CN108550682A - A kind of LED light - Google Patents
A kind of LED light Download PDFInfo
- Publication number
- CN108550682A CN108550682A CN201810461350.6A CN201810461350A CN108550682A CN 108550682 A CN108550682 A CN 108550682A CN 201810461350 A CN201810461350 A CN 201810461350A CN 108550682 A CN108550682 A CN 108550682A
- Authority
- CN
- China
- Prior art keywords
- led light
- metal
- emitting diodes
- light emitting
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
Abstract
The invention belongs to LED technology fields, it is related to a kind of LED light, including LED light emitting diodes, it is used to support the holder of LED light emitting diodes and the encapsulating material for encapsulating LED light emitting diodes, it is characterized in that, the holder is epoxy resin board, the LED light emitting diodes are located at the center of metal bowl, and are welded by conducting wire and metal pad, and the metal pad is connect by the metal layer of intercommunicating pore side wall in epoxy plate with metal pins；The encapsulating material is transparent epoxy resin, and the metal bowl, LED light emitting diodes, conducting wire and metal pad are by transparent or semitransparent epoxy resin enclosed above epoxy resin board；The LED light improves the binding force of epoxy plate and encapsulating material, structure is reliable, can not only effectively improve the brightness of LED light by improving supporting structure, material, moreover it is possible to effectively improve the service life of lamp, promote value of the product.
Description
Technical field
The present invention relates to a kind of LED light, belong to LED light technical field.
Background technology
With economic development, people's living standards continue to improve, people show the LED of high brightness, high life
Technology requirement is higher and higher, meanwhile, as LED shows being widely used for product, more prominent, such as figure of life problems performance
It is the schematic cross-sectional view of existing LED light shown in 1, metal outer lead 9 is connected to metal pad 5, supports 10 He of ontology
Reflection bowl 11 is that the PPA injection moldings of modeling fat are one-time formed, and LED hair diodes 6 are connected by conducting wire 7 with metal pad 5, existing
The sealing structure for the LED light that LED light main problem is presented with is poor, is very easy to moisture is allowed to enter inside lamp bead and causes dead lamp,
This problem can reduce the service life of LED light, seriously affect the service life of product, increase the later maintenance of product at
This；In addition, LED support（Support ontology 10）It is the basic material of LED light, plays support and protective effect, the reliability of holder
The service life of LED light is influenced, while the binding force of LED light packaged type, encapsulating material and holder also influences the use of LED light
Service life, encapsulating material 3 are epoxy resin, weaker with the binding force of modeling fat PPA.
Invention content
The purpose of the present invention is be directed to existing LED light there are the problem of, a kind of LED light is provided, the LED light pass through improve branch
Frame structure, material improve the binding force of epoxy plate and encapsulating material, and structure is reliable, can not only effectively improve the brightness of LED light,
The service life of lamp can also be effectively improved, value of the product is promoted.
To realize the above technical purpose, the technical scheme is that：A kind of LED light, including LED light emitting diodes, use
Holder in support LED light emitting diodes and encapsulating material for encapsulating LED light emitting diodes, which is characterized in that the holder
For epoxy resin board, the LED light emitting diodes are located at the center of metal bowl, and are welded by conducting wire and metal pad
It connects, the metal pad is connect by the metal layer of intercommunicating pore side wall in epoxy resin board with metal pins；The encapsulating material is
Transparent or semitransparent epoxy resin, the metal bowl, LED light emitting diodes, conducting wire and metal pad are by transparent or semi-transparent
It is bright epoxy resin enclosed above epoxy resin board.
Further, the metal pad and intercommunicating pore are respectively positioned in metal bowl, and the metal bowl is arranged in holder
On, and the height of metal bowl is 0.3mm ~ 1.0mm.
Further, filled with the epoxy resin for completely cutting off air in the intercommunicating pore.
Further, it is arranged below holder for drawing the metal pins of LED light-emitting diodes pipe electrodes, the metal draws
The quantity of foot is identical as connection hole number, and the quantity of metal pins is 4 ~ 6.
Further, the material for reflecting the metal bowl that LED light emitting diodes emit beam includes iron, copper and its conjunction
Gold, and electroplating surface has high reflective silver or chromium, the shape of the metal bowl includes round, rectangular and oval.
