JP2012212824A - Led mount substrate - Google Patents

Led mount substrate Download PDF

Info

Publication number
JP2012212824A
JP2012212824A JP2011078580A JP2011078580A JP2012212824A JP 2012212824 A JP2012212824 A JP 2012212824A JP 2011078580 A JP2011078580 A JP 2011078580A JP 2011078580 A JP2011078580 A JP 2011078580A JP 2012212824 A JP2012212824 A JP 2012212824A
Authority
JP
Japan
Prior art keywords
led
adhesive layer
opening
light
reflecting member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011078580A
Other languages
Japanese (ja)
Inventor
Akira Shimizu
明 清水
Ryoji Sugiura
良治 杉浦
Yosuke Okubo
洋祐 大久保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2011078580A priority Critical patent/JP2012212824A/en
Publication of JP2012212824A publication Critical patent/JP2012212824A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Led Device Packages (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an LED mount substrate that enables use of a conventional process without adding any step of plating the end face of an opening and can suppress loss of LED light from teh end face of the opening.SOLUTION: In an LED mount substrate in which a wiring substrate and a metal reflection member are arranged through an adhesive layer, and an LED mount portion is provided to the surface of the metal reflection member exposed to the bottom portion of an opening penetrating through the wiring substrate and the adhesive layer, the adhesive layer has a wavelength range of 460 ± 10 nm and a reflectivity of 50% or more at maximum.

Description

本発明は、発光強度と放熱性の優れたＬＥＤ搭載用基板に関する。   The present invention relates to an LED mounting substrate having excellent emission intensity and heat dissipation.

近年、省エネ・環境保全の面から、ＬＥＤ（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）を用いた液晶画面のバックライトや、ＬＥＤを用いた一般家庭用照明（ＬＥＤ照明）の需要が伸びてきている。特にＬＥＤ照明は、蛍光灯・白熱電球に比べ寿命は１０倍、電気代は１／１０、と優れた点が多く、脚光を浴びている。   In recent years, from the viewpoint of energy saving and environmental conservation, there has been an increasing demand for liquid crystal screen backlights using LEDs (Light Emitting Diodes) and general household lighting (LED lighting) using LEDs. In particular, LED lighting is in the limelight because it has many advantages such as 10 times longer life than fluorescent and incandescent bulbs and 1/10 of the electricity bill.

このＬＥＤ照明に用いられるＬＥＤ搭載用基板として、図３に示すような、反射率を向上させるための表面処理を施した金属製反射部材５上に、開口９を設けた樹脂製の配線基板３を貼り合せ、開口９から露出した金属製反射部材５上にダイボンド材（図示しない。）を用いて直接ＬＥＤを搭載したＬＥＤ搭載用基板２が開示されている（特許文献１）。このＬＥＤ搭載用基板２によれば、樹脂製の配線基板３と金属製反射部材５とを貼り合せる簡易な構成でありながら、反射率を向上させるための表面処理を行った金属製反射部材５を用いることで、ＬＥＤ１１を搭載した場合に、高輝度なＬＥＤ装置を実現することができる。   As an LED mounting substrate used for this LED illumination, as shown in FIG. 3, a resin wiring substrate 3 provided with an opening 9 on a metal reflecting member 5 subjected to a surface treatment for improving reflectivity. An LED mounting substrate 2 is disclosed in which LEDs are directly mounted using a die-bonding material (not shown) on the metal reflecting member 5 exposed from the opening 9 (Patent Document 1). According to the LED mounting substrate 2, the metal reflecting member 5 subjected to the surface treatment for improving the reflectance while having a simple configuration in which the resin wiring substrate 3 and the metal reflecting member 5 are bonded together. When LED 11 is mounted, a high-brightness LED device can be realized.

また、特許文献１のような構成のＬＥＤ搭載用基板では、図３に示すように、開口９の底部にＬＥＤ１１を搭載するため、ＬＥＤ１１から照射される光（以下、単に「ＬＥＤ光６」ということがある。）は、ＬＥＤ１１の上面側やＬＥＤ１１の底面側（即ち、金属製反射部材５側）以外に、ＬＥＤ１１の側面側（即ち、開口９の端面側）にも照射される。また、ＬＥＤ１１の底面側に照射された光が底面の金属製反射部材５に反射して開口９の端面に照射されるものもある。ＬＥＤ１１の側面側には配線基板３と接着層４を貫通して形成された開口９の端面がある。このため、この開口９の端面におけるＬＥＤ光６の損失をいかに抑制するかが、ＬＥＤ装置の輝度を稼ぐためには重要な要素となっている。   Further, in the LED mounting substrate having the configuration as in Patent Document 1, as shown in FIG. 3, since the LED 11 is mounted on the bottom of the opening 9, light emitted from the LED 11 (hereinafter simply referred to as “LED light 6”). May be irradiated not only on the upper surface side of the LED 11 and the bottom surface side of the LED 11 (that is, on the metal reflecting member 5 side) but also on the side surface side of the LED 11 (that is, on the end surface side of the opening 9). In some cases, the light irradiated on the bottom surface side of the LED 11 is reflected on the metal reflecting member 5 on the bottom surface and irradiated on the end surface of the opening 9. On the side surface side of the LED 11, there is an end face of an opening 9 formed through the wiring substrate 3 and the adhesive layer 4. For this reason, how to suppress the loss of the LED light 6 at the end face of the opening 9 is an important factor for increasing the brightness of the LED device.

開口の端面の反射率を向上させる方法としては、開口にめっきを形成した配線基板を用いることで、開口の端面の反射率を向上させるものが開示されている（特許文献２）。   As a method for improving the reflectance of the end face of the opening, there is disclosed a technique for improving the reflectance of the end face of the opening by using a wiring substrate in which the opening is plated (Patent Document 2).

