JP5063555B2 - Light-emitting element mounting substrate - Google Patents

Description

  The present invention relates to a light-emitting element mounting substrate for mounting a light-emitting element such as a light-emitting diode chip on the surface of the substrate, and a method for manufacturing the light-emitting element mounting substrate. Useful as such.

  Conventionally, an electric lamp such as a fluorescent lamp has been generally used as a light emitter of an illumination device. On the other hand, a light-emitting diode is known as a light-emitting element that can be reduced in weight and power, and an illumination device in which a plurality of light-emitting diodes are mounted on a wiring board is also known. Specifically, there has been known a method in which two leads of a light emitting diode are inserted into a through hole and soldered and mounted (for example, see Patent Document 1).

  In a conventional light emitting diode, an LED chip is die-bonded using a die bonding paste such as a silver paste on a recess provided in a metal lead, and a metal is provided between the electrode portion provided on the upper surface of the LED chip and the lead. After bonding with a bonding wire such as, the lead, the LED chip, and the bonding wire are sealed with a sealing resin having translucency. The functions of such a lead include a function of supporting the LED chip, a function of efficiently distributing light emitted from the LED chip forward using a mirror surface around the recess where the LED chip is die-bonded, and a heat generation of the LED chip. There is a function to release heat to the outside through a substrate or the like by heat conduction.

  On the other hand, in the normal use temperature range as a lighting fixture, the LED chip has a property that the light emission efficiency is higher as the temperature is lower and the light emission efficiency is lower as the temperature is higher. In a light source device using a light emitting diode, the heat generating part is mainly an LED chip. Therefore, the heat generated by the LED chip is quickly radiated to the outside, and the temperature of the LED chip is lowered to improve the luminous efficiency of the LED chip. This is a very important issue. In addition, by increasing the heat dissipation characteristics, a large current can be applied to the LED chip and the light output of the LED chip can be increased.

  Accordingly, some light source devices have been proposed in which the LED chip is directly die-bonded to a thermally conductive substrate in order to improve the heat dissipation characteristics of the LED chip instead of the conventional light emitting diode. For example, a recess is formed by pressing a substrate made of a thin aluminum plate, an insulator thin film is formed on the surface, and then an LED chip is die-bonded to the bottom surface of the recess via the insulator thin film to insulate It is known that the wiring pattern formed on the body film layer and the electrode on the surface of the LED chip are electrically connected via a bonding wire, and the recess is filled with a translucent sealing resin. Yes.

  In this light source device, the heat generated by the LED chip is dissipated from the LED chip through the die bonding paste → insulator film layer → substrate path, and the heat transmitted to the substrate diffuses throughout the substrate, so that a bullet-type light emitting diode Compared with, the heat dissipation path is short and the heat dissipation is very high. However, even in this heat dissipation path, an insulating film layer is present as a component that hinders heat dissipation, and thus sufficient heat dissipation cannot be obtained.

  In addition, in order to reduce the influence of the insulator film layer in heat dissipation from the LED chip, a light source device in which the insulator film layer is partially removed from the surface of the substrate and the LED chip is directly die-bonded to the exposed substrate is also proposed. Has been. However, the method of partially removing the insulator film layer is by cutting with an end mill or the like. The exposed surface of the substrate is severely damaged by cutting, and it is difficult to mount the LED chip on the cut surface. It was.

  Therefore, as shown in FIG. 9, the substrate 3 having thermal conductivity, the insulating member 4 bonded to one surface of the substrate 3, the through-hole 6 provided through the insulating member 4, The LED chip 2 mounted on the protruding portion 1 of the substrate 3 exposed from the through hole 6, the overhanging portion 4 a protruding inward from the opening edge on the substrate 3 side in the through hole 6, and the insulating member 4 are provided. The wiring pattern 8, the bonding wire 9 that electrically connects the portion of the wiring pattern 8 extending to the overhanging portion 4 a and the electrode of the LED chip 2, and the translucency that seals the LED chip 2 and the like A light source device including a sealing resin 7 is proposed (see, for example, Patent Document 2). Here, the protrusion 1 provided on the substrate 3 has an effect of radiating heat from the LED chip 2 to the substrate 3 and adjusting the height of the LED chip 2 to improve the light emission efficiency.