Further, the holder be single layer, bilayer or multilayer epoxy resin board, the thickness of the epoxy resin board is
0.2mm~2.8mm。
Further, the quantity of the LED light emitting diodes is at least one, is distributed in LED light emitting diodes both sides
The quantity of metal pad and intercommunicating pore is at least one.
Further, the appearance and size range of the LED light emitting diodes 3.5mm x 3.5mm ~ 1mm x 1mm it
Between.
Compared with existing LED light, the present invention has the following advantages：
1）Metal bowl electroplate or chromium, increase light reflectivity, make the luminance raising of LED light 20% or so；
2）Holder plays a supportive role, and is etched using one or more layers epoxy resin board, and encapsulating material uses and timbering material
Transparent or semitransparent epoxy resin similar in energy, so that the binding force of encapsulating material and holder enhances, and improves the sealing of LED light
Property, and then improve the service life；
3）Intercommunicating pore in holder is filled using epoxy resin, effectively completely cuts off air, improves the leakproofness of LED light, in turn
Improve the service life.
Description of the drawings
Fig. 1 is the schematic cross-sectional view of existing LED light.
Fig. 2 is the schematic cross-sectional view of the present invention.
Fig. 3 is the overlooking structure diagram of the present invention.
Reference sign：1- metal pins, 2- holders, 3- encapsulating materials, 4- metals bowl, 5- metal pads, 6-LED hairs
Optical diode, 7- conducting wires, 8- intercommunicating pores, 9- metals outer lead, 10- support ontologies and 11- reflect bowl.
Specific implementation mode
With reference to specific drawings and examples, the invention will be further described.
As shown in attached drawing 2 and Fig. 3, a kind of LED light, including LED light emitting diodes 6, it is used to support LED light emitting diodes 6
Holder 2 and encapsulating material 3 for encapsulating LED light emitting diodes 6, which is characterized in that the holder 2 is single layer, bilayer or more
The thickness of the epoxy resin board of layer, the epoxy resin board is 0.2mm ~ 2.8mm, and the LED light emitting diodes are located at metal bowl
The center of cup 4, and welded by conducting wire 7 and metal pad 5, the metal pad 5 passes through intercommunicating pore in epoxy resin board 8
The metal layer of side wall is connect with metal pins 1, and the metal pins 1 for drawing 6 electrode of LED light emitting diodes are arranged in holder 2
The quantity of lower section, the metal pins 1 is identical as 8 quantity of intercommunicating pore, filled with the ring for completely cutting off air in the intercommunicating pore 8
Oxygen resin, the metal pad 5 and intercommunicating pore 8 are respectively positioned in metal bowl 4, and the metal bowl 4 is arranged on holder 2, and
The height of metal bowl is 0.3mm ~ 1.0mm；
The encapsulating material 3 is transparent or semitransparent epoxy resin, the metal bowl 4, LED light emitting diodes 6, conducting wire 7 and gold
Belong to pad 5 by transparent or semitransparent epoxy resin enclosed above epoxy resin board.
Metal bowl 4 emits beam for reflecting LED light emitting diodes 6, and material includes iron, copper and its alloy, and table
Face is electroplate with high reflective silver or chromium, and metal bowl 4 is made using disposable metal moulding process；
The shape of metal bowl 4 is circle in the present embodiment, and the quantity of LED light emitting diodes 6 is three, and in one line,
The quantity of the metal pad 5 and intercommunicating pore 8 that are distributed in three 6 both sides of LED light emitting diodes is respectively two, metal pins 1
Quantity is four.
Metal pins 1 of the present invention are connected to metal pad 5 by the metal layer of 8 side wall of intercommunicating pore, and metal pad 5 is by leading
Line 7 is connect with the electrode of LED light emitting diodes 6, and such metal pins 1 can draw the electrode of LED light emitting diodes 6, pass through
The electric current of break-make metal pins 1 controls the light on and off of LED light emitting diodes 6, and realizes the display or illumination of picture and text as needed
The appearance and size of function, product of the present invention can be just the same with existing LED light, to realize that seamless replacement, reduction are substituted for
This.