特開２００７−１０９７０１号公報JP 2007-109701 A 特開２００９−２３９０３５号公報JP 2009-239035 A

しかしながら、特許文献２では、開口の端面のうち、配線基板の厚みに相当する部分はめっきによって反射率が向上するものの、接着層には反射率を考慮したものが使用されていないために、接着層の厚みに相当する部分については反射率が低い。また、開口にめっきを形成した配線基板では、配線基板の開口近傍の表裏面に、めっきによる段差が生じるため、配線基板と金属製反射部材とを接着層で貼り合わせる際に、接着層によって段差を埋めるのが難しく、段差を埋めようとすると反射率の低い接着層の厚みが厚くなるため、開口の端面の反射率はさらに低下し、結果的には開口からのＬＥＤ光６の取り出し効率の向上が図れない問題があった。さらに、開口の端面にめっきを行うための工数が増加する問題や、配線基板と接着層を貼り合わせる工程が、それぞれに開口を形成した後になるため、配線基板と接着層との位置合わせ精度が必要になり、位置ずれを起こすと接着層が開口内に染み出す問題があった。   However, in Patent Document 2, although the reflectance corresponding to the thickness of the wiring substrate in the end face of the opening is improved by plating, the adhesive layer is not used because the reflectance is not used. The portion corresponding to the thickness of the layer has a low reflectance. In addition, in a wiring board in which plating is formed in the opening, a step due to plating occurs on the front and back surfaces in the vicinity of the opening of the wiring board. Therefore, when bonding the wiring board and the metal reflective member with an adhesive layer, It is difficult to fill the gap, and the thickness of the adhesive layer having a low reflectivity increases when the step is filled. Therefore, the reflectivity of the end face of the opening is further reduced, and as a result, the efficiency of taking out the LED light 6 from the opening is reduced. There was a problem that could not be improved. Furthermore, the problem of increasing the man-hours for plating on the end face of the opening and the process of bonding the wiring board and the adhesive layer are performed after the opening is formed in each, so that the alignment accuracy between the wiring board and the adhesive layer is improved. There is a problem that the adhesive layer oozes out into the opening when it is necessary and misalignment occurs.

また、開口の端面にめっきを行わずに、開口の端面の反射率を向上させる方法としては、配線基板に用いる基材として、反射性の粒子を含有するシリコーン系の樹脂を、ガラスクロス等の補強繊維に含浸させたものを使用する方法が考えられる。しかし、この方法では、開口の端面のうち配線基板の基材の樹脂が露出した部分は反射率が高いものの、補強繊維であるガラスクロスが露出した部分では、ガラスクロスに照射された光が、ガラスクロスを通して配線基板の基材の内部に拡散してしまう現象が生じる。この基材の内部に拡散する光は、基材の樹脂に含有される光反射粒子によって、再び開口側に反射して来るものもあるが、接着層には特に反射率について考慮されたものは使用されていないため、この接着層に吸収されてしまうものも多い。このため、反射率の向上が難しい問題があった。   Moreover, as a method of improving the reflectance of the end face of the opening without plating the end face of the opening, a silicone resin containing reflective particles is used as a base material used for the wiring board, such as a glass cloth. A method in which a reinforcing fiber impregnated is used. However, in this method, the portion of the opening end face where the resin of the base material of the wiring board is exposed has high reflectance, but the portion of the glass cloth that is the reinforcing fiber is exposed, the light irradiated to the glass cloth is A phenomenon occurs in which the glass cloth diffuses into the substrate substrate. The light diffusing inside the base material may be reflected again to the opening side by the light reflecting particles contained in the base resin, but the adhesive layer is particularly considered for reflectivity. Since it is not used, it is often absorbed by this adhesive layer. For this reason, there is a problem that it is difficult to improve the reflectance.

本発明は、上記問題点に鑑みてなされたものであり、開口の端面へのめっき工程を追加することなく従来のプロセスを用いることを可能としつつ、開口の端面からのＬＥＤ光の損失を抑制可能なＬＥＤ搭載用基板を提供することを目的とする。   The present invention has been made in view of the above problems, and suppresses the loss of LED light from the end face of the opening while enabling the use of a conventional process without adding a plating step to the end face of the opening. An object is to provide a possible LED mounting substrate.

本発明は、次のものに関する。
１．配線基板と金属製反射部材とが接着層を介して配置され、ＬＥＤ搭載部が前記配線基板及び接着層を貫通する開口の底部に露出した前記金属製反射部材の表面に設けられるＬＥＤ搭載用基板において、前記接着層が４６０±１０ｎｍの波長範囲で最大５０％以上の反射率を有するＬＥＤ搭載用基板。
２．項１において、接着層が光反射性粒子を含有するＬＥＤ搭載用基板。
３．項１または２において、接着層が光反射性粒子として二酸化チタンを含有するＬＥＤ搭載用基板。
４．項１から３の何れかにおいて、金属製反射部材が、ＬＥＤからの光に対して、４６０±１０ｎｍの波長範囲で最大９５％以上の反射率を有する高反射アルミニウム板を用いて形成されるＬＥＤ搭載用基板。 The present invention relates to the following.
1. An LED mounting board provided on the surface of the metallic reflecting member, wherein the wiring board and the metallic reflecting member are arranged via an adhesive layer, and the LED mounting portion is exposed at the bottom of an opening penetrating the wiring board and the adhesive layer. Wherein the adhesive layer has a maximum reflectance of 50% or more in a wavelength range of 460 ± 10 nm.
2. Item 2. The LED mounting substrate according to Item 1, wherein the adhesive layer contains light-reflective particles.
3. Item 3. The LED mounting substrate according to Item 1 or 2, wherein the adhesive layer contains titanium dioxide as light reflecting particles.
4). Item 4. The LED according to any one of Items 1 to 3, wherein the metal reflecting member is formed using a highly reflective aluminum plate having a reflectance of 95% or more in a wavelength range of 460 ± 10 nm with respect to light from the LED. Mounting board.

本発明によれば、開口の端面へのめっき工程を追加することなく従来のプロセスを用いることを可能としつつ、開口の端面からのＬＥＤ光の損失を抑制可能なＬＥＤ搭載用基板を提供することが可能になる。   According to the present invention, it is possible to provide an LED mounting substrate capable of suppressing the loss of LED light from the end face of the opening while allowing a conventional process to be used without adding a plating step to the end face of the opening. Is possible.

本発明のＬＥＤ搭載用基板の断面図である。It is sectional drawing of the board | substrate for LED mounting of this invention. 本発明のＬＥＤ搭載用基板の製造工程を断面構造で表すフロー図である。It is a flowchart showing the manufacturing process of the board | substrate for LED mounting of this invention with a cross-sectional structure. 従来のＬＥＤ搭載用基板の断面図である。It is sectional drawing of the conventional board | substrate for LED mounting.

