JP2011044593A - Led substrate and led package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED substrate and an LED package hard to deteriorate and discolor with heat and ultraviolet rays emitted from an LED element and hence excellent in reliability as a luminaire, simultaneously attaining high reflectivity and heat radiating property and reduced in cost. <P>SOLUTION: In the LED substrate, a reflector is laminated to one surface of a wiring board having a bonding pad on its one surface and a lower surface electrode which is electrically connected with the bonding pad by inter-layer connection on its other surface via an adhesive. The bonding pad is exposed from the adhesive and a connection opening formed in the reflector and an LED mounting part for mounting the LED element which is electrically connected with the exposed bonding pad is disposed on a surface of the reflector. The LED package uses this LED substrate. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an LED substrate and an LED package, and more particularly to an LED substrate and an LED package used for illumination.

  In recent years, from the viewpoint of energy saving and environmental conservation, LCD televisions and backlights for liquid crystal screens and LED (Light Emitting Diode) for general household lighting have been advanced. LED lighting has many advantages, such as 10 times longer life than fluorescent and incandescent bulbs, and 1/10 of the electricity bill. It is in the limelight, but it is radiating heat due to the heat and ultraviolet rays generated from LED elements. Consideration must be given to improving the reliability of lighting equipment, such as designing and measures for discoloration of peripheral equipment, making it expensive in terms of cost.

  For example, in consideration of such reliability improvement, as a substrate or package used for LED lighting, as a base material for a lighting LED, A. A lead frame; Ceramic, C.I. Some use aluminum core wiring boards.

  A. Lead frames and B.I. As a substrate or package for LED lighting using ceramic, in order to improve the reflectance of white light from the LED, one using silver plating having the highest reflectance at a wavelength near 460 nm as a reflector is used. (Patent Documents 1 and 2).

  In addition, C.I. As a substrate or package for LED lighting using an aluminum core wiring board, as shown in FIG. 7, a single-sided wiring board 5 in which an opening 10 is provided in an LED mounting portion 7 is bonded to a highly reflective aluminum board 3. There is also a commercially available structure that prevents the deterioration of luminance over time by mounting the LED element 8 directly on the aluminum plate 3 without using silver plating that is pasted through the agent 4 and easily changes in color. (Patent Document 3).

JP 2007-158211 A JP 2007-227728 A JP 2007-109701 A

  A. of Patent Document 1. Ceramic and B.C. In a substrate or package for LED lighting using a lead frame, silver plating is used as a reflective material, but this silver plating tends to have a reflectivity that decreases with time due to discoloration. For this reason, a decrease in luminance over time cannot be prevented. B. In LED lighting substrates and packages using lead frames, PPA (aromatic polyamide) is often used as a resin that is integrally molded as a reflector, which is a reflective material. Discoloration cannot be avoided.

  C.I. LED lighting substrates and packages using aluminum core wiring boards do not use silver plating, so there is no decrease in luminance over time, and LED elements are mounted directly on the aluminum plate, so there is no problem with heat dissipation. Even it is effective. However, because of the structure in which a single-sided resin wiring board is attached to an aluminum plate, the bottom electrode is not disposed. Like a metal core wiring board, it is possible to make a structure where a hole is made in an aluminum plate, an insulating resin is filled in the hole, a hole is made in the center of the filled resin, and a bottom electrode is formed through a through hole by copper plating. However, due to the complexity of the process, it is inevitable that it will be expensive.

  The present invention has been made in view of the above problems, and since it is difficult to cause deterioration and discoloration against heat / ultraviolet rays emitted from LED elements, it has excellent reliability as a lighting fixture and has a high reflectance. An object of the present invention is to provide an LED substrate and an LED package that are compatible with high heat dissipation and are inexpensive.