  However, according to Patent Document 2, since the above-described projecting part 1 is formed by cutting an aluminum plate, it is usually necessary to form many projecting parts 1 one by one, which is disadvantageous in terms of accuracy and cost. In addition, it is difficult to cope with the case where the projecting portion 1 has a complicated planar shape. Patent Document 2 also describes a method of forming the protruding table 1 by press working, but it is difficult to apply when the thickness of the substrate 3 is large. Furthermore, since the projecting part 1 is provided on the bottom surface of the recess formed in the insulating member 4, light is irradiated with high efficiency by utilizing the reflection of light from the upper surface of the projecting part 1 and the wiring pattern 8. It was difficult to do.

JP-A-9-252651 JP 2002-94122 A

  Accordingly, an object of the present invention is to provide a substrate for mounting a light-emitting element and a method for manufacturing the same, which have a high heat dissipation effect from the light-emitting element, can be reduced in cost and accuracy, and preferably can increase light irradiation efficiency. It is to provide.

The above object can be achieved by the present invention as described below.
That is, the method for manufacturing a light emitting element mounting substrate of the present invention includes a step of selectively etching a surface metal layer laminated on a metal substrate to form a metal convex portion at a light emitting element mounting position, and the metal convex portion. Forming an electrode portion in the vicinity of.

  According to this manufacturing method, the surface metal layer laminated on the metal substrate is selectively etched to form the metal convex portions, so that many metal convex portions can be accurately and collectively formed on the metal substrate. A planar metal projection can also be easily formed. As a result, the heat dissipation effect from the light emitting element is high, and further, cost reduction and high accuracy can be achieved.

  In particular, the method for manufacturing a substrate for mounting a light-emitting element according to the present invention includes a step of selectively etching a surface metal layer laminated on a metal substrate to form a metal protrusion at a mounting position of the light-emitting element, and the metal protrusion Forming a flat insulating layer substantially flush with the upper surface of the metal, and simultaneously forming a power supply pattern having an electrode portion in the vicinity of the heat dissipation pattern while forming a heat dissipation pattern on the upper surface of the metal projection And preferably.

  According to this manufacturing method, the surface metal layer laminated on the metal substrate is selectively etched to form the metal convex portions, so that many metal convex portions can be accurately and collectively formed on the metal substrate. A planar metal projection can also be easily formed. In addition, since a flat insulating layer is formed substantially flush with the upper surface of the metal convex portion, the heat radiation pattern and the electrode portion on the upper surface of the metal convex portion can be formed at substantially the same height and are flat with respect to the light emitting element. A reflective surface can be formed. For this reason, by providing a reflector on the outer peripheral portion, it becomes possible to irradiate light with high efficiency using reflected light. As a result, the heat dissipation effect from the light emitting element is high, and the cost and accuracy can be reduced, and the light irradiation efficiency can be increased.

  In the above, it is preferable that the surface metal layer is laminated on the metal substrate via another protective metal layer exhibiting resistance at the time of etching. Since the metal substrate is protected by the protective metal layer during etching, the etching conditions can be easily controlled, and the flatness of the metal substrate is maintained, which is advantageous for forming a flat insulating layer. .

  On the other hand, the light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting and supplying power to the light emitting element, and is formed by etching at the metal substrate and the mounting position of the light emitting element on the metal substrate. And a metal protrusion, an insulating layer formed around the metal protrusion, and an electrode formed in the vicinity of the metal protrusion.

  According to this light emitting element mounting substrate, since the metal convex portion formed by etching is provided at the mounting position of the light emitting element on the metal substrate, many metal convex portions can be accurately and collectively formed on the metal substrate. A planar metal projection can also be easily formed. As a result, the heat dissipation effect from the light emitting element is high, and further, cost reduction and high accuracy can be achieved.