図１に、本発明のＬＥＤ搭載用基板２の一例の断面図を示す。本発明のＬＥＤ搭載用基板２の一例としては、配線基板３と金属製反射部材５とが接着層４を介して配置され、ＬＥＤ搭載部１０が前記配線基板３及び接着層４を貫通する開口９の底部に露出した前記金属製反射部材５の表面に設けられるＬＥＤ搭載用基板２において、前記接着層４が４６０±１０ｎｍの波長範囲で最大５０％以上の反射率を有するＬＥＤ搭載用基板２が挙げられる。上記構成によれば、接着層４が４６０±１０ｎｍの波長範囲で最大５０％以上の反射率を有するので、開口９の端面のの接着層４に照射されたＬＥＤ光６は、開口９内等に向かって反射される。開口９内に反射されたＬＥＤ光６は、金属製反射部材５等によって外部等に向かって反射される。また、開口９の端面の基材１８に照射されたＬＥＤ光６は、基材１８中の樹脂の部分（図示しない。）では開口９内等に向かって反射され、ガラスクロスの部分（図示しない。）ではガラスクロスを通して基材１８の内部へ拡散する。基材１８内部に拡散したＬＥＤ光６は、ガラスクロスを通してそのまま基材１８の奥深くまで進行するものもあるが、かなりの部分はガラスクロスから漏れ出て基材１８中の樹脂や接着層４によって反射され、再びガラスクロスを通して開口９内へ到達する。開口９内に反射されたＬＥＤ光６は、金属製反射部材５等によって外部等に向かって反射される。このように、接着層４が４６０±１０ｎｍの波長範囲で最大５０％以上の反射率を有することにより、開口９の端面の接着層４に照射されたＬＥＤ光６及び基材１８のガラスクロスに照射されたＬＥＤ光６の両者について、従来は吸収されてしまい利用できなかったものを、開口９内に戻すことができることにより、外部に取り出せるようにすることができる。したがって、開口９の端面にめっきを行う等の工程を追加することなく従来のプロセスをそのまま用いることを可能としつつ、開口９の端面からのＬＥＤ光６の損失を抑制可能となる。   In FIG. 1, sectional drawing of an example of the board | substrate 2 for LED mounting of this invention is shown. As an example of the LED mounting substrate 2 of the present invention, the wiring substrate 3 and the metal reflecting member 5 are arranged via the adhesive layer 4, and the LED mounting portion 10 is an opening through the wiring substrate 3 and the adhesive layer 4. The LED mounting substrate 2 provided on the surface of the metallic reflecting member 5 exposed at the bottom of the LED mounting substrate 2 wherein the adhesive layer 4 has a maximum reflectance of 50% or more in a wavelength range of 460 ± 10 nm. Is mentioned. According to the above configuration, since the adhesive layer 4 has a maximum reflectance of 50% or more in the wavelength range of 460 ± 10 nm, the LED light 6 applied to the adhesive layer 4 on the end face of the opening 9 is in the opening 9 or the like. Reflected towards. The LED light 6 reflected in the opening 9 is reflected toward the outside or the like by the metal reflecting member 5 or the like. Moreover, the LED light 6 irradiated to the base material 18 at the end face of the opening 9 is reflected toward the inside of the opening 9 in a resin portion (not shown) in the base material 18 and a glass cloth portion (not shown). .) Diffuses into the substrate 18 through the glass cloth. The LED light 6 diffused inside the base material 18 may travel deep into the base material 18 as it is through the glass cloth, but a significant portion leaks out of the glass cloth and is caused by the resin and the adhesive layer 4 in the base material 18. It is reflected and reaches the opening 9 again through the glass cloth. The LED light 6 reflected in the opening 9 is reflected toward the outside or the like by the metal reflecting member 5 or the like. Thus, when the adhesive layer 4 has a reflectance of 50% or more in the wavelength range of 460 ± 10 nm, the LED light 6 irradiated to the adhesive layer 4 on the end face of the opening 9 and the glass cloth of the base material 18 are applied. About both of the irradiated LED light 6, what was absorbed and cannot be used conventionally can be returned to the inside of the opening 9, so that it can be taken out to the outside. Therefore, the loss of the LED light 6 from the end face of the opening 9 can be suppressed while the conventional process can be used as it is without adding a process such as plating the end face of the opening 9.

本発明の配線基板３は、厚み方向に貫通しＬＥＤ搭載部１０となる開口９を有し、このＬＥＤ搭載部１０に搭載されるＬＥＤ１１と電気的に接続するための導体回路７と、この導体回路７を支持する基材１８とを備えるものであり、例えば、基材１８と銅箔とを有する銅張積層板等を用いて形成することができる。必要に応じて、導体回路７を保護するために、ソルダーレジスト８や、ニッケル／金めっき等による保護層１６を設けてもよい。配線基板３は、導体回路７を有する配線層を片面のみに設けた片面板、両面に設けた両面板、３層以上の層に設けた多層板の何れを使用してもよい。   The wiring board 3 of the present invention has an opening 9 that penetrates in the thickness direction and becomes the LED mounting portion 10, a conductor circuit 7 for electrically connecting to the LED 11 mounted on the LED mounting portion 10, and the conductor The circuit board 7 is provided with the base material 18 which supports the circuit 7, and can be formed using, for example, a copper clad laminate having the base material 18 and a copper foil. If necessary, a protective layer 16 made of solder resist 8 or nickel / gold plating may be provided to protect the conductor circuit 7. As the wiring board 3, any one of a single-sided board provided with a wiring layer having the conductor circuit 7 only on one side, a double-sided board provided on both sides, and a multilayer board provided on three or more layers may be used.

本発明の開口９は、配線基板３と接着層４の両者を貫通して設けられるもので、配線基板３と金属製反射部材５とが、ＬＥＤ搭載部１０に対応する開口９を有する接着層４を介して貼り合わされた際に、開口９の底部には金属製反射部材５の表面が露出する領域を形成するものである。この開口９によって形成された金属製反射部材５が露出する領域に、ＬＥＤ１１が搭載され、ＬＥＤ搭載部１０が形成される。開口９は、例えば、配線基板３に用いる基材１８や接着層４をルータやドリル、パンチ等で加工することにより形成することができる。   The opening 9 of the present invention is provided so as to penetrate both the wiring board 3 and the adhesive layer 4, and the wiring board 3 and the metal reflecting member 5 have an opening 9 corresponding to the LED mounting portion 10. A region where the surface of the metallic reflecting member 5 is exposed is formed at the bottom of the opening 9 when bonded through 4. The LED 11 is mounted in a region where the metallic reflecting member 5 formed by the opening 9 is exposed, and the LED mounting portion 10 is formed. The opening 9 can be formed, for example, by processing the base material 18 or the adhesive layer 4 used for the wiring board 3 with a router, a drill, a punch, or the like.

本発明の導体回路７は、配線基板３上に形成され、ＬＥＤ１１との接続端子や配線等となるものである。一般の配線基板の製造と同様の方法で形成することができ、例えば、配線基板３を銅張積層板を用いて形成する場合、銅箔をエッチング等で回路加工すること等によって形成することができる。   The conductor circuit 7 of the present invention is formed on the wiring board 3 and serves as a connection terminal and wiring with the LED 11. For example, when the wiring board 3 is formed using a copper-clad laminate, the copper foil may be formed by circuit processing by etching or the like. it can.