The present invention and its embodiments have been described above, description is not limiting, shown in attached drawing also only
It is one of embodiments of the present invention, practical structures are not limited thereto.All in all if those skilled in the art
It is enlightened by it, without departing from the spirit of the invention, is not inventively designed similar with the technical solution
Frame mode and embodiment, are within the scope of protection of the invention.
Claims (8)
1. a kind of LED light, including LED light emitting diodes（6）, be used to support LED light emitting diodes（6）Holder（2）With for
Encapsulate LED light emitting diodes（6）Encapsulating material（3）, which is characterized in that the holder（2）For epoxy resin board, the LED hairs
Optical diode is located at metal bowl（4）Center, and pass through conducting wire（7）With metal pad（5）Welding, the metal pad
（5）Pass through intercommunicating pore in epoxy resin board（8）The metal layer and metal pins of side wall（1）Connection；The encapsulating material（3）It is transparent
Or translucent epoxy, the metal bowl（4）, LED light emitting diodes（6）, conducting wire（7）And metal pad（5）By saturating
Bright or translucent epoxy is encapsulated in above epoxy resin board.
2. a kind of LED light according to claim 1, it is characterised in that：The metal pad（5）And intercommunicating pore（8）Equal position
In metal bowl（4）It is interior, the metal bowl（4）It is arranged in holder（2）On, and metal bowl（4）Height be 0.3mm ~
1.0mm。
3. a kind of LED light according to claim 1, it is characterised in that：The intercommunicating pore（8）It is interior to be filled with for completely cutting off sky
The epoxy resin of gas.
4. a kind of LED light according to claim 1, it is characterised in that：For drawing LED light emitting diodes（6）Electrode
Metal pins（1）It is arranged in holder（2）Lower section, the metal pins（1）Quantity and intercommunicating pore（8）Quantity is identical, and metal
Pin（1）Quantity be 4 ~ 6.
5. a kind of LED light according to claim 1, it is characterised in that：For reflecting LED light emitting diodes（6）Send out light
The metal bowl of line（4）Material include iron, copper and its alloy, and electroplating surface has high reflective silver or chromium, the metal bowl
（4）Shape include it is round, rectangular and oval.
6. a kind of LED light according to claim 1, it is characterised in that：The holder（2）For single layer, bilayer or multilayer
The thickness of epoxy resin board, the epoxy resin board is 0.2mm ~ 2.8mm.
7. a kind of LED light according to claim 1, it is characterised in that：The LED light emitting diodes（6）Quantity at least
It is one, is distributed in LED light emitting diodes（6）The metal pad of both sides（5）And intercommunicating pore（8）Quantity be at least one.
8. a kind of LED light according to claim 1, it is characterised in that：The LED light emitting diodes（6）Appearance and size
Range is between 3.5mmx3.5mm ~ 1mmx1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810461350.6A CN108550682A (en) | 2018-05-15 | 2018-05-15 | A kind of LED light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810461350.6A CN108550682A (en) | 2018-05-15 | 2018-05-15 | A kind of LED light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108550682A true CN108550682A (en) | 2018-09-18 |
Family
ID=63494951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810461350.6A Pending CN108550682A (en) | 2018-05-15 | 2018-05-15 | A kind of LED light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108550682A (en) |
Citations (16)
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| TW504805B (en) * | 2001-11-22 | 2002-10-01 | Solidlite Corp | Light-emitting diode package method for light-emitting efficiency improvement |
| US20040104391A1 (en) * | 2001-09-03 | 2004-06-03 | Toshihide Maeda | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device |
| JP2004238589A (en) * | 2003-02-10 | 2004-08-26 | Stanley Electric Co Ltd | Sealing resin for light-emitting diode and surface-mounting type light-emitting diode using the same |
