CN202721190U - Packing structure of high luminous flux patch LED (light emitting diode) - Google Patents
Packing structure of high luminous flux patch LED (light emitting diode) Download PDFInfo
- Publication number
- CN202721190U CN202721190U CN2012203097541U CN201220309754U CN202721190U CN 202721190 U CN202721190 U CN 202721190U CN 2012203097541 U CN2012203097541 U CN 2012203097541U CN 201220309754 U CN201220309754 U CN 201220309754U CN 202721190 U CN202721190 U CN 202721190U
- Authority
- CN
- China
- Prior art keywords
- cup
- silver coating
- bowl cup
- led
- luminescence chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Abstract
The utility model relates to an LED (light emitting diode) packing structure. The packing structure of a high luminous flux patch LED comprises an LED light-emitting chip, a bracket carrying the LED light-emitting chip, and a packing body covering the LED light-emitting diode and partial bracket. The bracket is provided with a cup bowl, a positive conductive pin and a negative conductive pin, wherein the cup bowl is used for arranging the LED light-emitting chip, and the positive conductive pin and the negative conductive pin lead a positive electrode and a negative electrode of the LED light-emitting chip out respectively through wires. The cup bowl comprises an inner bowl cup and an outer bowl cup, wherein the LED light-emitting chip is arranged in the inner bowl cup, the outer bowl cup is provided with a metal heat sink, a silver coating and transparent silica gel, the metal heat sink is arranged below the silver coating and matched with the silver coating in structure, the transparent silica gel is arranged above the silver coating and matched with the silver coating in structure, and the silver coating is connected with the positive electrode and the negative electrode of the LED light-emitting chip.
Description
Technical field
The utility model relates to the encapsulating structure of LED, is specifically related to a kind of paster LED encapsulating structure with high light flux.
Background technology
LED paster light source has widely at lighting field to be used, and considers the specification requirements such as production technology, cost, optical property, and the led light source of paster packaged type is adopted in increasing design.
High light flux LED paster encapsulating structure is the same with the led light source of other all packaged types, all needs to solve light efficiency, reliability and cost three's problem: light efficiency is the ratio of luminous flux and the specific electric energy power of its consumption; Reliability is often determined by the light source heat radiation performance; And cost is mainly reflected in raw material selection aspect; Mutual containing occurs in this three.Under different demands, may need outstanding effect of optimization aspect certain, such as, in the situation that cost and reliability keep, realizing high light flux, such subject under discussion seems in a large amount of led light source productions and is even more important.As commodity, realize the Properties Control under its cost, be a kind of inevitable demand.So, how when keeping preferably cost and reliability, improve the light efficiency of surface-mounted LED light source, be an inevitable demand of this class paster LED encapsulating structure design.
LED paster packaged type has in the market: direct spraying fluorescent material, then put transparent adhesive tape, and perhaps directly apply fluorescent glue; The light efficiency of aforesaid way fluorescent material is not strong or need more fluorescent glue just can reach requirement.
The utility model content
Technical problem to be solved in the utility model is, a kind of encapsulating structure of high light flux paster LED is provided, and effectively increases the light efficiency of fluorescent material, and reduces the consumption of fluorescent glue, and then reaches the purpose that reduces cost.
In order to solve the problems of the technologies described above, the encapsulating structure of a kind of high light flux paster LED of the present utility model comprises LED luminescence chip, the support of carrying LED luminescence chip and the packaging body that coats described LED luminescence chip and part support.Positive conductive feet and negative conductive feet that described support is provided with the cup of placing the LED luminescence chip, the both positive and negative polarity of LED luminescence chip is drawn by wire.Described cup comprises interior bowl cup and outer bowl cup, place the LED luminescence chip in the described interior bowl cup, described outer bowl cup is provided with metal heat sink, silver coating and transparent adhesive tape, described metal heat sink places under the silver coating and with it and structurally matches, and described transparent adhesive tape places on the silver coating and with it and structurally matches.Described silver coating is connected with the both positive and negative polarity of LED luminescence chip, is used for the position of fixed L ED luminescence chip, and the LED luminescence chip is fixedly installed in the interior bowl cup.Wherein, interior bowl cup is used for die bond and some fluorescent glue.
Further, described interior bowl cup and outer bowl cup adopt the PPA-TA112 material to make.As the interior bowl cup of interlayer, fully improved the luminous efficiency of LED luminescence chip, reduce the consumption of fluorescent material, thereby reduced cost.Further, the skin of described support uses the PPA-TA112 material.