本発明で使用する基材１８は、一般の配線基板に用いられるものを使用することができ、例えば、ガラス繊維を用いた補強材であるガラスクロスに、エポキシ樹脂やポリイミド樹脂、シリコーン樹脂を含浸させた、いわゆるガラスエポキシ基板やガラスポリイミド基板、ガラスシリコーン基板を用いることができる。また、樹脂中に光反射性粒子を含有したものを用いるのが望ましい。光反射性粒子としては、接着層４の光反射率を向上させるものであれば特に限定はない。このような光反射性粒子として、例えば、球状、針状、フレ―ク状などの形状を有し、粒径が０．５〜２５０ミクロン程度のシリカ、酸化アルミニウム、窒化アルミニウム、二酸化チタン、窒化ボロン、窒化ケイ素、ホウ化チタン等が挙げられる。添加量は、接着層４の固形分１００質量部に対して、２０〜１００質量部の範囲が望ましい。２０質量部未満では、接着層の熱伝導係数を増加させる効果が小さく、１００質量部を超えると、接着層４の接着性が低下するため、好ましくない。これらの中でも、ニ酸化チタンを含有するようにすると、ＬＥＤ１１からの４６０±１０ｎｍの光に対する反射率が高い（例えば、７０％以上が可能。）点から、ＬＥＤ搭載用基板２としては好ましい。また、光反射性粒子は一般に熱伝導性を向上させる作用もあることから、ＬＥＤ１１からの熱を放熱し易い点からも望ましい。このような、基材１８としては、銅張積層板ＨＬ−８２０ＷＤＩ（三菱ガス化学株式会社製、商品名）等が挙げられる。   As the base material 18 used in the present invention, those used for general wiring boards can be used. For example, glass cloth, which is a reinforcing material using glass fibers, is impregnated with epoxy resin, polyimide resin, or silicone resin. A so-called glass epoxy substrate, glass polyimide substrate, or glass silicone substrate can be used. Further, it is desirable to use a resin containing light-reflective particles. The light reflecting particles are not particularly limited as long as they improve the light reflectance of the adhesive layer 4. Examples of such light-reflective particles include silica, aluminum oxide, aluminum nitride, titanium dioxide, and nitride having a spherical shape, a needle shape, a flake shape, and a particle size of about 0.5 to 250 microns. Examples thereof include boron, silicon nitride, and titanium boride. The addition amount is desirably in the range of 20 to 100 parts by mass with respect to 100 parts by mass of the solid content of the adhesive layer 4. If it is less than 20 parts by mass, the effect of increasing the thermal conductivity coefficient of the adhesive layer is small, and if it exceeds 100 parts by mass, the adhesiveness of the adhesive layer 4 is lowered, which is not preferable. Among these, when titanium dioxide is contained, it is preferable as the LED mounting substrate 2 from the viewpoint that the reflectance with respect to light of 460 ± 10 nm from the LED 11 is high (for example, 70% or more is possible). In addition, the light-reflective particles generally have an effect of improving the thermal conductivity, and thus are desirable from the viewpoint that heat from the LED 11 is easily radiated. As such a base material 18, copper clad laminated board HL-820WDI (Mitsubishi Gas Chemical Co., Ltd. make, brand name) etc. are mentioned.

本発明の金属製反射部材５は、ＬＥＤ１１を搭載するための支持基板であるとともに、ＬＥＤ１１で生じた熱を放熱する放熱板として機能を有するものである。また、さらにＬＥＤ１１からの光を反射する反射材としての機能を備えるものであるのが輝度向上の点で望ましい。金属製反射部材５としては、例えば、銅、金等の赤色系金属材料や、銀、ニッケル、アルミニウムなどの銀白色系の金属材料が挙げられる。ＬＥＤ１１からの光が白色系の場合は（例えば、４６０±１０ｎｍの波長域にピーク発光波長を有する場合等。以下、同じ。）、金属製反射部材５として、銀、ニッケル、アルミニウムなどの銀白色系の金属材料が望ましい。   The metallic reflecting member 5 of the present invention is a support substrate for mounting the LED 11 and has a function as a heat radiating plate that radiates heat generated by the LED 11. In addition, it is desirable in terms of improving the luminance that it has a function as a reflecting material that reflects light from the LED 11. Examples of the metallic reflecting member 5 include red metal materials such as copper and gold, and silver white metal materials such as silver, nickel, and aluminum. When the light from the LED 11 is white (for example, when having a peak emission wavelength in a wavelength range of 460 ± 10 nm, the same applies hereinafter), the metallic reflecting member 5 is silver white such as silver, nickel, aluminum, etc. A metallic material is desirable.

本発明のＬＥＤ搭載部１０は、ＬＥＤ１１を搭載するための領域であり、配線基板３と接着層４とを貫通する開口９の底部に露出した金属製反射部材５の表面に設けられる。つまり、ＬＥＤ搭載部１０は、底面が金属製反射部材５の表面であり、配線基板３と接着層４とを貫通する開口９の端面によって囲まれ、上方のみが開放した領域となる。ＬＥＤ１１をＬＥＤ搭載部１０に搭載する方法としては、ダイボンディング材を用いて、金属製反射部材５の表面に直接ＬＥＤ１１を搭載するのが放熱の点で望ましい。ダイボンディング材は、絶縁性のものを使用するのが望ましい。これにより、ＬＥＤ１１と金属製反射部材５との絶縁性を確保することができるので、ＬＥＤ搭載用基板２を収納するＬＥＤ装置等の筐体に、金属製反射部材５を直接接触させてネジ等で固定することが可能となり、より放熱効率を高めることも可能になる。   The LED mounting portion 10 of the present invention is a region for mounting the LED 11, and is provided on the surface of the metal reflecting member 5 exposed at the bottom of the opening 9 that penetrates the wiring substrate 3 and the adhesive layer 4. That is, the LED mounting portion 10 has a bottom surface that is the surface of the metallic reflecting member 5, is surrounded by an end surface of the opening 9 that penetrates the wiring substrate 3 and the adhesive layer 4, and only an upper portion is an open area. As a method of mounting the LED 11 on the LED mounting portion 10, it is desirable in terms of heat dissipation that the LED 11 is mounted directly on the surface of the metallic reflecting member 5 using a die bonding material. It is desirable to use an insulating material for the die bonding material. Thereby, the insulation between the LED 11 and the metal reflecting member 5 can be ensured. Therefore, the metal reflecting member 5 is brought into direct contact with the housing of the LED device or the like that houses the LED mounting substrate 2 to provide screws or the like. It becomes possible to fix with, and it is also possible to further improve the heat radiation efficiency.