  In particular, the light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting and supplying power to the light emitting element, and is formed by etching at the metal substrate and the mounting position of the light emitting element on the metal substrate. Metal protrusion, a flat insulating layer that is substantially flush with the upper surface of the metal protrusion, a heat dissipation pattern formed on the upper surface of the metal protrusion, and the same height in the vicinity of the heat dissipation pattern. It is preferable to provide the pattern for electric power feeding which has the electrode part formed by.

  According to this light emitting element mounting substrate, since the metal convex portion formed by etching is provided at the mounting position of the light emitting element on the metal substrate, many metal convex portions can be accurately and collectively formed on the metal substrate. A planar metal projection can also be easily formed. In addition, since a flat insulating layer that is substantially flush with the upper surface of the metal convex portion is provided, the heat radiation pattern and the electrode portion on the upper surface of the metal convex portion can be formed at the same height, and both are flat with respect to the light emitting element. A reflective surface can be formed. For this reason, by providing a reflector on the outer peripheral portion, it becomes possible to irradiate light with high efficiency using reflected light. Moreover, when mounting a light emitting element provided with an electrode and a bonding part on the lower surface, it is important that the height of both is the same. As a result, the heat dissipation effect from the light emitting element is high, and the cost and accuracy can be reduced, and the light irradiation efficiency can be increased.

  In the above, it is preferable that the metal convex portion is bonded to the metal substrate via another protective metal layer exhibiting resistance during the etching. Since the metal substrate is protected by the protective metal layer during etching, the etching conditions can be easily controlled, and the flatness of the metal substrate is maintained, which is advantageous for forming a flat insulating layer. .

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A and 1B are drawings showing an example of a light-emitting element mounting substrate according to the present invention. FIG. 1A is a plan view, and FIG. 2A to 2G are process diagrams showing an example of a method for producing a light emitting element mounting substrate of the present invention.

  As shown in FIG. 1, the light emitting element mounting substrate of the present invention is a light emitting element mounting substrate for mounting a light emitting element 15 and supplying power thereto, and a metal substrate 10 and light emission of the metal substrate 10. A metal protrusion 22b formed by etching at the mounting position of the element 15, an insulating layer 40 formed around the metal protrusion 22b, and an electrode portion 23a formed in the vicinity of the metal protrusion 22b. . In the present embodiment, an example including a heat dissipation pattern 23b formed on the upper surface of the metal protrusion 22b and a power supply pattern having an electrode portion 23a formed at the same height in the vicinity of the heat dissipation pattern 23b. Indicates.

  Examples of the light emitting element 15 include a light emitting diode chip (bare chip), a packaged surface mount type light emitting diode (chip LED), and a semiconductor laser chip. When a light emitting diode chip is used, there are two types of the back side, a cathode type and an anode type. In the present invention, the bare chip type light emitting element 15 is superior in terms of heat dissipation and mounting area.

  As shown in FIG. 1, the light emitting element 15 is conductively connected to the electrode portions 23a on both sides. This conductive connection can be performed by connecting the upper electrode of the light emitting element 15 and each electrode portion 23 a by wire bonding or the like using the metal thin wire 17. As wire bonding, ultrasonic waves or a combination of this and heating can be used.

  Further, as shown in FIG. 1, a reflector 16 having a reflecting surface may be formed around the mounting position of the light emitting element 15. Furthermore, it is preferable to coat the inside of the reflector 16 with a transparent resin or the like, and a convex transparent resin lens may be provided above the reflector 16. Since the transparent resin lens has a convex surface, light can be efficiently emitted upward from the substrate. The transparent resin lens may be colored.