The present invention relates to the following.
(1) A reflecting plate is attached to one surface of a wiring board having a bonding pad on one surface and a lower surface electrode electrically connected to the bonding pad by interlayer connection on the other surface via an adhesive. LED mounting for mounting an LED element that is a combined LED substrate, wherein the bonding pad is exposed from a connection opening provided in the adhesive and the reflector, and is electrically connected to the exposed bonding pad An LED substrate having a portion provided on the surface of the reflector.
(2) The LED substrate according to (1), wherein the surface of the bonding pad is gold plating.
(3) The LED substrate according to (1) or (2) above, wherein the reflector is a highly reflective aluminum having a reflectance of 80% or more with respect to light having a wavelength of 460 nm.
(4) The LED substrate according to any one of the above (1) to (3), wherein a gap between bonding pads is filled with a resin and one surface of a wiring board is flat.
(5) An LED package in which an LED element is mounted on the LED mounting portion of the LED substrate of any one of (1) to (4), and the LED element and the exposed bonding pad are electrically connected.
(6) In (5) above, a hole for forming an anchor is provided in the reflecting plate, and an anchor portion is formed by the mold resin formed on the reflecting plate flowing into the hole and curing. LED package.

  According to the present invention, it is difficult to cause deterioration and discoloration even with respect to heat and ultraviolet rays emitted from the LED element, so that it is excellent in reliability as a lighting fixture, and has both high reflectance and high heat dissipation, and An inexpensive LED substrate and LED package can be provided.

Sectional drawing of Example 1 of the LED board and LED package of this invention is shown. The perspective view of Example 1 of the LED board and LED package of this invention is shown. An example of the manufacturing process of the LED substrate and LED package of this invention is shown. An example of the manufacturing process of the LED substrate and LED package of this invention is shown. Sectional drawing of Example 2 of the LED board and LED package of this invention is shown. The perspective view of Example 2 of the LED substrate and LED package of this invention is shown. Sectional drawing of the conventional LED board is shown.

  The LED substrate of the present invention is a substrate for mounting an LED element, and is a member for mounting a LED element to form a so-called LED package. It is desirable that it is mainly used for general illumination because it can take advantage of the features of the present invention such as high reflectivity and high heat dissipation.

  As an example of the LED substrate of the present invention, as shown in FIGS. 1 and 2, a conductor circuit 15 including a bonding pad 6 on one surface is electrically connected to the other surface by the bonding pad 6 and an interlayer connection 20. An LED substrate 1 in which a reflective plate 3 is bonded to the one surface of a wiring board 5 including a conductor circuit including a connected lower surface electrode 11 via an adhesive 4, the adhesive 4 and the reflective plate 3. The bonding pad 6 is exposed from the connection opening 12 provided in the LED, and the LED mounting portion 7 for mounting the LED element 8 electrically connected to the exposed bonding pad 6 is provided on the surface of the reflector 3. The LED board 1 provided in is mentioned.

  That is, as the LED substrate of the present invention, a bonding pad is provided on one surface, a wiring board having a bottom electrode on the other surface, a reflecting plate having a connection opening, and an adhesive on one surface of the wiring board. And an LED substrate having a structure in which the bonding pad is exposed from the connection opening to the surface side of the reflector. A structure in which a reflector is bonded to the surface of the LED substrate so that a bonding pad for connecting the LED element with a bonding wire is exposed, and the LED element is fixed and mounted on the reflector with a die bond agent It becomes. For this reason, the surface is covered with a reflection plate except for the bonding pad portion, so that the wiring board is protected from the heat and ultraviolet rays emitted from the LED element, achieving both high reflectivity and high heat dissipation, and inexpensive. It becomes possible to provide a simple LED substrate. In addition, it is possible to provide an LED substrate suitable for lighting applications that require particularly high luminance.

  As the wiring board used in the present invention, a board used for a general semiconductor mounting board can be used, and it may be either a double-sided wiring board or a multilayer wiring board. Further, a conductor circuit that is electrically connected to the bonding pad may be formed. The conductor circuit including the bonding pad can be formed by a circuit forming method used in manufacturing a general semiconductor mounting substrate. Further, at least a lower surface electrode may be formed on the other surface, and a conductor circuit electrically connected to the lower surface electrode may be formed. The bonding pad and the lower surface electrode are electrically connected by interlayer connection such as a through hole or a via hole. The bottom electrode and the conductor circuit can also be formed by a circuit forming method used in manufacturing a general semiconductor mounting substrate.