本発明の接着層４は、配線基板３と金属製反射部材５とを接着するものである。接着層４としては、接着層４が４６０±１０ｎｍの波長範囲で最大５０％以上の反射率を有するものを用いる。このような接着層４としては、接着層４が、光反射性粒子を含有するのが望ましい。光反射性粒子としては、接着層４の光反射率を向上させるものであれば特に限定はない。このような光反射性粒子として、例えば、球状、針状、フレ―ク状などの形状を有し、粒径が０．５〜２５０ミクロン程度のシリカ、酸化アルミニウム、窒化アルミニウム、二酸化チタン、窒化ボロン、窒化ケイ素、ホウ化チタン等が挙げられる。添加量は、接着層４の固形分１００質量部に対して、２０〜１００質量部の範囲が望ましい。２０質量部未満では、接着層４の熱伝導係数を増加させる効果が小さく、１００質量部を超えると、接着層４の接着性が低下するため、好ましくない。これらの中でも、ニ酸化チタンを含有するようにすると、ＬＥＤ１１からの４６０±１０ｎｍの光に対する反射率が高い（例えば、７０％以上が可能。）点から、ＬＥＤ搭載用基板２としては好ましい。また、光反射性粒子は一般に熱伝導性を向上させる作用もあることから、ＬＥＤ１１からの熱を放熱し易い点からも望ましい。このような接着層４としては、一般のプリント配線基板の製造において、多層化接着のために用いられる接着層等を使用することができる。例えば、エポキシ樹脂を主成分とする接着シート等の中から選択することができ、このような接着シートとしては、ＡＳ−２６００Ｗ（日立化成工業株式会社製、商品名）等が例示できる。   The adhesive layer 4 of the present invention adheres the wiring board 3 and the metal reflecting member 5. As the adhesive layer 4, the adhesive layer 4 having a maximum reflectance of 50% or more in a wavelength range of 460 ± 10 nm is used. As such an adhesive layer 4, it is desirable that the adhesive layer 4 contains light-reflective particles. The light reflecting particles are not particularly limited as long as they improve the light reflectance of the adhesive layer 4. Examples of such light-reflective particles include silica, aluminum oxide, aluminum nitride, titanium dioxide, and nitride having a spherical shape, a needle shape, a flake shape, and a particle size of about 0.5 to 250 microns. Examples thereof include boron, silicon nitride, and titanium boride. The addition amount is desirably in the range of 20 to 100 parts by mass with respect to 100 parts by mass of the solid content of the adhesive layer 4. If it is less than 20 parts by mass, the effect of increasing the thermal conductivity coefficient of the adhesive layer 4 is small, and if it exceeds 100 parts by mass, the adhesiveness of the adhesive layer 4 is lowered, which is not preferable. Among these, when titanium dioxide is contained, it is preferable as the LED mounting substrate 2 from the viewpoint that the reflectance with respect to light of 460 ± 10 nm from the LED 11 is high (for example, 70% or more is possible). In addition, the light-reflective particles generally have an effect of improving the thermal conductivity, and thus are desirable from the viewpoint that heat from the LED 11 is easily radiated. As such an adhesive layer 4, an adhesive layer or the like used for multilayer adhesion in the production of a general printed wiring board can be used. For example, it can select from the adhesive sheet etc. which have an epoxy resin as a main component, AS-2600W (Hitachi Chemical Industries Ltd. make, brand name) etc. can be illustrated as such an adhesive sheet.

金属製反射部材５が、ＬＥＤ１１からの光に対して、４６０±１０ｎｍの波長範囲で最大９５％以上の反射率を有する高反射アルミニウム板５を用いて形成されるのが望ましい。これにより、ＬＥＤ１１からの光が白色系の場合でも、ＬＥＤ１１からの光を高効率で反射できるので、高放熱性とともに高い発光強度が実現できる。また、アルミニウムであるため、銀めっきのような経時的な変色（黒変）がなく、放熱性と輝度向上を兼ね備えることで、長寿命化を実現できる。なお、高反射アルミニウム板５とは、４６０±１０ｎｍの波長域の何れかの波長での反射率が最大９５％以上となる反射面を備えたアルミニウム板をいう。このような高反射率によって、ＬＥＤパッケージ１としての輝度は、従来のアルミニウム板に比べて高くなることから、ＬＥＤ１１に流す電流も小さくすることが可能になり、ＬＥＤ１１が発する熱・光量を減らすことができ、結果的にＬＥＤ搭載用基板２の劣化も抑えられる。高反射アルミニウム板５としては、表面を鏡面処理し、さらに増反射処理を施した４２５ＯＥ（ＡＣＡ社製、商品名）等が例示できる。なお、反射率の測定は、例えば、分光測色計（商品名：ＣＭ−５０８ｄ、ミノルタ株式会社製）を用いて行うことができる。   It is desirable that the metallic reflecting member 5 is formed using a highly reflective aluminum plate 5 having a reflectance of 95% or more in the wavelength range of 460 ± 10 nm with respect to the light from the LED 11. Thereby, even when the light from the LED 11 is white, the light from the LED 11 can be reflected with high efficiency, so that high light emission intensity and high emission intensity can be realized. Moreover, since it is aluminum, there is no discoloration (black discoloration) with time like silver plating, and a long life can be realized by combining heat dissipation and luminance improvement. The highly reflective aluminum plate 5 refers to an aluminum plate provided with a reflective surface that has a maximum reflectance of 95% or more at any wavelength in the wavelength range of 460 ± 10 nm. Due to such a high reflectance, the luminance as the LED package 1 is higher than that of a conventional aluminum plate, so that the current flowing through the LED 11 can be reduced, and the heat and light quantity emitted by the LED 11 can be reduced. As a result, deterioration of the LED mounting substrate 2 can be suppressed. Examples of the highly reflective aluminum plate 5 include 425OE (trade name, manufactured by ACA) whose surface is mirror-finished and further subjected to an increased reflection treatment. The reflectance can be measured using, for example, a spectrocolorimeter (trade name: CM-508d, manufactured by Minolta Co., Ltd.).