  In this embodiment, the heat radiation pattern 23 b and the electrode portion 23 a on the upper surface of the metal protrusion 22 b can be formed at the same height, and both can form a flat reflecting surface with respect to the light emitting element 15. For this reason, by providing the reflector 16 in the outer peripheral portion, it becomes possible to irradiate light with high efficiency using reflected light. The light emitting element 15 may be mounted by any method such as conductive paste, double-sided tape, and soldering, but metal bonding is preferable from the viewpoint of heat dissipation.

  The light emitting element mounting substrate of the present invention can be preferably manufactured by the following manufacturing method of the present invention. As shown in FIGS. 2A to 2C, the light emitting element mounting substrate of the present invention selectively etches the surface metal layer 22 laminated on the metal substrate 10 to form a metal at the mounting position of the light emitting element 15. The process of forming the convex part 22b is included. In this embodiment, the surface metal layer 22 shows the example laminated | stacked on the metal substrate 10 through another protective metal layer 21 which shows tolerance at the time of the etching.

  In this embodiment, first, as shown in FIG. 2A, a laminated plate in which a heat radiating metal plate 10, a protective metal layer 21, and a first metal layer 22 for forming a metal convex portion 22b are laminated. Prepare SP. The laminated plate SP may be manufactured by any method, and for example, any of those manufactured using electrolytic plating, electroless plating, sputtering, vapor deposition, or a clad material can be used. Regarding the thickness of each layer of the laminated plate SP, for example, the thickness of the heat radiating metal plate 10 is 30 to 5000 μm, the thickness of the protective metal layer 21 is 1 to 20 μm, and the thickness of the surface metal layer 22 is 10 to 500 μm.

  The above-described electrolytic plating can be performed by a known method. In general, while the target substrate is immersed in a plating bath, it is used as a cathode, and a metal ion replenishment source of a metal to be plated is used as an anode. This is carried out by depositing a metal on the cathode side by an electrolysis reaction.

  On the other hand, for electroless plating, a plating solution such as copper, nickel, or tin can be used. Electroless plating solutions are well known for various metals, and various types are commercially available. In general, the liquid composition contains a metal ion source, an alkali source, a reducing agent, a chelating agent, a stabilizer, and the like. A plating catalyst such as palladium may be deposited prior to electroless plating.

  The metal plate 10 for heat dissipation may be either a single layer or a laminated body, and any metal may be used as a constituent metal. For example, copper, copper alloy, aluminum, stainless steel, nickel, iron, other alloys, etc. can be used. . Of these, copper and aluminum are preferable from the viewpoint of thermal conductivity and electrical conductivity. With the structure including the heat radiating metal plate 10 having good heat dissipation as described above, the temperature rise of the light emitting element 15 can be prevented, so that more drive current can be passed and the amount of light emission can be increased.

  As the metal constituting the surface metal layer 22, usually copper, copper alloy, nickel, tin or the like can be used, and copper is particularly preferable from the viewpoint of thermal conductivity and electrical conductivity.

  As the metal constituting the protective metal layer 21, a metal different from the metal plate for heat dissipation 10 and the surface metal layer 22 is used, and another metal exhibiting resistance when etching these metals can be used. Specifically, when these metals are copper, another metal constituting the protective metal layer 21 is gold, silver, zinc, palladium, ruthenium, nickel, rhodium, lead-tin solder alloy, or nickel. -A gold alloy or the like is used. However, the present invention is not limited to the combination of these metals, and any combination with another metal exhibiting resistance when the metal is etched can be used.

  Next, as shown in FIG. 2B, the surface metal layer 22 is selectively etched using the etching resist M. Thereby, the metal convex part 22b is formed in the mounting position of the light emitting element 15. The planar shape of the metal protrusion 22b may be any, but it is preferable from the viewpoint of heat dissipation to increase the area as much as possible.

  In this embodiment, as shown in FIG. 1, a substantially circular metal protrusion 22b is formed, and a substantially circular heat radiation pattern 23b is formed on the upper surface thereof. A semicircular arc-shaped electrode portion 23a is formed around the metal convex portion 22b and is electrically connected to the power feeding pattern. Thus, the substantially circular heat radiation pattern 23b and the electrode part 23a formed around the heat radiation pattern 23b can reflect light from the light emitting element 15 efficiently.