  The bonding pad is a terminal for making an electrical connection with an LED element or the like by wire bonding or bump, similar to that used in a general semiconductor mounting substrate. The surface of the bonding pad is preferably coated with a noble metal such as gold or silver in terms of workability and reliability when connecting with a bonding wire or solder.

  The surface of the bonding pad is preferably gold plated. Thereby, when using a gold wire as a bonding wire used for wire bonding, the bonding between the bonding pad and the bonding wire can be strengthened, and solder wettability when soldering can be ensured. . Further, it is desirable to provide nickel plating on the bonding pad as a base for gold plating. Conductor circuits including bonding pads are generally formed using copper foil or copper plating, but by providing nickel plating as the gold plating base, copper diffuses to the gold plating surface, and the connection reliability with the bonding wire Can be suppressed.

  The thickness of the gold plating is desirably 0.01 to 3 μm. Thereby, the gold plating can ensure the bonding strength with the bonding wire, and can prevent oxidation of the underlying nickel plating. The thickness of the underlying nickel plating is preferably 1 to 5 μm. Thereby, since nickel plating suppresses the spreading | diffusion to the gold plating surface of copper, the reliability of wire bonding is securable.

  In the present invention, the lower surface electrode refers to an electrode provided on the opposite surface (the other surface) of the surface (one surface) on which the bonding pads of the wiring board are provided. When mounted on a substrate, it is used to connect to mounting terminals on other substrates. The connection between the bottom electrode and the mounting terminal of another substrate can be performed by pressure bonding using a conductive adhesive or soldering.

  The adhesive used in the present invention is for bonding a wiring board and an aluminum plate, and general adhesives used in the manufacture of general multilayer wiring boards and semiconductor mounting substrates can be used. For example, a thermosetting liquid or sheet-like adhesive mainly composed of a thermosetting resin prepreg or a high molecular weight epoxy resin can be used. As the thermosetting resin prepreg, GEA-67N (manufactured by Hitachi Chemical Co., Ltd., trade name) is used, and as the liquid adhesive, SFX513 (made by Shin-Etsu Chemical Co., Ltd., trade name) is used as the sheet adhesive. Examples include AS-3000 and AS2600W (both manufactured by Hitachi Chemical Co., Ltd., trade name), high performance adhesive sheet TAS for electronic parts (trade name, manufactured by Toray Industries, Inc.), and the like.

  It is more desirable that the adhesive used in the present invention has high thermal conductivity. Thereby, the heat transmitted from the LED element to the adhesive via the reflector can be radiated more efficiently. Here, the high thermal conductive adhesive refers to an adhesive having a thermal conductivity coefficient of 0.1 to 30 W / m · K. As such a high thermal conductive adhesive, for example, an epoxy adhesive is inorganic. An adhesive filled with a system filler can be used.

  A thermosetting adhesive mainly composed of a high molecular weight epoxy resin is desirable in that the fluidity of the resin when laminated by heating and pressurization can be reduced. When using such an adhesive with low fluidity, an adhesive is formed on the reflector in advance, and an opening to be a connection opening is formed by drilling or the like, and then the step of bonding to the wiring board is taken. Work is facilitated. On the other hand, if an opening to be a connection opening is formed after pasting the reflector and the wiring board together, the bonding pad on the wiring board may not be exposed because it is difficult to control the penetration depth by drilling. I'm worried about going through the bonding pad. In addition, when using a conformal method by laser processing, when forming an opening to be a laser mask on the reflector, etching is performed after the etching resist is formed, and finally the etching resist is peeled off. Since the surface of the plate is exposed to the chemical used in this etching process, when a metal plate such as an aluminum plate is used as the reflection plate, the surface having high reflectivity is dissolved and altered, so that reflection occurs. There is a problem that the rate decreases. Furthermore, this conformal method has a problem that man-hours increase.

  The reflector used in the present invention has a function of reflecting the light emitted from the LED element and radiating the generated heat. The reflector is not particularly limited as long as it reflects the light from the LED element and has heat dissipation properties. For example, a red metal material such as copper or gold, or a silver white system such as silver, nickel, or aluminum. And a white heat-resistant resin material containing a filler having light reflectivity and thermal conductivity such as alumina and silica. Since the present invention has a simple configuration in which a reflecting plate is bonded to a wiring board, the reflecting plate to be used can be freely selected according to required luminance and application.