本発明のＬＥＤ搭載用基板２は、金属製反射部材５と配線基板３とが貼り合わされ、開口９内に金属製反射部材５の表面が露出する。このような構成により、金属製反射部材５として高反射アルミニウム板５を用いた場合でも、高反射アルミニウム板５の表面に対してエッチングやめっき等の処理がなされることがないので、高反射状態（４６０±１０ｎｍの波長域の何れかの波長での反射率が最大９５％以上）を維持したままで、開口９内に露出させることができる。また、接着層４により配線基板３と接着するだけで放熱材としてだけでなく反射材として使用できるので、金属製反射部材５の材質を選択する際の自由度が拡大する。これにより、高反射アルミニウム板５を使用することも可能であり、ＬＥＤ１１からの発光が白色系の場合でも、ＬＥＤ１１からの光を高効率で反射できるので、高い発光強度が実現できる。   In the LED mounting substrate 2 of the present invention, the metal reflecting member 5 and the wiring substrate 3 are bonded together, and the surface of the metal reflecting member 5 is exposed in the opening 9. With such a configuration, even when the highly reflective aluminum plate 5 is used as the metal reflecting member 5, the surface of the highly reflective aluminum plate 5 is not subjected to etching, plating, or the like. It can be exposed in the opening 9 while maintaining (the reflectance at any wavelength in the wavelength range of 460 ± 10 nm is 95% or more at the maximum). Moreover, since it can be used not only as a heat radiating material but also as a reflecting material simply by bonding to the wiring substrate 3 with the adhesive layer 4, the degree of freedom in selecting the material of the metallic reflecting member 5 is expanded. Thereby, it is also possible to use the highly reflective aluminum plate 5, and even when the light emission from the LED 11 is white, the light from the LED 11 can be reflected with high efficiency, so that a high light emission intensity can be realized.

本発明におけるＬＥＤ１１（Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）は、一対の電極の間に発光体を設けた素子をいう。本発明で使用するＬＥＤ１１としては、一般に照明や液晶バックライト等に使用されるものが使用できるが、特にはＬＥＤ１１からの光が、白色系の場合であると、高反射率でかつ高放熱性である特徴を生かすことができるため望ましい。なお、白色系の発光とは、具体的には、ＬＥＤ１１からの発光自体は、紫外線あるいは青色であって、ＬＥＤ１１を覆う封止樹脂１４に含まれる蛍光剤等によって白色系に変換された発光をいう。   The LED 11 (Light Emitting Diode) in the present invention refers to an element in which a light emitter is provided between a pair of electrodes. As the LED 11 used in the present invention, those generally used for illumination, liquid crystal backlights and the like can be used. In particular, when the light from the LED 11 is white, it has high reflectivity and high heat dissipation. It is desirable because it can make use of the characteristics that are. The white light emission specifically refers to light emission from the LED 11 itself, which is ultraviolet light or blue light, and is converted into white light by a fluorescent agent or the like contained in the sealing resin 14 covering the LED 11. Say.

ＬＥＤ１１は、開口９内に露出した金属製反射部材５の表面上に搭載される。これにより、ＬＥＤ１１の周囲が配線基板３と接着層４の開口９の端面によって囲まれ、また、ＬＥＤ１１の下面が金属製反射部材５によって囲まれ、かつＬＥＤ１１の上方が開放された状態となる。このため、ＬＥＤ１１からの発光が周囲に漏れるのを抑制でき、開口９の端面や金属製反射部材５からの反射と相俟って、上方への発光を高効率で実現できる。   The LED 11 is mounted on the surface of the metallic reflecting member 5 exposed in the opening 9. As a result, the periphery of the LED 11 is surrounded by the wiring substrate 3 and the end face of the opening 9 of the adhesive layer 4, the lower surface of the LED 11 is surrounded by the metallic reflecting member 5, and the upper side of the LED 11 is opened. For this reason, it can suppress that the light emission from LED11 leaks to circumference | surroundings, and combined with the reflection from the end surface of the opening 9 or the metallic reflective member 5, it can implement | achieve upward light emission with high efficiency.

導体回路７の表面には、保護層１６として、ニッケル−金めっきや銀めっきを施すと、ワイヤボンディング端子やフリップチップ接続端子、はんだ接続端子を有する場合に、これらにも一括形成でき、しかも、これらの接続端子との接続性を付与できるので望ましい。   When the surface of the conductor circuit 7 is subjected to nickel-gold plating or silver plating as the protective layer 16, when it has wire bonding terminals, flip chip connection terminals, solder connection terminals, these can be collectively formed, This is desirable because connectivity with these connection terminals can be imparted.

金属製反射部材５は、配線基板３の導体回路７及びＬＥＤ１１とは電気的に独立とされる。金属製反射部材５は、配線基板３の下方に接着層４を介して貼り合わされており、露出した状態であるが、導体回路７及びＬＥＤ１１とは電気的に独立であることにより、金属製反射部材５が他の放熱部材やＬＥＤパッケージ１の筐体等に接触しても影響がない。このため、金属製反射部材５の下面を他の放熱部材やＬＥＤパッケージ１の筐体等に接触させて放熱効果を向上させることが可能となる。   The metallic reflecting member 5 is electrically independent from the conductor circuit 7 and the LED 11 of the wiring board 3. The metal reflecting member 5 is bonded to the lower side of the wiring board 3 via the adhesive layer 4 and is in an exposed state. However, the metal reflecting member 5 is electrically independent from the conductor circuit 7 and the LED 11, and thus the metal reflecting member 5 is exposed. Even if the member 5 comes into contact with another heat radiating member, the housing of the LED package 1 or the like, there is no influence. For this reason, it is possible to improve the heat dissipation effect by bringing the lower surface of the metallic reflecting member 5 into contact with another heat radiating member or the housing of the LED package 1.

以下、本発明の実施例を説明するが、本発明はこれに限定されない。   Examples of the present invention will be described below, but the present invention is not limited thereto.

絶縁性の基材１８の両面に銅箔（図示しない。）を有する、厚さ０．１ｍｍの銅張積層板ＨＬ−８２０ＷＤＩ（三菱ガス化学株式会社製、商品名）を準備した。   A 0.1 mm thick copper clad laminate HL-820WDI (trade name, manufactured by Mitsubishi Gas Chemical Co., Ltd.) having copper foil (not shown) on both surfaces of the insulating base material 18 was prepared.

次に、この銅張り積層板の表面に、紫外線硬化型エッチングレジスト用ドライフィルムＨ−９０４０（日立化成工業株式会社製、商品名）をラミネータにて圧着した後、フォトマスクを合わせて導体回路７となるパターンを露光し、レジスト現像−銅箔エッチング−レジスト剥離工程を経て、配線基板３の表面に導体回路７を形成した。なお、裏面の銅箔は全面エッチングにより除去した。   Next, an ultraviolet curable etching resist dry film H-9040 (manufactured by Hitachi Chemical Co., Ltd., trade name) is pressure-bonded to the surface of the copper-clad laminate with a laminator, and then a photomask is attached to the conductor circuit 7. The pattern which becomes was exposed, and the conductive circuit 7 was formed on the surface of the wiring board 3 through the resist development-copper foil etching-resist peeling process. The copper foil on the back surface was removed by etching the entire surface.