  As the etching resist M, a photosensitive resin, a dry film resist (photoresist), or the like can be used. In addition, when the metal plate 10 for thermal radiation is etched simultaneously with the surface metal layer 22, it is preferable to provide the mask material for preventing this on the lower surface of the metal plate 10 for thermal radiation (illustration omitted).

  Examples of the etching method include etching methods using various etching solutions according to the types of metals constituting the protective metal layer 21 and the surface metal layer 22. For example, when the surface metal layer 22 is copper and the protective metal layer 21 is the aforementioned metal (including a metal resist), a commercially available alkaline etching solution, ammonium persulfate, hydrogen peroxide / sulfuric acid, or the like can be used. After the etching, the etching resist is removed.

  Next, as shown in FIG. 2D, the exposed protective metal layer 21 is removed, but it is also possible to form the insulating layer 40 without removing it. The protective metal layer 21 can be removed by etching. Specifically, when the surface metal layer 22 is copper and the protective metal layer 21 is the above-described metal, nitric acid that is commercially available for removing solder. It is preferable to use an acid-based etching solution such as an acid-based, sulfuric acid-based, or cyan-based acid.

  When the protective metal layer 21 exposed in advance is removed, the surface of the metal plate 10 for heat dissipation is exposed from the removed portion. In order to improve the adhesion between this and the insulating layer 40, blackening treatment, roughening treatment, etc. It is preferable to perform a surface treatment.

  In this embodiment, next, as shown in FIGS. 2E to 2F, a flat insulating layer 40 is formed substantially flush with the upper surface of the metal protrusion 22b. In that case, after forming the insulating layer 40 on the formation surface of the metal convex portion 22 b, the metal convex portion 22 b can be exposed from the insulating layer 40. Prior to this, the mask M may be removed, but this may be selected as appropriate according to the type of the mask M, such as removal of chemicals and removal of peeling. For example, in the case of photosensitive ink formed by screen printing, it is removed with chemicals such as alkali.

  For forming the insulating layer 40, first, the insulating material 40a is applied. As the insulating material 40a, for example, a reactive curable resin such as a liquid polyimide resin or an epoxy resin that has good insulation properties and is inexpensive can be used. . This may be applied by various methods so as to be slightly thicker than the height of the metal protrusion 22b, and then cured by heating or light irradiation. As a coating method, various coaters such as a curtain coater can be used. Alternatively, a hot pressing or vacuum laminating method may be used using an adhesive sheet, a prepreg, or the like containing a reactive curable resin.

  Next, the insulating layer 40 having substantially the same thickness as the height of the metal protrusion 22b is formed by grinding, polishing, or the like of the cured insulating material 40a. Examples of the grinding method include a method using a grinding apparatus having a hard rotary blade in which a plurality of hard blades made of diamond or the like are arranged in the radial direction of the rotary plate, and the hard rotary blade is fixedly supported while rotating. By moving along the upper surface of the wiring board, the upper surface can be planarized. Moreover, as a grinding | polishing method, the method of lightly grind | polishing by a belt sander, buff grinding | polishing, etc. is mentioned.

  The manufacturing method of this invention includes the process of forming the electrode part 23a in the vicinity of the metal convex part 22b, as shown in FIG.2 (g). In the present embodiment, an example is shown in which a heat radiation pattern 23b is formed on the upper surface of the metal convex portion 22b and a power feeding pattern having an electrode portion 23a is formed in the vicinity of the heat radiation pattern 23b.

  At this time, any pattern forming method may be used, and examples thereof include a panel plating method in which a pattern is formed using an etching resist, and a pattern plating method in which a pattern plating resist is used for plating.