  When the LED element is a so-called high-brightness LED element such as a blue LED or a white LED, a silver-white metallic material such as silver, nickel, or aluminum is desirable as the reflector. Among these, aluminum is preferable in that there is little discoloration with time. Here, the high-brightness LED generally refers to one having a luminance of several hundred to several thousand mcd / m2. In particular, when using a high-intensity LED as in lighting applications and high heat dissipation is required with high emission intensity, so-called highly reflective aluminum having a reflectance of 80% or more for light having a wavelength near 460 nm It is desirable to use Further, it is more preferable to use highly reflective aluminum having a reflectance of 90% or more with respect to light having a wavelength near 460 nm. Highly reflective aluminum having a reflectance of 95% or more with respect to light having a wavelength near 460 nm is used. More preferably it is used. Thus, by using highly reflective aluminum with higher reflectivity, it is possible to provide an LED substrate suitable for higher brightness applications. Here, the reflectance is obtained by removing light absorbed by the reflecting plate and transmitted light from light incident on the reflecting plate. The reflectance was measured using a spectrocolorimeter (trade name: CM-508d, manufactured by Minolta Co., Ltd.), and the reflectance at a wavelength of 460 ± 10 nm was read. The reflectance value is at least an initial value.

  As described above, the highly reflective aluminum used in the present invention has a reflectance of 80% or more with respect to light having a wavelength of about 460 nm. It is desirable that an oxide film having a high reflectance is formed on the surface. Due to the high reflectance of the oxide film formed on the surface, the light from the LED element can be reflected with high efficiency. Also, since metals generally corrode, the reflectivity is likely to change over time, but by forming a stable oxide film and providing this oxide film with a reflective function, the progress of metal corrosion is suppressed, It becomes possible to suppress a change in reflectance with time. Examples of such highly reflective aluminum plates include MIR02 (trade name, manufactured by ALANODOD) and ACA425OE (trade name, manufactured by ACA). As a result, not only general LED elements but also high-intensity LED elements can be mounted, light from the LED elements can be reflected with high efficiency and heat dissipation is good, so that high heat dissipation can be realized with high emission intensity. .

  In the present invention, the bonding pads are exposed from the connection openings provided in both the adhesive and the reflector. That is, a connection opening is provided at a position corresponding to the bonding pad provided on one surface of the wiring board, both of the adhesive and the reflector, and this connection when viewed from the front side of the reflector. The bonding pad provided on one surface of the wiring board is exposed from the opening for the surface of the reflector. As a result, the surface side of the reflection plate where the bonding pads are exposed has electrical properties between the LED element mounted on the reflection plate surface and the wiring board bonded to the back surface of the reflection material while having the properties as a reflection material. Connection can be made.

  The connection opening of the present invention is used for wire bonding or flip chip connection between the LED element mounted on the LED mounting portion provided on the surface of the reflector and the bonding pad provided on one surface of the wiring board. In order to expose the bonding pad to the surface of the reflective material. It is provided on both the reflector and the adhesive. For this reason, a connection opening is formed in advance on the reflecting plate on which the adhesive is formed by drilling, punching, laser processing, etc., and the bonding pad provided on one surface of the wiring board is exposed from the connection opening. It is desirable to perform alignment so that the two are bonded together. Thereby, the structure which the bonding pad formed on one surface of a wiring board exposes to the surface side of a reflecting plate from the opening for a connection with a simple construction method is realizable. It should be noted that the relationship between the position and size of the connection opening and the bonding pad may be such that the bonding pad is exposed entirely from the connection opening or a part thereof is exposed. That is, the connection opening may be larger than the bonding pad, and conversely, the connection opening may be smaller than the bonding pad. Further, the shape of the connection opening does not need to be similar to the shape of the bonding pad. For this reason, it is not necessary to align the connection opening and the bonding pad with high accuracy, so that the alignment operation is easy. Note that if only the bonding pads are exposed from the connection openings, the portion of the wiring board formed of resin is not exposed on the surface side of the reflecting plate, so that deterioration of the wiring board due to light from the LED element can be suppressed. Desirable,