次に、導体回路７を形成した配線基板３の表面に、アルカリ現像型白色ソルダーレジストＬＥ−６０００Ｓ−５０５Ｓ（山栄化学株式会社製、商品名）をスクリーン印刷した後、８０℃で１５分の仮乾燥を行い、フォトマスクを合わせたのち、露光−現像−ポストキュアを行ってソルダーレジスト８を形成した。   Next, on the surface of the wiring board 3 on which the conductor circuit 7 is formed, an alkali developing type white solder resist LE-6000S-505S (manufactured by Yamaei Chemical Co., Ltd., trade name) is screen-printed, and then at 80 ° C. for 15 minutes. After temporarily drying and aligning the photomask, exposure-development-postcure was performed to form a solder resist 8.

次に、電解ニッケル−電解金めっきプロセスにより、導体回路７の所定の位置にニッケル厚５μｍ、金厚０．３μｍの保護層１６を析出させ、配線基板３を作製した。   Next, a protective layer 16 having a nickel thickness of 5 μm and a gold thickness of 0.3 μm was deposited at a predetermined position of the conductor circuit 7 by an electrolytic nickel-electrolytic gold plating process, and the wiring board 3 was produced.

次に、接着層４として、厚さ２５μｍのＡＳ−２６００Ｗ（日立化成工業株式会社製、商品名）を準備した。この接着層４の反射率は、４６０±１０ｎｍの波長範囲で最大７０％であり、目視では外観が白色であった。なお、反射率の測定は、分光測色計（商品名：ＣＭ−５０８ｄ、ミノルタ株式会社製）を用いて行った。   Next, AS-2600W (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 25 μm was prepared as the adhesive layer 4. The reflectance of the adhesive layer 4 was a maximum of 70% in the wavelength range of 460 ± 10 nm, and the appearance was white visually. The reflectance was measured using a spectrocolorimeter (trade name: CM-508d, manufactured by Minolta Co., Ltd.).

次に、配線基板３の裏面に、接着層４として準備した厚さ２５μｍのＡＳ−２６００Ｗ（日立化成工業株式会社製、商品名）を重ね、ロールラミネータ（日立化成エレクトロニクス株式会社製）を用いて１１０℃、０．２ＭＰａ、１．５ｍ／分（約１秒間）の条件で、加圧・加熱することにより、図２に示す仮接着工程を行い、配線基板３の裏面に接着層４をＢステージ状態で仮接着した。これにより、接着層４付きの配線基板３を作製した。   Next, AS-2600W (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 25 μm prepared as the adhesive layer 4 is stacked on the back surface of the wiring board 3, and a roll laminator (manufactured by Hitachi Chemical Electronics Co., Ltd.) is used. By applying pressure and heating under conditions of 110 ° C., 0.2 MPa, 1.5 m / min (about 1 second), the temporary bonding step shown in FIG. Temporary bonding was performed in the stage state. Thereby, the wiring board 3 with the adhesive layer 4 was produced.

次に、図２に示す孔加工工程を行い、接着層４を仮接着した配線基板３の所定の箇所に、ＮＣルータマシンを用いて、ＬＥＤ搭載部１０となる１０ｍｍ×１０ｍｍの開口９を形成した。   Next, the hole machining step shown in FIG. 2 is performed, and an opening 9 of 10 mm × 10 mm to be the LED mounting portion 10 is formed at a predetermined position of the wiring board 3 to which the adhesive layer 4 is temporarily bonded by using an NC router machine. did.

次に、金属製反射部材５として、４６０±１０ｎｍの波長範囲で最大９５％以上の反射率を有する高反射アルミニウム板５である４２５ＯＥ（ＡＣＡ社製、商品名）を準備した。   Next, as the metallic reflecting member 5, 425OE (trade name, manufactured by ACA), which is a highly reflective aluminum plate 5 having a reflectance of 95% or more in the wavelength range of 460 ± 10 nm, was prepared.

次に、図２に示す本接着工程を行い、接着層４を仮接着し開口９を形成した配線基板３の接着層４側に、金属製反射部材５を合わせ、鏡板間に配置し、株式会社名機製作所製の平板の熱プレスにて１６０℃、５ＭＰａ、９０分間、加圧・加熱することによって張り合わせた。このときの加圧・加熱プレスによって、Ｂステージ状態であった接着層４が完全に硬化してＣステージ状態となり、配線基板３と金属製反射部材５とが本接着されて張り合わされたＬＥＤ搭載用基板２を形成した。   Next, the main bonding step shown in FIG. 2 is performed, and the metallic reflecting member 5 is aligned with the adhesive layer 4 side of the wiring board 3 in which the adhesive layer 4 is temporarily bonded to form the opening 9, and is disposed between the end plates. Bonding was performed by pressurizing and heating at 160 ° C., 5 MPa for 90 minutes using a flat plate hot press manufactured by Miki Seisakusho. By this pressurization / heating press, the adhesive layer 4 that was in the B-stage state is completely cured to become the C-stage state, and the LED mounting in which the wiring board 3 and the metal reflecting member 5 are bonded and bonded together Substrate 2 was formed.

（比較例）
実施例１と同様にして配線基板３を準備した後、接着層４として、厚さ２５μｍのＫＳ−７００３（日立化成工業株式会社製、商品名）を準備した。この接着層４の反射率は４６０±１０ｎｍの波長範囲で最大３０％未満であり、目視では外観が茶色であった。これ以降は、実施例１と同様にして、仮接着工程、孔加工工程、本接着工程を行い、ＬＥＤ搭載用基板２を作製した。 (Comparative example)
After preparing the wiring board 3 in the same manner as in Example 1, KS-7003 (trade name, manufactured by Hitachi Chemical Co., Ltd.) having a thickness of 25 μm was prepared as the adhesive layer 4. The reflectance of the adhesive layer 4 was less than 30% at maximum in the wavelength range of 460 ± 10 nm, and the appearance was brown visually. Thereafter, in the same manner as in Example 1, the temporary mounting step, the hole processing step, and the main bonding step were performed to produce the LED mounting substrate 2.

１：ＬＥＤパッケージ
２：ＬＥＤ搭載用基板
３：配線基板
４：接着層
５：金属製反射部材または高反射アルミニウム板
６：ＬＥＤ光
７：導体回路
８：ソルダーレジスト
９：開口
１０：ＬＥＤ搭載部
１１：ＬＥＤ
１２：ワイヤボンド
１４：封止樹脂
１６：保護層
１８：基材 1: LED package 2: LED mounting substrate 3: Wiring substrate 4: Adhesive layer 5: Metal reflecting member or highly reflective aluminum plate 6: LED light 7: Conductor circuit 8: Solder resist 9: Opening 10: LED mounting portion 11 : LED
12: Wire bond 14: Sealing resin 16: Protective layer 18: Base material

Claims (4)

配線基板と金属製反射部材とが接着層を介して配置され、ＬＥＤ搭載部が前記配線基板及び接着層を貫通する開口の底部に露出した前記金属製反射部材の表面に設けられるＬＥＤ搭載用基板において、前記接着層が４６０±１０ｎｍの波長範囲で最大５０％以上の反射率または５０％以上の透過率を有するＬＥＤ搭載用基板。   An LED mounting board provided on the surface of the metallic reflecting member, wherein the wiring board and the metallic reflecting member are arranged via an adhesive layer, and the LED mounting portion is exposed at the bottom of an opening penetrating the wiring board and the adhesive layer. Wherein the adhesive layer has a maximum reflectance of 50% or more or a transmittance of 50% or more in a wavelength range of 460 ± 10 nm. 請求項１において、接着層が光反射性粒子を含有するＬＥＤ搭載用基板。   The LED mounting substrate according to claim 1, wherein the adhesive layer contains light reflective particles. 請求項１または２において、接着層が光反射性粒子として二酸化チタンを含有するＬＥＤ搭載用基板。   3. The LED mounting substrate according to claim 1, wherein the adhesive layer contains titanium dioxide as light reflecting particles. 請求項１から３の何れかにおいて、金属製反射部材が、ＬＥＤからの光に対して、４６０±１０ｎｍの波長範囲で最大９５％以上の反射率を有する高反射アルミニウム板を用いて形成されるＬＥＤ搭載用基板。   4. The metal reflecting member according to claim 1, wherein the metallic reflecting member is formed by using a highly reflective aluminum plate having a reflectance of 95% or more in a wavelength range of 460 ± 10 nm with respect to light from the LED. LED mounting board.
JP2011078580A 2011-03-31 2011-03-31 Led mount substrate Pending JP2012212824A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011078580A JP2012212824A (en) 2011-03-31 2011-03-31 Led mount substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011078580A JP2012212824A (en) 2011-03-31 2011-03-31 Led mount substrate

Publications (1)

Publication Number Publication Date
JP2012212824A true JP2012212824A (en) 2012-11-01

Family

ID=47266546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011078580A Pending JP2012212824A (en) 2011-03-31 2011-03-31 Led mount substrate

Country Status (1)

Country Link
JP (1) JP2012212824A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014203942A (en) * 2013-04-04 2014-10-27 信越化学工業株式会社 Optical semiconductor device
JP2016178270A (en) * 2015-03-23 2016-10-06 ローム株式会社 LED package
JP2017079278A (en) * 2015-10-21 2017-04-27 スタンレー電気株式会社 Light receiving/emitting device and light emitting device
CN109075228A (en) * 2016-03-03 2018-12-21 奥斯兰姆奥普托半导体有限责任公司 Connection carrier, opto-electronic device and the method for manufacturing connection carrier or opto-electronic device
CN113594146A (en) * 2021-08-26 2021-11-02 华玻视讯(珠海)科技有限公司 Method for manufacturing direct type backlight lamp panel of liquid crystal display module

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239036A (en) * 2008-03-27 2009-10-15 Hitachi Aic Inc Led substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009239036A (en) * 2008-03-27 2009-10-15 Hitachi Aic Inc Led substrate

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JPN6014043108; 'エポキシ接着フィルムＡＳ-２６００／ＡＳ-２６００Ｗ' 日立ケミカル　製品紹介 , 20140919 *
JPN6014043110; '高反射率アルミシート「ＭＩＲＯ」' 株式会社　マテリアルハウス　取扱製品 , 20140919 *

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014203942A (en) * 2013-04-04 2014-10-27 信越化学工業株式会社 Optical semiconductor device
JP2016178270A (en) * 2015-03-23 2016-10-06 ローム株式会社 LED package
US10957676B2 (en) 2015-03-23 2021-03-23 Rohm Co., Ltd. LED package
JP2017079278A (en) * 2015-10-21 2017-04-27 スタンレー電気株式会社 Light receiving/emitting device and light emitting device
CN109075228A (en) * 2016-03-03 2018-12-21 奥斯兰姆奥普托半导体有限责任公司 Connection carrier, opto-electronic device and the method for manufacturing connection carrier or opto-electronic device
JP2019512165A (en) * 2016-03-03 2019-05-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ Connection carrier, optoelectronic component, and method of manufacturing connection carrier or optoelectronic component
CN113594146A (en) * 2021-08-26 2021-11-02 华玻视讯(珠海)科技有限公司 Method for manufacturing direct type backlight lamp panel of liquid crystal display module

Similar Documents

Publication Publication Date Title
US20100149823A1 (en) Lamp unit, circuit board, and method of manufaturing circuit board
US20130062633A1 (en) LED Array Having Embedded LED and Method Therefor
JP2005167086A (en) Substrate for mounting light emitting element and fabrication method thereof
WO2012144492A1 (en) Led substrate, light-emitting module, method for producing led substrate, and method for producing light-emitting module
JP5063555B2 (en) Light-emitting element mounting substrate
JP2009188187A (en) Electronic part and manufacturing method thereof
JP2012212824A (en) Led mount substrate
KR101498682B1 (en) Light emitting diode module
WO2011077900A1 (en) Light emitting diode element, light source device, surface light source illumination device, and liquid crystal display device
JP6158341B2 (en) Light emitting device and method for manufacturing light emitting device
JP2011151187A (en) Semiconductor light-emitting device and method of manufacturing semiconductor light-emitting device
JP2010003956A (en) Light emitting device and method of manufacturing the same
TW201933624A (en) Light source module
JP2009117124A (en) Light source unit
JP2011091126A (en) Light emitting device (cob module)
CN201243024Y (en) Non-throwing encapsulation structure of LED
JP2012079778A (en) Light-emitting device mounting board and light-emitting device package
JP2012079777A (en) Light-emitting device mounting board and light-emitting device package
JP2012209389A (en) Wiring board for mounting light-emitting element, light-emitting device and method for manufacturing wiring board for mounting light-emitting element
JP5186709B2 (en) LED board
JP2012212823A (en) Led mount substrate and method of manufacturing the same
TW201347616A (en) LED package and PCB type heat dissipation substrate used for the same and manufacturing method thereof
JP2012079781A (en) Led mounting board
KR101211719B1 (en) Film type optical component package and manufacturing method thereof
KR20130014116A (en) Optical component package and manufacturing method thereof

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20140221

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20140925

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20141009

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20150305