Further, the dark scope of cup of described interior bowl cup is 0.4-0.45mm, and its preferred cup is dark to be 0.4mm.The areal extent of interior bowl cup is 150-250mm
2, interior bowl cup can be square also can be circular.
Further, described interior bowl cup adopts fluorescent glue to apply into flat cup or protruding cup, has reduced the consumption of fluorescent material, thereby has reduced cost.
Further, in order to improve the light extraction efficiency of whole encapsulation, described metal heat sink adopts the C194 copper to become.
Further, described silver coating is to adopt the electroless plating method to be made into minute surface light shape, and LED luminescence chip light is fully reflected, and has improved the light efficiency of whole encapsulation.
The utility model adopts said structure, compared with prior art, has the following advantages:
1. described silver coating is minute surface light shape, and this silver coating will be derived from LED luminescence chip light and fully reflect, and improve the light efficiency of whole encapsulating structure;
2. the heat of metal heat sink vertically exports to another surface of substrate, is beneficial to the heat radiation of whole led chip, has promoted reliability, has realized the technical optimization of high light efficiency, high reliability LED encapsulation;
3. die bond in interior bowl cup, can improve chip the position get optical efficiency;
4. when some fluorescent glue in interior bowl cup, point to flat cup gets final product, and has reduced the consumption of fluorescent material, thereby has reduced cost;
5. the outer PPA-TA112 material of using of support can make to be derived from LED luminescence chip light and fully to reflect to improve and get optical efficiency;
6. put transparent adhesive tape in the bowl cup outside, can improve the optical efficiency of getting of LED luminescence chip, reduce the purpose of cost.
Description of drawings
Fig. 1 is the vertical view of embodiment of the present utility model;
Fig. 2 is the vertical view (containing the LED luminescence chip) of embodiment of the present utility model;
Fig. 3 is the cutaway view (flat cup packaged type) of embodiment of the present utility model;
Fig. 4 is the cutaway view (protruding cup packaged type) of embodiment of the present utility model.
Embodiment
Now with embodiment the utility model is further specified by reference to the accompanying drawings.
As a preferred embodiment, such as Fig. 1-shown in Figure 4, the encapsulating structure of a kind of high light flux paster LED of the present utility model comprises LED luminescence chip 1, the support 2 of carrying LED luminescence chip and the packaging body that coats described LED luminescence chip 1 and part support 2.
Positive conductive feet and negative conductive feet that described support 2 is provided with the cup 4 of placing LED luminescence chip 1, the both positive and negative polarity of LED luminescence chip 1 is drawn by wire 11.
Described cup 4 comprises interior bowl cup 41 and outer bowl cup 42, described interior bowl cup 41 interior placement LED luminescence chips 1, described outer bowl cup 42 is provided with silver coating 5, transparent adhesive tape 6 and metal heat sink 7, described metal heat sink 7 places under the silver coating 5, and structurally match with it and be divided into the first metal heat sink 71 and the second metal heat sink 72, described transparent adhesive tape 6 places on the silver coating 5 and with it and structurally matches.Wherein, described interior bowl cup 41 is used for die bond and some fluorescent glue.Described interior bowl cup 41 adopts the PPA-TA112 material to make, and the dark scope of cup of interior bowl cup is 0.4-0.45mm, the dark 0.4mm that is about of its preferred cup, and the area of interior bowl cup 41 is 150-250mm
2, interior bowl cup 41 can be square also can be circular, can certainly be other shapes.As the interior bowl cup of interlayer, fully improved the luminous efficiency of LED luminescence chip, reduce the consumption of fluorescent material, thereby reduced cost.In addition, the internal point convex lens silica gel of bowl cup 42 can effectively reduce hot spot outside, improves the consistency of product.Preferably, described outer bowl cup 42 also adopts the PPA-TA112 material to make.
Described silver coating 5 is connected with the both positive and negative polarity of LED luminescence chip 1, is used for the position of fixed L ED luminescence chip 1, and LED luminescence chip 1 is fixedly installed in the interior bowl cup 41.Described silver coating 5 is to adopt the electroless plating method to be made into minute surface light shape, and LED luminescence chip light is fully reflected, and has improved the light efficiency of whole encapsulation.
The structure of described metal heat sink 7 matches with the structure of silver coating 5.In order to improve the light extraction efficiency of whole encapsulation, described metal heat sink 7 adopts the C194 copper to become.Described the first metal heat sink 71 is connected with the both positive and negative polarity of led chip.The use of the second metal heat sink 72 effectively vertically exports to the heat of LED luminescence chip 1 another surface of substrate, is conducive to the heat radiation of whole LED luminescence chip 1, has promoted reliability.