  The power supply pattern having the heat radiation pattern 23b and the electrode portion 23a is preferably plated with a noble metal such as gold, nickel, or silver in order to increase the reflection efficiency. Further, a solder resist may be formed as in the case of a conventional wiring board, or solder plating may be partially performed.

[Other Embodiments of Light Emitting Element Mounting Board]
(1) In the above-described embodiment, an example in which a substantially circular metal convex portion and a heat radiation pattern and an electrode portion formed around the metal convex portion are shown. However, in the present invention, the metal convex portion, the heat radiation pattern, The shape of the electrode part is not particularly limited. For example, as shown in FIG. 3, the linear electrode part 23 a enters the notch part between the substantially circular metal convex part 22 b and the heat radiation pattern 23 b. Also good. According to this embodiment, since the electrode part 23a has penetrated to the vicinity of the light emitting element 15, a bonding wire can be shortened.
(2) In the above-described embodiment, as shown in FIG. 1, the example in which the light emitting element 15 and the reflector 16 are separately mounted on the light emitting element mounting substrate is shown. However, in the present invention, FIG. As shown, the light emitting element unit LU in which the light emitting element 15 and the reflector 16 are integrally formed may be mounted on the light emitting element mounting substrate. Various types of such light emitting element units LU are commercially available, and any of these can be used.

The light emitting element unit LU includes a pair of electrode portions and a bonding portion on the bottom surface thereof, and can be mounted with reflow or the like in the same manner as a normal surface mount component. Since the light emitting element mounting substrate of the present embodiment is provided with a power supply pattern having an electrode portion 23a formed at the same height as the heat dissipation pattern 23b provided on the upper surface of the metal convex portion 22b, Since the mounting surface becomes flat, the light emitting element unit LU can be mounted more suitably.
(3) In the above-described embodiment, the example in which the face-up type light emitting element is mounted is shown. However, in the present invention, as shown in FIG. 5, the face-down type light emitting element having a pair of electrodes on the bottom surface is mounted. May be. In that case, it is preferable that the electrode part 23a for supplying electric power has a shape entering the notch part between the metal convex part 22b and the heat radiation pattern 23b in order to improve heat dissipation.
(4) In the above-described embodiment, the metal convex portion formed at the mounting position of the light emitting element is joined to the metal substrate via another protective metal layer exhibiting resistance during the etching, and the metal convex portion Although an example in which a heat radiation pattern is formed on the upper surface is shown, the light emitting element mounting substrate of the present invention is a metal convex portion formed by etching, an insulating layer formed around the metal convex portion, Any structure may be used as long as it has an electrode part formed in the vicinity of the metal convex part.

  For example, as shown in FIG. 6A, the protective metal layer can be omitted by forming the metal protrusion 22b and the metal substrate 10 with different metals. In that case, it is preferable to form the metal convex part 22b with the same metal as the protective metal layer mentioned above. Such a metal protrusion 22b can be formed by stopping the etching on the metal substrate 10 when etching is performed, as in the above-described embodiment.

  In addition, as shown in FIG. 6B, the protective metal layer can be omitted by forming the metal convex portion 11 and the metal substrate 10 with the same metal. In that case, the metal convex part 11 can be formed by half-etching a metal plate having a thickness obtained by combining the metal convex part 11 and the metal substrate 10.

Further, as shown in FIG. 6C, the light emitting element 15 may be mounted on the metal protrusion 22b without forming the heat dissipation pattern. In this case, the light emitting element 15 is bonded to a lower position by the thickness of the electrode portion 23a.
(5) In the above-described embodiment, the example in which the light emitting element mounting substrate is configured by the heat radiation pattern and the power feeding pattern having the electrode portion has been described. However, in the present invention, other electronic circuits are provided on the same substrate. It may be formed. For example, it is preferable to form a drive circuit for a light emitting diode.