  The reflector of the present invention is preferably provided with an anchor forming hole 26 in addition to the connection opening (FIGS. 5 and 6). Thus, when the LED package 2 is formed using the LED substrate 1, the molding resin 14 formed on the reflecting plate 3 flows into the anchor formation hole 26 and hardens, thereby fixing the anchor portion 27. Therefore, the shear strength between the LED substrate 1 and the mold resin 14 can be ensured. It is more desirable for the anchor formation hole 26 to be provided not only for the reflecting plate 3 but also to reach a depth reaching the wiring board 5 below it. Here, the anchor formation hole 26 is for forming the anchor portion 27 by the mold resin 14 flowing into the hole and being cured. The anchor portion 27 refers to a portion having an effect of being physically joined, and specifically refers to a portion where the mold resin 14 has flowed into the hole and hardened.

  An LED mounting portion for mounting an LED element electrically connected to the exposed bonding pad is provided on the surface of the reflector of the present invention. The LED mounting portion refers to a region provided on the reflection plate for mounting the LED element. The LED element can be fixed to the LED mounting portion with a general die bond material. As the die bond material, an epoxy resin, a silicone resin, a mixed type resin thereof, or the like can be used. When a high-luminance LED element is mounted, using a silicone resin or a mixed type resin is effective in suppressing yellowing due to ultraviolet rays.

  It is desirable to fill the gap of the conductor circuit including the bonding pad with resin so that one surface of the wiring board is flat. As a result, on one surface of the wiring board where the bonding pad and the conductor circuit including the same are provided, the step between the conductor circuit and the base material is filled and flattened. As the adhesive used when bonding the two, those having low fluidity can be used. In other words, since there is no step due to the conductor circuit on one surface of the wiring board, it is not necessary to fill the step due to the conductor circuit with the adhesive, so that the fluidity of the adhesive itself is hardly required. For this reason, a connection opening is formed in advance on the reflecting plate on which the adhesive is formed by drilling, punching, laser processing, etc., and the bonding pad provided on one surface of the wiring board is exposed from the connection opening. Since a configuration in which the bonding pad is exposed from the connection opening of the reflector can be realized by a simple method of aligning and bonding together, the workability is very good.

  As a method for flattening the gap between the conductor circuits including the bonding pads with a resin, the resin is applied by a method such as printing on the base material where the conductor circuit is not provided, and then cured. It is desirable to polish the resin and the conductor circuit together. The resin used at this time may be an insulating resin, and a resin generally used as a solder resist in a semiconductor mounting substrate can be used. Here, polishing the resin and the conductor circuit in a lump means that the resin and the surface of the conductor circuit are simultaneously polished to form a polished surface having the same height. Thereby, since the surface of resin and a conductor circuit becomes equivalent height, the level | step difference of a conductor circuit and a base material can be filled with resin, and can be made into a flat state.

  An LED element is mounted on the LED mounting portion of the LED substrate, and the LED element and the exposed bonding pad are electrically connected. Further, the bonding pad exposed from the connection opening is electrically connected to the lower surface electrode provided on the other surface of the wiring board. Therefore, by connecting the lower surface electrode to another substrate, Can be mounted on a substrate. As a result, since the surface of the wiring board is covered with a reflecting plate, it is difficult to cause deterioration or discoloration against heat and ultraviolet rays emitted from the LED element. It is possible to provide an inexpensive LED package that achieves both reflectivity and high heat dissipation.

  It is desirable that the molding resin is formed so that the molding resin formed on the reflection plate flows into an anchor formation hole provided in the reflection plate and cures to form an anchor portion. Thereby, an LED package having a high shear strength between the mold resin and the LED substrate can be provided.

  Examples of the present invention will be described below with reference to FIGS. 1 to 6, but the present invention is not limited to these examples.