| JP2005322701A (en) * | 2004-05-06 | 2005-11-17 | Opto Device Kenkyusho:Kk | Reflective light emitting diode and manufacturing method thereof |
| CN1925182A (en) * | 2005-09-01 | 2007-03-07 | E.I.内穆尔杜邦公司 | Low temperature co-fired ceramic tape compositions, light emitting diode modules, lighting devices and method of forming thereof |
| KR20070035695A (en) * | 2005-09-28 | 2007-04-02 | 한국 고덴시 주식회사 | High brightness led package |
| JP2007266222A (en) * | 2006-03-28 | 2007-10-11 | Kyocera Corp | Substrate for loading light emitting element, package for storing light emitting element, light emitting device and light system |
| CN101335319A (en) * | 2008-05-30 | 2008-12-31 | 潮州市三江电子有限公司 | High-power LED ceramic package base |
| US20100059785A1 (en) * | 2008-09-05 | 2010-03-11 | Advanced Optoelectronic Technology Inc. | Light emitting device and method of fabricating the same |
| JP2011044593A (en) * | 2009-08-21 | 2011-03-03 | Hitachi Chem Co Ltd | Led substrate and led package |
| CN202721190U (en) * | 2012-06-29 | 2013-02-06 | 厦门多彩光电子科技有限公司 | Packing structure of high luminous flux patch LED (light emitting diode) |
| CN104103738A (en) * | 2013-04-03 | 2014-10-15 | 江苏稳润光电有限公司 | LED packaging method and LED packaging structure thereof |
| JP2015185560A (en) * | 2014-03-20 | 2015-10-22 | スタンレー電気株式会社 | semiconductor light-emitting module |
| CN205376571U (en) * | 2016-01-16 | 2016-07-06 | 临海市庆辉光电灯饰有限公司 | Built -in two -way LED who touches logical diode cut straightly lamp pearl |
| CN206340568U (en) * | 2017-03-28 | 2017-07-18 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages |
| CN208111481U (en) * | 2018-05-15 | 2018-11-16 | 深圳市泛珠科技发展有限公司 | A kind of LED light |
-
2018
- 2018-05-15 CN CN201810461350.6A patent/CN108550682A/en active Pending
Patent Citations (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040104391A1 (en) * | 2001-09-03 | 2004-06-03 | Toshihide Maeda | Semiconductor light emitting device, light emitting apparatus and production method for semiconductor light emitting device |
| TW504805B (en) * | 2001-11-22 | 2002-10-01 | Solidlite Corp | Light-emitting diode package method for light-emitting efficiency improvement |
| JP2004238589A (en) * | 2003-02-10 | 2004-08-26 | Stanley Electric Co Ltd | Sealing resin for light-emitting diode and surface-mounting type light-emitting diode using the same |
| JP2005322701A (en) * | 2004-05-06 | 2005-11-17 | Opto Device Kenkyusho:Kk | Reflective light emitting diode and manufacturing method thereof |
| CN1925182A (en) * | 2005-09-01 | 2007-03-07 | E.I.内穆尔杜邦公司 | Low temperature co-fired ceramic tape compositions, light emitting diode modules, lighting devices and method of forming thereof |
| KR20070035695A (en) * | 2005-09-28 | 2007-04-02 | 한국 고덴시 주식회사 | High brightness led package |
| JP2007266222A (en) * | 2006-03-28 | 2007-10-11 | Kyocera Corp | Substrate for loading light emitting element, package for storing light emitting element, light emitting device and light system |
| CN101335319A (en) * | 2008-05-30 | 2008-12-31 | 潮州市三江电子有限公司 | High-power LED ceramic package base |
| US20100059785A1 (en) * | 2008-09-05 | 2010-03-11 | Advanced Optoelectronic Technology Inc. | Light emitting device and method of fabricating the same |
| JP2011044593A (en) * | 2009-08-21 | 2011-03-03 | Hitachi Chem Co Ltd | Led substrate and led package |
| CN202721190U (en) * | 2012-06-29 | 2013-02-06 | 厦门多彩光电子科技有限公司 | Packing structure of high luminous flux patch LED (light emitting diode) |
| CN104103738A (en) * | 2013-04-03 | 2014-10-15 | 江苏稳润光电有限公司 | LED packaging method and LED packaging structure thereof |
| JP2015185560A (en) * | 2014-03-20 | 2015-10-22 | スタンレー電気株式会社 | semiconductor light-emitting module |
| CN205376571U (en) * | 2016-01-16 | 2016-07-06 | 临海市庆辉光电灯饰有限公司 | Built -in two -way LED who touches logical diode cut straightly lamp pearl |
| CN206340568U (en) * | 2017-03-28 | 2017-07-18 | 山东晶泰星光电科技有限公司 | A kind of QFN surface mounts RGB LED packages |
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