Preferably, the skin of described support 2 is the PPA-TA112 plastic material.
The transparent adhesive tape 6 that above-mentioned LED paster is used is silica gel.Interior bowl cup 41 interior use fluorescent glues apply into flat cup or protruding cup, are the schematic diagram that applies into flat cup among Fig. 3 and Fig. 4.Outer bowl cup 42 usefulness transparent silica gel apply into flat cup or protruding cup, use transparent silica gel to apply into the schematic diagram of flat cup among Fig. 3, and Fig. 4 applies into the schematic diagram of protruding cup with transparent silica gel.
The total thickness of the LED paster structure that the employing such scheme is made is 0.80-1.10mm.
Although specifically show and introduced the utility model in conjunction with preferred embodiment; but the those skilled in the art should be understood that; within not breaking away from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.
Claims (7)
1. the encapsulating structure of a high light flux paster LED is characterized in that: comprise LED luminescence chip, the support of carrying LED luminescence chip and the packaging body that coats described LED luminescence chip and part support; Positive conductive feet and negative conductive feet that described support is provided with the cup of placing the LED luminescence chip, the both positive and negative polarity of LED luminescence chip is drawn by wire; Described cup comprises interior bowl cup and outer bowl cup, place the LED luminescence chip in the described interior bowl cup, described outer bowl cup is provided with metal heat sink, silver coating and transparent silica gel, described metal heat sink places under the silver coating and with it and structurally matches, and described transparent silica gel places on the silver coating and with it and structurally matches; Described silver coating is connected with the both positive and negative polarity of LED luminescence chip.
2. the encapsulating structure of high light flux paster LED according to claim 1 is characterized in that: described interior bowl cup and an outer bowl cup employing PPA-TA112 material are made.
3. the encapsulating structure of high light flux paster LED according to claim 1 is characterized in that: the dark scope of cup of described interior bowl cup is 0.4-0.45mm.
4. the encapsulating structure of high light flux paster LED according to claim 3 is characterized in that: the dark 0.4mm of being of the cup of described interior bowl cup.
5. the encapsulating structure of high light flux paster LED according to claim 1 is characterized in that: the areal extent of described interior bowl cup is 150-250mm
2
6. the encapsulating structure of high light flux paster LED according to claim 1 is characterized in that: described heat sink employing C194 copper one-tenth.
7. the encapsulating structure of high light flux paster LED according to claim 1 is characterized in that: described silver coating is the silver coating that is minute surface light shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203097541U CN202721190U (en) | 2012-06-29 | 2012-06-29 | Packing structure of high luminous flux patch LED (light emitting diode) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012203097541U CN202721190U (en) | 2012-06-29 | 2012-06-29 | Packing structure of high luminous flux patch LED (light emitting diode) |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202721190U true CN202721190U (en) | 2013-02-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012203097541U Expired - Fee Related CN202721190U (en) | 2012-06-29 | 2012-06-29 | Packing structure of high luminous flux patch LED (light emitting diode) |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202721190U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106816515A (en) * | 2015-11-30 | 2017-06-09 | 郑州森源新能源科技有限公司 | A kind of efficient paster LED encapsulating structure |
| CN107195754A (en) * | 2017-06-30 | 2017-09-22 | 深圳市宇亮光电技术有限公司 | A kind of LED encapsulation structure and method for packing for eliminating yellow hot spot |
| CN108550682A (en) * | 2018-05-15 | 2018-09-18 | 深圳市泛珠科技发展有限公司 | A kind of LED light |
-
2012
- 2012-06-29 CN CN2012203097541U patent/CN202721190U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106816515A (en) * | 2015-11-30 | 2017-06-09 | 郑州森源新能源科技有限公司 | A kind of efficient paster LED encapsulating structure |
| CN107195754A (en) * | 2017-06-30 | 2017-09-22 | 深圳市宇亮光电技术有限公司 | A kind of LED encapsulation structure and method for packing for eliminating yellow hot spot |
| CN108550682A (en) * | 2018-05-15 | 2018-09-18 | 深圳市泛珠科技发展有限公司 | A kind of LED light |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Packing structure of high luminous flux patch LED (light emitting diode) Effective date of registration: 20150923 Granted publication date: 20130206 Pledgee: China Co truction Bank Corp Xiamen branch Pledgor: Xiamen Colorful Optoelectronics Technology Co.,Ltd. Registration number: 2015350000074 |
|
| PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130206 Termination date: 20190629 |