Example 1
First, as a base material 16 of the wiring board 5, a through hole 18 is formed by drilling a predetermined portion of a copper clad laminate in which a 18 μm copper foil is bonded to both sides of a core material having a thickness of 0.4 mm. FIG. 3 (a)). Thereafter, a copper plating 19 having a thickness of 15 μm is applied to form a through hole 20 (FIG. 3B). Although the thickness of the copper plating 19 varies depending on the heat dissipation characteristics, the heat conductivity is better as the thickness is thicker, and it is needless to say that the thickness is poor, and can be arbitrarily determined according to the heat dissipation characteristics required of the product.

  Next, an epoxy resin as a hole filling resin 21 is filled in the through hole 20 by a screen printing method and cured, and copper plating is performed again by 10 μm, and the hole is closed with copper plating (FIG. 3C). The filling of the hole filling resin 21 may be performed by filling with a roll coater. After resin filling, after curing at 160 ° C. for 60 minutes, the resin on the copper foil is removed by a buffing machine. When emphasizing thermal conductivity, it is desirable to use a copper paste as the hole filling resin 21.

  Next, a predetermined conductor circuit 15 is formed by an etching method, and the resin is entirely coated by a screen printing method in order to reduce the step between the conductor circuit 15 and the substrate 16. It goes without saying that the printing surface at this time is a surface on which the aluminum plate as the reflection plate 3 is bonded. The coated resin is cured with a box dryer at 150 ° C. for 1 hour, and the resin on the conductor circuit 15 is removed by buffing to complete a flat surface (FIG. 3D).

  Thereafter, a solder resist 24 is formed at a predetermined position excluding the bonding pad 6 (FIG. 3 (e)). As a noble metal plating 25, an electrolytic plating of 0.3 μm of gold is performed on an electrolytic plating of 5 μm of nickel. Except for this, the wiring board 5 having a flat surface is completed (FIG. 3E). The noble metal plating 25 is preferably gold plating with little discoloration, but because of the bonding pad 6 only in area, the electroplating of silver 1 μm may be performed on the electroplating of nickel 5 μm. Further, not only electrolytic plating but also electroless plating is possible.

  On the other hand, the reflecting plate 3 is first bonded in the form of a sheet as a thermosetting adhesive 4 on the entire non-glossy surface of a highly reflective aluminum material (thickness 0.2 mm) having a reflectance at a wavelength of 460 nm of 80% or more. AS3000 (trade name, manufactured by Hitachi Chemical Co., Ltd.) as an agent was formed by a lamination press (FIGS. 4 (g) and (h)). Thereafter, drilling is performed to provide the connection opening 12 at a predetermined position by drilling (FIG. 4 (i)). Drilling of the connection opening 12 and the anchor formation hole can be performed by punching.

  The wiring board 5 thus prepared and the aluminum plate 3 with the adhesive 4 are bonded together by a hot press (FIG. 4 (j)). At this time, bonding with a hot roll is also possible. The bonded wiring board 5 is processed into a predetermined size by router processing, and the LED substrate 1 is completed.

  Next, a blue LED, which is a high-intensity LED, is used as the LED element 8 at a predetermined location (LED mounting portion 7 provided on the aluminum plate 3) with a die bond paste (not shown) of a mixed type of silicone resin and epoxy resin. The LED element 8 (blue LED, 0.3 mm long × 0.3 mm wide) is mounted by dispensing with a dispenser. Thereafter, a mold resin 14a containing a fluorescent material for converting blue to white is first formed by transfer molding, and then a transparent mold resin 14b is formed (FIG. 4 (k)).

  The reflectance of the LED substrate of Example 1 manufactured as described above with respect to light having a wavelength of 460 nm was measured at the initial stage of LED lighting and after continuous lighting for 1000 hours at a high temperature of 160 ° C. Table 1 shows the results. In Example 1, the surface of the highly reflective aluminum hardly changed even after continuous lighting, and the reflectance decreased only from the initial 95% to 87% after continuous lighting, and the high reflectance was maintained. On the other hand, Reference Example 1 is an LED substrate using ceramic, and silver plating is used as a reflective material. In Reference Example 1, due to the discoloration over time of silver plating, the reflectance decreased with time from the initial 96% to 62% after continuous lighting. Reference Example 2 is an LED substrate using a lead frame, in which PPA (aromatic polyamide) is used as a resin integrally molded as a reflector. In Reference Example 2, there was discoloration due to heat and ultraviolet rays emitted from the LED element, and the reflectance decreased with time from 90% in the initial stage to 54% after continuous lighting.