In this case, wiring, lands, pads for bonding, pads for electrical connection to the outside, etc. are patterned around the substrate, particularly corners and the vicinity thereof, and parts between the wiring such as chip capacitors, chip resistors and printing resistors, A transistor, a diode, an IC, or the like may be provided.
(6) In the above-described embodiment, the example in which the light emitting element is mounted on the wiring substrate having a single wiring layer is shown. However, in the present invention, the light emitting device emits light on the multilayer wiring substrate having two or more wiring layers. An element may be mounted. In that case, the conductive connection structure between the wiring layers can be formed in the same process as the process of forming the metal protrusions. Details of the method of forming such a conductive connection structure are described in International Publication No. WO 00/52977, and any of these can be applied.

[Other Embodiments of Manufacturing Method]
(1) In the above-described embodiment, when the insulating layer is formed, the example in which the electrode portion and the like are formed after forming the insulating layer with the metal protrusion exposed is shown. In the present invention, as shown in FIG. In addition, a metal layer for forming the electrode portion or the like can be formed integrally with the insulating layer.

  For example, as shown in FIG. 7A, the metal protrusion 22b is formed in the same manner as described above. Next, as shown in FIG. 7B, an insulating layer and a metal layer are simultaneously formed using a copper foil with resin. The copper foil with resin is heated and pressed by a pressing surface to obtain a laminate having a convex portion at a position corresponding to the metallic convex portion 22b and having a metal layer 23 formed on the surface. At this time, it is preferable to arrange at least a sheet material that allows concave deformation between the press surface and the laminated body. Moreover, you may use the press surface which has a recessed part in the position corresponding to the metal convex part 22b.

  Various types of copper foil with resin are commercially available, and any of them can be used. Further, the metal layer forming material and the insulating layer forming material may be arranged separately. In this step, the sheet material is deformed in a concave shape at the time of hot pressing due to the presence of the metal convex portion 22b, and thus a corresponding convex portion is formed in the laminate.

  As a heating press method, a heating / pressurizing apparatus (thermal laminator, heating press) or the like may be used. In this case, the atmosphere may be set to a vacuum (vacuum laminator or the like) in order to avoid air contamination. Conditions such as heating temperature and pressure may be appropriately set according to the material and thickness of the insulating layer forming material and the metal layer forming material, but the pressure is preferably 0.5 to 30 MPa.

  As the insulating layer forming material, any material may be used as long as it is deformed at the time of lamination and solidified by heating or the like and has the heat resistance required for the wiring board. Specific examples include various reaction curable resins such as polyimide resins, phenol resins, and epoxy resins, and composites (prepregs) of the same with glass fibers, ceramic fibers, aramid fibers, and the like.

  The sheet material may be any material that allows concave deformation at the time of heating press, such as cushion paper, rubber sheet, elastomer sheet, nonwoven fabric, woven fabric, porous sheet, foam sheet, metal foil, and composites thereof. Can be mentioned. In particular, those that can be elastically deformed, such as cushion paper, rubber sheets, elastomer sheets, foam sheets, and composites thereof, are preferable.

  A release sheet may be additionally arranged together with the sheet material. Examples of the release sheet include a fluororesin film, a silicone resin film, various release papers, a fiber reinforced fluororesin film, and a fiber reinforced silicone resin film.

  The thickness of the sheet material is preferably thicker than half of the height of the metal convex portion 22b, and preferably thicker than the height of the metal convex portion 22b. By adjusting the thickness and hardness of the sheet material, it is possible to control the height and shape of the convex portions of the laminate formed by the hot press. Generally, when the thickness of the sheet material is reduced and the hardness is increased, the height and volume of the convex portions of the formed laminate are reduced.

  Next, as shown in FIG. 7C, the convex portions of the laminate are removed to expose the metal convex portions 22b. At this time, the portion where the upper surface of the metal protrusion 22b is higher than the upper surface of the metal layer 23 of the laminate may be removed and planarized at the same time.

