-PCB plate；10-LED chip；11- packaging plastic；12- heat-conducting glue；13- is heat sink；14- terminal pin；15- lens；16-
Bonding line；17- reflects mixed organization.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
The utility model provides a kind of technical solution referring to FIG. 1-2,：A kind of small spacing lamp bead envelope based on SMD technology
Assembling structure, including substrate 1, the upper end of the substrate 1 are fixedly installed mounting rack 2, and the 2 inside two sides of mounting rack are fixed respectively
It is provided with ventilation duct 3, the inside lower end of mounting rack 2 is fixedly installed insulating layer 4, the insulation between two ventilation ducts 3
The upper end of layer 4 is fixedly installed copper foil layer 5, and the upper end of the copper foil layer 5 is fixedly installed conducting resinl 6, the conducting resinl 6 it is upper
End is fixedly installed installation part 7, and the upper end of the installation part 7 is fixedly installed several installation pedestals 8, the installation pedestal respectively
8 upper end is fixedly installed pcb board 9, and the upper end of the pcb board 9 is fixedly installed several LED chips 10, the installation pedestal 8
The outside of upper end LED chip 10 be fixedly installed packaging plastic 11, the upper end of the packaging plastic 11 is fixedly installed reflection mixing
Mechanism 17, the lower end of the substrate 1 are fixedly installed heat-conducting glue 12, and the lower end of the heat-conducting glue 12 is fixedly installed heat sink 13.
The two sides of the mounting rack 2 are fixedly installed terminal pin 14, connect circuit convenient for the installation of device；The mounting rack
2 upper end is fixedly equipped with lens 15, projects convenient for the polymerization of light source, improves intensity of illumination, improving heat dissipation reduces light decay；If
The LED chip 10 is done at least provided with two, two LED chips 10 are respectively yellow light, blue light；The LED chip 10
Between be electrically connected by bonding line 16, by being electrically connected between the bonding line 16 and terminal pin 14, be convenient for circuit connection.
Working principle：In use, LED chip 10 is welded on pcb board 9, by bonding line 16 by terminal pin 14 and LED
Chip 10 connects, and connects the circuit between LED chip 10 and LED chip 10, and then lead to chip light emitting, will by heat-conducting glue 12
The heat transfer of device operation radiates by heat sink 13 to heat sink 13, avoids chip due to the excessively high damage of temperature, lead to simultaneously
It crosses ventilation duct 3 to radiate to LED chip 10, improves the service life of device, while insulating layer 4 is set and avoids printed circuit board
On circuit interference chip work, chip is fixed by packaging plastic 11, by setting copper foil layer 5 be stand-by circuit, avoid
Route damage or wherein some wafer damage and cause device integrally to deactivate, by setting reflection mixed organization 17 will be different
Become white light after the light reflection mixing of color to project away, lamp bead is by least two sets of monochromatic light sources of yellow light sources and blue light source
At possessing wider colour gamut, avoid light-source structure complicated, production is difficult and expensive, is convenient for light source by setting lens 15
Polymerization projection, improve intensity of illumination, improving heat dissipation reduces light decay, by be arranged terminal pin 14, convenient for the installation of device
And easy-to-connect improves device by setting installation part 7 and installation pedestal 8 convenient for the installation of device and the fixation of LED chip 10
Stability.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of small spacing lamp bead encapsulating structure based on SMD technology, including substrate (1), it is characterised in that；The substrate (1)
Upper end be fixedly installed mounting rack (2), the internal two sides of the mounting rack (2) are fixedly installed ventilation duct (3) respectively, two institutes
The inside lower end for stating mounting rack (2) between ventilation duct (3) is fixedly installed insulating layer (4), and the upper end of the insulating layer (4) is fixed
It is provided with copper foil layer (5), the upper end of the copper foil layer (5) is fixedly installed conducting resinl (6), and the upper end of the conducting resinl (6) is solid
Surely it is provided with installation part (7), the upper end of the installation part (7) is fixedly installed several installation pedestals (8) respectively, the installation base
The upper end of seat (8) is fixedly installed pcb board (9), and the upper end of the pcb board (9) is fixedly installed several LED chips (10), institute
It states and is fixedly installed packaging plastic (11) on the outside of the upper end LED chip (10) of installation pedestal (8), the upper end of the packaging plastic (11)
It is fixedly installed reflection mixed organization (17), the lower end of the substrate (1) is fixedly installed heat-conducting glue (12), the heat-conducting glue
(12) lower end is fixedly installed heat sink (13).