(Example 2)
In the same manner as in Example 1, a wiring board 5 was produced. Similarly to the first embodiment, the reflective plate 3 has a thermosetting adhesive 4 on the entire non-glossy surface of a highly reflective aluminum material (thickness 0.2 mm) having a reflectance of 460 nm and a wavelength of 80% or more. Is applied by screen printing (FIGS. 4 (g) and (h)), and after 20 minutes of pre-curing at 80 ° C., drilling is performed to provide connection openings 12 at predetermined positions (see FIG. FIG. 4 (i)). In Example 2, in order to improve the close contact with the mold resin 14 at the time of drilling, an anchor-forming hole 26 (FIGS. 5 and 6) was opened at a predetermined position by a drill having a diameter of 0.3 mm. . Except this, an LED substrate and an LED package were produced in the same manner as in Example 1.

(Reference Example 3)
In the same manner as in Example 1, a wiring board 5 was produced. As in the first embodiment, the reflector 3 is formed by applying a thermosetting adhesive 4 on the entire non-glossy surface of a highly reflective aluminum material (thickness 0.2 mm) having a reflectance of 460 nm and a wavelength of 80% or more. It apply | coated by printing (FIG. 4 (g), (h)), and temporary hardening was performed at 80 degreeC for 20 minutes. In Reference Example 1, no opening was provided in the reflector 3 having the adhesive 4. Except this, an LED substrate and an LED package were produced in the same manner as in Example 1.

  About Example 1, Example 2, and Reference Example 1 produced as described above, the shear strength between the mold resin and the LED substrate was measured. The shear strength was measured using a push-pull gauge. The results are shown in Table 2. In Example 1 in which the opening for connection is provided and in Example 2 in which the hole for anchor formation is provided in addition to the connection opening, the anchor effect with the mold resin 14 is compared with Reference Example 3 in which no opening is provided. The share strength could be improved.

DESCRIPTION OF SYMBOLS 1 ... LED board, 2 ... LED package, 3 ... Reflector plate or aluminum plate, 4 ... Adhesive agent, 5 ... Wiring board, 6 ... Bonding pad, 7 ... LED mounting part, 8 ... LED element, 9 ... Bonding wire, 10 ... Opening (for LED mounting portion), 11 ... (lower surface) electrode, 12 ... opening for connection, 13 ... resin (for flattening), 14 ... resin for molding, 15 ... (including bonding pad) conductor circuit , 16 ... base material, 17 ... copper foil, 18 ... through hole, 19 ... copper plating, 20 ... interlayer connection or through hole, 21 ... filling resin, 22 ... lid plating, 23 ... gap (of conductor circuit), 24 ... Solder resist, 25 ... Precious metal plating, 26 ... Hole for anchor formation, 27 ... Anchor part

Claims (6)

  LED in which a bonding pad is bonded to one surface and a reflecting plate is bonded to the one surface of the wiring board having a lower surface electrode electrically connected to the bonding pad by interlayer connection on the other surface via an adhesive An LED mounting portion for mounting an LED element that is a substrate, the bonding pad is exposed from the connection opening provided in the adhesive and the reflector, and is electrically connected to the exposed bonding pad, An LED substrate provided on the surface of the reflector.   2. The LED substrate according to claim 1, wherein the surface of the bonding pad is gold plating.   3. The LED substrate according to claim 1, wherein the reflector is a highly reflective aluminum having a reflectance of 80% or more with respect to light having a wavelength of 460 nm.   4. The LED substrate according to claim 1, wherein the bonding pad is filled with a resin and one surface of the wiring board is flattened.   An LED package in which an LED element is mounted on the LED mounting portion of the LED substrate according to claim 1, and the LED element and an exposed bonding pad are electrically connected.   6. The LED package according to claim 5, wherein a hole for forming an anchor is provided in the reflecting plate, and a resin for molding formed on the reflecting plate flows into the hole and is cured to form an anchor portion.

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