  As a method for removing the convex portion, a method by grinding or polishing is preferable, a method using a grinding device having a hard rotary blade in which a plurality of hard blades made of diamond or the like are arranged in the radial direction of the rotary plate, a sander, a belt sander, Examples thereof include a method using a grinder, a surface grinder, a hard abrasive molded product, and the like. When the grinding apparatus is used, the upper surface can be flattened by moving the hard rotary blade along the upper surface of the fixedly supported wiring board while rotating the hard rotary blade. Moreover, as a grinding | polishing method, the method of lightly grind | polishing by a belt sander, buff grinding | polishing, etc. is mentioned. When the convex portion is formed on the laminate as in the present invention, it becomes easy to grind only that portion, and the entire flattening can be performed more reliably.

Next, the metal layer 23 is etched using an etching resist to form a power feeding pattern having the electrode portions 23a. Thereafter, plating or the like may be performed to increase the thickness of the power feeding pattern or the like.
(2) In the above-described embodiment, an example in which grinding or the like is performed as it is after hot pressing the resin-coated copper foil is shown. However, in the present invention, as shown in FIGS. After heat-pressing the foil, the metal layer 23 above the metal protrusions 22b may be removed by etching (FIG. 8C), and then grinding or the like may be performed in the same manner.
(3) In the above-described embodiment, an example in which the metal layer is deformed into a convex shape by arranging a sheet material that allows concave deformation between the press surface and the stacked body has been described. A dry film resist is laminated on the upper surface of the metal layer, and pattern exposure and development are performed to form a dry film resist having an opening above the metal convex portion. It is also possible to deform the layer into a convex shape.

It is a figure which shows an example of the light emitting element mounting substrate of this invention, (a) is a top view, (b) is front view sectional drawing. Process drawing which shows an example of the manufacturing method of the light emitting element mounting substrate of this invention It is a figure which shows the other example of the light emitting element mounting substrate of this invention, (a) is a top view, (b) is front view sectional drawing. It is a figure which shows the other example of the light emitting element mounting substrate of this invention, (a) is a top view, (b) is front view sectional drawing. It is a figure which shows the other example of the light emitting element mounting substrate of this invention, (a) is a top view, (b) is front view sectional drawing. Front view sectional drawing which shows the other example of the light emitting element mounting substrate of this invention Process drawing which shows the other example of the manufacturing method of the light emitting element mounting substrate of this invention. Process drawing which shows the other example of the manufacturing method of the light emitting element mounting substrate of this invention. It is a figure which shows an example of the conventional light emitting element mounting substrate, (a) is front view sectional drawing, (b) is a top view

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Metal substrate 15 Light emitting element 21 Protective metal layer 22 Surface metal layer 22b Metal convex part 23a Electrode part 23b Heat radiation pattern 40 Insulating layer

Claims (3)

A light-emitting element mounting substrate for mounting a light-emitting element and supplying power thereto, a metal substrate, a metal convex portion formed by etching at a mounting position of the light-emitting element on the metal substrate, and the metal convex portion A substrate for mounting a light emitting device, comprising: an insulating layer formed in the periphery; a heat radiation pattern formed on an upper surface of the metal convex portion; and an electrode portion formed in the vicinity of the metal convex portion. The pattern for use has a cutout portion, and the metal convex portion has a cutout portion below the cutout portion of the heat radiation pattern, and the light emitting element has a shape in which the electrode portion enters the cutout portion. Substrate.   A light-emitting element mounting substrate for mounting a light-emitting element and supplying power thereto, a metal substrate, a metal convex portion formed by etching at a mounting position of the light-emitting element on the metal substrate, and the metal convex portion A power supply pattern having a flat insulating layer substantially flush with the upper surface, a heat radiation pattern formed on the upper surface of the metal protrusion, and an electrode portion formed at the same height as the heat radiation pattern A light emitting element mounting substrate comprising: the heat dissipating pattern having a cutout portion and the electrode portion entering the cutout portion.   The light emitting element mounting substrate according to claim 1, wherein the metal convex portion is bonded to the metal substrate via another protective metal layer exhibiting resistance during etching.

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