2. a kind of small spacing lamp bead encapsulating structure based on SMD technology according to claim 1, it is characterised in that：It is described
The two sides of mounting rack (2) are fixedly installed terminal pin (14).
3. a kind of small spacing lamp bead encapsulating structure based on SMD technology according to claim 1, it is characterised in that：It is described
The upper end of mounting rack (2) is fixedly equipped with lens (15).
4. a kind of small spacing lamp bead encapsulating structure based on SMD technology according to claim 1, it is characterised in that：It is several
For the LED chip (10) at least provided with two, two LED chips (10) are respectively yellow light, blue light.
5. a kind of small spacing lamp bead encapsulating structure based on SMD technology according to claim 1, it is characterised in that：It is described
It is electrically connected between LED chip (10) by bonding line (16), passes through electrical property between the bonding line (16) and terminal pin (14)
Connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820589044.6U CN208142172U (en) | 2018-04-24 | 2018-04-24 | A kind of small spacing lamp bead encapsulating structure based on SMD technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820589044.6U CN208142172U (en) | 2018-04-24 | 2018-04-24 | A kind of small spacing lamp bead encapsulating structure based on SMD technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208142172U true CN208142172U (en) | 2018-11-23 |
Family
ID=64310868
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820589044.6U Expired - Fee Related CN208142172U (en) | 2018-04-24 | 2018-04-24 | A kind of small spacing lamp bead encapsulating structure based on SMD technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208142172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880495A (en) * | 2019-11-30 | 2020-03-13 | 日照市东港区炫腾光电厂 | LED lamp bead |
-
2018
- 2018-04-24 CN CN201820589044.6U patent/CN208142172U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880495A (en) * | 2019-11-30 | 2020-03-13 | 日照市东港区炫腾光电厂 | LED lamp bead |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5288161B2 (en) | Light emitting module and lighting device | |
| CN102893418B (en) | Light emitting unit and illuminating apparatus | |
| CN102544341B (en) | Light emitting device and illumination apparatus using same | |
| CN103346247B (en) | A kind of flexibility COB encapsulation LED and preparation method thereof | |
| JP2015005524A (en) | Light emitting module and lighting device | |
| CN105185889B (en) | Naked brilliant encapsulation tunable optical photoelectric integral LED illumination component and manufacturing process | |
| CN106252343B (en) | A kind of optoelectronic integration COB light source and preparation method thereof | |
| US8143641B2 (en) | Integrated-type LED and manufacturing method thereof | |
| TWI802609B (en) | Illumination device with mounting substrate for LED lighting | |
| CN107785474A (en) | Light-emitting diode device and its preparation method | |
| KR20100028134A (en) | Light emitting diode module | |
| CN208142172U (en) | A kind of small spacing lamp bead encapsulating structure based on SMD technology | |
| EP4016649A1 (en) | Light-emitting device and manufacturing method, and display screen and lighting equipment comprising said light-emitting device | |
| CN203377266U (en) | Flexible COB (chip on board) packaging LED | |
| KR100954858B1 (en) | A high-luminance led package and method for manufacturing thereof | |
| CN115274635A (en) | LED light source packaging structure with high light efficiency and high heat conduction and manufacturing process thereof | |
| CN206419687U (en) | A kind of Novel LED light | |
| KR20120003558U (en) | An Improved Illuminating Device of Light Emitting Diode LED Wafer Holder | |
| CN208093557U (en) | A kind of direct-injection type light source | |
| CN205542879U (en) | Solderless LED display screen | |
| KR100691124B1 (en) | Manufacturing method for light emitting diode package | |
| CN110767640A (en) | Cavity body integrated structure support | |
| CN212085000U (en) | COB light source | |
| CN219435896U (en) | LED bulb lighting chip structure | |
| CN114038979B (en) | LED packaging support |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181123 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |